A high-performance photoelectric sensor packaging device

Abstract

This invention belongs to the field of optoelectronic sensor packaging devices, specifically relating to a high-efficiency optoelectronic sensor packaging device. The high-efficiency optoelectronic sensor packaging device includes a main body, an internal buffer structure, and a packaging device mounted on the upper surface of the buffer structure. A material release structure is provided on the inner wall of the packaging device. The buffer structure includes a motor mounted on the surface of the main body, with its output end penetrating the surface of the main body and rotatably connected to one end of a double-threaded rod. The other end of the double-threaded rod is located on the inner wall of the main body. When the sealing pressure of the packaging device needs to be changed, the high-efficiency optoelectronic sensor packaging device activates the motor, causing the double-threaded rod to rotate. This causes the moving block to move, compressing a hard spring and changing its initial pressure, thereby altering the sealing pressure between the injection plate and the mold.

Description

Technical Field

[0001] This invention relates to the field of optoelectronic sensor packaging technology, specifically to a high-performance optoelectronic sensor packaging device. Background Technology

[0002] A sensor packaging device is a system used to protect and enclose sensor chips, circuits, and components. It protects the internal components of the sensor from physical damage, and also prevents dust and moisture corrosion, thereby improving the performance and lifespan of the sensor. The internal components of the sensor are very sensitive to changes in environmental conditions. Packaging can protect the stability and consistency of the internal components, improve the reliability and lifespan of the sensor, and make the sensor easier to manufacture and use. Packaging can reduce the variation and interference of the sensor in different environments, and ensure the standardization and consistency of the sensor.

[0003] Currently, in existing technologies, during the encapsulation of sensors, the compression exerted by the dispensing device on the mold and sensor during the pressing process can easily damage the sensor. Furthermore, to ensure the stability of photoelectric sensors in harsh environments, the dispensing device often needs to apply significant sealing pressure to the mold and sensor, making the sensor even more susceptible to pressure damage. Therefore, we propose a high-efficiency photoelectric sensor encapsulation device. Summary of the Invention

[0004] The main objective of this invention is to provide a high-performance photoelectric sensor packaging device that can solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention proposes a high-efficiency photoelectric sensor packaging device, comprising a device body, a buffer structure disposed inside the device body, a packaging device disposed on the upper surface of the buffer structure, and a material release structure disposed on the inner wall of the packaging device. The buffer structure includes:

[0006] An electric motor is disposed on the surface of the device body. The output end of the electric motor passes through the surface of the device body and is rotatably connected to one end of a double-threaded rod. The other end of the double-threaded rod is disposed on the inner wall of the device body. The surface of the double-threaded rod is threadedly connected to the inner wall of the moving block. The inner wall of the moving block is slidably connected to the surface of a guide rod. Both ends of the guide rod are disposed on the inner wall of the device body.

[0007] Preferably, the surface of the movable block is fixedly connected to one end of the rigid spring, the other end of the rigid spring is fixedly connected to the surface of the sliding block, and the inner wall of the sliding block is slidably connected to the surface of the double-threaded rod.

[0008] Preferably, the inner wall of the sliding block is hinged to one end of the connecting rod, and the other end of the connecting rod is disposed inside the encapsulation device.

[0009] Preferably, the main body of the device includes a housing, the bottom surface of the housing is fixedly connected to a bracket, the surface of the housing is fixedly connected to the surface of the motor, the inner wall of the housing is rotatably connected to the end face of the double-threaded rod, and the inner wall of the housing is fixedly connected to both ends of the guide rod.

[0010] Preferably, the upper surface of the outer shell is fixedly connected to the end face of the guide post, the surface of the guide post is slidably connected to the inner wall of the pressure plate, and an injection plate is fixedly connected to the bottom surface of the pressure plate.

[0011] Preferably, the packaging device includes a frame, the inner wall of which is slidably connected to the inner wall of the outer shell, the inner wall of which is hinged to the surface of the connecting rod, the inner wall of which is rotatably connected to one side of the rotating rod via a coil spring, the other end of which is fixedly connected to the end face of the handle, the inner wall of which is sleeved on the surface of the movable sleeve, the surface of which is slidably connected to the inner wall of the frame, the inner wall of which is fixedly connected to one end of a spring, the other end of which is fixedly connected to the back of the extrusion block, and the surface of the extrusion block is slidably connected to the inner wall of the movable sleeve.

[0012] Preferably, the inner wall of the rotating rod is sleeved with the surface of the fixed sleeve, the surface of the fixed sleeve is slidably connected with the inner wall of the frame, the inner wall of the fixed sleeve is fixedly connected to one end of the second spring, the other end of the second spring is fixedly connected to the back of the snap-fit ​​block, the surface of the snap-fit ​​block is slidably connected with the inner wall of the fixed sleeve, and the surface of the snap-fit ​​block is disposed inside the mold.

[0013] Preferably, the mold includes a base plate, and fixing grooves are provided on both sides of the base plate, with the inner wall of the fixing groove slidably connected to the surface of the snap-fit ​​block.

[0014] Preferably, the inner wall of the base plate is slidably connected to the surface of the ejector block, the surface of the ejector block is fixedly connected to the surface of the spring, and both ends of the spring are fixedly connected to the inner wall of the base plate.

[0015] Preferably, the stripping structure includes a sliding rod, the surface of which is slidably connected to the inner wall of the frame, a push plate fixedly connected to the end face of the sliding rod, the upper surface of the push plate fixedly connected to one end of a tension spring, the other end of the tension spring fixedly connected to the bottom surface of the frame, and an extrusion plate fixedly connected to the upper surface of the push plate, the extrusion plate cooperating with the mold.

[0016] This invention provides a high-performance photoelectric sensor packaging device. It has the following advantages:

[0017] (1) The high-efficiency photoelectric sensor packaging device, through the set buffer structure, when it is necessary to package the sensor inside the mold, the external power pushes the pressure plate to move downward, so that the pressure plate pushes the injection plate to fit with the upper surface of the mold. In order to protect the sensor and ensure the fit between the injection plate and the mold, the injection plate will push the packaging device to move a certain distance. When the packaging device moves downward, the packaging device squeezes one end of the connecting rod, so that the other end of the connecting rod pushes the moving block to move, thereby squeezing the hard spring. When the maximum thrust of the external power is reached, the injection plate begins to inject glue into the mold. When it is necessary to change the sealing pressure of the packaging device, the motor is started, so that the motor drives the double-headed threaded rod to rotate, so that the moving block moves, thereby squeezing the hard spring, so that the initial pressure of the hard spring changes, thereby changing the sealing pressure between the injection plate and the mold.

[0018] (2) The high-efficiency photoelectric sensor packaging device, through the packaging device, when the mold needs to be installed, pushes the mold downward, so that the surface of the mold squeezes the extrusion block, so that the extrusion block pushes the moving sleeve through spring one to move, so that the moving sleeve pushes the rotating rod to rotate against the coil spring, thereby pushing out the fixed sleeve, so that the fixed sleeve pushes the snap-fit ​​block through spring two to move, so that the surface of the snap-fit ​​block squeezes the mold surface, so that spring two is compressed. When the mold is installed, spring two pushes the snap-fit ​​block to slide into the inner wall of the fixed groove to fix the mold. When the mold needs to be disassembled, the rotating rod is rotated by the handle, so that the rotating rod pulls back the snap-fit ​​block through the fixed sleeve and spring two, thereby facilitating the quick installation and disassembly of the mold.

[0019] (3) The high-efficiency photoelectric sensor packaging device, through the set material removal structure, when glue injection is required, the surface of the pressure plate squeezes the sliding rod and stretches the tension spring, so that the sliding rod moves downward, thereby releasing the pressure of the extrusion plate on the ejector block, so that the ejector block is pulled downward by the spring to return to its original position. When the glue injection is completed, the surface of the pressure plate leaves the sliding rod, so that the sliding rod moves upward under the action of the tension spring, thereby making the extrusion plate squeeze the bottom surface of the ejector block, so that the ejector block moves and ejects the glue-injected sensor out of the mold, making it convenient for workers to take it out. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0022] Figure 2 This is a schematic diagram of the overall cross-sectional structure of the present invention;

[0023] Figure 3 This is a schematic cross-sectional view of the packaging structure of the present invention;

[0024] Figure 4 This is an enlarged structural diagram of the present invention (A).

[0025] Figure 5 This is a schematic diagram of the mold structure of the present invention;

[0026] Figure 6 This is a bottom view schematic diagram of the material removal structure of the present invention.

[0027] Explanation of reference numerals in the attached diagrams: 1. Main body of the device; 2. Buffer structure; 3. Encapsulation device; 4. Unloading structure; 101. Outer shell; 102. Support; 103. Guide column; 104. Pressure plate; 105. Injection plate; 201. Motor; 202. Double-ended threaded rod; 203. Moving block; 204. Guide rod; 205. Hard spring; 206. Sliding block; 207. Connecting rod; 301. Frame; 302. Rotating rod; 303. Moving sleeve; 304. Spring one; 305. Extrusion block; 306. Fixing sleeve; 307. Spring two; 308. Snap-fit ​​block; 309. Mold; 3091. Base plate; 3092. Fixing groove; 3093. Ejection block; 3094. Spring; 310. Handle; 401. Sliding rod; 402. Push plate; 403. Tension spring; 404. Extrusion plate.

[0028] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Please see Figures 1-6This invention proposes a high-efficiency photoelectric sensor packaging device, including a device body 1. The device body 1 includes a shell 101, a bracket 102 fixedly connected to the bottom surface of the shell 101, a surface of the shell 101 fixedly connected to the surface of the motor 201, an inner wall of the shell 101 rotatably connected to the end face of the double-threaded rod 202, an inner wall of the shell 101 fixedly connected to both ends of the guide rod 204, an upper surface of the shell 101 fixedly connected to the end face of the guide post 103, a surface of the guide post 103 slidably connected to the inner wall of the pressure plate 104, and a glue injection plate 105 fixedly connected to the bottom surface of the pressure plate 104.

[0031] The main body 1 of the device has a buffer structure 2 inside, and a sealing device 3 is provided on the upper surface of the buffer structure 2. The sealing device 3 includes a frame 301. The inner wall of the frame 301 is slidably connected to the inner wall of the outer shell 101. The inner wall of the frame 301 is hinged to the surface of the connecting rod 207. The inner wall of the frame 301 is rotatably connected to one side of the rotating rod 302 by a coil spring. The other end of the rotating rod 302 is fixedly connected to the end face of the handle 310. The inner wall of the rotating rod 302 is sleeved on the surface of the movable sleeve 303. The surface of the movable sleeve 303 is slidably connected to the inner wall of the frame 301. The inner wall of the movable sleeve 303 is fixedly connected to one end of the spring 304. The other end of spring 304 is fixedly connected to the back of extrusion block 305. The surface of extrusion block 305 is slidably connected to the inner wall of movable sleeve 303. The inner wall of rotating rod 302 is sleeved on the surface of fixed sleeve 306. The surface of fixed sleeve 306 is slidably connected to the inner wall of frame 301. The inner wall of fixed sleeve 306 is fixedly connected to one end of spring 307. The other end of spring 307 is fixedly connected to the back of snap-fit ​​block 308. The surface of snap-fit ​​block 308 is slidably connected to the inner wall of fixed sleeve 306. The surface of snap-fit ​​block 308 is located inside mold 309. Mold 309 includes base plate 3091. The mold 3091 has fixing grooves 3092 on both sides. The inner wall of the fixing groove 3092 is slidably connected to the surface of the snap-fit ​​block 308. The inner wall of the base plate 3091 is slidably connected to the surface of the ejector block 3093. The surface of the ejector block 3093 is fixedly connected to the surface of the spring 3094. The two ends of the spring 3094 are fixedly connected to the inner wall of the base plate 3091. When the mold 309 needs to be installed, the mold 309 is pushed downward through the encapsulation device 3, so that the surface of the mold 309 presses the extrusion block 305. The extrusion block 305 pushes the moving sleeve 303 to move through the spring 304, so that the moving sleeve 303 pushes the rotating rod 302. The spring overcomes the rotation, thereby pushing out the fixing sleeve 306. The fixing sleeve 306 pushes the snap-fit ​​block 308 to move through the second spring 307. The surface of the snap-fit ​​block 308 presses against the surface of the mold 309, causing the second spring 307 to compress. When the mold 309 is installed, the second spring 307 pushes the snap-fit ​​block 308 into the inner wall of the fixing groove 3092 to fix the mold 309. When the mold 309 needs to be disassembled, the rotating rod 302 is rotated by the handle 310. The rotating rod 302 pulls back the snap-fit ​​block 308 through the fixing sleeve 306 and the second spring 307, thus facilitating the quick installation and disassembly of the mold 309.

[0032] The inner wall of the packaging device 3 is provided with a stripping structure 4. The stripping structure 4 includes a sliding rod 401, the surface of which is slidably connected to the inner wall of the frame 301. A push plate 402 is fixedly connected to the end face of the sliding rod 401. The upper surface of the push plate 402 is fixedly connected to one end of a tension spring 403, and the other end of the tension spring 403 is fixedly connected to the bottom surface of the frame 301. An extrusion plate 404 is fixedly connected to the upper surface of the push plate 402. The extrusion plate 404 cooperates with the mold 309. Through the stripping structure 4, when glue injection is required, the surface of the extrusion plate 404 extrudes... Pressing the sliding rod 401 and stretching the tension spring 403 causes the sliding rod 401 to move downward, thereby releasing the pressure of the extrusion plate 404 on the ejector block 3093. The ejector block 3093 is then pulled downward by the spring 3094 to return to its original position. When the glue injection is complete, the surface of the pressure plate 104 leaves the sliding rod 401, causing the sliding rod 401 to move upward under the action of the tension spring 403. This causes the extrusion plate 404 to press the bottom surface of the ejector block 3093, causing the ejector block 3093 to move and eject the glue-injected sensor out of the mold 309 for easy removal by the worker.

[0033] In the embodiment of the present invention, the buffer structure 2 includes: a motor 201, which is disposed on the surface of the device body 1. The output end of the motor 201 passes through the surface of the device body 1 and is rotatably connected to one end of a double-threaded rod 202. The other end of the double-threaded rod 202 is disposed on the inner wall of the device body 1. The surface of the double-threaded rod 202 is threadedly connected to the inner wall of a moving block 203. The inner wall of the moving block 203 is slidably connected to the surface of a guide rod 204. Both ends of the guide rod 204 are disposed on the inner wall of the device body 1. The surface of the moving block 203 is fixedly connected to one end of a rigid spring 205. The other end of the rigid spring 205 is fixedly connected to the surface of a sliding block 206. The inner wall of the sliding block 206 is slidably connected to the surface of the double-threaded rod 202. The inner wall of the sliding block 206 is hinged to one end of a connecting rod 207. The other end of the connecting rod 207 is disposed inside the encapsulation device 3. Through the buffer structure 2, when it is necessary to adjust the contents of the mold 309... When the sensor is encapsulated, an external power source pushes the pressure plate 104 downwards, causing the pressure plate 104 to push the injection plate 105 to adhere to the upper surface of the mold 309. To protect the sensor and ensure the adhesion between the injection plate 105 and the mold 309, the injection plate 105 will push the encapsulation device 3 to move a certain distance. When the encapsulation device 3 moves downwards, it squeezes one end of the connecting rod 207, causing the other end of the connecting rod 207 to push the moving block 203 to move, thereby squeezing the hard spring 205. When the maximum thrust of the external power source is reached, the injection plate 105 begins to inject glue into the mold 309. When it is necessary to change the sealing pressure of the encapsulation device 3, the motor 201 is started, causing the motor 201 to drive the double-headed threaded rod 202 to rotate, causing the moving block 203 to move, thereby squeezing the hard spring 205, causing the initial pressure of the hard spring 205 to change, thereby changing the sealing pressure between the injection plate 105 and the mold 309.

[0034] In this invention, during use, when it is necessary to encapsulate the sensor inside the mold 309, an external power pushes the pressure plate 104 downward, causing the pressure plate 104 to push the injection plate 105 to adhere to the upper surface of the mold 309. To protect the sensor and ensure the adhesion between the injection plate 105 and the mold 309, the injection plate 105 will push the encapsulation device 3 to move a certain distance. When the encapsulation device 3 moves downward, it squeezes one end of the connecting rod 207, causing the other end of the connecting rod 207 to push the moving block 203 to move, thereby squeezing the hard spring 205. When the maximum thrust set by the external power is reached... The injection plate 105 begins injecting glue into the mold 309. When the sealing pressure of the encapsulation device 3 needs to be changed, the motor 201 is started, causing the double-threaded rod 202 to rotate, which in turn moves the moving block 203, thus compressing the hard spring 205. This changes the initial pressure of the hard spring 205, thereby altering the sealing pressure between the injection plate 105 and the mold 309. When the mold 309 needs to be installed, it is pushed downwards, causing the surface of the mold 309 to press against the extrusion block 305. The extrusion block 305 then pushes the moving sleeve 303 through the spring 304, thus... The movable sleeve 303 pushes the rotating rod 302 to rotate against the coil spring, thereby pushing out the fixed sleeve 306. The fixed sleeve 306 then pushes the locking block 308 to move via the second spring 307, causing the surface of the locking block 308 to press against the surface of the mold 309, thus compressing the second spring 307. When the mold 309 is installed, the second spring 307 pushes the locking block 308 into the inner wall of the fixed groove 3092 to fix the mold 309. When the mold 309 needs to be disassembled, the rotating rod 302 is rotated via the handle 310, causing the rotating rod 302 to pull back the locking block 308 via the fixed sleeve 306 and the second spring 307. To facilitate the quick installation and disassembly of the mold 309, when glue injection is required, the surface of the pressure plate 104 presses against the sliding rod 401, stretching the tension spring 403, causing the sliding rod 401 to move downwards. This releases the pressure of the pressure plate 404 on the ejector block 3093, allowing the ejector block 3093 to be pulled downwards by the spring 3094. When glue injection is complete, the surface of the pressure plate 104 leaves the sliding rod 401, causing the sliding rod 401 to move upwards under the action of the tension spring 403. This causes the pressure plate 404 to press against the bottom surface of the ejector block 3093, causing the ejector block 3093 to move and eject the glue-injected sensor from the mold 309.

[0035] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A high-performance photoelectric sensor packaging device, comprising a device body (1), characterized in that: The main body (1) of the device includes a shell (101), the bottom surface of which is fixedly connected to a bracket (102). A buffer structure (2) is provided inside the main body (1), and a sealing device (3) is provided on the upper surface of the buffer structure (2). A material release structure (4) is provided on the inner wall of the sealing device (3). The buffer structure (2) includes: An electric motor (201) is disposed on the surface of the device body (1). The output end of the electric motor (201) passes through the surface of the device body (1) and is rotatably connected to one end of a double-threaded rod (202). The other end of the double-threaded rod (202) is disposed on the inner wall of the device body (1). The surface of the double-threaded rod (202) is threadedly connected to the inner wall of the moving block (203). The inner wall of the moving block (203) is slidably connected to the surface of a guide rod (204). Both ends of the guide rod (204) are disposed on the inner wall of the device body (1). The surface of the movable block (203) is fixedly connected to one end of the hard spring (205), the other end of the hard spring (205) is fixedly connected to the surface of the sliding block (206), the inner wall of the sliding block (206) is slidably connected to the surface of the double-threaded rod (202), the inner wall of the sliding block (206) is hinged to one end of the connecting rod (207), and the other end of the connecting rod (207) is located inside the encapsulation device (3). The encapsulation device (3) includes a frame (301), the inner wall of which is slidably connected to the inner wall of the outer shell (101), the inner wall of which is hinged to the surface of the connecting rod (207), the inner wall of which is rotatably connected to one side of the rotating rod (302) via a coil spring, the other end of which is fixedly connected to the end face of the handle (310), and the inner wall of which is connected to the movable sleeve (307). 3) The surface of the movable sleeve (303) is slidably connected to the inner wall of the frame (301), the inner wall of the movable sleeve (303) is fixedly connected to one end of the first spring (304), the other end of the first spring (304) is fixedly connected to the back of the extrusion block (305), the surface of the extrusion block (305) is slidably connected to the inner wall of the movable sleeve (303), the inner wall of the rotating rod (302) is sleeved to the surface of the fixed sleeve (306), the surface of the fixed sleeve (306) is slidably connected to the inner wall of the frame (301), the inner wall of the fixed sleeve (306) is fixedly connected to one end of the second spring (307), the other end of the second spring (307) is fixedly connected to the back of the snap-fit ​​block (308), the surface of the snap-fit ​​block (308) is slidably connected to the inner wall of the fixed sleeve (306), the surface of the snap-fit ​​block (308) is disposed inside the mold (309), the mold (309) includes A base plate (3091) has fixing grooves (3092) on both sides. The inner wall of the fixing groove (3092) is slidably connected to the surface of the snap-fit ​​block (308). The inner wall of the base plate (3091) is slidably connected to the surface of the ejector block (3093). The surface of the ejector block (3093) is fixedly connected to the surface of the spring (3094). The two ends of the spring (3094) are fixedly connected to the inner wall of the base plate (3091). When it is necessary to install the mold (309), push the mold (309) downward, so that the surface of the mold (309) presses against the extrusion block (305), so that the extrusion block (305) pushes the movable sleeve (303) to move through the first spring (304), so that the movable sleeve (303) pushes the rotating rod (302) to rotate against the coil spring, thereby pushing out the fixed sleeve (306), so that the fixed sleeve (306) pushes the snap-fit ​​block (308) to move through the second spring (307), so that the snap-fit ​​block (308) moves. The surface of the mold (308) is pressed against the surface of the mold (309), causing the second spring (307) to compress. When the mold (309) is installed, the second spring (307) pushes the snap block (308) to slide into the inner wall of the fixing groove (3092) to fix the mold (309). When the mold (309) needs to be disassembled, the rotating rod (302) is rotated by the handle (310), so that the rotating rod (302) is pulled back by the snap block (308) through the fixing sleeve (306) and the second spring (307).

2. The high-performance photoelectric sensor packaging device according to claim 1, characterized in that: The surface of the outer casing (101) is fixedly connected to the surface of the motor (201), the inner wall of the outer casing (101) is rotatably connected to the end face of the double-threaded rod (202), and the inner wall of the outer casing (101) is fixedly connected to both ends of the guide rod (204).

3. The high-performance photoelectric sensor packaging device according to claim 2, characterized in that: The upper surface of the outer shell (101) is fixedly connected to the end face of the guide post (103), the surface of the guide post (103) is slidably connected to the inner wall of the pressure plate (104), and the bottom surface of the pressure plate (104) is fixedly connected to the glue injection plate (105).

4. The high-performance photoelectric sensor packaging device according to claim 3, characterized in that: The material removal structure (4) includes a sliding rod (401), the surface of which is slidably connected to the inner wall of the frame (301). A push plate (402) is fixedly connected to the end face of the sliding rod (401). The upper surface of the push plate (402) is fixedly connected to one end of a tension spring (403), and the other end of the tension spring (403) is fixedly connected to the bottom surface of the frame (301). An extrusion plate (404) is fixedly connected to the upper surface of the push plate (402). The extrusion plate (404) cooperates with the mold (309). When glue injection is required, the surface of the extrusion plate (104) is pressed and slid. The rod (401) and tension spring (403) cause the sliding rod (401) to move downward, thereby releasing the pressure of the extrusion plate (404) on the ejector block (3093), causing the ejector block (3093) to be pulled downward by the spring (3094) to return to its original position. When the glue injection is completed, the surface of the pressure plate (104) leaves the sliding rod (401), causing the sliding rod (401) to move upward under the action of the tension spring (403), thereby causing the extrusion plate (404) to press the bottom surface of the ejector block (3093), causing the ejector block (3093) to move and eject the glue-injected sensor out of the mold (309).

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