An ultra-high strength bonding high gold wire for optical communication and its strength testing equipment

Abstract

The present invention discloses an ultra-high strength high-gold bonding wire for optical communication and a strength testing device thereof, which relates to the technical field of bonding wire testing tooling, and comprises a strength testing platform, a first supporting plate, a second supporting plate, a first testing assembly and a second testing assembly, wherein two groups of first supporting plates and second supporting plates arranged on the strength testing platform are arranged opposite to each other at the upper end of the strength testing platform; the first testing assembly and the second testing assembly comprise a rotating disk rotatably arranged on the first supporting plate or the second supporting plate and a plurality of groups of telescopic rods arranged in an array along the circumferential direction of the rotating disk; a clamping assembly for clamping the alloy wire is arranged at the end of the telescopic rod, and the clamping assembly comprises a clamping part rotatably arranged at the end of the telescopic rod and a rotating part connected to the clamping part; the first supporting plate is provided with a first transmission member and a second transmission member, and the second supporting plate is provided with a third transmission member; the present invention can realize detection work of different performances for the bonding gold wire.

Description

Technical Field

[0001] The present invention relates to the technical field related to bonding wire testing tooling, and in particular to an ultra-high strength bonding high gold wire for optical communication and a strength testing device thereof. Background Art

[0002] At present, bonding wires are required in various devices or chips in the field of optical communications. Bonding wires are fine metal wire inner leads used to achieve electrical connection between the input / output bonding points of the circuit inside the chip and the internal contact points of the lead frame when assembling semiconductor devices and integrated circuits. Bonding gold wire (generally speaking, bonding high-gold wire refers to a wire with a gold content of more than 50%) is the most commonly used conductive wire material for wire bonding. The casting and molding of bonding gold wires have extremely high requirements on equipment conditions. When the material purity meets the standards, the vacuum requirements for the melting environment and molding conditions are also extremely high.

[0003] The Chinese invention patent with patent number CN118010473A discloses a silver alloy bonding wire anti-aging test device, including a base, and also includes: a vertical plate, fixedly connected to the upper end of the base, wherein a first clamp is fixedly installed at the bottom of the front end of the vertical plate, a first slide groove is provided at the top of the front end of the vertical plate, a second clamp is slidably installed in the first slide groove, and a scale is provided in the first slide groove; a pulling component is arranged at the top of the vertical plate, and the pulling component is used to pull the second clamp; a device groove is arranged on the front end surface of the vertical plate and is arranged between the first clamp and the second clamp, wherein a reciprocating component is provided in the device groove, and the reciprocating component is used to reciprocate and scrape the bonding wire; the present invention can subject the bonding wire to various tests in different environments, so that the testing of the bonding wire is more comprehensive and efficient.

[0004] However, the tensile strength of traditional bonding alloy wires is poor and they are prone to breaking under high-speed bonding conditions, resulting in low production efficiency and unsatisfactory welding results, which in turn increases production costs. In addition, after production, the bonding wires need to be tested for their strength, tensile resistance and other properties before they can be used, but traditional testing equipment cannot complete the testing of various indicators at the same time, resulting in low testing efficiency and the inability to perform batch testing on bonding wires. Summary of the invention

[0005] In order to solve the defects of the prior art, the present invention provides an ultra-high strength bonding high gold wire for optical communication and a strength testing device thereof.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0007] The invention provides an ultra-high strength bonding high-gold wire for optical communication, wherein the material formula comprises the following weight percentages: 10-25% silver, 0.8-4% palladium, 0.5-3% platinum, 0.05-0.1% iron, 0.05-0.1% tantalum, 0.02-0.08% calcium, 0.0005%-0.001% beryllium, and the remainder is gold, wherein the gold content is greater than 70%.

[0008] As a preferred technical solution of the present invention, the purity of the gold is not less than 99.999wt%; the purity of the silver is not less than 99.99wt%; and the purity of the palladium is not less than 99.99wt%.

[0009] The present invention also provides a strength testing device for bonding high gold wire, comprising:

[0010] A strength testing platform, on the upper end of which two groups of first supporting plates and second supporting plates arranged on the strength testing platform are arranged opposite to each other;

[0011] A first test assembly and a second test assembly are respectively arranged at relative positions of the first support plate and the second support plate, and the first test assembly and the second test assembly include a rotating disk rotatably arranged on the first support plate or the second support plate and a plurality of groups of telescopic rods arranged in an array along the circumferential direction of the rotating disk;

[0012] The end of the telescopic rod is provided with a clamping assembly for clamping the alloy wire, and the clamping assembly includes a clamping part rotatably arranged at the end of the telescopic rod and a rotating part connected to the clamping part;

[0013] The first support plate is provided with a first transmission member and a second transmission member in sequence along its radial direction, and the second support plate is provided with a third transmission member at a position corresponding to the first transmission member.

[0014] As a preferred technical solution of the present invention, the bases of the first support plate and the second support plate are slidably arranged on the upper end of the strength testing platform.

[0015] As a preferred technical solution of the present invention, the telescopic rod includes a fixed rod fixedly set on the rotating disk and having several groups of limiting holes along its length direction, a sliding rod slidably set inside the fixed rod, and a limiting block installed on the sliding rod through a buffer spring and arranged corresponding to the limiting hole.

[0016] As a preferred technical solution of the present invention, the first test assembly and the second test assembly have the same structure, and each group of the telescopic rods in the two are arranged in a one-to-one correspondence.

[0017] As a preferred technical solution of the present invention, the clamping portion includes:

[0018] A supporting base is rotatably disposed on the telescopic rod through a rotating ring and is connected to the rotating member;

[0019] A winding rod, fixedly arranged at the upper end of the support base and having a first spiral groove formed on the outer side thereof;

[0020] A bidirectional threaded rod, rotatably disposed inside the support base and provided with a first threaded portion and a second threaded portion with opposite rotation directions;

[0021] A first sliding block and a second sliding block are formed in pairs, and are respectively arranged to be driven with the first threaded portion and the second threaded portion;

[0022] The paired first clamping block and second clamping block are fixedly arranged with the first slider and the second slider respectively, and second spiral grooves are respectively formed on opposite sides of the first clamping block and the second clamping block at positions corresponding to the first spiral grooves.

[0023] As a preferred technical solution of the present invention, the telescopic rod also includes a fixing plate fixedly arranged at the end of the sliding rod and a limiting ring arranged at one end of the fixing plate and matched with the rotating ring.

[0024] As a preferred technical solution of the present invention, the first clamping block and the second clamping block are further provided with a guide groove connected to the second spiral groove, and the guide groove is arranged in the axial direction of the rotating member.

[0025] As a preferred technical solution of the present invention, a grinding assembly is also provided at the upper end of the strength testing platform, and the grinding assembly is arranged between the first test assembly and the second test assembly. The grinding assembly includes a fixed seat, an arc plate arranged on the fixed seat and concentrically arranged with the first support plate and the second support plate, and a plurality of groups of grinding bumps arranged inside the arc plate.

[0026] The beneficial effects of the present invention are:

[0027] 1. In the present invention, high-purity gold is used as the base material, and minor elements such as silver, palladium, iron, calcium and trace elements such as tantalum and beryllium are added, so that a synergistic promotion effect is produced between the elements in the alloy, thereby obtaining a high-performance bonding high-gold wire with high gold content, high alloy wire strength and suitable for high-speed bonding, and at the same time, its tensile strength is better than that of traditional bonding alloy wires with the same wire diameter.

[0028] 2. In the present invention, two groups of relatively arranged first test components and second test components are arranged, and the two groups of test components can be translated on the strength testing platform, so that the tensile strength test of the bonded gold wire can be carried out. At the same time, by arranging multiple groups of relatively arranged telescopic rods on the first test component and the second test component, the telescopic rods cooperate with the clamping components to simultaneously test multiple groups of bonded gold wires. In addition, according to the different positions of the clamping components on the telescopic rods, when the telescopic rods drive the clamping components to rotate, the bonded gold wires can also be tested for different performances.

[0029] 3. When conducting a wear resistance test on the bonded gold wire, when the first test assembly and the second test assembly synchronously drive the bonded gold wire to rotate, the rotating parts on the first test assembly and the second test assembly will also rotate driven by the first transmission part and the third transmission part, thereby synchronously driving the bonded gold wire to rotate. This arrangement allows the bonded gold wire to be polished at various positions in the circumferential direction when conducting a polishing test on the bonded gold wire, so as to avoid polishing only one part of the bonded gold wire, which would cause inaccurate test results. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0031] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0032] Figure 2 It is a schematic diagram of the local structure of the present invention.

[0033] Figure 3 It is a structural schematic diagram of the first support plate and the first test assembly.

[0034] Figure 4 It is a cross-sectional schematic diagram of the telescopic rod.

[0035] Figure 5 It is a cross-sectional schematic diagram of the present invention.

[0036] Figure 6 A schematic diagram of the structure of the clamping assembly.

[0037] Figure 7 Another structural schematic diagram of the clamping assembly.

[0038] Figure 8 It is a schematic diagram of the structure when the first clamping block and the second clamping block in the clamping assembly are away from each other.

[0039] Fig. 9 A schematic cross-sectional view of the clamping assembly.

[0040] Fig.10 Schematic diagram of the structure of the first spiral groove and the second spiral groove.

[0041] Fig.11 for Figure 1 A local enlarged schematic diagram of point A in the middle.

[0042] In the figure: 1, strength test platform; 2, first support plate; 21, first transmission member; 22, second transmission member; 3, second support plate; 31, third transmission member; 4, first test assembly; 41, rotating disk; 42, telescopic rod; 421, fixed rod; 4211, limiting hole; 422, sliding rod; 423, buffer spring; 424, limiting block; 425, fixed plate; 426, limiting ring; 43, driving unit; 5, second test assembly; 6, clamping assembly; 61, clamp holding part; 611, supporting base; 612, rotating ring; 613, winding rod; 6131, first spiral groove; 614, bidirectional threaded rod; 6141, first threaded part; 6142, second threaded part; 615, first slider; 616, second slider; 617, first clamping block; 6171, second spiral groove; 6172, guide groove; 618, second clamping block; 62, rotating part; 7, grinding assembly; 71, fixed seat; 72, arc plate; 73, grinding bump. DETAILED DESCRIPTION

[0043] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0044] Embodiment 1

[0045] An ultra-high strength bonding high-gold wire for optical communication, the material formula of which is as follows by weight percentage: 10-25% silver, 0.8-4% palladium, 0.5-3% platinum, 0.05-0.1% iron, 0.05-0.1% tantalum, 0.02-0.08% calcium, 0.0005%-0.001% beryllium, and the rest is gold, the gold content is greater than 70%, the purity of the gold is not less than 99.999wt%; the purity of the silver is not less than 99.99wt%; the purity of the palladium is not less than 99.99wt%.

[0046] Embodiment 2

[0047] The components that are the same or corresponding to those in the first embodiment are marked with the same reference numerals as those in the first embodiment. For the sake of simplicity, only the differences from the first embodiment are described below. The second embodiment differs from the first embodiment in that:

[0048] like Figure 1-Figure 6As shown, the present invention also provides a strength test device for bonding high gold wire, comprising a strength test platform 1, a first support plate 2, a second support plate 3, a first test assembly 4 and a second test assembly 5, wherein two groups of first support plates 2 and second support plates 3 arranged on the strength test platform 1 are arranged relatively at the upper end of the strength test platform 1; the first test assembly 4 and the second test assembly 5 are respectively arranged at the relative positions of the first support plate 2 and the second support plate 3, the first test assembly 4 and the second test assembly 5 comprise a rotating disk 41 rotatably arranged on the first support plate 2 or the second support plate 3 and a plurality of groups of telescopic rods 42 arranged in an array along the circumferential direction of the rotating disk 41; a clamping assembly 6 for clamping the alloy wire is arranged at the end of the telescopic rod 42, and the clamping assembly 6 comprises a clamping portion 61 rotatably arranged at the end of the telescopic rod 42 and a rotating member 62 connected to the clamping portion 61;

[0049] The first support plate 2 is provided with a first transmission member 21 and a second transmission member 22 which are arranged to be in transmission with the rotating member 62 in sequence along the radial direction thereof, and the second support plate 3 is provided with a third transmission member 31 at a position corresponding to the first transmission member 21 .

[0050] Among them, by setting two sets of first test components 4 and second test components 5 that are arranged opposite to each other, and the two sets of test components can be translated on the strength test platform 1, the tensile strength test of the bonded gold wire can be performed. At the same time, by setting multiple sets of relatively arranged telescopic rods 42 on the first test component 4 and the second test component 5, the telescopic rods 42 cooperate with the clamping component 6 to simultaneously test multiple sets of bonded gold wires.

[0051] In addition, depending on the position of the clamping assembly 6 on the telescopic rod 42, different performance tests can be performed on the bonded gold wire when the telescopic rod 42 drives the clamping assembly 6 to rotate. For example, when the rotating member 62 in the clamping assembly 6 is located at the position of the first transmission member 21 and the third transmission member 31, when the first test assembly 4 and the second test assembly 5 rotate synchronously, the test assembly will cooperate with the polishing assembly 7 to perform a wear resistance test on the bonded gold wire. When the rotating member 62 in the clamping assembly 6 is located at the position of the second transmission member 22, since the second transmission member 22 is only arranged on the first support plate 2, when the first test assembly 4 and the second test assembly 5 rotate synchronously, the bonded gold wire will twist, and then the bonded gold wire can be subjected to a torque test.

[0052] In this embodiment, the rotating member 62 is preferably a gear, and the first transmission member 21, the second transmission member 22 and the third transmission member 31 are arc-shaped racks.

[0053] Further, if Figure 1As shown, the bases of the first support plate 2 and the second support plate 3 are slidably arranged at the upper end of the strength testing platform 1. In this way, the first test component 4 and the second test component 5 can move away from each other and also drive the bonding gold wire to lengthen, thereby realizing the tensile strength test of the bonding gold wire. In actual use, in order to facilitate the acquisition of the tensile strength value of the bonding gold wire, a tension sensor needs to be arranged in the clamping component 6. The setting of the tension sensor is a conventional method used by technicians in this field, so its specific structure and setting position will not be repeated here.

[0054] Further, if Figure 3-Figure 4 As shown, the telescopic rod 42 includes a fixed rod 421 fixedly set on the rotating disk 41 and having a plurality of groups of limiting holes 4211 along its length direction, a sliding rod 422 slidably set inside the fixed rod 421, and a limiting block 424 installed on the sliding rod 422 through a buffer spring 423 and set corresponding to the limiting hole 4211.

[0055] Among them, by setting the telescopic rod 42 to cooperate with the rotating disk 41, the relative position of the clamping assembly 6 at the end of the telescopic rod 42 can be changed along the radial direction of the rotating disk 41. When in use, pressing the limit block 424 to retract the limit block 424 into the limit hole 4211 can drive the sliding rod 422 to slide. After sliding the sliding rod 422 to a suitable position, release the limit block 424. Under the action of the rebound force of the buffer spring 423, the limit block 424 will pop out again and limit the sliding rod 422. By changing the length of the sliding rod 422 inside the fixed rod 421, the position of the clamping assembly 6 can be changed, and then the relative position of the bonding wire can be changed, which is convenient for subsequent different detection work on the bonding wire.

[0056] Further, if Figure 1-Figure 3As shown, the first test assembly 4 and the second test assembly 5 have the same structure and each group of the telescopic rods 42 in the two are arranged in a one-to-one correspondence. In addition, it should be noted that when the relative position of the slide bar 422 in the telescopic rod 42 is changed, the slide bars 422 in the corresponding two groups of telescopic rods 42 in the first test assembly 4 and the second test assembly 5 need to be moved synchronously to ensure that the bonded gold wire always remains in a horizontal state, which is convenient for subsequent detection work. Optionally, the outer side of the first test assembly 4 and the second test assembly 5 is also provided with a driving unit 43 for driving the rotating disk 41 to rotate. The driving unit 43 is fixedly arranged relative to the first support plate 2 and the second support plate 3. After completing the clamping of the bonded gold wire on the clamping assembly 6, the rotating disk 41 can be driven to rotate by controlling the driving unit 43, thereby driving the bonded gold wire to complete the detection work. It should be noted that the driving units 43 arranged on the outer sides of the first test assembly 4 and the second test assembly 5 rotate in the same direction and at the same speed during operation to ensure that the first test assembly 4 and the second test assembly 5 rotate synchronously.

[0057] Further, if Figure 5-Figure 10 As shown, the clamping portion 61 includes a support base 611, a rotating ring 612, a winding rod 613, a bidirectional threaded rod 614, a first slider 615, a second slider 616, a first clamping block 617 and a second clamping block 618. The support base 611 is rotatably arranged on the telescopic rod 42 through the rotating ring 612 and is connected to the rotating member 62; the winding rod 613 is fixedly arranged at the upper end of the support base 611 and a first spiral groove 6131 is opened on the outer side thereof; the bidirectional threaded rod 614 is rotatably arranged in the support base 611 The first and second threaded portions 6141 and 6142 are provided with opposite rotation directions; the paired first slider 615 and the second slider 616 are respectively transmission-disposed with the first threaded portion 6141 and the second threaded portion 6142; the paired first clamping block 617 and the second clamping block 618 are respectively fixedly disposed with the first slider 615 and the second slider 616, and the opposite sides of the first clamping block 617 and the second clamping block 618 are respectively provided with second spiral grooves 6171 at positions corresponding to the first spiral grooves 6131.

[0058] Among them, the traditional method for clamping and fixing the bonding wire is to use two clamping plates to clamp the bonding wire, which will cause poor clamping stability of the bonding wire and in order to ensure sufficient clamping force, the clamping plate will apply a large clamping force to the bonding wire, which is likely to have an adverse effect on the tensile strength test results of the bonding wire;

[0059] The present invention can achieve stable clamping of the bonding gold wire by setting a clamping assembly 6 in conjunction with the telescopic rod 42. By placing the bonding gold wire in a spirally wound manner inside the clamping assembly 6, no large pressure is applied to the bonding gold wire, and the test results of the tensile strength can be guaranteed.

[0060] In detail, when placing the bonding wire into the clamping assembly 6, first place the bonding wire around the first spiral groove 6131 opened on the winding rod 613, and then rotate the bidirectional threaded rod 614. At this time, the first slider 615 and the second slider 616 on the bidirectional threaded rod 614 will approach each other until the first clamping block 617 and the second clamping block 618 respectively cooperate with the winding rod 613. At this time, the bonding wire will be placed between the first spiral groove 6131 and the second spiral groove 6171, and will be stably clamped between the first clamping block 617, the second clamping block 618, and the winding rod 613.

[0061] It should be noted that, in order to facilitate the rotation of the bidirectional threaded rod 614, a handle may be provided on the outer side of the bidirectional threaded rod 614, and the bidirectional threaded rod 614 may be driven to rotate by rotating the handle.

[0062] Further, if Figure 7-Figure 8 As shown, the telescopic rod 42 also includes a fixing plate 425 fixedly arranged at the end of the sliding rod 422 and a limiting ring 426 arranged at one end of the fixing plate 425 and matched with the rotating ring 612. In this way, the rotating ring 612 will rotate inside the limiting ring 426 when rotating, thereby ensuring the stability of the clamping assembly 6 when rotating.

[0063] Further, if Figure 8-Figure 10 As shown, the first clamping block 617 and the second clamping block 618 are further provided with a guide groove 6172 connected with the second spiral groove 6171, and the guide groove 6172 is arranged in the axial direction of the rotating member 62. The advantage of such a setting is that since the axis of the rotating member 62 coincides with the axis of the bonding gold wire, when the clamping assembly 6 drives the bonding gold wire to rotate, the bonding gold wire will not shake to a large extent, thereby ensuring that: even if the bonding gold wire rotates driven by the clamping assembly 6, the bonding gold wire can always achieve continuous and stable contact with the grinding protrusion 73 in the grinding assembly 7, thereby ensuring the accuracy of the grinding test.

[0064] Further, if Figure 1 , Fig.11As shown, a grinding assembly 7 is also provided at the upper end of the strength testing platform 1, and the grinding assembly 7 is arranged between the first testing assembly 4 and the second testing assembly 5. The grinding assembly 7 includes a fixed seat 71, an arc plate 72 arranged on the fixed seat 71 and concentrically arranged with the first support plate 2 and the second support plate 3, and a plurality of groups of grinding bumps 73 arranged inside the arc plate 72.

[0065] Among them, when the wear resistance test of the bonded gold wire is carried out, when the first test component 4 and the second test component 5 synchronously drive the bonded gold wire to rotate, the rotating member 62 on the first test component 4 and the second test component 5 will also rotate under the drive of the first transmission member 21 and the third transmission member 31, thereby synchronously driving the bonded gold wire to rotate. Such an arrangement allows the bonded gold wire to be polished at various positions in the circumferential direction when the bonded gold wire is subjected to a polishing test, so as to avoid polishing only one part of the bonded gold wire, resulting in inaccurate test results.

[0066] Working process:

[0067] In the wire fixing process, the operator installs the bonding gold wires on the two groups of clamping assemblies 6 at the upper end respectively (the bonding gold wires are placed on the clamping assemblies 6 at the upper ends of the first support plate 2 and the second support plate 3 so that the bonding gold wires can avoid the arc plate 72), and then moves the slide bar 422 to drive the clamping assembly 6 to slide to a suitable position, and then rotates the rotating disk 41 to install and fix the next group of bonding gold wires until all the bonding gold wires are installed;

[0068] Adjustment process: during the wire fixing process, the slide bar 422 is moved and adjusted to different positions according to different test items (such as grinding test and torsion test) of the bonding gold wire;

[0069] During the testing process, the driving unit 43 drives the rotating disk 41 to rotate. When the bonding gold wire to be polished is driven by the rotating disk 41 to rotate, it will contact the polishing protrusion 73 on the arc plate 72. At the same time, the bonding gold wire will also rotate on the telescopic rod 42 following the clamping assembly 6.

[0070] The bonding wire undergoing the twisting test will not contact the grinding bump 73 when it rotates driven by the rotating disk 41 . The clamping assembly 6 at one end of the bonding wire will continuously rotate relative to the rotating disk 41 , while the clamping assembly 6 at the other end will be fixed relative to the rotating disk 41 .

[0071] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A strength test device for ultra-high strength bonding high gold wire for optical communication, characterized in that: The material formula of the bonding high gold wire is as follows by weight percentage: silver 10-25%, palladium 0.8-4%, platinum 0.5-3%, iron 0.05-0.1%, tantalum 0.05-0.1%, calcium 0.02-0.08%, beryllium 0.0005%-0.001%, and the rest is gold, with the gold content being greater than 70%; Strength testing equipment includes: A strength testing platform (1), having two sets of first supporting plates (2) and second supporting plates (3) arranged on the upper end thereof opposite to each other and arranged on the strength testing platform (1); A first test assembly (4) and a second test assembly (5) are respectively arranged at relative positions of the first support plate (2) and the second support plate (3); the first test assembly (4) and the second test assembly (5) comprise a rotating disk (41) rotatably arranged on the first support plate (2) or the second support plate (3), and a plurality of groups of telescopic rods (42) arranged in an array along the circumferential direction of the rotating disk (41); A clamping assembly (6) for clamping the alloy wire is provided at the end of the telescopic rod (42), the clamping assembly (6) comprising a clamping portion (61) rotatably provided at the end of the telescopic rod (42) and a rotating member (62) connected to the clamping portion (61); The first support plate (2) is provided with a first transmission member (21) and a second transmission member (22) in sequence along its radial direction and arranged to be transmitted with the rotating member (62); the second support plate (3) is provided with a third transmission member (31) at a position corresponding to the first transmission member (21); The bases of the first support plate (2) and the second support plate (3) are slidably arranged on the upper end of the strength testing platform (1); A grinding assembly (7) is also provided at the upper end of the strength test platform (1), the grinding assembly (7) being arranged between the first test assembly (4) and the second test assembly (5), the grinding assembly (7) comprising a fixing seat (71), an arc plate (72) arranged on the fixing seat (71) and concentrically arranged with the first support plate (2) and the second support plate (3), and a plurality of groups of grinding bumps (73) arranged inside the arc plate (72).

2. The strength testing equipment for ultra-high strength bonding high gold wire for optical communication according to claim 1, characterized in that: The purity of the gold is not less than 99.999wt%; the purity of the silver is not less than 99.99wt%; and the purity of the palladium is not less than 99.99wt%.

3. The strength testing equipment for ultra-high strength bonding high gold wire for optical communication according to claim 1, characterized in that: The telescopic rod (42) comprises a fixed rod (421) fixedly arranged on the rotating disk (41) and provided with a plurality of groups of limiting holes (4211) along its length direction, a sliding rod (422) slidably arranged inside the fixed rod (421), and a limiting block (424) mounted on the sliding rod (422) via a buffer spring (423) and arranged corresponding to the limiting hole (4211).

4. The strength testing equipment for ultra-high strength bonding high gold wire for optical communication according to claim 3, characterized in that: The first test assembly (4) and the second test assembly (5) have the same structure, and each set of telescopic rods (42) in the two are arranged in a one-to-one correspondence.

5. The strength testing equipment for ultra-high strength bonding high gold wire for optical communication according to claim 4, characterized in that: The clamping portion (61) comprises: A supporting base (611) is rotatably disposed on the telescopic rod (42) via a rotating ring (612) and is connected to the rotating member (62); A winding rod (613) is fixedly arranged at the upper end of the support base (611) and has a first spiral groove (6131) formed on its outer side; A bidirectional threaded rod (614) rotatably disposed inside the support base (611) and provided with a first threaded portion (6141) and a second threaded portion (6142) having opposite rotation directions; A pair of first sliding blocks (615) and second sliding blocks (616) are respectively arranged to be in transmission with the first threaded portion (6141) and the second threaded portion (6142); The paired first clamping block (617) and the second clamping block (618) are fixedly arranged on the first sliding block (615) and the second sliding block (616), respectively, and second spiral grooves (6171) are respectively provided on opposite sides of the first clamping block (617) and the second clamping block (618) at positions corresponding to the first spiral groove (6131).

6. The strength testing equipment for ultra-high strength bonding high gold wire for optical communication according to claim 5, characterized in that: The telescopic rod (42) further comprises a fixing plate (425) fixedly arranged at the end of the sliding rod (422), and a limiting circular ring (426) arranged at one end of the fixing plate (425) and cooperating with the rotating ring (612).

7. The strength testing equipment for ultra-high strength bonding high gold wire for optical communication according to claim 6, characterized in that: The first clamping block (617) and the second clamping block (618) are also provided with a guide groove (6172) which is connected to the second spiral groove (6171), and the guide groove (6172) is arranged in the axial direction of the rotating member (62).

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