A plastic encapsulation device for diode production that facilitates die replacement

Abstract

The present invention relates to the technical field of plastic encapsulation for diode production, and discloses a plastic encapsulation device for diode production that is convenient for replacing molds, including a plastic encapsulation frame. A sealing door is hinged on the surface of the plastic encapsulation frame. The bottom of the inner wall of the plastic encapsulation frame is fixedly connected with a mounting frame. An inclined groove is opened at the top of the mounting frame. A mold is installed inside the mounting frame. A hydraulic rod is fixedly connected to the top of the inner wall of the plastic encapsulation frame. A clamping component is arranged inside the mounting frame. After the mold is placed inside the mounting frame, the clamping plate moves towards the inside of the mounting frame by the elasticity of the elastic rod. The clamping plate presses and fixes the mold through the elasticity of the elastic rod, improving the stability of the mold during the plastic encapsulation of the diode. Four clamping plates are arranged inside the mounting frame, and the four faces of the mold are clamped and fixed by the clamping plates, further improving the stability of the mold during use.

Description

Technical Field

[0001] The present invention relates to the technical field of plastic encapsulation for diode production, and specifically to a plastic encapsulation device for diode production that is convenient for replacing molds. Background Art

[0002] A diode is an electronic device made of semiconductor materials (such as silicon, selenium, germanium, etc.). A diode has two electrodes, a positive electrode, also called an anode; and a negative electrode, also called a cathode. When a forward voltage is applied across the two electrodes of the diode, the diode conducts. When a reverse voltage is applied, the diode is cut off. The conduction and cut-off of the diode are equivalent to the on and off of a switch. The diode has a unidirectional conductivity. When conducting, the current direction is from the anode through the tube to the cathode. The diode is one of the earliest semiconductor devices and has a very wide range of applications.

[0003] During diode production, plastic encapsulation processing is required. When the existing plastic encapsulation device is in use, the diode needs to be placed in a mold inside the plastic encapsulation device. After the diode is plastic encapsulated, the mold needs to be disassembled and replaced in order to perform the next step of processing on the diode. When disassembling the mold, the operator needs to disassemble the mold, and the mold also needs to be re-fixed during installation, resulting in a slow replacement speed of the mold, thus affecting the working efficiency of plastic encapsulation. Summary of the Invention

[0004] The purpose of the present invention is to provide a plastic encapsulation device for diode production that is convenient for replacing molds, so as to solve the problems raised in the above background art.

[0005] To solve the above technical problems, the present invention is realized through the following technical solutions:

[0006] The present invention is a plastic encapsulation device for diode production that is convenient for replacing molds, including a plastic encapsulation frame. A sealing door is hinged on the surface of the plastic encapsulation frame. The bottom of the inner wall of the plastic encapsulation frame is fixedly connected with an installation frame. An inclined groove is opened at the top of the installation frame. A mold is installed inside the installation frame. The top of the inner wall of the plastic encapsulation frame is fixedly connected with a hydraulic rod. A clamping component is arranged inside the installation frame. An auxiliary component is arranged on the surface of the installation frame. The output end of the hydraulic rod is provided with a replacement component. An extrusion component is arranged on the surface of the replacement component.

[0007] The clamping component includes a positioning groove which is opened on the inner wall of the mounting frame. An elastic rod is fixedly connected to the inner wall of the positioning groove. The end of the elastic rod away from the positioning groove is fixedly connected to a clamping plate. The clamping plate moves towards the inside of the mounting frame by the elasticity of the elastic rod. The clamping plate fixes the mold by the elasticity of the elastic rod, improving the stability during the plastic encapsulation of the diode by the mold. Four clamping plates are arranged inside the mounting frame, and the four sides of the mold are clamped and fixed by the clamping plates. An extrusion rod is fixedly connected to the surface of the clamping plate. The end of the extrusion rod away from the clamping plate is fixedly connected to a sliding frame, and a sliding plate is fixedly connected to the bottom of the inner wall of the plastic encapsulation frame.

[0008] Further, the extrusion rod is arranged at one end of the clamping plate close to the elastic rod. The end of the extrusion rod away from the clamping plate penetrates through the mounting frame and extends to the outer end of the mounting frame. The inner wall of the sliding frame is slidably connected to the surface of the sliding plate, and the surface of the clamping plate is in contact with the inner wall of the positioning groove.

[0009] Further, the auxiliary component includes a fixed rod. The end of the fixed rod is fixedly connected to the surface of the sliding frame. An elastic contraction rod is fixedly connected to the surface of the fixed rod. An inclined plate is hinged to the surface of the fixed rod. The end of the inclined plate away from the fixed rod is hinged to a moving frame. A limiting rod is fixedly connected to the top of the moving frame. A stress plate is fixedly connected to the top of the limiting rod. A vertical plate is fixedly connected to the surface of the mounting frame.

[0010] Further, two fixed rods are arranged on the surface of the sliding frame, and the two fixed rods are symmetrically arranged with the sliding frame as the center. The inclined plate is located at one end of the elastic contraction rod close to the sliding frame.

[0011] Further, the inner wall of the moving frame is slidably connected to the surface of the vertical plate. The limiting rod is arranged at one end of the moving frame away from the vertical plate. The end of the elastic contraction rod away from the fixed rod is fixedly connected to the surface of the mounting frame.

[0012] Further, the replacement component includes a fixed disk. The top of the fixed disk is fixedly connected to the bottom of a hydraulic rod. A stabilizing rod is fixedly connected to the surface of the fixed disk. The end of the stabilizing rod away from the fixed disk is rotatably connected to an arc-shaped frame. A bent frame is fixedly connected to the top of the arc-shaped frame. An electric rod is hinged to the surface of the bent frame. A hinged plate is fixedly connected to the top of the fixed disk. The end of the electric rod away from the bent frame is hinged to the surface of the hinged plate. A clamping plate is fixedly connected to the bottom of the arc-shaped frame.

[0013] Further, the number of the stabilizing rods is four, and the four stabilizing rods are circumferentially arranged with the fixed disk as the center. The surface of the clamping plate is adapted to the surface of the mold.

[0014] Further, the extrusion component includes a rectangular frame, the bottom of the rectangular frame is fixedly connected to the inner wall of the stabilizing rod, the top of the rectangular frame is fixedly connected with a bending plate, one end of the bending plate away from the rectangular frame is fixedly connected with an elastic rod, the bottom of the elastic rod is fixedly connected with a pressing plate, and the pressing plate corresponds to the center of the stress plate.

[0015] The present invention has the following beneficial effects:

[0016] After the mold of the present invention is placed inside the mounting rack, the clamping plate moves towards the inside of the mounting rack by the elasticity of the elastic rod. The clamping plate fixes the mold by the elasticity of the elastic rod, improving the stability of the mold during the plastic encapsulation of the diode. There are four clamping plates arranged inside the mounting rack, and the four surfaces of the mold are clamped and fixed by the clamping plates, further improving the stability of the mold during use. The clamping plate is slidably connected to the inner wall of the mounting rack through the extrusion rod, and the extrusion rod is used to limit and support the clamping plate, improving the stability of the clamping plate when clamping the mold.

[0017] When the extrusion component of the present invention moves downward through the hydraulic rod, the bottom of the extrusion component will contact the top of the stress plate, and the stress plate will then push the moving rack downward through the limiting rod. When the moving rack slides downward, it pushes the fixed rod to move away from one end of the mounting rack through the inclined plate, and the fixed rod will pull the extrusion rod to move towards the outer end of the mounting rack, and the clamping plate will move into the positioning groove through the extrusion rod, thereby facilitating the installation of the mold inside the mounting rack and improving the convenience of the mold during installation and disassembly.

[0018] The fixed disk of the present invention moves downward through the hydraulic rod to contact the top of the mold. At this time, the electric rod is started to extend outward. When the electric rod extends, it pushes the arc-shaped frame to rotate on the surface of the stabilizing rod through the bending frame, and when the arc-shaped frame rotates, it pushes the clamping plate to move towards the surface of the mold, thereby clamping and fixing the mold through the clamping plate. After the clamping of the mold is completed, it can be separated from the mounting rack by the rising of the hydraulic rod, thereby disassembling and separating the mold.

[0019] When the fixed disk of the present invention moves downward, it pushes the bending plate downward through the connection between the stabilizing rod and the rectangular frame. When the bending plate moves downward, it pushes the pressing plate downward through the connection between the elastic rod and the pressing plate, so that the pressing plate can contact the top of the stress plate, thereby driving the auxiliary component to start working and improving the convenience of the mold during installation and disassembly.

[0020] Of course, it is not necessary for any product implementing the present invention to simultaneously achieve all the above-mentioned advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained based on these drawings.

[0022] Figure 1 Schematic diagram of the overall structure of the present invention;

[0023] Figure 2 Schematic cross-sectional structure diagram of the plastic encapsulation frame of the present invention;

[0024] Figure 3 Schematic diagram of the overall structure of the clamping component of the present invention;

[0025] Figure 4 Schematic diagram of the overall structure of the auxiliary component of the present invention;

[0026] Figure 5 Schematic diagram of the overall structure of the replacement component of the present invention;

[0027] Figure 6 Schematic diagram of the overall structure of the extrusion component of the present invention.

[0028] In the accompanying drawings, the list of components represented by each reference numeral is as follows:

[0029] In the figure: 1, plastic encapsulation frame; 2, sealing door; 3, hydraulic rod; 4, mounting frame; 5, inclined plane groove; 6, mold; 7, clamping component; 8, auxiliary component; 9, replacement component; 10, extrusion component; 11, positioning groove; 12, clamping plate; 13, sliding frame; 14, elastic rod; 15, extrusion rod; 16, sliding plate; 20, fixed rod; 21, inclined plate; 22, limiting rod; 23, stress plate; 24, moving frame; 25, elastic contraction rod; 26, vertical plate; 30, fixed disk; 31, stabilizing rod; 32, hinge plate; 33, arc frame; 34, electric rod; 35, bent frame; 36, clamping plate; 40, rectangular frame; 41, bending plate; 42, elastic rod; 43, pressing plate. Detailed implementation manners

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0031] Please refer to Figures 1-6As shown in the figure, the present invention is a plastic encapsulation device for diode production that facilitates mold replacement, including a plastic encapsulation frame 1. A sealing door 2 is hinged on the surface of the plastic encapsulation frame 1. The bottom of the inner wall of the plastic encapsulation frame 1 is fixedly connected with a mounting frame 4. An inclined groove 5 is opened at the top of the mounting frame 4. A mold 6 is installed inside the mounting frame 4. The top of the inner wall of the plastic encapsulation frame 1 is fixedly connected with a hydraulic rod 3. After the mold 6 of the present invention is placed inside the mounting frame 4, the clamping plate 12 moves towards the inside of the mounting frame 4 by the elasticity of the elastic rod 14. The clamping plate 12 squeezes and fixes the mold 6 through the elasticity of the elastic rod 14, improving the stability of the mold during diode plastic encapsulation. Four clamping plates 12 are arranged inside the mounting frame 4, and the four surfaces of the mold 6 are clamped and fixed by the clamping plates 12, further improving the stability of the mold 6 during use. The clamping plate 12 is slidably connected to the inner wall of the mounting frame 4 through an extrusion rod 15, and the extrusion rod 15 is used to limit and support the clamping plate 12, improving the stability of the clamping plate 12 when clamping the mold 6. A clamping component 7 is arranged inside the mounting frame 4, an auxiliary component 8 is arranged on the surface of the mounting frame 4, a replacement component 9 is arranged at the output end of the hydraulic rod 3, and an extrusion component 10 is arranged on the surface of the replacement component 9;

[0032] The clamping component 7 includes a positioning groove 11 opened on the inner wall of the mounting frame 4. An elastic rod 14 is fixedly connected to the inner wall of the positioning groove 11. One end of the elastic rod 14 away from the positioning groove 11 is fixedly connected with a clamping plate 12. An extrusion rod 15 is fixedly connected to the surface of the clamping plate 12. One end of the extrusion rod 15 away from the clamping plate 12 is fixedly connected with a sliding frame 13. The bottom of the inner wall of the plastic encapsulation frame 1 is fixedly connected with a sliding plate 16.

[0033] The extrusion rod 15 is arranged at one end of the clamping plate 12 close to the elastic rod 14. One end of the extrusion rod 15 away from the clamping plate 12 penetrates through the mounting frame 4 and extends to the outside of the mounting frame 4. The inner wall of the sliding frame 13 is slidably connected with the surface of the sliding plate 16. The surface of the clamping plate 12 is in contact with the inner wall of the positioning groove 11.

[0034] The auxiliary component 8 includes a fixed rod 20. The end of the fixed rod 20 is fixedly connected to the surface of the carriage 13. An elastic contraction rod 25 is fixedly connected to the surface of the fixed rod 20. An inclined plate 21 is hinged to the surface of the fixed rod 20. One end of the inclined plate 21 away from the fixed rod 20 is hinged to a moving frame 24. When the extrusion component 10 of the present invention moves downward through the hydraulic rod 3, the bottom of the extrusion component 10 will contact the top of the force-receiving plate 23. The force-receiving plate 23 will then push the moving frame 24 downward through the limiting rod 22. When the moving frame 24 slides downward, it will push the fixed rod 20 to move away from the mounting frame 4 through the inclined plate 21. The fixed rod 20 will then pull the extrusion rod 15 to move towards the outer end of the mounting frame 4. The clamping plate 12 will then move into the positioning groove 11 through the extrusion rod 15, thereby facilitating the installation of the mold 6 inside the mounting frame 4 and improving the convenience of installing and disassembling the mold 6. A limiting rod 22 is fixedly connected to the top of the moving frame 24. The top of the limiting rod 22 is fixedly connected to a force-receiving plate 23. A vertical plate 26 is fixedly connected to the surface of the mounting frame 4.

[0035] There are two fixed rods 20 arranged on the surface of the carriage 13. The two fixed rods 20 are symmetrically arranged with the carriage 13 as the center. The inclined plate 21 is located at one end of the elastic contraction rod 25 close to the carriage 13.

[0036] The inner wall of the moving frame 24 is slidably connected to the surface of the vertical plate 26. The limiting rod 22 is arranged at one end of the moving frame 24 away from the vertical plate 26. One end of the elastic contraction rod 25 away from the fixed rod 20 is fixedly connected to the surface of the mounting frame 4.

[0037] The replacement component 9 includes a fixed disk 30. The top of the fixed disk 30 is fixedly connected to the bottom of the hydraulic rod 3. A stabilizing rod 31 is fixedly connected to the surface of the fixed disk 30. One end of the stabilizing rod 31 away from the fixed disk 30 is rotatably connected to an arc-shaped frame 33. The top of the arc-shaped frame 33 is fixedly connected to a bent frame 35. An electric rod 34 is hinged to the surface of the bent frame 35. A hinge plate 32 is fixedly connected to the top of the fixed disk 30. When the fixed disk 30 of the present invention moves downward through the hydraulic rod 3 and contacts the top of the mold 6, at this time, the electric rod 34 is started to extend outward. When the electric rod 34 extends, it will push the arc-shaped frame 33 to rotate on the surface of the stabilizing rod 31 through the bent frame 35. When the arc-shaped frame 33 rotates, it will push the clamping plate 36 towards the surface of the mold 6, thereby clamping and fixing the mold through the clamping plate 36. After clamping the mold 6, it can be separated from the mounting frame 4 by the upward movement of the hydraulic rod 3, thereby disassembling and separating the mold 6. One end of the electric rod 34 away from the bent frame 35 is hinged to the surface of the hinge plate 32. The bottom of the arc-shaped frame 33 is fixedly connected to a clamping plate 36.

[0038] The number of the stabilizing rods 31 is set to four. The four stabilizing rods 31 are arranged in a circumferential manner with the fixed disk 30 as the center. The surface of the clamping plate 36 is adapted to the surface of the mold 6.

[0039] The extrusion member 10 includes a rectangular frame 40. The bottom of the rectangular frame 40 is fixedly connected to the inner wall of the stabilizing rod 31. A bending plate 41 is fixedly connected to the top of the rectangular frame 40. One end of the bending plate 41 away from the rectangular frame 40 is fixedly connected to an elastic rod 42. When the fixing plate 30 of the present invention moves downward, it pushes the bending plate 41 to move downward through the connection between the stabilizing rod 31 and the rectangular frame 40. When the bending plate 41 moves downward, it pushes the pressing plate 43 to move downward through the connection between the elastic rod 42 and the pressing plate 43, so that the pressing plate 43 can contact the top of the stress plate 23, thereby driving the auxiliary member 8 to start working and improving the convenience of installing and disassembling the mold 6. The bottom of the elastic rod 42 is fixedly connected to a pressing plate 43, and the pressing plate 43 corresponds to the center of the stress plate 23.

[0040] During use, after the mold 6 is placed inside the mounting frame 4, the clamping plate 12 moves inward into the mounting frame 4 by the elasticity of the elastic rod 14. The clamping plate 12 squeezes and fixes the mold 6 by the elasticity of the elastic rod 14, improving the stability of the mold during the plastic encapsulation of the diode. Four clamping plates 12 are provided inside the mounting frame 4, and the four surfaces of the mold 6 are clamped and fixed by the clamping plates 12, further improving the stability of the mold 6 during use. The clamping plate 12 is slidably connected to the inner wall of the mounting frame 4 through an extrusion rod 15, and the extrusion rod 15 is used to limit and support the clamping plate 12, improving the stability of the clamping plate 12 when clamping the mold 6. When the extrusion member 10 moves downward through the hydraulic rod 3, the bottom of the extrusion member 10 will contact the top of the stress plate 23, and the stress plate 23 will push the moving frame 24 to move downward through the limiting rod 22. When the moving frame 24 slides downward, it pushes the fixed rod 20 to move away from the mounting frame 4 through the inclined plate 21. The fixed rod 20 will pull the extrusion rod 15 to move to the outer end of the mounting frame 4, and the clamping plate 12 will move into the positioning groove 11 through the extrusion rod 15, thus facilitating the installation of the mold 6 inside the mounting frame 4 and improving the convenience of installing and disassembling the mold 6. The fixed plate 30 moves downward through the hydraulic rod 3 to contact the top of the mold 6. At this time, the electric rod 34 is started to extend outward. When the electric rod 34 extends, it pushes the arc-shaped frame 33 to rotate on the surface of the stabilizing rod 31 through the bent frame 35. When the arc-shaped frame 33 rotates, it pushes the clamping plate 36 to move toward the surface of the mold 6, thereby clamping and fixing the mold through the clamping plate 36. After the clamping of the mold 6 is completed, it can be separated from the mounting frame 4 by the rising of the hydraulic rod 3, thereby disassembling and separating the mold 6. When the fixing plate 30 moves downward, it pushes the bending plate 41 to move downward through the connection between the stabilizing rod 31 and the rectangular frame 40. When the bending plate 41 moves downward, it pushes the pressing plate 43 to move downward through the connection between the elastic rod 42 and the pressing plate 43, so that the pressing plate 43 can contact the top of the stress plate 23, thereby driving the auxiliary member 8 to start working and improving the convenience of installing and disassembling the mold 6.

[0041] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of the present invention, so that those skilled in the art can well understand and utilize the present invention. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A plastic packaging device for diode production that is easy to replace molds, comprising a plastic packaging frame (1), characterized in that: A sealing door (2) is hingedly connected to the surface of the plastic packaging frame (1); a mounting frame (4) is fixedly connected to the bottom of the inner wall of the plastic packaging frame (1); a bevel groove (5) is provided on the top of the mounting frame (4); a mold (6) is installed inside the mounting frame (4); a hydraulic rod (3) is fixedly connected to the top of the inner wall of the plastic packaging frame (1); a clamping component (7) is provided inside the mounting frame (4); an auxiliary component (8) is provided on the surface of the mounting frame (4); a replacement component (9) is provided at the output end of the hydraulic rod (3); and an extrusion component (10) is provided on the surface of the replacement component (9); The clamping component (7) comprises a positioning groove (11), the positioning groove (11) is formed on the inner wall of the mounting frame (4), the inner wall of the positioning groove (11) is fixedly connected to an elastic rod (14), one end of the elastic rod (14) away from the positioning groove (11) is fixedly connected to a clamping plate (12), the surface of the clamping plate (12) is fixedly connected to an extrusion rod (15), one end of the extrusion rod (15) away from the clamping plate (12) is fixedly connected to a slide frame (13), and the bottom of the inner wall of the plastic packaging frame (1) is fixedly connected to a slide plate (16); The auxiliary component (8) comprises a fixed rod (20), the end of the fixed rod (20) is fixedly connected to the surface of the slide (13), the surface of the fixed rod (20) is fixedly connected to an elastic contraction rod (25), the surface of the fixed rod (20) is hinged to an inclined plate (21), one end of the inclined plate (21) away from the fixed rod (20) is hinged to a moving frame (24), the top of the moving frame (24) is fixedly connected to a limiting rod (22), the top of the limiting rod (22) is fixedly connected to a force plate (23), and the surface of the mounting frame (4) is fixedly connected to a vertical plate (26); The replacement component (9) comprises a fixed plate (30), the top of the fixed plate (30) being fixedly connected to the bottom of the hydraulic rod (3), the surface of the fixed plate (30) being fixedly connected to a stabilizing rod (31), one end of the stabilizing rod (31) away from the fixed plate (30) being rotatably connected to an arc frame (33), the top of the arc frame (33) being fixedly connected to a bent frame (35), the surface of the bent frame (35) being hinged to an electric rod (34), the top of the fixed plate (30) being fixedly connected to a hinge plate (32), one end of the electric rod (34) away from the bent frame (35) being hinged to the surface of the hinge plate (32), and the bottom of the arc frame (33) being fixedly connected to a clamping plate (36); The extrusion component (10) comprises a rectangular frame (40), the bottom of the rectangular frame (40) is fixedly connected to the inner wall of the stabilizing rod (31), the top of the rectangular frame (40) is fixedly connected to a bending plate (41), one end of the bending plate (41) away from the rectangular frame (40) is fixedly connected to an elastic rod (42), the bottom of the elastic rod (42) is fixedly connected to a pressing plate (43), and the pressing plate (43) corresponds to the center of the force-bearing plate (23).

2. The diode production plastic packaging equipment that is easy to replace molds according to claim 1 is characterized by: The extrusion rod (15) is arranged at one end of the clamping plate (12) close to the elastic rod (14), and the end of the extrusion rod (15) away from the clamping plate (12) passes through the mounting frame (4) and extends to the outer end of the mounting frame (4), the inner wall of the slide frame (13) is slidably connected to the surface of the slide plate (16), and the surface of the clamping plate (12) contacts the inner wall of the positioning groove (11).

3. The diode production plastic packaging equipment that is easy to replace molds according to claim 2 is characterized by: Two fixing rods (20) are arranged on the surface of the slide (13), and the two fixing rods (20) are symmetrically arranged with the slide (13) as the center. The inclined plate (21) is located at one end of the elastic contraction rod (25) close to the slide (13).

4. The diode production plastic packaging equipment that is easy to replace molds according to claim 3 is characterized by: The inner wall of the movable frame (24) is slidably connected to the surface of the vertical plate (26), the limit rod (22) is arranged at one end of the movable frame (24) away from the vertical plate (26), and the end of the elastic contraction rod (25) away from the fixed rod (20) is fixedly connected to the surface of the mounting frame (4).

5. The diode production plastic packaging equipment that is easy to replace molds according to claim 4 is characterized by: The number of the stabilizing rods (31) is four, and the four stabilizing rods (31) are arranged around a fixed disk (30) as a central circumference, and the surface of the clamping plate (36) and the surface of the mold (6) are adapted to each other.

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