Liquid cooling system

Abstract

The present invention relates to the field of infrastructure technology, and provides a liquid cooling system comprising: a circulation device, a server cabinet, and at least one cold plate device. The circulation device comprises a liquid supply pipe and a liquid return pipe; the liquid supply pipe is connected to the cold plate device, and is used for cooling liquid to flow into the cold plate device; the liquid return pipe is connected to the server cabinet, and is used for cooling liquid to flow out of the server cabinet to the circulation device through the liquid return pipe; at least one heating element is provided in the server cabinet; the cold plate device is fixed above a selected heating element in the server cabinet; the cold plate device is provided with a non-sealed portion, and the cooling liquid flows from the non-sealed portion into the server cabinet, thereby cooling other heating elements. In this way, the cooling effect of the selected heating element can be improved, and no air cooling part needs to be added to the server.

Description

Technical Field

[0001] The present invention relates to the technical field of infrastructure, and in particular to a liquid cooling system. Background Art

[0002] The rapid development of high-density computing has led to higher requirements for heat dissipation in data center servers. As traditional air cooling increasingly fails to meet these needs, users are turning to liquid cooling technology. Currently, the main liquid cooling technologies include immersion cooling and cold plate cooling. Cold plate cooling involves placing a cold plate above the primary heat-generating components, removing heat from them through a coolant flow. Heat from secondary heat-generating components is removed through air cooling. Immersion cooling involves immersing the entire server in a coolant, allowing the flow of coolant to remove heat from the server's heat-generating components.

[0003] However, both of these liquid cooling technologies have their drawbacks. With cold plate cooling, because the cold plate is located at the primary heat-generating components rather than covering all heat-generating components in the server, secondary heat-generating components require additional heat dissipation equipment, increasing heat dissipation costs. With immersion cooling, due to factors such as viscosity, the coolant's flow rate slows down when it reaches primary heat-generating components such as the CPU (Central Processing Unit), preventing rapid heat dissipation from these components, thus impacting the coolant's ability to cool these components. Furthermore, since the heat dissipation from primary heat-generating components is higher than that from secondary heat-generating components, immersion cooling dissipates heat from all components simultaneously when the server is submerged. Consequently, the cooling effect on the primary heat-generating components is poor when immersion cooling is used. Summary of the Invention

[0004] The present invention provides a liquid cooling system to solve the defect in the prior art that the cooling effect of the main heating element and the secondary heating element cannot be guaranteed at the same time, so that the cooling effect of the main heating element and the secondary heating element can be better during the cooling process of the data center server.

[0005] The present invention provides a liquid cooling system comprising a circulation device, a server cabinet and at least one cold plate device;

[0006] The circulation device includes a liquid supply pipe and a liquid return pipe; the liquid supply pipe is connected to the cold plate device, and is used for cooling liquid to flow into the cold plate device; the liquid return pipe is connected to the server cabinet, and is used for cooling liquid to flow out of the server cabinet to the circulation device through the liquid return pipe;

[0007] At least one heating element is provided in the server cabinet;

[0008] The cold plate device is fixed above the selected heating element in the server cabinet; the cold plate device is provided with a non-sealed portion, and the cooling liquid flows into the server cabinet from the non-sealed portion.

[0009] According to the present invention, there is provided a liquid cooling system, wherein the cold plate device comprises a thermal contact material base and a housing;

[0010] The thermal contact material base is attached above the selected heating element in the server cabinet;

[0011] The shell is communicated with the liquid supply pipe; the shell is arranged on the thermal contact material base, and the non-sealed portion includes one or more holes arranged on the shell.

[0012] According to the present invention, a liquid cooling system is provided, wherein a gap exists at the connection between the shell and the thermal contact material base; and the non-sealed portion further comprises the gap.

[0013] According to the present invention, a liquid cooling system is provided, wherein at least one server board is provided in a server cabinet, and the heating element is provided on the server board; the thermal contact material base is fixed to a main heating area and covers the main heating element; the main heating area is the area on the server board where the main heating element is provided, and the main heating element is a heating element in the server cabinet whose heat generation is higher than a preset threshold.

[0014] According to the present invention, a liquid cooling system is provided, wherein the shell is detachably connected to the thermal contact material base.

[0015] According to the present invention, a liquid cooling system is provided, wherein the thermal contact material base is provided with a first mounting hole, and the shell is provided with a second mounting hole; the first mounting hole and the second mounting hole are arranged opposite to each other; the first mounting hole and the second mounting hole are connected by a connecting component so that the shell can be detachably connected above the thermal contact material base.

[0016] According to the present invention, a liquid cooling system is provided, wherein the connection height between the liquid return pipe and the server cabinet is at a preset height, and the preset height satisfies the condition that the heat generating components in the server cabinet are immersed before the cooling liquid flows out of the liquid return pipe.

[0017] According to the present invention, a liquid cooling system is provided, wherein the circulation device further comprises:

[0018] A heat exchange unit is connected to the liquid supply pipe and the liquid return pipe; the heat exchange unit is used to exchange heat for the coolant flowing out of the liquid return pipe and allow the coolant after heat exchange to flow into the liquid supply pipe.

[0019] According to the present invention, there is provided a liquid cooling system, wherein the circulation device further comprises a manifold and a cooling capacity distribution unit;

[0020] The manifold is respectively connected to the heat exchange unit, the liquid supply pipe, the liquid return pipe and the cooling distribution unit; the manifold is used to input the cooling liquid determined by the cooling distribution unit into the cold plate device through the liquid supply pipe.

[0021] According to the present invention, there is provided a liquid cooling system, wherein the cooling capacity distribution unit comprises a water pump and a heat exchanger;

[0022] The water pump is connected to the heat exchanger and the manifold respectively;

[0023] The heat exchanger is used to exchange heat for the coolant input from the manifold, and to transport the heat-exchanged coolant to the manifold via the water pump.

[0024] The present invention provides a liquid cooling system comprising a circulation device, a server cabinet, and a cold plate device. Multiple heating elements are disposed within the server cabinet. The cold plate device is secured above the heating elements within the server cabinet. The cold plate device includes an unsealed portion for coolant to flow from the unsealed portion into the server cabinet. Furthermore, a circulation device comprising a liquid supply pipe and a liquid return pipe is provided. The liquid supply pipe communicates with the cold plate device within the server cabinet for coolant to flow into the cold plate device. The liquid return pipe communicates with the server cabinet for coolant to flow out of the server cabinet. Thus, by placing the cold plate device above the heating elements, the coolant, upon reaching the cold plate device, first reaches the heating elements, cooling them. The coolant then flows out of the unsealed portion to cool all the heating elements within the server cabinet. Since the coolant reaches the heating elements first, the cooling capacity of the cooling elements is not affected by the slower flow of the coolant at the heating elements. Furthermore, the coolant flowing out of the unsealed portion can continue to cool the heating elements within the server cabinet. Therefore, in the cooling process of the data center server, the heating elements are immersed in the cold plate device and the coolant, and the cooling effect is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction is given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 This is one of the structural diagrams of the liquid cooling system provided by the present invention;

[0027] Figure 2 It is a structural schematic diagram of the cold plate device provided by the present invention;

[0028] Figure 3 This is the second structural diagram of the liquid cooling system provided by the present invention.

[0029] Reference numerals:

[0030] 1: Circulation device; 2: Server cabinet; 3: Cold plate assembly; 4: Positioning holes; 5: Thermal contact material base; 6: Housing; 7: Positioning pins; 8: Holes; 9: Liquid supply pipe; 10: Liquid return pipe; 11: Server board; 12: Selected heating element; 13: Coolant supply hole. DETAILED DESCRIPTION

[0031] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0032] Combine Figure 1 As shown, an embodiment of the present invention provides a liquid cooling system, including: a circulation device 1, a server cabinet 2 and at least one cold plate device 3.

[0033] The circulation device 1 includes a liquid supply pipe 9 and a liquid return pipe 10. The liquid supply pipe 9 is connected to the cold plate assembly 3 for cooling liquid to flow into the cold plate assembly 3; the liquid return pipe 10 is connected to the server cabinet 2 for cooling liquid to flow out of the server cabinet 2 to the circulation device 1 through the liquid return pipe 10.

[0034] At least one heating element is disposed in the server cabinet 2 .

[0035] The cold plate device 3 is fixed above the selected heating element 12 in the server cabinet 2 ; the cold plate device 3 is provided with a non-sealed portion, and the cooling liquid flows from the non-sealed portion into the server cabinet 2 .

[0036] The liquid cooling system provided by the embodiment of the present invention is provided with a circulation device 1, a server cabinet 2 and at least one cold plate device 3. A plurality of heating elements are provided in the server cabinet 2, specifically Figure 1 As shown, Figure 1 The ellipsis in Figure 1 Another cold plate assembly 3 may be installed between the two cold plate assemblies 3 in the server cabinet 2. The cold plate assembly 3 is secured above a selected heat-generating component within the server cabinet 2. The selected heat-generating component 12 is a selected heat-generating component within the server cabinet 2 and may be the primary heat-generating component within the server cabinet. Heat generated by the heat-generating component is transferred to the cold plate assembly 3, where it is removed by the coolant. The cold plate assembly 3 includes an unsealed portion, allowing coolant to flow from the unsealed portion into the server cabinet 2, thereby immersing the other heat-generating components in the coolant. A circulation device 1 is also provided, comprising a liquid supply pipe 9 and a liquid return pipe 10. The liquid supply pipe 9 is connected to the cold plate assembly 3 within the server cabinet 2, allowing coolant to flow into the cold plate assembly 3. The liquid return pipe 10 is connected to the server cabinet 2, allowing coolant to flow out of the server cabinet 2 through the return pipe 10. Thus, by placing the cold plate assembly 3 above the selected heat-generating component, the coolant, upon reaching the cold plate assembly 3, first cools the selected heat-generating component covered by the cold plate assembly. The coolant then flows out of the unsealed portion, cooling all the heating elements within the server cabinet 2. Because the coolant first cools the selected heating elements covered by the cold plate assembly within the cold plate assembly, the coolant's ability to cool these heating elements is not affected by the slowing of the coolant's flow rate at the heating element. Simultaneously, the coolant flowing out of the unsealed portion can continue to cool other heating elements within the server cabinet 2. Thus, during the cooling process of the data center servers, the cold plate assembly and the immersion of the coolant provide a better cooling effect on the heating elements.

[0037] In some embodiments, the heating elements include primary heating elements and secondary heating elements. A primary heating element is a heating element within a server cabinet that generates heat above a preset threshold. A secondary heating element is a heating element within a server cabinet that generates heat below a preset threshold. Optionally, the primary heating element may be, for example, a CPU. Secondary heating elements may be, for example, memory or a hard drive. In some embodiments, a cold plate assembly may be positioned above the primary heating element, while no cold plate assembly may be positioned above the secondary heating element.

[0038] Optionally, the cold plate assembly includes a thermal contact material base and a housing. The thermal contact material base is attached to a selected heat-generating component 12 within the server cabinet. The housing is connected to the liquid supply pipe 9. The housing is mounted on the thermal contact material base, and the non-sealed portion includes one or more holes disposed in the housing.

[0039] In this embodiment, since the cold plate device is set at the selected heating element 12 when using the cold plate liquid cooling technology, the cooling effect of the secondary heating element is poor. Therefore, in the prior art, an additional air-cooled heat dissipation device is usually added to cool the secondary heating element. However, adding an additional wind heat dissipation device will increase the cost of cooling the data center. The present application provides holes on the outer shell as a non-sealed part, so that after the coolant reaches the cold plate device, it first exchanges heat with the selected heating element through the thermal contact material base, and then flows out of the cold plate device into the server cabinet, thereby cooling all the heating elements in the server cabinet. In this way, the heating elements can be better cooled without providing an additional air cooling device. Furthermore, the PUE (Power Usage Effectiveness) of the data center server can be reduced without providing an additional air cooling device.

[0040] Furthermore, the shell is provided with a coolant supply hole, and the liquid supply pipe 9 is connected to the shell through the coolant supply hole.

[0041] Furthermore, a gap is formed at the connection between the outer shell and the thermal contact material base; the non-sealed portion also includes this gap. Thus, by providing a gap at the connection between the outer shell and the thermal contact material base, coolant can flow through the gap into the server cabinet. Therefore, coolant can flow out through both the holes and the gap, allowing the coolant to flow out of the cold plate assembly more quickly. This accelerates the circulation of the coolant, which in turn removes heat from the heating element more quickly, enhancing the cooling effect on the heating element within the server cabinet.

[0042] Optionally, the outer shell is partially or completely connected to the thermal contact material base by welding. Thus, when the outer shell is completely connected to the thermal contact material base by welding, after the coolant reaches the cold plate device, it can flow out from the holes into the server cabinet, thereby cooling the secondary heat-generating components disposed within the server cabinet. When the outer shell is incompletely connected to the thermal contact material base by welding, after the coolant reaches the cold plate device, it can flow out from the holes and the unconnected gap between the outer shell and the thermal contact material base. This allows the coolant to flow out more quickly into the server cabinet after reaching the cold plate device, thereby enhancing the cooling effect on the heat-generating components within the server cabinet.

[0043] Optionally, the housing includes a top plate and side plates. The top plate and side plates enclose a cavity. The side plates are partially or completely connected to the base of the thermal contact material by welding. The top plate is provided with a coolant supply hole for communicating with the liquid supply pipe 9. The side plates are provided with one or more holes. In this way, the coolant can enter the cavity through the coolant supply hole, thereby contacting the thermal contact material and removing heat from the thermal contact material, thereby removing heat from the selected heating element 12.

[0044] In some embodiments, the housing is detachably connected to the thermal contact material base. By detachably connecting the housing to the thermal contact material base, a cold plate assembly can be quickly assembled, and if the housing or thermal contact material is damaged, it can be quickly and portablely replaced.

[0045] Optionally, the thermal contact material base is provided with a first mounting hole, and the shell is provided with a second mounting hole; the first mounting hole and the second mounting hole are arranged opposite to each other; the first mounting hole and the second mounting hole are connected by a connecting component so that the shell can be detachably connected above the thermal contact material base.

[0046] Optionally, the shell includes: a top plate, a side plate and a third extension. The top plate and the side plate are enclosed to form a cavity. One or more third extensions are connected to the side plate. A coolant supply hole is provided on the top plate, and the coolant supply hole is used to communicate with the liquid supply pipe 9. One or more holes are provided on the side plate. Each third extension is respectively provided with a second mounting hole. In some embodiments, the shape after the top plate and the side plate are enclosed is a cube without a bottom surface. Among them, the cube includes, for example, a cube, a rectangular parallelepiped, a cone, etc. In this way, the third extension is connected to the side plate and the second mounting hole is provided on the third extension, which can facilitate the fixing of the shell and the base of the thermal contact material. It is also convenient to control the width of the gap between the shell and the base of the thermal contact material when fixing.

[0047] Optionally, the thermal contact material base includes a base panel and a first extension portion. The base panel is connected to one or more first extension portions. Each first extension portion is provided with a first mounting hole.

[0048] In some embodiments, combined Figure 2As shown, the cold plate device includes a thermal contact material base and an outer shell. The outer shell 6 includes a top plate, side plates, and four third extensions. The top plate and side plates together form a cavity. The top plate and side plates together form a rectangular parallelepiped without a bottom surface. The four third extensions are connected to the side plates. A coolant supply hole 13 is provided on the top plate. The thermal contact material base includes a base panel and a first extension connected to the base panel. The thermal contact material base is rectangular in shape, and the shape and size of the rectangle are the same as the shape and size of the bottom surface of the rectangular parallelepiped. The shape and size of the four third extensions of the outer shell are consistent with the shape and size of the four first extensions. Each of the four third extensions is provided with a second mounting hole. Each of the four first extensions is provided with a first mounting hole. When the outer shell is mounted on the thermal contact material base, the four third extensions overlap with the four first extensions. The second mounting holes provided on the side overlap with the first mounting holes provided on the first extensions. The first mounting holes and the second mounting holes are collectively referred to as positioning holes 4. The first mounting hole and the second mounting hole that overlap each other are connected by a connecting component, thereby fixing the thermal contact material base and the shell.

[0049] Optionally, at least one server board is disposed within the server cabinet, with a heating element disposed on the server board; a thermal contact material base is secured to a primary heating area and covers the primary heating element; the primary heating area being the area on the server board where the primary heating element is disposed, and the primary heating element being a heating element within the server cabinet that generates heat above a preset threshold. Each server board corresponds to a cold plate assembly. Therefore, when using immersion cooling technology, the flow rate of coolant at the primary heating element is relatively slow due to factors such as coolant viscosity. Furthermore, since immersion cooling technology indiscriminately exchanges heat with heating elements across the entire data center server, this may result in poor heat dissipation from the coolant at the primary heating element, potentially leading to overheating of the primary heating element. By securing the thermal contact material base to the primary heating area and covering the primary heating element, the coolant can cool the primary heating element first after reaching the cold plate assembly, thereby preventing overheating of the primary heating element.

[0050] In some embodiments, the thermal contact material base is welded to the main heat generating area by welding.

[0051] In some embodiments, the thermal contact material base is provided with a third mounting hole, and the server card is provided with a fourth mounting hole. The third and fourth mounting holes are arranged opposite each other, and the connecting component secures the thermal contact material base to the primary heat-generating area of ​​the server card through the third and fourth mounting holes. For example, the thermal contact material base includes a base panel and a second extension. The base panel is connected to one or more second extensions. Each second extension is provided with a third mounting hole.

[0052] Optionally, the connecting components include positioning pins, bolts, screws, rope loops, etc.

[0053] Optionally, the connection height of the return pipe 10 to the server cabinet is at a predetermined height, which satisfies the condition that the coolant will submerge the heat-generating components in the server cabinet before flowing out of the return pipe 10. The connection height of the return pipe 10 to the server cabinet is defined as the distance between the lowest point where the return pipe 10 contacts the server cabinet and the surface of the server cabinet that contacts the ground.

[0054] In some embodiments, the preset height is greater than the maximum component height, which is the height of the heating component within the server cabinet, ie, the distance between the highest point of the heating component and the component surface of the server cabinet that contacts the ground.

[0055] In some embodiments, combined Figure 3 As shown, a server board 11 is installed in the server cabinet 2. A selected heating element 12 is installed on the server board 11. The cold plate device is composed of a thermal contact material base 5 and a shell 6. The shell 6 is fixed to the thermal contact material base 5. The thermal contact material base 5 is fixed to the area where the selected heating element 12 is located by a positioning pin 7, and the thermal contact material base 5 is located above the selected heating element 12. The shell 6 is provided with a coolant supply hole and a plurality of holes 8. The liquid supply pipe 9 is connected to the shell 6 through the coolant supply hole. The server cabinet 2 is connected to the liquid return pipe 10. In this way, the thermal contact material base 5 is arranged above the selected heating element 12. The thermal contact material base 5 will exchange heat with the selected heating element 12. After the coolant reaches the cold plate device, it will first contact the thermal contact material base 5, cooling the thermal contact material base 5, and then cooling the selected heating element 12. The coolant then flows out from the hole 8 to cool all the heating elements in the server cabinet 2. Since the coolant first reaches the thermal contact material base 5, the selected heating element 12 is cooled first. The cooling capacity of the coolant on the main heating element will not be affected by the slowdown of the flow rate of the coolant at the selected heating element 12. At the same time, the coolant flows out from the hole 8 and can continue to cool other heating elements provided in the server cabinet 2. Therefore, in the cooling process of the data center server, the cooling effect of all heating elements can be better. In addition, the liquid cooling system of the present application can be used for modification of ordinary server cabinets, and there is no need to separately design and manufacture a liquid cooling cabinet (Tank) suitable for immersion cooling. It can be more convenient for users to use.

[0056] In some embodiments, if there are multiple main heat-generating components in a server cabinet, the server cabinet is equipped with a number of cold plate devices matching the number of main heat-generating components. Each cold plate device is positioned above each main heat-generating component and is provided with a coolant supply hole and a hole. The circulation device's supply pipe 9 is connected to the coolant supply holes of each cold plate device. The circulation device's return pipe 10 is connected to the server cabinet. For example, if there are two main heat-generating components in the server cabinet, such as main heat-generating component A and main heat-generating component B, then the server cabinet is equipped with two cold plate devices, such as cold plate device a and cold plate device b. Cold plate device a is positioned above main heat-generating component A. Cold plate device b is positioned above main heat-generating component B. Cold plate device a is provided with a coolant supply hole c and a hole d. Cold plate device b is provided with a coolant supply hole e and a hole f. The supply pipe 9 is connected to the coolant supply hole c and the coolant supply hole e. The return pipe 10 is connected to the server cabinet. In this way, a corresponding cold plate device is provided for each main heating element, so that each main heating element can be cooled well.

[0057] Optionally, the circulation device further includes a heat exchange unit connected to the liquid supply pipe 9 and the liquid return pipe 10; the heat exchange unit is used to heat the coolant flowing out of the liquid return pipe 10 and allow the heat-exchanged coolant to flow into the liquid supply pipe 9. In this way, by providing the heat exchange unit, the coolant can be automatically heat-exchanged, thereby automatically and continuously dissipating heat from the data center servers.

[0058] Optionally, the circulation device further includes a manifold and a cooling distribution unit. The manifold is connected to the heat exchange unit, the liquid supply pipe 9, the liquid return pipe 10, and the cooling distribution unit. The manifold is configured to deliver the cooling liquid determined by the cooling distribution unit to the cold plate assembly via the liquid supply pipe 9. The cooling distribution unit determines the amount of cooling liquid to be distributed to each server cabinet 2, and the manifold delivers the cooling liquid determined by the cooling distribution unit to the cold plate assembly 3 of the server cabinet 2 corresponding to the value.

[0059] Optionally, the heat exchange unit includes a water pump and a heat exchanger. The water pump is connected to the heat exchanger and manifold, respectively. The heat exchanger exchanges heat with the coolant input from the manifold and pumps the heat-exchanged coolant to the manifold via the water pump. Thus, the coolant circulation mechanism of the liquid cooling system is as follows: low-temperature coolant flows from the heat exchange unit (CDU) and, under the action of the water pump, is transported to the manifold. After the cooling distribution unit determines the amount of coolant allocated to each server cabinet, the manifold distributes the coolant to each server cabinet. The coolant distributed by the manifold first enters the supply pipe 9 and then reaches the cold plate assembly. Upon reaching the cold plate assembly, the low-temperature coolant exchanges heat with the heat-generating components through the thermal contact material base. It then flows from the cold plate assembly into the server cabinet, where it diffuses until all the heat-generating components within the server cabinet are submerged. At this point, the coolant exchanges heat with all the heat-generating components within the server cabinet, becoming high-temperature coolant. The high-temperature coolant then flows through the return pipe 10 into the manifold. From there, it enters the heat exchanger. After the heat exchanger heats the high-temperature coolant, the low-temperature coolant is returned to the manifold. This improves the cooling effect on the heat-generating components in the server cabinet.

[0060] In some embodiments, the coolant is an insulating coolant. Thus, the use of the insulating coolant can improve the safety performance of the system.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A liquid cooling system, characterized in that: including a circulation device, a server cabinet, and at least one cold plate device; The circulation device includes a liquid supply pipe and a liquid return pipe; the liquid supply pipe is connected to the cold plate device and is used for cooling liquid to flow into the cold plate device; The liquid return pipe is connected to the server cabinet and is used to flow the cooling liquid from the server cabinet to the circulation device through the liquid return pipe; At least one heating element is provided in the server cabinet; The cold plate device is fixed above the selected heating element in the server cabinet; the cold plate device is provided with a non-sealed portion, and the cooling liquid flows from the non-sealed portion into the server cabinet; The cold plate assembly includes a thermal contact material base and a housing; The thermal contact material base is attached above the selected heating element in the server cabinet; The shell is communicated with the liquid supply pipe; the shell is arranged on the thermal contact material base, and the non-sealed portion includes one or more holes arranged on the shell.

2. The liquid cooling system according to claim 1, characterized in that There is a gap at the connection between the shell and the thermal contact material base; the non-sealed part also includes the gap.

3. The liquid cooling system according to claim 1, characterized in that: At least one server board is arranged in the server cabinet, and the heating element is arranged on the server board; the thermal contact material base is fixed to the main heating area and covers the main heating element; the main heating area is the area on the server board where the main heating element is arranged, and the main heating element is a heating element in the server cabinet whose heat generation is higher than a preset threshold.

4. The liquid cooling system according to claim 1, wherein: The shell is detachably connected to the thermal contact material base.

5. The liquid cooling system according to claim 4, characterized in that: The thermal contact material base is provided with a first mounting hole, and the shell is provided with a second mounting hole; the first mounting hole and the second mounting hole are arranged opposite to each other; the first mounting hole and the second mounting hole are connected by a connecting component so that the shell can be detachably connected above the thermal contact material base.

6. The liquid cooling system according to any one of claims 1 to 5, characterized in that: The connection height between the liquid return pipe and the server cabinet is at a preset height, and the preset height satisfies the condition that the heat generating components in the server cabinet are immersed before the coolant flows out of the liquid return pipe.

7. The liquid cooling system according to any one of claims 1 to 5, characterized in that: The circulation device also includes: A heat exchange unit is connected to the liquid supply pipe and the liquid return pipe; the heat exchange unit is used to exchange heat for the coolant flowing out of the liquid return pipe and allow the coolant after heat exchange to flow into the liquid supply pipe.

8. The liquid cooling system according to claim 7, characterized in that: The circulation device also includes a manifold and a cold distribution unit; The manifold is respectively connected to the heat exchange unit, the liquid supply pipe, the liquid return pipe and the cooling distribution unit; the manifold is used to input the cooling liquid determined by the cooling distribution unit into the cold plate device through the liquid supply pipe.

9. The liquid cooling system according to claim 8, characterized in that: The heat exchange unit includes a water pump and a heat exchanger; The water pump is connected to the heat exchanger and the manifold respectively; The heat exchanger is used to exchange heat for the coolant input from the manifold, and to transport the heat-exchanged coolant to the manifold via the water pump.

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