A lithography machine workpiece table exchange device with multiple stations

Abstract

The application provides a photolithography machine workpiece table exchange device with multiple stations, and belongs to the technical field of semiconductor manufacturing equipment, and comprises a lower base, a first sliding structure, a second sliding structure, a first linear motor, a second linear motor and two microtables, and the microtables are connected with first sliders in the first sliding structure and second sliders in the second sliding structure, wherein the first linear motor drives the microtables to move along the X-axis direction, the second linear motor drives the microtables to move along the Y-axis direction, and the microtables can offset the corresponding errors generated by the first linear motor and the second linear motor during operation. The application realizes the motion error decoupling of the X-axis direction and the Y-axis direction, avoids error accumulation, improves the accuracy of position adjustment, realizes the synchronous exposure and calibration of wafers under multiple stations, improves the work efficiency, and has expansibility.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor manufacturing equipment, and relates to an exchange device, in particular to a photolithography machine workpiece table exchange device with multiple stations. BACKGROUND

[0002] The research background and progress of the photolithography machine workpiece table and the double workpiece table are a very key topic in the field of semiconductor manufacturing. As the core component of the photolithography machine, the performance of the workpiece table directly affects the quality and efficiency of chip manufacturing. With the increase of wafer size, the workpiece table needs to achieve extremely high positioning accuracy within a larger stroke range, usually reaching nanometer-level accuracy within a hundred millimeter stroke. However, the existing photolithography machine usually has only one workpiece table, which means that while the wafer is being exposed, the preparation of the next wafer cannot be carried out.

[0003] Chinese patent (CN 101963763 B) discloses a high-precision double workpiece table exchange device in the technical field of semiconductor manufacturing equipment. The device is particularly designed with a double-drive double-bridge structure. Chinese patent (CN201181389Y) discloses a photolithography machine silicon wafer table double table exchange system in the field of semiconductor manufacturing equipment. The system includes a silicon wafer table located at a pretreatment station and a silicon wafer table located at an exposure station. On these two stations, an H-shaped driving unit is respectively arranged, which is composed of two X-direction linear motors and a Y-direction linear motor, responsible for driving the silicon wafer table to move along the X-axis and Y-axis directions on the respective stations. Chinese patent (CN 101727019 A) discloses a photolithography machine silicon wafer table double table exchange system and its exchange method. The system is composed of two silicon wafer tables, a base table, X-axis linear guides, Y-axis linear guides, a silicon wafer table auxiliary driving unit, and four single-degree-of-freedom auxiliary driving units. The system also particularly includes two main driving units, the first main driving unit is installed on the first X-axis linear guide, and the second main driving unit is installed on the second X-axis linear guide.

[0004] According to the above description of the double workpiece table exchange device / system, the structure for driving the workpiece table to move transversely and the structure for driving the workpiece table to move longitudinally are connected to each other, which will cause the accumulation of errors and affect the accuracy of the workpiece table movement. SUMMARY

[0005] The purpose of the present application is to solve the above-mentioned problems existing in the prior art, and to provide a photolithography machine workpiece table exchange device capable of improving the accurate positioning of the workpiece table.

[0006] The purpose of the present application can be achieved by the following technical scheme: a photolithography machine workpiece table exchange device with multiple stations, comprising:

[0007] The lower base is provided with a plurality of first and second strip-shaped grooves which are orthogonal to each other, the first strip-shaped grooves are arranged along the X-axis direction, and the second strip-shaped grooves are arranged along the Y-axis direction, wherein the plane where the groove bottoms of the first strip-shaped grooves are located is different in height from the plane where the groove bottoms of the second strip-shaped grooves are located;

[0008] The first sliding structure comprises a first sliding rail which is laid along the length direction of the first strip-shaped grooves and connected to the groove bottoms of the first strip-shaped grooves, and a first sliding block which is slidably connected to the first sliding rail;

[0009] The second sliding structure comprises a second sliding rail which is laid along the length direction of the second strip-shaped grooves and connected to the groove bottoms of the second strip-shaped grooves, and a second sliding block which is slidably connected to the second sliding rail;

[0010] The coarse adjustment driving assembly comprises a first linear motor and a second linear motor, the first linear motor comprises a first linear motor stator which is connected to the groove wall of the first strip-shaped grooves, and a first linear motor mover which is connected to the first sliding block, and the second linear motor comprises a second linear motor stator which is connected to the groove wall of the second strip-shaped grooves, and a second linear motor mover which is connected to the second sliding block;

[0011] The at least two fine adjustment tables are connected to the first sliding block and the second sliding block in correspondence, and each fine adjustment table comprises a bottom plate, a fine adjustment driving assembly and a table, the fine adjustment driving assembly is clamped between the bottom plate and the table, wherein the edge of the fine adjustment driving assembly is connected to the bottom plate, the middle part of the fine adjustment driving assembly is connected to the table, and one fine adjustment table is used as the exposure position of the wafer, and the other fine adjustment table is used as the loading and unloading position and the calibration position of the wafer.

[0012] In the above-mentioned photolithography machine workpiece table exchange device with multiple stations, the intersection position of the first sliding rail and the second sliding rail is taken as a base point, one first sliding block is slidably connected to each side of the base point on the first sliding rail, one second sliding block is slidably connected to each side of the base point on the second sliding rail, and one pair of opposite edges of the fine adjustment table is clamped between the two first sliding blocks, and the other pair of opposite edges of the fine adjustment table is clamped between the two second sliding blocks, wherein the clamping connection between the fine adjustment table and the two first sliding blocks, or the clamping connection between the fine adjustment table and the two second sliding blocks is a separable connection, and the fine adjustment table is moved in the X-axis direction by the first linear motor, or is moved in the Y-axis direction by the second linear motor, or is bidirectionally moved in the X-axis direction and the Y-axis direction by the first linear motor and the second linear motor respectively.

[0013] In the above-mentioned photolithography machine workpiece table exchange device with multiple stations, the first sliding block comprises a sliding seat which is slidably connected to the first sliding rail, and a support which is connected to the sliding seat, wherein the support is provided with a roller which is rollingly connected to the clamping groove of the fine adjustment driving assembly, and the axis direction of the roller is perpendicular to the moving direction of the sliding seat.

[0014] In the multi-station lithography workpiece table exchange device, the fine adjustment driving assembly comprises a first piezoelectric ceramic stack actuator arranged in the X-axis direction and a second piezoelectric ceramic stack actuator arranged in the Y-axis direction, and a flexible structure, and the flexible structure comprises a metal plate, the metal plate is cut into a fixed plate and a movable plate arranged in a back-to-back shape by wire cutting, the fixed plate and the movable plate are connected through a plurality of rhombus-shaped amplification structures, the fixed plate is connected to the bottom plate through fasteners, the movable plate is connected to the table through fasteners, the first piezoelectric ceramic stack actuator and the second piezoelectric ceramic stack actuator are installed in the amplification structures, one end of the amplification structure connected to the movable plate is an output end, one end of the amplification structure connected to the fixed plate is a fixed end, and the other two ends of the amplification structure are input ends, and the two ends of the first piezoelectric ceramic stack actuator and the two ends of the second piezoelectric ceramic stack actuator are respectively connected to the two input ends of the corresponding amplification structures.

[0015] In the multi-station lithography workpiece table exchange device, the two ends of the first piezoelectric ceramic stack actuator and the two ends of the corresponding amplification structure are respectively connected to the two input ends of the corresponding amplification structure.

[0016] In the multi-station lithography workpiece table exchange device, the number of the first piezoelectric ceramic stack actuators arranged on the X-axis is one, the first piezoelectric ceramic stack actuator is arranged on the X-axis, and the lines connecting the two ends of the first piezoelectric ceramic stack actuator are parallel to the Y-axis, and the number of the second piezoelectric ceramic stack actuators arranged on the Y-axis is two, the two second piezoelectric ceramic stack actuators are symmetrically arranged on the same side of the fine adjustment table along the Y-axis, and the lines connecting the two ends of each second piezoelectric ceramic stack actuator are parallel to the X-axis.

[0017] In the multi-station lithography workpiece table exchange device, further comprising,

[0018] The upper base is arranged above the lower base, a third slot is arranged on the upper base, the opening direction of the third slot is opposite to the opening direction of the first slot or the second slot, and the two ends of the third slot span two adjacent first slots.

[0019] The third sliding structure comprises a third sliding rail arranged along the length direction of the third slot and laid on the bottom of the third slot, and two third sliding blocks connected to the third sliding rail and capable of clamping the fine adjustment table.

[0020] The third linear motor comprises a third linear motor stator connected to the third slot wall and a third linear motor mover connected to the third slider.

[0021] In the above-mentioned lithography worktable exchange device with multiple stations, the first sliding structure, the second sliding structure and the third sliding structure are the same in structure, and the first linear motor, the second linear motor and the third linear motor are the same in structure.

[0022] In the above-mentioned lithography worktable exchange device with multiple stations, when the number of microtables is two, the projections of the first slide rail, the second slide rail and the third slide rail on the lower base are spliced to form a "day" shape, and the exposure position and the calibration position are respectively located at the two ends of a horizontal line in the middle of the "day" shape; the first linear motor, the second linear motor and the third linear motor are used to move the two microtables in the clockwise direction or the counterclockwise direction, so that the microtable originally located at the exposure position is transferred to the calibration position, and the microtable originally located at the calibration position is transferred to the exposure position, thereby realizing the circulation of the two microtables.

[0023] In the above-mentioned lithography worktable exchange device with multiple stations, when the number of microtables is four, two of the microtables are used as exposure positions of wafers, and the other two are used as calibration positions of wafers, and the two exposure positions and the two calibration positions are arranged at intervals and form a ring-shaped distribution; the projections of the first slide rail, the second slide rail and the third slide rail on the lower base are spliced to form a "field" shape, and the first calibration position and the second calibration position are located at the two ends of a vertical line in the middle of the "field" shape, and the first exposure position and the second exposure position are located at the two ends of a horizontal line in the middle of the "field" shape; when the four microtables are rotated in the counterclockwise direction by the first linear motor, the second linear motor and the third linear motor, the microtable originally located at the first calibration position is transferred to the first exposure position, the microtable originally located at the first exposure position is transferred to the second calibration position, the microtable originally located at the second calibration position is transferred to the second exposure position, and the microtable originally located at the second exposure position is transferred to the first calibration position; when the four microtables are rotated in the clockwise direction by the first linear motor, the second linear motor and the third linear motor, the microtable originally located at the first calibration position is transferred to the second exposure position, the microtable originally located at the second exposure position is transferred to the second calibration position, the microtable originally located at the second calibration position is transferred to the first exposure position, and the microtable originally located at the first exposure position is transferred to the first calibration position.

[0024] Compared with the prior art, the present application has the following beneficial effects:

[0025] (1), the present application provides a kind of multi-station photolithography machine worktable exchange device, not only realizes wafer can be synchronous exposure and calibration, improve work efficiency, and realize the motion error decoupling of X axis direction and Y axis direction, avoid error accumulation, improve the precision of position adjustment.In addition, by microtable can offset the corresponding error generated in the operation process of first linear motor, second linear motor.

[0026] (2), the present application provides a kind of multi-station photolithography machine worktable exchange device, not only can realize the circulation of two microtables Table exchange, and also can realize the circulation of four microtables Table exchange, even more microtable circulation Table exchange, embodies the expansibility of photolithography machine workpiece exchange device, to further improve work efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 It is a kind of multi-station photolithography machine worktable exchange device of the present application structure schematic view.

[0028] Figure 2 It is another view structure schematic view of the present application a kind of multi-station photolithography machine worktable exchange device.

[0029] Figure 3 It is Figure 2 The sectional view A-A shown in the figure.

[0030] Figure 4 It is a kind of multi-station photolithography machine worktable exchange device of the present application local structure schematic view.

[0031] Figure 5 It is the structure schematic view of microtable in a preferred embodiment of the present application.

[0032] Figure 6 It is the local structure schematic view of microtable in a preferred embodiment of the present application.

[0033] Figure 7 It is another view structure schematic view of the microtable shown in the figure. Figure 6

[0034] Figure 8 It is another embodiment structure schematic view of the present application a kind of multi-station photolithography machine worktable exchange device.

[0035] Figure 9 It is Figure 8 The initial structure schematic view of photolithography machine worktable exchange device shown in the figure when exchanging table.

[0036] Figure 10 It is Figure 8 The process structure schematic view of photolithography machine worktable exchange device shown in the figure when exchanging table Figure 1 . ​

[0037] Figure 11 is Figure 8 Fig. 2 is a schematic diagram of the process structure of the lithography worktable exchange device shown in Fig. 1 during worktable exchange. Figure 2 .

[0038] Figure 12 is Figure 8 Fig. 3 is a schematic diagram of the structure of the lithography worktable exchange device shown in Fig. 1 after worktable exchange.

[0039] In the figure,

[0040] 10, lower base; 11, first linear groove; 12, second linear groove;

[0041] 20, first sliding structure; 21, first sliding rail; 22, first sliding block; 221, sliding seat; 222, support; 223, roller;

[0042] 30, second sliding structure; 31, second sliding rail; 32, second sliding block;

[0043] 40, first linear motor; 41, first linear motor stator; 42, first linear motor mover;

[0044] 50, second linear motor; 51, second linear motor stator; 52, second linear motor mover;

[0045] 60, micro worktable; 61, bottom plate; 62, carrier table; 63, first piezoelectric ceramic stack actuator; 64, second piezoelectric ceramic stack actuator; 65, fixed plate; 66, movable plate; 67, amplification structure; 68, first tilting movement block; 69, second tilting movement block;

[0046] 70, upper base; 71, third linear groove;

[0047] 80, third sliding structure; 81, third sliding rail; 82, third sliding block

[0048] 90, third linear motor; 91, third linear motor stator; 92, third linear motor mover;

[0049] J1, first calibration position; J2, second calibration position; B1, first exposure position; B2, second exposure position. DETAILED DESCRIPTION

[0050] The following are specific embodiments of the present application and further describe the technical solutions of the present application in conjunction with the drawings, but the present application is not limited to these embodiments.

[0051] It should be noted that all direction indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative position relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the direction indications will also change accordingly.

[0052] Embodiment one

[0053] As shown in the drawings, the present application provides a multi-station lithography machine workpiece table exchange device, which comprises: Figures 1 to 7 A lower base 10 is provided with a plurality of first and second orthogonal strip-shaped grooves 11 and 12, the first strip-shaped groove 11 is arranged along the X-axis direction, and the second strip-shaped groove 12 is arranged along the Y-axis direction, wherein the plane where the groove bottom of the first strip-shaped groove 11 is located is different in height from the plane where the groove bottom of the second strip-shaped groove 12 is located;

[0054] A first sliding structure 20 is arranged along the length direction of the first strip-shaped groove 11 and is connected to the first sliding rail 21 laid on the groove bottom of the first strip-shaped groove 11, and the first sliding block 22 is slidably connected to the first sliding rail 21;

[0055] A second sliding structure 30 is arranged along the length direction of the second strip-shaped groove 12 and is connected to the second sliding rail 31 laid on the groove bottom of the second strip-shaped groove 12, and the second sliding block 32 is slidably connected to the second sliding rail 31;

[0056] A coarse adjustment driving assembly comprises a first linear motor 40 and a second linear motor 50, the first linear motor 40 comprises a first linear motor stator 41 connected to the groove wall of the first strip-shaped groove 11 and a first linear motor mover 42 connected to the first sliding block 22, and the second linear motor 50 comprises a second linear motor stator 51 connected to the groove wall of the second strip-shaped groove 12 and a second linear motor mover 52 connected to the second sliding block 32;

[0057] At least two micro stages 60 are connected to the first sliding block 22 and the second sliding block 32 in correspondence, and the micro stage 60 comprises a bottom plate 61, a fine adjustment driving assembly, and a stage 62, the fine adjustment driving assembly is clamped between the bottom plate 61 and the stage 62, wherein the edge of the fine adjustment driving assembly is connected to the bottom plate 61, the middle part of the fine adjustment driving assembly is connected to the stage 62, and one of the micro stages 60 serves as the exposure position of the wafer, and the other micro stage 60 serves as the loading and unloading and calibration position of the wafer.

[0058]

[0059] ​It is worth mentioning that two micro-motion stages 60, one of which is used as the exposure position of the wafer, and the other is used as the loading and unloading and calibration position of the wafer, so that when one wafer is exposed, another wafer can be calibrated at the same time, thereby improving the work efficiency.

[0060] The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, and the raw material thereof is silicon. High-purity polysilicon is dissolved and incorporated into a silicon crystal seed, and then slowly pulled out to form a cylindrical single crystal silicon. After the silicon rod is ground, polished and sliced, a silicon wafer is formed, that is, a wafer.

[0061] In addition, the first slide rail 21 and the second slide rail 31 are connected to each other at a base point, and the first slide rail 21 is slidably connected to the first slide block 22 on both sides of the base point, and the second slide rail 31 is slidably connected to the second slide block 32 on both sides of the base point. One pair of edges of the micro-motion stage 60 is clamped between the two first slide blocks 22, and the other pair of edges of the micro-motion stage 60 is clamped between the two second slide blocks 32. The micro-motion stage 60 is moved along the direction of the first slide rail 21 under the action of the first linear motor 40 composed of the first linear motor stator 41 and the first linear motor mover 42, so as to realize the position adjustment of the micro-motion stage 60 in the X-axis direction. The micro-motion stage 60 is moved along the direction of the second slide rail 31 under the action of the second linear motor 50 composed of the second linear motor stator 51 and the second linear motor mover 52, so as to realize the position adjustment of the micro-motion stage 60 in the Y-axis direction. The clamping connection between the micro-motion stage 60 and the two first slide blocks 22, or the clamping connection between the micro-motion stage 60 and the two second slide blocks 32 is a separable connection. The micro-motion stage 60 can be moved in the X-axis direction by the first linear motor 40, or can be moved in the Y-axis direction by the second linear motor 50, or can be moved in the X-axis direction and the Y-axis direction by the first linear motor 40 and the second linear motor 50 respectively, that is, the linkage of the X-axis direction and the Y-axis direction is realized.

[0062] Since the movement of the micro-motion stage 60 driven by the first linear motor 40 in the X-axis direction and the movement of the micro-motion stage 60 driven by the second linear motor 50 in the Y-axis direction are two independent movements, the decoupling of the movement error is realized. Moreover, the carriers of the first linear motor 40 and the second linear motor 50 are the lower base 10, and there is no connection relationship between them, so as to avoid error accumulation, and further improve the accuracy of the micro-motion stage 60 in position adjustment.

[0063] The workpiece table exchange device with multiple stations of the photoetching machine provided by the application not only realizes synchronous exposure and calibration of the wafer, improves work efficiency, but also realizes motion error decoupling in X-axis direction and Y-axis direction, avoids error accumulation, and improves position adjustment accuracy.In addition, the corresponding errors generated by the first linear motor 40 and the second linear motor 50 in the operation process can be offset by the micro-motion table 60

[0064] Preferably, the first slider 22 and the second slider 32 are the same in structure, the first slider 22 comprises a sliding seat 221 in sliding cooperation with the first sliding rail 21, and a support 222 is connected to the sliding seat 221, wherein a roller 223 is connected to the support 222, and the roller 223 is in rolling cooperation with a clamping groove on the fine adjustment driving assembly, the axis direction of the roller 223 is perpendicular to the moving direction of the sliding seat 221, and the first linear motor mover 42 is connected to the sliding seat 221.

[0065] In the embodiment, the two rollers 223 in the two sliders on the same sliding rail are oppositely arranged, and the two sides of the micro-motion table 60 are clamped between the two rollers 223, so that the clamping and positioning of the micro-motion table 60 can be realized by the rollers 223, and when the micro-motion table 60 moves along the X-axis or Y-axis direction, the sliding block and the micro-motion table 60 are in rolling connection, so as to reduce friction and improve positioning accuracy.

[0066] It is worth mentioning that, since the plane where the groove bottom of the first strip-shaped groove 11 is located and the plane where the groove bottom of the second strip-shaped groove 12 is located have a height difference, the first sliding rail 21 connected to the groove bottom of the first strip-shaped groove 11 and the second sliding rail 31 connected to the groove bottom of the second strip-shaped groove 12 also have a height difference, so that in order to ensure that the clamping positions of the two first sliders 22 to the micro-motion table 60 and the clamping positions of the two second sliders 32 to the micro-motion table 60 are on the same plane, the heights of the sliding seats 221 in the first slider 22 and the second slider 32 are different. When the plane where the groove bottom of the first strip-shaped groove 11 is located is lower than the plane where the groove bottom of the second strip-shaped groove 12 is located, the height of the sliding seat 221 in the first slider 22 is higher than the height of the sliding seat 221 in the second slider 32; on the contrary, when the plane where the groove bottom of the first strip-shaped groove 11 is located is higher than the plane where the groove bottom of the second strip-shaped groove 12 is located, the height of the sliding seat 221 in the first slider 22 is lower than the height of the sliding seat 221 in the second slider 32.

[0067] Preferably, the fine adjustment driving assembly comprises a first piezoelectric ceramic stack actuator 63 arranged in the X-axis direction and a second piezoelectric ceramic stack actuator 64 arranged in the Y-axis direction, and a flexible structure, and the flexible structure comprises a metal plate, the metal plate is cut into a fixed plate 65 and a movable plate 66 arranged in a back-to-back shape by wire cutting, the fixed plate 65 and the movable plate 66 are connected by a plurality of amplification structures 67 arranged in a diamond shape, wherein the fixed plate 65 is connected to the bottom plate 61 by a fastener, the movable plate 66 is connected to the stage 62 by a fastener, the first piezoelectric ceramic stack actuator 63 and the second piezoelectric ceramic stack actuator 64 are installed in the amplification structure 67, and a clamping groove is arranged between the bottom plate 61 and the metal plate.

[0068] It is worth mentioning that one end of the amplification structure 67 connected to the movable plate 66 is an output end, one end of the amplification structure 67 connected to the fixed plate 65 is a fixed end, and the other two ends of the amplification structure 67 are input ends, wherein the two ends of the first piezoelectric ceramic stack actuator 63 and the two ends of the second piezoelectric ceramic stack actuator 64 are respectively connected to the two input ends of the corresponding amplification structure 67.

[0069] The flexible structure is a mechanical structure composed of flexible elements and rigid elements, and the elastic deformation of the flexible elements is used to transmit motion and force.

[0070] That is, a whole plate-shaped metal material is cut into a structure with uneven transverse thickness by wire cutting, when the mechanism is subjected to external force, the position with small transverse thickness deforms, thereby forming a corresponding displacement or rotation amount.

[0071] In the embodiment, the two ends of the amplification structure 67 connected to the movable plate 66 and the fixed plate 65 have small transverse thickness, when the two ends of the piezoelectric ceramic stack actuator output, the end of the amplification structure 67 connected to the movable plate 66 will deform, thereby enabling the wafer placed on the stage 62 to be fine adjusted.

[0072] In addition, the working principle of the first piezoelectric ceramic stack actuator 63 and the second piezoelectric ceramic stack actuator 64 in the embodiment is based on the piezoelectric effect, which converts electrical energy into mechanical motion, wherein the working principle of the piezoelectric ceramic stack actuator generally includes the following steps: first, apply voltage: when voltage is applied to the two ends of the piezoelectric ceramic material, an electric field will be generated in the material; second, piezoelectric effect: the crystal structure of the piezoelectric ceramic material changes slightly, causing the size of the material to change slightly, and the change is proportional to the strength of the electric field; third, mechanical displacement: due to the piezoelectric effect, the piezoelectric ceramic material will have a slight mechanical displacement; fourth, vibration effect: when the frequency of the electric field is high enough, the piezoelectric ceramic material will produce a vibration effect, thereby enabling the actuator to produce high-frequency mechanical vibration and achieve high-precision control.

[0073] Further preferably, the first piezoelectric ceramic stack actuator 63 is provided with a first inclined motion block 68 between the two ends of the first piezoelectric ceramic stack actuator 63 and the two ends of the corresponding amplification structure 67 respectively; the second piezoelectric ceramic stack actuator 64 is provided with a second inclined motion block 69 between the two ends of the second piezoelectric ceramic stack actuator 64 and the two ends of the corresponding amplification structure 67 respectively, wherein the horizontal degree of the stage 62 is adjusted by the first inclined motion block 68 and the second inclined motion block 69 to avoid tilting.

[0074] Further preferably, the number of the first piezoelectric ceramic stack actuator 63 located on the X-axis is one, and the first piezoelectric ceramic stack actuator 63 is arranged on the axis of the X-axis, and the two ends of the first piezoelectric ceramic stack actuator 63 are connected in parallel with the Y-axis; the number of the second piezoelectric ceramic stack actuator 64 located on the Y-axis is two, and the two second piezoelectric ceramic stack actuators 64 are symmetrically arranged on the same side of the micro stage 60 with the Y-axis, and the two ends of each second piezoelectric ceramic stack actuator 64 are connected in parallel with the X-axis.

[0075] Further preferably, the stage 62 is provided with a circular recess for carrying a wafer for photolithography.

[0076] In the embodiment, the running track of the first slider 22 and the running track of the second slider 32 are orthogonally arranged to overcome the cumulative error, but since the first slide rail 21 and the second slide rail 31 are arranged in an up-down manner, the two micro stages 60 can only move on the corresponding first slide rail 21 and the second slide rail 31, and cannot move across, so that the micro stage 60 located at the exposure position can only be used for wafer exposure, and the micro stage 60 located at the calibration position can only be used for wafer calibration and feeding, and cannot form a cycle.

[0077] Therefore, in order to realize the cycle of the two micro stages 60, an upper base 70 is further included, and the upper base 70 is arranged in an up-down manner with the lower base 10, and a third strip-shaped recess 71 is arranged on the upper base 70, wherein the opening direction of the third strip-shaped recess 71 is arranged opposite to the opening direction of the first strip-shaped recess 11 or the second strip-shaped recess 12, and the two ends of the third strip-shaped recess 71 span two adjacent first strip-shaped recesses 11.

[0078] A third sliding structure 80 is arranged on the third strip-shaped recess 71, and the third sliding structure 80 includes a third slide rail 81 laid along the length direction of the third strip-shaped recess 71 and on the groove bottom of the third strip-shaped recess 71, and two third sliders 82 are slidably connected on the third slide rail 81, wherein the two third sliders 82 can clamp the micro stage 60.

[0079] A third linear motor 90 includes a third linear motor stator 91 connected to the groove wall of the third strip-shaped recess 71, and a third linear motor rotor 92 connected to the third slider 82.

[0080] It is worth mentioning that through the cooperation among the third linear motor 90, the third slide rail 81 and the third slider 82, the cyclic movement of the two micro-stages 60 is realized, further improving the working efficiency. In addition, the third linear motor 90, the third slide rail 81 and the third slider 82 are connected to the upper base 70, so that the movement of the micro-stage 60 during the spanning movement and the movement on the X-axis and Y-axis are independently set, realizing the decoupling of movement errors and avoiding the generation of cumulative errors, thereby improving the accuracy of the movement of the micro-stage 60.

[0081] For example, in this embodiment, when viewed from the top view, the projections of the first slide rail 21, the second slide rail 31 and the third slide rail 81 on the lower base 10 are spliced to form a shape like the Chinese character '日' (day), and the exposure position and the calibration position are respectively located at both ends of the middle horizontal line of the shape like '日'. Through the first linear motor 40, the second linear motor 50 and the third linear motor 90, the two micro-stages 60 are moved in the clockwise or counterclockwise direction, so that the micro-stage 60 originally located at the exposure position is transferred to the calibration position, and the micro-stage 60 originally located at the calibration position is transferred to the exposure position, thus realizing the cycle of the two micro-stages 60.

[0082] Embodiment 2

[0083] As Figures 1 to 12 shown, compared with Embodiment 1, the difference of this embodiment is that four micro-stages 60 are provided in this embodiment. Among them, two micro-stages 60 serve as the exposure positions of the wafer, and the other two micro-stages 60 serve as the calibration positions of the wafer. Among them, the two exposure positions and the two calibration positions are arranged at intervals and form an annular distribution.

[0084] It is worth mentioning that a workpiece stage exchange device for a lithography machine with multiple workstations provided by the present invention can not only realize the cyclic stage exchange of the two micro-stages 60, but also realize the cyclic stage exchange of the four micro-stages 60, and even the cyclic stage exchange of more micro-stages 60, reflecting the expandability of the workpiece exchange device of the lithography machine, thereby further improving the working efficiency.

[0085] For example, in this embodiment, when viewed from the top view, the projections of the first slide rail 21, the second slide rail 31, and the third slide rail 81 on the lower base 10 are spliced to form a "field" shape. The first calibration position J1 and the second calibration position J2 are located at both ends of the middle vertical line of the "field" shape, and the first exposure position B1 and the second exposure position B2 are located at both ends of the middle horizontal line of the "field" shape. When the four micro-stages 60 are rotated counterclockwise by the first linear motor 40, the second linear motor 50, and the third linear motor 90, the micro-stage 60 originally at the first calibration position J1 is transferred to the first exposure position B1, the micro-stage 60 originally at the first exposure position B1 is transferred to the second calibration position J2, the micro-stage 60 originally at the second calibration position J2 is transferred to the second exposure position B2, and the micro-stage 60 originally at the second exposure position B2 is transferred to the first calibration position J1. Conversely, when the four micro-stages 60 are rotated clockwise by the first linear motor 40, the second linear motor 50, and the third linear motor 90, the micro-stage 60 originally at the first calibration position J1 is transferred to the second exposure position B2, the micro-stage 60 originally at the second exposure position B2 is transferred to the second calibration position J2, the micro-stage 60 originally at the second calibration position J2 is transferred to the first exposure position B1, and the micro-stage 60 originally at the first exposure position B1 is transferred to the first calibration position J1.

[0086] It should be noted that in the present invention, descriptions such as "first", "second", and "one" are only for descriptive purposes and should not be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined. Terms such as "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0087] In addition, the technical solutions between various embodiments of the present invention can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present invention.

[0088] The specific embodiments described herein are merely illustrative of the spirit of the application. Various modifications or changes in the specific embodiments described herein can occur to those skilled in the art to which the application pertains without departing from the spirit of the application, and it is understood that such modifications or changes are to be considered as within the scope of the application as defined by the appended claims.

Claims

1. A lithography worktable exchange device having multiple stations, characterized by, The utility model relates to a wafer exposure device, including: a lower base, a plurality of first and second orthogonal grooves are arranged on the lower base, the first grooves are arranged along the X-axis direction, and the second grooves are arranged along the Y-axis direction, wherein the plane where the groove bottom of the first groove is located and the plane where the groove bottom of the second groove is located have a height difference; a first sliding structure, including a first slide rail arranged along the length direction of the first groove and laid on the groove bottom of the first groove, and a first slider connected to the first slide rail and slidingly connected to the first slide rail; a second sliding structure, including a second slide rail arranged along the length direction of the second groove and laid on the groove bottom of the second groove, and a second slider connected to the second slide rail and slidingly connected to the second slide rail; a coarse adjustment driving assembly, including a first linear motor and a second linear motor, the first linear motor includes a first linear motor stator connected to the groove wall of the first groove and a first linear motor mover connected to the first slider, and the second linear motor includes a second linear motor stator connected to the groove wall of the second groove and a second linear motor mover connected to the second slider; at least two micro stages corresponding to the first and second sliders, and the micro stage includes a bottom plate, a fine adjustment driving assembly, and a stage, the fine adjustment driving assembly is clamped between the bottom plate and the stage, wherein the edge of the fine adjustment driving assembly is connected to the bottom plate, the middle part of the fine adjustment driving assembly is connected to the stage, and one of the micro stages is used as the exposure position of the wafer, and the other micro stage is used as the loading and unloading and calibration position of the wafer.

2. The multi-station wafer table exchange apparatus of claim 1, wherein, The intersection position of the first and second slide rails is used as a base point, one first slider is slidingly connected to the first slide rail on the two sides of the base point, one second slider is slidingly connected to the second slide rail on the two sides of the base point, one pair of edges of the micro stage is clamped between the two first sliders, and the other pair of edges of the micro stage is clamped between the two second sliders, wherein the clamping connection between the micro stage and the two first sliders or the clamping connection between the micro stage and the two second sliders is a separable connection, the micro stage moves in the X-axis direction through the first linear motor, moves in the Y-axis direction through the second linear motor, or moves in the X-axis and Y-axis directions through the first and second linear motors.

3. The multi-station wafer table exchange apparatus of claim 1, wherein, The first slider includes a sliding seat slidingly matched with the first slide rail, and a support connected to the sliding seat, wherein a roller is arranged on the support, the roller is rollingly matched with a clamping groove on the fine adjustment driving assembly, and the axis direction of the roller is perpendicular to the moving direction of the sliding seat.

4. A multi-station lithography wafer table exchange apparatus as claimed in any one of claims 1 to 3, wherein, The fine adjustment driving assembly comprises a first piezoelectric ceramic stack actuator arranged in the X-axis direction and a second piezoelectric ceramic stack actuator arranged in the Y-axis direction, and a flexible structure, and the flexible structure comprises a metal plate, the metal plate is cut into a fixed plate and a movable plate arranged in a back-shaped manner by wire cutting, the fixed plate and the movable plate are connected through a plurality of rhombus-shaped amplification structures, wherein the fixed plate is connected to the bottom plate through a fastener, the movable plate is connected to the stage through a fastener, the first piezoelectric ceramic stack actuator and the second piezoelectric ceramic stack actuator are installed in the amplification structure, one end of the amplification structure connected to the movable plate is an output end, one end of the amplification structure connected to the fixed plate is a fixed end, and the other two ends of the amplification structure are input ends, wherein the two ends of the first piezoelectric ceramic stack actuator and the two ends of the second piezoelectric ceramic stack actuator are respectively connected to the two input ends of the corresponding amplification structure.

5. A multi-station wafer table exchange apparatus for a lithography machine as defined in claim 4, wherein, The two ends of the first piezoelectric ceramic stack actuator and the two ends of the second piezoelectric ceramic stack actuator are respectively connected to the two ends of the corresponding amplification structure through a first inclined motion block and a second inclined motion block, wherein the levelness of the stage is adjusted through the first inclined motion block and the second inclined motion block.

6. A multi-station wafer table exchange apparatus for a lithography machine as defined in claim 4, wherein, The number of the first piezoelectric ceramic stack actuator arranged on the X-axis is one, and the first piezoelectric ceramic stack actuator is arranged on the X-axis, and the two ends of the first piezoelectric ceramic stack actuator are connected to each other in parallel with the Y-axis; the number of the second piezoelectric ceramic stack actuator arranged on the Y-axis is two, and the two second piezoelectric ceramic stack actuators are symmetrically arranged on the same side of the micro stage with the Y-axis, and the two ends of each second piezoelectric ceramic stack actuator are connected to each other in parallel with the X-axis.

7. The multi-station wafer table exchange apparatus of claim 1, wherein, Further comprising, The upper base is arranged above the lower base, and a third slot is arranged on the upper base, wherein the opening direction of the third slot is opposite to the opening direction of the first slot or the second slot, and the two ends of the third slot span two adjacent first slots; The third sliding structure comprises a third sliding rail arranged along the length direction of the third slot and laid on the bottom of the third slot, and two third sliding blocks connected to the third sliding rail and capable of sliding on the third sliding rail, wherein the two third sliding blocks can clamp the micro stage; The third linear motor comprises a third linear motor stator connected to the wall of the third slot, and a third linear motor rotor connected to the third sliding block.

8. A multi-station lithography stage exchange apparatus according to claim 7, wherein, The first sliding structure, the second sliding structure and the third sliding structure have the same structure, and the first linear motor, the second linear motor and the third linear motor have the same structure.

9. A multi-station lithography wafer table exchange apparatus as claimed in claim 8, wherein, When the number of micro-stages is two, the projections of the first slide rail, the second slide rail and the third slide rail on the lower base splice to form a "day" shape, and the exposure position and the calibration position are respectively located at the two ends of a horizontal in the middle of the "day" shape. The two micro-stages are moved in the clockwise direction or the counterclockwise direction by the first linear motor, the second linear motor and the third linear motor, so that the micro-stage originally located at the exposure position is transferred to the calibration position, and the micro-stage originally located at the calibration position is transferred to the exposure position, thereby realizing the circulation of the two micro-stages.

10. The multi-station lithography wafer table exchange apparatus of claim 8, wherein, When the number of micro-stages is four, two of the micro-stages are used as the exposure positions of the wafer, and the other two are used as the calibration positions of the wafer. The two exposure positions and the two calibration positions are arranged at intervals and form a ring-shaped distribution. The projections of the first slide rail, the second slide rail and the third slide rail on the lower base splice to form a "field" shape. The first calibration position and the second calibration position are located at the two ends of a vertical in the middle of the "field" shape, and the first exposure position and the second exposure position are located at the two ends of a horizontal in the middle of the "field" shape. When the four micro-stages are rotated in the counterclockwise direction by the first linear motor, the second linear motor and the third linear motor, the micro-stage originally located at the first calibration position is transferred to the first exposure position, the micro-stage originally located at the first exposure position is transferred to the second calibration position, the micro-stage originally located at the second calibration position is transferred to the second exposure position, and the micro-stage originally located at the second exposure position is transferred to the first calibration position. When the four micro-stages are rotated in the clockwise direction by the first linear motor, the second linear motor and the third linear motor, the micro-stage originally located at the first calibration position is transferred to the second exposure position, the micro-stage originally located at the second exposure position is transferred to the second calibration position, the micro-stage originally located at the second calibration position is transferred to the first exposure position, and the micro-stage originally located at the first exposure position is transferred to the first calibration position.

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