Chip mounting head and its mounting process

Abstract

The present invention relates to the field of chip mounting technology, and in particular to a chip mounting head and a mounting process thereof; the present invention provides a chip mounting head, comprising: a first adapter, the first adapter is arranged below a mounting robot, and the first adapter is hollow inside; a hollow motor, the hollow motor is fixed below the first adapter; a heating module, the heating module is fixed at the end of the rotating shaft of the hollow motor, a negative pressure air pipe, the negative pressure air pipe runs through the first adapter and the hollow motor, and the negative pressure air pipe is connected to the negative pressure air holes on the heating module; a debubble assembly, the debubble assembly is arranged to be lifted below the heating module, and the debubble assembly is linked to the negative pressure air pipe; wherein the debubble assembly moves downward until it abuts against a workpiece, and the negative pressure air pipe starts negative pressure suction; the debubble assembly moves upward relative to the heating module, and the friction ring of the debubble assembly is suitable for being sleeved on the outer wall of the negative pressure air pipe.

Description

Technical Field

[0001] The invention relates to the technical field of chip mounting, and in particular to a chip mounting head and a mounting process thereof. Background Art

[0002] Chip mounting is a technology that connects semiconductor chips to substrates or packages. During mounting, glue is applied to the bottom of the chip, and the mounting head absorbs the chip and mounts it on the substrate.

[0003] The conventional chip mounting head has an adsorption head and a chip and fixes the chip to the substrate. In order to improve the fixing effect of the glue and the substrate, the end of the chip mounting head is often provided with a heating module, which can prevent the glue from curing too quickly during the mounting process.

[0004] Although the heating module prolongs the curing time of the glue, bubbles will be generated between the chip and the substrate when the glue is bonding the two, and the generation of bubbles will cause the fixing stability of the chip and the substrate to deteriorate.

[0005] Therefore, how to prevent glue from generating bubbles during chip mounting is a technical problem that needs to be solved urgently in this field. Summary of the invention

[0006] The purpose of the present invention is to provide a chip mounting head and a chip mounting process thereof.

[0007] In order to solve the above technical problems, the present invention provides a chip mounting head, comprising:

[0008] The first adapter is arranged below the placement robot and is hollow inside;

[0009] A hollow motor, arranged below the first adapter;

[0010] A heating module is arranged at the end of the rotating shaft of the hollow motor; a negative pressure air pipe runs through the first adapter and the hollow motor and is connected to the negative pressure air hole on the heating module;

[0011] A debubble assembly, which is lifted and arranged below the heating module, and is linked to the negative pressure air pipe;

[0012] The debubble assembly moves downward until it contacts the workpiece, and the negative pressure air pipe starts negative pressure suction;

[0013] The debubble assembly moves upward relative to the heating module, and the friction ring of the debubble assembly is suitable for being sleeved on the outer wall of the negative pressure air pipe.

[0014] Preferably, the defoaming assembly comprises: a contact plate, the contact plate and the heating module are parallel to each other, and a plurality of springs are fixed between the contact plate and the heating module;

[0015] A positioning cylinder, wherein the positioning cylinder is fixed above the contact plate and is hollow;

[0016] A friction ring is fixed on the inner wall of the positioning tube, and the inner diameter of the friction ring is smaller than the outer diameter of the negative pressure air pipe.

[0017] Preferably, the friction ring is a flexible member, the negative pressure air pipe is inserted into the positioning tube, and the friction ring is suitable for wrapping and clamping the negative pressure air pipe from all sides.

[0018] Preferably, a negative pressure hole is provided on the contact plate, and the negative pressure hole is connected to the negative pressure air pipe.

[0019] Preferably, the positioning tube is circumferentially arranged around the negative pressure hole, and the inner diameter of the positioning tube is larger than the inner diameter of the negative pressure hole.

[0020] Preferably, the heating module is hollow, and a bearing is fixed to the inner ring of the heating module;

[0021] The outer wall of the positioning cylinder is suitable for abutting against the inner ring of the bearing, and the positioning cylinder is suitable for moving up and down relative to the inner ring of the bearing.

[0022] Preferably, the inner diameter of the positioning tube is not less than the outer diameter of the negative pressure air pipe.

[0023] Preferably, a gap is provided between the positioning cylinder and the lower end of the negative pressure air pipe, and a gap is provided between the outer wall of the negative pressure air pipe and the inner ring of the hollow motor.

[0024] Preferably, when the negative pressure air pipe is not inserted into the positioning tube, the negative pressure air pipe is suitable for dissipating heat from the heating module during negative pressure suction.

[0025] Preferably, the placement head further includes a second adapter, the second adapter is fixed to the lower end of the placement robot, and the second adapter is hollow.

[0026] Preferably, a force sensor is fixed at the lower end of the second adapter, and the force sensor is arranged between the second sensor and the first adapter, and the force sensor is connected to the placement robot via an electrical signal.

[0027] On the other hand, the present invention also provides a chip mounting process of a chip mounting head, comprising the following steps:

[0028] One end of the negative pressure air pipe is connected to the air pump, and the air pump is suitable for sucking the air in the negative pressure air pipe when working;

[0029] The placement robot drives the heating module to move toward the workpiece until the lower end of the debubble assembly abuts against the workpiece, the heating module continues to move downward, and the debubble assembly moves upward relative to the heating module until the lower end of the negative pressure air pipe is inserted into the positioning cylinder of the debubble assembly;

[0030] The negative pressure air pipe is opened to suck air under negative pressure, and at the same time, the friction between the negative pressure air pipe and the friction ring increases, so that the contact plate limit heating module moves downward; the contact plate of the debubble component negatively absorbs the workpiece, and when the workpiece moves to abut against the substrate; the negative pressure air pipe stops pumping air; the spring pushes the contact plate to move downward, and the contact plate squeezes the workpiece to make it continue to move toward the substrate, and the contact plate squeezes out excess glue between the workpiece and the substrate; and the bubbles in the glue between the workpiece and the substrate are removed.

[0031] The beneficial effect of the present invention is that the chip mounting head of the present invention, through the setting of the debubble assembly, after the debubble assembly adsorbs the workpiece and makes it abut against the substrate, the contact plate can continue to move downward relative to the heating module, which can not only remove the excess glue between the workpiece and the substrate and reduce the thickness of the glue layer, but also squeeze out the bubbles in the glue. When the negative pressure air pipe is not inserted into the positioning cylinder, the negative pressure air pipe can absorb the heat generated by the heating module, avoiding the over-high temperature of the heating module, improving the life of the equipment, and at the same time, improving the stability of the workpiece mounted on the substrate.

[0032] Other features and advantages of the present invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practicing the present invention.

[0033] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0035] Figure 1 is a stereogram of a preferred embodiment of a chip attach head of the present invention;

[0036] Figure 2 is a stereoscopic view of the defoaming assembly of the present invention;

[0037] Figure 3 is a cutaway stereogram of a patch head of the present invention;

[0038] Figure 4 It is a schematic diagram of a state in which the negative pressure air tube of the present invention is inserted into a positioning tube.

[0039] In the figure:

[0040] 1. First adapter; 2. Hollow motor; 3. Heating module; 31. Bearing; 4. Negative pressure air pipe; 5. Debubble assembly; 51. Contact plate; 52. Positioning cylinder; 53. Friction ring; 54. Negative pressure hole; 6. Second adapter; 7. Force sensor. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] In some embodiments, Figures 1 to 4 As shown, the present invention provides a chip mounting head, including: a first adapter 1, which is arranged below the mounting robot, and the first adapter 1 is hollow inside; a hollow motor 2, which is fixed below the first adapter 1; a heating module 3, which is fixed at the end of the rotating shaft of the hollow motor 2, and the heating module 3 is suitable for abutting against the chip; a negative pressure air pipe 4, which runs through the first adapter 1 and the hollow motor 2, and the negative pressure air pipe 4 is connected to the negative pressure air hole on the heating module 3; a second adapter 6, which is fixed at the lower end of the mounting robot, and the second adapter 6 is hollow. A force sensor 7 is fixed at the lower end of the second adapter 6, and the force sensor 7 is arranged between the second sensor and the first adapter 1, and the force sensor 7 is connected to the mounting robot electrical signal. The debubble assembly 5 is arranged to be lifted and lowered below the heating module 3, and the debubble assembly 5 is linked with the negative pressure air pipe 4; wherein, the debubble assembly 5 moves downward until it contacts the workpiece, and the negative pressure air pipe 4 starts negative pressure suction; the debubble assembly 5 moves upward relative to the heating module 3, and the friction ring 53 of the debubble assembly 5 is suitable for being sleeved on the outer wall of the negative pressure air pipe 4. Through the arrangement of the debubble assembly 5, after the debubble assembly 5 adsorbs the workpiece and contacts the substrate, the contact plate 51 can continue to move downward relative to the heating module 3, which can not only remove the excess glue between the workpiece and the substrate, reduce the thickness of the glue layer, but also squeeze out the bubbles in the glue. When the negative pressure air pipe 4 is not inserted into the positioning tube 52, the negative pressure air pipe 4 can work to suck away the heat generated by the heating module 3, avoid the over-high temperature of the heating module 3, improve the life of the equipment, and at the same time, improve the stability of the workpiece mounted on the substrate.

[0043] Reference Figure 2 and Figure 3 The defoaming assembly 5 includes: a contact plate 51, which is parallel to the heating module 3, and a plurality of springs are fixed between the contact plate 51 and the heating module 3; the heating module 3 is suitable for heating the contact plate 51, a positioning cylinder 52, which is fixed above the contact plate 51 and is hollow; a friction ring 53, which is fixed to the inner wall of the positioning cylinder 52, and the inner diameter of the friction ring 53 is smaller than the outer diameter of the negative pressure air pipe 4. The friction ring 53 is a flexible member, and the negative pressure air pipe 4 is inserted into the positioning cylinder 52, and the friction ring 53 is suitable for wrapping and clamping the negative pressure air pipe 4 from all sides. When the contact plate 51 is pushed upward by the workpiece, the friction ring 53 is suitable for being sleeved on the outer wall of the negative pressure air pipe 4. At this time, the negative pressure air pipe 4 is connected and sealed with the positioning tube 52, and the friction ring 53 is pushed and deformed by the negative pressure air pipe 4. The friction force between the friction ring 53 and the negative pressure air pipe 4, as well as the negative pressure suction force of the negative pressure air pipe 4, is greater than the elastic force of the spring; in the process of the contact plate 51 negatively adsorbing the workpiece, the spring will not push the contact plate 51 to move away from the heating module 3. A negative pressure hole 54 is provided on the contact plate 51, and the negative pressure hole 54 is connected to the negative pressure air pipe 4. When the negative pressure air pipe 4 is inserted into the positioning tube 52, the negative pressure air pipe 4 is suitable for passing through the negative pressure hole 54 to negatively adsorb the workpiece at the bottom of the contact plate 51. The positioning tube 52 is arranged circumferentially around the negative pressure hole 54, and the inner diameter of the positioning tube 52 is larger than the inner diameter of the negative pressure hole 54.

[0044] Optionally, the heating module 3 is hollow, and a bearing 31 is fixed to the inner ring of the heating module 3; the outer wall of the positioning cylinder 52 is suitable for abutting against the inner ring of the bearing 31, and the positioning cylinder 52 is suitable for moving up and down relative to the inner ring of the bearing 31. When the hollow motor 2 drives the heating module 3 to rotate circumferentially, the contact plate 51 rotates synchronously with the heating module 3, and the positioning cylinder 52 is suitable for rotating circumferentially relative to the negative pressure air pipe 4.

[0045] Reference Figure 3 The inner diameter of the positioning tube 52 is not less than the outer diameter of the negative pressure air tube 4. The negative pressure air tube 4 is suitable for being inserted into the positioning tube 52.

[0046] In order to facilitate cooling of the heating module 3, a gap is provided between the positioning cylinder 52 and the lower end of the negative pressure air pipe 4, and a gap is provided between the outer wall of the negative pressure air pipe 4 and the inner ring of the hollow motor 2. When the contact plate 51 is not in contact with the workpiece, the negative pressure air pipe 4 is suitable for extracting the air in the hollow motor 2 and the heating module 3 when the air pump sucks air under negative pressure, so as to accelerate the heat dissipation and cooling of the hollow motor 2 and the heating module 3. When the negative pressure air pipe 4 is not inserted into the positioning cylinder 52, the negative pressure air pipe 4 is suitable for dissipating heat from the heating module 3 when sucking under negative pressure.

[0047] In some embodiments, the present invention further provides a chip mounting head mounting process, comprising the following steps:

[0048] One end of the negative pressure air pipe 4 is connected to the air pump, and the air pump is suitable for sucking the air in the negative pressure air pipe 4 when working;

[0049] The placement robot drives the heating module 3 to move toward the workpiece until the lower end of the debubble assembly 5 abuts against the workpiece, and the heating module 3 continues to move downward, and the debubble assembly 5 moves upward relative to the heating module 3 until the lower end of the negative pressure air pipe 4 is inserted into the positioning cylinder 52 of the debubble assembly 5;

[0050] The negative pressure air pipe 4 is opened to suck air under negative pressure, and at the same time, the friction force between the negative pressure air pipe 4 and the friction ring 53 is increased, so that the contact plate 51 cannot move downward relative to the heating module 3; at this time, the contact plate 51 of the debubble assembly 5 is suitable for negative pressure adsorption of the workpiece, and when the workpiece moves to abut against the substrate; the negative pressure air pipe 4 stops pumping air; at this time, the spring pushes the contact plate 51 to move downward, and the contact plate 51 is suitable for squeezing the workpiece to make it continue to move toward the substrate, and the contact plate 51 can squeeze out the excess glue between the workpiece and the substrate; at the same time, it can also remove bubbles in the glue between the workpiece and the substrate.

[0051] The various devices selected in this application (components whose specific structures are not described) are all universal standard parts or components known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or conventional experimental methods.

[0052] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0053] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0054] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A chip mounting head, characterized in that: include: A first adapter (1) is arranged below the mounting robot and is hollow inside; A hollow motor (2) fixed below the first adapter (1); A heating module (3) is fixed to the end of the rotating shaft of the hollow motor (2); a negative pressure air pipe (4) passes through the first adapter (1) and the hollow motor (2), and is connected to the negative pressure air hole on the heating module (3); A defoaming component (5) is arranged to be lifted below the heating module (3) and is linked to the negative pressure air pipe (4); The debubble assembly (5) moves downward until it contacts the workpiece, and the negative pressure air pipe (4) starts negative pressure suction; The debubble assembly (5) moves upward relative to the heating module (3), and the friction ring (53) of the debubble assembly (5) is suitable for being sleeved on the outer wall of the negative pressure air pipe (4); The debubble assembly (5) comprises: a contact plate (51), the contact plate (51) and the heating module (3) being parallel to each other, and a plurality of springs being fixed between the contact plate (51) and the heating module (3); A positioning cylinder (52), the positioning cylinder (52) being fixed above the contact plate (51), and the positioning cylinder (52) being hollow; A friction ring (53), the friction ring (53) being fixed to the inner wall of the positioning cylinder (52), and the inner diameter of the friction ring (53) being smaller than the outer diameter of the negative pressure air pipe (4).

2. The chip attach head according to claim 1, characterized in that: The friction ring (53) is a flexible member, and the negative pressure air pipe (4) is inserted into the positioning tube (52). The friction ring (53) is suitable for wrapping and clamping the negative pressure air pipe (4) from all sides.

3. The chip attach head according to claim 2, characterized in that: The contact plate (51) is provided with a negative pressure hole (54), and the negative pressure hole (54) is in communication with the negative pressure air pipe (4).

4. The chip attach head according to claim 3, characterized in that: The positioning cylinder (52) is circumferentially arranged around the negative pressure hole (54), and the inner diameter of the positioning cylinder (52) is greater than the inner diameter of the negative pressure hole (54).

5. The chip attach head according to claim 4, characterized in that: The heating module (3) is hollow, and a bearing (31) is fixed to the inner ring of the heating module (3); The outer wall of the positioning cylinder (52) is suitable for abutting against the inner ring of the bearing (31), and the positioning cylinder (52) is suitable for moving up and down relative to the inner ring of the bearing (31).

6. The chip attach head according to claim 5, characterized in that: The inner diameter of the positioning cylinder (52) is not less than the outer diameter of the negative pressure air pipe (4).

7. The chip attach head according to claim 6, characterized in that: A gap is provided between the positioning cylinder (52) and the lower end of the negative pressure air pipe (4), and a gap is provided between the outer wall of the negative pressure air pipe (4) and the inner ring of the hollow motor (2).

8. The chip attach head according to claim 7, characterized in that: When the negative pressure air pipe (4) is not inserted into the positioning tube (52), the negative pressure air pipe (4) is suitable for dissipating heat from the heating module (3) during negative pressure suction.

9. The chip attach head according to claim 8, characterized in that: The placement head further comprises a second adapter (6), the second adapter (6) being fixed to the lower end of the placement robot, and the second adapter (6) being hollow.

10. The chip attach head according to claim 9, characterized in that: A force sensor (7) is fixed at the lower end of the second adapter (6), the force sensor (7) being arranged between the second sensor and the first adapter (1), and the force sensor (7) being in electrical signal communication with the mounting robot.

11. A chip bonding process using the chip bonding head as claimed in claim 10, characterized in that: include: The negative pressure air pipe (4) is connected to the air pump, and the air pump is suitable for sucking the air in the negative pressure air pipe (4) when working; The mounting robot drives the heating module (3) to move toward the workpiece until the lower end of the debubble assembly (5) abuts against the workpiece, the heating module (3) continues to move downward, and the debubble assembly (5) moves upward relative to the heating module (3) until the lower end of the negative pressure air pipe (4) is inserted into the positioning cylinder (52) of the debubble assembly (5); The negative pressure air pipe (4) is opened to suck air under negative pressure, and at the same time, the friction between the negative pressure air pipe (4) and the friction ring (53) is increased, so that the contact plate (51) limits the heating module (3) to move downward; the contact plate (51) of the debubble assembly (5) is suitable for negative pressure adsorption of the workpiece, and when the workpiece moves to abut against the substrate; the negative pressure air pipe (4) stops sucking air; the spring pushes the contact plate (51) to move downward, the contact plate (51) squeezes the workpiece to make it continue to move towards the substrate, and the contact plate (51) squeezes out excess glue between the workpiece and the substrate; and the bubbles in the glue between the workpiece and the substrate are removed.

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