A packaging device and method for a high-current field-effect transistor

Abstract

The present invention discloses a packaging device and method for a high-current field-effect transistor, which relates to the technical field of high-current field-effect transistor packaging. It includes a conductive base, and a circuit board is provided on the top of the conductive base. The packaging device and method for a high-current field-effect transistor disclosed by the present invention have the following effects: during the last step of packaging the field-effect transistor, the staff pulls the adjusting frame inside each docking frame, so that the positioning rod on the adjusting frame is separated from the positioning groove, and then each embedding column on the packaging shell is directly pressed into the docking frame. During the pressing process of the embedding column, it cooperates with the card slot to be stuck on each tooth, thereby driving the rotating disk to rotate. When the embedding column is pressed to the lowest position, the staff releases the pulling of the adjusting frame, and the adjusting spring rod resets, then the teeth on the rotating disk penetrate into the inside of the matching card slot, thereby locking the embedding column, completing the docking of the packaging shell and the conductive base, and achieving the effects of high efficiency and convenience.

Description

Technical Field

[0001] The present invention relates to the technical field of high-current field effect transistor packaging, and particularly to a packaging device and method for a high-current field effect transistor. Background Art

[0002] A field effect transistor is a semiconductor device that uses the electric field effect of a control input circuit to control the current of an output circuit, and is named accordingly; during the use of a field effect transistor, it needs to be packaged.

[0003] Existing high-current field effect transistor packaging devices generally connect a conductive base and a packaging shell through bolts. The field effect transistor is installed on a circuit board inside the packaging shell. However, when connecting through bolts, there is an inconvenient disassembly situation. At the same time, when humid air corrodes the bolts, the bolts cannot be disassembled, which will cause inconvenience in subsequent maintenance of the field effect transistor and reduce the use value of the high-current field effect transistor packaging device. Summary of the Invention

[0004] The present invention discloses a packaging device and method for a high-current field effect transistor, aiming to solve the technical problem that existing high-current field effect transistor packaging devices generally connect a conductive base and a packaging shell through bolts, and the field effect transistor is installed on a circuit board inside the packaging shell. However, when connecting through bolts, there is an inconvenient disassembly situation. At the same time, when humid air corrodes the bolts, the bolts cannot be disassembled, which will cause inconvenience in subsequent maintenance of the field effect transistor.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] A packaging device for a high-current field effect transistor includes a conductive base. A circuit board is provided on the top of the conductive base, and high-current field effect transistor bodies are equidistantly arranged on the circuit board. An electrode connection seat is provided in the middle of the circuit board. Two wiring ports are opened at the top of the electrode connection seat. A packaging shell is clamped outside the electrode connection seat. Quick docking components are provided at the four corners of the top of the conductive base. The quick docking component includes a docking frame, and the docking frame is fixedly connected to the top of the conductive base. An embedding column is fixedly connected to the bottom of the packaging shell above the docking frame. Matching card slots are equidistantly opened on the outer side wall of the embedding column. An embedding hole is opened at the top of the docking frame, and the embedding column is inserted into the interior of the embedding hole.

[0007] By providing a quick docking component, during the last step of encapsulating the field effect transistor, the staff pulls the adjusting frame inside each docking frame, causing the positioning rod on the adjusting frame to separate from the positioning slot. Then, each embedding post on the encapsulation housing is directly pressed into the docking frame. During the pressing process of the embedding post, the matching card slots cooperate with the card teeth, thereby driving the rotating disc to rotate. When the embedding post is pressed to the lowest position, the staff releases the pulling force on the adjusting frame, and the adjusting spring rod resets. Then, the card teeth on the rotating disc penetrate deeper into the interior of the matching card slot, thereby locking the embedding post, completing the docking of the encapsulation housing and the conductive base, which is efficient and convenient. When disassembling it, just pull the adjusting frame to quickly remove the embedding post and complete the separation, improving the encapsulation efficiency and encapsulation effect of the field effect transistor.

[0008] In a preferred solution, an air inlet hole is provided on one side of the docking frame facing the electrode connection seat, and an exhaust hole is provided on the side of the docking frame away from the electrode connection seat. Limiting sliding grooves are provided on both inner walls of the docking frame. Limiting sliders are slidably connected inside the two limiting sliding grooves. On the opposite sides of the two limiting sliders, shaft plates are fixedly connected. On the opposite sides of the two shaft plates, connecting shafts are connected through bearings. At the opposite ends of the two connecting shafts, the same rotating disc is fixedly connected. Equally spaced card teeth are fixedly connected to the outer side wall of the rotating disc, and the card teeth are adapted to the matching card slots on the embedding posts.

[0009] In a preferred solution, a rear support rod is fixedly connected to the outside of the docking frame at the position of the exhaust hole, and adjusting spring rods are fixedly connected to the side of the rear support rod facing the two limiting sliders. One end of the adjusting spring rod is fixedly connected to one side of the limiting slider.

[0010] In a preferred solution, connecting rods are fixedly connected to the outer side walls of the two shaft plates facing upward, and at the ends of the two connecting rods away from the rotating disc, the same adjusting frame is fixedly connected. The adjusting frame is located outside the docking frame. A pull ring is fixedly connected to one side of the adjusting frame. Positioning slots are provided on the same side of the docking frame and the rear support rod. A positioning rod is fixedly connected to the side of the adjusting frame facing the positioning slot, and the positioning rod is adapted to the positioning slot.

[0011] In a preferred solution, a heat dissipation component is provided on the outside of the circuit board of the conductive base, and the heat dissipation component includes a transfer ring frame. The transfer ring frame is fixedly connected to the top of the conductive base. A plurality of lifting rods are fixedly connected to the top of the transfer ring frame. The same air collecting ring frame is fixedly connected to the tops of the plurality of lifting rods. Air extraction holes are provided on the inner side wall of the air collecting ring frame facing the circuit board. A pump ring frame is fixedly connected to the top of the air collecting ring frame. An air pump is fixedly connected inside the pump ring frame. The air output end of the air pump is fixedly connected to a trachea, and one end of the trachea is inserted into the interior of the transfer ring frame. The air intake end of the air pump is fixedly connected to an air extraction pipe, and the air extraction pipe is inserted into the interior of the air collecting ring frame.

[0012] By providing a heat dissipation component, during the operation of the field effect transistor, the air pump is regularly started. The air pump evacuates the gas inside the encapsulation housing through each air extraction hole on the air collection ring frame. The gas carries the heat generated during the operation of the field effect transistor, accelerating the gas flow inside the encapsulation housing, improving the heat dissipation effect, preventing the field effect transistor from being damaged due to overheating, and protecting the field effect transistor.

[0013] In a preferred embodiment, a gas guide cover is fixedly connected to one side of the transfer ring frame facing each docking frame air inlet hole. A connection hole is formed on one side of the gas guide cover, and a communication pipe is fixedly connected inside the connection hole. One end of the communication pipe is inserted into the inside of the transfer ring frame. The inner wall of the gas guide cover located above is connected by a hinge with a filter screen. The upper surface of the filter screen is fixedly connected with shock spring rods at equal intervals. One end of each shock spring rod is fixedly connected to the top inner wall of the gas guide cover. The top of the filter screen is fixedly connected with a telescopic sealing band, and the upper surface of the telescopic sealing band is fixedly connected to the top inner wall of the gas guide cover. The filter screen is placed obliquely. An installation block is fixedly connected to the top inner wall of the gas guide cover at the side of the filter screen. An electric telescopic rod is fixedly connected to one side of the installation block facing the filter screen, and the output end of the electric telescopic rod is in contact with the filter screen.

[0014] In a preferred embodiment, a slag discharge hole is formed in the gas guide cover below the filter screen, and a dust collection frame is inserted into the inside of the slag discharge hole. A docking rail is fixedly connected to one side of the gas guide cover facing the dust collection frame. A docking sliding frame is slidably connected inside the docking rail, and the docking sliding frame is fixedly connected to one side of the dust collection frame. Two ends of the top of the docking rail are fixedly connected with abutting blocks. Both ends of the docking rail are connected by hinges with end sealing plates. One side of the end sealing plate is fixedly connected with a compression spring rod, and one end of the compression spring rod is fixedly connected to one side of the abutting block.

[0015] In a preferred embodiment, wire docking assemblies are provided at both wiring ports of the electrode connection seat. The wire docking assembly includes an external fixing ring, which is fixedly connected to the outside of the electrode connection seat at the wiring port. The inner side wall of the external fixing ring is fixedly connected with a compression airbag. The inner side wall of the wiring port is fixedly connected with an installation inner plate, and the top of the installation inner plate is fixedly connected with an inner sleeve. The inner sleeve is located inside the compression airbag. The inner side wall of the inner sleeve is fixedly connected with connecting spring rods at equal intervals. One end of each connecting spring rod is fixedly connected with an axle frame, and both inner side walls of each axle frame are connected by bearings with the same wire roller.

[0016] By providing a wire docking assembly, during the wiring operation, the wire is passed through the inner sleeve. The wire travels to the electrode connection seat under the action of each wire roller. When the wire docking is completed, the micro motor is started, and the micro motor drives the locking rope to rotate. In this way, the open end of the compression airbag above is closed, and the wire is squeezed and sealed by the compression airbag, preventing external dust from entering the inside of the electrode connection seat along the wiring port and causing pollution.

[0017] In a preferred embodiment, air holes are formed in the outer side wall of the extrusion airbag facing upward, and an air inlet and outlet pipe is arranged inside the air holes. A valve is connected to the outside of the air inlet and outlet pipe through a flange. A fixing rod is fixedly connected to the top of the external fixing ring, a locking rope is arranged at the top end of the fixing rod, a side frame is fixedly connected to the top of the external fixing ring far away from the fixing rod, a micro motor is fixedly connected to the side of the side frame facing the locking rope, an output shaft of the micro motor is fixedly connected to a rotating shaft through a coupling, and one end of the rotating shaft is fixedly connected to the outer side wall of the locking rope.

[0018] A packaging method for a high-current field effect transistor uses the packaging device for a high-current field effect transistor as described above, and includes the following steps:

[0019] Step 1: First, install each field effect transistor, circuit board, conductive base, and electrode connection seat. After the installation is completed, start the packaging operation;

[0020] Step 2: The staff pulls the adjusting frame inside each docking frame, so that the positioning rod on the adjusting frame is separated from the positioning slot. Then, directly press each embedding column on the packaging shell into the docking frame. During the pressing process of the embedding column, it is stuck on each tooth through the matching slot, thereby driving the rotating disk to rotate. When the embedding column is pressed to the lowest position, the staff releases the pulling of the adjusting frame, and the adjusting spring rod resets. Then, the teeth on the rotating disk penetrate into the inside of the matching slot, thereby clamping the embedding column to death and completing the docking of the packaging shell and the conductive base.

[0021] As can be seen from the above, the packaging device for a high-current field effect transistor provided by the present invention has the technical effect of being efficient and convenient. During the last step of packaging the field effect transistor, the staff pulls the adjusting frame inside each docking frame, so that the positioning rod on the adjusting frame is separated from the positioning slot. Then, directly press each embedding column on the packaging shell into the docking frame. During the pressing process of the embedding column, it is stuck on each tooth through the matching slot, thereby driving the rotating disk to rotate. When the embedding column is pressed to the lowest position, the staff releases the pulling of the adjusting frame, and the adjusting spring rod resets. Then, the teeth on the rotating disk penetrate into the inside of the matching slot, thereby clamping the embedding column to death and completing the docking of the packaging shell and the conductive base. Description of the Drawings

[0022] Figure 1 It is a schematic diagram of the overall structure of the packaging device for a high-current field effect transistor proposed by the present invention.

[0023] Figure 2 It is a schematic diagram of the split structure of the packaging shell and the conductive base of the packaging device for a high-current field effect transistor proposed by the present invention.

[0024] Figure 3Schematic diagram of the quick docking component structure of a packaging device for a high-current field effect transistor proposed by the present invention.

[0025] Figure 4 Cross-sectional view of the docking frame structure of a packaging device for a high-current field effect transistor proposed by the present invention.

[0026] Figure 5 Schematic diagram of the internal structure of the docking frame of a packaging device for a high-current field effect transistor proposed by the present invention.

[0027] Figure 6 Schematic diagram of the heat dissipation component structure of a packaging device for a high-current field effect transistor proposed by the present invention.

[0028] Figure 7 Schematic diagram of the air guide cover structure of a packaging device for a high-current field effect transistor proposed by the present invention.

[0029] Figure 8 Schematic diagram of the internal structure of the air guide cover of a packaging device for a high-current field effect transistor proposed by the present invention.

[0030] Figure 9 Schematic diagram of the wire docking component structure of a packaging device for a high-current field effect transistor proposed by the present invention.

[0031] Figure 10 For Figure 9 Overall structural cross-sectional view.

[0032] In the figure: 1, conductive base; 2, quick docking component; 201, docking frame; 202, air inlet hole; 203, limit sliding groove; 204, rotating disk; 205, limit slider; 206, adjusting spring rod; 207, shaft plate; 208, connecting shaft; 209, tooth; 210, connecting rod; 211, positioning rod; 212, pull ring; 213, adjusting frame; 214, positioning groove; 215, rear support rod; 216, exhaust hole; 3, encapsulation housing; 4, wire docking component; 401, extrusion airbag; 402, locking rope; 403, fixed rod; 404, installation inner plate; 405, external fixing ring; 406, side frame; 407, micro motor; 408, rotating shaft; 409, air inlet and outlet pipe; 410, air valve; 411, inner sleeve; 412, shaft frame; 413, wire roller; 414, connecting spring rod; 5, electrode connection seat; 6, heat dissipation component; 601, transfer ring frame; 602, air guide cover; 603, air extraction hole; 604, air collection ring frame; 605, lifting rod; 606, air duct; 607, air pump; 608, pump ring frame; 609, air extraction pipe; 610, dust collection frame; 611, docking sliding frame; 612, oscillating spring rod; 613, connecting pipe; 614, installation block; 615, telescopic sealing band; 616, docking rail; 617, end sealing plate; 618, extrusion spring rod; 619, abutting block; 620, filter screen; 621, electric telescopic rod; 7, field effect transistor body; 8, circuit board; 9, embedding column; 10, mating card slot. Detailed implementation manners

[0033] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0034] A packaging device and method for a high-current field effect transistor disclosed by the present invention are mainly applied to the existing high-current field effect transistor packaging devices, which generally connect the conductive base and the packaging housing through bolts. The field effect transistor is installed on the circuit board inside the packaging housing. However, when connecting through bolts, there is a situation where disassembly is inconvenient. At the same time, when the bolts are corroded by humid air, the bolts cannot be disassembled, which will lead to inconvenient maintenance of the field effect transistor in the subsequent process.

[0035] Refer to Figures 1 - 10, A packaging device for a high-current field-effect transistor, comprising a conductive base 1. A circuit board 8 is provided on the top of the conductive base 1, and field-effect transistor bodies 7 are equidistantly arranged on the circuit board 8. An electrode connection seat 5 is provided at the middle part of the circuit board 8. Two wiring ports are opened at the top of the electrode connection seat 5. A packaging shell 3 is clamped outside the electrode connection seat 5. Quick docking components 2 are provided at the four corners of the top of the conductive base 1. The quick docking component 2 includes a docking frame 201, and the docking frame 201 is fixedly connected to the top of the conductive base 1. An embedding column 9 is fixedly connected to the bottom of the packaging shell 3 above the docking frame 201. Matching card slots 10 are equidistantly opened on the outer side wall of the embedding column 9. An embedding hole is opened at the top of the docking frame 201, and the embedding column 9 is inserted into the interior of the embedding hole.

[0036] In a specific application scenario, during the last step of packaging the field-effect transistor, the staff pulls the adjusting frame 213 inside each docking frame 201, so that the positioning rod 211 on the adjusting frame 213 is separated from the positioning slot 214. Then, each embedding column 9 on the packaging shell 3 is directly pressed into the docking frame 201. During the pressing process of the embedding column 9, the matching card slot 10 is stuck on each tooth 209, thereby driving the rotating disk 204 to rotate. When the embedding column 9 is pressed to the lowest position, the staff releases the pulling of the adjusting frame 213, and the adjusting spring rod 206 resets. Then, the tooth 209 on the rotating disk 204 penetrates into the interior of the matching card slot 10, thereby locking the embedding column 9 and completing the docking of the packaging shell 3 and the conductive base 1, which is efficient and convenient.

[0037] Specifically, during the docking process, the embedding column 9 moves up and down. The adjusting spring rod 206 here plays a role in horizontal limiting, so as to ensure that after the embedding column 9 is inserted into the interior of the docking frame 201, when the tooth 209 on the outer side of the rotating disk 204 penetrates into the interior of the matching card slot 10, the two are in close contact, improving the packaging firmness.

[0038] It should be noted that before pulling the adjusting frame 213, the adjusting spring rod 206 is already in a compressed state.

[0039] Refer to Figures 1 - 5, in a preferred embodiment, an air inlet hole 202 is formed on one side of the docking frame 201 facing the electrode connection base 5, and an exhaust hole 216 is formed on the side of the docking frame 201 away from the electrode connection base 5. Limiting sliding grooves 203 are formed on both inner walls of the docking frame 201. Limiting sliders 205 are slidably connected to the interiors of the two limiting sliding grooves 203. Shaft plates 207 are fixedly connected to the opposite sides of the two limiting sliders 205. Connecting shafts 208 are connected to the opposite sides of the two shaft plates 207 through bearings. The opposite ends of the two connecting shafts 208 are fixedly connected to the same rotating disk 204. Tooth-like projections 209 are fixedly connected to the outer side wall of the rotating disk 204 at equal intervals. The tooth-like projections 209 are adapted to the mating card slots 10 on the embedding column 9. A rear support rod 215 is fixedly connected to the docking frame 201 at the outer side of the exhaust hole 216. Adjusting spring rods 206 are fixedly connected to the sides of the rear support rod 215 facing the two limiting sliders 205. One end of each adjusting spring rod 206 is fixedly connected to one side of the corresponding limiting slider 205. Connecting rods 210 are fixedly connected to the outer side walls of the two shaft plates 207 facing upward. The opposite ends of the two connecting rods 210 away from the rotating disk 204 are fixedly connected to the same adjusting frame 213. The adjusting frame 213 is located outside the docking frame 201. A pull ring 212 is fixedly connected to one side of the adjusting frame 213. Positioning grooves 214 are formed on the same side of the docking frame 201 and the rear support rod 215. A positioning rod 211 is fixedly connected to the side of the adjusting frame 213 facing the positioning groove 214. The positioning rod 211 is adapted to the positioning groove 214.

[0040] Refer to Figure 1 , Figure 2 , Figure 6 , Figure 7 and Figure 8, in a preferred embodiment, a heat dissipation component 6 is provided outside the circuit board 8 on the conductive base 1, and the heat dissipation component 6 includes a transfer ring frame 601. The transfer ring frame 601 is fixedly connected to the top of the conductive base 1. A plurality of lifting rods 605 are fixedly connected to the top of the transfer ring frame 601. The tops of the plurality of lifting rods 605 are fixedly connected to the same air collecting ring frame 604. The inner side wall of the air collecting ring frame 604 facing the circuit board 8 is provided with air extraction holes 603. A pump ring frame 608 is fixedly connected to the top of the air collecting ring frame 604. An air pump 607 is fixedly connected inside the pump ring frame 608. An air delivery pipe 606 is fixedly connected to the air delivery end of the air pump 607. One end of the air delivery pipe 606 is inserted into the inside of the transfer ring frame 601. An air extraction pipe 609 is fixedly connected to the air intake end of the air pump 607. The air extraction pipe 609 is inserted into the inside of the air collecting ring frame 604. A gas guide cover 602 is fixedly connected to one side of the transfer ring frame 601 facing each air intake hole 202 of the docking frame 201. A connection hole is provided on one side of the gas guide cover 602, and a communication pipe 613 is fixedly connected inside the connection hole. One end of the communication pipe 613 is inserted into the inside of the transfer ring frame 601. The inner wall of the gas guide cover 602 located above is connected by a hinge with a filter screen 620. Oscillation spring rods 612 are fixedly connected to the upper surface of the filter screen 620 at equal intervals. One end of the oscillation spring rod 612 is fixedly connected to the inner wall of the top of the gas guide cover 602. A telescopic sealing belt 615 is fixedly connected to the top of the filter screen 620. The upper surface of the telescopic sealing belt 615 is fixedly connected to the inner wall of the top of the gas guide cover 602. The filter screen 620 is placed obliquely. An installation block 614 is fixedly connected to the inner wall of the top of the gas guide cover 602 at the side of the filter screen 620. An electric telescopic rod 621 is fixedly connected to one side of the installation block 614 facing the filter screen 620. The output end of the electric telescopic rod 621 is in contact with the filter screen 620. A slag discharge hole is provided below the filter screen 620 in the gas guide cover 602, and a dust collecting frame 610 is inserted into the inside of the slag discharge hole. A docking rail 616 is fixedly connected to one side of the gas guide cover 602 facing the dust collecting frame 610. A docking sliding frame 611 is slidably connected inside the docking rail 616. The docking sliding frame 611 is fixedly connected to one side of the dust collecting frame 610. Two ends of the top of the docking rail 616 are fixedly connected with abutting blocks 619. Both ends of the docking rail 616 are connected by hinges with end sealing plates 617. A pressing spring rod 618 is fixedly connected to one side of the end sealing plate 617. One end of the pressing spring rod 618 is fixedly connected to one side of the abutting block 619.

[0041] Specifically, during the operation of the field effect transistor, the air pump 607 is periodically started. The air pump 607 evacuates the gas inside the encapsulation housing 3 through the respective air extraction holes 603 on the air collecting ring frame 604. The gas carries the heat generated during the operation of the field effect transistor, accelerating the gas flow inside the encapsulation housing 3, improving the heat dissipation effect, preventing the field effect transistor from being damaged due to overheating, and protecting the field effect transistor.

[0042] It should be noted that the air pump 607 introduces all the collected hot gas into the transfer ring frame 601, and then discharges it into the interior of each docking frame 201 through the air guide cover 602. The hot gas heats the humid gas inside the docking frame 201, thereby achieving the dehumidification effect inside the docking frame 201, avoiding the corrosion of various structures inside the docking frame 201 by the humid air, protecting the docking frame 201 and various structural components inside it, and at the same time realizing the waste utilization of the hot gas.

[0043] In a specific application scenario, during the process of the hot gas passing through the air guide cover 602, the filter screen 620 inside the air guide cover 602 filters it, thereby collecting the dust carried by the hot gas and avoiding the influence of this part of the dust on the structural components inside the docking frame 201. When the filter screen 620 filters the dust, the electric telescopic rod 621 is periodically adjusted to push the filter screen 620, so that the shock spring rod 612 behind the filter screen 620 is compressed. When the electric telescopic rod 621 resets, the shock spring rod 612 drives the filter screen 620 to be in a vibrating state, accelerating the falling of the dust attached to the filter screen 620, preventing the dust from blocking the filter holes of the filter screen 620, and extending the service life of the filter screen 620.

[0044] Refer to Figure 1 、 Figure 2 、 Figure 9 and Figure 10 , in a preferred embodiment, wire docking assemblies 4 are provided at both wiring ports of the electrode connection base 5, and the wire docking assembly 4 includes an external fixing ring 405. The external fixing ring 405 is fixedly connected to the outside of the electrode connection base 5 at the wiring port. The inner side wall of the external fixing ring 405 is fixedly connected with an extrusion airbag 401. The inner side wall of the wiring port is fixedly connected with an installation inner plate 404. The top of the installation inner plate 404 is fixedly connected with an inner sleeve 411. The inner sleeve 411 is located inside the extrusion airbag 401. The inner side wall of the inner sleeve 411 is fixedly connected with connecting spring rods 414 at equal intervals. One end of each connecting spring rod 414 is fixedly connected with an axle bracket 412. The inner side walls on both sides of each axle bracket 412 are connected with the same wire roller 413 through bearings. The outer side wall of the extrusion airbag 401 facing upward is provided with air holes, and an air inlet and outlet pipe 409 is arranged inside the air holes. The outside of the air inlet and outlet pipe 409 is connected with an air valve 410 through a flange. The top of the external fixing ring 405 is fixedly connected with a fixing rod 403. A locking rope 402 is arranged at the top of the fixing rod 403. The top of the external fixing ring 405 far from the fixing rod 403 is fixedly connected with a side bracket 406. A micro motor 407 is fixedly connected to the side of the side bracket 406 facing the locking rope 402. The output shaft of the micro motor 407 is fixedly connected with a rotating shaft 408 through a coupling. One end of the rotating shaft 408 is fixedly connected to the outer side wall of the locking rope 402.

[0045] Specifically, during the wiring operation, the wire is passed through the inner sleeve 411. Under the action of each wire roller 413, the wire travels to the electrode connection base 5. After the wire connection is completed, the micro motor 407 is started. The micro motor 407 drives the locking rope 402 to rotate. In this way, the open end of the extrusion airbag 401 located above is sealed. The wire is extruded, limited and sealed by the extrusion airbag 401 to prevent external dust from entering the electrode connection base 5 through the wiring port and causing pollution.

[0046] A packaging method for a high-current field-effect transistor, using a packaging device for a high-current field-effect transistor as described above, includes the following steps:

[0047] Step 1: First, install each field-effect transistor, circuit board 8, conductive base 1 and electrode connection base 5. After the installation is completed, start the packaging operation;

[0048] Step 2: The staff pulls the adjustment frame 213 inside each docking frame 201, so that the positioning rod 211 on the adjustment frame 213 is separated from the positioning groove 214. Then, each embedding column 9 on the packaging shell 3 is directly pressed into the docking frame 201. During the pressing process of the embedding column 9, it cooperates with the card slot 10 to be stuck on each tooth 209, thereby driving the rotating disk 204 to rotate. When the embedding column 9 is pressed to the lowest position, the staff releases the pulling of the adjustment frame 213, and the adjustment spring rod 206 resets. Then, the tooth 209 on the rotating disk 204 penetrates deeper into the inside of the matching card slot 10, thereby locking the embedding column 9 and completing the docking of the packaging shell 3 and the conductive base 1.

[0049] As described above, only the specific preferred embodiments of the present invention are provided, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent substitutions or changes, and all should be covered by the protection scope of the present invention.

Claims

1. A packaging device for a high-current field-effect transistor, comprising a conductive base (1), characterized in that, The top of the conductive base (1) is provided with a circuit board (8), and field effect transistor bodies (7) are equidistantly arranged on the circuit board (8). An electrode connection seat (5) is arranged at the middle part of the circuit board (8). Two wiring ports are opened at the top of the electrode connection seat (5). A packaging shell (3) is clamped outside the electrode connection seat (5). Quick docking components (2) are arranged at the four corners of the top of the conductive base (1). The quick docking component (2) includes a docking frame (201), and the docking frame (201) is fixedly connected to the top of the conductive base (1). An embedding column (9) is fixedly connected to the bottom of the packaging shell (3) above the docking frame (201). Matching card slots (10) are equidistantly opened on the outer side wall of the embedding column (9). An embedding hole is opened at the top of the docking frame (201), and the embedding column (9) is inserted into the interior of the embedding hole; A heat dissipation component (6) is arranged outside the circuit board (8) of the conductive base (1). The heat dissipation component (6) includes a transfer ring frame (601). The transfer ring frame (601) is fixedly connected to the top of the conductive base (1). A plurality of lifting rods (605) are fixedly connected to the top of the transfer ring frame (601). The same air collecting ring frame (604) is fixedly connected to the tops of the plurality of lifting rods (605). Air extraction holes (603) are opened on the inner side wall of the air collecting ring frame (604) facing the circuit board (8). A pump ring frame (608) is fixedly connected to the top of the air collecting ring frame (604). An air pump (607) is fixedly connected inside the pump ring frame (608). An air delivery pipe (606) is fixedly connected to the air delivery end of the air pump (607). One end of the air delivery pipe (606) is inserted into the interior of the transfer ring frame (601). An air extraction pipe (609) is fixedly connected to the air intake end of the air pump (607). The air extraction pipe (609) is inserted into the interior of the air collecting ring frame (604).

2. The encapsulation device of a high-current field-effect transistor according to claim 1, characterized in that, An air inlet hole (202) is opened on one side of the docking frame (201) facing the electrode connection seat (5), and an exhaust hole (216) is opened on the side of the docking frame (201) away from the electrode connection seat (5). Limit sliding grooves (203) are opened on both inner side walls of the docking frame (201). Limit sliding blocks (205) are slidably connected inside the two limit sliding grooves (203). Shaft plates (207) are fixedly connected to the opposite sides of the two limit sliding blocks (205). Connecting shafts (208) are connected to the opposite sides of the two shaft plates (207) through bearings. The same rotating disk (204) is fixedly connected to the opposite ends of the two connecting shafts (208). Teeth (209) are fixedly connected to the outer side wall of the rotating disk (204) at equal intervals. The teeth (209) are adapted to the matching card slots (10) on the embedding column (9).

3. The encapsulation device of a high-current field effect transistor according to claim 2, wherein, A rear support rod (215) is fixedly connected to the outside of the docking frame (201) at the exhaust hole (216). Adjusting spring rods (206) are fixedly connected to the side of the rear support rod (215) facing the two limit sliding blocks (205). One end of the adjusting spring rod (206) is fixedly connected to one side of the limit sliding block (205).

4. The encapsulation device of a high-current field-effect transistor according to claim 3, characterized in that, On the outer walls facing upward of the two shaft plates (207), connecting rods (210) are fixedly connected, and at the ends of the two connecting rods (210) far from the rotating disk (204), the same adjusting frame (213) is fixedly connected. The adjusting frame (213) is located outside the docking frame (201). A pull ring (212) is fixedly connected to one side of the adjusting frame (213). Positioning grooves (214) are formed on the same side of the docking frame (201) and the rear support rod (215). A positioning rod (211) is fixedly connected to the side of the adjusting frame (213) facing the positioning groove (214), and the positioning rod (211) is adapted to the positioning groove (214).

5. The encapsulation device for a high-current field effect transistor according to claim 4, characterized in that On the side of each air inlet hole (202) of the transfer ring frame (601) facing the docking frame (201), a gas guide cover (602) is fixedly connected. A connection hole is formed on one side of the gas guide cover (602), and a communicating pipe (613) is fixedly connected inside the connection hole. One end of the communicating pipe (613) is inserted into the inside of the transfer ring frame (601). The inner wall of the gas guide cover (602) located above is connected with a filter screen (620) through a hinge. Oscillating spring rods (612) are fixedly connected to the upper surface of the filter screen (620) at equal intervals. One end of the oscillating spring rod (612) is fixedly connected to the top inner wall of the gas guide cover (602). A telescopic sealing belt (615) is fixedly connected to the top of the filter screen (620), and the upper surface of the telescopic sealing belt (615) is fixedly connected to the top inner wall of the gas guide cover (602). The filter screen (620) is placed obliquely. An installation block (614) is fixedly connected to the top inner wall of the gas guide cover (602) at the side of the filter screen (620). An electric telescopic rod (621) is fixedly connected to the side of the installation block (614) facing the filter screen (620), and the output end of the electric telescopic rod (621) is in contact with the filter screen (620).

6. The encapsulation device of a high-current field effect transistor according to claim 5, characterized in that A slag discharge hole is formed in the gas guide cover (602) below the filter screen (620), and a dust collection frame (610) is inserted into the inside of the slag discharge hole. A docking rail (616) is fixedly connected to the side of the gas guide cover (602) facing the dust collection frame (610). A docking slide (611) is slidably connected inside the docking rail (616), and the docking slide (611) is fixedly connected to one side of the dust collection frame (610). Blocks (619) are fixedly connected to both ends of the top of the docking rail (616). End sealing plates (617) are connected to both ends of the docking rail (616) through hinges. A pressing spring rod (618) is fixedly connected to one side of the end sealing plate (617), and one end of the pressing spring rod (618) is fixedly connected to one side of the block (619).

7. The encapsulation device of a high-current field effect transistor according to claim 6, characterized in that, The electrode connection base (5) is provided with wire docking components (4) at both wire connection ports. The wire docking component (4) includes an external fixing ring (405), and the external fixing ring (405) is fixedly connected to the outside of the electrode connection base (5) at the wire connection port. An extrusion airbag (401) is fixedly connected to the inner side wall of the external fixing ring (405). An installation inner plate (404) is fixedly connected to the inner side wall of the wire connection port. An inner sleeve (411) is fixedly connected to the top of the installation inner plate (404). The inner sleeve (411) is located inside the extrusion airbag (401). Connecting spring rods (414) are fixedly connected to the inner side wall of the inner sleeve (411) at equal intervals. One end of each connecting spring rod (414) is fixedly connected to a shaft frame (412). A wire roller (413) is connected to the inner side walls on both sides of each shaft frame (412) through bearings.

8. The encapsulation device of a high-current field-effect transistor according to claim 7, characterized in that, The outer side wall of the extrusion airbag (401) facing upward is provided with air holes, and an air inlet and outlet pipe (409) is arranged inside the air holes. A gas valve (410) is connected to the outside of the air inlet and outlet pipe (409) through a flange. A fixing rod (403) is fixedly connected to the top of the external fixing ring (405). A locking rope (402) is arranged at the top end of the fixing rod (403). A side frame (406) is fixedly connected to the top of the external fixing ring (405) away from the fixing rod (403). A micro motor (407) is fixedly connected to the side of the side frame (406) facing the locking rope (402). The output shaft of the micro motor (407) is fixedly connected to a rotating shaft (408) through a coupling. One end of the rotating shaft (408) is fixedly connected to the outer side wall of the locking rope (402).

9. A packaging method for a high-current field-effect transistor, using a packaging device for a high-current field-effect transistor as described in claim 8, characterized in that, It includes the following steps: Step 1: First, install between each field effect transistor, circuit board (8), conductive base (1) and electrode connection base (5). After the installation is completed, start the encapsulation operation. Step 2: The staff pulls the adjusting frame (213) inside each docking frame (201) so that the positioning rod (211) on the adjusting frame (213) is separated from the positioning groove (214). Then, each embedding column (9) on the encapsulation shell (3) is directly pressed into the docking frame (201). During the pressing process of the embedding column (9), it cooperates with the card slots (10) to be stuck on each tooth (209), thereby driving the rotating disk (204) to rotate. When the embedding column (9) is pressed to the lowest position, the staff releases the pulling of the adjusting frame (213), and the adjusting spring rod (206) resets. Then, the teeth (209) on the rotating disk (204) penetrate deeper into the inside of the matching card slot (10), thereby locking the embedding column (9) and completing the docking of the encapsulation shell (3) and the conductive base (1).

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