An automatic directional stacking device for power MOSFET chips

Abstract

The present invention discloses a device for automatically stacking power MOSFET chips in a directed manner, which includes a conveyor belt. On the top surface of the conveyor belt, there are side baffles. The side baffles are connected to a leveling groove, and the leveling groove is connected to an extension plate. The interior of the leveling groove is divided into several channels by arranging internal partitions. There are stepped platforms in the channels. The leveling groove is connected to an extension plate, and an electromagnet is arranged on the upper part of the extension plate. On the support mechanism near the tail of the conveyor belt, a deflecting conveyor belt is arranged through a support side rod. There are magnetic blocks on the deflecting conveyor belt, and a collection assembly is arranged between the support side rods. Through the setting and cooperation of the deflecting conveyor belt, magnetic blocks, collection assembly, etc., the present invention successfully realizes the orientation of power MOSFET chips, and through the setting of the partitioning assembly, the materials can be automatically collected and stacked smoothly and continuously. The structure is exquisitely set, with high automation and high efficiency, significantly improving the orientation and stacking efficiency of the materials, and having great application prospects.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device manufacturing, and particularly relates to a device for automatically stacking power MOSFET chips in a directed manner. Background Art

[0002] A power MOSFET chip is a metal-oxide-semiconductor field-effect transistor designed for low-voltage applications, combining high switching speed and excellent efficiency. This innovative technology is a core component of many applications, including consumer electronics, power supplies, motor controllers, radio frequency applications, transportation technology, and automotive electronics. After the production of power MOSFET chips, a wrapping layer needs to be set. To facilitate the setting of the wrapping layer, the produced power MOSFET chips need to be arranged in rows for easy grasping and positioning. After the wrapping layer has been set, for the packaging of power MOSFET chips, the power MOSFET chips need to be neatly arranged. A power MOSFET chip includes a chip body part and a lead part. For easy soldering, the lead part of the power MOSFET chip is generally relatively slender. After a large number of power MOSFET chips are produced, they need to be separated to screen out qualified products.

[0003] Currently, separation is mainly achieved through mechanical structures or manual labor.

[0004] However, mechanical separation easily leads to a chaotic orientation of power MOSFET chips. The lead parts of power MOSFET chips will collide and squeeze with each other, causing the leads of power MOSFET chips to become bent or even broken, affecting the qualification rate and yield rate of power MOSFET chips. Manual separation is inefficient and costly. Therefore, a device that can stack power MOSFET chips in a directed and automatic manner is needed to solve the problem of how to efficiently separate, arrange, and stack power MOSFET chips. Summary of the Invention

[0005] The purpose of the present invention is to provide a device for automatically stacking power MOSFET chips in a directed manner to solve the problems raised in the above background art.

[0006] The purpose of the present invention can be achieved through the following technical solutions:

[0007] A power MOSFET chip directional automatic stacking device, including a conveyor belt, the conveyor belt is supported by a support mechanism, both sides of the top surface of the conveyor belt are provided with side baffles, the same-side ends of the two side baffles are fixedly connected with a leveling groove, the other side of the leveling groove is fixedly connected with an extension plate, the inside of the leveling groove is divided into several channels by arranging inner partitions, a stepped platform is arranged in the channel, the height of the channel gradually decreases along the movement direction of the conveyor belt, the height of the lowest channel is equal to the thickness of a single power MOSFET chip, the width of the channel is equal to the width of a single power MOSFET chip, extension plates are fixedly connected to the rear side walls of the leveling groove at positions between the channels, an electromagnet is arranged on the upper part of the rear side wall of the extension plate, a direction-changing conveyor belt is arranged on the support mechanism near the tail of the conveyor belt through a support side rod, magnet blocks are arranged at equal distances on the direction-changing conveyor belt, and a collection assembly is arranged between the support side rods on both sides of the conveyor belt.

[0008] The collection assembly includes a bottom plate, several collection plates are arranged on the top surface of the bottom plate, the collection plates divide the bottom plate into blanking channels corresponding to the channels, a first cover plate is arranged on the top surface of the collection plate far from the conveyor belt, a collection port is arranged at the position where the collection plate is close to the conveyor belt, the collection port includes a first inclined surface and a second inclined surface, a second cover plate is arranged on the top surface of the collection plate at the position of the second inclined surface, folding plates are arranged on the side walls of the second cover plate close to the conveyor belt and above the blanking channels, rollers are arranged at the positions where the blanking channels are close to the conveyor belt, and a separation assembly is rotatably connected to the rollers, the separation assembly includes a bushing and a stop plate and two separation plates arranged on it.

[0009] Preferably: The outer sides of the side baffles and the leveling groove are fixedly connected with a frame body for supporting the side baffles and the leveling groove on the top surface of the conveyor belt.

[0010] Preferably: The surface of the conveyor belt is provided with parallel and equidistant conveyor belt convex grains.

[0011] Preferably: A partition groove is opened on the side baffle, the partition groove is set in a "7" shape, a partition assembly is arranged on the partition groove, the partition assembly includes a rolling shaft and a rolling brush sleeved on it, the rolling shaft rotates in the partition groove, and the rolling brush is located between the two side baffles.

[0012] Preferably: Feeding port shunt plates are arranged at positions between the channels on the front side wall of the leveling groove, and the feeding port shunt plates are set in a triangular cone shape.

[0013] Preferably: The collection assembly is arranged below the direction-changing conveyor belt and at the tail of the conveyor belt.

[0014] Preferably, the running direction of the direction-changing conveyor belt is clockwise, and the running direction of the conveyor belt is clockwise.

[0015] Preferably, when the rolling shaft is placed on the top of the partition groove, the distance between the outer side surface of the rolling brush and the surface of the conveyor belt is equal to the thickness of a single power MOSFET chip.

[0016] Preferably, the distance between the two partition plates is set such that only one side can pass the power MOSFET chip each time when the power MOSFET chip passes above and below the intermittent plate.

[0017] Advantages of the present invention:

[0018] 1. By the setting of the conveyor belt protrusions in the present invention, the transmission speed of the power MOSFET chips with the correct direction is accelerated, so that the power MOSFET chips with the correct direction can be collected faster. And a partition component is provided, which not only enables the power MOSFET chips to enter the leveling groove in a single-layer state, reducing the occurrence of jams, but also can cut off the input of materials in case of emergency, improving the operation safety of the device.

[0019] 2. By the setting of the feed port diverter plate in the present invention, it not only helps the materials to be diverted into the leveling groove, but also can turn the horizontal power MOSFET chips, reducing the accumulation of materials at the entrance of the leveling groove. Through the setting of the stepped platform, the situation of blockage inside the leveling groove is avoided, greatly improving the operation fluency of the device, and further improving the stacking efficiency of the device in a specific orientation.

[0020] 3. Through the setting and cooperation of the direction-changing conveyor belt, magnet blocks and collection components, etc. in the present invention, the orientation of the power MOSFET chips is successfully realized, and through the setting of the partition component, the power MOSFET chips can be automatically collected and stacked smoothly and continuously. The structure is exquisitely set, with high automation and high efficiency, significantly improving the orientation and stacking efficiency of the power MOSFET chips, and having great application prospects. Description of the Drawings

[0021] The following further describes the present invention with reference to the drawings.

[0022] Figure 1 is the overall structural schematic diagram of the present invention;

[0023] Figure 2 is the structural schematic diagram of the partition component in the present invention;

[0024] Figure 3 is the front view of a partial structure of the present invention;

[0025] Figure 4 is the structural schematic diagram of the leveling groove in the present invention;

[0026] Figure 5 is a schematic connection diagram of the direction-changing conveyor belt and the magnet block in the present invention;

[0027] Figure 6 is a schematic structural diagram of the collection component in the present invention;

[0028] Figure 7 is a schematic structural diagram of the partition component in the present invention.

[0029] In the figure: 1, conveyor belt; 101, conveyor belt convex particles; 102, frame body; 103, support mechanism; 2, side baffle; 201, partition groove; 3, partition component; 301, rolling shaft; 302, rolling brush; 4, feed port diverter plate; 5, leveling groove; 501, inner partition board; 502, stepped platform; 6, extension plate; 7, electromagnet; 8, direction-changing conveyor belt; 801, magnet block; 802, support side rod; 9, bottom plate; 901, collection plate; 902, first cover plate; 903, second cover plate; 904, folding plate; 905, roller; 906, partition component; 907, intermittent plate; 908, partition board; 10, collection port; 11, first inclined surface; 12, second inclined surface. Detailed implementation manners

[0030] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0031] Refer to Figure 1-7As shown in the figure, the present invention is a power MOSFET chip directional automatic stacking device, including a conveyor belt 1 supported by a support mechanism 103. On both sides of the top surface of the conveyor belt 1, there are side baffles 2. The same-side ends of the two side baffles 2 are fixedly connected with a leveling groove 5. The outer sides of the side baffles 2 and the leveling groove 5 are fixedly connected with a frame body 102 for supporting the side baffles 2 and the leveling groove 5 on the top surface of the conveyor belt 1. One side of the leveling groove 5 away from the side baffle 2 is fixedly connected with an extension plate 6. On the surface of the conveyor belt 1, there are parallel and equidistant conveyor belt protrusions 101. There is a partition groove 201 on the side baffle 2, and the partition groove 201 is set in a "7" shape. A partition component 3 is arranged on the partition groove 201. The partition component 3 includes a rolling shaft 301 and a rolling brush 302 sleeved thereon. The rolling shaft 301 rotates in the partition groove 201, and the rolling brush 302 is located between the two side baffles 2. The interior of the leveling groove 5 is divided into several channels by arranging an inner partition plate 501. There is a stepped platform 502 in the channel. The height of the channel gradually decreases along the movement direction of the conveyor belt 1, and the height of the lowest channel is equal to the thickness of a single power MOSFET chip, and the width of the channel is equal to the width of a single power MOSFET chip.

[0032] Furthermore, at the positions between the channels on the front side wall of the leveling groove 5, there are all feeding port shunt plates 4. The feeding port shunt plates 4 are set in a triangular cone shape. At the positions between the channels on the rear side wall of the leveling groove 5, there are all fixedly connected with extension plates 6. On the upper part of the rear side wall of the extension plate 6, there is an electromagnet 7.

[0033] Furthermore, on the support mechanism 103 near the tail of the conveyor belt 1, there is a deflecting conveyor belt 8 arranged through a support side rod 802. Magnet blocks 801 are arranged at equal distances on the deflecting conveyor belt 8. A collecting component is arranged between the support side rods 802 on both sides of the conveyor belt 1. The collecting component is arranged below the deflecting conveyor belt 8 and at the tail of the conveyor belt 1.

[0034] The collecting component includes a bottom plate 9. On the top surface of the bottom plate 9, there are several collecting plates 901. The collecting plates 901 divide the bottom plate 9 into blanking channels corresponding to the channels. On the top surface of the collecting plate 901 away from the conveyor belt 1, there is a first cover plate 902. A collecting port 10 is arranged near the conveyor belt 1 on the collecting plate 901. The collecting port 10 includes a first inclined surface 11 and a second inclined surface 12. On the top surface of the collecting plate 901 at the position of the second inclined surface 12, there is a second cover plate 903. On the side wall of the second cover plate 903 close to the conveyor belt 1 and above the blanking channel, there are all folding plates 904. At the position of the blanking channel close to the conveyor belt 1, there are all roller shafts 905. A separating component 906 is rotatably connected to the roller shafts 905. The separating component 906 includes a bushing and a stop plate 907 and two separating plates 908 arranged thereon.

[0035] It should be noted that the running direction of the direction-changing conveyor belt 8 is clockwise, and the running direction of the conveyor belt 1 is also clockwise.

[0036] The conveyor belt convex grains 101 can slide into the pin gaps of the power MOSFET chips with the pins facing backward. It should be noted that the pins facing backward refer to the direction opposite to the running direction of the conveyor belt 1, so as to drive the power MOSFET chips to move on the conveyor belt 1 in the correct direction. Moreover, the power MOSFET chips that slide into the conveyor belt convex grains 101 are subject to a greater driving force of the conveyor belt 1 and move faster on the conveyor belt 1 than the power MOSFET chips that do not slide into the conveyor belt convex grains 101, which speeds up the transmission speed of the power MOSFET chips with the correct direction, so that the power MOSFET chips with the correct direction can be collected faster.

[0037] The top of the "7"-shaped partition groove 201 can not only support the rolling shaft 301, but also move the rolling shaft 301 to the lower end of the partition groove 201 when the channel is accidentally blocked, blocking the power MOSFET chips ready to enter the channel and playing a role in blocking, avoiding further aggravation of the channel mouth blockage and greatly improving the efficiency of the channel to resume operation. It should be added that when the rolling shaft 301 is placed at the top of the partition groove 201, the distance between the outer side surface of the rolling brush 302 and the surface of the conveyor belt 1 is equal to the thickness of a single power MOSFET chip, which means that after passing through the partition assembly 3, the power MOSFET chips will enter the leveling groove 5 in a single-layer state, reducing the occurrence of blockage and making the automatic directional stacking of the power MOSFET chips by this device smoother.

[0038] Since the pins of the power MOSFET chips are iron pins, the magnetic force of the electromagnet 7 is set relatively weak, and only the iron pins of the power MOSFET chips need to move forward parallelly. It should be noted that the forward movement at this time refers to the same direction as the running direction of the conveyor belt 1. The pins of the power MOSFET chips with the pins facing forward will continue to move forward parallelly under the action of the electromagnet 7, and the gap between the two pins will pass through the folding plate 904. The main body of the power MOSFET chip will be blocked by the folding plate 904, and its pins will contact the magnet block 801 on the direction-changing conveyor belt 8 and be adsorbed. As the direction-changing conveyor belt 8 rotates clockwise, the pins will be lifted and rotated. When rotated to an angle parallel to the second cover plate 903, the main body of the power MOSFET chip will be blocked by the bent section at the front end of the folding plate 904. As the magnet block 801 moves, the magnetic force weakens, and the power MOSFET chips that have completed the turning will fall onto the intermittent plate 907 at the entrance of the blanking channel due to gravity and then enter the blanking channel.

[0039] The feed inlet diverter plate 4 can not only divert the single-layer power MOSFET chips into the channels of the combing and flattening grooves 5, but also cause one end of the horizontal power MOSFET chips to tilt up and drop from both sides of the feed inlet diverter plate 4, serving the function of changing the horizontal power MOSFET chips into vertical ones, that is, the long sides of the power MOSFET chips are in the running direction of the conveyor belt 1.

[0040] When the power MOSFET chips enter the combing and flattening grooves 5, stacking may occur. Through the settings of the inner partition plate 501 and the stepped platform 502, the power MOSFET chips finally coming out of the channels of the combing and flattening grooves 5 are in a single layer and in a vertical direction.

[0041] The distance between the two partition plates 908 is set such that only one side can pass the power MOSFET chips each time when the power MOSFET chips pass above and below the stop plate 907.

[0042] The power MOSFET chips with the body facing forward pass under the stop plate 907, and the power MOSFET chips with the pins facing forward pass above the stop plate 907 after being redirected by the redirecting conveyor belt 8. To prevent blockage caused by simultaneous passing, the stop plate 907 and the partition plate 908 are provided. When two power MOSFET chips pass simultaneously, since the redirected power MOSFET chips are closer to the magnet and lighter in mass than the power MOSFET chips under the stop plate 907, the power MOSFET chips under the stop plate 907 will pass first, causing the partition plate 908 to block the power MOSFET chips above the stop plate 907. Then, under the action of gravity, the power MOSFET chips above the stop plate 907 push the blocking partition plate 908, and the partition assembly 906 starts to rotate, causing the partition plate 908 to temporarily block the power MOSFET chips under the stop plate 907. After the power MOSFET chips above the stop plate 907 pass, they push the partition plate 908 and continue to pass.

[0043] Through the setting of the partition assembly 906, the power MOSFET chips can be smoothly collected from the blanking channel, greatly improving the efficiency of the directional automatic stacking of this device. The structural setting is delicate and efficient, suitable for popularization and use.

[0044] The directional automatic stacking process of the power MOSFET chips of the present invention is as follows:

[0045] The power MOSFET chips enter from the left side of the conveyor belt 1. Under the protection of the side baffle 2, they pass through the partition assembly 3, and the power MOSFET chips enter the leveling groove 5 in a single layer. Under the action of the feed port diverter plate 4, the horizontal power MOSFET chips will change their directions, so that the power MOSFET chips enter the leveling groove 5 vertically. During the entry process, the phenomenon of power MOSFET chip stacking may occur. The stepped platform 502 can push the stacked power MOSFET chips, so that the power MOSFET chips coming out of the leveling groove 5 are all vertical and single-layer; under the protection of the extension plate 6, the power MOSFET chips are conveyed to the collection assembly.

[0046] The power MOSFET chips with the body in the front and the pins in the back will fall into the blanking channel due to the weight of the body, and the pins at the tail will also help the power MOSFET chips lift the tail under the attraction of the electromagnet 7, so as to better fall into the blanking channel.

[0047] The power MOSFET chips with the pins in the front will move horizontally under the attraction of the electromagnet 7. The pin gaps will insert into the folding plate 904, and the pins will contact the magnet blocks 801 on the direction-changing conveyor belt 8. Under the attraction of the magnet blocks 801 and the clockwise movement of the direction-changing conveyor belt 8, the pins of the power MOSFET chips are driven to turn, and the power MOSFET chips are stuck at the bent section at the front end of the folding plate 904. With the movement of the direction-changing conveyor belt 8, the suction force of the magnet blocks 801 will weaken, so that the power MOSFET chips after direction change fall into the blanking channel, and enter the blanking channel orderly under the action of the intermittent plate 907 and the partition plate 908, so that the power MOSFET chips are stacked in an orderly and oriented manner.

[0048] The above has described a specific embodiment of the present invention in detail, but the content described is only the preferred embodiment of the present invention and cannot be considered as limiting the scope of implementation of the present invention. All equivalent changes and improvements made according to the scope of the application of the present invention should still fall within the scope covered by the patent of the present invention.

Claims

1. A power MOSFET chip directional automatic stacking device, characterized in that It includes a conveyor belt (1), the conveyor belt (1) is supported by a support mechanism (103), side baffles (2) are arranged on both sides of the top surface of the conveyor belt (1), the same-side ends of the two side baffles (2) are fixedly connected with a leveling groove (5), the other side of the leveling groove (5) is fixedly connected with an extension plate (6), the interior of the leveling groove (5) is divided into a number of channels by arranging an inner partition plate (501), a stepped platform (502) is arranged in the channels, the height of the channels gradually decreases along the movement direction of the conveyor belt (1), the height of the lowest channel is equal to the thickness of a single power MOSFET chip, the width of the channels is equal to the width of a single power MOSFET chip, extension plates (6) are fixedly connected at the rear side walls of the leveling groove (5) between the channels, an electromagnet (7) is arranged at the upper part of the rear side wall of the extension plate (6), a deflecting conveyor belt (8) is arranged on the support mechanism (103) near the tail of the conveyor belt (1) through a support side rod (802), magnet blocks (801) are arranged at equal intervals on the deflecting conveyor belt (8), and a collection assembly is arranged between the support side rods (802) on both sides of the conveyor belt (1); The collection assembly includes a bottom plate (9), a number of collection plates (901) are arranged on the top surface of the bottom plate (9), the collection plates (901) divide the bottom plate (9) into blanking channels corresponding to the channels, a first cover plate (902) is arranged on the top surface of the collection plate (901) away from the conveyor belt (1), a collection port (10) is arranged at the collection plate (901) near the conveyor belt (1), the collection port (10) includes a first inclined surface (11) and a second inclined surface (12), a second cover plate (903) is arranged on the top surface of the collection plate (901) at the second inclined surface (12), folding plates (904) are arranged at the side walls of the second cover plate (903) near the conveyor belt (1) and above the blanking channels, rollers (905) are arranged at the blanking channels near the conveyor belt (1), a partition assembly (906) is rotatably connected to the rollers (905), and the partition assembly (906) includes a bushing and a stop plate (907) and two partition plates (908) arranged thereon; The running direction of the deflecting conveyor belt (8) is clockwise.

2. The directional automatic stacking device for a power MOSFET chip according to claim 1, wherein A frame body (102) is fixedly connected to the outer side surfaces of the side baffles (2) and the leveling groove (5) for supporting the side baffles (2) and the leveling groove (5) on the top surface of the conveyor belt (1).

3. The directional automatic stacking device for a power MOSFET chip according to claim 2, characterized in that, Conveyor belt convex grains (101) that are parallel and equidistant are arranged on the surface of the conveyor belt (1).

4. The automatic directional stacking device for a power MOSFET chip according to claim 3, characterized in that, A partition groove (201) is formed on the side baffle (2). The partition groove (201) is set in a "7" shape. A partition component (3) is arranged on the partition groove (201). The partition component (3) includes a rolling shaft (301) and a rolling brush (302) sleeved thereon. The rolling shaft (301) rotates in the partition groove (201), and the rolling brush (302) is located between the two side baffles (2).

5. The automatic directional stacking device for a power MOSFET chip according to claim 4, wherein Feeding port diverter plates (4) are arranged at the front side walls of the combing groove (5) where they are between the channels. The feeding port diverter plates (4) are set in a triangular pyramid shape.

6. The automatic directional stacking device for power MOSFET chips according to claim 5, characterized in that The collecting component is arranged below the deflecting conveyor belt (8), and the collecting component is arranged at the tail of the conveyor belt (1).

7. The directional automatic stacking device for a power MOSFET chip according to claim 6, wherein The running direction of the conveyor belt (1) is clockwise.

8. The automatic directional stacking device for power MOSFET chips according to claim 7, wherein, When the rolling shaft (301) is placed at the top of the partition groove (201), the distance from the outer side surface of the rolling brush (302) to the surface of the conveyor belt (1) is equal to the thickness of a single power MOSFET chip.

9. The directional automatic stacking device for a power MOSFET chip according to claim 8, characterized in that The distance between the two partition plates (908) is set such that only one side can pass through the power MOSFET chip each time when the power MOSFET chip passes above and below the intermittent plate (907).

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