A wafer cleaning system based on mobile cleaning of transmission equipment

Through a mobile cleaning system based on the transmission equipment, the rolling support of the transmission disk and flexible transmission belt is used, combined with the wafer spray system and flexible brush block, the problems of inefficiency and dirt impact during the wafer cleaning process are solved, and efficient and thorough wafer cleaning is achieved.

CN118782501BActive Publication Date: 2025-09-02ANHUI FULLERDE CHANGJIANG SEMICON MATERIALS CO LTD
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Patent Information

Application Number
CN202411031560.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-07-30
Publication Date
2025-09-02
Estimated Expiration
2044-07-30

AI Technical Summary

Technical Problem

The cleaning process of wafer loading and unloading has inefficiency and inconvenience, and dirt on the wafer cleaning parts affects the cleaning quality.

Method used

A wafer cleaning system based on mobile cleaning of transmission equipment is adopted, and a transmission disk, rolling support and flexible conveyor belt are used to provide rolling support, and a double-sided cleaning is combined with a wafer spray system and a flexible brush block to achieve the wafer removal while cleaning.

Benefits of technology

It improves the efficiency and quality of wafer cleaning, ensures that the wafer can be cleaned simultaneously during the transmission process, avoids dirt contamination, and improves the thoroughness and convenience of cleaning.

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Abstract

The present invention discloses a wafer cleaning system based on mobile cleaning of a transmission device, specifically relating to the field of wafer cleaning technology, comprising a cleaning hood, a transmission disk provided in the cleaning hood, a plurality of rolling supports provided on the transmission disk, each rolling support including a pair of rolling rollers rotatably connected to one side of the transmission disk, and the pair of rolling rollers being used to place wafers, a hollow rotating shaft being fixedly connected on both sides of the transmission disk, the transmission disk being rotatably connected to the cleaning hood via the hollow rotating shaft, and a rotating device for driving the transmission disk to rotate being provided on the cleaning hood; the above-mentioned wafer cleaning system based on mobile cleaning of a transmission device also includes a rotary drive mechanism, a rolling support structure, a wafer spray system, a support plate and a brush block cleaning system. The present invention solves the problems of low cleaning efficiency and inconvenience in the process of wafer loading and unloading cleaning, and the problem that dirt on the wafer cleaning parts easily affects the cleaning quality of the wafers.
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Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning, and more particularly to a wafer cleaning system based on mobile cleaning of a transmission device. Background Art

[0002] A wafer is a silicon chip used in the manufacture of silicon semiconductor integrated circuits. Due to its round shape, it is called a silicon wafer. In semiconductor integrated circuit manufacturing, wet cleaning is a key process for achieving high-quality products. Cleaning equipment has gradually shifted from batch cleaning to single-wafer cleaning to improve cleaning quality and, in turn, yield.

[0003] In related technologies, wafer cleaning equipment primarily uses two rotatable cleaning brushes to act on both sides of the wafer, and cooperates with a spray system to spray cleaning liquid to achieve double-sided cleaning of a single wafer. However, the inventor believes that when a single wafer is cleaned, the loading and unloading of the wafer must be completed before the loading and unloading can be replaced. This process has the problems of low cleaning efficiency and inconvenience. In addition, the brush body used for wafer cleaning is prone to accumulate cleaning dirt over long periods of use, which can easily affect the cleaning quality of the wafer. Based on this, the present application provides a wafer cleaning system based on mobile cleaning of a transmission device to solve the problems of the prior art. Summary of the Invention

[0004] In order to overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides a wafer cleaning system based on mobile cleaning of a transmission device. The technical problem to be solved by the present invention is: the process of wafer loading and unloading cleaning has the problems of low cleaning efficiency and inconvenience, and the dirt on the wafer cleaning parts easily affects the cleaning quality of the wafer.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a wafer cleaning system based on mobile cleaning of a transfer device, comprising a cleaning cover, a transfer disk provided in the cleaning cover, a plurality of rolling supports provided on the transfer disk, each rolling support including a pair of rolling rollers rotatably connected to one side of the transfer disk, and the pair of rolling rollers being used to place wafers, a hollow rotating shaft being fixedly connected to both sides of the transfer disk, the transfer disk being rotatably connected to the cleaning cover via the hollow rotating shaft, and a rotating device for driving the transfer disk to rotate being provided on the cleaning cover;

[0006] a rotation drive mechanism, the rotation drive mechanism being arranged on the transmission disc and being used for driving one of the rolling rollers in each rolling support member to rotate;

[0007] A rolling support structure, the rolling support structure includes an outer holding frame, an inner holding frame, a pair of fixed plates and a pair of driven rollers, the outer holding frame is fixedly mounted in the cleaning cover, the inner holding frame is arranged on the inner side of the outer holding frame, a pair of fixed plates are fixedly connected to the outer holding frame and the inner holding frame, the driven roller is rotatably connected to the fixed plates, a pair of driven rollers are transmission-connected with a flexible transmission belt, and the flexible transmission belt is slidably connected to the outer holding frame and the inner holding frame, and the flexible transmission belt is movably connected to the wafer;

[0008] A wafer spraying system, the number of which is a pair and which is arranged in the cleaning hood, the wafer spraying system being used to spray cleaning liquid onto both sides of the wafer;

[0009] A pair of support plates, each of which is fixedly connected to the inner wall of the cleaning cover, a second rotating device being slidably connected to the support plate, a flexible brush block being fixedly connected to the output end of the second rotating device, a telescopic device for telescoping the second rotating device being fixedly connected to the cleaning cover, a pair of baffles being provided on the outer side of the flexible brush block, and an opening and closing drive assembly being provided on the baffles and the second rotating device; and

[0010] A brush block cleaning system is provided on the transmission disc and is used for spraying cleaning water onto the flexible brush block.

[0011] In a preferred embodiment, the rotary drive mechanism includes an annular rack, several gear 1s and several gear 2s, the annular rack is fixedly mounted in the cleaning cover, the gear 1 is rotatably connected to the other side of the transmission disk, the gear 2 is fixedly connected to the shaft end of the rolling roller, the gear 1 is in meshing contact with the annular rack, and the gear 2 is in meshing connection with the gear 1.

[0012] In a preferred embodiment, a pair of side panels are fixedly connected to the outer retaining frame and the inner retaining frame, and the side panels are fixedly connected to the inner wall of the cleaning cover. A driven roller 2 is rotatably connected to the pair of side panels, and the flexible transmission belt is transmission-connected to the driven roller 2. A material port is formed at the top of both the outer retaining frame and the inner retaining frame.

[0013] In a preferred embodiment, a transmission protrusion is provided on the path for retaining the inner annular surface of the inner frame.

[0014] In a preferred embodiment, a limiting roller for tensioning the flexible transmission belt is rotatably connected to the inner retaining frame, and the number of the limiting rollers is multiple.

[0015] In a preferred embodiment, a pair of baffles are fixedly connected to a connecting plate, and the pair of baffles are arranged in an outward-octagonal shape. The bottom of the rotating device 2 is fixedly connected to a slide, and the slide is slidably connected to the support plate. The opening and closing drive assembly includes a linear rack 1, a gear 3 and a linear rack 2. The linear rack 1 is fixedly connected to the slide, the gear 3 is meshed and connected to the linear rack 1, and the gear 3 is rotatably connected to the support plate, the linear rack 2 is meshed and connected to the gear 3, the baffle is fixedly connected to the linear rack 2, and the linear rack 2 is slidably connected to the support plate.

[0016] In a preferred embodiment, the brush block cleaning system includes a water collection tray, multiple water pipes, multiple solenoid valves and multiple water spray trays, the water collection tray is fixedly connected to the other side of the transmission tray, the water pipe is fixedly connected to the water collection tray, the solenoid valve is arranged on the water pipe, and the water spray tray is fixedly connected to one end of the water pipe.

[0017] In a preferred embodiment, when one of the water spray discs is disposed between a pair of flexible brush blocks, two pairs of baffles located on both sides of the wafer are in contact with each other;

[0018] When a pair of flexible brush blocks contacts the wafer, two pairs of baffles located on both sides of the wafer reserve a cleaning gap.

[0019] In a preferred embodiment, a rotary joint is provided at one end of one hollow rotating shaft, a conductive slip ring is provided at one end of the other hollow rotating shaft, a valve controller is provided on the transmission disk, and the conductive slip ring is electrically connected to the solenoid valve through the valve controller.

[0020] In a preferred embodiment, it also includes a conveyor belt cleaning system for cleaning the flexible conveyor belt, the conveyor belt cleaning system includes a pipe and a water spray rack, the pipe is fixedly arranged on the cleaning cover, the water spray rack is fixedly connected to one end of the pipe, and the spraying direction of the water spray rack corresponds to the inner side of the flexible conveyor belt.

[0021] In a preferred embodiment,

[0022] Technical effects and advantages of the present invention:

[0023] The present invention provides a wafer cleaning system based on mobile cleaning of transmission equipment, which utilizes a transmission disk to move the wafer to realize the cleaning process, and cooperates with rolling supports and a flexible transmission belt with a special path to provide rolling support for the movement path of the wafer. During the rotation of the transmission disk, the wafer can be adaptively rotated, and cooperates with the spraying of cleaning liquid of the wafer spray system and the flexible brush block based on the center position of the wafer movement path. This can improve the thoroughness of double-sided cleaning of single-piece wafers, and because the wafer can realize transmission cleaning, and the limit of wafer transmission is easy to act and release, the wafer can meet the effect of cleaning and moving materials at the same time, which can improve the efficiency of wafer cleaning.

[0024] The present invention provides a wafer cleaning system based on mobile cleaning of transmission equipment. By setting up a brush block cleaning system, a pair of flexible brush blocks can achieve the effect of relative movement. While the flexible brush blocks are conveniently applied to the wafer surface to realize rotational cleaning, the brush block cleaning system can spray cleaning water to the opposite surfaces of a pair of rotating flexible brush blocks, which can facilitate the cleaning of the flexible brush blocks to improve the quality of the wafers. Since the cleaning of the wafers and the cleaning of the flexible brush blocks are cooperative, the progress of the wafer cleaning can be guaranteed. In addition, by arranging a baffle in an outward-octagonal shape on the outer side of the flexible brush block, the use action of the flexible brush block can adaptively control the opening and closing of the baffle through the opening and closing drive component, which can effectively avoid the flexible brush block from contaminating the cleaned wafers during cleaning.

[0025] The present invention provides a wafer cleaning system based on mobile cleaning of a transmission device. By setting up a transmission belt cleaning system for cleaning a flexible transmission belt, the cleanliness of the flexible transmission belt can be improved to avoid contamination of the wafer cleaning waste liquid caused by the wafer contacting the flexible transmission belt. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic structural diagram of the overall first perspective of the present invention.

[0027] Figure 2 It is a schematic diagram of the overall second viewing angle structure of the present invention.

[0028] Figure 3 For the present invention Figure 1 Schematic diagram of the overall structure without the cleaning cover.

[0029] Figure 4 For the present invention Figure 3 Enlarged view of part A in the middle.

[0030] Figure 5 For the present invention Figure 3 side view.

[0031] Figure 6 It is a structural schematic diagram of the rolling support structure of the present invention.

[0032] Figure 7 It is a structural schematic diagram of the retaining inner frame of the present invention.

[0033] Figure 8 This is a schematic diagram of the connection between the flexible brush block, the opening and closing drive assembly, and the baffle of the present invention.

[0034] Figure 9 For the present invention Figure 8 Enlarged view of part B in the middle.

[0035] Figure 10 It is a structural schematic diagram of the scrubbing and cleaning system of the present invention.

[0036] The accompanying drawings are marked as follows: 1. cleaning cover; 2. transmission plate; 3. hollow shaft; 4. rolling support; 5. rotary drive mechanism; 51. ring rack; 52. gear 1; 53. gear 2; 6. rolling support structure; 61. outer retaining frame; 62. inner retaining frame; 621. transmission protrusion; 63. fixing plate; 64. driven roller 1; 7. flexible transmission belt; 8. limiting roller; 9. wafer spray system; 10. support plate; 11. rotating device 2; 12. flexible brush block; 13. telescopic device; 14. Baffle; 15. Opening and closing drive assembly; 151. Linear rack 1; 152. Gear 3; 153. Linear rack 2; 16. Brush block cleaning system; 161. Water collection tray; 162. Water pipe; 163. Solenoid valve; 164. Water spray tray; 17. Conductive slip ring; 171. Valve controller; 18. Rotary joint; 19. Side plate; 191. Driven roller 2; 20. Slide; 21. Connecting plate; 22. Conveyor belt cleaning system; 221. Pipeline; 222. Water spray rack; 23. Rotating device 1. DETAILED DESCRIPTION

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention. Example

[0038] See also Figures 1-10The present invention provides a wafer cleaning system based on mobile cleaning of a transmission equipment, comprising a cleaning hood 1, which is hollow and can flow out cleaning pollutants from its bottom. The pollutants can be collected centrally in conjunction with a collecting device. A transmission tray 2 is arranged in the cleaning hood 1, and a plurality of rolling supports 4 are arranged on the transmission tray 2. Each rolling support 4 includes a pair of rolling rollers rotatably connected to one side of the transmission tray 2, and the pair of rolling rollers are used to place wafers, and rolling grooves for supporting wafers are provided on the rolling rollers. By taking and placing wafers, the position of the rolling rollers can facilitate rapid loading and unloading of wafers. Hollow rotating shafts 3 are fixedly connected on both sides of the transmission tray 2, and the transmission tray 2 is rotatably connected to the cleaning hood 1 through the hollow rotating shaft 3. A rotating device 23 for driving the transmission tray 2 to rotate is provided on the cleaning hood 1. The rotating device 23 can use a rotating motor in conjunction with a belt transmission mechanism or a gear transmission mechanism to drive the transmission tray 2 to rotate, so that the transmission tray 2 can drive the wafer to achieve a transmission-type cleaning effect at a low and uniform speed.

[0039] The above-mentioned wafer cleaning system based on mobile cleaning of a transmission device also includes a rotation drive mechanism 5, a rolling support structure 6, a wafer spray system 9, a support plate 10 and a brush block cleaning system 16.

[0040] The rotary drive mechanism 5 includes an annular rack 51, several gear ones 52 and several gear twos 53. The annular rack 51 is fixedly mounted in the cleaning cover 1, gear one 52 is rotatably connected to the other side of the transmission disk 2, and gear two 53 is fixedly connected to the shaft end of the rolling roller. Gear one 52 is in meshing contact with the annular rack 51, and gear two 53 is in meshing connection with gear one 52. In order to ensure the efficiency of the wafer rotation on the rolling roller, gear two 53 and gear one 52 can adopt a combination of speed-increasing gears to increase the rotation frequency of the wafer cleaning.

[0041] Specifically, when the wafer is placed on a pair of rolling rollers and the transmission disk 2 is driven to rotate by the rotating device 1 23, the gear 1 52 can be rotated until the gear 1 52 contacts the annular rack 51, and then the gear 1 52 can engage the gear 2 53 to drive a rolling roller used to support the wafer to rotate, so that the wafer can be rotated for cleaning.

[0042] The rolling support structure 6 includes an outer holding frame 61, an inner holding frame 62, a pair of fixed plates 63 and a pair of driven rollers 64. The outer holding frame 61 is fixedly mounted in the cleaning cover 1, the inner holding frame 62 is arranged on the inner side of the outer holding frame 61, a pair of fixed plates 63 are fixedly connected to the outer holding frame 61 and the inner holding frame 62, the driven roller 64 is rotatably connected to the fixed plate 63, and a flexible transmission belt 7 is transmission-connected to the pair of driven rollers 64, and the flexible transmission belt 7 is slidably connected to the outer holding frame 61 and the inner holding frame 62, and the flexible transmission belt 7 is movably connected to the wafer.

[0043] A pair of side panels 19 are fixedly connected to the outer retaining frame 61 and the inner retaining frame 62, and the side panels 19 are fixedly connected to the inner wall of the cleaning cover 1. The side panels 19 can be used to block the position of the flexible conveyor belt 7 on the outer retaining frame 61 and the inner retaining frame 62, so as to prevent the wafer cleaning dirt from contaminating the flexible conveyor belt 7 at this position. A pair of side panels 19 are rotatably connected to a driven roller 2 191, and the flexible conveyor belt 7 is transmission-connected to the driven roller 2 191. The driven roller 2 191 can make the flexible conveyor belt 7 tensioned and set on the rolling support structure 6. A material port is formed at the top of the outer retaining frame 61 and the inner retaining frame 62, and the position of the material port can facilitate the removal and placement of wafers onto the rolling support 4.

[0044] A transmission protrusion 621 is provided on the path of the inner ring surface of the inner frame 62 . The transmission protrusion 621 is arranged in an arc shape. The transmission protrusion 621 can prevent the flexible transmission belt 7 from sliding.

[0045] The inner frame 62 is kept in rotation and is connected to a limiting roller 8 for tensioning the flexible conveyor belt 7. There are multiple limiting rollers 8, and the limiting rollers 8 can roll and contact the flexible conveyor belt 7. The limiting rollers 8 can keep the flexible conveyor belt 7 on the inner frame 62 in a fixed shape and prevent transmission disengagement. By shaping the path of the flexible conveyor belt 7 on the inner frame 62, the wafer on the rolling roller can contact the flexible conveyor belt 7 when it rotates. The flexible conveyor belt 7 can provide a rolling fulcrum for the wafer, and the three rolling fulcrums formed by the two rolling rollers can stabilize the rotation state of the wafer.

[0046] Specifically, when the transmission disk 2 drives the wafer on the rolling support structure 6 to be transported on a circular path, until the circumferential side of the wafer contacts the flexible transmission belt 7, and at the same time, the rotating drive mechanism 5 drives the wafer to rotate through the rolling roller, the flexible transmission belt 7 can slide on the retaining outer frame 61 and the retaining inner frame 62, and adaptively transmit on the driven roller 1 64 and the driven roller 2 191, so that three rolling fulcrums can be obtained when the wafer rotates, and the wafer rotation cleaning can be more stable.

[0047] The number of wafer spray systems 9 is a pair, and they are arranged in the cleaning cover 1. The wafer spray system 9 is used to spray cleaning liquid on both sides of the wafer. The wafer spray system 9 can be arranged in the cleaning cover 1 through a mounting member. The wafer spray system 9 is an existing technology for wafer spray cleaning. It mainly sprays cleaning liquid on both sides, so it will not be described in detail here.

[0048] The number of the support plates 10 is a pair, and the support plates 10 are fixedly connected to the inner wall of the cleaning cover 1. A rotating device 11 is slidably connected to the support plate 10, and the rotating device 11 also adopts a rotating motor. A flexible brush block 12 is fixedly connected to the output end of the rotating device 11. The flexible brush block 12 rotates and acts on the wafer surface, and can be rotated and cleaned in conjunction with the cleaning liquid. When multiple wafers rotate, the centers of multiple circles are on the same circular path, and because the flexible brush block 12 can pass through the center of the moving wafer, the rotation of the wafer and the rotation of the flexible brush block 12 can thoroughly clean the wafer surface. A telescopic device 13 for telescoping the rotating device 11 is fixedly connected to the cleaning cover 1. The telescopic device 13 adopts a telescopic motor. A pair of baffles 14 are provided on the outside of the flexible brush block 12. The baffles 14 can block the flexible brush block 12 during self-cleaning to prevent cleaning dirt from contaminating the cleaned wafers. An opening and closing drive component 15 is provided on the baffle 14 and the rotating device 11.

[0049] A pair of baffles 14 are fixedly connected to a connecting plate 21, and a pair of baffles 14 are arranged in an outward-octagonal shape. The bottom of the rotating device 2 11 is fixedly connected to a slide 20, and the slide 20 is slidably connected to the support plate 10. The opening and closing drive assembly 15 includes a linear rack 151, a gear 3 152 and a linear rack 2 153. The linear rack 151 is fixedly connected to the slide 20, the gear 3 152 is meshedly connected to the linear rack 151, and the gear 3 152 is rotatably connected to the support plate 10, the linear rack 2 153 is meshedly connected to the gear 3 152, the baffle 14 is fixedly connected to the linear rack 2 153, and the linear rack 2 153 is slidably connected to the support plate 10. In this arrangement, a slide groove is provided on the linear rack 2 153, and the linear rack 2 153 is slidably connected to the support plate 10 through the slide groove.

[0050] The brush block cleaning system 16 includes a water collecting tray 161, multiple water pipes 162, multiple solenoid valves 163 and multiple water spray trays 164. Water spray holes are provided on both sides of the water spray tray 164. The water collecting tray 161 is fixedly connected to the other side of the transmission tray 2. The water pipe 162 is fixedly connected to the water collecting tray 161. The solenoid valve 163 is arranged on the water pipe 162. The water spray tray 164 is fixedly connected to one end of the water pipe 162. The solenoid valve 163 can be used to control the on and off of the water supply from the water pipe 162 to the water spray tray 164.

[0051] When one of the water spray plates 164 is set between a pair of flexible brush blocks 12, the two pairs of baffles 14 on both sides of the wafer are connected; when a pair of flexible brush blocks 12 are in contact with the wafer, the two pairs of baffles 14 on both sides of the wafer reserve a cleaning gap.

[0052] A rotary joint 18 is provided at one end of one of the hollow rotating shafts 3, and a water pump can be connected to the rotary joint 18. In this way, the rotation of the transmission disk 2 can effectively store water in the water collection disk 161. A conductive slip ring 17 is provided at one end of the other hollow rotating shaft 3. A valve controller 171 is provided on the transmission disk 2. The conductive slip ring 17 is electrically connected to the solenoid valve 163 through the valve controller 171. The conductive slip ring 17 can be passed through the hollow rotating shaft 3 through a wire and then electrically connected to the valve controller 171. The valve controller 171 can be electrically connected to several solenoid valves 163 through corresponding wires. The conductive slip ring 17 can be embedded in one end of the hollow rotating shaft 3 through a mounting part. The conductive slip ring 17 can allow the solenoid valve 163 to be energized and controlled when the transmission disk 2 rotates. This makes it convenient for the valve controller 171 to energize and control the switch of any solenoid valve 163, so as to flexibly open and close the water spraying operation of the water spraying disk 164.

[0053] Specifically, when the transmission disk 2 rotates and drives one of the water spray disks 164 to be located between a pair of flexible brush blocks 12, the flexible brush block 12 on the rotating device 2 11 can be driven to move outward through the telescopic device 13, and the slide 20 can drive the linear rack 151 to engage the gear 3 152, and the gear 3 152 can drive the linear rack 2 153 to slide on the support plate 10, so that the horizontally arranged baffles 14 can approach and dock with each other, so that the solenoid valve 163 controlling the area of ​​the water spray disk 164 is opened, and the external pressurized water supply can spray cleaning water to the opposite surfaces of a pair of flexible brush blocks 12 through the water spray disk 164, and the flexible brush block 12 is rotated through the rotating device 2 11, which can accelerate the separation of pollutants on the flexible brush block 12 by centrifugal water washing.

[0054] After the flexible brush block 12 has completed cleaning and the wafer is close to the position of the flexible brush block 12, the telescopic device 13 can drive the corresponding flexible brush block 12 to move inward until it contacts the side of the wafer. At this time, the opening and closing drive component 15 can drive the baffle 14 set parallel to the beam area away, and a cleaning gap for the wafer can be reserved between the baffles 14 to allow the wafer to pass through. The flexible brush block 12 can then clean and contact the circularly movable and rotatable wafer, because the flexible brush block 12 can pass through the center of the wafer, so that the wafer can be thoroughly cleaned.

[0055] It is worth noting that in order to achieve timely response of the telescopic device 13, the second rotating device 11 and the external water pump working signal, a photoelectric module can be set in the cleaning cover 1 to detect the position of the wafer to output the driving signal. Example

[0056] See also Figure 5The difference between this embodiment and embodiment 1 is that a wafer cleaning system based on mobile cleaning of a conveyor device also includes a conveyor belt cleaning system 22 for cleaning the flexible conveyor belt 7. The conveyor belt cleaning system 22 can be set in multiple places to increase the cleaning range. The conveyor belt cleaning system 22 includes a pipe 221 and a water spray rack 222. The pipe 221 is fixedly arranged on the cleaning cover 1, and the water spray rack 222 is fixedly connected to one end of the pipe 221. The spray direction of the water spray rack 222 corresponds to the inner side of the flexible conveyor belt 7.

[0057] Specifically, since the dirt cleaned from the wafer during cleaning will fall onto the inner surface of the flexible conveyor belt 7, and the setting of the transmission protrusion 621 can make the interior of the flexible conveyor belt 7 arched, which can reduce the retention rate of cleaning pollutants, the pipe 221 is connected to an external water pump, and the flexible conveyor belt 7 near the wafer cleaning is flushed with water through the water spray rack 222, and the residual dirt on the flexible conveyor belt 7 is reduced. In this way, the proximity of the flexible conveyor belt 7 to the wafer can be ensured.

[0058] It is worth noting that in other embodiments, when cleaning the flexible conveyor belt 7 for cleanliness, the flexible conveyor belt 7 can also be cleaned by means of jet and scraping, such as using an air pump for blowing and a cleaning brush for scraping, which all fall within the scope of protection of this application.

Claims

1. A wafer cleaning system based on mobile cleaning of a transfer device, comprising a cleaning cover (1), a transfer tray (2) provided in the cleaning cover (1), and a plurality of rolling supports (4) provided on the transfer tray (2), characterized in that: Each rolling support member (4) includes a pair of rolling rollers rotatably connected to one side of the transmission disk (2), and the pair of rolling rollers are used to place wafers, and both sides of the transmission disk (2) are fixedly connected to a hollow rotating shaft (3), and the transmission disk (2) is rotatably connected to the cleaning cover (1) through the hollow rotating shaft (3), and the cleaning cover (1) is provided with a rotating device (23) for driving the transmission disk (2) to rotate; A rotary drive mechanism (5), the rotary drive mechanism (5) being arranged on the transmission disc (2), and the rotary drive mechanism (5) being used to drive one of the rolling rollers in each rolling support member (4) to rotate; A rolling support structure (6), wherein the rolling support structure (6) comprises an outer holding frame (61), an inner holding frame (62), a pair of fixed plates (63) and a pair of driven rollers (64), wherein the outer holding frame (61) is fixedly mounted in the cleaning cover (1), the inner holding frame (62) is arranged on the inner side of the outer holding frame (61), the pair of fixed plates (63) are fixedly connected to the outer holding frame (61) and the inner holding frame (62), the driven rollers (64) are rotatably connected to the fixed plates (63), a flexible transmission belt (7) is transmission-connected to the pair of driven rollers (64), and the flexible transmission belt (7) is slidably connected to the outer holding frame (61) and the inner holding frame (62), and the flexible transmission belt (7) is movably connected to the wafer; A wafer spraying system (9), wherein the number of the wafer spraying systems (9) is a pair and the wafer spraying systems (9) are arranged in the cleaning cover (1), and the wafer spraying system (9) is used to spray cleaning liquid onto both sides of the wafer; A pair of support plates (10) are provided, and the support plates (10) are fixedly connected to the inner wall of the cleaning cover (1); a second rotating device (11) is slidably connected to the support plate (10); a flexible brush block (12) is fixedly connected to the output end of the second rotating device (11); a telescopic device (13) for telescoping the second rotating device (11) is fixedly connected to the cleaning cover (1); a pair of baffles (14) are provided on the outer side of the flexible brush block (12); an opening and closing drive assembly (15) is provided on the baffles (14) and the second rotating device (11); and A brush block cleaning system (16) is provided on the transmission disc (2), and the brush block cleaning system (16) is used for spraying cleaning water onto the flexible brush block (12).

2. The wafer cleaning system based on mobile cleaning of a transmission device according to claim 1, characterized in that: The rotary drive mechanism (5) comprises an annular rack (51), a plurality of gears 1 (52) and a plurality of gears 2 (53), wherein the annular rack (51) is fixedly mounted in the cleaning cover (1), the gear 1 (52) is rotatably connected to the other side of the transmission disc (2), the gear 2 (53) is fixedly connected to the shaft end of the rolling roller, the gear 1 (52) is in meshing contact with the annular rack (51), and the gear 2 (53) is in meshing connection with the gear 1 (52).

3. The wafer cleaning system based on mobile cleaning of a transmission device according to claim 1, characterized in that: A pair of side plates (19) are fixedly connected to the outer retaining frame (61) and the inner retaining frame (62), and the side plates (19) are fixedly connected to the inner wall of the cleaning cover (1). A driven roller 2 (191) is rotatably connected to the pair of side plates (19), and the flexible transmission belt (7) is transmission-connected to the driven roller 2 (191). A material port is formed at the top of each of the outer retaining frame (61) and the inner retaining frame (62).

4. According to the wafer cleaning system based on mobile cleaning of a transmission device as claimed in claim 1, a transmission protrusion (621) is provided on the path of the inner ring surface of the inner frame (62).

5. The wafer cleaning system based on mobile cleaning of a transmission device according to claim 1, characterized in that: The retaining inner frame (62) is rotatably connected to a limiting roller (8) for tensioning the flexible transmission belt (7), and the number of the limiting rollers (8) is multiple.

6. The wafer cleaning system based on mobile cleaning of a transmission device according to claim 3, characterized in that: A pair of baffles (14) are fixedly connected to a connecting plate (21), and the pair of baffles (14) are arranged in an outward-octagonal shape. The bottom of the rotating device 2 (11) is fixedly connected to a slide (20), and the slide (20) is slidably connected to the support plate (10). The opening and closing drive component (15) includes a linear rack 1 (151), a gear 3 (152) and a linear rack 2 (153). The linear rack 1 (151) is fixedly connected to the slide (20), the gear 3 (152) is meshedly connected to the linear rack 1 (151), and the gear 3 (152) is rotatably connected to the support plate (10), the linear rack 2 (153) is meshedly connected to the gear 3 (152), the baffle (14) is fixedly connected to the linear rack 2 (153), and the linear rack 2 (153) is slidably connected to the support plate (10).

7. The wafer cleaning system based on mobile cleaning of a transmission device according to claim 6, characterized in that: The brush block cleaning system (16) comprises a water collecting tray (161), a plurality of water pipes (162), a plurality of solenoid valves (163) and a plurality of water spray trays (164), wherein the water collecting tray (161) is fixedly connected to the other side of the transmission tray (2), the water pipes (162) are fixedly connected to the water collecting tray (161), the solenoid valves (163) are arranged on the water pipes (162), and the water spray tray (164) is fixedly connected to one end of the water pipes (162).

8. The wafer cleaning system based on mobile cleaning of a transmission device according to claim 7, characterized in that: When one of the water spray discs (164) is disposed between a pair of flexible brush blocks (12), two pairs of baffles (14) located on both sides of the wafer are in contact with each other; When a pair of flexible brush blocks (12) are in contact with the wafer, two pairs of baffles (14) located on both sides of the wafer reserve cleaning gaps.

9. The wafer cleaning system based on mobile cleaning of a transmission device according to claim 7, characterized in that: A rotary joint (18) is provided at one end of one of the hollow rotating shafts (3), and a conductive slip ring (17) is provided at one end of the other hollow rotating shaft (3). A valve controller (171) is provided on the transmission disk (2), and the conductive slip ring (17) is electrically connected to the solenoid valve (163) via the valve controller (171).

10. The wafer cleaning system based on mobile cleaning of a transmission device according to claim 1, characterized in that: The invention also includes a conveyor belt cleaning system (22) for cleaning the flexible conveyor belt (7), wherein the conveyor belt cleaning system (22) includes a pipe (221) and a water spray rack (222), wherein the pipe (221) is fixedly provided on the cleaning cover (1), and the water spray rack (222) is fixedly connected to one end of the pipe (221), and the spraying direction of the water spray rack (222) corresponds to the inner side surface of the flexible conveyor belt (7).

Citation Information

Patent Citations

  • Wafer vertical cleaning device and method

    CN114975191A

  • Wafer cleaning device and cleaning method

    CN117855102A