Chip detection device

Abstract

The present invention relates to the field of chip detection technology, and in particular to a chip detection device, comprising a base; a positioning unit, comprising a positioning plate and a positioning tube, a wafer is adsorbed and mounted on the positioning plate by the positioning tube; a detection unit, comprising a moving module, a probe and an optical microscope; a transmission unit, comprising a vertical shaft, a first gear and a second gear, the outer edge surface of the positioning plate has a tooth groove, and the driving end of the moving module is installed with a third gear. The present invention drives the probe and the optical microscope to move a distance unit through the moving module. As the positioning plate rotates, the probe and the optical microscope complete the detection of all the unit points of the outermost circle of the wafer. After returning to the initial point, the moving module drives the probe and the optical microscope to move a distance unit again to test the second circle of chips on the wafer, and so on and so forth until all the detections are completed. Through this automated test, the test cycle of each wafer is significantly shortened. Compared with manual operation, the need for manual intervention is reduced.

Description

Technical Field

[0001] The present invention relates to the field of chip detection, and in particular to a chip detection device. Background Art

[0002] In the semiconductor manufacturing process, chip quality inspection is crucial. With the rapid development of integrated circuit technology, the complexity and integration of chips are constantly improving, which puts higher requirements on the accuracy and efficiency of chip inspection. Traditional chip inspection devices usually rely on manual operation, and have problems such as slow inspection speed, low accuracy and high labor costs, which are difficult to meet the needs of modern large-scale production.

[0003] The chip detection methods commonly used in the market currently mainly include optical detection, electrical parameter testing, and functional testing. However, these methods have the following shortcomings in the application process:

[0004] 1. Optical inspection: The optical inspection method mainly uses a microscope or optical scanning equipment to check the surface defects of the chip. Although this method can detect tiny surface defects, it has limited detection capabilities for internal structures. In addition, optical inspection equipment is expensive, has high maintenance costs, and is complex to operate, which limits its widespread application.

[0005] 2. Electrical parameter test: Electrical parameter test determines the quality of a chip by measuring its electrical performance indicators. This method can effectively detect electrical defects in the chip, but it requires physical contact with the chip under test, which can easily introduce problems such as poor contact and affect the detection accuracy. At the same time, for multi-pin chips, the testing process is cumbersome and inefficient.

[0006] Therefore, there is an urgent need for a new chip detection device to verify the integrity of chip functions. Summary of the invention

[0007] In view of the above problems existing in the prior art, the present invention is proposed.

[0008] Therefore, the technical problem to be solved by the present invention is that the existing detection technology is relatively complicated and has the problems of slow detection speed and low accuracy through manual operation.

[0009] In order to solve the above technical problems, the present invention provides the following technical solutions: a chip detection device, comprising:

[0010] A base, comprising a substrate and a mobile platform, wherein the mobile platform has a mounting portion;

[0011] The positioning unit comprises a positioning plate and a positioning tube, wherein the positioning plate has an air hole connected to an external air source and is rotatably mounted on the mounting portion through a locking motor, the positioning tube is fixedly mounted on the positioning plate and is connected to the interior of the positioning plate, and the wafer is adsorbed and mounted on the positioning plate through the positioning tube;

[0012] A detection unit, comprising a mobile module, a probe and an optical microscope, wherein the probe and the optical microscope are integrated and mounted on the mobile module, and are used to perform electrical and functional tests on the chips on the wafer;

[0013] The transmission unit includes a vertical shaft and a first gear and a second gear coaxially arranged on the vertical shaft. The outer edge surface of the positioning plate has a tooth groove meshing with the first gear. The driving end of the moving module is equipped with a third gear meshing with the second gear.

[0014] As a preferred solution of the chip detection device of the present invention, the probe comprises a detection body and a casing, and the detection body is slidably installed in the casing via an elastic member.

[0015] As a preferred solution of the chip detection device of the present invention, wherein: the moving module comprises a support plate, a guide rod, a threaded rod and a moving seat, the two ends of the guide rod are fixed to the support plate, the support plate is mounted on the base plate, the threaded rod is located below the guide rod and is rotatably connected to the support plate, and the moving seat is jointly mounted on the guide rod and the threaded rod;

[0016] Wherein, the third gear is fixedly mounted on the threaded rod.

[0017] As a preferred solution of the chip detection device of the present invention, the movable seat includes a seat body, a sliding frame is slidably installed on the seat body, the probe and the optical microscope are installed on the sliding frame, a driving member is fixedly installed on the seat body, and the output end of the driving member is fixedly connected to the sliding frame.

[0018] As a preferred solution of the chip detection device of the present invention, the surface of the positioning plate has positioning pins, and the positioning pins are evenly distributed along the circumference of the positioning plate.

[0019] As a preferred solution of the chip detection device of the present invention, the positioning tube includes a tube body, a piston, a hollow column and a suction cup, the piston is sealed and connected to the tube body and has a through hole, the hollow column is slidably installed in the tube body and one end located outside the tube body is fixed to the suction cup, and the other end of the hollow column is fixed to the piston.

[0020] As a preferred solution of the chip detection device of the present invention, wherein: an elastic member is movably mounted on the hollow column, and two ends of the elastic member are respectively fixed to the piston and the top wall of the tube body.

[0021] As a preferred solution of the chip detection device of the present invention, a water channel is arranged in the positioning plate, and the water channel has a water inlet and a water outlet, and the water inlet and the water outlet are both used to connect to a water source.

[0022] As a preferred solution of the chip detection device of the present invention, wherein: a digital infrared temperature sensor, a lens and a laser system are also fixedly installed on the sliding frame, the lens is located below the digital infrared temperature sensor, and the extension direction of the laser system is perpendicular to the sensing direction of the digital infrared temperature sensor.

[0023] As a preferred solution of the chip detection device of the present invention, wherein: a cleaning unit is fixedly installed on the support plate on one side, and the cleaning unit includes a cleaning box, a support sleeve and cleaning cotton. The surface of the cleaning box has an opening and is filled with cleaning liquid. The cleaning cotton sleeve is arranged on the support sleeve and rotatably installed in the opening of the cleaning box. The support sleeve has an extension shaft, and the inner wall of the cleaning box has a groove that can accommodate the extension shaft. A ratchet mechanism is arranged between the extension shaft and the inner wall of the groove for controlling the unidirectional rotation of the cleaning cotton.

[0024] The beneficial effects of the present invention are as follows: the wafer is adsorbed on the positioning plate by the positioning tube to maintain stability during detection. In the initial stage of detection, the positioning plate is rotated by locking the motor, and the moving module drives the probe and the optical microscope to move a distance unit to a unit point on the outermost circle of the wafer. A unit point contains a chip. The optical microscope can magnify and observe the surface of the wafer to detect physical defects on the surface of the chip. At the same time, before the probe performs electrical testing, the optical microscope can help to accurately align the position of the probe to ensure that the probe correctly contacts the target test point. As the positioning plate rotates, the probe and the optical microscope complete the detection of all the unit points on the outermost circle of the wafer and return to the initial point. The local tooth groove drives the meshing first gear to rotate again, causing the moving module to drive the probe and the optical microscope to move a distance unit again to test the second circle of chips on the wafer, and so on until all the chips on the surface of the wafer are detected. Through this automated testing, the test cycle of each wafer is significantly shortened. Compared with manual operation, it reduces the need for human intervention and can work continuously and uninterruptedly, thereby improving overall production capacity and reducing possible errors and omissions during operation. It also improves the reliability and stability of the test process by combining optical detection with electrical detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0026] Figure 1 A schematic diagram of the overall structure of a chip detection device according to an embodiment of the present invention;

[0027] Figure 2 A schematic diagram of a base structure of a chip detection device according to an embodiment of the present invention;

[0028] Figure 3 An exploded diagram of the positioning unit structure of a chip detection device according to an embodiment of the present invention;

[0029] Figure 4 A schematic diagram of the structure of a detection unit of a chip detection device according to an embodiment of the present invention;

[0030] Figure 5 A schematic diagram of the probe structure of a chip detection device according to an embodiment of the present invention;

[0031] Figure 6 A schematic diagram of the structure of a mobile base of a chip detection device according to an embodiment of the present invention;

[0032] Figure 7 A schematic diagram of the positioning tube structure of a chip detection device according to an embodiment of the present invention;

[0033] Figure 8 A schematic diagram of the partial structure of a cleaning component of a chip detection device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0034] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0035] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0036] Secondly, the present invention is described in detail with reference to schematic diagrams. When describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0037] Furthermore, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0038] Example 1

[0039] Reference Figure 1 and Figure 2 and Figure 3 and Figure 4 This embodiment provides a chip detection device, including a base 100, a positioning unit 200, a detection unit 300 and a transmission unit 400.

[0040] The base 100 includes a substrate 101 and a mobile platform 102. The substrate 101 is used to provide structural support for the entire device. The mobile platform 102 is installed on the substrate 101 and has a mounting portion 102a for fixing the positioning unit 200 and providing its movement function to facilitate unloading after detection.

[0041] The positioning unit 200 includes a positioning plate 201 and a positioning tube 202. The positioning plate 201 has an air hole 201a connected to an external air source and is rotatably mounted on the mounting portion 102a via a locking motor 204. The positioning tube 202 is fixedly mounted on the positioning plate 201 and is connected to the interior of the positioning plate 201. The wafer is adsorbed and mounted on the positioning plate 201 via the positioning tube 202.

[0042] Specifically, the positioning disk 201 has a shaft 201e, the center of which is a hollow structure and is connected to the interior of the positioning disk 201, the air hole 201a is arranged on the shaft 201e, and a slip ring 201f for covering the air hole 201a is slidably installed on the shaft 201e, so that a relatively sealed space is formed inside the positioning disk 201, thereby increasing the internal negative pressure, and the external air source is connected to the air hole 201a through an air pipe, and the air pipe is fixedly installed on the slip ring 201f to avoid the air pipe from being entangled when the positioning disk 201 rotates.

[0043] The detection unit 300 includes a mobile module 301, a probe 302 and an optical microscope 303. The probe 302 and the optical microscope 303 are integrated and mounted on the mobile module 301 to perform electrical and functional tests on the chips on the wafer. Figure 5 As an option, the probe 302 includes a detection body 302a and a casing 302b. The detection body 302a is slidably installed in the casing 302b through an elastic member. Preferably, the elastic member is a first spring 302c.

[0044] The transmission unit 400 includes a vertical shaft 401 and a first gear 402 and a second gear 403 coaxially arranged on the vertical shaft 401. The outer edge surface of the positioning plate 201 has a tooth groove 201b that is meshed and connected with the first gear 402. Specifically, the tooth groove 201b is local, and the driving end of the moving module 301 is installed with a third gear 301e that can be meshed and connected with the second gear 403.

[0045] It should be noted that the second gear 403 and the third gear 301e are conical teeth, thereby achieving a meshing connection at an angle of 90°.

[0046] In the chip detection device of this embodiment, the positioning plate 201 is connected to the external air source through the air hole 201a to generate negative pressure and provide adsorption force. The wafer is adsorbed on the positioning plate 201 through the positioning tube 202 to maintain stability during detection. In the initial stage of detection, the positioning plate 201 is rotated by locking the motor 204, and the local tooth groove 201b drives the meshing first gear 402 to rotate, and transmits the rotational force to the moving module 301 through the vertical shaft 401 and the meshing second gear 403 and the second gear 403, so that the moving module 301 drives the probe 302 and the optical microscope 303 to move a distance unit, which is located at a unit point on the outermost circle of the wafer. A unit point contains a chip. The optical microscope 303 can magnify and observe the wafer surface to detect the physical properties of the chip surface. Defects, such as scratches, contamination, cracks, etc. At the same time, before the probe 302 performs electrical testing, the optical microscope 303 can help accurately align the position of the probe 302 to ensure that the probe 302 correctly contacts the target test point. As the positioning plate 201 continues to rotate through the locking motor 204, the probe 302 and the optical microscope 303 complete the detection of all the unit points of the outermost circle of the wafer, return to the initial point, and then the local tooth groove 201b drives the meshing first gear 402 to rotate again, causing the moving module 301 to drive the probe 302 and the optical microscope 303 to move a distance unit again, and test the second circle of chips on the wafer, and so on, until all the chips on the surface of the wafer are detected. Through this automated test, the test cycle of each wafer is significantly shortened. Compared with manual operation, the need for manual intervention is reduced, and it can work continuously and uninterruptedly, thereby improving the overall production capacity, reducing the errors and omissions that may occur during the operation, and improving the reliability and stability of the test process through the combination of optical detection and electrical detection.

[0047] One of the application scenarios of the probe 302 when in use:

[0048] 1. Contact and signal transmission: The chip test probe 302 is usually integrated on the needle card, and the needle card is equipped with multiple fine probes 302. These probes 302 are designed very precisely to accurately contact with the test pads on the chip to form a good electrical connection. In this way, the test signal can be transmitted from the test instrument to each test point of the chip through the probe 302.

[0049] 2. Signal stimulation and acquisition: The test instrument sends specific electrical signals to the chip. These signals can be current, voltage or more complex digital signal sequences to activate different functional modules of the chip's internal circuit. The chip's response signal is then returned to the test instrument through the probe 302, which contains key information about the chip's function and performance.

[0050] 3. Data analysis: The response signals collected by the test instrument are analyzed to determine whether the chip works as expected. This includes checking whether there are any faults, whether the performance is up to standard, whether the speed meets the specifications, etc. Any deviation from the expected behavior may indicate that the chip is defective.

[0051] Each structure is described in detail below with reference to the accompanying drawings.

[0052] Reference Figure 4 The moving module 301 includes a support plate 301a, a guide rod 301b, a threaded rod 301c and a moving seat 301d. Both ends of the guide rod 301b are fixed to the support plate 301a. The support plate 301a is mounted on the base plate 101. The threaded rod 301c is located below the guide rod 301b and is rotatably connected to the support plate 301a. The moving seat 301d is mounted on the guide rod 301b and the threaded rod 301c.

[0053] The third gear 301e is fixedly mounted on the threaded rod 301c.

[0054] Through the arrangement of the above structure, the support plate 301a provides structural support for the entire movable module 301 and fixes the movable module 301 on the base plate 101. The local tooth groove 201b drives the third gear 301e to rotate through the transmission unit 400 and transmits the rotational force to the threaded rod 301c. Since the guide rod 301b constrains the rotation of the movable seat 301d, the movable seat 301d can achieve a smooth linear movement of a distance unit through the rotation of the threaded rod 301c and then stop.

[0055] Reference Figure 6 The movable seat 301d includes a seat body 301d-1, a sliding frame 301d-2 is slidably installed on the seat body 301d-1, the probe 302 and the optical microscope 303 are installed on the sliding frame 301d-2, and a driving member is fixedly installed on the seat body 301d-1, and the output end of the driving member is fixedly connected to the sliding frame 301d-2. Preferably, the driving member is a cylinder.

[0056] Through the setting of the above structure, the seat body 301d-1 serves as the main structure of the movable seat 301d, providing a stable installation foundation. The sliding frame 301d-2 can be slidably installed on the seat body 301d-1, which is convenient for adjusting the position of the probe 302 and the optical microscope 303, and realizes fast and smooth sliding adjustment through the cylinder, thereby improving the detection accuracy and efficiency and meeting the needs of modern large-scale production.

[0057] As an option, in order to improve the accuracy of the position when the wafer is placed, the surface of the positioning plate 201 has positioning pins 201 c, and the positioning pins 201 c are evenly distributed along the circumference of the positioning plate 201.

[0058] Reference Figure 7 The positioning tube 202 includes a tube body 202a, a piston 202b, a hollow column 202c and a suction cup 202d. The piston 202b is sealed and connected to the tube body 202a and has a through hole 202b-1. The hollow column 202c is slidably installed in the tube body 202a and one end located outside the tube body 202a is fixed to the suction cup 202d, and the other end of the hollow column 202c is fixed to the piston 202b.

[0059] An elastic member is movably mounted on the hollow column 202c, and two ends of the elastic member are respectively fixed to the piston 202b and the inner top wall of the tube body 202a. Preferably, the elastic member is a second spring 202e.

[0060] Through the above-mentioned structure, after the wafer contacts the suction cup 202d, the external air source draws the inside of the positioning plate 201 to negative pressure through the air pipe. After the wafer contacts the suction cup 202d, the piston 202b moves downward in the tube body 202a under the action of pressure, and the second spring 202e is stretched, driving the wafer to move to a fixed position, ensuring the stable positioning of the wafer during the detection process. After the detection is completed, the external air source is turned off, the pressure in the positioning plate 201 is restored to balance, the second spring 202e pulls the piston 202b to reset, and the wafer is re-bounced, which is convenient for the robot to pick up.

[0061] Example 2

[0062] Reference Figure 3 and Figure 6 , which is the second embodiment of the present invention, is based on the previous embodiment and provides a chip detection device.

[0063] A water channel 201d is provided in the positioning plate 201. The water channel 201d has a water inlet 201d-1 and a water outlet 201d-2. Both the water inlet 201d-1 and the water outlet 201d-2 are used to connect to a water source.

[0064] A digital infrared temperature sensor 304 , a lens 305 and a laser system 306 are also fixedly mounted on the sliding frame 301d - 2 . The lens 305 is located below the digital infrared temperature sensor 304 . The extension direction of the laser system 306 is perpendicular to the sensing direction of the digital infrared temperature sensor 304 .

[0065] Through the setting of the above structure, the water channel 201d can be designed to be serpentine and curved to increase the flow time of the medium. The medium temperature can be set according to the temperature required for wafer detection. The ultraviolet laser assisted probe 302 and optical microscope 303 emitted by the laser system 306 provide more comprehensive detection results and can more effectively detect surface and sub-surface defects. At the same time, the lens 305 is used to reflect ultraviolet laser and transmit infrared rays. By using 45° reflection, the infrared light in the detection process can pass through to the digital infrared temperature sensor 304, collect the temperature of the detection surface, and make timely adjustments.

[0066] Example 3

[0067] Reference Figure 1 and Figure 8 , which is the third embodiment of the present invention. Based on the previous embodiment, this embodiment provides a chip detection device, including a cleaning unit 500.

[0068] The cleaning unit 500 includes a cleaning box 501, a supporting sleeve 502 and cleaning cotton 503. The cleaning box 501 has an opening on its surface and is filled with cleaning liquid. The cleaning cotton 503 is sleeved on the supporting sleeve 502 and rotatably installed in the opening of the cleaning box 501. The supporting sleeve 502 has an extension shaft 502a. The inner wall of the cleaning box 501 has a groove 501a that can accommodate the extension shaft 502a. A ratchet mechanism 504 is arranged between the extension shaft 502a and the inner wall of the groove 501a for controlling the unidirectional rotation of the cleaning cotton 503.

[0069] By setting the above structure, when the probe 302 is in the initial position, it is located in the cleaning box 501, which is used to protect the detection end of the probe 302. With the forward and reverse rotation of the locking motor 204, the probe 302 returns to the cleaning box 501 again and contacts the cleaning cotton 503 to wipe the dirt on the surface, thereby improving the detection accuracy. The cleaning cotton 503 can rotate in the cleaning box 501 under the abutment of the probe 302, but the ratchet mechanism 504 constrains the rotation direction of the cleaning cotton 503 to be unidirectional, so that when the probe 302 leaves the cleaning box 501, the cleaning cotton 503 does not rotate, reducing the dirt adhering to the surface of the cleaning cotton 503 and rotating back, and the probe 302 has a retraction action under the action of the first spring 302c to prevent the probe 302 from being stuck in the cleaning box 501.

[0070] It should be noted that the surface of the cleaning cotton 503 has a brush for contacting the probe 302 to achieve cleaning of the surface of the probe 302, and the abutment position when the probe 302 contacts the cleaning cotton 503 is located above the axis of the support sleeve 502, which is convenient for increasing the contact with the cleaning cotton 503 while pushing the support sleeve 502 to rotate.

[0071] Importantly, it should be noted that the construction and arrangement of the present application shown in a plurality of different exemplary embodiments are only exemplary. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and proportion of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, directional changes, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in the application. For example, the element shown as integrally formed can be composed of multiple parts or elements, the position of the element can be inverted or otherwise changed, and the nature or number or position of the discrete element can be changed or changed. Therefore, all such modifications are intended to be included in the scope of the present invention. The order or sequence of any process or method steps can be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure of performing the function described herein, and is not only structurally equivalent but also equivalent structure. Without departing from the scope of the present invention, other replacements, modifications, changes and omissions can be made in the design, operating conditions and arrangement of the exemplary embodiments. Therefore, the invention is not limited to a specific embodiment, but extends to numerous modifications still falling within the scope of the appended claims.

[0072] Additionally, in order to provide a concise description of exemplary embodiments, all features of an actual embodiment (ie, those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention) may not be described.

[0073] It will be appreciated that in the development of any actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will be a routine task of design, fabrication, and production for those of ordinary skill having the benefit of this disclosure without undue experimentation.

[0074] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A chip detection device, characterized in that: include, A base (100) comprises a substrate (101) and a moving platform (102), wherein the moving platform (102) has a mounting portion (102a); A positioning unit (200) comprising a positioning plate (201) and a positioning tube (202); the positioning plate (201) is connected to an external air source and has an air hole (201a), and is rotatably mounted on the mounting portion (102a) via a locking motor (204); the positioning tube (202) is fixedly mounted on the positioning plate (201) and is connected to the interior of the positioning plate (201); and a wafer is adsorbed and mounted on the positioning plate (201) via the positioning tube (202); A detection unit (300) comprises a mobile module (301), a probe (302) and an optical microscope (303), wherein the probe (302) and the optical microscope (303) are integrated and mounted on the mobile module (301) and are used to perform electrical and functional tests on chips on a wafer; The transmission unit (400) comprises a vertical shaft (401) and a first gear (402) and a second gear (403) coaxially arranged on the vertical shaft (401); the outer edge surface of the positioning plate (201) has a tooth groove (201b) meshingly connected with the first gear (402); and the driving end of the moving module (301) is provided with a third gear (301e) meshingly connected with the second gear (403); The movable module (301) comprises a support plate (301a), a guide rod (301b), a threaded rod (301c) and a movable seat (301d); both ends of the guide rod (301b) are fixed to the support plate (301a); the support plate (301a) is mounted on the base plate (101); the threaded rod (301c) is located below the guide rod (301b) and is rotatably connected to the support plate (301a); and the movable seat (301d) is mounted on the guide rod (301b) and the threaded rod (301c); Wherein, the third gear (301e) is fixedly mounted on the threaded rod (301c); The positioning tube (202) comprises a tube body (202a), a piston (202b), a hollow column (202c) and a suction cup (202d); the piston (202b) is sealed and connected inside the tube body (202a) and has a through hole (202b-1); the hollow column (202c) is slidably mounted inside the tube body (202a) and one end of the hollow column (202c) located outside the tube body (202a) is fixed to the suction cup (202d); and the other end of the hollow column (202c) is fixed to the piston (202b); A water channel (201d) is provided in the positioning plate (201), and the water channel (201d) has a water inlet (201d-1) and a water outlet (201d-2), and both the water inlet (201d-1) and the water outlet (201d-2) are used to connect to a water source; A cleaning unit (500) is fixedly mounted on the support plate (301a) on one side, the cleaning unit (500) comprising a cleaning box (501), a support sleeve (502) and cleaning cotton (503); the cleaning box (501) has an opening on its surface and is filled with cleaning liquid; the cleaning cotton (503) is sleeved on the support sleeve (502) and rotatably mounted in the opening of the cleaning box (501); the support sleeve (502) has an extension shaft (502a); the inner wall of the cleaning box (501) has a groove (501a) capable of accommodating the extension shaft (502a); a ratchet mechanism (504) is arranged between the extension shaft (502a) and the inner wall of the groove (501a) for controlling the unidirectional rotation of the cleaning cotton (503).

2. The chip detection device according to claim 1, characterized in that: The probe (302) comprises a detection body (302a) and a casing (302b); the detection body (302a) is slidably mounted in the casing (302b) via an elastic member.

3. The chip detection device according to claim 2, characterized in that: The movable seat (301d) comprises a seat body (301d-1), a sliding frame (301d-2) is slidably mounted on the seat body (301d-1), the probe (302) and the optical microscope (303) are mounted on the sliding frame (301d-2), a driving member is fixedly mounted on the seat body (301d-1), and an output end of the driving member is fixedly connected to the sliding frame (301d-2).

4. The chip detection device according to claim 3, characterized in that: The surface of the positioning disk (201) is provided with positioning pins (201c), and the positioning pins (201c) are distributed at equal distances along the circumference of the positioning disk (201).

5. The chip detection device according to claim 4, characterized in that: An elastic member is movably mounted on the hollow column (202c), and two ends of the elastic member are respectively fixed to the piston (202b) and the inner top wall of the tube body (202a).

6. The chip detection device according to claim 5, characterized in that: A digital infrared temperature sensor (304), a lens (305) and a laser system (306) are also fixedly mounted on the sliding frame (301d-2); the lens (305) is located below the digital infrared temperature sensor (304); and the extension direction of the laser system (306) is perpendicular to the sensing direction of the digital infrared temperature sensor (304).

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