Heating and ventilation equipment

Abstract

The application discloses a heating and ventilation device, which comprises a device main body and an electric control box, wherein the device main body comprises a cabinet and a partition plate arranged in the cabinet, the partition plate separates the cabinet into a fan cavity and a compressor cavity, the electric control box is arranged on the partition plate, and a fan is arranged in the fan cavity; the electric control box comprises a shell and a circuit board assembly, the shell has a containing cavity, and the circuit board assembly is arranged in the containing cavity; the circuit board assembly comprises a circuit board body and electronic components, at least part of the electronic components is arranged on one side of the circuit board body which faces the fan cavity, so that the heat of the electronic components is conducted to the fan cavity through the shell. The application aims to improve the heat dissipation effect of the electric control box.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heating and ventilation equipment, and particularly relates to a kind of heating and ventilation equipment. BACKGROUND

[0002] The circuit board assembly is installed in the electric control box of the heating and ventilation equipment such as air conditioner, and electronic components are integrated on the circuit board assembly. When the heating and ventilation equipment is working, a large amount of heat will be generated by the electronic components, for example, the heat generated by the electronic components such as filter and reactor will cause the temperature of the electronic components to rise, affecting the working stability of the electronic components, so timely heat dissipation is needed to prevent the temperature from being too high to cause the circuit board assembly line to age.

[0003] Therefore, it is urgent to improve the heat dissipation performance of the electric control box. SUMMARY

[0004] The main purpose of the present application is to provide a kind of heating and ventilation equipment, to improve the heat dissipation effect of the electric control box.

[0005] To achieve the above-mentioned purpose, the present application provides a kind of heating and ventilation equipment, comprising: equipment main body and electric control box, the equipment main body includes cabinet and the partition plate arranged in the cabinet, the partition plate divides the cabinet into fan cavity and compressor cavity, the electric control box is arranged on the partition plate, and the fan cavity is provided with a fan;

[0006] The electric control box comprises a shell and a circuit board assembly, the shell has a receiving cavity therein, and the circuit board assembly is arranged in the receiving cavity. The circuit board assembly comprises a circuit board body and electronic components, and at least part of the electronic components are arranged on the side of the circuit board body facing the fan cavity, so that the heat generated by the electronic components is conducted to the side of the shell facing the fan cavity, and then conducted to the fan cavity. The air cooling heat dissipation can be realized in the fan cavity, or the heat dissipation can be realized by other heat conducting medium in the fan cavity, so as to improve the heat dissipation efficiency of the electric control box and improve the heat dissipation effect of the electronic components on the circuit board assembly.

[0007] The present application provides a kind of heating and ventilation equipment, by arranging the circuit board assembly in the receiving cavity, and arranging at least part of the electronic components on the side of the circuit board body facing the fan cavity, which is conducive to the heat generated by the electronic components being directly conducted to the side of the shell facing the fan cavity, and then conducted to the fan cavity. The air cooling heat dissipation can be realized in the fan cavity, or the heat dissipation can be realized by other heat conducting medium in the fan cavity, so as to improve the heat dissipation efficiency of the electric control box and improve the heat dissipation effect of the electronic components on the circuit board assembly.

[0008] Optionally, the shell is configured to realize heat conduction with the electronic components.

[0009] Optionally, the outer surface of the side of the shell facing the fan cavity forms a plurality of heat dissipation air channels for air flow.

[0010] Optionally, the shell comprises a box body and a cover, the box body is arranged on the partition plate, and a side of the box body facing the compressor cavity is provided with an opening, the cover is arranged at the opening to jointly form the containing cavity with the box body, and a side wall of the box body facing the fan cavity is a heat-conducting wall.

[0011] Optionally, a first heat dissipation fin is arranged on a side of the heat-conducting wall facing the fan cavity, and a plurality of the first heat dissipation fins are arranged in sequence and at intervals, and the heat dissipation air duct is formed between adjacent two first heat dissipation fins.

[0012] Optionally, a shape of an end of the electronic component away from the circuit board body is matched with a shape of an inner wall surface of the heat-conducting wall.

[0013] Optionally, at least part of the electronic component abuts against the heat-conducting wall, or,

[0014] A heat-conducting pad is further arranged in the shell, and the heat-conducting pad abuts between the inner wall surface of the heat-conducting wall and at least part of the electronic component.

[0015] Optionally, the heat-conducting pad is attached to the inner wall surface of the heat-conducting wall.

[0016] Optionally, an extension direction of the heat dissipation air duct is consistent with a direction in which air in the fan cavity flows through an outer surface of the shell.

[0017] Optionally, an included angle between a plate surface direction of the circuit board body and a plate surface direction of the partition plate is 0°-30°.

[0018] Optionally, the electronic components are all arranged on a side of the circuit board body facing the fan cavity, or the heat-generating components in the electronic components are all arranged on a side of the circuit board body facing the fan cavity.

[0019] Optionally, a plurality of second heat dissipation fins are arranged on a side of the cover facing the compressor cavity, and the second heat dissipation fins are arranged in sequence and at intervals.

[0020] The heating and ventilation device provided by the application can realize heat conduction between at least part of the electronic components and the shell, heat generated by the electronic components can be quickly transferred to the shell, the heat transferred to the shell can be taken away by flowing air, so that the working temperature of the circuit board assembly can be reduced, and the possibility of overheat damage of the circuit board assembly can be reduced.

[0021] The heating and ventilation device provided by the application can shorten the heat transfer path, improve the heat dissipation efficiency, and reduce the noise caused by air flow by allowing the heat of the electronic components to be conducted to the fan cavity through the shell. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0023] Figure 1 A schematic diagram of the installation structure of the electrical control box of the HVAC equipment provided in the embodiments of this application;

[0024] Figure 2 A three-dimensional structural diagram of the electrical control box and partition of the HVAC equipment provided in the embodiments of this application;

[0025] Figure 3 Another three-dimensional structural schematic diagram of the electrical control box of the HVAC equipment provided in the embodiments of this application;

[0026] Figure 4 An exploded view of the electrical control box of the HVAC equipment provided in the embodiments of this application;

[0027] Figure 5 A three-dimensional structural diagram of the electrical control box of the HVAC equipment provided in the embodiments of this application;

[0028] Figure 6 A three-dimensional structural schematic diagram of the circuit board assembly of the electrical control box of the HVAC equipment provided in the embodiments of this application;

[0029] Figure 7 A perspective view of the cross-sectional view of the electrical control box of the HVAC equipment provided in the embodiments of this application;

[0030] Figure 8 A front view of the cross-sectional view of the electrical control box of the HVAC equipment provided in the embodiments of this application;

[0031] Figure 9 Another exploded view of the electrical control box of the HVAC equipment provided in the embodiments of this application.

[0032] Explanation of icon numbers:

[0033] Reference Name Reference Name 100 Housing 110 Receiving cavity 120 Box body 121 First heat dissipation fin 122 Wire passing hole 130 Cover 131 Second heat dissipation fin 140 Heat dissipation air duct 150 Protective sleeve 160 Sealing gasket 200 Circuit board assembly 210 Circuit board body 220 Electronic component 300 Thermal conductive pad 400 Fan 500 Case 510 Fan cavity 520 Compressor cavity 600 Partition plate 700 Compressor assembly Detailed Implementation

[0034] The electrical control boxes used in HVAC equipment typically contain electronic components. These components generate heat when they are working, and this heat accumulates in the control box. Timely heat dissipation is necessary. If heat dissipation is not timely, it can lead to heat stagnation, resulting in localized high temperatures and affecting the lifespan of the electronic components.

[0035] In the related art, in order to meet the heat dissipation requirement, air flow is directly flowed into the surface of the circuit board assembly, and a heat sink is arranged on the circuit board assembly to ventilate and dissipate heat for the circuit board assembly, but this destroys the integrity of the electric control box, reduces the waterproof and moisture-proof property of the electric control box, and is prone to cause dust and impurities to fall into the electric control box, which is not conducive to protecting the circuit board assembly.

[0036] Therefore, the present application provides a heating and ventilation device, by improving, at least part of the electronic components are arranged on the side of the circuit board body facing the fan cavity, the heat generated by the electronic components in the electric control box is transferred to the shell, and the air flow formed in the fan cavity is used for air cooling, or other heat conduction medium in the fan cavity is used for heat dissipation, so as to take away the heat transferred to the shell by the electronic components, and the effect of heat dissipation and cooling for the electronic components is achieved.

[0037] Reference Figure 1 The present application provides a heating and ventilation device, which comprises: a device main body and an electric control box, the device main body comprises a case 500 and a partition plate 600 arranged in the case 500, the partition plate 600 divides the case 500 into a fan cavity 510 and a compressor cavity 520, the electric control box is arranged on the partition plate 600, and the fan 400 is arranged in the fan cavity 510. The fan is used for forming air flow.

[0038] Reference Figure 1 And Figure 4 As shown in the figure, the electric control box comprises a shell 100 and a circuit board assembly 200, the shell 100 has a containing cavity 110, and the circuit board assembly 200 is arranged in the containing cavity 110, wherein the circuit board assembly 200 comprises a circuit board body 210 and electronic components 220, and at least part of the electronic components 220 are arranged on the side of the circuit board body 210 facing the fan cavity 510, so that the heat of the electronic components 220 is conducted to the fan cavity 510 through the shell 100.

[0039] The present application provides a heating and ventilation device, by arranging the circuit board assembly 200 in the containing cavity 110, and arranging at least part of the electronic components 220 on the side of the circuit board body 210 facing the fan cavity 510, the heat generated by the electronic components 220 is directly conducted to the side of the shell 100 facing the fan cavity 510, the air flow formed in the fan cavity 510 is directly used for dissipating heat for the shell 100 through the outer surface of the shell 100, the heat transfer path is shortened, and the heat dissipation efficiency of the electronic components 220 on the circuit board assembly 200 is improved, and the heat dissipation efficiency is improved.

[0040] In a possible implementation, the fan cavity 510 is provided with a fan 400, the fan 400 forms an air flow in the fan cavity 510, the air flow formed in the fan cavity 510 flows through the outer surface of the shell 100 and carries away the heat transferred from the electronic components 220 to the shell 100, thereby dissipating the heat of the electronic components 220, and the air flow formed in the fan cavity 510 directly flows through the outer surface of the shell 100, thereby reducing the noise caused by the air flow.

[0041] In a possible implementation, heat exchange pipes can also be arranged in the fan cavity 510, part of the heat exchange pipes are attached to the side of the shell 100 facing the fan cavity 510, and a heat conducting medium such as refrigerant flows in the heat exchange pipes, and the heat conducting medium is used for heat dissipation to carry away the heat transferred from the electronic components 220 to the shell 100, thereby dissipating the heat of the electronic components 220.

[0042] The warm air supply device provided by the application considers that the compressor assembly 700 arranged in the compressor cavity 520 generates heat during operation, thereby increasing the temperature in the compressor cavity 520, and in order to shorten the heat transfer path, improve the heat dissipation efficiency, and reduce the noise caused by the air flow, the air flow formed in the fan cavity 510 directly flows through the outer surface of the shell 100 to dissipate the heat of the shell 100, without indirectly passing through the compressor cavity 520, so that the temperature of the air flow flowing to the outer surface of the shell 100 is relatively low, which is beneficial to the air flow flowing to the outer surface of the shell 100 to carry away more heat transferred from the electronic components 220 to the shell 100, thereby improving the heat dissipation efficiency and the heat dissipation effect of the electronic components 220.

[0043] In a possible implementation, as shown in Figure 1 、 Figure 3 and Figure 4 , the shell 100 is configured to achieve heat conduction with the electronic components 220, and the outer surface of the side of the shell 100 facing the fan cavity 510 is provided with a plurality of heat dissipation air channels 140 for the air flow to pass through, and the heat dissipation air channels 140 can guide the air flow.

[0044] The heat generated by the electronic components 220 during operation is conducted to the shell 100, and the outer surface of the side of the shell 100 facing the fan cavity 510 is provided with a plurality of heat dissipation air channels 140, and when the air flow formed in the fan cavity 510 passes through the heat dissipation air channels 140, the heat transferred from the electronic components 220 to the shell 100 can be carried away, thereby improving the heat dissipation effect.

[0045] In an embodiment, the shell 100 comprises a box body 120 and a cover 130, the box body 120 is arranged on the partition plate 600, and the side of the box body 120 facing the compressor cavity 520 has an opening, and the cover 130 is arranged at the opening to form the containing cavity 110 together with the box body 120. The shell 100 has good sealing performance, which can prevent impurities, water vapor and the like from entering the containing cavity 110, thereby protecting the circuit board assembly 200.

[0046] In an embodiment, as shown in Figure 9 , the box body 120 and the cover 130 can be connected by screws or bolts, which facilitates installation and disassembly. In order to improve the sealing performance of the electric control box, a sealing gasket 160 can be arranged between the box body 120 and the cover 130 to ensure good sealing performance.

[0047] In an embodiment, as shown in Figure 1 and Figure 2 , the partition plate 600 can be arranged vertically in the cabinet 500, and a mounting hole can be formed in the partition plate 600 to communicate the fan cavity 510 and the compressor cavity 520, and the box body 120 is embedded in the mounting hole. The box body 120 and the partition plate 600 can be fixed by screw connection, bolt connection or welding connection, which improves the stability of the box body 120.

[0048] In an embodiment, as shown in Figure 1 , Figure 4 and Figure 7 , the side wall of the box body 120 facing the fan cavity 510 is a heat-conducting wall, the heat-conducting wall has a first heat dissipation fin 121 arranged on the side facing the fan cavity 510, and a plurality of first heat dissipation fins 121 are arranged in sequence and at intervals, and a heat dissipation air duct 140 is formed between adjacent two first heat dissipation fins 121. The heat generated by the electronic components 220 is transmitted to the heat-conducting wall, and the first heat dissipation fin 121 arranged on the side of the heat-conducting wall facing the fan cavity 510 can increase the heat dissipation area of the heat-conducting wall, which is conducive to the heat generated by the electronic components 220 being carried away by the airflow flowing through the heat dissipation air duct 140, thereby achieving the purpose of efficiently cooling the electronic components 220.

[0049] In an embodiment, the heat-conducting wall can be made of aluminum, copper, an alloy containing aluminum or an alloy containing copper, etc. to achieve high thermal conductivity.

[0050] In an embodiment, as shown in Figure 4 and Figure 5As shown, in order to achieve better heat conduction effect between the shell 100 and the electronic components 220, the box body 120 can be integrally cast, and the box body 120 can be made of a material with good thermal conductivity, for example, aluminum, copper, an alloy containing aluminum, or an alloy containing copper, so that the box body 120 has good thermal conductivity, which is conducive to mutual heat conduction with the electronic components 220.

[0051] In one possible implementation, referring to Figure 9 As shown, the cover 130 can be integrally cast, and the cover 130 is made of a material with good thermal conductivity, for example, aluminum or copper.

[0052] In one possible implementation, referring to Figure 6 、 Figure 7 and Figure 9 As shown, the shape of the end of the electronic component 220 away from the circuit board body 210 is adapted to the shape of the inner wall surface of the heat-conducting wall. This is because the sizes of the electronic components 220 on the circuit board assembly 200 are different, in order to enable each electronic component 220 to achieve better heat transfer effect with the shell 100, the shape of the inner wall surface of the heat-conducting wall is adapted to the shape of the end of the electronic component 220 away from the circuit board body 210, which is conducive to better contact between the heat-conducting wall and the electronic component 220 to transfer heat, and avoids insufficient heat dissipation leading to local high temperature.

[0053] In one possible implementation, the shape of the inner wall surface of the heat-conducting wall can be adapted to the shape of the electronic component 220 by providing protrusions or grooves on the inner wall surface of the heat-conducting wall, so that the inner wall surface of the heat-conducting wall is better fitted with each electronic component 220.

[0054] In one possible implementation, at least part of the electronic components 220 abut against the heat-conducting wall. Heat is transferred through direct contact between the electronic components 220 and the heat-conducting wall of the box body 120. The heat generated by the electronic components 220 during operation is conducted to the box body 120, and then the heat is taken away by the airflow flowing through the outer surface of the box body 120, ensuring the heat dissipation effect, and the cold air in the fan cavity 510 directly flows to the heat-conducting wall of the shell 100, which can also reduce the noise caused by air flow. Of course, the heat-conducting wall can also be designed to be shaped to make all the electronic components 220 abut against the heat-conducting wall, improve the heat transfer efficiency, and make the heat dissipation more balanced.

[0055] In one possible implementation, referring to Figure 6 、 Figure 8 and Figure 9As shown, the heat-conducting pad 300 is arranged in the shell 100 and abuts between the inner wall surface of the heat-conducting wall and the at least partial electronic components 220. The heat-conducting pad 300 has good heat-conducting performance to reduce thermal resistance. By arranging the heat-conducting pad 300, the air gap between the heat-conducting wall of the box body 120 and the electronic components 220 can be prevented, so as to avoid the influence of the air gap on the heat transfer effect, so that the heat can be timely transferred between the electronic components 220 and the box body 120, and the heat generated by the electronic components 220 can be quickly conducted out.

[0056] In a possible implementation, all the electronic components 220 can abut against the heat-conducting pad 300, so as to avoid the dead angle of heat dissipation and improve the heat transfer effect.

[0057] In a possible implementation, part of the electronic components 220 directly abut against the inner wall surface of the heat-conducting wall, and the heat-conducting pad 300 is arranged between the other part of the electronic components 220 and the inner wall surface of the heat-conducting wall, so as to improve the heat-conducting effect.

[0058] In a possible implementation, the heat-conducting pad 300 is pasted to the inner wall surface of the heat-conducting wall.

[0059] In a possible implementation, the heat-conducting pad 300 can be coated with heat-conducting glue on one side. Of course, the heat-conducting pad 300 can also have adhesion, which is convenient for fixing the heat-conducting pad 300 to the inner wall surface of the heat-conducting wall, convenient for assembly during production, can prevent the rigid collision and damage of the electronic components 220 to the inner wall surface of the heat-conducting wall, and can also improve the heat transfer efficiency. Since the electronic components 220 are not pasted to the heat-conducting pad 300, the disassembly operation of the circuit board assembly 200 will not be affected, and the disassembly and maintenance of the heating and ventilation equipment in the later stage are facilitated.

[0060] In a possible implementation, as shown in Figure 1 and Figure 8 The gap between the two adjacent first heat dissipation fins 121 forms a heat dissipation air duct 140. The extension direction of the heat dissipation air duct 140 is consistent with the direction in which the airflow in the fan cavity 510 flows through the outer surface of the shell 100.

[0061] As shown in Figure 4 and Figure 8 When the airflow in the fan cavity 510 flows through the outer surface of the shell 100, it is easier to enter the heat dissipation air duct 140. The airflow entering the heat dissipation air duct 140 can exchange heat with the two adjacent first heat dissipation fins 121 and the heat-conducting wall of the box body 120 respectively, so as to improve the heat dissipation efficiency, so that the continuous airflow formed in the fan cavity 510 can improve the overall heat dissipation and cooling effect of the electric control box in the flowing process, and the adverse effects of high temperature on the electronic components 220 can be reduced.

[0062] In a possible implementation, the first heat dissipation fins 121 can be perpendicular to the plate surface of the heat-conductive wall, or can have an included angle with the plate surface of the heat-conductive wall, the included angle being an acute angle, and the first heat dissipation fins 121 can be inclined to the side where the electronic components 220 have higher heat dissipation, so as to guide the airflow to flow to the position where the electronic components 220 have higher heat dissipation, and to prevent local temperature from being too high to damage the electronic components 220.

[0063] In a possible implementation, the surface of the first heat dissipation fins 121 is provided with heat-conductive protrusions, which can help to increase the contact area of the first heat dissipation fins 121 and the airflow flowing in the heat dissipation air duct 140, so as to improve the heat dissipation efficiency.

[0064] In a possible implementation, as shown in Figure 4 and Figure 8 , the first heat dissipation fins 121 can be distributed according to the temperature distribution of the electronic components 220 during operation, for example, the number of the first heat dissipation fins 121 distributed in the position corresponding to the electronic components 220 with high heat generation is increased to improve the heat dissipation effect, and the number of the first heat dissipation fins 121 distributed in the position corresponding to the electronic components 220 with low heat generation is reduced, so as to achieve balanced heat dissipation effect.

[0065] Here, the number of the first heat dissipation fins 121 is not specifically limited, and the first heat dissipation fins 121 can not be limited to a rectangular shape, but can also be in a trapezoidal shape or the like.

[0066] In a possible implementation, as shown in Figure 1 , Figure 4 and Figure 6 , the electronic components 220 are all arranged on the side of the circuit board body 210 facing the fan cavity 510, and the side of the circuit board body 210 away from the fan cavity 510 abuts against the cover body 130. Such a structure allows the heat transferred from the electronic components 220 to the circuit board body 210 to be transferred to the cover body 130, and then dissipated by the cover body 130, so as to achieve omnidirectional heat dissipation.

[0067] In a possible implementation, the heat generating devices in the electronic components 220 are all arranged on the side of the circuit board body 210 facing the fan cavity 510. The heat generating devices include at least one of an inverter, a rectifier, an inductor, a filter, and a reactor. Such a structure allows the heat generated by the heat generating devices to be effectively transferred to the side of the housing 100 facing the fan cavity 510, so as to prevent local temperature from being too high, and then dissipate the heat by the cold air or heat-conductive medium in the fan cavity 510, so as to shorten the heat transfer path, improve the heat dissipation efficiency, and improve the stability of the circuit board assembly 200.

[0068] In a possible implementation, the circuit board body 210 can be a PCB board.

[0069] In a possible implementation, the included angle between the board surface direction of the circuit board body 210 and the board surface direction of the partition plate 600 is 0-30°. With such a structure, the air cooling heat dissipation effect of the fan cavity 510 can be fully utilized, so that the position of the shell 100 that is in thermal contact with the electronic components 220 can have a larger area in thermal exchange with the cold air formed in the fan cavity 510, the utilization rate of the airflow formed in the fan cavity 510 is improved, and the heat generated by the electronic components 220 can be more quickly taken away by the airflow formed in the fan cavity 510, thereby improving the heat dissipation effect.

[0070] In a possible implementation, the included angle between the board surface direction of the circuit board body 210 and the board surface direction of the partition plate 600 can be 0°, so that the electronic components 220 are directly opposite the fan cavity 510, and the part of the shell 100 that is in thermal contact with the electronic components 220 has the largest windward surface, thereby improving the heat dissipation efficiency. Of course, the included angle between the board surface direction of the circuit board body 210 and the board surface direction of the partition plate 600 can also be 5°, 10°, 15°, 20°, or 30°, to ensure the heat dissipation effect of the electric control box.

[0071] In a possible implementation, the side of the cover body 130 facing the compressor cavity 520 is provided with a plurality of second heat dissipation fins 131, and the second heat dissipation fins 131 are arranged in sequence and at intervals. The second heat dissipation fins 131 can increase the heat dissipation area of the cover body 130, so as to exchange heat with the air in the compressor cavity 520 through the second heat dissipation fins 131, thereby playing an auxiliary heat dissipation role. The second heat dissipation fins 131 can be arranged in a plurality of rows and a plurality of columns.

[0072] In a possible implementation, the second heat dissipation fins 131 can be perpendicular to the board surface of the cover body 130, or can have an included angle with the board surface of the cover body 130, and the included angle is an acute angle.

[0073] Here, the number of the second heat dissipation fins 131 is not specifically limited, and the second heat dissipation fins 131 can not be limited to a rectangular shape, but can also be in a trapezoidal shape or the like.

[0074] In a possible implementation, referring to FIG. 1, Figure 9 As shown in the figure, a wire hole 122 is formed in the side wall of the box body 120 facing the bottom surface, and a protective sleeve 150 is arranged in the wire hole 122. The cable connected to the circuit board assembly 200 extends to the outside of the accommodating cavity 110 through the protective sleeve 150, so as to be electrically connected to other components outside the accommodating cavity 110, facilitate wiring operation, and improve the wiring efficiency.

[0075] In a possible implementation, the wire passing hole 122 includes, but is not limited to, a circular hole, a polygonal hole, or a rectangular hole, and the like. Of course, the wire passing hole 122 can also be a half hole formed in a side wall of the box body 120 facing the bottom surface and a half hole formed in the cover 130, which are spliced with each other.

[0076] The protective sleeve 150 can be a rubber sleeve, which protects the wires and prevents the wires from being cut by the inner wall of the wire passing hole 122, thereby improving the safety of use. In order to prevent the protective sleeve 150 from falling off, the outer surface of the protective sleeve 150 is provided with a clamping protrusion that can abut against the inner wall of the wire passing hole 122, thereby improving the stability of the installation of the protective sleeve 150.

[0077] Reference Figure 1 As shown, the device body includes an outdoor unit, and the extension direction of the heat dissipation air duct 140 of the electric control box is consistent with the airflow direction of the air blower 400.

[0078] The air blower 400 provides a continuous cold airflow for the electric control box. The cold airflow is transferred to the heat of the shell 100 in the process of flowing through the electronic components 220, thereby ensuring stable heat dissipation effect and improving the stability of heat dissipation.

[0079] In a possible implementation, considering that the airflow blown to different positions of the electric control box by the air blower 400 can be different, the electronic components 220 with high power, such as inverters, rectifiers, inductors, and the like, can be arranged at positions of the electric control box that are more easily contacted by the airflow, thereby facilitating the heat generated by the electronic components 220 to be dissipated in time and ensuring the normal work of the electronic components 220.

[0080] The heating and ventilation device in the embodiment includes, but is not limited to, an air conditioner, a multi-split unit, a heat pump, a pool machine, a water heater, and the like.

[0081] When the heating and ventilation device is an air conditioner, for example, a central air conditioner, the air conditioner further includes an indoor unit and an outdoor unit. The indoor unit is arranged indoors, and the outdoor unit is arranged outdoors. The indoor unit and the outdoor unit can both be multiple. The multiple indoor units can be arranged in the same indoor space or different indoor spaces. The multiple outdoor units can be respectively provided with electric control boxes to control the multiple outdoor units. The different outdoor units can communicate with each other and cooperate with each other to realize joint work of multiple main units.

[0082] The heating and ventilation equipment provided by the application can be a closed shell, so that the accommodating cavity 110 is a closed cavity, has good sealing performance, can cope with harsh environments, and can effectively prevent rainwater from entering the electric control box, so that the problem of corrosion and circuit failure caused by rainwater entering the electric control box can be avoided when the heating and ventilation equipment works in a rainy or humid environment, so that the circuit board assembly 200 can be better protected from damage, the safety of use is improved, and the reliability of the operation of the heating and ventilation equipment is improved.

[0083] The heating and ventilation equipment provided by the application can be a closed shell, so that the accommodating cavity 110 is a closed cavity, has good sealing performance, can cope with harsh environments, and can effectively prevent rainwater from entering the electric control box, so that the problem of corrosion and circuit failure caused by rainwater entering the electric control box can be avoided when the heating and ventilation equipment works in a rainy or humid environment, so that the circuit board assembly 200 can be better protected from damage, the safety of use is improved, and the reliability of the operation of the heating and ventilation equipment is improved.

[0084] The heating and ventilation equipment provided by the application can be a closed shell, so that the accommodating cavity 110 is a closed cavity, has good sealing performance, can cope with harsh environments, and can effectively prevent rainwater from entering the electric control box, so that the problem of corrosion and circuit failure caused by rainwater entering the electric control box can be avoided when the heating and ventilation equipment works in a rainy or humid environment, so that the circuit board assembly 200 can be better protected from damage, the safety of use is improved, and the reliability of the operation of the heating and ventilation equipment is improved.

[0085] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0086] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0087] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0088] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0089] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0090] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A heating and ventilating apparatus, characterized by The application relates to an air conditioner, which comprises a device body and an electric control box, wherein the device body comprises a cabinet (500) and a partition plate (600) arranged in the cabinet (500), the partition plate (600) divides the cabinet (500) into a fan cavity (510) and a compressor cavity (520), the electric control box is arranged on the partition plate (600), and a fan (400) is arranged in the fan cavity (510). The electric control box comprises a shell (100) and a circuit board assembly (200), the shell (100) has a containing cavity (110) therein, and the circuit board assembly (200) is arranged in the containing cavity (110); the circuit board assembly (200) comprises a circuit board body (210) and electronic components (220), at least part of the electronic components (220) are arranged on one side of the circuit board body (210) facing the fan cavity (510), so that the heat of the electronic components (220) is conducted to the fan cavity (510) through the shell (100). The shell (100) comprises a box body (120) and a cover (130). A side of the cover (130) facing the compressor cavity (520) is provided with a plurality of second heat dissipation fins (131), and the second heat dissipation fins (131) are arranged in sequence and at intervals. The shell (100) is configured to realize heat conduction with the electronic components (220).

2. The heating device according to claim 1, wherein An outer surface of the shell (100) on a side facing the fan cavity (510) forms a plurality of heat dissipation air channels (140) for air flow.

3. The warming device of claim 1, wherein, The box body (120) is arranged on the partition plate (600), and a side of the box body (120) facing the compressor cavity (520) has an opening, the cover (130) is arranged at the position of the opening, so that the cover (130) and the box body (120) jointly form the containing cavity (110), and a side wall of the box body (120) facing the fan cavity (510) is a heat conduction wall.

4. The heating device according to claim 3, wherein A side of the heat conduction wall facing the fan cavity (510) is provided with first heat dissipation fins (121), a plurality of the first heat dissipation fins (121) are arranged in sequence and at intervals, and the first heat dissipation fins (121) are arranged in sequence and at intervals, and adjacent two first heat dissipation fins (121) form the heat dissipation air channels (140).

5. The heating device according to claim 4, wherein The shape of an end of the electronic components (220) away from the circuit board body (210) is matched with the shape of an inner wall surface of the heat conduction wall.

6. The heating device according to claim 5, wherein At least part of the electronic components (220) abuts against the heat conduction wall; or, 7. The heating device according to claim 6, wherein The shell (100) is further provided with a heat conduction pad (300), the heat conduction pad (300) abuts between the inner wall surface of the heat conduction wall and at least part of the electronic components (220). The heat conduction pad (300) is pasted on the inner wall surface of the heat conduction wall.

8. The heating device according to claim 7, wherein The extension direction of the heat dissipation air channels (140) is consistent with the direction of air flow in the fan cavity (510) through the outer surface of the shell (100).

9. The heating device according to any one of claims 3 to 8, wherein ​ 10. The heating device according to any one of claims 1 to 8, wherein The included angle between the board surface direction of the circuit board body (210) and the board surface direction of the partition plate (600) is 0°-30°.

11. The heating device according to any one of claims 3 to 8, wherein The electronic components (220) are arranged on the side of the circuit board body (210) facing the fan cavity (510), or the heat generating components in the electronic components (220) are arranged on the side of the circuit board body (210) facing the fan cavity (510).

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