Welding ribbon conveying device and welding ribbon conveying method

Abstract

The present application relates to a welding ribbon conveying device and a welding ribbon conveying method. The welding ribbon conveying device includes: a grabbing assembly and a mounting structure, a plurality of the grabbing assemblies are arranged in rows and / or columns on the mounting structure to form a grabbing mechanism; the grabbing assembly includes a hook clamp structure and a pressure needle structure, the hook clamp structure has a first position and a second position relative to the mounting structure, and the pressure needle structure is arranged on one side of the hook clamp structure; when the hook clamp structure is at the first position, at least a portion of the corresponding pressure needle structure can be pressed against the hook clamp structure; when the hook clamp structure is at the second position, the corresponding pressure needle structure can be separated from the hook clamp structure. The welding ribbon conveying device provided by the present application improves the reliability of welding ribbon conveying and reduces the risk of welding ribbon falling.

Description

Technical Field

[0001] The present application relates to the technical field of battery production equipment, and more specifically, to a soldering ribbon conveying device and a soldering ribbon conveying method. Background Art

[0002] In conventional BC (Back Contact) battery assembly string soldering, the solder ribbon is typically placed on the cell using a vacuum suction device. The ribbon is then moved over the cell, and after the vacuum is broken, the ribbon is pressed down and placed on the cell. This method is prone to vacuum leaks when handling large quantities of ribbon, causing the ribbon to fall. Summary of the Invention

[0003] One purpose of the present application is to provide a new technical solution for a welding ribbon conveying device and a welding ribbon conveying method.

[0004] According to a first aspect of the present application, there is provided a gripping assembly, comprising:

[0005] A gripping assembly and a mounting structure, wherein a plurality of the gripping assemblies are arranged in rows and / or columns on the mounting structure to form a gripping mechanism;

[0006] The grabbing assembly includes a hook-clamp structure and a pressure needle structure, wherein the hook-clamp structure has a first position and a second position relative to the mounting structure, and the pressure needle structure is arranged on one side of the hook-clamp structure;

[0007] When the hook-and-clamp structure is located at the first position, at least a portion of the corresponding pressure needle structure can press against the hook-and-clamp structure;

[0008] When the hook-and-clamp structure is located at the second position, the corresponding pressure-pin structure can be separated from the hook-and-clamp structure.

[0009] Optionally, an auxiliary mechanism is further included. When a solder strip is pressed between the pressure needle structure and the hook clamp structure, the auxiliary mechanism can press against the solder strip, and the pressing force is greater than or equal to the pressing force of the pressure needle structure on the solder strip.

[0010] Optionally, the welding ribbon transport device further includes a mounting plate, two grabbing mechanisms are provided and are respectively fixed at two ends of the first surface of the mounting plate, and the auxiliary mechanism is fixed between the two grabbing mechanisms.

[0011] Optionally, the structure of the auxiliary mechanism is the same as the pressure needle structure, and the number of the pressure needle structures included therein is the same as the number of the hook and clamp structures included in the grasping mechanism.

[0012] Optionally, the welding ribbon transporting device further includes a lifting mechanism, which is disposed on the mounting plate and can at least drive the auxiliary mechanism to rise or fall.

[0013] Optionally, the grabbing assembly further comprises a guide structure, and a limiting groove is provided on the guide structure, so that when the hook and clamp structure is located at the first position, the welding strip it carries can be located in the limiting groove.

[0014] Optionally, the pressure needle structure includes a pressure plate, a spring and a connecting piece, and the pressure plate is connected to the connecting piece through the spring, so that at least a portion of the pressure plate can be pressed against the hook and clamp structure.

[0015] Optionally, the pressure needle structure further includes an air pipe joint, an adsorption hole is provided in the pressure plate, the air pipe joint is communicated with the adsorption hole, and can be connected to a pneumatic source.

[0016] Optionally, the hook-and-clamp structure has a supporting portion, the upper surface of which is higher than the lower surface of the pressure plate, so that when the hook-and-clamp structure is at the first position, at least a portion of the lower surface of the pressure plate can be pressed against the upper surface of the supporting portion.

[0017] Optionally, the grabbing assembly further comprises a first driving member, and the hook-and-clamp structure further comprises a connecting portion;

[0018] The supporting portion is connected to the first driving member through the connecting portion, and the first driving member is used to make the hook and clamp structure be located at the first position or the second position.

[0019] According to a second aspect of the present application, a method for handling a welding ribbon is provided, which is applied to the welding ribbon handling device described in the first aspect, wherein the hook and clamp structure has a supporting portion, and the pressure needle structure has a pressure plate. The welding ribbon handling method includes:

[0020] Positioning each hook and clamp structure at a second position, with the upper surface of each supporting portion lower than the bottom surface of the welding strip, and the lower surface of each pressing plate higher than the upper surface of the supporting portion;

[0021] Move each hook and clamp structure to the first position, and simultaneously raise it to a position where the upper surface of each supporting portion contacts the lower surface of the soldering ribbon, and press the lower surface of each pressing plate against the upper surface of the soldering ribbon to complete the soldering ribbon grabbing;

[0022] The hook and clamp structure is lowered until the upper surface of each supporting part is separated from the lower surface of the welding ribbon, and at the same time, the hook and clamp structure is moved to the second position so that each pressing plate presses the welding ribbon against the battery cell to complete the welding ribbon placement.

[0023] One of the technical effects of the present application is that, by setting a hook-clamp structure and a pressure-pin structure, the present application enables, when the hook-clamp structure is in the first position, the pressure-pin structure to be pressed against the hook-clamp structure, so that the soldering ribbon can be pressed between the hook-clamp structure and the pressure-pin structure, thereby achieving the grasping of the soldering ribbon; and when the hook-clamp is in the second position, the hook-clamp structure is separated from the pressure-pin structure, so that the soldering ribbon can be separated from the grasping component and placed.

[0024] By arranging multiple of the above-mentioned grabbing components in rows and / or columns on the mounting structure, a grabbing mechanism is formed. After grabbing the solder strip, one soldering surface of the solder strip is pressed onto the pressure pin structure and the other soldering surface is supported on the hook and clamp structure during transportation, thereby improving the reliability of grabbing the solder strip and reducing the risk of the solder strip falling.

[0025] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings, which constitute a part of the specification, illustrate embodiments of the present application and, together with the description, serve to explain the principles of the present application.

[0027] Figure 1 This is one of the schematic diagrams of a welding ribbon handling device provided in this application.

[0028] Figure 2 Figure 1 A partial enlarged view of point A in the middle.

[0029] Figure 3 Figure 1 side view.

[0030] Figure 4 This is one of the schematic diagrams of a gripping mechanism provided in this application.

[0031] Figure 5 yes Figure 4 side view.

[0032] Figure 6 yes Figure 5 BB cross-sectional view.

[0033] Figure 7 This is the second schematic diagram of a gripping mechanism provided in this application.

[0034] Figure 8 This is a structural schematic diagram of a pressing plate provided in this application.

[0035] Figure 9 yes Figure 8 main view.

[0036] Figure 10 yes Figure 9CC cross-sectional view.

[0037] Figure 11 This is one of the actions of a grabbing mechanism provided in the present application to grab the solder strip on the solder strip slitting mechanism (the hook and clamp structure is located at the second position).

[0038] Figure 12 yes Figure 11 Local schematic diagram at point M in the middle.

[0039] Figure 13 This is the second action of a grabbing mechanism provided by the present application to grab the soldering ribbon on the soldering ribbon slitting mechanism (the hook and clamp structure is located at the second position).

[0040] Figure 14 yes Figure 13 A local enlarged view of point N in the middle.

[0041] Figure 15 This is a schematic diagram of the action of a gripping mechanism provided in the present application during the handling process after gripping the solder strip.

[0042] Figure 16 yes Figure 15 A local enlarged view of point P in the middle.

[0043] Figure 17 This is a schematic diagram of a gripping mechanism provided in this application for placing a solder ribbon on a battery.

[0044] Figure 18 yes Figure 17 A partial enlarged view of the middle Q.

[0045] Figure 19 This is the second schematic diagram of a welding ribbon handling device provided in this application.

[0046] Figure 20 yes Figure 19 main view.

[0047] Figure 21 yes Figure 20 Bottom view of .

[0048] Figure 22 This is an assembly diagram of a gripping mechanism and auxiliary mechanism provided in this application.

[0049] Figure 23 This is one of the schematic diagrams of an auxiliary mechanism provided in this application.

[0050] Figure 24 This is the second schematic diagram of an auxiliary mechanism provided by this application.

[0051] Figure 25 yes Figure 24 A partial enlarged view of point D in the middle.

[0052] Figure 26 This is a schematic diagram of a lifting mechanism provided by this application.

[0053] Description of reference numerals:

[0054] 100. Grabbing mechanism; 10. Hook-and-clamp structure; 101. Supporting part; 102. Connecting part; 20. Pressing needle structure; 201. Adsorption hole; 202. Pressing plate; 203. Spring; 204. Connecting part; 205. Retaining ring; 30. Guide structure; 301. Limiting groove; 40. Air pipe joint; 50. First driving part; 200. Mounting plate; 300. Auxiliary mechanism; 400. Lifting mechanism; 401. Connecting plate; 402. Slot; 403. Second driving part; 500. Welding ribbon; 600. Welding ribbon slitting mechanism; 700. Battery cell. DETAILED DESCRIPTION

[0055] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0056] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present disclosure, its application, or uses.

[0057] Techniques and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the techniques and equipment should be considered part of the specification.

[0058] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0059] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0060] like Figures 1 to 18As shown, according to the first aspect of the present application, there is provided a welding ribbon handling device, comprising a grabbing assembly and a mounting structure, wherein a plurality of grabbing assemblies are arranged in rows and / or columns on the mounting structure to form a grabbing mechanism 100; the grabbing assembly comprises a hook clamp structure 10 and a pressure needle structure 20, and the hook clamp structure 10 has a first position and a second position relative to the mounting structure; the pressure needle structure 20 is arranged on one side of the hook clamp structure 10; when the hook clamp structure 10 is at the first position, at least a portion of the pressure needle structure 20 can be pressed against the hook clamp structure 10; when the hook clamp structure 10 is at the second position, the pressure needle structure 20 can be separated from the hook clamp structure 10.

[0061] Specifically, the solder ribbon transport mechanism provided in the present application is used to grab the solder ribbon 500 from the solder ribbon slitting mechanism 600 or other solder ribbon 500 carrying device and then transport and place it on the battery cell 700 to perform the string welding process of the BC battery assembly.

[0062] In actual application, the hook-and-clamp structure 10 has a first position and a second position relative to the mounting structure, so as to facilitate the support, transportation, and placement of the soldering ribbon 500. That is, when the hook-and-clamp structure 10 is in the first position, the soldering ribbon 500 can be supported on the hook-and-clamp structure 10. When the hook-and-clamp structure 10 is in the first position, at least a portion of the pressure pin structure 20 can press against the hook-and-clamp structure 10. Therefore, when the soldering ribbon 500 is supported on the hook-and-clamp structure 10, the pressure pin structure 20 and the hook-and-clamp structure 10 can press the soldering ribbon 500 between their contact surfaces, thereby achieving the grasping and transportation of the soldering ribbon 500.

[0063] During the above process, one surface of the soldering ribbon 500 rests on the hook-and-clip structure 10, while the other surface is pressed against the hook-and-clip structure 10 by the pressure pin structure 20. This allows the soldering ribbon 500 to be securely pressed between the hook-and-clip structure 10 and the pressure pin structure 20. This prevents the risk of the soldering ribbon 500 falling during handling, thereby improving handling reliability. The clamping of the soldering ribbon 500 on both surfaces also avoids damage to the soldering ribbon 500, a common problem in conventional techniques where the two sides of the soldering ribbon 500 are clamped by clamping jaws, thereby improving the safety of the soldering ribbon 500 during handling.

[0064] In addition, after the solder ribbon 500 is moved to a predetermined position, for example, onto the battery cell 700, the hook-and-clamp structure 10 can be moved to a second position, and the pressure pin structure 20 can be separated from the hook-and-clamp structure 10. In this way, with the solder ribbon 500 held between them, the separation of the hook-and-clamp structure 10 and the pressure pin structure 20 allows the solder ribbon 500 to be placed onto the battery cell 700, completing the entire process of grabbing, moving, and placing the solder ribbon 500.

[0065] In the above embodiment, the hook-clamp structure 10 is located at the first position and the second position, and the hook-clamp structure 10 can be in a closed state and an open state, so that it can adjust the distance relationship with the pressure needle structure 20. The specific form can be designed according to actual needs, and the position movement of the hook-clamp structure 10 can be achieved by a motor, a cylinder and other driving parts, and this application does not impose any restrictions on this.

[0066] like Figures 4 to 7 As shown, a gripping mechanism 100 is formed by arranging a plurality of gripping components in columns or rows on a mounting structure. Since it grips the welding ribbon 500 firmly and places the welding ribbon 500 in a precise position, the working efficiency of the welding ribbon 500 gripping mechanism 100 and the product yield of the battery assembly finally produced are improved.

[0067] In actual applications, multiple hook and clamp structures 10 and multiple pressure needle structures 20 can be matched and set in multiple groups to simultaneously grab multiple welding ribbons 500 through multiple grabbing components to improve production efficiency; or multiple grabbing components can be used to simultaneously grab the same welding ribbon 500 to further improve the reliability of the transportation of the welding ribbon 500. The specific matching design is carried out according to actual needs.

[0068] In one embodiment, a plurality of groups of gripping components are matched and arranged on the mounting structure, and the plurality of groups of gripping components are arranged in rows and / or columns on the mounting structure, and the hook-clamp structure 10 has a first position and a second position relative to the mounting structure to achieve the pressing contact or separation of the hook-clamp structure 10 and the pressure pin structure 20. The grouped gripping components can improve the gripping efficiency and gripping reliability of the welding ribbon 500. The mounting structure can be a plate-like structure or a strip-like structure, or a plurality of hook-clamp structures 10 and a plurality of pressure pin structures 20 can be integrated together by a structure similar to a mounting beam, and then matched with each other and arranged on the same mounting plate 200, so as to adapt to different production needs.

[0069] Alternatively, as Figure 2 As shown, the grabbing assembly further includes a guide structure 30 , on which a limiting groove 301 is provided. When the hook and clamp structure 10 is located at the first position, the welding strip 500 it carries can be located in the limiting groove 301 .

[0070] Specifically, in actual application, the welding ribbon 500 is a long strip structure. The setting of the guide structure 30 enables the welding ribbon 500 to be located in the limiting groove 301 of the guide structure 30 when it is located between the hook and clamp structure 10 and the pressure needle structure 20. In the process of grabbing and carrying, the part of the welding ribbon 500 that is not pressed between the hook and clamp structure 10 and the pressure needle structure 20 can be restricted in the limiting groove 301 to prevent it from shaking left and right, thereby ensuring that the welding ribbon 500 will not fall or change its position during transportation, thereby ensuring the yield and utilization rate of subsequent welding products. Figures 11 to 18 .

[0071] Alternatively, as Figure 2 and Figure 6 As shown, the pressure needle structure 20 includes a pressure plate 202, a spring 203 and a connecting member 204. The pressure plate 202 is connected to the connecting member 204 through the spring 203, so that at least a portion of the pressure plate 202 can press against the hook and clamp structure 10.

[0072] Specifically, in this embodiment, the pressing plate 202 of the pressure pin structure 20 is connected to the connecting member 204 via a spring 203, and the spring 203 can be provided with a pre-tightening force, so that when the hook-clamp structure 10 is in the first position, the pressing plate 202 can be pressed against the hook-clamp structure 10 under the action of the spring 203, thereby achieving the purpose of pressing the welding ribbon 500. Among them, at least a portion of the pressing plate 202 presses against the hook-clamp structure 10, which means that the size of the pressing plate 202 and the contact size of the hook-clamp structure 10 can be designed according to actual needs. The contact surface between the two is based on the compression of the welding ribbon 500, and it is not necessary to limit the contact surface to be the same.

[0073] In actual application, the pressure plate 202 can be designed as a connecting rod and a cylindrical pressure head located at one end of the connecting rod. The spring 203 is mounted on the connecting rod, and the pressure head is assembled on the connecting member 204 through the other end of the connecting rod. The spring 203 is provided with a certain pre-tightening force so that the pressure head can be pressed against the hook clamp structure 10 to achieve compression of the welding strip 500.

[0074] Alternatively, as Figures 7 to 10 As shown, the pressure needle structure 20 further includes an air pipe connector 40 , and an adsorption hole 201 is provided in the pressure plate 202 . The air pipe connector 40 is communicated with the adsorption hole 201 and can be connected to a pneumatic source.

[0075] Specifically, in this embodiment, by providing an adsorption hole 201 in the pressure plate 202, in actual application, after the air joint head is connected to the external pneumatic source, the pressure plate 202 can achieve an adsorption effect, so that in the process of transporting the welding ribbon 500, the pressure plate 202 can adsorb the welding ribbon 500 through the adsorption hole 201, further improving the gripping force of the pressure needle structure 20 and the hook and clamp structure 10 on the welding ribbon 500, improving the safety and reliability of the welding ribbon 500 during transportation, and preventing it from falling.

[0076] In the above embodiment, the pressure plate 202 includes a pressure head and a connecting rod connected to the pressure head. A retaining ring 205 and an air pipe connector 40 are provided on the other end of the connecting rod to achieve a movable connection between the pressure plate 202 and the connector 204, as well as a pneumatic connection with the air pipe structure. In actual use, the suction function of the pressure plate 202 can be activated during transportation or placement of the solder ribbon 500 to improve the grip of the solder ribbon 500. Activating the suction function during placement of the solder ribbon 500 ensures that the position of the solder ribbon 500 remains unchanged after the hook-clamp structure 10 moves to the second position and separates from the pressure pin structure 20, thereby improving the placement accuracy of the solder ribbon 500.

[0077] Optionally, the adsorption hole 201 is configured as a waist-shaped hole.

[0078] Specifically, in actual applications, the solder strip 500 is usually a long strip structure, and the adsorption hole 201 is set to a waist-shaped hole. When adsorbing the solder strip 500, the length direction of the waist-shaped hole is consistent with the length direction of the solder strip 500, thereby increasing the adsorption area of ​​the adsorption hole 201 for the solder strip 500 and improving the adsorption force of the pressure plate 202 for the solder strip 500.

[0079] Alternatively, as Figure 2 As shown, the hook-and-clamp structure 10 has a supporting portion 101, the upper surface of the supporting portion 101 is higher than the lower surface of the pressure plate 202, so that when the hook-and-clamp structure 10 is located at the first position, at least a portion of the lower surface of the pressure plate 202 can be pressed against the upper surface of the supporting portion 101.

[0080] Specifically, in this embodiment, the supporting portion 101 of the hook-and-clip structure 10 contacts the pressing pin structure 20 to achieve compression of the soldering ribbon 500. The supporting portion 101 can be configured as a planar structure that matches the shape of the soldering ribbon 500 and can be appropriately larger than the size of the soldering ribbon 500, so that the soldering ribbon 500 can be completely supported on the supporting portion 101, thereby improving the reliability of the support of the soldering ribbon 500 and providing a certain degree of protection for the soldering ribbon 500 during transportation.

[0081] In actual application, when the grabbing assembly does not grab the solder ribbon 500, the upper surface of the supporting portion 101 is higher than the pressing plate 202, so that when the hook-clip structure 10 is grabbing the solder ribbon 500 or carrying the solder ribbon 500, the lower surface of the pressing plate 202 is pressed against the upper surface of the supporting portion 101, thereby pressing the solder ribbon 500 and improving the pressing force on the solder ribbon 500. Figures 11 to 18 .

[0082] Alternatively, as Figure 3 、 Figure 19 and Figure 20 As shown, the grabbing assembly further includes a first driving member 50, and the hook-clamping structure 10 further has a connecting portion 102; the supporting portion 101 is connected to the first driving member 50 via the connecting portion 102, and the first driving member 50 is used to locate the hook-clamping structure 10 at the first position or the second position.

[0083] Specifically, in this embodiment, the supporting portion 101 is connected to the first driving member 50 via the connecting portion 102, so that the hook-clamping structure 10 can be located at the first position or the second position, thereby adjusting the position or state of the hook-clamping structure 10. The first driving member 50 can drive the hook-clamping structure 10 to move toward or away from the pressing pin structure 20 in the horizontal direction or the vertical direction, so that the pressing pin structure 20 can be pressed against or separated from the supporting portion 101.

[0084] In practical applications, the position of the pressure needle structure 20 can also be adjusted to achieve the pressing or separation between the pressure needle structure 20 and the hook and clamp structure 10. The first driving member 50 can be a driving member such as a cylinder, an electric cylinder or a motor.

[0085] In practical applications, the specific form of the gripping mechanism 100 in the welding ribbon handling device can be designed according to actual needs. Figures 4 and 5 As shown, it is assembled from 12 groups of gripping components, which can sequentially grip 12 welding strips 500 to form a small gripping mechanism 100. Figures 11 to 18 Four sets of structures composed of the above 12 gripping components are assembled together on a mounting structure to form a larger gripping mechanism 100 capable of clamping and gripping the 12 solder ribbons 500 at four locations. If more solder ribbons 500 need to be gripped at one time, this can be achieved by further increasing the number of gripping components or the number of small gripping mechanisms 100.

[0086] The following Figures 11 to 18 Taking the provided grabbing mechanism 100 as an example, the operational relationship between each hook and clamp structure 10 and the corresponding pressing pin structure 20 during the process of grabbing, transporting, and placing the solder ribbon 500 is described:

[0087] like Figures 11 to 12Figure 2 shows the operation of the gripping mechanism 100 as it prepares to grab the solder ribbon 500 after the solder ribbon 500 has been slit in the solder ribbon slitting mechanism 600. The solder ribbon 500 is positioned within the guide groove of the solder ribbon slitting mechanism 600, and the gripping mechanism 100 correspondingly descends to the grabbing position. At this point, the hook and clamp structure 10 is in the second position, with the upper surface of the support portion 101 of the hook and clamp structure 10 1-2 mm below the back surface of the solder ribbon 500. The pressure plate 202 of the pressure pin structure 20 contacts the upper surface of the guide groove of the solder ribbon slitting mechanism 600, causing the lower surface of the pressure plate 202 to be higher than the upper surface of the support portion 101. During this process, the pressure pin structure 20 does not contact the solder ribbon 500.

[0088] like Figures 13 and 14 FIG2 is a schematic diagram showing the gripping mechanism 100 gripping and transporting the solder ribbon 500. The gripping mechanism 100 rises until the upper surface of the supporting portion 101 of the hook and clamp structure 10 contacts the lower surface of the solder ribbon 500. Simultaneously, the first driving member 50 drives the hook and clamp structure 10 to move to the first position, completely resting the lower surface of the solder ribbon 500 on the supporting portion 101.

[0089] like Figures 15 and 16 The figure shows the second schematic diagram of the gripping mechanism 100 gripping and transporting the solder ribbon 500. The gripping mechanism 100 continues to rise until the solder ribbon 500 is separated from the solder ribbon slitting mechanism 600. During this process, due to the action of the spring 203, the lower surface of the pressing plate 202 contacts the upper surface of the solder ribbon 500, pressing the solder ribbon 500 against the supporting portion 101 of the hook and clamp structure 10. Subsequently, the gripping mechanism 100 moves to the location where the solder ribbon 500 is to be placed.

[0090] like Figures 17 and 18 The figure shows the action of the grasping mechanism 100 placing the solder ribbon 500 on the battery cell 700. When the grasping mechanism 100 moves to the top of the battery cell 700, the hook clamp structure 10 opens, and the hook clamp structure 10 moves to the second position, so that the upper surface of the supporting portion 101 is separated from the lower surface of the solder ribbon 500. At the same time, the pressure pin structure 20 is not restricted by the hook clamp structure 10. Under the action of the spring 203, the pressure plate 202 presses the solder ribbon 500 against the battery cell 700, thereby placing the solder ribbon 500. Subsequently, the grasping mechanism 100 is separated from the battery cell 700 to carry out the next cycle of grasping, transporting and placing processes. At this time, the hook clamp is in the second position, the lower surface of the pressure plate 202 is lower than the upper surface of the supporting portion 101, and there is no contact between the two.

[0091] In the above process, the solder ribbon grasping device formed by multiple grasping components can grasp multiple solder ribbons 500 at a time, and there are more grasping positions for each solder ribbon 500, which not only improves the grasping efficiency but also ensures the reliability of grasping the solder ribbon 500. In particular, since the solder ribbon 500 is pressed by the pressing plate 202 and the supporting portion 101 during the transportation process, the reliability of grasping and handling is further improved. In the placement process, the pressing effect of the pressing plate 202 on the solder ribbon 500 can prevent its position from shifting, thereby improving the reliability of the placement of the solder ribbon 500.

[0092] Alternatively, as Figures 19 to 26 As shown, the solder strip transporting device also includes an auxiliary mechanism 300 and the gripping mechanism 100 described in the second aspect; when the solder strip 500 is pressed between the pressure needle structure 20 and the hook clamp structure 10, the auxiliary mechanism 300 can be pressed on the solder strip 500, and the pressing force is greater than or equal to the pressing force of the pressure needle structure 20 on the solder strip 500.

[0093] Specifically, in this embodiment, the solder tape conveying device is assembled by one or more grasping mechanisms 100. When the solder tape 500 is pressed between the pressure pin structure 20 and the hook clamp structure 10, the pressing force of the auxiliary mechanism 300 on the solder tape 500 is greater than or equal to the pressing force of the pressure pin structure 20 on the solder tape 500, so that in the process of placing the solder tape 500, when the hook clamp structure 10 is separated from the pressure pin structure 20, at least the auxiliary mechanism 300 can be pressed on the solder tape 500 to fix the position of the solder tape 500, so as to facilitate the subsequent processes of further pressing and bonding the solder tape 500 to the battery cell 700, thereby improving the position control of the solder tape 500 during the placement of the solder tape 500.

[0094] The auxiliary mechanism 300 may be formed by a plurality of pressure needle structures 20 or by other similar mechanisms, and this application does not impose any limitation thereto.

[0095] Alternatively, as Figures 19 to 22 As shown, the welding ribbon transport device further includes a mounting plate 200 , two gripping mechanisms 100 are provided and are respectively fixed at both ends of the first surface of the mounting plate 200 , and the auxiliary mechanism 300 is fixed between the two gripping mechanisms 100 .

[0096] Specifically, in this embodiment, two gripping mechanisms 100 are provided at both ends of the soldering ribbon 500 to grasp the soldering ribbon 500. An auxiliary mechanism 300 is provided in the middle to secure the position of the soldering ribbon 500 during placement, preventing it from shifting. This structural design not only ensures the reliability of the soldering ribbon 500 during gripping, thus avoiding the risk of it falling, but also ensures the positional accuracy of the soldering ribbon 500 during placement, thereby improving the welding quality of subsequent products.

[0097] In the above embodiment, each gripping mechanism 100 is assembled using multiple pressure pin structures and a matching number of hook and clamp structures 10. Each auxiliary mechanism 300 can be implemented using the same number of pressure pin structures 20, improving the device's integration and the convenience of unified control. They are assembled on the mounting plate 200 to facilitate the movement of the entire device.

[0098] Alternatively, as Figures 23 to 25 As shown, the structure of the auxiliary mechanism 300 is the same as that of the pressure needle structure 20 , and the number of the pressure needle structures 20 included therein is the same as the number of the hook and clamp structures 10 included in the grasping mechanism 100 .

[0099] Specifically, the auxiliary mechanism 300 is the same as the needle pressing structure 20 to improve the unified control of the device. Figures 23 to 25 As shown, in one embodiment, the auxiliary mechanism 300 includes a plurality of components similar to the pressure needle structure 20 arranged in a row, each component includes a connecting rod, a pressure head arranged at one end of the connecting rod and a retaining ring 205 at the other end, and a spring 203 sleeved on the connecting rod. The plurality of connecting rods pass through the connecting member 204 (a connecting beam) to form an integrated structure, and the retaining ring 205 and the pressure head are located on different sides of the connecting member 204.

[0100] In practical applications, the auxiliary mechanism 300 may also be provided with a guide structure 30, such as that in the gripping assembly provided in the first aspect, to limit the left-right shaking of the solder ribbon 500 and improve the positioning accuracy of the solder ribbon 500. The structural design of the auxiliary mechanism 300 reduces the number of parts in the entire solder ribbon handling device while achieving more functions, thus simplifying the device structure and improving the device's operating efficiency.

[0101] Alternatively, as Figures 19 to 21 as well as Figure 26 As shown, the welding ribbon conveying device further includes a lifting mechanism 400 , which is disposed on the mounting plate 200 and can at least drive the auxiliary mechanism 300 to rise or fall.

[0102] Specifically, in this embodiment, the lifting mechanism 400 can at least drive the auxiliary mechanism 300 to rise or fall, so as to press and position the soldering ribbon 500 or press and bond it to the battery cell 700 during the process of the gripping mechanism 100 placing the soldering ribbon 500 .

[0103] In one embodiment, if Figures 24 to 26 As shown, the lifting mechanism 400 includes two second driving members 403 and a connecting plate 401 arranged between the two driving members. A plurality of slots 402 are provided on the connecting plate 401. The pressure needle structure in the auxiliary mechanism 300 is clamped in the slot 402 through the retaining ring 205 on the connecting rod, so that in actual application, the second driving member 403 can drive the connecting plate 401 to rise or fall, so as to realize the rising or falling of the auxiliary mechanism 300.

[0104] In addition, in the above embodiment, multiple lifting mechanisms 400 are provided, and multiple pressure needle structures 20 in the grasping mechanism 100 can also be clamped on one lifting mechanism 400, so that the pressure needle structure 20 in the grasping mechanism 100 and the middle pressure needle structure 20 of the auxiliary mechanism 300 can rise or fall at the same time, thereby improving the integration of the device.

[0105] The following Figures 19 to 21 Taking the provided solder ribbon handling device as an example, the operational relationship between the various mechanisms during the process of grabbing, handling, and placing the solder ribbon 500 is described:

[0106] refer to Figures 11 to 12 , is a schematic diagram of the operation of the gripping mechanism 100 preparing to grip the solder ribbon 500 after the solder ribbon 500 has been slit in the solder ribbon slitting mechanism 600. The solder ribbon 500 is located in the guide groove of the solder ribbon slitting mechanism 600, and the gripping mechanism 100 correspondingly descends to the gripping position. At this time, the hook clamp structure 10 is located in the second position, and the upper surface of the supporting portion 101 of the hook clamp structure 10 is 1-2 mm lower than the back surface of the solder ribbon 500. The pressure plate 202 of the pressure pin structure 20 contacts the upper surface of the guide groove of the solder ribbon slitting mechanism 600, so that the lower surface of the pressure plate 202 is higher than the upper surface of the supporting portion 101. During this process, the gripping mechanism 100 and each pressure pin structure 20 of the auxiliary mechanism 300 have no contact with the solder ribbon 500, and the lifting mechanism 400 is in a low position and has no contact with the retaining ring 205.

[0107] Reference 13 to Figure 14 , which is one of the schematic diagrams of the gripping mechanism 100 gripping and transporting the solder ribbon 500. The gripping mechanism 100 rises until the upper surface of the supporting portion 101 of the hook and clamp structure 10 contacts the lower surface of the solder ribbon 500. Simultaneously, the first driving member 50 drives the hook and clamp structure 10 to the first position, completely resting the lower surface of the solder ribbon 500 on the supporting portion 101. At this point, the position of the lifting mechanism 400 remains unchanged.

[0108] Reference 15 to Figure 16 , which is the second schematic diagram of the gripping mechanism 100 gripping and transporting the solder ribbon 500. The gripping mechanism 100 continues to rise until the solder ribbon 500 is separated from the solder ribbon slitting mechanism 600. During this process, the spring 203 causes the lower surface of the pressing plate 202 to contact the upper surface of the solder ribbon 500, pressing the solder ribbon 500 against the supporting portion 101 of the hook and clamp structure 10. The entire solder ribbon transport device then moves above the battery cell 700.

[0109] Reference 17 to Figure 18 , which is a schematic diagram of the gripping mechanism 100 placing the solder ribbon 500 on the cell 700. When the gripping mechanism 100 descends to a certain height, because the pressure pin structure 20 in the auxiliary mechanism 300 is not constrained by the hook and clamp structure 10, its pressure plate 202 is lower than the pressure plate 202 in the gripping mechanism 100, partially pressing the solder ribbon 500 against the cell 700, thereby securing the position of the solder ribbon 500. At this point, the hook and clamp structure 10 of the solder ribbon gripping device does not need to move to the second position and remains a certain distance (2-3 mm) from the cell 700.

[0110] Furthermore, the lifting mechanism 400 drives each pressing pin structure 20 to lift up, so that it is separated from the soldering ribbon 500, and at the same time the hook and clamp structure 10 moves to the second position, so that the soldering ribbon 500 falls to the surface of the battery cell 700; then the lifting mechanism 400 drives each pressing pin structure 20 to descend, until the pressure plate 202 of the pressing pin structure presses the soldering ribbon 500 on the battery cell 700, and then the entire soldering ribbon conveying device is lowered a certain distance (for example, 1-2 mm), so as to ensure that the soldering ribbon 500 is pressed against the surface of the battery cell 700 (the part of the surface of the battery cell 700 corresponding to the soldering ribbon 500 is coated with glue).

[0111] Subsequently, the entire ribbon transport device rises, detaches from the cell 700, and proceeds to the next cycle. At this point, the hook and clamp structures 10 of the gripping mechanism 100 are in the second position. The bottoms of the pressing pin structures 20 within the gripping mechanism 100 and the pressing pin structures 20 within the auxiliary mechanism 300 are both lower than the upper surface (supporting surface) of the supporting portion 101 of the hook and clamp structures 10, and there is no contact between the pressing pin structures 20 and the hook and clamp structures 10.

[0112] In the above process, the solder ribbon grasping device formed by multiple grasping components can grasp multiple solder ribbons 500 at a time, and there are more grasping positions for each solder ribbon 500, which not only improves the grasping efficiency but also ensures the reliability of grasping the solder ribbon 500. In particular, since the solder ribbon 500 is pressed by the pressing plate 202 and the supporting portion 101 during the transportation process, the reliability of grasping and handling is further improved. In the placement process, the pressing effect of the pressing plate 202 on the solder ribbon 500 can prevent its position from shifting, thereby improving the reliability of the placement of the solder ribbon 500.

[0113] According to the second aspect of the present application, a method for handling a solder strip is provided, which is applied to the solder strip handling device described in the first aspect, wherein the hook and clamp structure 10 has a supporting portion 101, and the pressure needle structure 20 has a pressure plate 202. Figures 11 to 18 , the welding ribbon conveying method includes:

[0114] First, each hook and clamp structure 10 is located at the second position, and the upper surface of each supporting portion 101 is lower than the bottom surface of the welding strip 500, and the lower surface of each pressing plate 202 is higher than the upper surface of the supporting portion 101. Figures 11 to 12 .

[0115] Next, move each hook and clamp structure 10 to the first position, and at the same time, raise it to the position where the upper surface of each supporting portion 101 contacts the lower surface of the soldering ribbon 500, and press the lower surface of each pressing plate 202 against the upper surface of the soldering ribbon 500 to complete the soldering ribbon grabbing. Figures 13 to 16 .

[0116] Finally, after the solder ribbon transport device is moved to the position above the placement of the solder ribbon 500, the hook and clamp structure 10 is lowered until the upper surface of each supporting portion 101 is separated from the lower surface of the solder ribbon 500. At the same time, the hook and clamp structure 10 is moved to the second position so that each pressing plate 202 presses the solder ribbon 500 against the battery cell 700, completing the placement of the solder ribbon 500. Figures 17 and 18 .

[0117] By adopting the above-mentioned method for transporting the soldering ribbon, the soldering ribbon 500 is pressed by the pressure plate 202 and the supporting part 101 during the transport process, thereby improving the reliability of grasping and transporting. In the placement process, the pressure plate 202 has a pressing effect on the soldering ribbon 500, which can avoid its position deviation and improve the reliability of the placement of the soldering ribbon 500.

[0118] In addition, in the above process, one surface of the soldering ribbon 500 is supported on the hook-clamp structure 10, and the other surface is pressed against the hook-clamp structure 10 by the pressure needle structure 20, so that the soldering ribbon 500 can be firmly pressed between the hook-clamp structure 10 and the pressure needle structure 20. During the transportation process, the risk of the soldering ribbon 500 falling can be avoided, thereby improving the reliability of transportation.

[0119] The two surfaces of the soldering ribbon 500 are clamped, which avoids the problem of damage to the soldering ribbon 500 caused by clamping the two sides of the soldering ribbon 500 with clamping claws in conventional technology, thereby improving the safety of grasping and carrying the soldering ribbon 500.

[0120] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0121] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present application. It should be understood by those skilled in the art that the above examples may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A welding ribbon conveying device, characterized in that: include: A gripping assembly and a mounting structure, wherein a plurality of the gripping assemblies are arranged in rows and / or columns on the mounting structure to form a gripping mechanism; The grabbing assembly includes a guide structure, a hook and clamp structure, and a pressure needle structure. The guide structure is provided with a limiting groove. The hook and clamp structure has a first position and a second position relative to the mounting structure. The pressure needle structure is provided on one side of the hook and clamp structure. The pressure needle structure includes a pressure plate, a spring, an air pipe joint and a connecting piece. The pressure plate is connected to the connecting piece via the spring so that at least a portion of the pressure plate can press against the hook clamp structure. A suction hole is provided in the pressure plate. The air pipe joint is connected to the suction hole and can be connected to a pneumatic source. When the hook-and-clamp structure is located at the first position, at least a portion of the corresponding pressure pin structure can be pressed against the hook-and-clamp structure, and the welding strip supported by the hook-and-clamp structure can be located in the limiting groove; When the hook-and-clamp structure is located at the second position, the corresponding pressure needle structure can be separated from the hook-and-clamp structure; The auxiliary mechanism can press against the soldering strip when a soldering strip is pressed between the pressure needle structure and the hook clamp structure, and the pressing force is greater than or equal to the pressing force of the pressure needle structure on the soldering strip.

2. The welding ribbon conveying device according to claim 1, characterized in that: It also includes a mounting plate, two grabbing mechanisms are provided and are respectively fixed at two ends of the first surface of the mounting plate, and the auxiliary mechanism is fixed between the two grabbing mechanisms.

3. The welding ribbon conveying device according to claim 2, characterized in that: The structure of the auxiliary mechanism is the same as that of the pressure needle structure, and the number of the pressure needle structures included therein is the same as the number of the hook and clamp structures included in the grasping mechanism.

4. The welding ribbon conveying device according to claim 2, characterized in that: The welding ribbon conveying device further includes a lifting mechanism, which is disposed on the mounting plate and can at least drive the auxiliary mechanism to rise or fall.

5. The welding ribbon conveying device according to claim 1, characterized in that: The hook-and-clamp structure has a supporting portion, the upper surface of which is higher than the lower surface of the pressure plate, so that when the hook-and-clamp structure is at the first position, at least a portion of the lower surface of the pressure plate can be pressed against the upper surface of the supporting portion.

6. The welding ribbon conveying device according to claim 5, characterized in that: The grab assembly further includes a first driving member, and the hook and clamp structure further includes a connecting portion; The supporting portion is connected to the first driving member through the connecting portion, and the first driving member is used to make the hook and clamp structure be located at the first position or the second position.

7. A method for conveying a solder ribbon, applied to the solder ribbon conveying device according to any one of claims 1 to 6, wherein the hook and clamp structure has a supporting portion, and the pressure needle structure has a pressure plate, characterized in that: The welding ribbon conveying method comprises: Positioning each hook and clamp structure at a second position, with the upper surface of each supporting portion lower than the bottom surface of the welding strip, and the lower surface of each pressing plate higher than the upper surface of the supporting portion; Move each hook and clamp structure to the first position, and simultaneously raise it to a position where the upper surface of each supporting portion contacts the lower surface of the soldering ribbon, and press the lower surface of each pressing plate against the upper surface of the soldering ribbon to complete the soldering ribbon grabbing; The hook and clamp structure is lowered until the upper surface of each supporting part is separated from the lower surface of the welding ribbon, and at the same time, the hook and clamp structure is moved to the second position so that each pressing plate presses the welding ribbon against the battery cell to complete the welding ribbon placement.

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