An electronic component factory inspection device and method

Abstract

The present invention relates to an electronic component factory inspection device and method, and to the technical field of electronic component inspection; the device comprises an inspection cabinet, a conveyor and an inspection unit, the inspection unit comprises a detection probe for inspecting the heat dissipation performance of the electronic component and a horizontal adjustment frame arranged above the detection probe for position adjustment of the detection probe, and a heating block and a temperature sensing block are arranged on the detection probe; the present invention can inspect the heat dissipation performance of the electronic component and the hardness of the electronic component under different temperature states, thereby ensuring the quality of the electronic component before delivery; secondly, the present invention can reduce the inspection of a single position of the electronic component in the traditional technology, and improve the accuracy of the electronic component inspection by means of multi-point inspection.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component detection, and in particular to an electronic component factory detection device and method. Background Art

[0002] Electronic components usually refer to electronic components and small machines and instruments. They can be used in similar products and are certain parts of industries such as electrical appliances, radios, and instruments. Among electronic components, aluminum substrate is a special metal-based printed circuit board (MCPCB), which improves the heat dissipation of the circuit board by attaching the printed circuit board to a metal substrate.

[0003] Aluminum substrates are commonly found in LED lighting products and have two sides, one for soldering LED pins and the other for contacting the heat-conducting part. The structure of an aluminum substrate usually consists of three layers: a circuit layer (copper foil), an insulating layer, and a metal substrate. Therefore, as a type of circuit board, aluminum substrates are an important component of electronic components for specific applications such as LED lighting.

[0004] The production inspection of aluminum substrate is an important link to ensure product quality.

[0005] For example, the Chinese patent with the publication number CN214122066U discloses a thermal conductivity meter for aluminum-based copper-clad laminate detection, including a base, a temporary rack is arranged on the left side of the top of the base, a second lifting device is arranged on the right side of the temporary rack, a detection lower plate is fixedly connected to the top of the second lifting device, a normal product conveyor belt is arranged at the rear end of the detection lower plate, a defective product conveyor belt is arranged below the normal product conveyor belt, a detection upper plate is arranged on the left side of the first lifting device and the detection upper plate is directly above the detection lower plate, an intelligent measuring instrument is arranged on the right side of the first lifting device, a push plate is fixedly connected to the output end of the pneumatic telescopic rod, guide rods are arranged on both sides of the pneumatic telescopic rod and the two ends of the guide rods are respectively fixedly connected to the push plate and the mounting plate. Unqualified aluminum substrates can be measured in time to control product quality, and materials can be automatically fed to save labor costs, which is worthy of promotion.

[0006] However, the above electronic component detection device still has some shortcomings in actual use:

[0007] 1. In the above-mentioned prior art, the thermal conductivity of the aluminum substrate can be detected by a detector, but the detector only detects the aluminum substrate at one position against the aluminum substrate. The detection position is single, which will result in less detection data and easily lead to a certain degree of randomness in the detection result. In addition, only detecting a single position of the aluminum substrate will result in poor accuracy of the detection result.

[0008] 2. Secondly, in the prior art, the aluminum substrate, as a heat dissipation product, needs to be subjected to long-term alternation between hot and cold. Therefore, when the aluminum substrate is inspected, the prior art is unable to inspect the overall quality and hardness of the aluminum substrate at room temperature and at high temperature. The prior art simply inspects the aluminum substrate at room temperature, which results in poor reliability of the aluminum substrate.

[0009] Therefore, based on the above-stated viewpoints, there is still room for improvement in the existing electronic component detection devices. Summary of the invention

[0010] In order to solve the above problems, the present invention provides an electronic component factory inspection device and method.

[0011] In a first aspect, an electronic component factory inspection device includes a testing cabinet having a working area for storing electronic components.

[0012] The conveyor is installed inside the testing cabinet and realizes batch transportation of electronic components.

[0013] The detection part is arranged in the detection cabinet and is located at the upper and lower ends of the conveyor. The detection part includes a detection probe for detecting the heat dissipation performance of electronic components and a horizontal adjustment frame arranged above the detection probe for adjusting the position of the detection probe. The two detection probes and the horizontal adjustment frame are symmetrically arranged in the detection cabinet, and a position adjustment member is arranged on the horizontal adjustment frame to adjust the position of the detection probe.

[0014] Preferably, a synchronizer for controlling the synchronous rotation and relative lifting of the detection probe is provided in the working area of ​​the detection cabinet, and the synchronizer includes a synchronization sleeve, a synchronization passive control component, an execution belt, a synchronization shaft, a driving gear and a driving motor; the synchronization sleeve is symmetrically rotated in the detection cabinet, and the synchronization passive control component is slidably arranged in the synchronization sleeve from bottom to top, and the opposite sides of the two synchronization passive control components are connected to the horizontal adjustment frame.

[0015] The two actuating belts are respectively sleeved on corresponding synchronous sleeves, and a synchronous shaft is commonly arranged at one end of the two actuating belts away from the synchronous sleeves.

[0016] One of the driving gears is fixedly mounted on a synchronous sleeve on one side, and the other driving gear is fixedly mounted on an output shaft of a driving motor, and the two driving gears are meshed with each other. The driving motor is mounted on the inner wall of the detection cabinet through a motor seat.

[0017] Preferably, the sliding connection between the synchronous sleeve and the synchronous passive control member is a sawtooth structure.

[0018] Preferably, the synchronizer also includes a lifting component for controlling the synchronous relative lifting of the two horizontal adjustment frames, and the lifting component includes a limit block, a limit horizontal rod, a limit vertical rod, a limit gear and a lifting electric push rod; the limit blocks are respectively installed on two synchronous passive control components, the limit horizontal rods are respectively plugged and installed on the two limit blocks, and the limit horizontal rods extend along the length direction of the execution belt, the limit vertical rods are respectively fixed to the ends of the two limit horizontal rods away from the limit blocks, and the two limit vertical rods are staggered, and the opposite side of the limit vertical rod is a sawtooth structure, the limit gear is rotatably arranged on the detection cabinet, and the limit gear is meshed with the two limit vertical rods.

[0019] The lifting electric push rod is arranged on the detection cabinet, and the output end of the lifting electric push rod is downwardly connected to a limit horizontal rod on one side.

[0020] Preferably, the position adjustment component includes an adjusting sleeve, a T-shaped column, a limit compression spring, a gripping handle, a locking gear and a locking rack. The adjusting sleeve is slidably arranged in the horizontal adjustment frame at equal intervals along the length direction of the horizontal adjustment frame, and an adjusting groove for the adjusting sleeve to adjust the position is provided in the horizontal adjustment frame. The T-shaped column is slidably installed in the adjusting sleeve along the height direction of the adjusting sleeve in an inverted manner, and a limit compression groove for the T-shaped column to limit the sliding movement is provided in the adjusting sleeve. The limit compression spring is sleeved on the T-shaped column, and the limit compression spring is provided between the T-shaped column and the inner wall of the adjusting sleeve. The gripping handle is provided at the top of the T-shaped column.

[0021] A locking gear is integrally arranged at the middle of the T-shaped column, and the locking rack is arranged at the upper end of the horizontal adjustment frame through a bracket, and the locking gear is movably meshed with the locking rack.

[0022] Preferably, the detection probe is movably inserted and installed in the adjustment sleeve.

[0023] Preferably, the detection probe comprises a heating block and a temperature sensing block, a heating block is provided at the bottom of the detection probe on one side, and a temperature sensing block for receiving the temperature of the heating block is provided on the detection probe on the other side.

[0024] Preferably, a hardness detection module for performing scratch resistance detection on the surface of electronic components is also provided between the detection probe and the adjustment sleeve. The hardness detection module includes an adjustment sleeve, a plug-in circular hole provided on the detection probe, and a plug-in board movably installed in the plug-in circular hole. A hardness detector is installed on the bottom of the plug-in board by means of a threaded connection.

[0025] Preferably, the plug-in board is an L-shaped structure, and a magnetic cylinder matching the plug-in circular hole on the adjusting sleeve is integrally fixedly connected to one side of the plug-in board, and magnets matching the magnetic cylinder are provided in the plug-in circular holes of the adjusting sleeve and the detection probe.

[0026] In a second aspect, the present invention further provides a method for detecting electronic components before leaving the factory, and the method for detecting electronic components before leaving the factory is as follows:

[0027] S1. Preparation: transport the pre-produced electronic components to the work area on the test cabinet where the electronic components are stored, and then start the conveyor inside the test cabinet to make it rotate clockwise at a constant speed;

[0028] S2. Transportation of electronic components: Then, the electronic components to be tested are placed on the conveyor and limited so that they enter the testing area of ​​the testing cabinet along the conveyor;

[0029] S3. Product heat dissipation detection: After the conveyor transports the electronic components to the designated area of ​​the detection cabinet, the detection probes on the detection unit contact the surface of the electronic components, and then the detection unit performs heat dissipation performance detection on the surface of the detected electronic components;

[0030] S4. Product wear resistance test: After testing the heat dissipation performance of the surface of the electronic components, the testing department will continue to test the hardness of the electronic components to check the hardness of the surface of the electronic components;

[0031] S5. Product Diversity Testing: The testing department tests the hardness of electronic components at room temperature and at continuous high temperature.

[0032] S6. Product collection: After the electronic components are tested, they are collected and the batch testing of the subsequent electronic components is repeated.

[0033] In summary, the present application includes at least one of the following beneficial technical effects:

[0034] 1. The position adjustment member in the present invention can not only adjust the position of the detection probe for electronic components of different sizes to improve the applicability of the present invention, but also can accurately adjust the position of each detection probe individually, ensuring that the detection probe can perform regular and fixed-point detection on each or multiple positions on the electronic components, thereby improving the accuracy of production detection of electronic components; and simultaneous analysis of detection data from multiple monitoring probes can be of great significance to the detection results, ensuring the universality of the detection results and avoiding randomness of the detection results.

[0035] 2. Electronic components are often in a state of alternating hot and cold when working, so it is impossible to ensure whether the hardness of the electronic components changes under the state of alternating hot and cold for a long time. Therefore, the present invention also proposes to detect the hardness of electronic components under different temperatures, which further improves the accuracy of electronic component hardness detection.

[0036] 3. The present invention can detect the hardness of electronic components through a hardness detector, and can also replace hardness detectors of different shapes. The hardness detector can be installed and disassembled by rotating to ensure quick replacement of the hardness detector. The bottom of the hardness detector and the contact end of the electronic component surface have a point structure, a surface structure and other different structures. The surface hardness of the electronic component can be detected in a variety of different ways, thereby improving the diversity of electronic component hardness detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0038] Figure 1 It is a schematic diagram of the main structure of the present invention.

[0039] Figure 2 It is a schematic diagram of the structure between the conveyor and the detection unit of the present invention.

[0040] Figure 3 It is a schematic structural diagram of the conveyor of the present invention.

[0041] Figure 4 It is a schematic diagram of the structure between the synchronizer and the lifting member of the present invention from a first perspective.

[0042] Figure 5 It is a schematic diagram of the first viewing angle structure between the detection probe and the horizontal adjustment frame of the present invention.

[0043] Figure 6 It is a schematic diagram of the second viewing angle structure between the detection probe and the horizontal adjustment frame of the present invention.

[0044] Figure 7 It is a structural schematic diagram of the position adjusting member of the present invention.

[0045] Figure 8 It is a structural explosion diagram of the position adjusting member of the present invention.

[0046] Fig. 9 It is a schematic diagram of the structure between the synchronizer and the lifting member of the present invention from a first perspective.

[0047] Fig.10 It is a structural explosion diagram of the hardness detection module of the present invention.

[0048] Fig.11It is a flow chart of the electronic component factory inspection method of the present invention.

[0049] In the figure, A, electronic components; 1, detection cabinet; 2, conveyor; 3, detection part; 30, detection probe; 31, horizontal adjustment frame; 32, position adjustment member; 4, synchronizer; 40, synchronous sleeve; 41, synchronous passive control member; 42, execution belt; 43, synchronous shaft; 44, driving gear; 45, driving motor; 5, lifting member; 50, limit block; 51, limit horizontal rod; 52, limit vertical rod; 53, limit gear; 54, lifting electric push rod; 320, adjustment sleeve; 32 1. T-shaped column; 322. Limiting compression spring; 323. Holding handle; 324. Locking gear; 325. Locking rack; 300. Heating block; 301. Temperature sensing block; 6. Hardness detection module; 60. Plug-in hole; 61. Plug-in board; 62. Hardness detector; 63. Magnetic cylinder; 64. Magnet; 20. Conveying shaft; 21. Conveying belt; 22. Fixed block; 23. Adjusting block; 24. Adjusting threaded rod; 25. Conveying motor; 26. No. 1 connecting belt; 27. No. 2 connecting belt. DETAILED DESCRIPTION

[0050] The following is combined with Figure 1-Figure 11 While embodiments of the invention have been described in detail, the invention can be implemented in many different ways as defined and covered by the claims.

[0051] The embodiment of the present application discloses an electronic component factory inspection device and method, which illustrates that the electronic component factory inspection device and method are mainly used in the process of production inspection of aluminum substrates, and can avoid the problem of poor accuracy of aluminum substrate performance inspection results in the prior art in terms of technical effect; especially in the process of heat dissipation and wear resistance inspection of the aluminum substrate, the prior art can perform heat dissipation inspection and wear resistance inspection separately for the aluminum substrate, which causes the prior art to have a certain degree of singleness, and in life, aluminum substrates are often used for heat dissipation, and the prior art cannot detect the wear resistance and overall hardness of the aluminum substrate under different temperature states; when performing production inspection on electronic component A, it can be inspected by sampling.

[0052] It should be noted that the electronic component A in the present invention mainly refers to an aluminum substrate, which is a metal-based copper-clad plate, which is usually composed of a three-layer structure: a circuit layer (copper foil), an insulating layer, and a metal base layer. This structure enables the aluminum substrate to have a good heat dissipation function, and is particularly suitable for the fields of LED lighting, power electronics, automotive electronics, communication equipment, and solar energy. Embodiment 1

[0053] Reference Figure 1, which is a schematic diagram of the main structure of the present invention; specifically, an electronic component factory inspection device includes a detection cabinet 1, which is provided with a working area for storing electronic components A.

[0054] The testing cabinet 1 is used for placing and testing electronic components A. First, the electronic components A to be tested are placed in the working area of ​​the testing cabinet 1 for short-term storage. After testing, subsequent operations can be carried out.

[0055] See also Figure 1 , Figure 2 and Figure 3 As shown, it is a schematic diagram of the structure of the conveyor 2 in this embodiment; the conveyor 2 is arranged inside the detection cabinet 1, and realizes the batch transportation of electronic components A; the conveyor 2 includes a conveying shaft 20, a conveying belt 21, a fixing block 22, an adjusting block 23, an adjusting threaded rod 24, a conveying motor 25, a No. 1 connecting belt 26 and a No. 2 connecting belt 27.

[0056] The conveying shaft 20 is distributed in a rectangular rotation inside the detection cabinet 1, the conveying belt 21 is symmetrically arranged along the width direction of the detection cabinet 1, the fixing blocks 22 are arranged on the conveying belt 21 at equal intervals, and the fixing blocks 22 on the two conveying belts 21 correspond one to one, the adjusting blocks 23 are arranged on the conveying shaft 20, and the adjusting threaded rods 24 are arranged on both sides thereof along the length direction of the detection cabinet 1, and the adjusting blocks 23 are threadedly connected with the adjusting threaded rods 24.

[0057] The conveying motor 25 and the adjusting threaded rod 24 are staggered and distributed, as shown in FIG. Figure 3 As shown, no interference occurs between them.

[0058] The conveying motor 25 is arranged on the conveying shaft 20 on one side of the conveying belt 21 in the detection cabinet 1, the No. 1 connecting belt 26 is sleeved on the two adjusting threaded rods 24, and the No. 2 connecting belt 27 is sleeved on the conveying shaft 20 on the same side of the two conveying belts 21.

[0059] During the specific implementation process, the conveying motor 25 rotates, and the conveying motor 25 controls the two conveyor belts 21 to rotate synchronously and in the same direction with the cooperation of the No. 2 connecting belt 27, and the two corresponding fixed blocks 22 on the two conveyor belts 21 move synchronously; when the conveyor belt 21 moves at a constant speed, the electronic components A placed in the working area of ​​the detection cabinet 1 are placed between the two corresponding fixed blocks 22, and are clamped and transported by the two fixed blocks 22, so that they are transported to the middle of the detection cabinet 1 for inspection.

[0060] In order to further ensure the adaptability of the present invention and realize that the present invention can clamp and transport electronic components A of different sizes, the present invention also proposes an adjusting threaded rod 24. It should be noted that a bidirectional threaded groove is provided on the adjusting threaded rod 24. Therefore, when the adjusting threaded rod 24 rotates, the two conveyor belts 21 can approach and move away from each other synchronously. Therefore, the fixed blocks 22 on the two conveyor belts 21 that clamp the electronic components A also approach and move away synchronously accordingly, thereby realizing the clamping and transportation of electronic components A of different sizes.

[0061] See also Figure 4 As shown, it is a structural schematic diagram of the detection of electronic component A in this embodiment; the detection part 3 is arranged in the detection cabinet 1 and is located at the upper and lower ends of the conveyor 2. The detection part 3 includes a detection probe 30 for detecting the heat dissipation performance of the electronic component A and a horizontal adjustment frame 31 arranged above the detection probe 30 for adjusting the position of the detection probe 30. The two detection probes 30 and the horizontal adjustment frame 31 are symmetrically arranged in the detection cabinet 1, and a position adjustment member 32 is arranged on the horizontal adjustment frame 31 to adjust the position of the detection probe 30.

[0062] It should be noted that the detection probe 30 is slidably arranged between the horizontal adjustment frames 31, and the position of the detection probe 30 is adjusted by the position adjustment member 32, so as to ensure that the detection probe 30 can detect different positions of the electronic component A, and the position of the detection probe 30 can also be adjusted for electronic components A of different sizes to adapt to the detection of electronic components A of different sizes.

[0063] Reference Figure 5 , Figure 6 and Figure 7 As shown, it is a schematic diagram of the structure of the position adjustment member 32 mentioned above for controlling the position adjustment of the detection probe 30; specifically, the position adjustment member 32 includes an adjusting sleeve 320, a T-shaped column 321, a limit compression spring 322, a gripping handle 323, a locking gear 324 and a locking rack 325, the adjusting sleeve 320 is slidably arranged in the horizontal adjustment frame 31 at equal intervals along the length direction of the horizontal adjustment frame 31, and an adjusting groove for the adjusting sleeve 320 to adjust the position is provided in the horizontal adjustment frame 31, the T-shaped column 321 is slidably installed in the adjusting sleeve 320 along the height direction of the adjusting sleeve 320 in an inverted manner, and a limit sliding groove for the T-shaped column 321 to limit the sliding movement is provided in the adjusting sleeve 320, the limit compression spring 322 is sleeved on the T-shaped column 321, and the limit compression spring 322 is arranged between the T-shaped column 321 and the inner wall of the adjusting sleeve 320, and the gripping handle 323 is arranged at the top of the T-shaped column 321.

[0064] It should be noted that, under the initial loading, under the action of the limiting compression spring 322, the bottom of the T-shaped column 321 rests on the adjusting sleeve 320, and at the same time the limiting compression spring 322 presses the T-shaped column 321 downward, so that the locking gear 324 on the T-shaped column 321 and the locking rack 325 on the horizontal adjustment frame 31 engage with each other. At this time, the T-shaped column 321 is limited in the horizontal adjustment frame 31 and cannot be adjusted in position.

[0065] A locking gear 324 is integrally provided in the middle of the T-shaped column 321 . A locking rack 325 is provided on the upper end of the horizontal adjustment frame 31 through a bracket, and the locking gear 324 is movably meshed with the locking rack 325 .

[0066] During the specific implementation process, when electronic components A of the same size in the same batch have completed the inspection, and the size of the electronic components A to be inspected in the next batch is different from the size of the electronic components A in the previous batch, it is necessary to adjust the position of the detection probe 30 so that the detection probe 30 can be evenly spaced on the surface of the next batch of electronic components A to be inspected, thereby ensuring the accuracy of the inspection results of each electronic component A during production inspection.

[0067] Therefore, when it is necessary to adjust the position of the detection probe 30, first grasp the holding handle 323 and lift it upward to move the T-shaped column 321 connected to the holding handle 323 upward. At this time, the locking gear 324 on the T-shaped column 321 and the locking rack 325 on the horizontal adjustment frame 31 are separated from each other. At this time, the T-shaped column 321 can be adjusted along the limiting slide groove in the horizontal adjustment frame 31. When the position of the T-shaped column 321 is adjusted to the specified appropriate position, release the holding handle 323. At this time, under the elastic force of the limiting compression spring 322, the T-shaped column 321 moves downward to ensure that the locking gear 324 on the T-shaped column 321 is re-engaged with the locking rack 325 on the horizontal adjustment frame 31, thereby realizing the re-fixation of the position of the detection probe 30. Finally, repeat the above operation to adjust the positions of multiple detection probes 30.

[0068] The position adjustment member 32 in the present invention can not only adjust the position of the detection probe 30 for electronic components A of different sizes to improve the applicability of the present invention, but also can accurately adjust the position of each detection probe 30 individually, ensuring that the detection probe 30 can perform regular and fixed-point detection on each or multiple positions on the electronic component A, thereby improving the accuracy of production detection of the electronic component A; and simultaneous analysis of the detection data of multiple detection probes 30 can be of great significance to the detection results, ensuring the universality of the detection results and avoiding randomness of the detection results.

[0069] Reference Figure 7 and Figure 8, which is a schematic diagram of the structure of the detection probe 30 in this embodiment; specifically, the detection probe 30 includes a heating block 300 and a temperature sensing block 301, a heating block 300 is provided at the bottom of one side of the detection probe 30, and a temperature sensing block 301 that receives the temperature of the heating block 300 is provided on the other side of the detection probe 30.

[0070] It should be noted that the heating block 300 and the temperature sensing block 301 are existing known structures. The heating block 300 mainly generates heat for heating by powering on; the temperature sensing block 301 can detect the temperature and display the temperature in a digital display.

[0071] When the two detection probes 30 are against the surface of electronic component A, the heating block 300 inside the detection probe 30 located above electronic component A starts to heat up, causing the surface area of ​​electronic component A covered by the detection probe 30 to heat up. At this time, the temperature sensing block 301 located on the back of electronic component A starts to sense the temperature of the surface of electronic component A, and records the heating and cooling process of electronic component A in real time, and determines the heat dissipation performance of electronic component A based on the recorded data.

[0072] It should be noted that the heating block 300 in the present invention mainly simulates the LED lamp in the electronic component A. When it is working, it will emit a large amount of heat. At this time, it is necessary to dissipate the heat through the electronic component A and quickly transfer the heat to the back of the electronic component A, thereby simulating the heat dissipation of the electronic component A.

[0073] Reference Figure 4 and Fig. 9 As shown, the above mainly describes the steps for detecting the heat dissipation performance of the electronic component A. In the conventional technology, it is often only possible to detect the heat dissipation performance of the electronic component A as a whole. However, the present invention can detect the heat dissipation performance of multiple points on the surface of the electronic component A through a plurality of detection probes 30. In order to further improve the accuracy of the heat dissipation performance detection, the present invention also proposes a synchronizer 4. Specifically, a synchronizer 4 for controlling the synchronous rotation and relative lifting of the detection probe 30 is provided in the working area of ​​the detection cabinet 1. The synchronizer 4 includes a synchronous sleeve 40, a synchronous passive control part 41, an execution belt 42, a synchronous shaft 43, a driving gear 44 and a driving motor 45. The synchronous sleeve 40 is symmetrically rotatable and arranged in the detection cabinet 1. The synchronous passive control part 41 is slidably arranged in the synchronous sleeve 40 from bottom to top. The sliding connection between the synchronous sleeve 40 and the synchronous passive control part 41 is a sawtooth structure. The opposite sides of the two synchronous passive control parts 41 are connected to the horizontal adjustment frame 31.

[0074] The two actuator belts 42 are respectively sleeved on the corresponding synchronous sleeves 40 , and a synchronous shaft 43 is commonly provided at one end of the two actuator belts 42 away from the synchronous sleeve 40 .

[0075] One driving gear 44 is fixedly mounted on the synchronous sleeve 40 on one side, and another driving gear 44 is fixedly mounted on the output shaft of the driving motor 45, and the two driving gears 44 are meshed with each other. The driving motor 45 is mounted on the inner wall of the detection cabinet 1 through a motor seat.

[0076] The synchronizer 4 in the present invention can drive the detection probes 30 at the upper and lower ends of the electronic component A to move synchronously, ensuring that the heating block 300 and the temperature sensing block 301 on the detection probe 30 can correspond one to one, avoiding misalignment between the two, and affecting the accuracy of the temperature sensing block 301 in detecting the temperature heat dissipation performance of the electronic component A during the heating and cooling process.

[0077] It should be noted that the sliding connection between the synchronous sleeve 40 and the synchronous passive control member 41 is a sawtooth structure, the purpose of which is to ensure that the synchronous passive control member 41 can be raised and lowered while rotating to avoid interference.

[0078] Secondly, the driving motor 45 can perform continuous rotation or rotation, and is mainly controlled by numerical control. The driving motor 45 is an existing known structure and will not be described here.

[0079] During the specific implementation process, the drive motor 45 is first started. The drive motor 45 controls the synchronous sleeve 40 and the synchronous passive control component 41 to drive the horizontal adjustment frame 31 to rotate. When the horizontal adjustment frame 31 rotates, the heat dissipation performance of multiple areas on the surface of the electronic component A can be tested. A large amount of test data is collected through multi-point detection to ensure the universality of the test results and improve the accuracy of the test results.

[0080] Furthermore, when the driving motor 45 drives the synchronous sleeve 40 and the synchronous passive control component 41 on one side to rotate, it is necessary to ensure that the two horizontal adjustment frames 31 rotate synchronously, so as to ensure that the heating block 300 and the heating sensing block on the detection probe 30 are displaced at the same distance each time, so that the corresponding heating block 300 and the temperature sensing block 301 are always on the same straight line. Therefore, when the driving motor 45 drives the synchronous sleeve 40 on one side to rotate, the synchronous sleeve 40 on one side will drive the synchronous sleeve 40 on the other side to rotate synchronously with the cooperation of the synchronous shaft 43 and the execution belt 42, and finally realize that the two horizontal adjustment frames 31 always rotate synchronously.

[0081] Look again Figure 4 and Fig. 9As shown, it is a structural schematic diagram of the lifting member 5 on the synchronizer 4 of the present invention; specifically, the synchronizer 4 also includes a lifting member 5 for controlling the synchronous relative lifting of the two horizontal adjustment frames 31, and the lifting member 5 includes a limit block 50, a limit horizontal rod 51, a limit vertical rod 52, a limit gear 53 and a lifting electric push rod 54; the limit blocks 50 are respectively installed on the two synchronous passive control members 41, the limit horizontal rods 51 are respectively plugged and installed on the two limit blocks 50, and the limit horizontal rods 51 extend along the length direction of the execution belt 42, the limit vertical rods 52 are respectively fixed to the ends of the two limit horizontal rods 51 away from the limit blocks 50, and the two limit vertical rods 52 are staggered, and the opposite side of the limit vertical rod 52 is a sawtooth structure, the limit gear 53 is rotatably arranged on the detection cabinet 1, and the limit gear 53 is meshed with the two limit vertical rods 52.

[0082] The lifting electric push rod 54 is arranged on the detection cabinet 1, and the output end of the lifting electric push rod 54 is downwardly connected to the limit horizontal rod 51 on one side.

[0083] It should be noted that the lifting electric push rod 54 is a known structure, which can accurately control the lifting distance of the output end.

[0084] During the specific implementation process, the lifting electric push rod 54 pushes the limit horizontal rod 51 on one side downward, and the limit horizontal rod 51 drives the synchronous passive control component 41 and the horizontal adjustment frame 31 to move upward through the limit block 50, so that the detection probe 30 on the horizontal adjustment frame 31 can be against the electronic component A to realize the detection of the electronic component A.

[0085] When the lifting electric push rod 54 moves upward, it drives the detection probe 30 away from the electronic component A, which can provide a larger activity space for taking and placing the electronic component A in the detection cabinet 1. Embodiment 2

[0086] Reference Figure 8 and Fig.10 As shown, on the basis of Example 1, in order to further improve the integrity of the detection of electronic component A and ensure that the produced electronic component A can meet the factory standards, the present invention also proposes a hardness detection module 6, through which the hardness of electronic component A can be detected.

[0087] A hardness detection module 6 for performing scratch resistance detection on the surface of the electronic component A is also arranged between the detection probe 30 and the adjustment sleeve 320. The hardness detection module 6 includes an adjusting sleeve 320 and a plug-in circular hole 60 opened on the detection probe 30, and a plug-in board 61 movably installed in the plug-in circular hole 60. A hardness detector 62 is installed at the bottom of the plug-in board 61 by means of a threaded connection.

[0088] The plug-in board 61 comprises an L-shaped structure, and a magnetic cylinder 63 matching the plug-in circular hole 60 on the adjustment sleeve 320 is integrally fixedly connected to one side of the plug-in board 61, and a magnet 64 matching the magnetic cylinder 63 is provided in the plug-in circular hole 60 of the adjustment sleeve 320 and the detection probe 30.

[0089] During the specific implementation, after the heat dissipation performance test of the electronic component A is completed, the plug board 61 is installed into the plug hole 60 on the detection probe 30 and the adjustment sleeve 320, and the stability of the installation of the plug board 61 is ensured by the cooperation of the magnet 64 and the magnetic cylinder 63.

[0090] Then, the drive motor 45 is started, and the drive motor 45 drives the hardness detector 62 to rotate and scrape the surface of the electronic component A. After the hardness detector 62 rotates and rubs along the surface of the electronic component A, the surface of the electronic component A is inspected by the existing known visual inspection equipment, and the scratches on the surface of the electronic component A per unit area are inspected according to the specified surface, thereby realizing the detection of the surface hardness of the electronic component A.

[0091] Look again Fig.10 As shown, the hardness detector 62 is a circular ring structure, and one side of the hardness detector 62 is a quick-release end movably connected to the plug board 61, and the other side is a scratch detection end in contact with the surface of the electronic component A.

[0092] It should be noted that in order to improve the efficiency of surface hardness detection of electronic component A, the present invention also proposes a hardness detector 62 that can be replaced with different shapes. The hardness detector 62 can be installed and disassembled by rotation to ensure the replacement of the hardness detector 62. The bottom of the hardness detector 62 and the contact end with the surface of the electronic component A have a point structure and a surface structure, and the surface hardness of the electronic component A can be detected in a variety of different ways. Embodiment 3

[0093] On the basis of the first and second embodiments, in order to further improve the integrity of the detection of the electronic component A and ensure that the produced electronic component A can meet the factory standards, the present invention also proposes to perform hardness detection on the electronic component A at different temperatures.

[0094] When electronic component A is working, it needs to dissipate heat for a long time. Therefore, electronic component A works in a state of alternating hot and cold for a long time, and it cannot be ensured whether the hardness of electronic component A changes. Electronic component A may be damaged due to high temperature, or the upper end parts may become loose due to high temperature. Therefore, the present invention also proposes to test the hardness of electronic component A while testing the heat dissipation performance of electronic component A, and at the same time, the hardness of electronic component A in Example 2 is tested at room temperature, thereby realizing the hardness test of electronic component A at room temperature and high temperature, and ensuring whether the hardness of electronic component A changes within the specified temperature range.

[0095] When the heating block 300 at the bottom of the detection probe 30 heats the surface of the electronic component A, the hardness detector 62 follows the detection probe to scrape the surface of the electronic component A, so that the electronic component A is in a high temperature state. The hardness detector 62 detects the hardness of the electronic component A. Similarly, the heating can be stopped so that the hardness of the electronic component A can be detected at normal room temperature. The two are then compared to achieve high-standard and strict testing of the electronic component A.

[0096] See also Fig.11 As shown, the present invention also proposes a factory inspection method for electronic components A, and the factory inspection method for electronic components A is as follows:

[0097] S1, preparation work: the pre-produced electronic components A are transported to the working area for storing the electronic components A on the testing cabinet 1, and the conveyor 2 arranged inside the testing cabinet 1 is started.

[0098] S2. Transportation of electronic components: Then place the electronic component A to be tested on the conveyor belt 21 on the conveyor 2 and clamp the electronic component A through cooperation with the fixed block 22, and then make it rotate clockwise at a uniform speed along the rotation direction of the conveyor belt 21, so that it enters the area to be tested of the detection cabinet 1 along the conveyor belt 21.

[0099] S3. Product heat dissipation detection: After the conveyor 2 conveys the electronic component A to the designated area of ​​the detection cabinet 1, the detection probe 30 on the detection part 3 contacts the surface of the electronic component A, and then the heating block 300 on the detection probe 30 starts to heat, so that the heat is quickly transferred to the electronic component A. Then, the electronic component A quickly transfers the heat to its back side through itself to dissipate the heat. In this process, the temperature sensing block 301 is attached to the back side of the heated electronic component A, and the process of heat generation and heat dissipation of the heating block 300 is recorded in real time by the temperature sensing block 301, thereby realizing the heat dissipation performance detection of the surface of the detected electronic component A.

[0100] It should be noted that the heating block 300 and the temperature sensing block 301 can rotate on the surface of the electronic component A following the detection probe 30, thereby changing their positions on the surface of the electronic component A, and realizing one-to-one fixed-point detection of multiple positions of the electronic component A. It can not only collect multiple data for analysis, reducing the randomness of the detection results; but also improve the accuracy of the detection of the electronic component A.

[0101] S4. Product wear resistance test: After the heat dissipation performance of the surface of the electronic component A is tested, the plug board 61 is plugged into the test probe 30. At this time, the surface of the electronic component A is scratched by the hardness detector 62 on the plug board 61 to detect the hardness of the electronic component A. The hardness detector 62 can be replaced to implement hardness testing of the electronic component A using hardness detectors 62 of different shapes, which can effectively improve the diversity and accuracy of its detection.

[0102] S5. Product variety testing: The heating block 300 then heats the electronic component A, and then the hardness detector 62 is used to scratch the surface of the electronic component A to check whether the hardness of the electronic component A changes at room temperature and at high temperature, thereby effectively improving the accuracy of the hardness test of the electronic component A.

[0103] S6. Product collection: After the electronic component A is tested, it is collected, and the subsequent electronic components A are tested repeatedly in batches.

[0104] It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description, and therefore it is intended that all changes within the meaning and scope of the equivalent elements of the claims are included in the present invention, and any figure marks in the claims should not be regarded as limiting the claims involved.

[0105] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. An electronic component factory inspection device, characterized in that: include A testing cabinet (1) having a work area for storing electronic components; A conveyor (2) is arranged inside the testing cabinet (1) and realizes batch transportation of electronic components; A detection unit (3) is arranged in the detection cabinet (1) and is located at the upper and lower ends of the conveyor (2). The detection unit (3) comprises a detection probe (30) for detecting the heat dissipation performance of the electronic components and a horizontal adjustment frame (31). The detection probe (30) is slidably arranged on the horizontal adjustment frame (31). The two detection probes (30) and the horizontal adjustment frame (31) are symmetrically arranged in the detection cabinet (1). The horizontal adjustment frame (31) is provided with a position adjustment member (32) for adjusting the position of the detection probe (30); A synchronizer (4) for controlling the detection probe (30) to rotate synchronously and to rise and fall relative to each other is arranged in the working area of ​​the detection cabinet (1), and the synchronizer (4) comprises a synchronization sleeve (40), a synchronization passive control member (41), an execution belt (42), a synchronization shaft (43), a driving gear (44) and a driving motor (45); the synchronization sleeve (40) is symmetrically rotatable and arranged in the detection cabinet (1), the synchronization passive control member (41) is slidably arranged in the synchronization sleeve (40) from bottom to top, and opposite sides of the two synchronization passive control members (41) are connected to the level adjustment frame (31); The two actuating belts (42) are respectively sleeved on corresponding synchronous sleeves (40), and a synchronous shaft (43) is commonly provided at one end of the two actuating belts (42) away from the synchronous sleeve (40); One of the driving gears (44) is fixedly mounted on a synchronous sleeve (40) on one side, and the other driving gear (44) is fixedly mounted on an output shaft of a driving motor (45), and the two driving gears (44) are meshed with each other, and the driving motor (45) is mounted on the inner wall of the detection cabinet (1) via a motor seat; The synchronizer (4) further comprises a lifting member (5) for controlling the synchronous relative lifting of the two horizontal adjustment frames (31), the lifting member (5) comprising a limit block (50), a limit horizontal rod (51), a limit vertical rod (52), a limit gear (53) and a lifting electric push rod (54); the limit blocks (50) are respectively mounted on the two synchronous passive control members (41); the limit horizontal rods (51) are respectively plugged and mounted on the two limit blocks (50), and the limit horizontal rods (51) extend along the length direction of the execution belt (42); the limit vertical rods (52) are respectively fixed to one end of the two limit horizontal rods (51) away from the limit blocks (50), and the two limit vertical rods (52) are staggered and distributed, and the opposite side of the limit vertical rods (52) is a sawtooth structure; the limit gear (53) is rotatably arranged on the detection cabinet (1), and the limit gear (53) is meshed with the two limit vertical rods (52); The lifting electric push rod (54) is arranged on the detection cabinet (1), and the output end of the lifting electric push rod (54) is connected downward to a limit horizontal rod (51) on one side.

2. The electronic component factory inspection device according to claim 1, characterized in that: The sliding connection between the synchronous sleeve (40) and the synchronous passive control member (41) is a sawtooth structure.

3. The electronic component factory inspection device according to claim 1, characterized in that: The position adjustment member (32) comprises an adjustment sleeve (320), a T-shaped column (321), a limit compression spring (322), a gripping handle (323), a locking gear (324) and a locking rack (325); the adjustment sleeve (320) is slidably arranged in the horizontal adjustment frame (31) at equal intervals along the length direction of the horizontal adjustment frame (31); and an adjustment slide groove for the adjustment sleeve (320) to adjust the position is provided in the horizontal adjustment frame (31); the T-shaped column (3 21) is installed in the adjusting sleeve (320) by sliding along the height direction of the adjusting sleeve (320) in an inverted manner, and a limiting sliding groove is provided in the adjusting sleeve (320) for limiting the sliding movement of the T-shaped column (321), the limiting compression spring (322) is sleeved on the T-shaped column (321), and the limiting compression spring (322) is provided between the T-shaped column (321) and the inner wall of the adjusting sleeve (320), and the holding handle (323) is provided at the top end of the T-shaped column (321); A locking gear (324) is integrally provided at the middle of the T-shaped column (321); the locking rack (325) is arranged at the upper end of the horizontal adjustment frame (31) via a bracket, and the locking gear (324) and the locking rack (325) are movably meshed.

4. The electronic component factory inspection device according to claim 3, characterized in that: The detection probe (30) is movably plugged and installed in the adjustment sleeve (320).

5. The electronic component factory inspection device according to claim 1, characterized in that: The detection probe (30) comprises a heating block (300) and a temperature sensing block (301); the bottom of one side of the detection probe (30) is provided with the heating block (300), and the other side of the detection probe (30) is provided with a temperature sensing block (301) for receiving the temperature of the heating block (300).

6. The electronic component factory inspection device according to claim 3, characterized in that: A hardness detection module (6) for performing scratch resistance detection on the surface of the electronic component is also provided between the detection probe (30) and the adjustment sleeve (320). The hardness detection module (6) comprises the adjustment sleeve (320), a plug-in circular hole (60) provided on the detection probe (30), and a plug-in board (61) movably installed in the plug-in circular hole (60). A hardness detector (62) is installed at the bottom of the plug-in board (61) by means of a threaded connection.

7. The electronic component factory inspection device according to claim 6, characterized in that: The plug-in board (61) is an L-shaped structure, and a magnetic attraction cylinder (63) that matches the plug-in circular hole (60) on the adjustment sleeve (320) is integrally fixedly connected to one side of the plug-in board (61), while a magnet (64) that matches the magnetic attraction cylinder (63) is provided in the plug-in circular hole (60) of the adjustment sleeve (320) and the detection probe (30).

8. A method for detecting electronic components before they leave the factory, using an electronic component before they leave the factory detection device as claimed in any one of claims 1 to 7, characterized in that: The factory inspection method for electronic components is as follows: S1, preparation work: transport the pre-produced electronic components to the working area for storing electronic components on the testing cabinet (1), and then start the conveyor (2) arranged inside the testing cabinet (1) to rotate clockwise at a constant speed; S2, electronic component transportation: then placing the electronic components to be inspected on the conveyor (2) and limiting their position so that they can enter the inspection area of ​​the inspection cabinet (1) along the conveyor (2); S3, product heat dissipation detection: after the conveyor (2) conveys the electronic components to the designated area of ​​the detection cabinet (1), the detection probe (30) on the detection unit (3) contacts the surface of the electronic components, and then the detection unit (3) performs heat dissipation performance detection on the surface of the detected electronic components; S4, product wear resistance test: after the heat dissipation performance test of the surface of the electronic component is carried out, the hardness of the electronic component is further tested by the testing unit (3) to check the hardness of the surface of the electronic component; S5. Product variety testing: The testing unit (3) tests the hardness of electronic components under a continuous high temperature condition; S6. Product collection: After the electronic components are tested, they are collected and the batch testing of the subsequent electronic components is repeated.

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