Automatic flattening device and process for processing chip inductors

Abstract

The invention discloses an automatic flattening device and process for processing a patch inductor, comprising a processing table, wherein a patch inductor body is arranged above the processing table, a supporting leg is fixedly installed at the bottom of the processing table, and a processing component is arranged above the processing table, wherein the processing component comprises a flattening component arranged above the processing table, and a clamping component is arranged outside the flattening component, the patch inductor body is placed on the top surface of the processing table and clamped by the clamping component, and a telescopic rod is started, which drives a supporting plate to move downward, so that a gear and a rack are meshed, and at this time a motor is started, and a reciprocating screw fixedly installed at an output end thereof rotates accordingly, and since a sleeve block is sleeved with the reciprocating screw rod, and another sleeve block is slidably arranged with an outer wall of a limiting rod, under the restriction thereof, the rotating reciprocating screw rod can drive the sleeve block to reciprocate, and the sleeve block drives a pressing roller connected to a rotating outer wall thereof to move reciprocally accordingly, so as to flatten the patch inductor body.

Description

Technical Field

[0001] The invention relates to the technical field of chip inductor flattening, and in particular to an automatic flattening device and process for chip inductor processing. Background Art

[0002] Chip inductors are a commonly used inductor component. They are wound by wire and have the characteristics of miniaturization, high quality, high energy storage and low resistance. Chip inductors are mainly used in circuits for filtering, energy storage, anti-interference, DC blocking, AC, resonance and frequency selection. During the processing of chip inductors, an automatic flattening device is used to ensure that the chip part of the inductor is flat before welding, which is crucial to improving welding quality and production efficiency.

[0003] As disclosed in Chinese patent CN220963026U, a flattening device for processing chip inductors is required to be checked as a whole before using the flattening device for processing chip inductors to ensure that it can work normally. First, the chip inductor to be processed is placed inside the placement cavity and fits with the guide plate. According to the size of the chip inductor to be processed, the knob is turned, and the knob drives the double-headed screw to rotate. The rotation of the double-headed screw makes the adjustment sleeves on both sides approach or move away. The adjustment sleeve drives the bottom flattening plate to adjust the position, so that the flattening plates on both sides correspond to the chip feet of the chip inductor to be processed. Then, the servo motors on both sides are started, and the servo motors drive the threaded rod to rotate. As the slider slides inside the fixed plate, The threaded sleeve and the connecting rod only slide in the horizontal position, and the threaded sleeve drives the connecting rod and the auxiliary pressing plate to move, so that the auxiliary pressing plates on both sides are convenient for pressing the two sides of the chip inductor closely. The inclined surface on the auxiliary pressing plate squeezes the patch feet, so that the patch feet shrink inward, which is convenient for the subsequent flattening operation, and then the cylinder is started, and the cylinder drives the mounting plate and the pressing plate to press down, so that the pressing plate can flatten the patch feet. After the flattening operation is completed, the electric push rods on both sides are started to shrink, and the guide plate flips downward due to its own gravity, so that the chip inductor on the guide plate slides into the collection box for collection, which reduces the trouble of manual material retrieval, is more convenient to use, reduces the tediousness of manual flattening, and improves the efficiency of chip inductor flattening. At the same time, it is suitable for use with chip inductors of different sizes and is practical.

[0004] For this structure, although the chip inductor can be flattened by a pressing plate, when the size of the chip inductor is large, it is necessary to adjust the position of the pressing plate and flatten it in sections, which leads to uneven overall flatness. Therefore, we propose an automatic flattening device and process for chip inductor processing that can evenly flatten the chip inductor to make it uniformly flat. Summary of the invention

[0005] The purpose of the present invention is to provide an automatic flattening device and process for processing chip inductors to solve the problems raised in the above background technology.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: an automatic flattening device for chip inductor processing, comprising a processing table, a chip inductor body is arranged above the processing table, support legs are fixedly installed on the bottom of the processing table, and a processing component is arranged above the processing table, the processing component includes a flattening component arranged above the processing table, a clamping component is arranged on the outside of the flattening component, and a cleaning component is arranged above the clamping component.

[0007] According to the above technical scheme, the flattening assembly includes a telescopic rod fixedly installed on the top surface of the processing table, the end of the telescopic rod is fixedly installed with a support plate, the outer wall of the support plate is fixedly installed with a motor, the output end of the motor is fixedly installed with a reciprocating screw, the outer wall of the reciprocating screw is sleeved with a sleeve block, the outer wall of the sleeve block is rotatably connected with a pressure roller, the outer wall of the pressure roller is sleeved with a gear, a limiting rod is provided at one end of the pressure roller away from the reciprocating screw, the gear is meshed with a rack, an L-shaped bracket is fixedly installed on the top surface of the support plate, the end of the L-shaped bracket is hingedly connected with a connecting plate, the end of the connecting plate away from the L-shaped bracket is rotatably connected with an auxiliary roller, the end of the auxiliary roller is fixedly installed with a sliding column, and a limited position frame is slidably provided on the outer wall of the sliding column.

[0008] According to the above technical solution, the clamping assembly includes a fixed plate fixedly installed on the outer wall of the supporting plate, a sliding rod is fixedly installed on the side wall of the fixed plate, a folding frame is slidably provided on the outer wall of the sliding rod, a limiting frame is slidably provided on the outer wall of the folding frame, a push rod is slidably provided inside the folding frame, a clamping plate is fixedly installed on the end of the push rod, a first magnetic ring is fixedly installed on the outer wall of the clamping plate, and a second magnetic ring is fixedly installed on the outer wall of the folding frame.

[0009] According to the above technical solution, the cleaning assembly includes a vertical pole fixedly installed on the top surface of the sleeve block, the outer wall of the vertical pole is sleeved with a spring, the outer wall of the vertical pole is slidably provided with a sleeve plate, the outer wall of the sleeve plate is fixedly installed with a brush plate, and the bottom of the brush plate is fixedly installed with bristles.

[0010] According to the above technical solution, the rack is fixedly installed on the top surface of the processing table. There are two racks, which are symmetrically distributed about the center line of the pressure roller. Under the restriction of the rack, the moving gear can drive the pressure roller to rotate.

[0011] According to the above technical solution, the limit frame is fixedly installed on the top surface of the processing table, and the sliding column fixedly installed on the end of the auxiliary roller is slidably arranged inside the limit frame. Under the restriction of the limit frame, the auxiliary roller can slide smoothly when the connecting plate pulls the auxiliary roller through the sliding column.

[0012] According to the above technical solution, the connecting plate is hingedly connected to the auxiliary roller through a sliding column at one end away from the L-shaped bracket. There are four connecting plates, which are divided into two groups and are symmetrically distributed with respect to the center line of the top surface of the processing table. When pushed by the connecting plate, the auxiliary roller can be pushed, and the two auxiliary rollers move in opposite directions to perform preliminary leveling work on the chip inductor body.

[0013] According to the above technical solution, the folding frame is arranged at an angle, and the splint is made of rubber material. When the sliding rod moves downward and squeezes the inside of the folding frame, the two folding frames can move toward each other under the restriction of the restriction frame fixedly installed on the top surface of the processing table, so that the folding frame pushes the splint through the push rod, so that the splint contacts and fits with the outer wall of the chip inductor body. Under the restriction of the splint made of rubber material, the outer wall of the chip inductor body can be prevented from being scratched.

[0014] According to the above technical solution, one end of the spring is fixedly installed on the top surface of the sleeve block, and the end of the spring away from the sleeve block is fixedly installed on the bottom of the sleeve plate. Under the elastic action of the spring, the sleeve plate can be pulled, so that the sleeve plate drives the bristles fixedly installed on the bottom of the brush plate to move downward, so that the bristles are always in contact with the outer wall of the pressure roller, and the rotating pressure roller can perform cleaning work under the restriction of the bristles.

[0015] An automatic flattening process for chip inductor processing, comprising the following:

[0016] S1. When processing the chip inductor body, take 10-20 samples of the product after spraying and place them in 15% hydrochloric acid. After 4-8 minutes, observe whether the product generates bubbles. If there are bubbles, the product can be sprayed for 0.5-2h longer, and then tested again with hydrochloric acid to see if it is qualified. This operation can improve the product yield, avoid poor tin creep, and reduce the waste of spraying materials that leads to thick paint film. Add ≤500mL product + 1000mL aluminum ball + pure water + 5m cutting fluid to the rolling tank for rolling, pure water cleaning + alcohol soaking for 30s + oven drying (8min / 100℃). This operation improves the product yield, avoids rust, improves the production efficiency, and reduces the drying time. At this time, the chip inductor body can be flattened, and the chip inductor body can be placed on the top of the processing table, clamped by the clamping component, and started. The telescopic rod is moved, which drives the support plate to move downward, so that the gear and the rack are meshed. At this time, the motor is started, and the reciprocating screw fixedly installed at its output end rotates accordingly. Since the sleeve block is sleeved with the reciprocating screw rod, and the other sleeve block is slidably arranged with the outer wall of the limit rod, the rotating reciprocating screw rod can drive the sleeve block to reciprocate, and the sleeve block drives the outer wall thereof to rotate, and the connected pressure roller moves back and forth accordingly to flatten the chip inductor body. When the gear sleeved on the outer wall of the pressure roller is meshed with the rack, the moving pressure roller drives the gear to move, and under the restriction of the rack, the gear drives the pressure roller to rotate. The rotating and moving pressure roller can better flatten the chip inductor body, and can fully cover and flatten the chip inductor body without producing a flattening dead angle. When the chip inductor body is greatly bent, the telescopic rod can be started to adjust the distance between the pressure roller and the chip inductor body for gradual flattening.

[0017] S2. When the support plate moves downward, the L-shaped bracket fixed on its top surface moves downward accordingly. Since the connecting plate is hingedly connected to the L-shaped bracket and the sliding column fixed on the end of the auxiliary roller, the downward-moving L-shaped bracket pushes the auxiliary roller through the connecting plate, and the sliding column slides smoothly under the restriction of the limit frame. The auxiliary roller can first level the chip inductor body to assist in flattening the pressing roller.

[0018] S3. When it is necessary to flatten the chip inductor body, place the chip inductor body on the top surface of the processing table and on the inner sides of the two clamping plates, start the telescopic rod, which drives the supporting plate to move downward, and the supporting plate drives the fixed plate downward accordingly. The outer wall of the sliding rod fixedly installed on the side wall of the fixed plate is squeezed against the inner wall of the folding frame. Since the folding frame is inclined, the sliding rod squeezes the folding frame, causing the two folding frames to move towards each other, and the folding frame slides on the inner side of the limiting frame, and the folding frame drives the push rod slidingly arranged inside it to move toward the direction of the chip inductor body. Then the supporting plate moves downward, so that the clamping plate contacts the chip inductor body, and the folding frame continues to move towards each other. The second magnetic ring fixedly installed on the outer wall of the folding frame slides on the outer wall of the push rod and slides toward the first magnetic ring. Since the second magnetic ring and the first magnetic ring repel each other magnetically, pressure can be applied to the clamping plate, so that the clamping plate stably clamps the chip inductor body. The chip inductor body only needs to be placed between the clamping plates, and the flattening component can be started to flatten the chip inductor body.

[0019] S4. When it is necessary to flatten the chip inductor body, the outer wall of the pressure roller needs to be cleaned to avoid pressing dust on the surface of the chip inductor body. Start the telescopic rod to drive the pressure roller to move downward, start the motor to move the gear and the pressure roller, and the pressure roller begins to rotate. The pressure roller and the bristles are in contact and friction. Under the restriction of the bristles, the dust attached to the outer wall of the pressure roller can be cleaned. Under the pull of the spring, the bristles and the pressure roller are tightly attached. When the outer wall of the pressure roller is cleaned, the dust on the top surface of the processing table is blown away, and the telescopic rod is started to push the pressure roller upward. At this time, the chip inductor body is placed under the pressure roller to flatten the chip inductor body.

[0020] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0021] 1. The automatic flattening device for processing chip inductors of the present invention is composed of a flattening component as one component. When processing the chip inductor body, 10-20 pcs of the product is sampled after spraying and placed in 15% hydrochloric acid. After 4-8 minutes, observe whether the product generates bubbles. If there are bubbles, the spraying time can be increased by 0.5-2h, and then the hydrochloric acid test is performed again to determine whether it is qualified. This operation can improve the product yield, avoid poor tin climbing, and reduce the waste of spraying materials resulting in a thicker paint film. When rolling the chip inductor, ≤500mL of the product + 1000mL of aluminum balls + pure water + 5m of cutting fluid are added to the rolling tank for rolling, and then washed with pure water + soaked in alcohol for 30s + dried in an oven (8min / 100℃). This operation improves the product yield, avoids poor rust, improves the generation efficiency, and reduces the drying time. At this time, the chip inductor body can be flattened. Place the chip inductor body The top surface of the processing table is clamped by the clamping assembly, and the telescopic rod is started, which drives the support plate to move downward, so that the gear and the rack are meshed. At this time, the motor is started, and the reciprocating screw fixedly installed at its output end rotates accordingly. Since the sleeve block is sleeved with the reciprocating screw rod, and the other sleeve block is slidably arranged with the outer wall of the limit rod, the rotating reciprocating screw rod can drive the sleeve block to reciprocate, and the sleeve block drives the outer wall thereof to rotate, and the pressure roller connected to the reciprocating movement moves accordingly to flatten the chip inductor body. When the gear sleeved on the outer wall of the pressure roller is meshed with the rack, the moving pressure roller drives the gear to move, and under the restriction of the rack, the gear drives the pressure roller to rotate. The rotating and moving pressure roller can better flatten the chip inductor body, and can fully cover and flatten the chip inductor body without producing a flattening dead angle. When the chip inductor body is greatly bent, the telescopic rod can be started to adjust the distance between the pressure roller and the chip inductor body for gradual flattening.

[0022] 2. The automatic flattening device for processing chip inductors of the present invention is composed of a flattening assembly as one component. When the support plate moves downward, the L-shaped bracket fixedly installed on the top surface thereof moves downward accordingly. Since the connecting plate is hingedly connected to the L-shaped bracket and the sliding column fixedly installed at the end of the auxiliary roller, the downwardly moving L-shaped bracket pushes the auxiliary roller through the connecting plate, and the sliding column slides smoothly under the restriction of the limit frame. The auxiliary roller can first flatten the chip inductor body to assist the flattening of the pressing roller.

[0023] 3. The automatic flattening device for processing the patch inductor of the present invention is composed of a clamping assembly as one of its components. When the patch inductor body needs to be flattened, the patch inductor body is placed on the top surface of the processing table and on the inner side of the two clamping plates. The telescopic rod is started, which drives the support plate to move downward, and the support plate drives the fixed plate downward accordingly. The outer wall of the sliding rod fixedly installed on the side wall of the fixed plate is squeezed with the inner wall of the folding frame. Since the folding frame is arranged at an angle, the sliding rod squeezes the folding frame, so that the two folding frames move in opposite directions, and the folding frame slides on the inner side of the limiting frame, and the folding frame drives The push rod slidingly arranged inside it moves toward the direction of the chip inductor body, and then the supporting plate moves downward, so that the clamping plate contacts the chip inductor body, and the folding frame continues to move in the opposite direction. The second magnetic ring fixedly installed on the outer wall of the folding frame slides on the outer wall of the push rod and slides toward the first magnetic ring. Since the second magnetic ring and the first magnetic ring magnetically repel each other, pressure can be applied to the clamping plate, so that the clamping plate can stably clamp the chip inductor body. The chip inductor body only needs to be placed between the clamping plates to start the flattening component to flatten the chip inductor body.

[0024] 4. The automatic flattening device for processing the chip inductor of the present invention is composed of a cleaning component as one of its components. When the chip inductor body needs to be flattened, the outer wall of the pressure roller needs to be cleaned to avoid pressing dust onto the surface of the chip inductor body. The telescopic rod is started to drive the pressure roller to move downward, the motor is started to move the gear and the pressure roller, and the pressure roller begins to rotate. The pressure roller and the bristles are in contact and friction. Under the restriction of the bristles, the dust attached to the outer wall of the pressure roller can be cleaned. Under the pull of the spring, the bristles are tightly attached to the pressure roller. When the outer wall of the pressure roller is cleaned, the dust on the top surface of the processing table is blown away, the telescopic rod is started to push the pressure roller upward, and the chip inductor body is placed under the pressure roller at this time, and the chip inductor body can be flattened. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0026] Figure 1 It is a three-dimensional front structural schematic diagram of an automatic flattening device and process for processing chip inductors of the present invention;

[0027] Figure 2 It is a schematic diagram of a three-dimensional flattening component, a clamping component and a cleaning component of an automatic flattening device and process for processing chip inductors of the present invention;

[0028] Figure 3 A schematic diagram of a flattening component of an automatic flattening device and process for processing a chip inductor according to the present invention;

[0029] Figure 4 It is a first partial schematic diagram of a flattening component of an automatic flattening device and process for processing a chip inductor according to the present invention;

[0030] Figure 5 It is a second partial schematic diagram of a flattening component of an automatic flattening device and process for processing a chip inductor according to the present invention;

[0031] Figure 6 A schematic diagram of a clamping assembly of an automatic flattening device and process for processing a chip inductor according to the present invention;

[0032] Figure 7 It is an exploded schematic diagram of a clamping assembly of an automatic flattening device and process for processing a chip inductor according to the present invention;

[0033] Figure 8 A schematic diagram of a cleaning component of an automatic flattening device and process for processing a chip inductor according to the present invention;

[0034] Fig. 9 It is an exploded schematic diagram of a cleaning component of an automatic flattening device and process for processing a chip inductor according to the present invention;

[0035] In the figure: 1, processing table; 2, chip inductor body; 3, supporting leg; 4, processing assembly; 41, flattening assembly; 43, clamping assembly; 44, cleaning assembly; 411, telescopic rod; 412, supporting plate; 413, motor; 414, reciprocating screw rod; 415, sleeve block; 416, pressure roller; 417, gear; 418, limit rod; 419, rack; 420, L-shaped bracket; 421, connecting plate; 422, auxiliary roller; 423, sliding column; 424, limit frame; 431, fixing plate; 432, sliding rod; 433, folding frame; 434, limiting frame; 435, push rod; 436, clamping plate; 437, first magnetic ring; 438, second magnetic ring; 441, vertical rod; 442, spring; 443, sleeve plate; 444, brush plate; 445, bristles. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] Example 1

[0038] A preferred embodiment of the automatic flattening device for chip inductor processing provided by the present invention is as follows: Figures 1 to 9 As shown: an automatic flattening device for processing chip inductors, comprising a processing table 1;

[0039] A chip inductor body 2 is arranged above the processing table 1;

[0040] A support leg 3 is fixedly mounted at the bottom of the processing table 1;

[0041] and a processing assembly 4 arranged above the processing table 1, the processing assembly 4 includes a flattening assembly 41 arranged above the processing table 1, the flattening assembly 41 includes a telescopic rod 411 fixedly installed on the top surface of the processing table 1, a support plate 412 is fixedly installed at the end of the telescopic rod 411, a motor 413 is fixedly installed on the outer wall of the support plate 412, a reciprocating screw rod 414 is fixedly installed on the output end of the motor 413, a sleeve block 415 is sleeved on the outer wall of the reciprocating screw rod 414, and a pressure roller 416 is rotatably connected to the outer wall of the sleeve block 415 A gear 417 is sleeved on the outer wall of the pressure roller 416, a limit rod 418 is set at the end of the pressure roller 416 away from the reciprocating screw rod 414, the gear 417 is meshed with a rack 419, an L-shaped bracket 420 is fixedly installed on the top surface of the support plate 412, and a connecting plate 421 is hingedly connected to the end of the L-shaped bracket 420, and an auxiliary roller 422 is rotatably connected to the end of the connecting plate 421 away from the L-shaped bracket 420, and a sliding column 423 is fixedly installed on the end of the auxiliary roller 422, and a limit frame 424 is slidably set on the outer wall of the sliding column 423.

[0042] In this embodiment, when processing the chip inductor body 2, 10-20pcs of the product is sampled after spraying and placed in 15% hydrochloric acid. After 4-8 minutes, observe whether the product generates bubbles. If there are bubbles, the product can increase the spraying time by 0.5-2h, and then test again with hydrochloric acid to see if it is qualified. This operation can improve the product yield, avoid poor tin creep, and reduce the waste of spraying materials resulting in thick paint film. ≤500mL product + 1000mL aluminum ball + pure water + 5m cutting fluid are added to the rolling tank for rolling, pure water washing + alcohol soaking for 30s + oven drying (8min / 100℃) This operation improves product yield, avoids rust, improves production efficiency, and reduces drying time. At this time, the chip inductor body 2 can be flattened, and the chip inductor body 2 is placed on the top surface of the processing table 1, clamped by the clamping assembly 43, and the telescopic rod 411 is started, which drives the support plate 412 to move downward, so that the gear 417 is engaged with the rack 419. At this time, the motor 413 is started, and the reciprocating screw rod 414 fixedly installed at its output end rotates accordingly. Since the sleeve block 415 is sleeved with the reciprocating screw rod 414, and the other sleeve block 415 is slidably arranged with the outer wall of the limit rod 418, the rotating reciprocating screw rod 4 14 can drive the sleeve block 415 to reciprocate, and the sleeve block 415 drives the outer wall of the sleeve block 415 to rotate and the connected pressing roller 416 to move reciprocally, so as to flatten the chip inductor body 2. When the gear 417 set on the outer wall of the pressing roller 416 is engaged with the rack 419, the moving pressing roller 416 drives the gear 417 to move. Under the restriction of the rack 419, the gear 417 drives the pressing roller 416 to rotate. The rotating and moving pressing roller 416 can better flatten the chip inductor body 2, and can fully cover and flatten the chip inductor body 2 without producing a flattening dead angle. When the chip inductor body 2 is greatly bent, it can Start the telescopic rod 411 and adjust the distance between the pressing roller 416 and the chip inductor body 2 to gradually flatten it. When the support plate 412 moves downward, the L-shaped bracket 420 fixedly installed on its top surface moves downward accordingly. Since the connecting plate 421 is hingedly connected to the L-shaped bracket 420 and the sliding column 423 fixedly installed at the end of the auxiliary roller 422, the downwardly moving L-shaped bracket 420 pushes the auxiliary roller 422 through the connecting plate 421, and the sliding column 423 slides smoothly under the restriction of the limit frame 424. The auxiliary roller 422 can first flatten the chip inductor body 2 to assist in flattening the pressing roller 416.

[0043] Example 2

[0044] A preferred embodiment of the automatic flattening device for chip inductor processing provided by the present invention is as follows: Figures 1 to 9As shown: the clamping assembly 43 includes a fixed plate 431 fixedly installed on the outer wall of the support plate 412, a sliding rod 432 is fixedly installed on the side wall of the fixed plate 431, a folding frame 433 is slidably provided on the outer wall of the sliding rod 432, a limiting frame 434 is slidably provided on the outer wall of the folding frame 433, a push rod 435 is slidably provided inside the folding frame 433, a clamping plate 436 is fixedly installed on the end of the push rod 435, a first magnetic ring 437 is fixedly installed on the outer wall of the clamping plate 436, and a second magnetic ring 438 is fixedly installed on the outer wall of the folding frame 433.

[0045] In this embodiment, when it is necessary to flatten the chip inductor body 2, the chip inductor body 2 is placed on the top surface of the processing table 1 and on the inner side of the two clamping plates 436, and the telescopic rod 411 is started, which drives the support plate 412 to move downward, and the support plate 412 drives the fixed plate 431 to move downward accordingly, and the outer wall of the sliding rod 432 fixedly installed on the side wall of the fixed plate 431 is squeezed with the inner wall of the folding frame 433. Since the folding frame 433 is arranged at an angle, the sliding rod 432 squeezes the folding frame 433, so that the two folding frames 433 move in opposite directions, and the folding frame 433 slides on the inner side of the limiting frame 434, and the folding frame 433 drives the push rod 432 set to slide inside it. 5 moves toward the chip inductor body 2, and the support plate 412 moves downward, so that the clamping plate 436 contacts the chip inductor body 2, and the folding frame 433 continues to move in the opposite direction. The second magnetic ring 438 fixedly installed on the outer wall of the folding frame 433 slides on the outer wall of the push rod 435 and slides toward the first magnetic ring 437. Since the second magnetic ring 438 and the first magnetic ring 437 repel each other magnetically, pressure can be applied to the clamping plate 436, so that the clamping plate 436 can stably clamp the chip inductor body 2. The chip inductor body 2 only needs to be placed between the clamping plates 436 to start the flattening component 41 to flatten the chip inductor body 2.

[0046] Example 3

[0047] A preferred embodiment of the automatic flattening device for chip inductor processing provided by the present invention is as follows: Figures 1 to 9 As shown: the cleaning component 44 includes a vertical rod 441 fixedly mounted on the top surface of the sleeve block 415, a spring 442 is sleeved on the outer wall of the vertical rod 441, a sleeve plate 443 is slidably mounted on the outer wall of the vertical rod 441, a brush plate 444 is fixedly mounted on the outer wall of the sleeve plate 443, and bristles 445 are fixedly mounted on the bottom of the brush plate 444.

[0048] In this embodiment, when it is necessary to flatten the chip inductor body 2, it is necessary to clean the outer wall of the pressure roller 416 to avoid pressing dust onto the surface of the chip inductor body 2. The telescopic rod 411 is started to drive the pressure roller 416 to move downward, the motor 413 is started to move the gear 417 and the pressure roller 416, and the pressure roller 416 begins to rotate. The pressure roller 416 contacts and rubs with the bristles 445. Under the restriction of the bristles 445, the dust attached to the outer wall of the pressure roller 416 can be cleaned. Under the pull of the spring 442, the bristles 445 and the pressure roller 416 are tightly attached. When the outer wall of the pressure roller 416 is cleaned, the dust on the top surface of the processing table 1 is blown away, the telescopic rod 411 is started, and the pressure roller 416 is pushed upward. At this time, the chip inductor body 2 is placed under the pressure roller 416, and the chip inductor body 2 can be flattened.

[0049] The rack 419 is fixedly installed on the top surface of the processing table 1 . There are two racks 419 symmetrically distributed about the center line of the pressure roller 416 . Under the restriction of the rack 419 , the moving gear 417 can drive the pressure roller 416 to rotate.

[0050] Among them, the limit frame 424 is fixedly installed on the top surface of the processing table 1, and the sliding column 423 fixedly installed on the end of the auxiliary roller 422 is slidably set inside the limit frame 424. Under the restriction of the limit frame 424, the auxiliary roller 422 can slide smoothly when the connecting plate 421 pulls the auxiliary roller 422 through the sliding column 423.

[0051] Among them, the connecting plate 421 is hingedly connected to the auxiliary roller 422 at one end away from the L-shaped bracket 420 through the sliding column 423. There are four connecting plates 421, which are divided into two groups and are symmetrically distributed with respect to the center line of the top surface of the processing table 1. Under the push of the connecting plate 421, the auxiliary roller 422 can be pushed, and the two auxiliary rollers 422 move in opposite directions to first perform preliminary leveling work on the chip inductor body 2.

[0052] Among them, the folding frame 433 is set at an angle, and the clamping plate 436 is made of rubber. When the sliding rod 432 moves downward and squeezes the inside of the folding frame 433, the two folding frames 433 can move in opposite directions under the restriction of the restriction frame 434 fixedly installed on the top surface of the processing table 1, so that the folding frame 433 pushes the clamping plate 436 through the push rod 435, so that the clamping plate 436 is in contact with and fits the outer wall of the chip inductor body 2. Under the restriction of the clamping plate 436 made of rubber, the outer wall of the chip inductor body 2 can be avoided from being scratched.

[0053] Among them, one end of the spring 442 is fixedly installed on the top surface of the sleeve block 415, and the end of the spring 442 away from the sleeve block 415 is fixedly installed on the bottom of the sleeve plate 443. Under the elastic action of the spring 442, the sleeve plate 443 can be pulled, so that the sleeve plate 443 drives the bristles 445 fixedly installed on the bottom of the brush plate 444 to move downward, so that the bristles 445 are always in contact with the outer wall of the pressure roller 416, and the rotating pressure roller 416 can perform cleaning work under the restriction of the bristles 445.

[0054] An automatic flattening process for chip inductor processing, comprising the following:

[0055] S1. When processing the chip inductor body 2, take 10-20 samples of the product after spraying and place them in 15% hydrochloric acid. After 4-8 minutes, observe whether the product generates bubbles. If there are bubbles, the spraying time can be increased by 0.5-2h, and then the hydrochloric acid test is performed again to see if it is qualified. This operation can improve the product yield, avoid poor tin creep, and reduce the waste of spraying materials that leads to thick paint film. When rolling the chip inductor, add ≤500mL product + 1000mL aluminum ball + pure water + 5m cutting fluid into the rolling tank for rolling, pure water cleaning + alcohol soaking for 30s + oven drying (8min / 100℃). This operation improves the product yield, avoids rust, improves the production efficiency, and reduces the drying time. At this time, the chip inductor body 2 can be flattened, and the chip inductor body 2 is placed on the top surface of the processing table 1, clamped by the clamping component 43, and the telescopic rod 411 is started, which drives the support plate 412 to move downward, so that the gear 417 and the rack 41 9 meshes, and the motor 413 is started at this time, and the reciprocating screw 414 fixedly installed at its output end rotates accordingly. Since the sleeve block 415 is sleeved with the reciprocating screw 414, and the other sleeve block 415 is slidably arranged with the outer wall of the limit rod 418, the rotating reciprocating screw 414 can drive the sleeve block 415 to reciprocate, and the sleeve block 415 drives the outer wall of the sleeve block 415 to rotate and the connected pressure roller 416 moves back and forth accordingly, flattening the chip inductor body 2. When the gear 41 set on the outer wall of the pressure roller 416 is When the pressing roller 416 is meshed with the rack 419, the moving pressing roller 416 drives the gear 417 to move. Under the restriction of the rack 419, the gear 417 drives the pressing roller 416 to rotate. The rotating and moving pressing roller 416 can flatten the chip inductor body 2 better and can fully cover and flatten the chip inductor body 2 without producing a flattening dead angle. When the chip inductor body 2 is bent, the telescopic rod 411 can be started to adjust the distance between the pressing roller 416 and the chip inductor body 2 to perform gradual flattening.

[0056] S2. When the support plate 412 moves downward, the L-shaped bracket 420 fixedly installed on its top surface moves downward accordingly. Since the connecting plate 421 is hingedly connected to the L-shaped bracket 420 and the sliding column 423 fixedly installed at the end of the auxiliary roller 422, the downwardly moving L-shaped bracket 420 pushes the auxiliary roller 422 through the connecting plate 421, and the sliding column 423 slides smoothly under the restriction of the limit frame 424. The auxiliary roller 422 can first level the chip inductor body 2 to assist in flattening the pressing roller 416.

[0057] S3. When the chip inductor body 2 needs to be flattened, the chip inductor body 2 is placed on the top surface of the processing table 1 and on the inner side of the two clamping plates 436. The telescopic rod 411 is started, which drives the support plate 412 to move downward, and the support plate 412 drives the fixed plate 431 to move downward accordingly. The outer wall of the sliding rod 432 fixedly installed on the side wall of the fixed plate 431 is pressed against the inner wall of the folding frame 433. Since the folding frame 433 is inclined, the sliding rod 432 presses the folding frame 433, so that the two folding frames 433 move in opposite directions, and the folding frame 433 slides on the inner side of the limiting frame 434, and the folding frame 433 drives the push rod 435 set to slide inside it. The folding frame 433 moves toward the chip inductor body 2, and the supporting plate 412 moves downward, so that the clamping plate 436 contacts the chip inductor body 2. The folding frame 433 continues to move in the opposite direction. The second magnetic ring 438 fixedly installed on the outer wall of the folding frame 433 slides on the outer wall of the push rod 435 and slides toward the first magnetic ring 437. Since the second magnetic ring 438 and the first magnetic ring 437 repel each other magnetically, pressure can be applied to the clamping plate 436 to stably clamp the chip inductor body 2. The chip inductor body 2 only needs to be placed between the clamping plates 436 to start the flattening component 41 to flatten the chip inductor body 2.

[0058] S4. When the chip inductor body 2 needs to be flattened, the outer wall of the pressure roller 416 needs to be cleaned to avoid dust being pressed onto the surface of the chip inductor body 2. The telescopic rod 411 is started to drive the pressure roller 416 to move downward, the motor 413 is started to move the gear 417 and the pressure roller 416, the pressure roller 416 starts to rotate, and the pressure roller 416 contacts and rubs with the bristles 445. Under the restriction of the bristles 445, the dust attached to the outer wall of the pressure roller 416 can be cleaned. Under the pull of the spring 442, the bristles 445 and the pressure roller 416 are tightly attached. When the outer wall of the pressure roller 416 is cleaned, the dust on the top surface of the processing table 1 is blown away, the telescopic rod 411 is started, and the pressure roller 416 is pushed upward. At this time, the chip inductor body 2 is placed under the pressure roller 416, and the chip inductor body 2 can be flattened.

[0059] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0060] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An automatic flattening device for processing chip inductors, comprising a processing table (1); A chip inductor body (2) is arranged above the processing table (1); A supporting leg (3) is fixedly mounted on the bottom of the processing table (1); and a processing assembly (4) arranged above the processing table (1), characterized in that: The processing assembly (4) comprises a flattening assembly (41) arranged above the processing table (1), a clamping assembly (43) is arranged outside the flattening assembly (41), and a cleaning assembly (44) is arranged above the clamping assembly (43); The flattening assembly (41) comprises a telescopic rod (411) fixedly mounted on the top surface of the processing table (1); a support plate (412) is fixedly mounted on the end of the telescopic rod (411); a motor (413) is fixedly mounted on the outer wall of the support plate (412); a reciprocating screw rod (414) is fixedly mounted on the output end of the motor (413); a sleeve block (415) is sleeved on the outer wall of the reciprocating screw rod (414); a pressure roller (416) is rotatably connected to the outer wall of the sleeve block (415); a gear (417) is sleeved on the outer wall of the pressure roller (416); 416) is provided with a limit rod (418) at one end away from the reciprocating screw rod (414), the gear (417) is meshed with a rack (419), an L-shaped bracket (420) is fixedly installed on the top surface of the support plate (412), the end of the L-shaped bracket (420) is hingedly connected to a connecting plate (421), the connecting plate (421) is rotatably connected to an auxiliary roller (422) at one end away from the L-shaped bracket (420), a sliding column (423) is fixedly installed at the end of the auxiliary roller (422), and a limit frame (424) is slidably provided on the outer wall of the sliding column (423); The clamping assembly (43) comprises a fixing plate (431) fixedly mounted on the outer wall of the supporting plate (412); a sliding rod (432) is fixedly mounted on the side wall of the fixing plate (431); a folding frame (433) is slidably mounted on the outer wall of the sliding rod (432); a limiting frame (434) is slidably mounted on the outer wall of the folding frame (433); a push rod (435) is slidably mounted inside the folding frame (433); a clamping plate (436) is fixedly mounted on the end of the push rod (435); a first magnetic ring (437) is fixedly mounted on the outer wall of the clamping plate (436); and a second magnetic ring (438) is fixedly mounted on the outer wall of the folding frame (433); The cleaning assembly (44) comprises a vertical rod (441) fixedly mounted on the top surface of the sleeve block (415); a spring (442) is sleeved on the outer wall of the vertical rod (441); a sleeve plate (443) is slidably mounted on the outer wall of the vertical rod (441); a brush plate (444) is fixedly mounted on the outer wall of the sleeve plate (443); and bristles (445) are fixedly mounted on the bottom of the brush plate (444).

2. The automatic flattening device for chip inductor processing according to claim 1, characterized in that: The rack (419) is fixedly mounted on the top surface of the processing table (1), and there are two racks (419) which are symmetrically distributed about the center line of the pressure roller (416).

3. The automatic flattening device for chip inductor processing according to claim 1, characterized in that: The limit frame (424) is fixedly mounted on the top surface of the processing table (1), and the sliding column (423) fixedly mounted on the end of the auxiliary roller (422) is slidably arranged inside the limit frame (424).

4. The automatic flattening device for chip inductor processing according to claim 1, characterized in that: One end of the connecting plate (421) away from the L-shaped bracket (420) is hingedly connected to the auxiliary roller (422) via a sliding column (423). There are four connecting plates (421), which are divided into two groups and are symmetrically distributed about the center line of the top surface of the processing table (1).

5. The automatic flattening device for chip inductor processing according to claim 1, characterized in that: The folding frame (433) is arranged in an inclined manner, and the clamping plate (436) is made of rubber material.

6. The automatic flattening device for chip inductor processing according to claim 1, characterized in that: One end of the spring (442) is fixedly mounted on the top surface of the sleeve block (415), and one end of the spring (442) away from the sleeve block (415) is fixedly mounted on the bottom of the sleeve plate (443).

7. An automatic flattening process for chip inductor processing, characterized in that: Includes the following: S1. When processing the chip inductor body (2), take 10-20 samples of the product after painting and place them in 15% hydrochloric acid. After 4-8 minutes, observe whether the product produces bubbles. If there are bubbles, increase the spraying time by 0.5-2h, and then test again with hydrochloric acid to see if it is qualified. Placing the painted product in hydrochloric acid can improve the product yield, avoid poor tin creep, and reduce the waste of painting materials that lead to thick paint film. When rolling the chip inductor, add ≤500mL of product + 1000mL of aluminum ball + pure water + 5m cutting fluid into the rolling tank and roll. Grinding, pure water cleaning + alcohol soaking 30s + oven drying (8min / 100℃), placing the product in a rolling mill can improve the product yield, avoid rusting, improve the production efficiency, and reduce the drying time. At this time, the chip inductor body (2) is flattened, and the chip inductor body (2) is placed on the top surface of the processing table (1), clamped by the clamping component (43), and the telescopic rod (411) is started, which drives the support plate (412) to move downward, so that the gear (417) and the rack (419) are engaged, and the motor is started at this time. (413), the reciprocating screw (414) fixedly installed at its output end rotates accordingly. Since the sleeve block (415) is sleeved with the reciprocating screw (414), and another sleeve block (415) is slidably arranged with the outer wall of the limit rod (418), under its restriction, the rotating reciprocating screw (414) drives the sleeve block (415) to reciprocate, and the sleeve block (415) drives the outer wall thereof to rotate, and the pressure roller (416) connected thereto moves reciprocally accordingly, flattening the chip inductor body (2). When the gear (417) sleeved on the outer wall of the pressure roller (416) When meshing with the rack (419), the moving pressure roller (416) drives the gear (417) to move, and under the restriction of the rack (419), the gear (417) drives the pressure roller (416) to rotate, and the rotating and moving pressure roller (416) flattens the chip inductor body (2), and the rotating and moving pressure roller (416) fully covers and flattens the chip inductor body (2). When the chip inductor body (2) bends, the telescopic rod (411) is started to adjust the distance between the pressure roller (416) and the chip inductor body (2) to perform gradual flattening; S2. When the support plate (412) moves downward, the L-shaped bracket (420) fixedly installed on the top surface thereof moves downward accordingly. Since the connecting plate (421) is hingedly connected to the L-shaped bracket (420) and the sliding column (423) fixedly installed at the end of the auxiliary roller (422), under the restriction of the connecting plate (421), the L-shaped bracket (420) moving downward pushes the auxiliary roller (422) through the connecting plate (421), and the sliding column (423) slides smoothly under the restriction of the limit frame (424). The auxiliary roller (422) first performs a flattening operation on the chip inductor body (2) to assist the pressing roller (416) in flattening. S3. When the chip inductor body (2) needs to be flattened, the chip inductor body (2) is placed on the top surface of the processing table (1) and on the inner side of the two clamping plates (436). The telescopic rod (411) is started, which drives the support plate (412) to move downward, and the support plate (412) drives the fixed plate (431) to move downward accordingly. The outer wall of the sliding rod (432) fixedly installed on the side wall of the fixed plate (431) is pressed against the inner wall of the folding frame (433). Since the folding frame (433) is arranged at an angle, the sliding rod (432) presses the folding frame (433), so that the two folding frames (433) move in opposite directions. The folding frame (433) slides on the inner side of the limiting frame (434), and the folding frame (433) drives the push rod (435) set inside the folding frame (433) to slide. The support plate (412) moves in the direction of the chip inductor body (2), and the clamping plate (436) contacts the chip inductor body (2). The folding frame (433) continues to move in the opposite direction. The second magnetic ring (438) fixedly mounted on the outer wall of the folding frame (433) slides on the outer wall of the push rod (435) and slides in the direction of the first magnetic ring (437). Due to the magnetic repulsion between the second magnetic ring (438) and the first magnetic ring (437), pressure is applied to the clamping plate (436) under the restriction of the clamping plate (436), so that the clamping plate (436) stably clamps the chip inductor body (2). The chip inductor body (2) only needs to be placed between the clamping plates (436), and the flattening component (41) is activated to flatten the chip inductor body (2). S4. When the chip inductor body (2) needs to be flattened, the outer wall of the pressure roller (416) needs to be cleaned to prevent dust from being pressed onto the surface of the chip inductor body (2). The telescopic rod (411) is started to drive the pressure roller (416) to move downward, and the motor (413) is started to move the gear (417) and the pressure roller (416). The pressure roller (416) starts to rotate, and the pressure roller (416) contacts and rubs against the bristles (445). ) limit, the dust attached to the outer wall of the pressure roller (416) is cleaned, and the bristles (445) are pulled tightly against the pressure roller (416) by the spring (442). When the outer wall of the pressure roller (416) is cleaned, the dust on the top surface of the processing table (1) is blown away, and the telescopic rod (411) is started to push the pressure roller (416) upward. At this time, the chip inductor body (2) is placed under the pressure roller (416) to flatten the chip inductor body (2).

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