Photovoltaic silicon wafer slicing machine

Abstract

The present invention belongs to the technical field of silicon wafer processing, and specifically is a photovoltaic silicon wafer slicer, comprising a conveyor platform, a conveyor belt is installed on the surface of the conveyor platform; a bracket is arranged at the top of the conveyor platform, a first hydraulic cylinder is arranged at the top of the bracket, and a clamping assembly is arranged at the bottom of the first hydraulic cylinder; the clamping assembly is used to clamp and fix the silicon block to be sliced; cutting assemblies are arranged below the clamping assembly and on both sides of the conveyor platform; the photovoltaic silicon wafer slicer described in the present invention is provided with a drag plate, and when in use, the top of the drag plate squeezes and lifts the bottom end of the silicon block; and then lifts the cut silicon wafer; after the cutting is completed, the drag plate is driven by the second hydraulic cylinder and the connecting block to separate from the bottom of the silicon wafer, and then the silicon wafer falls downward onto the conveyor belt and is transported to the gas position; the silicon wafer is lifted and restricted during the entire slicing process to prevent one end of the silicon wafer from bending downward due to gravity and affecting the slicing quality.

Description

Technical Field

[0001] The invention belongs to the technical field of silicon wafer processing, in particular to a photovoltaic silicon wafer slicer. Background Art

[0002] The silicon content in the earth's crust is 25.8%, which provides an inexhaustible source for the production of monocrystalline silicon. Since silicon is one of the most abundant elements in the earth's crust, solar cells are destined to enter the large-scale market; currently, when using silicon wafers, it is necessary to slice the block silicon, which requires professional cutting.

[0003] Diamond wire cutting machines are mostly used in existing silicon wafer cutting operations. Diamond wire cutting machines are made by setting diamond wires; diamond wires are made by evenly consolidating diamond powder particles with a certain distribution density on a busbar; when in use, the diamond wires and silicon blocks are subjected to high-speed grinding motion to slice the silicon blocks; the cut silicon wafers are transported to other locations via a conveyor belt arranged below; however, in actual slicing operations, as the silicon blocks are sliced, one end of the silicon wafer is subjected to the effect of gravity, so that during the cutting process, one end of the silicon wafer is easily bent downward due to the effect of gravity; especially in the cutting of large-sized silicon wafers, the downward bending of one end of the silicon wafer during cutting will affect the cutting quality.

[0004] To this end, the present invention provides a photovoltaic silicon wafer slicer. Summary of the invention

[0005] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0006] The technical solution adopted by the present invention to solve the technical problem is as follows: a photovoltaic silicon wafer slicer described in the present invention comprises a conveying platform, a conveying belt is installed on the surface of the conveying platform; a bracket is arranged at the top of the conveying platform, a first hydraulic cylinder is arranged at the top of the bracket, and a clamping assembly is arranged at the bottom of the first hydraulic cylinder; the clamping assembly is used to clamp and fix the silicon block to be sliced; a cutting assembly is arranged below the clamping assembly and on both sides of the conveying platform; the cutting assembly is specifically a diamond wire cutting;

[0007] A pair of drag plates are arranged at the center below the clamping assembly; the drag plates are used to lift the silicon block clamped and fixed by the clamping assembly; a connecting block is arranged at the end of the drag plate, and a second hydraulic cylinder is installed on the side of the connecting block; the second hydraulic cylinder is installed on the side of the conveying platform.

[0008] Preferably, a support platform is provided at the top of the conveying platform and below the carriage.

[0009] Preferably, a rectangular hole is provided at the top of the carriage; a guide belt is provided inside the rectangular hole; a rotating shaft is provided inside the guide belt and at the end of the carriage, and a connecting piece is provided at the end of the rotating shaft; an output motor is provided at the end of the connecting piece away from the rotating shaft; the output end of the output motor is connected to the connecting piece, and the output motor housing is partially installed on the side of the conveying platform.

[0010] Preferably, the connecting member includes a connecting shaft; one end of the connecting shaft is connected to the end of the rotating shaft, and the other end is provided with a receiving plate, and the end of the receiving plate away from the connecting shaft is provided with a pair of plug-in rods based on central symmetry, and the surface of the plug-in rod is sleeved with a receiving disk; the center position of the side surface of the receiving disk is connected to the output end of the output motor.

[0011] Preferably, a pair of guide plates are symmetrically arranged above the conveyor belt based on the center line, and one end of the guide plate is slidably connected to the surface of the conveyor belt; a fixing piece is arranged between the side surface of the guide plate and the top of the conveyor platform.

[0012] Preferably, a fixing frame is provided at the top of the drag plate, a scraper is provided at the top of the fixing frame, and the bottom end of the scraper is slidably connected to the surface of the conveyor belt.

[0013] Preferably, a material receiving box is provided below the rectangular hole.

[0014] Preferably, a cooling bag is provided on the surface of the conveyor belt, mounting plates are provided at both ends of the cooling bag, and the mounting plates are installed on both sides of the carriage.

[0015] Preferably, a hose is provided through the side of the mounting plate; one end of the hose is connected to the cooling bag, and the other end is externally connected to a water pump.

[0016] Preferably, an arc-shaped slide plate is provided on the side of the drag plate and below the mounting plate; the arc-shaped slide plate is used to receive the mounting plate; and the mounting plate is slidably connected to the arc-shaped slide plate.

[0017] The beneficial effects of the present invention are as follows:

[0018] 1. The photovoltaic silicon wafer slicer described in the present invention is provided with a drag plate. When in use, the top of the drag plate squeezes and lifts the bottom end of the silicon block; and then lifts the cut silicon wafer; after the cutting is completed, the drag plate is driven to separate from the bottom of the silicon wafer by the second hydraulic cylinder and the connecting block, and then the silicon wafer falls downward onto the conveyor belt and is transported to the gas position; during the entire slicing process, the silicon wafer is lifted and restricted to prevent one end of the silicon wafer from bending downward due to gravity and affecting the slicing quality.

[0019] 2. The photovoltaic silicon wafer slicing machine described in the present invention is provided with a guide belt; when in use, the guide belt on the drag plate replaces the drag plate and is pressed against the bottom end of the silicon block. When the slicing is completed, the output motor is started, and the output motor drives the rotating shaft to rotate through the connecting piece, and then drives the guide belt to rotate through the friction force between the rotating shaft and the guide belt; the rotating guide belt drives the silicon wafer to move in the direction of the conveyor belt through the friction force, so that the silicon wafer remains relatively still with the conveyor belt when it falls onto the conveyor belt, thereby improving the stability of the silicon wafer being transported. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention will be further described below in conjunction with the accompanying drawings.

[0021] Figure 1 is a stereogram of the present invention;

[0022] Figure 2 is a schematic diagram of the position of the cutting assembly of the present invention;

[0023] Figure 3 It is a schematic diagram of the position of the carriage of the present invention;

[0024] Figure 4 It is a schematic diagram of the structure on the carriage of the present invention;

[0025] Figure 5 It is a schematic diagram of the position of the guide belt on the carriage of the present invention;

[0026] Figure 6 It is a schematic diagram of a carriage of the present invention;

[0027] Figure 7 It is a schematic diagram of a guide belt of the present invention;

[0028] Figure 8 is a schematic diagram of a connector of the present invention;

[0029] Fig. 9 It is a schematic diagram of the connection structure of the cooling bag of the present invention;

[0030] Fig.10 It is a schematic diagram of a scraper of the present invention.

[0031] In the figure: 1. conveying platform; 11. conveying belt; 12. bracket; 13. first hydraulic cylinder; 14. clamping assembly; 15. cutting assembly; 2. drag plate; 20. rectangular hole; 21. connecting block; 22. second hydraulic cylinder; 23. guide belt; 231. rotating shaft; 24. connecting piece; 241. connecting shaft; 242. receiving plate; 243. plug-in rod; 244. receiving plate; 25. output motor; 3. supporting platform; 4. receiving plate; 5. fixing frame; 51. scraper; 52. receiving box; 6. arc slide plate; 61. mounting plate; 62. hose; 63. cooling bag. DETAILED DESCRIPTION

[0032] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0033] like Figures 1 to 4 As shown, a photovoltaic silicon wafer slicer according to an embodiment of the present invention comprises a conveyor platform 1, a conveyor belt 11 is installed on the surface of the conveyor platform 1; a bracket 12 is arranged at the top of the conveyor platform 1, a first hydraulic cylinder 13 is arranged at the top of the bracket 12, and a clamping assembly 14 is arranged at the bottom of the first hydraulic cylinder 13; the clamping assembly 14 is used to clamp and fix the silicon block to be sliced; a cutting assembly 15 is arranged below the clamping assembly 14 and on both sides of the conveyor platform 1; the cutting assembly 15 is specifically a diamond wire cutting;

[0034] A pair of carriages 2 are provided at the center below the clamping assembly 14; the carriages 2 are used to lift the silicon block clamped and fixed by the clamping assembly 14; a connecting block 21 is provided at the end of the carriage 2, and a second hydraulic cylinder 22 is installed on the side of the connecting block 21; the second hydraulic cylinder 22 is installed on the side of the conveying platform 1;

[0035] In the actual slicing operation, as the silicon block is sliced, one end of the silicon wafer is subjected to the effect of gravity, so that during the cutting process, one end of the silicon wafer is prone to bend downward due to the effect of gravity; especially in the case of cutting large-sized silicon wafers, the bending of one end of the silicon wafer during cutting will affect the cutting quality; to solve the above problem, the embodiment of the present invention provides a carriage 2, which controls the operation of the conveyor belt 11 when in use; and clamps the silicon block through the clamping assembly 14; then cooperates with the first hydraulic cylinder 13 and the cutting assembly 15 to slice the silicon block; during slicing, the top end of the carriage 2 squeezes and lifts the bottom end of the silicon block; and then lifts the cut silicon wafer; after the cutting is completed, the carriage 2 is driven by the second hydraulic cylinder 22 and the connecting block 21 to separate from the bottom of the silicon wafer, and then the silicon wafer falls downward onto the conveyor belt 11 and is transported to the gas position; the silicon wafer is lifted and restricted during the entire slicing process to prevent one end of the silicon wafer from bending downward due to gravity and affecting the slicing quality.

[0036] A support platform 3 is provided at the top of the conveying platform 1 and below the carriage 2 ; the support platform 3 continuously supports the bottom end of the carriage 2 so that the carriage 2 remains horizontal, thereby ensuring the use effect of the carriage 2 .

[0037] like Figures 4 to 8As shown, a rectangular hole 20 is provided at the top of the carriage 2; a guide belt 23 is provided inside the rectangular hole 20; a rotating shaft 231 is provided inside the guide belt 23 and at the end of the carriage 2, and a connecting member 24 is provided at the end of the rotating shaft 231; an output motor 25 is provided at the end of the connecting member 24 away from the rotating shaft 231; the output end of the output motor 25 is connected to the connecting member 24, and the housing part of the output motor 25 is installed on the side of the conveying platform 1; when in use, the guide belt 23 on the carriage 2 replaces the carriage 2 to press against the bottom end of the silicon block, and when the slicing is completed, the output motor 25 is started, and the output motor 25 drives the rotating shaft 231 to rotate through the connecting member 24, and then drives the guide belt 23 to rotate through the friction between the rotating shaft 231 and the guide belt 23; the rotating guide belt 23 drives the silicon wafer to move in the running direction of the conveyor belt 11 through the friction force, so that the silicon wafer remains relatively still with the conveyor belt 11 when it falls on the conveyor belt 11, thereby improving the stability of the silicon wafer being conveyed.

[0038] The connecting member 24 includes a connecting shaft 241; one end of the connecting shaft 241 is connected to the end of the rotating shaft 231, and the other end is provided with a receiving plate 242, and the end of the receiving plate 242 away from the connecting shaft 241 is symmetrically provided with a pair of plug rods 243 based on the center, and the surface of the plug rod 243 is sleeved with a receiving plate 244; the center position of the side of the receiving plate 244 is connected to the output end of the output motor 25; when the drag plate 2 moves, the plug rod 243 moves relative to the receiving plate 244, and the receiving plate 244 drives the rotating shaft 231 to rotate continuously through the plug rod 243, the receiving plate 242 and the connecting shaft 241, and the rotating shaft 231 mobilizes the guide belt 23 to rotate; therefore, the drag plate 2 will not be hindered when moving, ensuring smoothness of use; it should be pointed out that the position of the drag plate 2 needs to be adjusted according to the size of the silicon block.

[0039] like Figures 1 to 4 As shown, a pair of guide plates 4 are symmetrically arranged above the conveyor belt 11 based on the center line, and one end of the guide plate 4 is slidably connected to the surface of the conveyor belt 11; a fixing part is arranged between the side of the guide plate 4 and the top of the conveyor platform 1; the silicon wafers transported by the guide belt 23 will be received by the guide plate 4, and then slide onto the conveyor belt 11, further improving the stability of the silicon wafers falling onto the conveyor belt 11.

[0040] like Figures 5 to 10 As shown, a fixing frame 5 is provided at the top of the drag plate 2, and a scraper 51 is provided at the top of the fixing frame 5. The bottom end of the scraper 51 is slidably connected to the surface of the conveyor belt 11. When the guide belt 23 rotates, the particles produced by cutting attached to its surface are scraped by the scraper 51, and then fall into the rectangular hole 20, thereby realizing automatic cleaning of the guide belt 23.

[0041] A material receiving box 52 is provided below the rectangular hole 20; particles passing through the rectangular hole 20 are received and collected by the material receiving box 52, which is convenient for subsequent cleaning.

[0042] A cooling bag 63 is provided on the surface of the conveyor belt 11, and mounting plates 61 are provided at both ends of the cooling bag 63, and the mounting plates 61 are installed on both sides of the carriage 2; when in use, the heat generated by cutting will continuously heat the guide belt 23, and by providing the cooling bag 63, the coolant in the cooling bag 63 cools the guide belt 23 to prevent the guide belt 23 from being continuously overheated and causing relaxation to affect the use effect.

[0043] A hose 62 is provided on the side of the mounting plate 61; one end of the hose 62 is connected to the cooling bag 63, and the other end is connected to a water pump; when in use, the water pump is started, and the water pump transports the external coolant into the cooling bag 63 through the hose 62 at one end of the cooling bag 63, and then discharges it through the other hose 62, so that the coolant in the cooling bag 63 keeps flowing, thereby optimizing the cooling effect.

[0044] An arc-shaped slide plate 6 is provided on the side of the carriage 2 and below the mounting plate 61; the arc-shaped slide plate 6 is used to receive the mounting plate 61; the mounting plate 61 is slidably connected to the arc-shaped slide plate 6; when in use, as the guide belt 23 rotates, the guide belt 23 drives the cooling bag 63 to rotate synchronously through friction, and the cooling bag 63 drives the mounting plate 61 to rotate on the arc-shaped slide plate 6; so that the cooling bag 63 can rotate synchronously with the guide belt 23 when in use, thereby reducing the friction effect between the guide belt 23 and the cooling bag 63; and protecting the cooling bag 63; it should be pointed out that the hose 62 is inserted into the mounting plate 61 and is rotatably connected to the mounting plate 61, and does not interfere with the rotation of the mounting plate 61.

[0045] During operation, the conveyor belt 11 is controlled to operate; and the silicon block is clamped by the clamping assembly 14; then the silicon block is sliced ​​in cooperation with the first hydraulic cylinder 13 and the cutting assembly 15; during slicing, the top of the carriage 2 squeezes and lifts the bottom end of the silicon block; and then the cut silicon wafer is lifted; after the cutting is completed, the carriage 2 is driven to separate from the bottom of the silicon wafer by the second hydraulic cylinder 22 and the connecting block 21, and then the silicon wafer falls downward onto the conveyor belt 11 and is transported to the gas position; the silicon wafer is lifted and restricted during the entire slicing process to prevent one end of the silicon wafer from bending downward due to gravity and affecting the slicing quality; a support platform 3 is provided at the top of the conveying platform 1 and below the carriage 2; the support platform 3 continuously supports the bottom end of the carriage 2, so that the carriage 2 remains horizontal, ensuring the use effect of the carriage 2; when in use, the guide belt 23 on the carriage 2 replaces the carriage 2 to press against the bottom end of the silicon block, and when the slicing is completed, the output motor 25 starts The output motor 25 drives the rotating shaft 231 to rotate through the connecting piece 24, and then drives the guide belt 23 to rotate through the friction between the rotating shaft 231 and the guide belt 23; the rotating guide belt 23 drives the silicon wafer to move in the running direction of the conveyor belt 11 through the friction force, so that the silicon wafer remains relatively still with the conveyor belt 11 when it falls on the conveyor belt 11, thereby improving the stability of the silicon wafer being transported; when the carriage 2 moves, the plug-in rod 243 moves relative to the receiving plate 244, and the receiving plate 244 drives the rotating shaft 231 to rotate continuously through the plug-in rod 243, the receiving plate 242 and the connecting shaft 241, and the rotating shaft 231 mobilizes the guide belt 23 to rotate; therefore, the carriage 2 will not be hindered when moving, ensuring smoothness of use; the silicon wafer transported by the guide belt 23 will be received by the receiving plate 4, and then slide into the conveyor belt 11, further improving the stability of the silicon wafer falling on the conveyor belt 11.

[0046] When the guide belt 23 rotates, the particles produced by cutting and attached to its surface are scraped by the scraper 51; then they fall into the rectangular hole 20, realizing automatic cleaning of the guide belt 23; a receiving box 52 is provided below the rectangular hole 20; the particles passing through the rectangular hole 20 are received and collected by the receiving box 52, which is convenient for subsequent cleaning; when in use, the heat generated by cutting will continuously heat the guide belt 23, and by providing a cooling bag 63, the coolant in the cooling bag 63 cools the guide belt 23 to prevent the guide belt 23 from being continuously overheated and causing relaxation to affect the use effect; when in use, the cooling bag 63 is turned on and the cooling liquid in the cooling bag 63 cools the guide belt 23 A water pump is driven, and the water pump transports the external coolant into the cooling bag 63 through the hose 62 at one end of the cooling bag 63, and then discharges it through another hose 62, so that the coolant in the cooling bag 63 keeps flowing, thereby optimizing the cooling effect; when in use, as the guide belt 23 rotates, the guide belt 23 drives the cooling bag 63 to rotate synchronously through friction, and the cooling bag 63 drives the mounting plate 61 to rotate on the arc-shaped slide plate 6; so that the cooling bag 63 can rotate synchronously with the guide belt 23 when in use, reducing the friction effect between the guide belt 23 and the cooling bag 63; and protecting the cooling bag 63.

[0047] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A photovoltaic silicon wafer slicer, characterized in that: The invention comprises a conveying platform (1), a conveying belt (11) being installed on the surface of the conveying platform (1); a bracket (12) being arranged at the top of the conveying platform (1), a first hydraulic cylinder (13) being arranged at the top of the bracket (12), and a clamping assembly (14) being arranged at the bottom of the first hydraulic cylinder (13); the clamping assembly (14) being used for clamping and fixing a silicon block to be sliced; a cutting assembly (15) being arranged below the clamping assembly (14) and on both sides of the conveying platform (1); the cutting assembly (15) is specifically a diamond wire cutting assembly; A pair of carriages (2) are arranged at the center below the clamping assembly (14); the carriages (2) are used to lift the silicon block clamped and fixed by the clamping assembly (14); a connecting block (21) is arranged at the end of the carriage (2); a second hydraulic cylinder (22) is installed on the side of the connecting block (21); the second hydraulic cylinder (22) is installed on the side of the conveying platform (1); a support platform (3) is arranged at the top of the conveying platform (1) and below the carriage (2); A rectangular hole (20) is provided at the top of the carriage (2); a guide belt (23) is provided inside the rectangular hole (20); a rotating shaft (231) is provided inside the guide belt (23) and at the end of the carriage (2); a connecting piece (24) is provided at the end of the rotating shaft (231); an output motor (25) is provided at the end of the connecting piece (24) away from the rotating shaft (231); an output end of the output motor (25) is connected to the connecting piece (24), and a housing portion of the output motor (25) is mounted on a side surface of the conveying platform (1); The connecting member (24) comprises a connecting shaft (241); one end of the connecting shaft (241) is connected to the end of the rotating shaft (231), and the other end is provided with a receiving plate (242); the end of the receiving plate (242) away from the connecting shaft (241) is provided with a pair of plug-in rods (243) based on central symmetry, and the surface of the plug-in rods (243) is sleeved with a receiving plate (244); the center position of the side of the receiving plate (244) is connected to the output end of the output motor (25); A pair of guide plates (4) are symmetrically arranged above the conveyor belt (11) based on the center line, and one end of the guide plate (4) is slidably connected to the surface of the conveyor belt (11); a fixing piece is arranged between the side surface of the guide plate (4) and the top of the conveyor platform (1).

2. A photovoltaic silicon wafer slicer according to claim 1, characterized in that: A fixing frame (5) is arranged at the top of the drag plate (2), a scraper (51) is arranged at the top of the fixing frame (5), and the bottom end of the scraper (51) is slidably connected to the surface of the conveyor belt (11).

3. A photovoltaic silicon wafer slicer according to claim 2, characterized in that: A material receiving box (52) is provided below the rectangular hole (20).

4. The photovoltaic silicon wafer slicer according to claim 1, characterized in that: A cooling bag (63) is provided on the surface of the conveyor belt (11), mounting plates (61) are provided at both ends of the cooling bag (63), and the mounting plates (61) are mounted on both sides of the carriage (2).

5. A photovoltaic silicon wafer slicer according to claim 4, characterized in that: A hose (62) is provided through the side of the mounting plate (61); one end of the hose (62) is connected to the cooling bag (63), and the other end is externally connected to a water pump.

6. A photovoltaic silicon wafer slicer according to claim 5, characterized in that: An arc-shaped slide plate (6) is provided on the side of the drag plate (2) and below the mounting plate (61); the arc-shaped slide plate (6) is used to receive the mounting plate (61); and the mounting plate (61) is slidably connected to the arc-shaped slide plate (6).

Images