A wet etching device and method for preparing TGV blind vias

Abstract

The present invention discloses a wet etching device and method for preparing TGV blind vias, which includes a base. Above the base, there is a support disk for loading a single glass substrate. On one side of the support disk, there is an etching solution spraying mechanism for spraying etching solution to prepare blind vias on the glass substrate. On the other side of the support disk, there is a cleaning solution spraying mechanism for spraying cleaning solution to clean the etched surface of the glass substrate. On the other side of the support disk, there is also a jet drying mechanism for spraying nitrogen to dry the etched surface of the glass substrate. At the center of the support disk, there is a back spraying assembly for continuously spraying nitrogen to protect the back of the glass substrate. The wet etching of TGV blind vias in the present invention is single-piece rotary etching, with good hole wall roughness and good etching uniformity. At the same time, single-piece rotary cleaning can also avoid the attachment of etching by-products to the inner wall and improve the cleaning efficiency of micro-holes.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and particularly to a wet etching device and method for preparing TGV blind holes. Background Art

[0002] The TGV (Through Glass Via) interconnection technology has application advantages such as excellent high-frequency electrical characteristics, low cost, simple process flow, and strong mechanical stability, and has broad application prospects in the fields of radio frequency devices, microelectromechanical system (MEMS) packaging, optoelectronic system integration, etc.

[0003] As Figure 1 shown, the current mainstream method for forming TGV holes is the laser-induced plus HF immersion etching method, but there are many problems in terms of hole formation rate, sidewall roughness, the presence of etching by-products on the sidewalls, hole taper, etc., which affect subsequent metallization processing and yield. Summary of the Invention

[0004] The purpose of the present invention is to provide a wet etching device and method for preparing TGV blind holes to solve the defects existing in the preparation of TGV blind holes by the existing laser-induced plus HF immersion etching method.

[0005] To solve the above technical problems, the present invention provides a wet etching device for preparing TGV blind holes, including a base,

[0006] Above the base, there is a support disk for loading a single glass substrate;

[0007] On one side of the support disk, there is an etching solution spraying mechanism for spraying etching solution to prepare blind holes on the glass substrate;

[0008] On the other side of the support disk, there is a cleaning solution spraying mechanism for spraying cleaning solution to clean the etched surface of the glass substrate;

[0009] On the other side of the support disk, there is also a jet drying mechanism for spraying nitrogen to dry the etched surface of the glass substrate;

[0010] In the center of the support disk, there is a back spray assembly for continuously spraying nitrogen to protect the back of the glass substrate.

[0011] Preferably, the support disk is a disk, and a rotating motor is provided below it, and the support disk is connected to the output shaft of the rotating motor. Under the action of the rotating motor, the support disk and the glass substrate loaded above are driven to rotate;

[0012] The output shaft of the rotating motor is a hollow shaft, and the back spray pipe of the back spray assembly extends along the hollow shaft and passes through the center of the support disk to protect the back of the glass substrate loaded on the support disk by continuously spraying nitrogen.

[0013] Preferably, a plurality of clamping members are arranged on the circumference of the support disk for clamping and fixing a single glass substrate.

[0014] Preferably, the clamping members are a plurality of centrifugal clamping members evenly arranged on the circumference of the support disk. The centrifugal clamping members include a triangular base, and two positioning columns are symmetrically arranged on both sides of the triangular base. A single glass substrate is placed on the two positioning columns;

[0015] The centrifugal clamping member further includes a centrifugal pendulum pressing hammer, and the centrifugal pendulum pressing hammer is installed between the two positioning columns through a rotating shaft; and a counterweight is provided at the tail of the centrifugal pendulum pressing hammer. Under the action of gravity, the centrifugal pendulum pressing hammer naturally hangs down to avoid the placement area of the positioning column; when the centrifugal clamping member rotates at a high speed with the support disk, the counterweight at the tail of the centrifugal pendulum pressing hammer is lifted under the action of centrifugal force, so that the head of the centrifugal pendulum pressing hammer presses and fixes the single glass substrate on the positioning column.

[0016] Preferably, the clamping members are a plurality of electrostatic chucks evenly arranged on the circumference of the support disk. The electrostatic chucks include a base substrate, a dielectric layer and an electrode;

[0017] The dielectric layer is fixedly bonded to the base substrate, contacts the back surface of the glass substrate and adsorbs and fixes it;

[0018] The electrode is embedded and installed in the base substrate and is electrically connected to the dielectric layer;

[0019] The electrodes of each electrostatic chuck also extend from the edge of the support disk to the center through an electrical contact part and an electrical extension part to connect to the same power supply;

[0020] The electrostatic chuck further includes a plug-in block, and is detachably plugged with the support disk through the plug-in block.

[0021] Preferably, a liftable protective cover is provided outside the support disk;

[0022] The protective cover includes an outer cover and an inner cover arranged in a nested manner. Outer cover lifting cylinders are provided on both sides of the outer cover, and the outer cover is driven to lift in the vertical direction through the outer cover lifting cylinders; inner cover lifting cylinders are provided on both sides of the inner cover, and the inner cover is driven to lift in the vertical direction through the inner cover lifting cylinders;

[0023] Arc-shaped covers are provided at the tops of the outer cover and the inner cover for blocking and collecting etching liquid or cleaning liquid splashed out by the rotation of the glass substrate;

[0024] When the cleaning liquid spraying mechanism sprays cleaning liquid to clean the etched surface of the glass substrate, the outer cover lifting cylinder drives the outer cover to rise. At this time, the cleaning liquid splashed out due to the rotation of the glass substrate is blocked by the outer cover and then flows downward along its inner wall, and converges into the cleaning liquid recovery pipe at the bottom of the outer cover;

[0025] When the etching liquid spraying mechanism sprays etching liquid to prepare blind holes on the glass substrate, the inner cover lifting cylinder drives the inner cover to rise. At this time, the etching liquid splashed out due to the rotation of the glass substrate is blocked by the inner cover and then flows downward along its inner wall, and converges into the etching liquid recovery pipe at the bottom of the inner cover.

[0026] Preferably, a plurality of negative pressure suction pipes are arranged inside the inner cover. One end of the negative pressure suction pipe extends to the inside of the inner cover, and the other end extends to the annular negative pressure groove. The gas inside the inner cover connecting the annular negative pressure groove and the negative pressure suction pipe is sucked out by an external negative pressure device, so as to suck out the floating substances generated by etching.

[0027] Preferably, the etching liquid spraying mechanism includes an etching liquid megasonic wave nozzle, a first swing arm, a first lifting cylinder, a first rotating motor and a first fixing seat. The etching liquid spraying mechanism is fixedly installed on the base through the first fixing seat. The first rotating motor, the first lifting cylinder and the first swing arm are sequentially installed on the first fixing seat, and the etching liquid megasonic wave nozzle is installed at the front end of the first swing arm; and the etching liquid megasonic wave nozzle is connected to the liquid storage tank of the etching liquid through a liquid medicine pipe; during etching, the first lifting cylinder drives the first swing arm and the etching liquid megasonic wave nozzle to lift above the glass substrate, and the first rotating motor drives the first swing arm and the etching liquid megasonic wave nozzle to reciprocate along the radius of the glass substrate;

[0028] The cleaning liquid spraying mechanism includes a cleaning liquid megasonic wave nozzle, a second swing arm, a second lifting cylinder, a second rotating motor and a second fixing seat. The cleaning liquid spraying mechanism is fixedly installed on the base through the second fixing seat. The second rotating motor, the second lifting cylinder and the second swing arm are sequentially installed on the second fixing seat, and the cleaning liquid megasonic wave nozzle is installed at the front end of the second swing arm; and the cleaning liquid megasonic wave nozzle is connected to the liquid storage tank of the cleaning liquid through a cleaning liquid pipe; during cleaning, the second lifting cylinder drives the second swing arm and the cleaning liquid megasonic wave nozzle to lift above the glass substrate, and the second rotating motor drives the second swing arm and the cleaning liquid megasonic wave nozzle to reciprocate along the radius of the glass substrate.

[0029] Preferably, the jet drying mechanism includes a gas nozzle, a third swing arm, a third lifting cylinder, a third rotating motor, and a third fixed seat. The jet drying mechanism is fixedly installed on the base through the third fixed seat. The third rotating motor, the third lifting cylinder, and the third swing arm are sequentially installed on the third fixed seat, and the gas nozzle is installed at the front end of the third swing arm. The gas nozzle is connected to a nitrogen gas storage tank through a nitrogen gas pipe. During drying, the third lifting cylinder drives the third swing arm and the gas nozzle to lift above the glass substrate, and the third rotating motor drives the third swing arm and the gas nozzle to reciprocate along the radius of the glass substrate.

[0030] The present invention also provides a method for preparing TGV blind holes by a wet etching device, which includes the following steps:

[0031] Step A: Laser-induced deformation. First, a preset small hole is formed on the glass substrate by laser, and then the glass substrate irradiated by the laser is placed on the support disk by a manipulator.

[0032] Step B: First cleaning with ultrapure water

[0033] Step B1: After being detected as normal by the detection sensor on one side of the support disk, the outer cover rises under the action of the outer cover lifting cylinder, and the rotating motor drives the support disk and the glass substrate placed on the support disk to rotate, and the rotation speed is 300 - 3000 rpm.

[0034] Step B2: Then start the second rotating motor to drive the cleaning liquid megasonic wave nozzle at the end of the second swing arm to swing to the center of the glass substrate, and at the same time start the second lifting cylinder to drive the cleaning liquid megasonic wave nozzle to descend close to the etching surface of the glass substrate.

[0035] Step B3: Then open the ultrapure water control valve, spray ultrapure water onto the etching surface of the glass substrate through the cleaning liquid megasonic wave nozzle, and the flow rate of the ultrapure water is 300 - 800 ml / min. At the same time, open the control valve of the back spray assembly, and continuously spray nitrogen gas onto the back of the glass substrate through the back spray pipe, and the flow rate of the nitrogen gas is 2 - 6 L / min.

[0036] Step B4: During the process of spraying ultrapure water by the cleaning liquid megasonic wave nozzle, the second rotating motor drives the second swing arm to reciprocate along the radius of the glass substrate, and the swing speed is 1 - 150 mm / sec. The cleaning time is 20 - 60 s, so as to clean the impurities on the surface of the glass substrate after laser irradiation and prepare for etching. During the cleaning process, the ultrapure water splashes outward with the high-speed rotation of the glass substrate, flows downward along the inner wall of the outer cover after being blocked by the outer cover, and is collected in the cleaning liquid recovery pipe at the bottom of the outer cover.

[0037] Step B5: After the cleaning is completed, the ultrapure water control valve closes, and the second lifting cylinder and the second rotary motor drive the second swing arm and the cleaning liquid megasonic nozzle to swing back to the origin position;

[0038] Step C: Etching with etching solution,

[0039] Step C1: After the cleaning is completed, the inner cover rises under the action of the inner cover lifting cylinder, and then the first rotary motor is started to drive the etching liquid megasonic nozzle at the end of the first swing arm to swing to the center of the glass substrate. At the same time, the first lifting cylinder is started to drive the etching liquid megasonic nozzle to descend close to the etching surface of the glass substrate;

[0040] Step C2: Then open the etching solution control valve, and spray the etching solution onto the etching surface of the glass substrate through the etching liquid megasonic nozzle. The flow rate of the etching solution is 300 - 500 ml / min, and the temperature is 23 - 45 °C;

[0041] Step C3: During the process of spraying the etching solution by the etching liquid megasonic nozzle, the first rotary motor drives the first swing arm to reciprocate along the radius of the glass substrate, and the swing speed is 1 - 150 mm / sec; the spraying time is 100 - 1800 s; during the etching process, the etching solution splashes outward with the high-speed rotation of the glass substrate, and after being blocked by the inner cover, it flows downward along the inner wall of the inner cover and collects in the etching solution recovery pipe at the bottom of the inner cover;

[0042] Step C4: After the etching is completed, the etching solution control valve closes, and the first lifting cylinder and the first rotary motor drive the first swing arm and the etching liquid megasonic nozzle to swing back to the origin position;

[0043] Step D: Secondary cleaning with ultrapure water, repeat the operations of steps B2 - B5 to quickly replace the etching solution on the glass substrate and clean the impurities in the etching blind holes;

[0044] Step E: Drying,

[0045] Step E1: Start the third rotary motor to drive the gas nozzle at the end of the third swing arm to swing to the center of the glass substrate. At the same time, start the third lifting cylinder to drive the gas nozzle to descend close to the etching surface of the glass substrate

[0046] Step E2: Then open the nitrogen control valve, and spray dry nitrogen onto the etching surface of the glass substrate through the gas nozzle;

[0047] Step E3: During the process of drying with dry nitrogen sprayed by the gas nozzle, the third rotary motor drives the third swing arm to perform fixed-point drying or reciprocate along the radius of the glass substrate, and the swing speed is 1 - 150 mm / sec; the cleaning time is 30 - 60 s;

[0048] Step E4: After drying is completed, close the nitrogen control valve. The third lifting cylinder and the third rotating motor drive the third swing arm and the gas nozzle to swing back to the origin position.

[0049] Step F: For blanking and inspection, close the control valve of the back spray assembly. The outer cover lifting cylinder and the inner cover lifting cylinder drive the outer cover and the inner cover to descend simultaneously. The manipulator takes out the etched glass substrate and transports it to the inspection equipment to detect the via hole formation rate and the blind hole roughness.

[0050] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0051] 1. The wet etching of TGV blind holes in the present invention is single-piece rotary etching, with good hole wall roughness and good etching uniformity. At the same time, single-piece rotary cleaning can also avoid the attachment of etching by-products to the inner wall and improve the cleaning efficiency of micro-holes.

[0052] 2. The etching liquid spraying mechanism, the cleaning liquid spraying mechanism, and the air jet drying mechanism in the present invention all have independent lifting and rotating functions, and can orderly perform cleaning, etching, and drying processes on the glass substrate, further improving the etching efficiency of TGV blind holes on the glass substrate.

[0053] 3. The wet etching device of the present invention is also provided with a back spray assembly, which can protect the back of the glass substrate by continuously spraying nitrogen to prevent its back from being damaged.

[0054] 3. The protective cover in the wet etching device of the present invention is divided into an outer cover and an inner cover, and the outer cover and the inner cover are independently lifted by lifting cylinders respectively. When the cleaning liquid spraying mechanism sprays cleaning liquid to clean the etched surface of the glass substrate, the outer cover lifting cylinder drives the outer cover to rise. At this time, the cleaning liquid splashed out due to the rotation of the glass substrate is blocked by the outer cover and flows downward along its inner wall, and is collected in the cleaning liquid recovery pipe at the bottom of the outer cover for recycling. When the etching liquid spraying mechanism sprays etching liquid to prepare blind holes on the glass substrate, the inner cover lifting cylinder drives the inner cover to rise. At this time, the etching liquid splashed out due to the rotation of the glass substrate is blocked by the inner cover and flows downward along its inner wall, and is collected in the etching liquid recovery pipe at the bottom of the inner cover for recycling. Description of the Drawings

[0055] Figure 1 is a schematic diagram of the current mainstream method for TGV via hole formation;

[0056] Figure 2 is a schematic structural diagram of the wet etching device for preparing TGV blind holes provided by the present invention;

[0057] Figure 3 is a top view of the wet etching device for preparing TGV blind holes provided by the present invention;

[0058] Figure 4It is a cross-sectional view of the wet etching device for preparing TGV blind holes provided by the present invention;

[0059] Figure 5 It is a schematic structural diagram of the support plate adopting a centrifugal clamping member provided by the present invention;

[0060] Figure 6 It is a layout diagram of the centrifugal clamping member on the support plate provided by the present invention;

[0061] Figure 7 It is a schematic structural diagram of the centrifugal clamping member from the first perspective provided by the present invention;

[0062] Figure 8 It is a schematic structural diagram of the centrifugal clamping member from the second perspective provided by the present invention;

[0063] Figure 9 It is a schematic structural diagram of the centrifugal clamping member from the third perspective provided by the present invention;

[0064] Figure 10 It is a schematic structural diagram of the support plate adopting an electrostatic chuck provided by the present invention;

[0065] Figure 11 It is a layout diagram of the electrostatic chuck on the support plate provided by the present invention;

[0066] Figure 12 It is a cross-sectional view of the support plate adopting an electrostatic chuck provided by the present invention;

[0067] Figure 13 It is Figure 12 the enlarged view of part A in

[0068] Figure 14 It is a schematic structural diagram of the protective cover provided by the present invention;

[0069] Figure 15 It is a cross-sectional view of the protective cover provided by the present invention;

[0070] Figure 16 It is a schematic connection structure diagram of the negative pressure suction pipe and the annular negative pressure groove provided by the present invention;

[0071] Figure 17 It is a schematic structural diagram of the etching solution spraying mechanism provided by the present invention;

[0072] Figure 18 It is a schematic structural diagram of the cleaning solution spraying mechanism provided by the present invention;

[0073] Figure 19 It is a schematic structural diagram of the air jet drying mechanism provided by the present invention;

[0074] Figure 20 It is a flow chart for preparing TGV blind holes provided by the present invention.

[0075] In the figure: 1, base; 2, support plate; 3, glass substrate; 4, etching solution spraying mechanism; 5, cleaning solution spraying mechanism; 6, jet drying mechanism; 7, back spray assembly; 8, rotating motor; 9, protective cover;

[0076] 10a, centrifugal clamping member; 101a, triangular base; 102a, positioning column; 103a, centrifugal pendulum pressing hammer;

[0077] 10b, electrostatic chuck; 101b, base substrate; 102b, dielectric layer; 103b, electrode; 104b, electrical contact part; 105b, electrical extension part; 106b, plug-in block;

[0078] 901a, outer cover; 901b, outer cover lifting cylinder; 901c, cleaning solution recovery pipe; 902a, inner cover; 902b, inner cover lifting cylinder; 902c, etching solution recovery pipe;

[0079] 401a, etching solution megasonic nozzle; 402a, first swing arm; 403a, first lifting cylinder; 404a, first rotating motor; 405a, first fixed seat;

[0080] 501a, cleaning solution megasonic nozzle; 502a, second swing arm; 503a, second lifting cylinder; 504a, second rotating motor; 505a, second fixed seat;

[0081] 601a, gas nozzle; 602a, third swing arm; 603a, third lifting cylinder; 604a, third rotating motor; 605a, third fixed seat. Detailed implementation manners

[0082] The following further detailed description is made on the present invention in combination with the accompanying drawings and specific embodiments. According to the following description and the claims, the advantages and features of the present invention will be clearer. It should be noted that the accompanying drawings are all in very simplified forms and use non-precise scales, only for the purpose of facilitating and clearly assisting in explaining the purpose of the embodiments of the present invention.

[0083] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0084] In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, the terms "mounted", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood through specific situations.

[0085] In addition, the features, operations, and characteristics described in the specification can be combined in any appropriate manner to form various embodiments. Similarly, the steps or actions described in the method can also be adjusted in sequence in a manner that can be easily seen by those skilled in the art. Therefore, the various sequences in the specification and the drawings are only for clearly describing a certain embodiment, rather than a sequence that must be followed, unless it is stated otherwise that a certain sequence must be adhered to.

[0086] Embodiment 1

[0087] The present invention provides a wet etching device for preparing TGV blind holes. Please refer to Figure 2 - 4 , which includes a base 1. Above the base 1, there is a support disk 2 for loading a single glass substrate 3. On one side of the support disk 2, there is an etching solution spraying mechanism 4 for spraying etching solution to prepare blind holes on the glass substrate 3. On the other side of the support disk 2, there is a cleaning solution spraying mechanism 5 for spraying cleaning solution to clean the etched surface of the glass substrate 3. On the other side of the support disk 2, there is also a jet drying mechanism 6 for spraying nitrogen to dry the etched surface of the glass substrate 3. At the center of the support disk 2, there is a back spray assembly 7 for continuously spraying nitrogen to protect the back of the glass substrate 3.

[0088] Specifically, the support disk 2 is a disk, and a rotary motor 8 is provided below it. The support disk 2 is connected to the output shaft of the rotary motor 8. Under the action of the rotary motor 8, the support disk 2 and the glass substrate 3 loaded thereon are driven to rotate.

[0089] Moreover, the output shaft of the rotary motor 8 is a hollow shaft, and the back spray pipe of the back spray assembly 7 extends along the hollow shaft and passes through the center of the support disk 2 to protect the back of the glass substrate 3 loaded on the support disk 2 by continuously spraying nitrogen.

[0090] Specifically, a plurality of clamping members are arranged on the circumference of the support disk 2 for clamping and fixing a single glass substrate 3.

[0091] In one embodiment, as Figure 5 - 9 , the clamping members are a plurality of centrifugal clamping members 10a evenly arranged on the circumference of the support disk 2. The centrifugal clamping member 10a includes a triangular base 101a, and two positioning columns 102a are symmetrically arranged on both sides of the triangular base 101a. A single glass substrate 3 is placed on the two positioning columns 102a.

[0092] The centrifugal clamping member 10a further includes a centrifugal pendulum pressing hammer 103a. The centrifugal pendulum pressing hammer 103a is installed between the two positioning columns 102a through a rotating shaft; and a counterweight is provided at the tail of the centrifugal pendulum pressing hammer 103a. Under the action of gravity, the centrifugal pendulum pressing hammer 103a naturally hangs down to avoid the placement area of the positioning column 102a; when the centrifugal clamping member 10a rotates at a high speed with the support disk 2, the counterweight at the tail of the centrifugal pendulum pressing hammer 103a is lifted under the action of centrifugal force, so that the head of the centrifugal pendulum pressing hammer 103a presses and fixes the single glass substrate 3 on the positioning column 102a.

[0093] In one embodiment, as Figure 10 - 13 , the clamping members are a plurality of electrostatic chucks 10b evenly arranged on the circumference of the support disk 2. The electrostatic chuck 10b includes a base substrate 101b, a dielectric layer 102b, and an electrode 103b; the dielectric layer 102b is fixedly bonded to the base substrate 101b, contacts the back of the glass substrate 3, and adsorbs and fixes it; the electrode 103b is embedded in the base substrate 101b and is electrically connected to the dielectric layer 102b.

[0094] Moreover, the electrode 103b of each electrostatic chuck 10b also extends from the edge of the support disk 2 to the center through an electrical contact portion 104b and an electrical extension portion 105b to connect to the same power supply.

[0095] The electrostatic chuck 10b further includes a plug-in block 106b, and is detachably plugged into the support disk 2 through the plug-in block 106b.

[0096] Compared with the centrifugal clamping member 10a, the electrostatic chuck 10b is completely located on the back surface of the glass substrate 3, and the etched surface of the glass substrate 3 does not need to be pressed and fixed, so that it will neither block the flow of the etching solution on the etched surface nor prevent the need for etching blind holes at the edge of the loaded glass substrate 3 to be satisfied.

[0097] Specifically, please refer to Figure 14 and Figure 15 , a liftable protective cover 9 is provided outside the support disk 2; wherein, the protective cover 9 includes an outer cover 901a and an inner cover 902a arranged in a nested manner, and outer cover lifting cylinders 901b are provided on both sides of the outer cover 901a, and the outer cover 901a is driven to lift in the vertical direction by the outer cover lifting cylinders 901b; inner cover lifting cylinders 902b are provided on both sides of the inner cover 902a, and the inner cover 902a is driven to lift in the vertical direction by the inner cover lifting cylinders 902b.

[0098] Moreover, arc-shaped covers are provided at the tops of the outer cover 901a and the inner cover 902a for blocking and collecting the etching solution or cleaning solution splashed out by the rotation of the glass substrate 3; when the cleaning solution spraying mechanism 5 sprays the cleaning solution to clean the etched surface of the glass substrate 3, the outer cover lifting cylinder 901b drives the outer cover 901a to rise, and at this time, the cleaning solution splashed out by the rotation of the glass substrate 3 is blocked by the outer cover 901a and then flows downward along its inner wall, and the cleaning solution is collected in the cleaning solution recovery pipe 901c at the bottom of the outer cover 901a; when the etching solution spraying mechanism 4 sprays the etching solution to prepare the blind holes on the glass substrate 3, the inner cover lifting cylinder 902b drives the inner cover 902a to rise, and at this time, the etching solution splashed out by the rotation of the glass substrate 3 is blocked by the inner cover 902a and then flows downward along its inner wall, and the etching solution is collected in the etching solution recovery pipe 902c at the bottom of the inner cover 902a.

[0099] In some embodiments, upper limit sensors and lower limit sensors are respectively installed on the outer cover lifting cylinder 901b and the inner cover lifting cylinder 902b to control the lifting positions of the outer cover 901a and the inner cover 902a.

[0100] Furthermore, please also refer to Figure 16 , a plurality of negative pressure suction pipes 903a are provided inside the inner cover 902a, one end of the negative pressure suction pipe 903a extends into the inner part of the inner cover 902a, and the other end extends into the annular negative pressure groove 903b. The gas inside the inner cover 902a communicating with the annular negative pressure groove 903b and the negative pressure suction pipe 903a is sucked out by an external negative pressure device, so as to suck out the floating substances generated by etching.

[0101] Specifically, as Figure 17As shown in the figure, the etching solution spraying mechanism 4 includes an etching solution megasonic nozzle 401a, a first swing arm 402a, a first lifting cylinder 403a, a first rotating motor 404a, and a first fixing base 405a. The etching solution spraying mechanism 4 is fixedly installed on the base 1 through the first fixing base 405a. The first rotating motor 404a, the first lifting cylinder 403a, and the first swing arm 402a are sequentially installed on the first fixing base 405a. The etching solution megasonic nozzle 401a is installed at the front end of the first swing arm 402a. The etching solution megasonic nozzle 401a is connected to the storage tank of the etching solution through a liquid medicine pipe. During etching, the first lifting cylinder 403a drives the first swing arm 402a and the etching solution megasonic nozzle 401a to lift above the glass substrate 3, and the first rotating motor 404a drives the first swing arm 402a and the etching solution megasonic nozzle 401a to reciprocate along the radius of the glass substrate 3.

[0102] Specifically, as Figure 18 As shown in the figure, the cleaning solution spraying mechanism 5 includes a cleaning solution megasonic nozzle 501a, a second swing arm 502a, a second lifting cylinder 503a, a second rotating motor 504a, and a second fixing base 505a. The cleaning solution spraying mechanism 5 is fixedly installed on the base 1 through the second fixing base 505a. The second rotating motor 504a, the second lifting cylinder 503a, and the second swing arm 502a are sequentially installed on the second fixing base 505a. The cleaning solution megasonic nozzle 501a is installed at the front end of the second swing arm 502a. The cleaning solution megasonic nozzle 501a is connected to the storage tank of the cleaning solution through a cleaning solution pipe. During cleaning, the second lifting cylinder 503a drives the second swing arm 502a and the cleaning solution megasonic nozzle 501a to lift above the glass substrate 3, and the second rotating motor 504a drives the second swing arm 502a and the cleaning solution megasonic nozzle 501a to reciprocate along the radius of the glass substrate 3.

[0103] Specifically, as Figure 19As shown, the jet drying mechanism 6 includes a gas nozzle 601a, a third swing arm 602a, a third lifting cylinder 603a, a third rotating motor 604a, and a third fixed seat 605a. The jet drying mechanism 6 is fixedly installed on the base 1 through the third fixed seat 605a. The third rotating motor 604a, the third lifting cylinder 603a, and the third swing arm 602a are sequentially installed on the third fixed seat 605a. The gas nozzle 601a is installed at the front end of the third swing arm 602a. The gas nozzle 601a is connected to a nitrogen gas storage tank through a nitrogen gas pipe. During drying, the third lifting cylinder 603a drives the third swing arm 602a and the gas nozzle 601a to lift above the glass substrate 3, and the third rotating motor 604a drives the third swing arm 602a and the gas nozzle 601a to reciprocate along the radius of the glass substrate 3.

[0104] Embodiment 2

[0105] The present invention also provides a method for preparing TGV blind holes by a wet etching device. Please refer to Figure 20 , including the following steps:

[0106] Step A: Laser-induced deformation. First, a preset small hole is formed on the glass substrate 3 by laser, and then the glass substrate 3 irradiated by the laser is placed on the support disk 2 by a manipulator.

[0107] Step B: First cleaning with ultrapure water

[0108] Step B1: After being detected as normal by the detection sensor on one side of the support disk 2, the outer cover 901a rises under the action of the outer cover lifting cylinder 901b, and the rotating motor 8 drives the support disk 2 and the glass substrate 3 placed on the support disk 2 to rotate at a rotation speed of 300 - 3000 rpm.

[0109] Step B2: Then, the second rotating motor 504a is started to drive the cleaning liquid megasonic wave nozzle 501a at the end of the second swing arm 502a to swing and rotate to the center of the glass substrate 3, and at the same time, the second lifting cylinder 503a is started to drive the cleaning liquid megasonic wave nozzle 501a to descend close to the etching surface of the glass substrate 3.

[0110] Step B3: Then, the ultrapure water control valve is opened, and ultrapure water is sprayed onto the etching surface of the glass substrate 3 through the cleaning liquid megasonic wave nozzle 501a, with an ultrapure water flow rate of 300 - 800 ml / min; at the same time, the control valve of the back spray assembly 7 is opened, and nitrogen gas is continuously sprayed onto the back of the glass substrate 3 through the back spray pipe, with a nitrogen gas flow rate of 2 - 6 L / min.

[0111] Step B4: During the process of spraying ultrapure water by the cleaning liquid megasonic nozzle 501a, the second rotating motor 504a drives the second swing arm 502a to reciprocate along the radius of the glass substrate 3, with a swing speed of 1 - 150 mm / sec; the cleaning time is 20 - 60 s, so as to clean the impurities on the surface of the glass substrate 3 after laser irradiation and prepare for etching; during the cleaning process, the ultrapure water splashes outward with the high-speed rotation of the glass substrate 3, and after being blocked by the outer cover 901a, it flows downward along the inner wall thereof and collects in the cleaning liquid recovery pipe 901c at the bottom of the outer cover 901a;

[0112] Step B5: After the cleaning is completed, the ultrapure water control valve is closed, and the second lifting cylinder 503a and the second rotating motor 504a drive the second swing arm 502a and the cleaning liquid megasonic nozzle 501a to swing back to the origin position;

[0113] Step C: Etching with etching liquid,

[0114] Step C1: After the cleaning is completed, the inner cover 902a rises under the action of the inner cover lifting cylinder 902b, and then the first rotating motor 404a is started to drive the etching liquid megasonic nozzle 401a at the end of the first swing arm 402a to swing to the center of the glass substrate 3. At the same time, the first lifting cylinder 403a is started to drive the etching liquid megasonic nozzle 401a to descend close to the etching surface of the glass substrate 3;

[0115] Step C2: Then, the etching liquid control valve is opened, and the etching liquid is sprayed onto the etching surface of the glass substrate 3 through the etching liquid megasonic nozzle 401a. The flow rate of the etching liquid is 300 - 500 ml / min, and the temperature is 23 - 45 °C;

[0116] Step C3: During the process of spraying the etching liquid by the etching liquid megasonic nozzle 401a, the first rotating motor 404a drives the first swing arm 402a to reciprocate along the radius of the glass substrate 3, with a swing speed of 1 - 150 mm / sec; the liquid spraying time is 100 - 1800 s; during the etching process, the etching liquid splashes outward with the high-speed rotation of the glass substrate 3, and after being blocked by the inner cover 902a, it flows downward along the inner wall thereof and collects in the etching liquid recovery pipe 902c at the bottom of the inner cover 902a;

[0117] Step C4: After the etching is completed, the etching liquid control valve is closed, and the first lifting cylinder 403a and the first rotating motor 404a drive the first swing arm 402a and the etching liquid megasonic nozzle 401a to swing back to the origin position;

[0118] Step D: Secondary cleaning with ultrapure water, repeating the operations of steps B2 - B5 to quickly replace the etching liquid on the glass substrate 3 and clean the impurities in the etching blind holes;

[0119] Step E: Drying,

[0120] Step E1: Start the third rotary motor 604a to drive the gas nozzle 601a at the end of the third swing arm 602a to swing to the center of the glass substrate 3. At the same time, start the third lifting cylinder 603a to drive the gas nozzle 601a to descend close to the etching surface of the glass substrate 3.

[0121] Step E2: Then open the nitrogen control valve and spray dry nitrogen onto the etching surface of the glass substrate 3 through the gas nozzle 601a.

[0122] Step E3: During the process of spraying dry nitrogen by the gas nozzle 601a, the third rotary motor 604a drives the third swing arm 602a to perform fixed-point drying or reciprocating movement along the radius of the glass substrate 3, and the swing speed is 1 - 150 mm / sec; the cleaning time is 30 - 60 s.

[0123] Step E4: After drying is completed, close the nitrogen control valve, and the third lifting cylinder 603a and the third rotary motor 604a drive the third swing arm 602a and the gas nozzle 601a to swing back to the origin position.

[0124] Step F: Unloading and inspection. Close the control valve of the back spray assembly 7, and the outer cover lifting cylinder 901b and the inner cover lifting cylinder 902b drive the outer cover 901a and the inner cover 902a to descend simultaneously. The manipulator takes out the etched glass substrate 3 and transports it to the inspection equipment to inspect the via hole formation rate and the blind hole roughness.

[0125] The TGV blind hole wet etching of the present invention is single-piece rotary etching, with good hole wall roughness and good etching uniformity; at the same time, single-piece rotary cleaning can also avoid the attachment of etching by-products to the inner wall and improve the cleaning efficiency of micro holes.

[0126] The above description is only a description of the preferred embodiments of the present invention, and does not limit the scope of the present invention in any way. Any changes and modifications made by those of ordinary skill in the art of the present invention according to the above disclosure shall fall within the protection scope of the claims.

Claims

1. A method for preparing TGV blind vias using a wet etching device, characterized in that: The steps include: A: Laser induced deformation, B: Ultrapure water for one-time cleaning, B1: The outer cover rises, and the rotary motor drives the support plate and the glass substrate thereon to rotate at a speed of 300-3000 rpm; B2: Start the second rotating motor and the second lifting cylinder to drive the cleaning liquid megasonic nozzle at the end of the second swing arm to rotate to the center of the glass substrate and descend close to the etching surface; B3: Spray ultrapure water onto the etched surface through the cleaning liquid megasonic nozzle at a flow rate of 300-800 ml / min; at the same time, continuously spray nitrogen onto the back of the glass substrate through the back spray pipe of the back spray assembly at a flow rate of 2-6 L / min; B4: During the spraying of ultrapure water, the second swing arm reciprocates along the radius of the glass substrate at a swing speed of 1 to 150 mm / sec; the cleaning time is 20 to 60 seconds; during the cleaning process, the ultrapure water flows downward along the inner wall of the outer cover and collects in the cleaning liquid recovery pipe at the bottom; C: Etching liquid etching, C1: The inner cover is raised, the first rotating motor and the first lifting cylinder are started, and the etching liquid megasonic nozzle at the end of the first swing arm is driven to rotate to the center of the glass substrate and descend close to the etching surface; C2: Spray the etching liquid onto the etching surface through the etching liquid megasonic nozzle, with a flow rate of 300-500 ml / min and a temperature of 23-45°C; C3: During the process of spraying the etching solution, the first swing arm reciprocates along the radius of the glass substrate, with a swing speed of 1~150mm / sec; the spraying time is 100~1800s; During the etching process, the etching solution flows downward along the inner wall of the inner cover and is collected in the etching solution recovery pipe at the bottom; D: Secondary cleaning with ultrapure water, repeating the operations of steps B2 to B4 to replace the etching solution on the glass substrate and clean the impurities in the etched blind holes; The floating objects generated during etching and cleaning are sucked out by the negative pressure suction pipe in the inner cover; E: Drying: the third rotary motor drives the gas nozzle at the end of the third swing arm to dry at a fixed point or reciprocate along the radius of the glass substrate, with a swing speed of 1~150mm / sec; the cleaning time is 30~60s; F: Material cutting inspection.

2. The method for preparing a TGV blind hole by a wet etching device according to claim 1, characterized in that: The wet etching device comprises a base (1), and a support plate (2) is provided above the base (1) to load a single glass substrate (3); an etching liquid spraying mechanism (4) is provided on one side of the support plate (2) to spray the etching liquid to prepare a blind hole on the glass substrate (3); a cleaning liquid spraying mechanism (5) is provided on the other side of the support plate (2) to spray the cleaning liquid to clean the etching surface of the glass substrate (3); a jet drying mechanism (6) is also provided on the other side of the support plate (2) to spray nitrogen to dry the etching surface of the glass substrate (3); and a back spraying assembly (7) is provided at the center of the support plate (2) to continuously spray nitrogen to protect the back side of the glass substrate (3).

3. The method for preparing TGV blind vias by a wet etching device according to claim 2, characterized in that: The support disk (2) is a circular disk, a rotating motor (8) is provided below the support disk (2), and the support disk (2) is connected to the output shaft of the rotating motor (8). Under the action of the rotating motor (8), the support disk (2) and the glass substrate (3) loaded thereon are driven to rotate; The output shaft of the rotating motor (8) is a hollow shaft, and the back spray pipe of the back spray assembly (7) extends along the hollow shaft and passes through the center of the support plate (2), thereby protecting the back side of the glass substrate (3) loaded on the support plate (2) by continuously spraying nitrogen.

4. A method for preparing a TGV blind hole by a wet etching device as claimed in claim 3, characterized in that: A plurality of clamping members are arranged around the circumference of the support plate (2) for clamping and fixing a single glass substrate (3).

5. The method for preparing TGV blind vias by wet etching device according to claim 4, characterized in that: The clamping member is a plurality of centrifugal clamping members (10a) evenly arranged on the circumference of the support plate (2), the centrifugal clamping member (10a) comprising a triangular base (101a), two positioning columns (102a) being symmetrically arranged on both sides of the triangular base (101a), and the single glass substrate (3) is mounted on the two positioning columns (102a); The centrifugal clamp (10a) further comprises a centrifugal pendulum hammer (103a), which is installed between the two positioning columns (102a) via a rotating shaft; and a counterweight block is provided at the tail of the centrifugal pendulum hammer (103a), so that under the action of gravity, the centrifugal pendulum hammer (103a) naturally droops to avoid the placement area of ​​the positioning columns (102a); when the centrifugal clamp (10a) rotates at a high speed along with the support plate (2), the counterweight block at the tail of the centrifugal pendulum hammer (103a) is lifted under the action of centrifugal force, so that the head of the centrifugal pendulum hammer (103a) covers the single-piece glass substrate (3) fixed on the positioning columns (102a).

6. A method for preparing a TGV blind hole by a wet etching device as claimed in claim 4, characterized in that: The clamping member is a plurality of electrostatic chucks (10b) evenly arranged on the circumference of the support plate (2), and the electrostatic chuck (10b) comprises a base substrate (101b), a dielectric layer (102b) and an electrode (103b); The dielectric layer (102b) is fixedly bonded to the base substrate (101b), in contact with the back surface of the glass substrate (3), and is adsorbed and fixed thereon; The electrode (103b) is embedded and installed in the base substrate (101b), and is electrically connected to the dielectric layer (102b); The electrode (103b) of each electrostatic suction cup (10b) is also connected to the same power source by extending from the edge to the center of the support plate (2) through an electrical contact portion (104b) and an electrical extension portion (105b); The electrostatic suction cup (10b) further comprises a plug-in block (106b), through which the plug-in block (106b) is detachably plugged into the support plate (2).

7. The method for preparing TGV blind vias by wet etching device according to claim 3, characterized in that: The support plate (2) is provided with a liftable protective cover (9) on the outside; The protective cover (9) comprises an outer cover (901a) and an inner cover (902a) which are arranged in a telescopic manner; outer cover lifting cylinders (901b) are provided on both sides of the outer cover (901a), and the outer cover (901a) is driven to be lifted or lowered in a vertical direction by the outer cover lifting cylinders (901b); inner cover lifting cylinders (902b) are provided on both sides of the inner cover (902a), and the inner cover (902a) is driven to be lifted or lowered in a vertical direction by the inner cover lifting cylinders (902b); The tops of the outer cover (901a) and the inner cover (902a) are both provided with arc-shaped covers for blocking and collecting etching liquid or cleaning liquid splashed out by the rotation of the glass substrate (3); When the cleaning liquid spraying mechanism (5) sprays cleaning liquid to clean the etched surface of the glass substrate (3), the outer cover lifting cylinder (901b) drives the outer cover (901a) to rise, and the cleaning liquid splashed out due to the rotation of the glass substrate (3) is blocked by the outer cover (901a) and flows downward along its inner wall, and is collected in the cleaning liquid recovery pipe (901c) at the bottom of the outer cover (901a); When the etching liquid spraying mechanism (4) sprays etching liquid to prepare a blind hole on the glass substrate (3), the inner cover lifting cylinder (902b) drives the inner cover (902a) to rise. At this time, the etching liquid splashed out due to the rotation of the glass substrate (3) is blocked by the inner cover (902a) and flows downward along its inner wall, and is collected in the etching liquid recovery pipe (902c) at the bottom of the inner cover (902a).

8. The method for preparing TGV blind vias by wet etching device according to claim 7, characterized in that: A plurality of negative pressure suction pipes (903a) are arranged in the inner cover (902a), one end of the negative pressure suction pipe (903a) extends into the inner cover (902a), and the other end extends into the annular negative pressure groove (903b), and the gas in the inner cover (902a) connected to the annular negative pressure groove (903b) and the negative pressure suction pipe (903a) is sucked out through an external negative pressure device, thereby sucking out floating objects generated by etching.

9. The method for preparing TGV blind vias by wet etching device according to claim 2, characterized in that: The etching liquid spraying mechanism (4) comprises an etching liquid megasonic wave nozzle (401a), a first swing arm (402a), a first lifting cylinder (403a), a first rotating motor (404a) and a first fixed seat (405a); the etching liquid spraying mechanism (4) is fixedly mounted on the base (1) via the first fixed seat (405a); the first rotating motor (404a), the first lifting cylinder (403a) and the first swing arm (402a) are sequentially mounted on the first fixed seat (405a); The sonic nozzle (401a) is mounted on the front end of the first swing arm (402a); the etching liquid megasonic nozzle (401a) is connected to a storage tank of the etching liquid via a liquid tube; during etching, the first lifting cylinder (403a) drives the first swing arm (402a) and the etching liquid megasonic nozzle (401a) to rise and fall above the glass substrate (3), and the first rotating motor (404a) drives the first swing arm (402a) and the etching liquid megasonic nozzle (401a) to reciprocate along the radius of the glass substrate (3); The cleaning liquid spraying mechanism (5) comprises a cleaning liquid megasonic wave nozzle (501a), a second swing arm (502a), a second lifting cylinder (503a), a second rotating motor (504a) and a second fixed seat (505a); the cleaning liquid spraying mechanism (5) is fixedly mounted on the base (1) via the second fixed seat (505a); the second rotating motor (504a), the second lifting cylinder (503a) and the second swing arm (502a) are sequentially mounted on the second fixed seat (505a); The sonic nozzle (501a) is mounted on the front end of the second swing arm (502a); the cleaning liquid megasonic nozzle (501a) is connected to a cleaning liquid storage tank via a cleaning liquid pipe; during cleaning, the second lifting cylinder (503a) drives the second swing arm (502a) and the cleaning liquid megasonic nozzle (501a) to rise and fall above the glass substrate (3), and the second rotating motor (504a) drives the second swing arm (502a) and the cleaning liquid megasonic nozzle (501a) to reciprocate along the radius of the glass substrate (3).

10. The method for preparing TGV blind vias by wet etching device according to claim 2, characterized in that: The jet drying mechanism (6) comprises a gas nozzle (601a), a third swing arm (602a), a third lifting cylinder (603a), a third rotating motor (604a) and a third fixed seat (605a); the jet drying mechanism (6) is fixedly mounted on the base (1) via the third fixed seat (605a); and the third rotating motor (604a), the third lifting cylinder (603a) and the third swing arm (602a) are sequentially mounted on the third fixed seat (605a). The gas nozzle (601a) is installed at the front end of the third swing arm (602a); the gas nozzle (601a) is connected to a nitrogen gas storage tank via a nitrogen pipe; during drying, the third lifting cylinder (603a) drives the third swing arm (602a) and the gas nozzle (601a) to rise and fall above the glass substrate (3), and the third rotating motor (604a) drives the third swing arm (602a) and the gas nozzle (601a) to reciprocate along the radius of the glass substrate (3).

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