An electronic device

Abstract

Embodiments of the present application provide an electronic device, which can include a first sub-board, a second sub-board, and a connecting sub-board connecting the first sub-board and the second sub-board, a side surface of the connecting sub-board is provided with a radiator, and an antenna is formed by the radiator. Since the structure of the antenna uses the side surface of the connecting sub-board to arrange the radiator, a radiation beam perpendicular to the side surface can be generated, and the coverage of the radiation beam of the electronic device in the direction is realized. Meanwhile, since the radiator is arranged on the side surface, the size of the antenna in the thickness direction of the electronic device is reduced, and the thickness of the electronic device will not be increased due to the layout of the antenna.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of wireless communication, and in particular to an electronic device. BACKGROUND

[0002] With the rapid development of wireless communication technology, the low frequency of radio spectrum has tended to be saturated, and the millimeter wave frequency band has abundant spectrum resources, so that the millimeter wave can provide a solution for high-speed wireless communication. The millimeter wave antenna requires wideband and high gain performance to realize high-speed data transmission, low latency and high reliability.

[0003] However, due to the limited space of the electronic device, how to reasonably layout the millimeter wave antenna in the limited space is a problem to be solved. SUMMARY

[0004] The electronic device provided by the embodiments of the present application includes a first sub-board, a second sub-board, and a connecting sub-board connecting the first sub-board and the second sub-board, a side surface of the connecting sub-board is provided with a radiator, and an antenna is formed by the radiator.

[0005] In a first aspect, an electronic device is provided, including: a radio frequency chip; a first sub-board and a second sub-board, the radio frequency chip being located on the first sub-board; a connecting sub-board, the connecting sub-board including a first surface and a second surface arranged opposite to each other, and a first side surface connected between the first surface and the second surface, the first surface being connected with the first sub-board, and the second surface being connected with the second sub-board; and a first radiator, the first radiator being located on the first side surface, the first radiator including a first feeding point, and the first radiator being coupled with the radio frequency chip at the first feeding point.

[0006] According to the technical scheme of the embodiments of the present application, the radiator is arranged on the first side surface of the connecting sub-board, which can utilize the original structure in the electronic device to realize the layout of the antenna. At the same time, since the radiator is arranged on the side surface of the connecting sub-board, it can generate a first directional (perpendicular to the first side surface) radiation beam, so that the electronic device can realize the coverage of the millimeter wave frequency band in the first direction. Moreover, since the radiator is not integrated with the radio frequency chip in the same package, the size in the thickness direction of the electronic device is small. In an embodiment, the antenna can be a millimeter wave antenna, which works in the millimeter wave frequency band.

[0007] In some implementations of the first aspect, the connection sub-board further comprises: a plurality of first ground pads, a plurality of second ground pads, and a plurality of first metal connectors; the first ground pads are located on the first surface, the second ground pads are located on the second surface, and the first metal connectors are located inside the connection sub-board; a first end of each of the first metal connectors is connected to a first ground pad, and a second end of each of the first metal connectors is connected to a second ground pad; at least some of the plurality of first ground pads, the plurality of second ground pads, and the plurality of first metal connectors are arranged along a first direction, and the first direction is a length extension direction of the first radiator.

[0008] According to the technical solutions of the embodiments of the present application, the first ground pads, the second ground pads, and the metal connectors can be equivalent to floors of the radiator, which can improve the radiation performance of the antenna. At the same time, the interference of other electrical signal transmission structures inside the connection sub-board on the antenna when transmitting electrical signals can be reduced, and the radiation performance of the antenna can be further improved.

[0009] In some implementations of the first aspect, the connection sub-board further comprises: a plurality of third ground pads and a plurality of fourth ground pads; the third ground pads are located on a first region of the first surface, the first region is a region surrounded by the first edge and the plurality of first ground pads, and the first surface intersects the first side surface at the first edge; and the fourth ground pads are located on a second region of the second surface, the second region is a region surrounded by the second edge and the plurality of second ground pads, and the second surface intersects the first side surface at the second edge.

[0010] According to the technical solutions of the embodiments of the present application, the first ground pads, the second ground pads, and the metal connectors can be equivalent to floors of the radiator, which can improve the radiation performance of the antenna. At the same time, the interference of other electrical signal transmission structures inside the connection sub-board on the antenna when transmitting electrical signals can be reduced, and the radiation performance of the antenna can be further improved.

[0011] In some implementations of the first aspect, a distance between any two adjacent third ground pads in the plurality of third ground pads is less than or equal to 0.5 mm, and / or a distance between any two adjacent fourth ground pads in the plurality of fourth ground pads is less than or equal to 0.5 mm.

[0012] According to the technical scheme of the embodiment of the present application, the distance between the two adjacent pads is less than or equal to 0.5 mm, which can be understood as that the shortest distance between any two points on the two adjacent pads is less than or equal to 0.5 mm. When the distance between the two adjacent pads is less than or equal to 0.5 mm, the interference of the other electrical signal transmission structure in the connection sub-board on the antenna when transmitting electrical signals can be better reduced, and the radiation performance of the antenna is further improved.

[0013] With reference to the first aspect, in some implementations of the first aspect, the connection sub-board further includes: a feeding pad and a feeding connector; the feeding pad is located in the first region, and the feeding pad is electrically connected with the radio frequency chip; a first end of the feeding connector is electrically connected with the first radiator at the first feeding point, and a second end of the feeding connector is electrically connected with the feeding pad.

[0014] According to the technical scheme of the embodiment of the present application, the first ground pad, the second ground pad, the third ground pad, the fourth ground pad and the metal connector can form a semi-open metal cavity, and an opening is arranged only in the direction in which the antenna radiates, and only the feeding connector for transmitting the radio frequency signal of the antenna is arranged in the metal cavity, so that the interference of the other electrical signal transmission structure in the connection sub-board on the antenna can be reduced.

[0015] With reference to the first aspect, in some implementations of the first aspect, the feeding connector includes a first part and a second part, the first part is located on the first side surface, and the second part is located on the first surface; a first end of the first part is electrically connected with the first radiator at the first feeding point, a second end of the first part is connected with a first end of the second part, and a second end of the second part is electrically connected with the feeding pad.

[0016] With reference to the first aspect, in some implementations of the first aspect, the feeding connector includes a first part and a second part, the first part and the second part are arranged in the connection sub-board, the first part extends along a second direction, the second part extends along a third direction, and the second direction is different from the third direction; a first end of the first part is electrically connected with the first radiator at the first feeding point, a second end of the first part is connected with a first end of the second part, and a second end of the second part is electrically connected with the feeding pad.

[0017] With reference to the first aspect, in some implementations of the first aspect, the first sub-board further includes a feeding line; a first end of the feeding line is electrically connected with the feeding pad, and a second end of the feeding line is electrically connected with the radio frequency chip.

[0018] With reference to the first aspect, in some implementations of the first aspect, a sum of a length of the feeding line and a length of the feeding connector is less than or equal to 15 mm.

[0019] According to the technical solution of the embodiment of the present application, the first radiator is arranged on the first side of the connection sub-board, the radio frequency chip is located on the first sub-board, the distance between the radio frequency chip and the first radiator is short, and the feeding path between the radio frequency chip and the feeding point is short, so that the loss of the radio frequency signal in the transmission process can be effectively reduced, and the radiation performance of the antenna can be improved.

[0020] With reference to the first aspect, in some implementations of the first aspect, a distance between two adjacent first metal connectors of the plurality of first metal connectors is less than or equal to 0.5 mm.

[0021] According to the technical solution of the embodiment of the present application, the distance between the two adjacent first metal connectors is less than or equal to 0.5 mm, which can be understood as that the shortest distance between any two points on the two adjacent first metal connectors is less than or equal to 0.5 mm. When the distance between the two adjacent pads is less than or equal to 0.5 mm, the plurality of third ground pads on the first surface can be equivalent to a metal surface, and the plurality of fourth ground pads on the second surface can also be equivalent to a metal surface. Therefore, the first ground pad, the second ground pad, the third ground pad, the fourth ground pad and the metal connector can form a semi-open metal cavity, and only an opening is arranged in the first direction (for example, the y direction) in which the antenna radiates. The metal cavity can isolate the antenna from other electrical signal transmission structures in the connection sub-board, so as to avoid mutual interference between the radiation beams (for example, the side lobe beams) generated by the antenna and the other electrical signal transmission structures in the connection sub-board. Moreover, only the feeding connector for transmitting the radio frequency signal of the antenna is arranged in the metal cavity, so that the interference of the other electrical signal transmission structures in the connection sub-board on the electrical signal fed by the antenna can be reduced, and the radiation performance of the antenna can be improved.

[0022] With reference to the first aspect, in some implementations of the first aspect, the first radiator includes a first metal piece and a second metal piece; and a first end of the first metal piece and a first end of the second metal piece are opposite to each other and do not contact each other.

[0023] According to the technical solution of the embodiment of the present application, the first radiator can form a dipole antenna. In actual applications, the radiator 220 can also form other antenna structures, for example, a patch antenna, an inverted F antenna, a planar inverted F antenna, etc., and the embodiment of the present application does not limit this.

[0024] With reference to the first aspect, in some implementations of the first aspect, the electronic device further includes a second radiator; the connecting sub-board includes a second side surface connecting between the first surface and the second surface, and the second radiator is located on the second side surface; wherein the second radiator includes a second feeding point, and the second radiator is coupled to the radio frequency chip at the second feeding point.

[0025] According to the technical scheme of the embodiment of the present application, the first radiator can form an antenna 1, and the second radiator can form an antenna 2, and the antenna 1 and the antenna 2 can be used to generate radiation beams in different directions to improve the beam coverage of the electronic device.

[0026] With reference to the first aspect, in some implementations of the first aspect, the connecting sub-board further includes a plurality of fifth ground pads, a plurality of sixth ground pads and a plurality of second metal connectors; wherein the fifth ground pads are located on the first surface, the sixth ground pads are located on the second surface, and the second metal connectors are located in the connecting sub-board; a first end of the second metal connector is connected to the fifth ground pad, and a second end of the second metal connector is connected to the sixth ground pad; at least part of the plurality of fifth ground pads, the plurality of sixth ground pads and the plurality of second metal connectors are arranged along a fourth direction, and the fourth direction is a length extension direction of the second radiator.

[0027] With reference to the first aspect, in some implementations of the first aspect, the connecting sub-board further includes a plurality of seventh ground pads and a plurality of eighth ground pads; wherein the seventh ground pads are located on a third region of the first surface, the third region is a region surrounded by the third edge and the plurality of fifth ground pads, and the first surface and the second side surface intersect at the third edge; and the eighth ground pads are located on a fourth region of the second surface, the fourth region is a region surrounded by the fourth edge and the plurality of sixth ground pads, and the second surface and the second side surface intersect at the fourth edge.

[0028] With reference to the first aspect, in some implementations of the first aspect, the first side surface is connected to the second side surface.

[0029] According to the technical scheme of the embodiment of the present application, for the sake of brevity of the discussion, the embodiment of the present application only takes the first side surface and the second side surface as an example for illustration, and in actual application, the first side surface and the second side surface can be two sides that are not connected, for example, the first side surface and the second side surface can also be oppositely arranged sides, and the embodiment of the present application does not limit this.

[0030] With reference to the first aspect, in some implementations of the first aspect, the first region and the third region are in communication, and / or the second region and the fourth region are in communication.

[0031] According to the technical solution of the embodiment of the present application, the communication can be understood as that a metal connecting member is arranged between the two regions, for example, the first metal connecting member and the second metal connecting member are not arranged between the two ends of the first radiator and the second radiator close to each other.

[0032] With reference to the first aspect, in some implementations of the first aspect, the connecting sub-board comprises a first dielectric plate, a second dielectric plate and a third dielectric plate which are sequentially stacked; the first dielectric plate is connected with the first sub-board, and the third dielectric plate is connected with the second sub-board; and the first radiator is located on the second dielectric plate.

[0033] With reference to the first aspect, in some implementations of the first aspect, the width of the first radiator is greater than or equal to 1 mm and less than or equal to 2 mm.

[0034] With reference to the first aspect, in some implementations of the first aspect, the length of the first radiator is greater than or equal to 8 mm and less than or equal to 16 mm.

[0035] With reference to the first aspect, in some implementations of the first aspect, the connecting sub-board is in a ring structure.

[0036] According to the technical solution of the embodiment of the present application, the connecting sub-board can surround a cavity together with the first sub-board and the second sub-board. The first chip can be arranged in the cavity, so that more electronic devices can be arranged in the same volume. The first chip can also be replaced by other electronic elements, and the embodiment of the present application is only used as an example and is not limited. BRIEF DESCRIPTION OF DRAWINGS

[0037] Figure 1 is a schematic diagram of an electronic device provided by an embodiment of the present application.

[0038] Figure 2 is a layout schematic diagram of a packaged antenna provided by an embodiment of the present application.

[0039] Figure 3 is a schematic diagram of an electronic device 10 provided by an embodiment of the present application.

[0040] Figure 4 is Figure 3 is a sectional view of the electronic device 10 along the sectional line A-A.

[0041] Figure 5 is a top view of a connecting sub-board provided by an embodiment of the present application.

[0042] Figure 6 is a bottom view of the connecting sub-board provided by an embodiment of the present application.

[0043] Figure 7 is a sectional view of the connecting sub-board shown in FIG. 8 along the section line B-B. Figure 3

[0044] Figure 8 is a partial sectional view of the connecting sub-board shown in FIG. 10. Figure 4

[0045] Figure 9 is a perspective view of the connecting sub-board provided by an embodiment of the present application.

[0046] Figure 10 is a perspective view of the electronic device provided by an embodiment of the present application.

[0047] Figure 11 is a structural schematic view of the electronic device provided by an embodiment of the present application.

[0048] Figure 12 is a perspective view of the electronic device provided by an embodiment of the present application.

[0049] Figure 13 is a preparation method of the connecting sub-board provided by an embodiment of the present application.

[0050] Figure 14 is a schematic view of another electronic device 10 provided by an embodiment of the present application.

[0051] Figure 15 is a top view of the connecting sub-board provided by an embodiment of the present application.

[0052] Figure 16 is a bottom view of the connecting sub-board provided by an embodiment of the present application.

[0053] Figure 17 is a sectional view of the connecting sub-board provided by an embodiment of the present application in the xoy plane.

[0054] Figure 18 is a top view of the connecting sub-board provided by an embodiment of the present application.

[0055] Figure 19 is a bottom view of the connecting sub-board provided by an embodiment of the present application.

[0056] Figure 20 is a sectional view of the connecting sub-board provided by an embodiment of the present application in the xoy plane.

[0057] Figure 21 is a schematic view of another electronic device 10 provided by an embodiment of the present application. DETAILED DESCRIPTION

[0058] ​​The following explains the terms that can appear in the embodiments of the present application.

[0059] It should be understood that the term "and / or" used herein is only to describe the same field of the associated objects, which means that there can be three relationships, for example, A and / or B can represent the following three cases: A exists alone, A and B exist together, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the front and rear associated objects.

[0060] "Within the scope of" used in the present application, by default, includes the two end values of the range, unless it is indicated separately that the end value is not included, for example, within the range of 1 to 5, including the two values of 1 and 5.

[0061] Coupling: can be understood as direct coupling and / or indirect coupling, "coupling connection" can be understood as direct coupling connection and / or indirect coupling connection. Direct coupling can also be referred to as "electrical connection", which means that the components are in physical contact and electrically conductive; it can also be understood as a form of connection between different components in the circuit structure through the entity circuit of the copper foil or wire of the printed circuit board (PCB) that can transmit electrical signals; "indirect coupling" can be understood as electrical conduction between two conductors through space / non-contact. In an embodiment, indirect coupling can also be referred to as capacitive coupling, for example, through the coupling between the gap between the two conductive parts to form an equivalent capacitor to achieve signal transmission.

[0062] Lumped element / device: refers to the collective name of all elements when the size of the element is much smaller than the relative wavelength of the circuit operating frequency. For signals, at any time, the characteristics of the element always remain fixed and are independent of the frequency.

[0063] Distributed element / device: unlike lumped elements, when the size of the element is similar to or larger than the relative wavelength of the circuit operating frequency, the characteristics of each point of the element itself will be different due to the changes in the signal when the signal passes through the element. At this time, the element as a whole cannot be regarded as a single body with fixed characteristics, and should be referred to as a distributed element.

[0064] Capacitance: can be understood as lumped capacitance and / or distributed capacitance. Lumped capacitance refers to a component that exhibits capacitance, such as a capacitor element; distributed capacitance (or distributed capacitance) refers to the equivalent capacitance formed by the gap between two conductive parts.

[0065] Inductance: can be understood as lumped inductance and / or distributed inductance. Lumped inductance refers to a component that exhibits inductance, such as an inductor element; distributed inductance (or distributed inductance) refers to the equivalent inductance formed by a certain length of conductive part.

[0066] Radiating element: is a device in an antenna for receiving / transmitting electromagnetic wave radiation. In some cases, "antenna" is understood in a narrow sense as a radiating element, which changes guided wave energy from a transmitter into radio waves, or converts radio waves into guided wave energy for radiating and receiving radio waves. The modulated high-frequency current energy (or guided wave energy) generated by the transmitter is transmitted to the transmitting radiating element via a feed line, which is converted into some polarized electromagnetic wave energy by the radiating element, and radiated in a desired direction. The receiving radiating element converts some polarized electromagnetic wave energy from a certain direction in space into modulated high-frequency current energy, which is delivered to the input of the receiver via a feed line.

[0067] The radiating element can include a conductor with a certain shape and size, such as a wire, or a patch, etc., which is not limited in the specific shape. In an embodiment, the wire-shaped radiating element can be referred to as a wire antenna. In an embodiment, the wire-shaped radiating element can be implemented by a conductive frame, which can also be referred to as a frame antenna. In an embodiment, the wire-shaped radiating element can be implemented by a bracket conductor, which can also be referred to as a bracket antenna. In an embodiment, the wire diameter (e.g., including thickness and width) of the wire-shaped radiating element, or the radiating element of the wire antenna, is much smaller (e.g., less than 1 / 16 of the wavelength) than the wavelength (e.g., the medium wavelength), and the length can be comparable to the wavelength (e.g., the length is around 1 / 8 of the wavelength, or 1 / 8 to 1 / 4, or 1 / 4 to 1 / 2, or longer). The main forms of wire antennas include dipole antennas, half-wave dipole antennas, monopole antennas, loop antennas, inverted F antennas (also referred to as IFA, Inverted F Antenna), and planar inverted F antennas (also referred to as PIFA, Planar Inverted F Antenna). For example, for a dipole antenna, each dipole antenna generally includes two radiating branches, and each branch is fed by a feed from the feed end of the radiating branch. For example, the inverted F antenna (Inverted-F Antenna, IFA) can be regarded as being obtained by adding a ground path to a monopole antenna. The IFA antenna has a feed point and a ground point, and is called an inverted F antenna because its side view is in the shape of an inverted F. In an embodiment, the patch-shaped radiating element can include a microstrip antenna, or a patch antenna. In an embodiment, the patch-shaped radiating element can be implemented by a planar conductor (e.g., a conductive patch or a conductive coating, etc.). In an embodiment, the patch-shaped radiating element can include a conductive patch, such as a copper patch, etc. In an embodiment, the patch-shaped radiating element can include a conductive coating, such as silver paste, etc. The shape of the patch-shaped radiating element includes a circle, a rectangle, a ring, etc., which is not limited in the specific shape. The structure of the microstrip antenna is generally composed of a dielectric substrate, a radiating element, and a ground plate, wherein the dielectric substrate is arranged between the radiating element and the ground plate.

[0068] The radiators can also include slots or gaps formed on the conductors, for example, closed or semi-closed slots or gaps formed on the ground conductor plane. In one embodiment, the radiators with slots or gaps can be referred to as slot antennas or gap antennas. In one embodiment, the radiators with closed slots or gaps can be referred to as closed slot antennas. In one embodiment, the radiators with semi-closed slots or gaps (for example, with openings added to the closed slots or gaps) can be referred to as open slot antennas. In some embodiments, the gap shape is long and strip-shaped. In some embodiments, the length of the gap is about half a wavelength (for example, a dielectric wavelength). In some embodiments, the length of the gap is about an integer multiple of a wavelength (for example, one dielectric wavelength). In some embodiments, the gap can be fed by a transmission line across one or both sides of the gap, whereby a radio frequency electromagnetic field is excited on the gap and electromagnetic waves are radiated into space. In one embodiment, the radiators of the slot antennas or gap antennas can be implemented by conductive frames grounded at both ends, which can also be referred to as frame antennas; in this embodiment, it can be considered that the slot antennas or gap antennas include linear radiators, which are arranged in space with the ground plane and grounded at both ends of the radiators, thereby forming closed or semi-closed slots or gaps. In one embodiment, the radiators of the slot antennas or gap antennas can be implemented by bracket conductors grounded at both ends, which can also be referred to as bracket antennas.

[0069] The feed unit / feed circuit / feed structure is a combination of all components of an antenna for the purpose of reception and transmission of radio waves. In the case of a receiving antenna, the feed unit can be considered as the antenna part from the first amplifier to the front-end transmitter. In a transmitting antenna, the feed unit can be considered as the part after the last power amplifier. In some cases, the "feed unit" is understood in a narrow sense as a radio frequency chip, or a transmission path including a radio frequency chip to a feed point on a radiator or a transmission line. The feed unit has the function of converting radio waves into electrical signals and sending them to the receiver components. In general, it is considered as part of the antenna for converting radio waves into electrical signals and vice versa. The antenna should be designed to consider the possibility of maximum power transmission and efficiency. For this purpose, the antenna feed impedance must be matched to the load resistance. The antenna feed impedance is a combination of resistance, capacitance and inductance. To ensure maximum power transmission conditions, the two impedances (load resistance and feed impedance) should be matched. The matching can be done by considering the frequency requirements and the design parameters of the antenna (such as gain, directivity and radiation efficiency).

[0070] End / point: the "end / point" in the first end / second end / feed end / ground end / feed point / ground point / connection point of the antenna radiator, which cannot be understood as a point or end physically disconnected from other radiators, but can also be considered as a point or section on a continuous radiator. In an embodiment, the "end / point" can include a connection / coupling area on the antenna radiator for coupling other conductive structures, for example, the feed end / feed point can be a coupling area (for example, an area facing a part of the feed circuit) on the antenna radiator for coupling a feed structure or a feed circuit, and for another example, the ground end / ground point can be a connection / coupling area on the antenna radiator for coupling a ground structure or a ground circuit.

[0071] Open end / closed end: in some embodiments, the open end / ground end is relative to whether it is grounded, and the closed end is grounded, and the open end is not grounded. In some embodiments, the open end / closed end is relative to other conductive bodies, and the closed end is electrically connected to other conductive bodies, and the open end is not electrically connected to other conductive bodies. In an embodiment, the open end can also be referred to as a free end, an open end, or an open circuit end. In an embodiment, the closed end can also be referred to as a ground end or a short circuit end. It should be understood that in some embodiments, other conductive bodies can be coupled through the open end to transfer coupled energy (which can be understood as transferring current).

[0072] Resonance / resonance frequency: resonance frequency is also called resonance frequency. The resonance frequency can refer to the frequency at which the imaginary part of the antenna input impedance is zero. The resonance frequency can have a frequency range, that is, a frequency range in which resonance occurs. The frequency corresponding to the strongest resonance point is the center frequency point frequency. The return loss characteristic of the center frequency can be less than -20 dB. It should be understood that, unless otherwise specified, the first resonance of the antenna / radiator mentioned in this application should be the fundamental mode resonance generated by the antenna / radiator, or the resonance with the lowest frequency generated by the antenna / radiator.

[0073] Resonance frequency band / communication frequency band / operating frequency band: no matter what type of antenna, it always works in a certain frequency range (bandwidth). For example, an antenna supporting B40 frequency band has a working frequency band including frequencies in the range of 2300MHz-2400MHz, or in other words, the working frequency band of the antenna includes the B40 frequency band. The frequency range that meets the index requirements can be regarded as the working frequency band of the antenna.

[0074] It should be understood that the wavelength of the radiation signal in the air can be calculated as follows: (air wavelength, or vacuum wavelength) = speed of light / frequency, where the frequency is the frequency of the radiation signal (MHz), and the speed of light can be taken as 3x108m / s. The wavelength of the radiation signal in the medium can be calculated as follows: wherein ε is the relative permittivity of the medium. The wavelength in the embodiments of the present application generally refers to a medium wavelength, which can be a medium wavelength corresponding to a center frequency of a resonance frequency, or a medium wavelength corresponding to a center frequency of an operating frequency band supported by the antenna. For example, assuming that the center frequency of the B1 uplink frequency band (resonance frequency of 1920-1980 MHz) is 1955 MHz, the wavelength can be a medium wavelength calculated using the frequency of 1955 MHz. Without being limited to the center frequency, the "medium wavelength" can also refer to a medium wavelength corresponding to a non-center frequency of the resonance frequency or the operating frequency band. For the convenience of understanding, the medium wavelength mentioned in the embodiments of the present application can be simply calculated by the relative permittivity of the medium filled on one side or multiple sides of the radiator.

[0075] Ground (GND): can refer to at least a part of any ground layer, or ground plate, or ground metal layer in an electronic device (such as a mobile phone), or at least a part of any combination of the above ground layer, or ground plate, or ground component, and the "ground" can be used for the grounding of components in the electronic device. In an embodiment, the "ground" can be a ground layer of a circuit board of the electronic device, or a ground plate formed by a middle frame of the electronic device, or a ground metal layer formed by a metal film under the screen. In an embodiment, the circuit board can be a printed circuit board (PCB), for example, an 8-layer, 10-layer, or 12-14 layer board with 8, 10, 12, 13, or 14 layers of conductive material, or elements separated and electrically insulated by a dielectric layer or an insulating layer such as glass fiber, polymer, etc. In an embodiment, the circuit board includes a medium substrate, a ground layer, and a wiring layer, and the wiring layer and the ground layer are electrically connected by a via. In an embodiment, components such as a display, a touch screen, an input button, a transmitter, a processor, a memory, a battery, a charging circuit, a system on chip (SoC) structure, etc. can be mounted on or connected to the circuit board; or electrically connected to the wiring layer and / or the ground layer in the circuit board. For example, the radio frequency source is arranged on the wiring layer.

[0076] Any ground layer, or ground plate, or ground metal layer described above is made of conductive material. In an embodiment, the conductive material can use any of the following materials: copper, aluminum, stainless steel, brass and their alloys, copper foil on an insulating substrate, aluminum foil on an insulating substrate, gold foil on an insulating substrate, silver-plated copper, silver-plated copper foil on an insulating substrate, silver foil on an insulating substrate, and tin-plated copper, graphite powder impregnated cloth, graphite coated substrate, copper plated substrate, brass plated substrate, and aluminum plated substrate. Those skilled in the art can understand that the ground layer / ground plate / ground metal layer can also be made of other conductive materials.

[0077] Ground: refers to coupling with the above-mentioned ground / floor by any means. In an embodiment, the ground can be through the physical ground, such as the physical ground of a specific position on the frame (or referred to as the physical ground) through the part of the structure of the middle frame. In an embodiment, the ground can be through the device ground, such as the device ground (or referred to as the device ground) through the capacitors / inductors / resistors and the like in series or parallel.

[0078] The technical solutions of the embodiments of the present application will be described below with reference to the drawings.

[0079] As shown in Figure 1 The electronic device 10 can include a cover 13, a display module 15, a printed circuit board (PCB) 17, a middle frame 19 and a rear cover 21. It should be understood that in some embodiments, the cover 13 can be a cover glass, and can also be replaced by a cover of other materials, such as a PET (Polyethylene terephthalate) material cover and the like.

[0080] Among them, the cover 13 can be arranged close to the display module 15, and can be mainly used for protecting and dustproofing the display module 15.

[0081] In an embodiment, the display module 15 can include a liquid crystal display (LCD), a light emitting diode (LED) display panel or an organic light-emitting diode (OLED) display panel, and the like, and the embodiments of the present application do not limit this.

[0082] The middle frame 19 mainly plays a supporting role for the whole machine. Figure 1PCB 17 can be disposed between the middle frame 19 and the back cover 21, and it can be understood that, in an embodiment, the PCB 17 can also be disposed between the middle frame 19 and the display module 15, and the embodiments of the present application do not limit this. The printed circuit board PCB 17 can be made of a flame-retardant material (FR-4) medium plate, a Rogers medium plate, a hybrid medium plate of Rogers and FR-4, and the like. Here, FR-4 is a code of a flame-retardant material grade, and the Rogers medium plate is a high-frequency plate. The PCB 17 carries electronic components such as radio frequency chips. In an embodiment, a metal layer can be provided on the printed circuit board PCB 17. The metal layer can be used for grounding of the electronic components carried on the printed circuit board PCB 17, and can also be used for grounding of other components such as support antennas, frame antennas, and the like. The metal layer can be referred to as a ground plate, or a grounding plate, or a grounding layer. In an embodiment, the metal layer can be formed by etching metal on the surface of any one layer of medium plate in the PCB 17. In an embodiment, the metal layer for grounding can be provided on one side of the printed circuit board PCB 17 close to the middle frame 19. In an embodiment, the edge of the printed circuit board PCB 17 can be regarded as the edge of its grounding layer. In an embodiment, the metal middle frame 19 can also be used for grounding of the above-mentioned components. The electronic device 10 can also have other ground plates / grounding plates / grounding layers, as described above, which will not be repeated here.

[0083] The electronic device 10 can also include a battery (not shown in the figure). The battery can be disposed between the middle frame 19 and the back cover 21, or can be disposed between the middle frame 19 and the display module 15, and the embodiments of the present application do not limit this. In some embodiments, the PCB 17 is divided into a main board and a sub-board, and the battery can be disposed between the main board and the sub-board, wherein the main board can be disposed between the middle frame 19 and the upper edge of the battery, and the sub-board can be disposed between the middle frame 19 and the lower edge of the battery.

[0084] The electronic device 10 can also include a frame 11, which can be formed of a conductive material such as metal. The frame 11 can be disposed between the display module 15 and the back cover 21 and extend circumferentially around the periphery of the electronic device 10. The frame 11 can have four side edges surrounding the display module 15, helping to fix the display module 15. In one implementation, the frame 11 made of metal material can be directly used as a metal frame of the electronic device 10, forming a metal frame appearance, suitable for metal industrial design (ID). In another implementation, the outer surface of the frame 11 can also be a non-metal material, such as a plastic frame, forming a non-metal frame appearance, suitable for non-metal ID.

[0085] The middle frame 19 can include the bezel 11, and the middle frame 19 including the bezel 11 can serve as a support for the electronic devices in the whole machine as a whole. The cover plate 13 and the back cover 21 are respectively attached along the upper and lower edges of the bezel to form a housing of the electronic device. In an embodiment, the cover plate 13, the back cover 21, the bezel 11 and / or the middle frame 19 can be collectively referred to as the housing of the electronic device 10. It should be understood that the "housing" can be used to refer to part or all of any one of the cover plate 13, the back cover 21, the bezel 11 or the middle frame 19, or part or all of any combination of the cover plate 13, the back cover 21, the bezel 11 or the middle frame 19.

[0086] The bezel 11 on the middle frame 19 can at least partially serve as an antenna radiator to receive / transmit radio frequency signals. The part of the bezel serving as the radiator can have a gap with other parts of the middle frame 19 to ensure that the antenna radiator has a good radiation environment. In an embodiment, the middle frame 19 can be provided with an aperture at the part of the bezel serving as the radiator to facilitate the radiation of the antenna.

[0087] Alternatively, the bezel 11 can not be considered as a part of the middle frame 19. In an embodiment, the bezel 11 can be connected to and integrally formed with the middle frame 19. In another embodiment, the bezel 11 can include a protruding member extending inwardly to be connected to the middle frame 19, for example, by a spring, a screw, welding or the like. The protruding member of the bezel 11 can also be used to receive a feed signal, so that at least part of the bezel 11 serves as an antenna radiator to receive / transmit radio frequency signals. The part of the bezel serving as the radiator can have a gap 42 with the middle frame 30 to ensure that the antenna radiator has a good radiation environment, so that the antenna has a good signal transmission function.

[0088] The back cover 21 can be made of a metal material, or can be made of a non-conductive material such as a glass back cover, a plastic back cover or the like non-metal back cover. The back cover 21 can also be made of a back cover including both conductive and non-conductive materials. In an embodiment, the back cover 21 including the conductive material can replace the middle frame 19 and serve as a whole with the bezel 11 to support the electronic devices in the whole machine.

[0089] In an embodiment, the conductive part of the middle frame 19 and / or the back cover 21 can serve as a reference ground of the electronic device 10, and the bezel 11, the PCB 17 and the like of the electronic device can be grounded through electrical connection with the middle frame.

[0090] The antenna of the electronic device 10 can also be disposed in the frame 11. When the frame 11 of the electronic device 10 is made of a non-conductive material, the antenna radiator can be disposed in the electronic device 10 and extend along the frame 11. For example, the antenna radiator is disposed against the frame 11 to minimize the volume occupied by the antenna radiator and to be closer to the outside of the electronic device 10 to achieve better signal transmission effects. It should be noted that the antenna radiator disposed against the frame 11 means that the antenna radiator can be disposed against the frame 11 or close to the frame 11, for example, a small gap can be formed between the antenna radiator and the frame 11.

[0091] The antenna of the electronic device 10 can also be disposed in the housing, such as a bracket antenna, a millimeter wave antenna, and the like (not shown in the figure). Figure 1 The clearance of the antenna disposed in the housing can be obtained by a slit or an aperture on any one of the middle frame, the frame, the back cover, and the display screen, or a non-conductive gap or aperture formed between any two of them, and the clearance of the antenna can ensure the radiation performance of the antenna. It should be understood that the clearance of the antenna can be a non-conductive area formed by any conductive component in the electronic device 10, and the antenna radiates signals to the external space through the non-conductive area. In an embodiment, the antenna 40 can be in the form of a flexible printed circuit (FPC) based antenna, a laser-direct-structuring (LDS) based antenna, or a microstrip disk antenna (MDA), etc. In an embodiment, the antenna can also be a transparent structure embedded in the screen of the electronic device 10, so that the antenna is a transparent antenna unit embedded in the screen of the electronic device 10.

[0092] Figure 1 Only some components included in the electronic device 10 are schematically shown, and the actual shape, actual size, and actual structure of these components are not limited. Figure 1

[0093] It should be understood that in the embodiments of the present application, the face where the display screen of the electronic device is located is considered as the front face, the face where the back cover is located is considered as the back face, and the face where the frame is located is considered as the side face.

[0094] It should be understood that in the embodiments of the present application, when the user holds (usually vertically and faces the screen) the electronic device, the orientation of the electronic device has a top, a bottom, a left side, and a right side. It should be understood that in the embodiments of the present application, when the user holds (usually vertically and faces the screen) the electronic device, the orientation of the electronic device has a top, a bottom, a left side, and a right side.

[0095] ​With the development of mobile communication systems, the low frequency of the radio spectrum has tended to be saturated. The millimeter wave frequency band has abundant spectrum resources, and therefore, the millimeter wave can provide a solution for high-speed wireless communication with low latency and high reliability.

[0096] In Figure 1 The electronic device shown in the figure usually adopts an antenna in package (AIP) as a millimeter wave antenna unit. The AIP is to integrate the radiator of the millimeter wave antenna and the radio frequency chip (RFIC) that supplies power to the radiator in the same package, as shown in Figure 2 .

[0097] In the electronic device, in order to ensure that the electronic device has good communication performance in the millimeter wave frequency band in all directions, multiple AIPs are usually required to be arranged, as shown in Figure 2 At least one of the multiple AIPs generates a radiation beam perpendicular to the plane (for example, the z direction) in which the display screen of the electronic device is located, and at least one of the multiple AIPs generates a radiation beam parallel to the plane (for example, the y direction) in which the display screen of the electronic device is located, so that the electronic device can realize the coverage of the radiation beam in the millimeter wave frequency band in all directions and achieve good communication performance.

[0098] As shown in Figure 2 , the AIP 101 can be located on the upper surface of the PCB 17, for example, between the PCB 17 and the back cover, for generating a radiation beam in the first direction. The AIP 102 can be located between the PCB 17 and the frame 11 and electrically connected to the PCB 17 through the FPC, and can be used to generate a radiation beam in the second direction.

[0099] Since the AIP is a packaged module, when the AIP 102 is arranged on the side surface of the PCB 17, the width L1 of the AIP 102 needs to be less than the thickness of the electronic device. However, the AIP 102 integrates elements such as RFIC, and therefore, the width L1 of the AIP 102 is large, which will cause the thickness of the electronic device to be thick, which conflicts with the appearance design of the increasingly thin electronic device.

[0100] The electronic device provided by the embodiments of the present application can include a first sub-board, a second sub-board, and a connecting sub-board connecting the first sub-board and the second sub-board, and a radiator is arranged on the side surface of the connecting sub-board, and an antenna is formed by the radiator. The structure of the antenna uses the side surface of the connecting sub-board to arrange the radiator, so that a radiation beam perpendicular to the side surface can be generated, and the coverage of the radiation beam in the direction of the electronic device is realized. At the same time, since the radiator is arranged on the side surface, the size of the antenna in the thickness direction of the electronic device is reduced, and the thickness of the electronic device will not be increased due to the layout of the antenna.

[0101] Figure 3Fig. 1 is a schematic diagram of an electronic device 10 provided by an embodiment of the present application.

[0102] As shown in Fig. 1, the electronic device 10 includes a first sub-board 201, a second sub-board 202, and a connecting sub-board 203 between the first sub-board 201 and the second sub-board 202. The electronic device 10 further includes a radio frequency chip 210 on the first sub-board 201, and a radiator 220 on the connecting sub-board 203. Figure 3

[0103] It should be understood that the PCB 17 in the electronic device 10 shown in Fig. 1 can include the first sub-board 201, the second sub-board 202, and the connecting sub-board 203. Figure 1

[0104] As shown in Fig. 1, the connecting sub-board 203 includes oppositely arranged first and second surfaces 231 and 232, and a first side surface 233 connected between the first and second surfaces 231 and 232, the first surface 231 being connected with the first sub-board 201, and the second surface 232 being connected with the second sub-board 202. Figure 4

[0105] The radiator 220 is located at the first side surface, and includes a feeding point, and the radiator 220 is coupled with the radio frequency chip 210 at the feeding point 221.

[0106] It should be understood that the technical solution provided by the embodiment of the present application sets the radiator 220 on the first side surface 233 of the connecting sub-board 203, which can utilize the original structure in the electronic device to realize the layout of the antenna. Meanwhile, since the radiator 220 is set on the side surface of the connecting sub-board 203, it can generate a radiation beam in a first direction (a direction perpendicular to the first side surface 231, for example, the y direction), so that the electronic device can realize the coverage of the frequency band radiation beam in the first direction. Moreover, since the radiator 220 is not integrated with the radio frequency chip 210 in the same package, the size in the thickness direction (for example, the z direction) of the electronic device is relatively small.

[0107] It should be understood that, for the sake of simplicity of discussion, the embodiment of the present application only takes the example that the radio frequency chip 210 is directly electrically connected with the radiator 220 at the feeding point 221, and in actual application, the radio frequency chip 210 can be coupled with the radiator 220 through a metal piece at the feeding point 221, which is not limited by the embodiment of the present application.

[0108] The coupling of the radiator 220 with the radio frequency chip 210 at the feeding point 221 can be understood as the coupling of the radiator 220 with at least one radio frequency channel (for example, at least one pin) in the radio frequency chip 210 at the feeding point 221.

[0109] ​​​In an embodiment, the antenna formed by the radiator 220 can be a millimeter wave antenna. The operating frequency band of the antenna can include at least part of the frequency band of 24.25-29.5 GHz (for example, covering the frequency bands of n257, n258, and / or n261), or 37-43.5 GHz (for example, covering the frequency bands of n259, and / or n260).

[0110] In an embodiment, the connection sub-board 203 can be a ring-shaped structure. The connection sub-board 203 can form a cavity together with the first sub-board 201 and the second sub-board 202, as shown in FIG. 2B. The first chip 211 can be disposed in the cavity, so that more electronic devices can be disposed in the same volume. The first chip 211 can also be replaced by other electronic components, and the embodiments of the present application are only used as examples and are not limited. In an embodiment, the first chip 211 can be located on the surface of the second sub-board 202 close to the connection sub-board 203, or can also be located on the surface of the first sub-board 201 close to the connection sub-board 203. Figure 4

[0111] It should be understood that the connection sub-board 203 can be a ring-shaped structure of any shape, and the embodiments of the present application only take a rectangular ring-shaped structure as an example. In actual application, it can also be other ring-shaped structures, and the embodiments of the present application do not limit this.

[0112] In an embodiment, the electronic device 10 can further include a second chip 212, which can be located on the surface of the first sub-board 201 or the second sub-board 202.

[0113] In an embodiment, when the connection sub-board 203 is a ring-shaped structure, the width D1 of each side of the connection sub-board 203 can be greater than or equal to 5 mm and less than or equal to 15 mm.

[0114] In an embodiment, the height H1 of the connection sub-board 203 can be greater than or equal to 1 mm and less than or equal to 2 mm.

[0115] In an embodiment, the width D2 of the radiator 220 can be greater than or equal to 1 mm and less than or equal to 2 mm. The width D2 of the radiator 220 is less than the height H1 of the connection sub-board 203.

[0116] In an embodiment, the length of the radiator 220 can be greater than or equal to 8 mm and less than or equal to 16 mm.

[0117] ​In an embodiment, the radiator 220 includes a first metal piece 222 and a second metal piece 223. The first end of the first metal piece 222 and the first end of the second metal piece 223 are opposite and do not contact each other. The second end of the first metal piece 222 and the second end of the second metal piece 223 are open ends. In an embodiment, the feeding point 221 includes a first feeding point 2211 and a second feeding point 2212. The first feeding point 2211 is located at the first end of the first metal piece 222, and the second feeding point 2212 is located at the first end of the second metal piece 223.

[0118] It should be understood that, for the sake of brevity of the discussion, the embodiments of the present application are only exemplified by taking the radiator 220 forming a dipole antenna as an example. In actual applications, the radiator 220 can also form other antenna structures, such as a patch antenna, an inverted F antenna (IFA), a planar inverted F antenna (PIFA), etc., and the embodiments of the present application do not limit this.

[0119] It should be understood that, when the radiator 220 includes the first metal piece 222 and the second metal piece 223, the length of the radiator 220 can be understood as the sum of the length L1 of the first metal piece 222 and the length L2 of the second metal piece 223.

[0120] In an embodiment, the length L1 of the first metal piece 222 and the length L2 of the second metal piece 223 satisfy: L2x90%≤L1≤L2x110%.

[0121] It should be understood that the first metal piece 222 and the second metal piece 223 can form a symmetrical dipole antenna.

[0122] In an embodiment, the connecting sub-board 203 can include a first dielectric board 2031, a second dielectric board 2032, and a third dielectric board 2033 which are sequentially stacked. Among them, the first dielectric board 2031 is connected with the first sub-board 201, and the third dielectric board 2033 is connected with the second sub-board 202. The radiator 220 can be located on the second dielectric board 2032.

[0123] It should be understood that the connecting sub-board 203 can include multiple layers of dielectric boards, for example, greater than or equal to 3 layers, and the embodiments of the present application do not limit this. For the sake of brevity of the discussion, only 3 layers are exemplified. Similarly, the first sub-board 201 and the second sub-board 202 can also include multiple layers of dielectric boards, for example, greater than or equal to 2 layers, and here will not be repeated.

[0124] In an embodiment, the connecting sub-board 203 includes a first ground pad 241, a second ground pad 242, and a metal connecting piece 243, as shown in FIG. 2B.Figure 4 As shown.

[0125] The first ground pads 241 are arranged on the first surface 231, as shown. Figure 5 The second ground pads 242 are arranged on the second surface 232, as shown. Figure 6 The metal connectors 243 are arranged in the connecting sub-board 203, as shown. Figure 7 The first ends of the metal connectors 243 are connected with the first ground pads 241, and the second ends of the metal connectors 243 are connected with the second ground pads 242.

[0126] At least some of the first ground pads 241 are arranged along a second direction, which is a length extension direction (e.g., the x direction) of the radiator 220. Correspondingly, at least some of the second ground pads 242 are arranged along the second direction, and at least some of the metal connectors 243 are arranged along the second direction.

[0127] In an embodiment, the first surface 231 can further be provided with first function pads 251, and the second surface 232 can be provided with second function pads 252, and function connectors 253 arranged in the connecting sub-board 203. The first ends of the function connectors 253 are connected with the first function pads 251, and the second ends of the function connectors 253 are connected with the second function pads 252. The first function pads 251, the second function pads 252 and the function connectors 253 can be used to transmit electrical signals, for example, can be electrically connected with the first chip to transmit electrical signals emitted by the first chip.

[0128] It should be understood that the first ground pads 241, the second ground pads 242 and the metal connectors 243 can be equivalent to the ground plate of the radiator, which can improve the radiation performance of the antenna. At the same time, it can also reduce the interference of other electrical signal transmission structures (e.g., the first function pads 251, the second function pads 252 and the function connectors 253) in the connecting sub-board 203 to the antenna when transmitting electrical signals, and further improve the radiation performance of the antenna.

[0129] In an embodiment, the first ground pads 241 or the second ground pads 242 can be electrically connected with the ground plate in the electronic device.

[0130] In an embodiment, the first ground pads 241 can be connected with the first sub-board 201 by soldering, and the second ground pads 242 can be connected with the second sub-board 202 by soldering, as shown. Figure 4

[0131] ​In an embodiment, the metal connectors 243 can be metal plating in the through holes from the first surface 231 to the second surface 232 of the connection sub-board 203, or can also be metal columns formed by filling metal in the through holes.

[0132] In an embodiment, the distance between two adjacent metal connectors 243 in the plurality of metal connectors 243 is less than or equal to 0.5 mm. In an embodiment, the distance between two adjacent metal connectors 243 can be equal to 0, and the two adjacent metal connectors 243 can partially overlap.

[0133] It should be understood that the distance between two adjacent metal connectors 243 being less than or equal to 0.5 mm can be understood as the shortest distance between any two points on the two adjacent metal connectors being less than or equal to 0.5 mm.

[0134] When the distance between two adjacent metal connectors 243 is less than or equal to 0.5 mm, the plurality of metal connectors 243 can be equivalent to a metal surface, which can better reduce the mutual interference between the transmission of other electrical signals in the connection sub-board 203 and the antenna, and further improve the radiation performance of the antenna.

[0135] In an embodiment, the connection sub-board 203 includes third ground pads 244 and fourth ground pads 245. The plurality of third ground pads 244 are located on a first region 261 of the first surface 231, as shown in FIG. 2B. The first region 261 is a region surrounded by the first edge 2311 and the plurality of first ground pads 241, and the first surface 231 intersects the first side surface 233 at the first edge 2311. Figure 5 The plurality of fourth ground pads 245 are disposed on a second region 262 of the second surface 232, as shown in FIG. 2C. The second region 262 is a region surrounded by the second edge 2321 and the plurality of second ground pads 242, and the second surface 232 intersects the first side surface 233 at the second edge 2321. Figure 6

[0136] It should be understood that the plurality of third ground pads 244 on the first surface 231 and the plurality of fourth ground pads 245 on the second surface 232 can reduce the mutual interference between the radiation beams (e.g., side lobe beams) generated by the antenna and other electrical signal transmission structures in the connection sub-board 203.

[0137] In an embodiment, the third ground pads 244 or the fourth ground pads 245 can be electrically connected to a ground plane in the electronic device.

[0138] In an embodiment, the third ground pads 244 can be connected to the first sub-board 201 by soldering, and the fourth ground pads 245 can be connected to the second sub-board 202 by soldering. ​

[0139] In one embodiment, the distance between two adjacent third ground pads 244 among a plurality of third ground pads 244 is less than or equal to 0.5 mm, and / or the distance between two adjacent fourth ground pads 245 among a plurality of fourth ground pads 245 is less than or equal to 0.5 mm.

[0140] It should be understood that the distance between two adjacent pads being less than or equal to 0.5mm can be interpreted as the shortest distance between any two points on two adjacent pads being less than or equal to 0.5mm.

[0141] When the distance between two adjacent pads is less than or equal to 0.5 mm, the multiple third ground pads 244 located on the first surface 231 can be equivalent to metal surfaces, and the multiple fourth ground pads 245 located on the second surface 232 can also be equivalent to metal surfaces. Therefore, the first ground pad 241, the second ground pad 242, the third ground pad 244, the fourth ground pad 245, and the metal connector 243 can form a semi-open metal cavity, with an opening only in the first direction (e.g., the y-direction) in which the antenna generates radiation. This metal cavity can isolate the antenna from other electrical signal transmission structures within the connecting sub-board 203, avoiding mutual interference between the radiated beam (e.g., sidelobe beam) generated by the antenna and other electrical signal transmission structures within the connecting sub-board 203. Furthermore, since only the feed connector for transmitting the antenna's radio frequency signal is provided within this metal cavity, interference from other electrical signal transmission structures within the connecting sub-board 203 on the electrical signal fed into the antenna can be reduced, improving the antenna's radiation performance.

[0142] In one embodiment, the connection sub-board 203 further includes a power supply pad 246 and a power supply connector 247, such as Figure 8 As shown. The power supply pad 246 is located in the first region 261, as... Figure 5 As shown. The power feed pad 246 is electrically connected to the RF chip 210. The first end of the power feed connector 247 is electrically connected to the radiator 220 at the power feed point 221, and the second end of the power feed connector is electrically connected to the power feed pad.

[0143] In one embodiment, the power supply connector 247 may be a first portion 2471 and a second portion 2472, such as Figure 8 As shown. A first portion 2471 and a second portion 2472 are disposed within the connecting sub-board 203. The first portion 2471 extends along a first direction, and the second portion 2472 extends along a third direction, which are different from the first direction and the second direction. A first end of the first portion 2471 is electrically connected to the radiator 220 at a feed point 221, a second end of the first portion is connected to the first end of the second portion 2472, and a second end of the second portion 2472 is electrically connected to the feed pad 246.

[0144] In an embodiment, the first direction can be the y direction, and the third direction can be a direction perpendicular to the first surface 231, for example, the z direction. In an embodiment, the first direction can be perpendicular to the third direction, or the first direction can also be at an angle with the third direction, which is not limited in the embodiments of the present application.

[0145] It should be understood that when the radiator 220 includes the first metal piece 222 and the second metal piece 223, the first feeding point 2211 is located at the first end of the first metal piece 222, and the second feeding point 2212 is located at the first end of the second metal piece 223. The connecting sub-board can include two feeding pads 246 and two feeding connectors 247, which are electrically connected to the first feeding point 2211 and the second feeding point 2212, respectively, as shown in Figure 9 .

[0146] In the schematic view of the connecting sub-board 203 shown in Figure 9 , the first ground pad 241 and the second ground pad 242 are connected to both ends of the metal connector 243. The third ground pad 244 is located in the same plane (the first surface) as the first ground pad 241, and the fourth ground pad 245 is located in the same plane (the second surface) as the second ground pad 242.

[0147] In an embodiment, the first sub-board 201 can also include a feeding line 248, as shown in Figure 10 . The first end of the feeding line 248 is electrically connected to the feeding pad 246, and the second end of the feeding line 248 is electrically connected to the radio frequency chip 210.

[0148] In an embodiment, the feeding line 248 can be arranged on the surface of the first sub-board 201 away from the connecting sub-board, and the first end of the feeding line 248 can be electrically connected to the feeding pad 246 through the connector 249. Alternatively, when the first sub-board 201 includes a multi-layer dielectric board, the feeding line 248 can be arranged between two layers of dielectric boards, and the first end of the feeding line 248 can be electrically connected to the feeding pad 246 through the connector 249, and the second end of the feeding line 248 can also be electrically connected to the radio frequency chip 210 through another connector 249.

[0149] In an embodiment, the distance between the radio frequency chip 210 and the feeding point 221 of the radiator 220 is less than or equal to 15 mm.

[0150] It should be understood that the distance between the radio frequency chip 210 and the feeding point 221 of the radiator 220 can be understood as the total length of the feeding path electrically connected between the radio frequency chip 210 and the feeding point 221 of the radiator 220. The total length of the feeding path can be understood as the sum of the length of the feeding line 248 and the length of the feeding connector 247. In Figure 10In the schematic diagram of the electronic device 10 shown, the total length of the feeding path can be understood as the sum of the length of the feeding line 248 and the length of one feeding connector 247.

[0151] In the technical scheme provided in the embodiments of the present application, the radiator 220 is arranged on the first side surface 233 of the connecting sub-board 203, the radio frequency chip 210 is located on the first sub-board 201, the distance between the radio frequency chip 210 and the radiator 220 is relatively short, and the feeding path between the radio frequency chip 210 and the feeding point 221 is relatively short. It should be understood that, as the frequency of the electrical signal increases, the transmission loss per unit path increases, and therefore, a shorter feeding path can effectively reduce the loss of the radio frequency signal in the transmission process and improve the radiation performance of the antenna.

[0152] In one embodiment, the first part 2471 of the feeding connector 247 can be located on the first side surface 233, as shown in (a) of FIG. 13, and the second part 2472 can be located on the first surface, as shown in (b) of FIG. 13. The first end of the first part 2471 is electrically connected to the radiator 220 at the feeding point 221, the second end of the first part is connected to the first end of the second part 2472, and the second end of the second part 2472 is electrically connected to the feeding pad 246. Figure 11 Figure 11 It should be understood that, when the feeding connector 247 adopts the structure shown in (a) of FIG. 13, the radio frequency chip 210 can also be electrically connected through the feeding line 248 on the first sub-board 201, as shown in (b) of FIG. 13.

[0153] It should be understood that, when the feeding connector 247 adopts the structure shown in (a) of FIG. 13, the radio frequency chip 210 can also be electrically connected through the feeding line 248 on the first sub-board 201, as shown in (b) of FIG. 13. Figure 11 Figure 12 It should be understood that, when the feeding connector 247 adopts the structure shown in (a) of FIG. 13, the radio frequency chip 210 can also be electrically connected through the feeding line 248 on the first sub-board 201, as shown in (b) of FIG. 13.

[0154] Figure 13 is a preparation method of a connecting sub-board provided in the embodiments of the present application.

[0155] S301, a rectangular slot hole is processed on the second medium plate by a mechanical or laser method, and metal filling in the slot hole is realized by electroplating or the like.

[0156] S302, a metal wire layer is made on the first medium plate, the second medium plate or the third medium plate by a subtractive or semi-additive method to realize transmission of an electrical signal.

[0157] S303, the first medium plate, the second medium plate and the third medium plate are stacked and arranged, laser blind holes and through holes are processed at corresponding positions by a laser method, and metal wire layers are electrically connected in each plane by a chemical plating or electroplating process. Through this step, the feeding connector and the metal connector in the above-mentioned embodiments can be made, thereby forming the structure shown in (a) and (b) on the left side of FIG. 13, which are three-dimensional structure diagrams and top views, respectively. Figure 13

[0158] ​​​S304, cutting is realized by mechanical cutting or laser cutting in the region of the inner layer metal structure, thereby forming the required radiator structure on the side of the connecting sub-board, such as Figure 13 the structure shown on the right side of (a) and (b) in FIG. 10, respectively a three-dimensional structure diagram and a top view.

[0159] It should be understood that the embodiments of the present application are only used as an example that the connecting sub-board includes three layers of medium plates, and in actual production or design, more layers of medium plates can also be used, and the embodiments of the present application do not limit this. At the same time, the preparation method described in the above embodiments is only used as an example, and the same structure can also be achieved by other technical means, for example, a metal layer can also be made on the side of the connecting sub-board by coating or sputtering or evaporation or chemical / electroplating process, and then the corresponding radiator can be formed by laser processing on the side, and the embodiments of the present application do not limit this.

[0160] Figure 14 is another schematic diagram of an electronic device 10 provided by an embodiment of the present application.

[0161] As shown in Figure 14 , the electronic device 10 can also include a radiator 310.

[0162] The connecting sub-board 203 includes a second side 234 connected between the first surface and the second surface, and the radiator 310 is located on the second side 234. The radiator 310 includes a feed point 311, and the radiator 310 is coupled to the radio frequency chip 210 at the feed point 311.

[0163] It should be understood that Figure 14 the electronic device 10 shown in Figure 10 is only different from the electronic device 10 shown in Figure 10 , the electronic device 10 shown in Figure 14 only includes an antenna 1 formed by the radiator 220, the electronic device 10 shown in

[0164] also includes an antenna 2 formed by the radiator 310, and the antenna 1 and the antenna 2 can be used to generate radiation beams in different directions to improve the beam coverage of the electronic device.

[0165] It should be understood that the antenna 1 formed by the radiator 220 and the antenna 2 formed by the radiator 310 can be the same or different, and embodiments of the present application do not make any limitation thereon, and can be adjusted according to actual production or design. Meanwhile, the connecting sub-board 203 can be provided with multiple radiators to form multiple antennas, and embodiments of the present application do not make any limitation thereon, and for the sake of simplicity of discussion, only two antennas are taken as examples for description.

[0166] Moreover, the antenna 1 formed by the radiator 220 and the antenna 2 formed by the radiator 310 can adopt the same or different feeding modes. For example, in the structure shown in Figure 14 , the antenna 1 and the antenna 2 can be electrically connected with the feeding line of the first sub-board 201 through the feeding connectors arranged in the connecting sub-board, so as to realize electrical connection with the radio frequency chip. In actual production or design, the feeding connectors arranged on the first surface and the side surface (the first side surface or the second side surface) shown in Figure 11 may also be electrically connected with the feeding line of the first sub-board 201, so as to realize electrical connection with the radio frequency chip. Embodiments of the present application do not make any limitation on the feeding forms of the antenna 1 and the antenna 2.

[0167] In one embodiment, the connecting sub-board 203 further comprises a fifth ground pad 321, a sixth ground pad 322 and a metal connector 323.

[0168] The multiple fifth ground pads 321 are located on the first surface 321, as shown in Figure 15 . The multiple sixth ground pads 322 are located on the second surface 322, as shown in Figure 16 . The metal connector 323 is located in the connecting sub-board 203, as shown in Figure 17 .

[0169] The first end of the metal connector 323 is connected with the fifth ground pad 321, and the second end of the second metal connector 323 is connected with the sixth ground pad 322. At least part of the multiple fifth ground pads 321, the multiple sixth ground pads 322 and the multiple metal connectors 323 are arranged along the fourth direction (the length extension direction of the radiator 310, for example, the y direction).

[0170] In one embodiment, the connecting sub-board 203 further comprises a seventh ground pad 324 and an eighth ground pad 325.

[0171] The multiple seventh ground pads 324 are located on the third region 331 of the first surface 231, and the third region 331 is a region surrounded by the third edge 2312 and the multiple fifth ground pads 321, and the first surface 231 intersects with the second side surface 234 at the third edge 2312.

[0172] The plurality of eighth ground pads 325 are located in a fourth region 332 of the second surface 232, the fourth region 332 being a region surrounded by the fourth edge 2322 and the plurality of sixth ground pads 322, the second surface 232 and the second side surface 234 intersecting at the fourth edge 2322.

[0173] It should be understood that the first ground pad 241, the second ground pad 242, the third ground pad 244, the fourth ground pad 245 and the metal connecting piece 243 can form a semi-open metal cavity 1, which can be used to isolate the antenna 1 from other electrical signal transmission structures in the connecting sub-board 203. The fifth ground pad 321, the sixth ground pad 322, the seventh ground pad 324, the eighth ground pad 325 and the metal connecting piece 323 can form a semi-open metal cavity 2, which can be used to isolate the antenna 2 from other electrical signal transmission structures in the connecting sub-board 203.

[0174] In an embodiment, the first side surface 233 and the second side surface 234 can be adjacent side surfaces of the connecting sub-board 203, the first side surface 233 and the second side surface 234 being connected.

[0175] It should be understood that, for the sake of brevity of the discussion, the embodiments of the present application are only exemplified by taking the first side surface 233 and the second side surface 234 as connected side surfaces, in actual applications, the first side surface 233 and the second side surface 234 can be two side surfaces not connected, for example, the first side surface 233 and the second side surface 234 can also be oppositely arranged side surfaces, and the embodiments of the present application do not limit this.

[0176] In an embodiment, the first region 261 and the third region 331 are not connected. The second region 262 and the fourth region 332 are not connected.

[0177] It should be understood that not connected can be understood as that a metal connecting piece is arranged between two regions, so that the metal cavity 1 and the metal cavity 2 in the above-mentioned embodiments are not connected. For example, a metal connecting piece 243 and a metal connecting piece 323 are arranged between the two ends (the second end of the first metal piece 222 and the second end of the fourth metal piece 313) of the radiators 220 and 310 close to each other (taking the line between the end of the second end of the first metal piece 222 and the end of the second end of the fourth metal piece 313 as the diameter to form a virtual circular region, and the metal connecting piece 243 and the metal connecting piece 323 are included in the region, as shown in Figure 14 ).

[0178] Since the first region 261 and the third region 331 are not connected, and the second region 262 and the fourth region 332 are not connected, antenna 1 and antenna 2 can have good isolation. At the same time, antenna 1 and antenna 2 can generate radiation in different directions. The operating frequency bands of antenna 1 and antenna 2 can both include the first frequency band, making them suitable as co-frequency antenna units for use in multi-input multi-output (MIMO) systems.

[0179] In one embodiment, the first region 261 and the third region 331 are connected, such as... Figure 18 As shown, and / or, the second region 262 and the fourth region 332 are connected, as... Figure 19 As shown.

[0180] It should be understood that connectivity can be interpreted as the presence of a metal connector between two regions to connect the metal cavities 1 and 2 in the above embodiments. For example, no metal connectors 243 and 323 are provided between the two adjacent ends (the second end of the first metal member 222 and the second end of the fourth metal member 313) of the radiator 220 and radiator 310 (a virtual circular region is formed with the line connecting the ends of the first metal member 222 and the fourth metal member 313 as its diameter, and the metal connectors 243 and 323 are included within this region, such as...). Figure 20 As shown), Figure 21 As shown. Since no metal connectors 243 and 323 are provided between the two close ends of radiators 220 and 310 (the second end of the first metal piece 222 and the second end of the fourth metal piece 313), costs can be saved. Meanwhile, antenna 1 and antenna 2 can generate radiation in different directions.

[0181] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are illustrative; for instance, the division of units is merely a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical or other forms.

[0182] The above merely provides the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of the changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electronic device, comprising: The electronic device comprises: a radio frequency chip; a first sub-board and a second sub-board, the radio frequency chip being located on the first sub-board; a connecting sub-board, the connecting sub-board comprising a first surface and a second surface arranged oppositely, and a first side surface connected between the first surface and the second surface, the first surface being connected with the first sub-board, and the second surface being connected with the second sub-board; a first radiator, the first radiator being located on the first side surface, the first radiator comprising a first feeding point, and the first radiator being coupled with the radio frequency chip at the first feeding point.

2. The electronic device according to claim 1, wherein: the connecting sub-board further comprises a plurality of first ground pads, a plurality of second ground pads and a plurality of first metal connectors; wherein the first ground pads are located on the first surface, the second ground pads are located on the second surface, and the first metal connectors are located in the connecting sub-board; a first end of the first metal connector is connected with the first ground pad, and a second end of the first metal connector is connected with the second ground pad; at least part of the plurality of first ground pads, the plurality of second ground pads and the plurality of first metal connectors are arranged along a first direction, the first direction being a length extension direction of the first radiator.

3. The electronic device according to claim 2, wherein: the connecting sub-board further comprises a plurality of third ground pads and a plurality of fourth ground pads; wherein the third ground pads are located on a first region of the first surface, the first region being a region surrounded by a first edge and the plurality of first ground pads, the first surface and the first side surface intersecting at the first edge; the fourth ground pads are located on a second region of the second surface, the second region being a region surrounded by a second edge and the plurality of second ground pads, the second surface and the first side surface intersecting at the second edge.

4. The electronic device according to claim 3, wherein: a distance between two adjacent third ground pads in the plurality of third ground pads is less than or equal to 0.5 mm, and / or a distance between two adjacent fourth ground pads in the plurality of fourth ground pads is less than or equal to 0.5 mm.

5. The electronic device according to claim 3, wherein: the connecting sub-board further comprises a feeding pad and a feeding connector; wherein the feeding pad is located on the first region, and the feeding pad is electrically connected with the radio frequency chip; a first end of the feeding connector is electrically connected with the first radiator at the first feeding point, and a second end of the feeding connector is electrically connected with the feeding pad.

6. The electronic device according to claim 5, wherein: the feeding connector comprises a first part and a second part, the first part being located on the first side surface, and the second part being located on the first surface. A first end of the first portion is electrically connected to the first radiator at the first feeding point, a second end of the first portion is connected to a first end of the second portion, and a second end of the second portion is electrically connected to the feeding pad. 7.The electronic device of claim 5, wherein, The feeding connector includes a first portion and a second portion, the first portion and the second portion are arranged in the connection sub-board, the first portion extends along a second direction, the second portion extends along a third direction, and the second direction and the third direction are different; A first end of the first portion is electrically connected to the first radiator at the first feeding point, a second end of the first portion is connected to a first end of the second portion, and a second end of the second portion is electrically connected to the feeding pad. 8.The electronic device of any one of claims 5 to 7, wherein, The first sub-board further includes a feeding line; A first end of the feeding line is electrically connected to the feeding pad, and a second end of the feeding line is electrically connected to the radio frequency chip. 9.The electronic device of claim 8, wherein, The sum of the length of the feeding line and the length of the feeding connector is less than or equal to 15 mm. 10.The electronic device of any one of claims 2 to 9, wherein, The distance between two adjacent first metal connectors of the plurality of first metal connectors is less than or equal to 0.5 mm. 11.The electronic device of any one of claims 1 to 10, wherein, The first radiator includes a first metal piece and a second metal piece; The first end of the first metal piece and the first end of the second metal piece are opposite and do not contact each other. 12.The electronic device of claim 3, wherein, The electronic device further includes a second radiator; The connection sub-board includes a second side surface connected between the first surface and the second surface, and the second radiator is located on the second side surface; The second radiator includes a second feeding point, and the second radiator is coupled to the radio frequency chip at the second feeding point. 13.The electronic device of claim 12, wherein, The connection sub-board further includes a plurality of fifth ground pads, a plurality of sixth ground pads, and a plurality of second metal connectors; The fifth ground pads are located on the first surface, the sixth ground pads are located on the second surface, and the second metal connectors are arranged in the connection sub-board; A first end of the second metal connector is connected to the fifth ground pad, and a second end of the second metal connector is connected to the sixth ground pad; At least part of the plurality of fifth ground pads, the plurality of sixth ground pads, and the plurality of second metal connectors are arranged along a fourth direction, and the fourth direction is the length extension direction of the second radiator. 14.The electronic device of claim 13, wherein, The connection sub-board further includes a plurality of seventh ground pads and a plurality of eighth ground pads; The seventh ground pad is located at a third region of the first surface, the third region being a region surrounded by a third edge and a plurality of the fifth ground pads, the first surface intersecting the second side at the third edge. The eighth ground pad is located at a fourth region of the second surface, the fourth region being a region surrounded by a fourth edge and a plurality of the sixth ground pads, the second surface intersecting the second side at the fourth edge.

15. The electronic device of claim 14, wherein, The first side is connected to the second side.

16. The electronic device of claim 15, wherein, The first region and the third region are in communication, and the second region and the fourth region are in communication.

17. The electronic device according to any one of claims 1 to 16, wherein The connection sub-board comprises a first dielectric plate, a second dielectric plate and a third dielectric plate which are sequentially stacked; The first dielectric plate is connected to the first sub-board, and the third dielectric plate is connected to the second sub-board; The first radiator is located on the second dielectric plate.

18. The electronic device of any of claims 1-17, wherein, The width of the first radiator is greater than or equal to 1 mm and less than or equal to 2 mm.

19. The electronic device of any of claims 1-18, wherein, The length of the first radiator is greater than or equal to 8 mm and less than or equal to 16 mm.

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