A chip inductor

Abstract

The invention provides a chip inductor, belonging to the technical field of inductors. It mainly aims at the problem that the electrode sheet of the traditional inductor is difficult to replace, and proposes the following technical scheme, including a magnet and a winding, the winding is sleeved on a ceramic frame, the magnet is arranged in the ceramic frame, a packaging component is arranged on the outer side of the ceramic frame, the packaging component includes a first protective shell and a second protective shell, the first protective shell and the second protective shell are arranged on both sides of the ceramic frame respectively, both ends of the ceramic frame are provided with assembly components for fixing the electrode sheet, the assembly component includes a mounting kit, one end of the packaging component is provided with the mounting kit, and the outer side of the packaging component is also provided with a heat dissipation component; through the setting of the assembly component, the mounting kit with the built-in electrode sheet can be removed to replace the electrode sheet, thereby avoiding the waste of resources caused by the abandonment of the entire inductor due to problems with the electrode sheet, improving the maintainability of the inductor, and reducing the use cost.

Description

Technical Field

[0001] The present invention belongs to the technical field of inductors, and more specifically, particularly relates to a chip inductor. Background Art

[0002] The miniaturization and integration of electronic equipment is one of the important trends in the development of the electronics industry. Chip inductors have gradually become commonly used inductive components in electronic circuits due to their small size, light weight, and easy installation.

[0003] For example, the Chinese utility model patent with patent number 201821830692.2 provides a chip inductor, which is provided with a magnetic core, a coil, a guide pin and a packaging seat. When in use, a coil is wound on the magnetic core, two sets of guide pins are installed at both ends of the magnetic core, and a packaging seat is wrapped around the magnetic core to improve the adaptability to high temperature, high humidity, severe cold, salt spray and other environments; however, the electrode sheets of traditional chip inductors are usually fixedly installed. When the electrode sheets are oxidized or damaged, it is difficult to replace or repair them, which often leads to the scrapping of the entire inductor and increases the cost of use. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a chip inductor to solve the technical problem in the prior art that the electrode sheets of traditional chip inductors are usually fixedly installed. When the electrode sheets are oxidized or damaged, they are difficult to replace or repair, which often leads to the scrapping of the entire inductor and increases the cost of use.

[0005] The purpose and effect of a chip inductor of the present invention are achieved by the following specific technical means:

[0006] A chip inductor comprises a magnet and a winding, wherein the winding is sleeved on a ceramic skeleton, the magnet is arranged inside the ceramic skeleton, a packaging component is arranged on the outside of the ceramic skeleton, the packaging component comprises a first protective shell and a second protective shell, the first protective shell and the second protective shell are arranged on both sides of the ceramic skeleton respectively, assembly components for fixing electrode sheets are arranged at both ends of the ceramic skeleton, the assembly component comprises an installation kit, the installation kit is arranged at one end of the packaging component, and a heat dissipation component is also arranged on the outside of the packaging component.

[0007] In a preferred embodiment, two groups of grooves are respectively opened at both ends of the ceramic skeleton, and pins are clamped in the two groups of grooves. Two groups of wire grooves are opened at the bottom of the ceramic skeleton, and two groups of connecting wires are respectively passed through the two groups of wire grooves. One end of the two groups of connecting wires is respectively connected to the two groups of pins, and the other end is connected to the winding. One end of the two groups of pins is respectively connected to the two groups of electrode sheets.

[0008] In a preferred embodiment, an assembly groove is provided on one side of the installation kit, the electrode sheet is arranged in the assembly groove, a plurality of groups of reinforcing ribs are provided on the inner wall of the assembly groove, one side of the plurality of groups of reinforcing ribs are in contact with the electrode sheet, a through groove is provided at the bottom of the assembly groove, and the bottom of the electrode sheet passes through the through groove.

[0009] In a preferred embodiment, two groups of mounting blocks are arranged on the top of the mounting kit, a mounting cavity is opened on one side of the two groups of mounting blocks, fixing columns are arranged in the two groups of mounting cavities, through holes are opened at the bottom of the two groups of mounting cavities, two groups of fixing holes are opened on the top of the first protective shell and the second protective shell respectively, and the bottom ends of the two groups of fixing columns pass through the two groups of through holes and are penetrated into the two groups of fixing holes respectively.

[0010] In a preferred embodiment, positioning plates are provided on the two groups of fixed columns, and two groups of springs are respectively sleeved on the two groups of fixed columns. The bottom ends of the two groups of springs are respectively connected to the two groups of positioning plates, and the top ends are respectively in contact with the tops of the two groups of installation cavities. Through holes are opened on the tops of the two groups of installation cavities, and the tops of the two groups of fixed columns are respectively connected to the same group of pull rods through the two groups of through holes. The pull rods are provided with protrusions for easy operation, and a closing plate is provided on one side of the installation kit corresponding to the two groups of installation cavities.

[0011] In a preferred embodiment, the packaging component also includes a moisture-proof layer, the ceramic skeleton and the outer side of the winding are wrapped with the moisture-proof layer, the moisture-proof layer is located between the first protective shell and the second protective shell, a shielding layer is arranged on the outer side of the moisture-proof layer, the moisture-proof layer is made of epoxy resin, through holes are opened at both ends of the moisture-proof layer and the two groups of pins pass through the two groups of through holes respectively.

[0012] In a preferred embodiment, three groups of first connecting buckles are arranged on the top of the second protective shell, three groups of sliding grooves are correspondingly opened on the top of the first protective shell, the three groups of first connecting buckles are respectively inserted into the three groups of sliding grooves, a clamping frame is arranged on the top of the three groups of sliding grooves, and one ends of the three groups of first connecting buckles are respectively detachably clamped in the three groups of clamping frames; three groups of second connecting buckles are arranged on the bottom of the first protective shell, three groups of clamping grooves are correspondingly opened on the bottom of the second protective shell, and one ends of the three groups of second connecting buckles are respectively detachably clamped in the three groups of clamping grooves.

[0013] In a preferred embodiment, the heat dissipation component includes four groups of copper tubes, four groups of installation grooves are opened on the ceramic skeleton, and four groups of copper tubes are respectively passed through the four groups of installation grooves. Four groups of through holes are correspondingly opened on the packaging component, the first protective shell and the second protective shell, and the first protective shell and the second protective shell are respectively provided with a heat insulation board on the side corresponding to the second protective shell; the four groups of copper tubes respectively pass through the four groups of through holes and contact the two groups of heat insulation boards.

[0014] In a preferred embodiment, the heat dissipation assembly also includes multiple groups of heat sinks, and two groups of heat spreaders are respectively provided on one side of the four groups of copper tubes away from the two groups of heat insulation plates; multiple groups of heat sinks and multiple groups of connecting strips are respectively provided on one side of the two groups of heat spreaders, and the multiple groups of heat sinks are respectively connected in series through the multiple groups of connecting strips, and multiple groups of heat dissipation grooves are formed between the multiple groups of heat sinks.

[0015] In a preferred embodiment, the heat dissipation component also includes two groups of cooling fans, and two groups of heat spreaders are respectively provided on one side of the four groups of copper tubes away from the two groups of heat insulation boards; two groups of cooling fans are respectively provided on one side of the two groups of heat spreaders, and four groups of through holes are respectively opened on the two groups of heat spreaders, and four groups of mounting parts are respectively provided on the surrounding sides of the two groups of cooling fans, and the four groups of mounting parts are respectively penetrated into the four groups of through holes, and four groups of cooling units are respectively provided on the surrounding sides of the two groups of cooling fans, and the four groups of cooling units include multiple groups of cooling fins, and multiple groups of cooling fins are respectively provided on the surrounding sides of the two groups of cooling fans, and the eight groups of cooling units are connected by multiple groups of connecting strips, and multiple groups of ventilation channels are formed between the multiple groups of cooling fins.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. Through the setting of the assembly components, when there is a problem with the electrode sheet of the inductor, the electrode sheet can be replaced without replacing the entire inductor; by pulling the pull rod with the protrusion, the two sets of fixing columns are disengaged from the two sets of fixing holes, and the installation kit can be removed to replace the electrode sheet, avoiding the waste of resources caused by the abandonment of the entire inductor due to the problem of the electrode sheet, improving the maintainability of the inductor and reducing the cost of use; and during installation, only the installation kit needs to be put back in place, and the two sets of fixing columns will be automatically locked in the two sets of fixing holes under the action of the two sets of springs, which improves the convenience of maintenance and reduces the time and labor cost of maintenance.

[0018] 2. Through the setting of the packaging component, when the inductor is used, it is packaged through the moisture-proof layer and the shielding layer, which effectively protects the internal ceramic frame, winding and other components; the moisture-proof layer is made of epoxy resin, which can reliably isolate the internal structure from the external environment, prevent moisture from invading, and avoid the performance of the components being affected by moisture; the shielding layer reduces external electromagnetic interference, ensures that the inductor can maintain a stable and reliable working state, and improves the service life and application range of the inductor.

[0019] 3. Through the setting of the heat dissipation component, when the inductor is used, the copper tube is embedded in the ceramic frame and passes through the packaging component, contacts the heat spreader for heat transfer, and then dissipates heat through multiple groups of heat dissipation slots formed by multiple groups of heat sinks on the heat spreader, promoting natural convection heat dissipation, which can quickly and evenly dissipate the heat generated by the inductor, effectively reducing the temperature inside the inductor and reducing the performance degradation caused by high temperature. It can not only ensure that the inductor can work stably at high power density, but also improve its overall reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of a first embodiment of a chip inductor of the present invention;

[0021] Figure 2 is an exploded view of a first embodiment of a chip inductor of the present invention;

[0022] Figure 3 It is a schematic structural diagram of a chip inductor of the present invention after the magnet, winding and ceramic frame are assembled;

[0023] Figure 4 yes Figure 3 Schematic diagram of the structure after splitting;

[0024] Figure 5 It is a schematic structural diagram of an assembled component in a chip inductor of the present invention;

[0025] Figure 6 It is a schematic diagram of the structure of a chip inductor after the assembly components are disassembled in the present invention;

[0026] Figure 7 is a top view of a chip inductor of the present invention;

[0027] Figure 8 yes Figure 7 Sectional view of AA in the middle;

[0028] Fig. 9 It is a schematic structural diagram of a chip inductor after packaging components are assembled in the present invention;

[0029] Fig.10 yes Fig. 9 Schematic diagram of the structure after splitting;

[0030] Fig.11 It is a schematic structural diagram of a chip inductor of the present invention after the second connecting buckle and the clamping groove are separated;

[0031] Fig.12 It is a schematic diagram of the structure of a disassembled heat dissipation component in a chip inductor of the present invention;

[0032] Fig.13 This is a schematic diagram of the structure of a chip inductor embodiment 2 after assembly according to the present invention;

[0033] Fig.14 This is a schematic diagram of the structure of a chip inductor after being disassembled according to Embodiment 2 of the present invention;

[0034] Fig.15 It is a schematic diagram of the structure of the disassembled heat dissipation component in the second embodiment of a chip inductor of the present invention.

[0035] In the figure, the corresponding relationship between the component names and the figure numbers is as follows:

[0036] 101, magnet; 102, winding; 103, ceramic skeleton; 104, electrode sheet; 105, pin; 106, wire slot; 107, connecting wire; 201, installation kit; 202, assembly slot; 203, reinforcing rib; 204, installation block; 205, installation cavity; 206, fixing column; 207, fixing hole; 208, positioning plate; 209, spring; 210, pull rod; 211, bump; 212, closing plate; 301, first protection Shell; 302, second protective shell; 303, moisture-proof layer; 304, shielding layer; 305, first connecting buckle; 306, slide groove; 307, snap-on frame; 308, second connecting buckle; 309, snap-on groove; 401, copper tube; 402, installation groove; 403, heat insulation board; 404, heat sink; 405, heat spreader; 406, connecting strip; 407, heat sink; 408, cooling fan; 409, mounting piece; 410, ventilation channel. DETAILED DESCRIPTION

[0037] The following is a further detailed description of the embodiments of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the technical solutions of the present invention, but cannot be used to limit the scope of protection of the present invention.

[0038] Embodiment 1:

[0039] As attached Figures 1 to 15 As shown:

[0040] The present invention provides a chip inductor, comprising a magnet 101 and a winding 102, wherein the winding 102 is sleeved on a ceramic skeleton 103, and the magnet 101 is arranged inside the ceramic skeleton 103. In order to protect internal components, the inductor is provided with a packaging component on the outside of the ceramic skeleton 103, and the packaging component comprises a first protective shell 301 and a second protective shell 302, and the first protective shell 301 and the second protective shell 302 are respectively covered on both sides of the ceramic skeleton 103. Through the arrangement of the first protective shell 301 and the second protective shell 302, a more solid external protection is provided for the use of the inductor; in addition, assembly components for fixing electrode sheets 104 are installed at both ends of the ceramic skeleton 103, and the assembly components include a mounting kit 201, and the mounting kit 201 is arranged at one end of the packaging component; it is worth mentioning that a heat dissipation component is also arranged on the outside of the packaging component to ensure stable operation of the inductor under high power density.

[0041] Please refer to Figure 3 , Figure 4 and Figure 8 As shown, two groups of grooves are respectively provided at both ends of the ceramic skeleton 103, and pins 105 are respectively provided in these grooves. At the same time, two groups of wire grooves 106 are also provided at the bottom of the ceramic skeleton 103, and two groups of connecting wires 107 are respectively passed through the two groups of wire grooves 106. One end of these connecting wires 107 is respectively connected to the two groups of pins 105, and the other end is connected to the winding 102. In addition, one end of the two groups of pins 105 is also respectively connected to the two groups of electrode sheets 104; the electrical connection between the pins 105 and the electrode sheets 104 and the winding 102 is realized, so that the winding 102 wrapped inside the packaging component can be connected to the external circuit.

[0042] Please refer to Figure 2 , Figure 5 and Figure 6 As shown, an assembly groove 202 is opened on one side of the installation kit 201, and the assembly groove 202 is used to install the electrode sheet 104; it is worth noting that a plurality of groups of reinforcing ribs 203 are provided on the inner wall of the assembly groove 202, and one side of these reinforcing ribs 203 is in contact with the electrode sheet 104. Through the provision of multiple groups of reinforcing ribs 203, the electrode sheet 104 can be more firmly fixed in place, thereby improving stability; in addition, a through groove is also opened at the bottom of the assembly groove 202, so that the bottom of the electrode sheet 104 can pass through the through groove to be exposed to the outside, thereby facilitating subsequent connection.

[0043] Please refer to Figure 5 and Figure 6As shown, two groups of mounting blocks 204 are further provided on the top of the mounting kit 201, and mounting cavities 205 are provided on one side of these mounting blocks 204, and fixing columns 206 are provided inside the mounting cavities 205; through holes are provided at the bottoms of the two groups of mounting cavities 205, and two groups of fixing holes 207 are provided at the tops of the first protective shell 301 and the second protective shell 302 respectively; during assembly, the bottom ends of the two groups of fixing columns 206 are respectively penetrated into the two groups of fixing holes 207 through these through holes to firmly fix the two groups of mounting kits 201 on the first protective shell 301 and the second protective shell 302; the cooperation of the fixing columns 206 and the fixing holes 207 is utilized to realize the reliable connection between the first protective shell 301, the second protective shell 302 and the two groups of mounting kits 201, thereby ensuring the stability of the entire assembly structure.

[0044] Please refer to Figure 6 As shown, the two groups of fixing columns 206 are provided with positioning plates 208, and the two groups of positioning plates 208 are respectively located in the two groups of mounting cavities 205, and the two groups of fixing columns 206 are respectively sleeved with two groups of springs 209, the bottom ends of these springs 209 are connected to the positioning plates 208, and the top ends are in contact with the tops of the two groups of mounting cavities 205; at the same time, the tops of the two groups of mounting cavities 205 are also provided with through holes, so that the tops of the two groups of fixing columns 206 can pass through these through holes and be connected to the same group of pulling rods 210; the upper end of the pulling rod 210 is also provided with a protrusion 211 for easy operation, and the other On the one hand, a closing plate 212 is provided on one side of the installation kit 201 corresponding to the positions of the two groups of installation cavities 205; when the electrode sheet 104 becomes oxidized or damaged and needs to be replaced, the two groups of fixing columns 206 can be disengaged from the fixing holes 207 by simply pulling the pulling rod 210 on the protrusion 211, thereby removing the entire installation kit 201 and quickly replacing the damaged electrode sheet 104, thereby increasing the maintainability of the inductor. This not only avoids the waste of resources caused by the entire inductor being scrapped due to problems with the electrode sheet 104, but also greatly reduces the user's maintenance costs.

[0045] During installation, it is only necessary to put the installation kit 201 back to its original position. After the installation kit 201 is replaced, the two sets of springs 209 will automatically push the two sets of fixing columns 206 to re-engage them in the fixing holes 207, thereby firmly fixing the entire installation kit 201 in place, thereby improving the convenience of maintenance and reducing the time and labor costs required during the maintenance process.

[0046] Please refer to Figure 7 , Fig. 9 and Fig.10As shown, the packaging component also includes a moisture-proof layer 303; specifically, the ceramic skeleton 103 and the outer side of the winding 102 are wrapped by the moisture-proof layer 303, and the moisture-proof layer 303 is located between the first protective shell 301 and the second protective shell 302. The setting of the moisture-proof layer 303 can effectively isolate the internal structure from the external environment to prevent moisture from invading and affecting the performance of the components; and on the outer side of the moisture-proof layer 303, a shielding layer 304 is also provided, and the setting of the shielding layer 304 can reduce electromagnetic interference from the outside, ensure that the inductor can maintain a stable and reliable working state, and greatly improve its service life and application range; it is worth mentioning that the moisture-proof layer 303 is made of epoxy resin, which can reliably isolate the internal structure. At the same time, through holes are opened at both ends of the moisture-proof layer 303 and the shielding layer 304, so that the two groups of pins 105 can pass through and be connected to the external circuit; through this multiple protection structure, a strong guarantee is provided for the long-term stable operation of the inductor.

[0047] Please refer to Fig.10 and Fig.11 As shown, three groups of first connection buckles 305 are arranged on the top of the second protective shell 302, and three groups of slide grooves 306 are correspondingly opened on the top of the first protective shell 301. The three groups of first connection buckles 305 are respectively inserted into the three groups of slide grooves 306, and a clamping frame 307 is also provided on the top of the slide groove 306. One ends of the three groups of first connection buckles 305 can be detachably clamped in the three groups of clamping frames 307; at the same time, three groups of second connection buckles 308 are also arranged on the bottom of the first protective shell 301, and three groups of clamping grooves 309 are correspondingly opened on the bottom of the second protective shell 302, and one ends of the three groups of second connection buckles 308 can also be detachably clamped in the three groups of clamping grooves 309; the first protective shell 301 can be reliably connected to the second protective shell 302, and installation and disassembly can be realized, which further improves the maintainability of the inductor.

[0048] Please refer to Figure 2 and Fig.12As shown, the heat dissipation component includes four groups of copper tubes 401, and four groups of mounting grooves 402 are opened on the ceramic frame 103. These copper tubes 401 are respectively inserted into the four groups of mounting grooves 402 opened on the ceramic frame 103; at the same time, the surfaces of the packaging component, the first protective shell 301 and the second protective shell 302 are also correspondingly opened with four groups of through holes, and on the side corresponding to the first protective shell 301 and the second protective shell 302, heat insulation boards 403 are also respectively arranged; these four groups of copper tubes 401 pass through these through holes and contact with the two groups of heat insulation boards 403 to form a good heat conduction channel; through the arrangement of the four groups of copper tubes 401, the heat generated inside the inductor can be effectively absorbed and conducted; and through the arrangement of the two groups of heat insulation boards 403, the invasion of external heat and the heat of the four groups of copper tubes 401 extending out can be blocked, thereby maintaining the temperature stability of the inductor to the maximum extent.

[0049] Please refer to Fig.12 As shown, in addition to the aforementioned four groups of copper tubes 401 and two groups of heat insulation plates 403, this heat dissipation component is also equipped with multiple groups of heat sinks 404, which further enhances the heat dissipation performance; specifically, two groups of heat spreaders 405 are respectively provided on one side of the four groups of copper tubes 401 away from the two groups of heat insulation plates 403, and multiple groups of heat sinks 404 and multiple groups of connecting strips 406 are respectively provided on one side of the two groups of heat spreaders 405, and these heat sinks 404 are connected in series with each other through the connecting strips 406 to form multiple groups of heat dissipation grooves 407; through these heat dissipation grooves 407, heat can be quickly and evenly dissipated from the heat spreaders 405 to the outside, which promotes natural convection heat dissipation and greatly reduces the temperature inside the inductor; this not only ensures that the inductor can work stably even at high power density, but also significantly improves its overall reliability, ensuring that the inductor can operate stably for a long time in various harsh environments.

[0050] Please refer to Fig.13 , Fig.14 and Fig.15 As shown, the heat dissipation component also includes two groups of heat dissipation fans 408, and two groups of heat spreaders 405 are respectively arranged on one side of the four groups of copper tubes 401 away from the two groups of heat insulation plates 403; two groups of heat dissipation fans 408 are respectively arranged on one side of the two groups of heat spreaders 405, and four groups of through holes are respectively opened on the two groups of heat spreaders 405, and four groups of mounting parts 409 are respectively arranged on the surrounding sides of the two groups of heat dissipation fans 408, and the four groups of mounting parts 409 are respectively penetrated in the four groups of through holes, and four groups of heat dissipation units are respectively arranged on the surrounding sides of the two groups of heat dissipation fans 408, and the four groups of heat dissipation units include multiple groups of heat dissipation fins 404, and multiple groups of heat dissipation fins 404 are respectively arranged on the surrounding sides of the two groups of heat dissipation fans 408, and the eight groups of heat dissipation units are respectively connected by multiple groups of connecting strips 406, and multiple groups of ventilation channels 410 are formed between the multiple groups of heat dissipation fins 404.

[0051] Embodiment 2:

[0052] Based on the chip inductor provided in the first embodiment of the present application, the second embodiment of the present application proposes a chip inductor. The second embodiment is only a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment. The second embodiment of the present invention will be further described below.

[0053] Please refer to Fig.13 , Fig.14 and Fig.15 As shown, the heat dissipation assembly also includes two groups of heat dissipation fans 408. Specifically, two groups of heat spreaders 405 are respectively arranged on one side of the four groups of copper tubes 401 away from the two groups of heat insulation boards 403. The two groups of heat spreaders 405 are respectively arranged on one side of the two groups of heat spreaders 405. At the same time, four groups of through holes are opened on the heat spreaders 405. Four groups of mounting parts 409 are respectively arranged on the surrounding sides of the two groups of heat dissipation fans 408. These mounting parts 409 are respectively penetrated in the four groups of through holes, so as to realize the stable installation of the two groups of heat dissipation fans 408. In addition, the surrounding sides of the two groups of heat dissipation fans 408 are also respectively arranged There are four groups of heat dissipation units, each group of heat dissipation units includes multiple groups of heat sinks 404, and multiple groups of heat sinks 404 are respectively arranged on the sides of two groups of heat dissipation fans 408. The eight groups of heat dissipation units are connected by multiple groups of connecting strips 406, and multiple groups of ventilation channels 410 are formed between the multiple groups of heat sinks 404. Driven by the two groups of heat dissipation fans 408, heat can be quickly dissipated through these ventilation channels 410 by forced convection, which greatly improves the overall heat dissipation efficiency. This not only ensures that the inductor maintains stable operation under high power density, but also greatly improves its service life and reliability.

[0054] Compared with the first embodiment, multiple groups of heat sinks 404 are connected in series by multiple groups of connecting strips 406, so that multiple groups of heat sinks 407 are formed between the multiple groups of heat sinks 404, so as to naturally dissipate heat through the multiple groups of heat sinks 407, so that heat can be quickly and evenly dissipated from the heat spreader 405 to the outside; in the second embodiment, a heat dissipation fan 408 is installed on the heat spreader 405, and it is installed and fixed by two groups of mounting parts 409, and four groups of heat dissipation units are correspondingly arranged on the side of the heat dissipation fan 408, and the four groups of heat dissipation units are connected by multiple groups of connecting strips 406. The heat dissipation unit includes multiple groups of heat sinks 404, and multiple A plurality of ventilation channels 410 are formed between the heat sinks 404, and one end of the plurality of ventilation channels 410 leads to the cooling fan 408. The main difference is that by starting the cooling fan 408, the heat can be quickly dissipated through the ventilation channels 410 by forced convection. This forced convection cooling method can greatly improve the speed and efficiency of heat dissipation, and can more effectively reduce the operating temperature of the inductor compared to natural heat dissipation. Therefore, the stability and reliability of the inductor under high-load working conditions are significantly improved, and its service life is extended. The remaining conditions are consistent with those in Example 1, so they will not be repeated in this example.

[0055] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A chip inductor, comprising a magnet (101) and a winding (102), characterized in that: The winding (102) is sleeved on a ceramic frame (103), the magnet (101) is arranged inside the ceramic frame (103), a packaging component is arranged outside the ceramic frame (103), the packaging component comprises a first protective shell (301) and a second protective shell (302), the first protective shell (301) and the second protective shell (302) are arranged on both sides of the ceramic frame (103), assembly components for fixing the electrode sheet (104) are arranged at both ends of the ceramic frame (103), the assembly components comprise a mounting kit (201), the mounting kit (201) is arranged at one end of the packaging component, and a heat dissipation component is also arranged on the outside of the packaging component; Two groups of grooves are respectively formed at both ends of the ceramic skeleton (103), and pins (105) are respectively inserted into the two groups of grooves; two groups of wire grooves (106) are formed at the bottom of the ceramic skeleton (103), and two groups of connecting wires (107) are respectively inserted into the two groups of wire grooves (106); one end of the two groups of connecting wires (107) is respectively connected to the two groups of pins (105), and the other end is connected to the winding (102); one end of the two groups of pins (105) is respectively connected to the two groups of electrode sheets (104); A mounting groove (202) is provided on one side of the installation kit (201), the electrode sheet (104) is arranged in the mounting groove (202), a plurality of groups of reinforcing ribs (203) are provided on the inner wall of the mounting groove (202), one side of the plurality of groups of reinforcing ribs (203) are in contact with the electrode sheet (104), a through groove is provided at the bottom of the mounting groove (202), and the bottom of the electrode sheet (104) passes through the through groove; Two groups of mounting blocks (204) are arranged on the top of the mounting kit (201), and mounting cavities (205) are provided on one side of the two groups of mounting blocks (204), and fixing columns (206) are arranged in the two groups of mounting cavities (205), and through holes are provided at the bottom of the two groups of mounting cavities (205), and two groups of fixing holes (207) are respectively provided on the top of the first protective shell (301) and the second protective shell (302), and the bottom ends of the two groups of fixing columns (206) pass through the two groups of through holes and are arranged in the two groups of fixing holes (207); The two groups of fixed columns (206) are each provided with a positioning plate (208), and the two groups of fixed columns (206) are also respectively sleeved with two groups of springs (209), the bottom ends of the two groups of springs (209) are respectively connected to the two groups of positioning plates (208), and the top ends are respectively in contact with the tops of the two groups of installation cavities (205), and the tops of the two groups of installation cavities (205) are each provided with through holes, and the tops of the two groups of fixed columns (206) are respectively connected to the same group of pull rods (210) through the two groups of through holes, and the pull rods (210) are respectively provided with protrusions (211) for easy operation, and a closing plate (212) is provided on one side of the installation kit (201) corresponding to the two groups of installation cavities (205).

2. The chip inductor according to claim 1, characterized in that: The packaging component also includes a moisture-proof layer (303), the ceramic skeleton (103) and the outer side of the winding (102) are wrapped with the moisture-proof layer (303), the moisture-proof layer (303) is located between the first protective shell (301) and the second protective shell (302), a shielding layer (304) is arranged on the outer side of the moisture-proof layer (303), the moisture-proof layer (303) is made of epoxy resin, through holes are opened at both ends of the moisture-proof layer (303) and the shielding layer (304), and the two groups of pins (105) pass through the two groups of through holes respectively.

3. The chip inductor according to claim 2, characterized in that: Three groups of first connection buckles (305) are arranged on the top of the second protective shell (302), and three groups of slide grooves (306) are correspondingly opened on the top of the first protective shell (301). The three groups of first connection buckles (305) are respectively inserted into the three groups of slide grooves (306). A clamping frame (307) is arranged on the top of the three groups of slide grooves (306), and one end of the three groups of first connection buckles (305) is respectively detachably clamped in the three groups of clamping frames (307); three groups of second connection buckles (308) are arranged on the bottom of the first protective shell (301), and three groups of clamping grooves (309) are correspondingly opened on the bottom of the second protective shell (302), and one end of the three groups of second connection buckles (308) is respectively detachably clamped in the three groups of clamping grooves (309).

4. The chip inductor according to claim 1, characterized in that: The heat dissipation component comprises four groups of copper tubes (401), the ceramic frame (103) is provided with four groups of installation slots (402), the four groups of copper tubes (401) are respectively passed through the four groups of installation slots (402), the packaging component, the first protective shell (301) and the second protective shell (302) are respectively provided with four groups of through holes, and the first protective shell (301) and the second protective shell (302) are respectively provided with a heat insulation board (403) on one side corresponding to the other side; the four groups of copper tubes (401) respectively pass through the four groups of through holes and contact the two groups of heat insulation boards (403).

5. The chip inductor according to claim 4, characterized in that: The heat dissipation assembly also includes a plurality of groups of heat sinks (404); two groups of heat spreaders (405) are respectively arranged on one side of the four groups of copper tubes (401) away from the two groups of heat insulation plates (403); a plurality of groups of heat sinks (404) and a plurality of groups of connecting strips (406) are respectively arranged on one side of the two groups of heat spreaders (405); the plurality of groups of heat sinks (404) are respectively connected in series via the plurality of groups of connecting strips (406); and a plurality of groups of heat dissipation grooves (407) are formed between the plurality of groups of heat sinks (404).

6. The chip inductor according to claim 4, characterized in that: The heat dissipation assembly also includes two groups of heat dissipation fans (408). Two groups of heat spreaders (405) are respectively arranged on one side of the four groups of copper tubes (401) away from the two groups of heat insulation plates (403). Two groups of heat dissipation fans (408) are respectively arranged on one side of the two groups of heat spreaders (405). Four groups of through holes are respectively opened on the two groups of heat spreaders (405). Four groups of mounting parts (409) are respectively arranged on the circumference of the two groups of heat dissipation fans (408). The four groups of mounting parts (409) are respectively penetrated in the four groups of through holes. Four groups of heat dissipation units are respectively arranged on the circumference of the two groups of heat dissipation fans (408). The four groups of heat dissipation units include multiple groups of heat sinks (404). Multiple groups of heat sinks (404) are respectively arranged on the circumference of the two groups of heat dissipation fans (408). The eight groups of heat dissipation units are respectively connected by multiple groups of connecting strips (406). Multiple groups of ventilation channels (410) are formed between the multiple groups of heat sinks (404).

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