Phased array antenna heat dissipation structure and antenna system

Abstract

The present invention relates to a phased array antenna heat dissipation structure and antenna system, comprising a main housing having multiple chambers formed by a heat dissipation cold plate. The main housing includes a top plate and side plates arranged around the edge of the top plate. The top plate's upper surface is separated by the heat dissipation cold plate to form a first antenna mounting chamber and a second antenna mounting chamber. The first antenna mounting chamber is used to mount a receiving antenna array, and the second antenna mounting chamber is used to mount a transmitting and receiving common-aperture antenna array. The top plate's lower surface is separated by the heat dissipation cold plate to form a first functional module mounting chamber, a second functional module mounting chamber, and a third functional module mounting chamber. The present invention utilizes a highly integrated design with the heat dissipation cold plate, the antenna mounting platform, and the functional module mounting chambers, thereby increasing the overall system integration, reducing system volume and weight, and improving heat dissipation efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of phased array antennas, and in particular to a phased array antenna heat dissipation structure and an antenna system. Background Art

[0002] With the rapid development of 5G communications and broadband low-orbit satellite communications, silicon-based millimeter-wave processes and integrated antenna / RF technology are maturing. Active phased arrays are moving toward low-cost, low-profile, and multi-frequency co-aperture designs. To enhance antenna functionality, a new antenna structure is created by combining transmit and receive co-aperture antennas with receive antennas. Compared to traditional phased arrays, co-aperture transmit and receive antennas reuse the array surface, reducing its size. However, due to the extremely high density of transmit and receive chips and various circuits, the antenna surface temperature increases dramatically, preventing effective heat dissipation and thus affecting the antenna's electrical performance.

[0003] Existing heat dissipation technologies typically only target traditional phased arrays or antenna arrays with co-aperture for both transmitting and receiving. For example, Chinese invention patent CN116390454A proposes a heat dissipation method and system for a highly integrated satellite communication phased array user terminal. This method involves distributing heat from the condensing end of a semiconductor refrigeration plate through a vapor chamber and then transferring it to heat sinks. The heat sinks then diffuse the heat into the surrounding airflow generated by a piezoelectric fan. This method addresses the heat generation issue associated with satellite communication phased array antenna unit chips during operation.

[0004] In order to enhance the function of the antenna, the transmitting and receiving co-aperture antenna and the receiving antenna are set together to form a new antenna structure, which will generate more heat during operation. Therefore, solving the problem of efficient heat dissipation of high heat flux density in a limited space is a technical problem that needs to be urgently solved by technical personnel in this field. Summary of the Invention

[0005] In order to solve the technical problems existing in the above-mentioned prior art, the purpose of the present invention is to provide a phased array antenna heat dissipation structure and antenna system, which can quickly diffuse the heat generated by the transmitting and receiving co-aperture antenna array surface and the receiving antenna array surface chip into the air.

[0006] To achieve the above-mentioned object, the present invention provides a phased array antenna heat dissipation structure, comprising a main housing having multiple chambers formed by a heat dissipation cold plate, wherein the main housing comprises a top plate and side plates arranged around the edge of the top plate;

[0007] The upper surface of the top plate is provided with a first antenna installation cavity and a second antenna installation cavity separated by the heat dissipation cold plate, the first antenna installation cavity is used to install the receiving antenna array surface, and the second antenna installation cavity is used to install the transmitting and receiving common-aperture antenna array surface;

[0008] The lower surface of the top plate is divided into a first functional module installation cavity, a second functional module installation cavity and a third functional module installation cavity by the heat dissipation cold plate.

[0009] According to a technical solution of the present invention, the first antenna installation cavity is arranged opposite to the first functional module installation cavity, and the second antenna installation cavity is arranged opposite to the second functional module installation cavity and the third functional module installation cavity;

[0010] Heat dissipation fins are distributed on the back of the first functional module installation cavity and the third functional module installation cavity.

[0011] According to a technical solution of the present invention, the heat dissipation cold plate adopts a temperature averaging plate with a rectangular cavity structure, and the inner cavity of the temperature averaging plate is filled with a working medium.

[0012] According to a technical solution of the present invention, a cooling fan is provided in the third functional module installation cavity except for the side adjacent to the second functional module installation cavity;

[0013] A heat dissipation fan is provided on a side of the first functional module installation cavity away from the third functional module installation cavity.

[0014] According to a technical solution of the present invention, a radome is provided above the top plate, and the radome is made of a transparent material with a honeycomb sandwich structure;

[0015] The phased array antenna heat dissipation structure further includes: a bottom plate adapted to be mounted on the main housing, wherein the bottom plate, the radome and the top plate are parallel;

[0016] The bottom plate is fixed to the heat dissipation fins to form an internal heat dissipation air duct.

[0017] According to a technical solution of the present invention, it also includes:

[0018] A heat transfer boss plate is provided with a plurality of bosses, and the heat transfer boss plate is arranged between the antenna cover and the receiving antenna array surface and the transmitting and receiving co-aperture antenna array surface.

[0019] According to a technical solution of the present invention, a thermally conductive pad is further installed on the top of the boss;

[0020] The thermally conductive adhesive pad contacts the chips mounted on the transmit-receive co-aperture antenna array and the receive antenna array.

[0021] According to a technical solution of the present invention, an external connector installation cavity is provided on the side of the first antenna installation cavity.

[0022] According to one aspect of the present invention, an antenna system configured with a phased array antenna heat dissipation structure as described in any one of the above technical solutions is proposed, comprising:

[0023] A receiving antenna is arranged in the first antenna installation cavity;

[0024] The transmitting and receiving aperture is arranged in the second antenna installation cavity;

[0025] The main control board and the up / down converter are arranged in the first functional module installation cavity;

[0026] The combined inertial navigation module, tracking receiver and navigation antenna are arranged in the second functional module installation cavity.

[0027] The external connector assembly is arranged in the external connector installation cavity.

[0028] According to a technical solution of the present invention, the external connector component includes at least: a radio frequency interface, a power supply interface, a control interface and a debugging interface, wherein the radio frequency interface includes a radio frequency interface for receiving four beams and a radio frequency interface for transmitting four beams.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] A phased array antenna heat dissipation structure and antenna system of the present invention, by providing antenna mounting cavities and functional module mounting cavities on the upper and lower surfaces of a top plate, respectively, can effectively utilize the internal space of a main housing and achieve a compact layout. The receiving antenna array and the transmit-receive co-aperture antenna array are mounted in separate cavities, which helps clarify functional divisions and facilitates management and maintenance. The independent provision of the first and second antenna mounting cavities allows independent thermal management of different types of antennas, which can be optimized according to their respective thermal load characteristics. The provision of the functional module mounting cavities facilitates a modular design, allowing each module to be independently upgraded or replaced as needed, thereby improving the flexibility and scalability of the system. The provision of multiple functional module mounting cavities within the main housing fully utilizes the efficient heat dissipation capacity of the heat dissipation cold plate. At the same time, the separate cavity arrangement of the receiving antenna array and the transmit-receive co-aperture antenna array further improves overall heat dissipation efficiency and ensures stable operation of electronic components. The integration of the antenna and functional modules within a single main housing reduces external connections, reduces system complexity, improves integration, and solves the problem of low temperature consistency of the antenna array. This makes the antenna system using the heat dissipation structure of the present invention characterized by high overall integration, a low profile, and light weight. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be derived from these drawings without inventive effort.

[0032] Figure 1 A diagram of the upper surface structure of a phased array antenna heat dissipation structure provided in an embodiment of the present invention;

[0033] Figure 2 A bottom surface structural diagram of a phased array antenna heat dissipation structure provided in an embodiment of the present invention;

[0034] Figure 3 An exploded diagram of the structure of a phased array antenna system provided in an embodiment of the present invention;

[0035] Figure 4 and Figure 5 A structural diagram of the back side of the antenna array surface of a phased array antenna system provided in an embodiment of the present invention;

[0036] Figure 6 A cross-sectional view of a temperature distribution plate according to an embodiment of the present invention.

[0037] Description of reference numerals:

[0038] 10. Heat dissipation cold plate; 11. First antenna installation cavity; 12. Second antenna installation cavity; 130. First functional module installation cavity; 131. Main control board; 132. Up and down converter; 140. Second functional module installation cavity; 141. Combined inertial navigation module; 142. Tracking receiver; 143. Navigation antenna; 150. Third functional module installation cavity; 2. External connector installation cavity; 3. Heat transfer boss plate; 4. Heat dissipation fins; 501. First air outlet fan; 502. First air inlet fan; 503. Second air inlet fan; 504. Second air outlet fan; 6. Radome; 7. Bottom plate; 8. Transceiver and transmit common aperture antenna array; 9. Receiving antenna array; 15. Thermal conductive pad; 16. Capillary layer. DETAILED DESCRIPTION

[0039] The description of the embodiments in this specification should be combined with the corresponding drawings, which should be considered a complete part of this specification. In the drawings, the shapes and thicknesses of the embodiments may be exaggerated and indicated for simplicity or convenience. Furthermore, the various structural components in the drawings will be described separately. It is worth noting that components not shown in the drawings or not described in words are known to those of ordinary skill in the art.

[0040] The description of the embodiments herein and any references to directions and orientations are for ease of description only and are not to be construed as limiting the scope of the present invention. The following description of the preferred embodiments may involve combinations of features, which may exist independently or in combination. The present invention is not specifically limited to the preferred embodiments. The scope of the present invention is defined by the claims.

[0041] like Figures 1 to 3 As shown, a phased array antenna heat dissipation structure of the present invention includes a main housing with multiple chambers formed by a heat dissipation cold plate 10, and the main housing includes a top plate and side plates arranged around the edge of the top plate;

[0042] The upper surface of the top plate is separated by a heat dissipation cold plate 10 to form a first antenna installation cavity 11 and a second antenna installation cavity 12. The first antenna installation cavity 11 is used to install the receiving antenna array 9, and the second antenna installation cavity 12 is used to install the transmitting and receiving common aperture antenna array 8;

[0043] The lower surface of the top plate is divided into a first functional module installation cavity 130 , a second functional module installation cavity 140 and a third functional module installation cavity 150 by the heat dissipation cold plate 10 .

[0044] By respectively arranging antenna mounting cavities and functional module mounting cavities on the upper and lower surfaces of the top plate, the internal space of the main shell can be effectively utilized to achieve a compact layout; the receiving antenna array and the transmit-receive common-aperture antenna array 8 are respectively installed in different cavities, which helps to clarify functional zoning and facilitates management and maintenance; the independent setting of the first antenna mounting cavity 11 and the second antenna mounting cavity 12 allows independent thermal management of different types of antennas, which can be optimized according to their respective thermal load characteristics; the setting of the functional module mounting cavity helps to achieve modular design, and each module can be independently upgraded or replaced as needed, thereby improving the flexibility and scalability of the system; by arranging multiple functional module mounting cavities in the main shell, the efficient heat dissipation capacity of the heat dissipation cold plate is fully utilized. At the same time, the receiving antenna array and the transmit-receive common-aperture antenna array are arranged in separate cavities, which is more conducive to improving the overall heat dissipation efficiency and ensuring the stable operation of the electronic components; integrating the antenna and the functional module in a main shell can reduce external connections, reduce the complexity of the system, improve the integration, and solve the problem of low temperature consistency of the antenna array, so that the antenna system using the heat dissipation structure of the present invention has the characteristics of high overall integration, low profile, and light weight.

[0045] In some embodiments of the present invention, the first antenna installation cavity 11 is disposed opposite to the first functional module installation cavity 130 , and the second antenna installation cavity 12 is disposed opposite to the second functional module installation cavity 140 and the third functional module installation cavity 150 ;

[0046] In this embodiment, the heat dissipation cold plate 10 between the first antenna installation cavity 11 and the first functional module installation cavity 130, and between the second antenna installation cavity 12 and the second functional module installation cavity 140 is provided with a through hole, so that the receiving antenna array surface 9 and the first functional module installation cavity 130 are vertically interconnected, and the transmitting and receiving common aperture antenna array surface 8 and the second functional module installation cavity 140 are vertically interconnected, which can reduce the signal transmission path, reduce signal attenuation, and improve signal transmission efficiency.

[0047] Secondly, the space can be effectively utilized to achieve a compact layout; the heat generated by the receiving antenna array surface 9 installed in the first antenna installation cavity 11 can be quickly discharged through the first functional module installation cavity 130, and the heat generated by the transmitting and receiving co-aperture antenna array surface 8 installed in the second antenna installation cavity 12 can be quickly discharged through the second functional module installation cavity 140, which optimizes the heat dissipation path, improves the heat dissipation efficiency, and ensures the temperature control of the antenna array surface and the functional module.

[0048] like Figure 5 As shown, heat dissipation fins 4 are distributed on the back of the first functional module installation cavity 130 and the third functional module installation cavity 150 , which have the effect of reducing weight and increasing volume efficiency.

[0049] In some embodiments of the present invention, the heat dissipation cold plate 10 is a temperature averaging plate with a rectangular cavity structure, a capillary layer 16 is attached to the cavity, and the working fluid is welded by high-frequency diffusion welding to form the inner cavity of the temperature averaging plate filled with the working fluid.

[0050] The working fluid filled in the inner cavity of the temperature spreader can vaporize after being heated in the hot area. The gas quickly expands to the entire cavity, and then liquefies in the cooling area. The liquid then returns to the hot area through the capillary layer. This process realizes the rapid transfer and uniform distribution of heat, and improves the heat conduction efficiency. Secondly, the cavity frame of the temperature spreader is the installation body of the receiving antenna array 9 and the transmitting and receiving co-aperture antenna array 8, and is highly integrated with the array surface. This not only meets the installation requirements of the antenna array surface components, but also optimizes space utilization and improves the integration of the whole machine.

[0051] like Figure 4 As shown, in some embodiments of the present invention, a cooling fan is provided in the third functional module installation cavity 150 except for one side adjacent to the second functional module installation cavity 140;

[0052] A heat dissipation fan is provided on a side of the first functional module installation cavity 130 away from the third functional module installation cavity 150 .

[0053] The rotation of the fan draws air in and blows it through the heat dissipation fins 4, taking away the heat.

[0054] The third functional module installation cavity 150 is provided with an air inlet fan and an air outlet fan on opposite sides. The air inlet fan, the air outlet fan, the heat dissipation fins 4, and the heat dissipation cold plate constituting the third functional module installation cavity 150 form a heat dissipation duct, so that the air enters the third functional module installation cavity 150 and carries away the high-temperature gas on the fins through the heat dissipation duct to achieve the purpose of heat dissipation.

[0055] In the third functional module installation cavity 150, after the first air inlet fan 502 and the second air inlet fan 503 are powered on, cold air outside the antenna system is brought into the third functional module installation cavity 150 and the first functional module installation cavity 130. After the cold air enters the third functional module installation cavity 150 and the first functional module installation cavity, it exchanges with the hot air on the heat dissipation fins 4, and finally the hot air is brought out from the first air outlet fan 501.

[0056] In some embodiments of the present invention, a radome 6 is provided above the top plate, and the radome 6 is made of a transparent material with a honeycomb sandwich structure;

[0057] The phased array antenna heat dissipation structure further includes: a bottom plate 7 adapted to be mounted on the main housing, the bottom plate 7 and the radome 6 being parallel to the top plate;

[0058] The bottom plate 7 is fixed to the heat dissipation fins 4 to form an internal heat dissipation duct.

[0059] The transparent material ensures the transmittance of the antenna cover 6 to electromagnetic waves, allowing the antenna array to effectively receive and send signals without losing signal strength due to the material itself. Secondly, the honeycomb sandwich structure provides high mechanical strength, can withstand the impact and pressure of the external environment, and protect the antenna array surface from physical damage.

[0060] In a possible implementation, the radome 6 is snapped onto the main shell and is located above the top plate, and the top plate and the radome are adapted to the main shell in size.

[0061] In some embodiments of the present invention, further comprising:

[0062] The heat transfer boss plate 3 is provided with a plurality of bosses, and the heat transfer boss plate 3 is arranged between the antenna cover 6 and the receiving antenna array surface 9 and the transmitting and receiving co-aperture antenna array surface 8.

[0063] The boss design on the heat transfer boss plate 3 increases the surface area in contact with the antenna array chip, which helps to more effectively conduct heat from the chip to the heat transfer boss, and then to the entire heat dissipation system. The boss design helps to distribute heat more evenly on the heat transfer boss plate 3, reduce the formation of hot spots, and thus improve the thermal stability of the entire antenna array.

[0064] In some embodiments of the present invention, a thermally conductive pad 15 is further installed on the top of the boss;

[0065] The thermally conductive adhesive pad 15 contacts the chips mounted on the transmitting and receiving co-aperture antenna array surface 8 and the receiving antenna array surface 9 .

[0066] The use of the thermal conductive pad 15 can not only improve the efficiency of heat conduction, but also has a shock-absorbing function, which can absorb and buffer the force generated by vibration or impact, and protect sensitive chips from damage. Secondly, the thermal conductive pad 15, as a thermal interface material, can fill the tiny gap between the chip and the heat transfer boss, reduce thermal resistance, and ensure smooth heat transfer.

[0067] In some embodiments of the present invention, an external connector installation cavity 2 is provided on a side of the first antenna installation cavity 11 .

[0068] It not only helps to improve the system's integration and maintenance convenience, but also improves the stability of signal transmission and heat dissipation efficiency, while protecting the connector from damage, thereby improving the reliability and durability of the entire phased array antenna system.

[0069] According to one aspect of the present invention, an antenna system configured with a phased array antenna heat dissipation structure as described in any one of the above technical solutions is proposed, comprising:

[0070] A receiving antenna is provided in the first antenna installation cavity 11;

[0071] The transmitting and receiving ports share the same caliber and are arranged in the second antenna mounting cavity 12;

[0072] The main control board 131 and the up / down converter 132 are arranged in the first functional module installation cavity 130;

[0073] The combined inertial navigation module, tracking receiver, and navigation antenna are disposed in the second functional module installation cavity 140 .

[0074] The external connector assembly is arranged in the external connector installation cavity 2 .

[0075] In this embodiment, if Figure 6 As shown, the chips of the receiving antenna and the transmitting and receiving co-aperture antenna are the heat sources. The heat generated by the receiving antenna array surface 9 and the transmitting and receiving co-aperture antenna array surface 8 is transferred to the heat transfer boss plate 3 through the thermal conductive adhesive pad 15 in contact therewith. The top of the heat transfer boss plate 3 is in contact with the heat dissipation cold plate 10, and the heat is transferred to the heat dissipation cold plate 10. Secondly, heat dissipation fins 4 are distributed on the back of the first functional module installation cavity 130 and the third functional module installation cavity 150, which increases the heat dissipation area and then the fan takes away the heat from the heat dissipation fins 4 through forced convection, thereby improving the heat dissipation efficiency.

[0076] In some embodiments of the present invention, the external connector assembly includes at least: a radio frequency interface, a power supply interface, a control interface, and a debugging interface, wherein the radio frequency interface includes a radio frequency interface for receiving four beams and a radio frequency interface for transmitting four beams.

[0077] Integrating multiple interfaces into one external connector assembly reduces the required physical space, simplifies wiring and connections, and improves system integration. Secondly, the centralized interface design makes maintenance and upgrade processes simpler and faster because all necessary connection points are concentrated in one location for easy access and operation.

[0078] The RF interface is specifically designed for receiving and transmitting beams, ensuring efficient and stable signal transmission, which is crucial to the performance of the phased array antenna system. The power supply interface simplifies power connection and ensures the power supply required for stable operation of the system. The presence of the control interface and debugging interface enables the system to flexibly perform control adjustments and fault diagnosis, improving the system's operability and reliability.

[0079] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, horizontal, vertical, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0080] The above embodiments are used to illustrate the present invention rather than to limit the present invention. Any modifications and changes made to the present invention within the spirit of the present invention and the protection scope of the claims shall fall within the protection scope of the present invention.

Claims

1. A phased array antenna heat dissipation structure, characterized in that: The invention comprises a main shell having a plurality of chambers and formed by a heat dissipation cold plate (10), wherein the main shell comprises a top plate and side plates arranged around the edge of the top plate; The upper surface of the top plate is divided into a first antenna installation cavity (11) and a second antenna installation cavity (12) by the heat dissipation cold plate (10), wherein the first antenna installation cavity (11) is used for installing a receiving antenna array surface (9), and the second antenna installation cavity (12) is used for installing a transmitting and receiving common aperture antenna array surface (8); The lower surface of the top plate is divided into a first functional module installation cavity (130), a second functional module installation cavity (140), and a third functional module installation cavity (150) by the heat dissipation cold plate (10); The first antenna installation cavity (11) is arranged opposite to the first functional module installation cavity (130), and the second antenna installation cavity (12) is arranged opposite to the second functional module installation cavity (140) and the third functional module installation cavity (150); Heat dissipation fins (4) are distributed on the backs of the first functional module installation cavity (130) and the third functional module installation cavity (150); In the third functional module installation cavity, a heat dissipation fan is provided on each side except the side adjacent to the second functional module installation cavity (140); A cooling fan is provided on a side of the first functional module installation cavity (130) away from the third functional module installation cavity (150); Heat generated by the receiving antenna array surface (9) installed in the first antenna installation cavity (11) can be discharged through the first functional module installation cavity (130), and heat generated by the transmitting and receiving co-aperture antenna array surface (8) installed in the second antenna installation cavity (12) can be discharged through the second functional module installation cavity (140); The independent arrangement of the first antenna installation cavity (11) and the second antenna installation cavity (12) allows independent thermal management of different types of antennas.

2. The phased array antenna heat dissipation structure according to claim 1, characterized in that: The heat dissipation cold plate (10) adopts a temperature-averaging plate with a rectangular cavity structure, and the inner cavity of the temperature-averaging plate is filled with a working medium.

3. The phased array antenna heat dissipation structure according to claim 1, characterized in that: A radome (6) is provided above the top plate, and the radome (6) is made of a transparent material with a honeycomb sandwich structure; The phased array antenna heat dissipation structure further comprises: a bottom plate (7) adapted to be mounted on the main housing, wherein the bottom plate (7), the antenna cover (6) and the top plate are parallel; The bottom plate (7) is fixed to the heat dissipation fins (4) to form an internal heat dissipation air duct.

4. The phased array antenna heat dissipation structure according to claim 3, characterized in that: Also includes: A heat transfer boss plate (3) is provided with a plurality of bosses, and the heat transfer boss plate (3) is provided between the antenna cover (6), the receiving antenna array surface (9), and the transmitting and receiving common aperture antenna array surface (8).

5. The phased array antenna heat dissipation structure according to claim 4, characterized in that: A heat-conducting adhesive pad (15) is also installed on the top of the boss; The thermally conductive adhesive pad (15) contacts the chips mounted on the transmitting and receiving co-aperture antenna array surface (8) and the receiving antenna array surface (9).

6. The phased array antenna heat dissipation structure according to claim 1, characterized in that: An external connector installation cavity (2) is provided on the side of the first antenna installation cavity (11).

7. An antenna system equipped with the phased array antenna heat dissipation structure according to any one of claims 1 to 6, characterized in that: include: A receiving antenna, arranged in the first antenna installation cavity (11); A transmitting and receiving common aperture antenna, arranged in the second antenna installation cavity (12); A main control board (131) and an up / down converter (132) are arranged in the first functional module installation cavity (130); A combined inertial navigation module (141), a tracking receiver (142), and a navigation antenna (143) are arranged in the second functional module installation cavity (140); An external connector assembly is arranged in the external connector installation cavity (2).

8. The antenna system according to claim 7, wherein: The external connector component includes at least: a radio frequency interface, a power supply interface, a control interface and a debugging interface, wherein the radio frequency interface includes a radio frequency interface for receiving four beams and a radio frequency interface for transmitting four beams.

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