Semiconductor device processing equipment

Abstract

The present application relates to a semiconductor device processing equipment, including: a workbench; a loading device, a carrying and transporting device, driving the carrying platform to move between a first position and a second position along a first direction; a gripping device; a film pasting device; a pressing device; and a cutting device. The feeding component and the receiving component of the film pasting device are respectively located on both sides of the carrying platform, one end of the blue film is wound on the feeding component, and the other end is wound on the receiving component. The feeding component can rotate with the receiving component, the feeding component has a first preset speed, and the receiving component has a second preset speed. The first preset speed and the second preset speed tend to be consistent, so that the blue film between the feeding component and the receiving component always has tension. The pressing device presses the blue film with tension to attach it to the wafer and the iron ring, so that the blue film can fit tightly when covering the wafer, avoiding defects such as wrinkles and bubbles, greatly improving the flatness and uniformity of the film, thereby improving the quality of semiconductor devices.

Description

Technical Field

[0001] The present application relates to a semiconductor device processing device, belonging to the technical field of semiconductor device processing. Background Art

[0002] In the production process of semiconductor devices, the blue film (the blue film mentioned in this article refers to the film used to carry the wafer. Since most of them are blue, they are often called blue films, but they are not limited to blue films) processing of the wafer is a crucial link. By temporarily attaching the wafer to the blue film fixed on the iron ring, the wafer and the iron ring can be firmly combined together to ensure that there is no relative displacement between the two during the processing process. At the same time, it also reduces the direct contact between the external force and the wafer during the transmission process, reduces the risk of fragments, and facilitates subsequent processing. The quality of the attached blue film directly affects the performance and reliability of semiconductor devices. However, there are many problems that are difficult to ignore when the traditional semiconductor device processing method is to attach the film to the wafer.

[0003] In actual operation, if the tension of the blue film is insufficient, wrinkles are likely to form on the blue film during the film pasting process, which not only affects the appearance quality of the film, but may also cause the wafer surface to be uneven, thereby adversely affecting the subsequent semiconductor device processing technology and affecting the performance and reliability of the device.

[0004] Therefore, it is necessary to improve the prior art to overcome the above defects in the prior art. Summary of the invention

[0005] In view of this, an embodiment of the present application provides a semiconductor device processing device to solve at least one problem existing in the background technology, including:

[0006] Workbench;

[0007] A feeding device, arranged on the workbench, for feeding the iron ring;

[0008] A carrying and transporting device is arranged at one side of the loading device, comprising a carrying platform arranged on the workbench and a first driving member connected to the carrying platform, wherein the carrying platform is used to carry the wafer and the iron ring, and the first driving member can drive the carrying platform to move between a first position and a second position along a first direction;

[0009] A grabbing device is arranged on one side of the carrying and transporting device, and the grabbing device can grab the iron ring of the loading device to the carrying platform at the first position, and the iron ring is located at the periphery of the wafer;

[0010] The film pasting device comprises a feeding component, a receiving component and a blue film. When the carrying platform is in the second position, in the horizontal direction, the feeding component and the receiving component are respectively located on both sides of the carrying platform along the first direction. One end of the blue film is wound on the feeding component, and the other end is wound on the receiving component. The feeding component can rotate with the receiving component. The feeding component has a first preset speed for loosening the blue film, and the receiving component has a second preset speed for tightening the blue film. The first preset speed and the second preset speed tend to be consistent, so that the blue film between the feeding component and the receiving component always has tension.

[0011] A pressing device is installed on the workbench through a mounting plate, the pressing device comprises a pressing plate and a second driving member connected to the pressing plate, the second driving member can drive the pressing plate to move in the height direction, so as to fit and fix the blue film located above the carrier platform with the iron ring and the wafer on the carrier platform when the blue film is located at the second position;

[0012] The cutting device includes a connecting arm arranged above a supporting platform, a cutting piece arranged at a first end of the connecting arm, a third driving member connected to the cutting piece, and a fourth driving member connected to the connecting arm, wherein the third driving member can drive the cutting piece to move in a height direction to approach or move away from the blue film above the supporting platform, and the fourth driving member can drive the cutting piece to rotate around the second end of the connecting arm and along the edge of the pressing plate to cut the blue film above the supporting platform.

[0013] Optionally, in the above-mentioned semiconductor device processing equipment, the connecting arm is arranged above the pressing plate, and the connecting arm and the pressing plate are arranged coaxially, and the second driving member can drive the cutting device and the pressing plate to move in the height direction at the same time.

[0014] Optionally, in the semiconductor device processing equipment, the film attaching device further comprises guide components arranged in pairs, and the two guide components are respectively arranged close to the feeding component and the receiving component;

[0015] Each of the guide assemblies comprises a fixed rod fixed on the workbench, a first guide rod arranged on the fixed rod, and a second guide rod located below the guide rod, and the blue film passes through the inner side of the first guide rod and the outer side of the second guide rod in sequence from top to bottom.

[0016] Optionally, the above-mentioned semiconductor device processing equipment also includes a flattening device, which includes a flattening plate arranged above the blue film along the second direction, a slider connected to the end of the flattening plate, a slide rail arranged on the workbench, and a fifth driving member connected to the flattening plate, wherein the fifth driving member can drive the flattening plate to move in the first direction under the action of the slide rail and the slider to tension the blue film.

[0017] Optionally, in the semiconductor device processing equipment, the flattening plate includes a flattening upper plate and a flattening lower plate located below the flattening upper plate, and the blue film is wound from the feeding assembly and then passes between the flattening upper plate and the flattening lower plate and then wound onto the receiving assembly;

[0018] The flattening lower plate can move in the height direction relative to the flattening upper plate to clamp the blue film.

[0019] Optionally, in the above-mentioned semiconductor device processing equipment, the loading device includes a connecting table connected to the workbench, a supporting table arranged above the connecting table, and a sixth driving member connected to the supporting table, the supporting table is used to support a plurality of iron rings, and the sixth driving member can drive the supporting table to move in the height direction to load the plurality of iron rings in sequence.

[0020] Optionally, in the above-mentioned semiconductor device processing equipment, the grasping device includes a connecting frame, a grasping member connected to the connecting frame, a seventh driving member connected to the connecting frame, and an eighth driving member arranged on the connecting frame and connected to the grasping member, the eighth driving member can drive the grasping member to move in the height direction to approach or move away from the iron ring on the loading device, and the seventh driving member can drive the connecting frame and the grasping member to move in the second direction to move the iron ring on the loading device to the supporting platform in the first position.

[0021] Optionally, in the above-mentioned semiconductor device processing equipment, the grasping member includes a main body connected to the connecting frame and a plurality of first suction cups connected to the main body, and the plurality of suction cups are connected to an external air source to adsorb and fix the iron ring.

[0022] Optionally, the above-mentioned semiconductor device processing equipment further comprises a flipping device installed on the workbench, and the flipping device can flip the wafer and the iron ring on the carrier when they are in the first position, so that the blue film is set downward.

[0023] Optionally, in the above-mentioned semiconductor device processing equipment, the flipping device includes an adsorption frame and a ninth driving member and a tenth driving member connected to the adsorption frame, the ninth driving member can drive the adsorption frame to flip, and the tenth driving member can drive the ninth driving member and the adsorption frame to move closer to or away from the supporting platform in the height direction.

[0024] Compared with the prior art, the present application has the following beneficial effects: by installing a film pasting device and a pressing device on a workbench, and the feeding assembly and the receiving assembly of the film pasting device are respectively located on both sides of the carrier platform, one end of the blue film is wound on the feeding assembly, and the other end is wound on the receiving assembly, the feeding assembly can rotate with the receiving assembly, the feeding assembly has a first preset speed for loosening the blue film, and the receiving assembly has a second preset speed for tightening the blue film, the first preset speed and the second preset speed tend to be consistent, so that the blue film between the feeding assembly and the receiving assembly always has tension, and the pressing device presses the blue film that maintains the tension to attach it to the wafer and the iron ring, so that the blue film can fit tightly when covering the wafer, avoiding defects such as wrinkles and bubbles, greatly improving the flatness and uniformity of the film pasting, thereby improving the quality of semiconductor devices. The feeding assembly can rotate with the receiving assembly, and the two have a preset speed that tends to be consistent, realizing the continuous and stable supply and recovery of the blue film, reducing the pause and adjustment time in the film pasting process, and greatly improving the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a schematic diagram of the structure of the semiconductor device processing equipment shown in the present application;

[0026] Figure 2 for Figure 1 A partial schematic diagram of a semiconductor device processing equipment shown;

[0027] Figure 3 for Figure 1 A schematic structural diagram of a grabbing device of a semiconductor device processing equipment shown;

[0028] Figure 4 for Figure 1 A schematic structural diagram of a loading device of a semiconductor device processing equipment shown;

[0029] Figure 5 for Figure 1 A schematic structural diagram of a carrying and transporting device for semiconductor device processing equipment shown;

[0030] Figure 6 for Figure 1 A schematic structural diagram of a flipping device of a semiconductor device processing equipment shown;

[0031] Figure 7 for Figure 1The schematic diagram of the assembly of the pressing device and the cutting device of the semiconductor device processing equipment shown;

[0032] Figure 8 for Figure 7 A schematic structural diagram of the assembly of the pressing device and the cutting device of the semiconductor device processing equipment in another direction;

[0033] Fig. 9 for Figure 1 The structural schematic diagram of the film attaching device of the semiconductor device processing equipment shown;

[0034] Fig.10 for Figure 1 The structural schematic diagram of the flattening device of the semiconductor device processing equipment is shown.

[0035] in,

[0036] 100-wafer, 200-iron ring 200, 300-blue film;

[0037] 1-shell, 11-feed window;

[0038] 2- Workbench;

[0039] 3-feeding device, 31-connecting platform, 32-supporting platform, 33-sixth driving member, 34-limiting plate, 35-detection member;

[0040] 4-carrying and transporting device, 41-carrying platform, 42-first driving member;

[0041] 5-grabbing device, 51-connecting frame, 52-grabbing member, 521-main body, 522-first suction cup, 53-seventh driving member, 54-eighth driving member;

[0042] 6-film laminating device, 61-feeding assembly, 611-first rotating shaft, 612-first roller, 62-receiving assembly, 621-second rotating shaft, 622-second roller, 623-driving motor, 63-guide assembly, 631-fixing rod, 632-first guide rod, 633-second guide rod;

[0043] 7-pressing device, 71-pressing plate, 72-second driving member, 73-first horizontal plate;

[0044] 8-cutting device, 81-connecting arm, 82-cutting member, 83-third driving member, 84-fourth driving member, 85-second horizontal plate;

[0045] 9-flattening device, 91-flattening plate, 911-flattening upper plate, 912-flattening lower plate, 92-sliding block, 93-sliding rail, 94-fifth driving member;

[0046] 10-turning device, 101-adsorption frame, 102-ninth driving member, 103-tenth driving member. DETAILED DESCRIPTION

[0047] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. It is understandable that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some structures related to the present application are shown in the accompanying drawings, rather than all structures. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0048] The terms "including" and "having" and any variations thereof in this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products or devices.

[0049] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0050] See also Figures 1 to 5 As shown, a semiconductor device processing equipment shown in a preferred embodiment of the present application is suitable for attaching a blue film 300 to the surface of a wafer 100 and an iron ring 200 to fix the wafer 100 and the iron ring 200, so as to facilitate the transportation of the wafer 100 and the iron ring 200 and subsequent processes, such as cutting and grinding of the wafer 100. The fixing effect of the blue film 300 can ensure the processing accuracy and quality.

[0051] In the present application. The semiconductor device processing equipment includes a shell 1, a workbench 2 arranged inside the shell 1, a loading device 3, a carrying and transporting device 4, a gripping device 5, a film sticking device 6, a pressing device 7 and a cutting device 8. Among them, a feeding window 11 is provided on the shell 1, and the robot transports the wafer 100 to be processed to the carrying and transporting device 4 through the feeding window 11. The loading device 3 is used to load the iron ring 200, and the gripping device 5 is used to grab and move the iron ring 200 loaded by the loading device 3 to the carrying and transporting device 4. The carrying and transporting device 4 is used to carry the wafer 100 and the iron ring 200, and drive the wafer 100 and the iron ring 200 to move between the first position and the second position. When the carrying and transporting device 4 drives the wafer 100 and the iron ring 20 When 0 moves from the first position to the second position, the film sticking device 6 makes the blue film 300 be located above the carrying and transporting device 4, the pressing device 7 presses down the blue film 300 located above the carrying and transporting device 4, so that the blue film 300 is attached to the wafer 100 and the iron ring 200, thereby fixing the wafer 100 and the iron ring 200, and the cutting device cuts the blue film 300 attached to the wafer 100 and the iron ring 200 and separates it from other blue films 300, thereby realizing the attachment and fixation of the blue film 300 to the wafer 100 and the iron ring 200.

[0052] Specifically, refer to Figure 4 The feeding device 3 includes a connecting platform 31 connected to the workbench 2, a supporting platform 32 arranged above the connecting platform 31, and a sixth driving member 33 connected to the supporting platform 32. The supporting platform 32 is used to support a plurality of iron rings 200. The sixth driving member 33 can drive the supporting platform 32 to move in the height direction to sequentially feed the plurality of iron rings 200. It should be noted that, in this embodiment, the sixth driving member 33 is a pulse cylinder.

[0053] The feeding device 3 also includes at least two limit plates 34 installed on the workbench 2. At least two limit plates 34 are relatively arranged on both sides of the support platform 32 so that a plurality of iron rings 200 can be stacked in the height direction and will not be displaced in the horizontal direction. In this embodiment, the feeding device 3 also includes a detection member 35, which is connected to the controller and is used to detect whether the iron ring 200 is in place, so that after the signal is fed back to the controller, the controller controls the grasping device 5 to grasp the iron ring 200 in place to prevent the grasping device 5 from being empty. The orderly feeding method ensures the accurate position of the iron ring 200 and provides a reliable basis for the subsequent grasping and processing links.

[0054] refer to Figure 2 and Figure 3 The grabbing device 5 is disposed on one side of the carrying and transporting device 4 , and the grabbing device 5 can grab the iron ring 200 of the loading device 3 onto the transport carrying platform 41 at the first position, and make the iron ring 200 be located outside the wafer 100 .

[0055] Specifically, the grabbing device 5 includes a connecting frame 51, a grabbing member 52 connected to the connecting frame 51, a seventh driving member 53 connected to the connecting frame 51, and an eighth driving member 54 disposed on the connecting frame 51 and connected to the grabbing member 52. The eighth driving member 54 can drive the grabbing member 52 to move in the height direction to approach or move away from the iron ring 200 on the feeding device 3 to achieve the grabbing of the iron ring 200; the seventh driving member 53 can drive the connecting frame 51 and the grabbing member 52 to move in the second direction to move the iron ring 200 on the feeding device 3 to the load-bearing and transporting assembly in the first position.

[0056] More specifically, the grabbing member 52 includes a main body 521 connected to the connecting frame 51 and a plurality of first suction cups 522 connected to the main body 521, and the plurality of suction cups are connected to an external air source to adsorb and fix the iron ring 200. The advantage of such a configuration is that the iron ring 200 can be grasped by the adsorption force generated by the first suction cup 522, which can ensure the stability of the iron ring 200 during the grasping and moving process, prevent the iron ring 200 from falling or shifting and being unable to be placed normally on the transport bearing assembly, and prevent friction between the iron ring 200 and the grabbing member 52, thereby scratching the iron ring 200. In other embodiments, other grasping methods can also be used, for example, the iron ring 200 can also be grasped by the magnetic suction force generated by electromagnetics. The specific grasping method is not specifically limited here, and can be determined according to actual conditions, as long as the above-mentioned effect can be achieved.

[0057] As mentioned above, reference Figure 2 and Figure 5 The carrying and transporting device 4 is arranged on one side of the loading device 3. The carrying and transporting device 4 includes a carrying platform 41 arranged on the workbench 2 and a first driving member 42 connected to the carrying platform 41. The carrying platform 41 is used to carry the wafer 100 and the iron ring 200. The first driving member 42 can drive the carrying platform 41 to move between the first position and the second position along the first direction to realize the wafer 100 and the iron ring 200 to be attached with the blue film 300 and to unload the wafer 100 and the iron ring 200 after being attached with the blue film 300.

[0058] refer to Figure 2 and Fig. 9, the film pasting device 6 includes a feeding component 61, a receiving component 62 and a blue film 300. When the support platform 41 is in the second position, in the horizontal direction, the feeding component 61 and the receiving component 62 are respectively located on both sides of the support platform 41 along the first direction, and one end of the blue film 300 is wound on the feeding component 61, and the other end is wound on the receiving component 62. Among them, the feeding component 61 includes a first rotating shaft 611 fixed on the workbench 2 and a first roller 612 sleeved on the outside of the first rotating shaft 611; the receiving component 62 includes a second rotating shaft 621 connected to a driving motor 623 and a second roller 622 sleeved on the outside of the second rotating shaft 621. The driving motor 623 can drive the second rotating shaft 621 to drive the second roller 622 to rotate counterclockwise, thereby driving the first roller 612 to rotate clockwise, so that the receiving component 62 can roll up the blue film 300 while the feeding component 61 releases the blue film 300.

[0059] Specifically, the feeding component 61 has a first preset speed for loosening the blue film 300, and the collecting component 62 has a second preset speed for tightening the blue film 300. The first preset speed is consistent with the second preset speed, so that the blue film 300 between the feeding component 61 and the collecting component 62 always has tension, preventing the blue film 300 from being flat and wrinkle-free during the film pasting process, thereby improving the quality of the film pasting. In addition, the blue film 300 that is always under tension facilitates the cutting device to cut the blue film 300.

[0060] The film laminating device 6 also includes a pair of guide assemblies 63, and the two guide assemblies 63 are respectively arranged near the feeding assembly 61 and the receiving assembly 62. Each guide assembly 63 includes a fixed rod 631 fixed on the workbench 2, a first guide rod 632 arranged on the fixed rod 631, and a second guide rod 633 located below the guide rod. The blue film 300 passes through the inner side of the first guide rod 632 and the outer side of the second guide rod 633 from top to bottom. Such an arrangement can provide a stable path guidance for the transportation of the blue film 300, prevent the blue film 300 from deflection, winding and other problems during the transportation process, and ensure the smooth progress of the film laminating process. The arrangement of the first guide rod 632 and the second guide rod 633 ensures that the transportation direction and tension of the blue film 300 are stable, thereby further improving the accuracy of the blue film 300 covering the wafer 100 and the iron ring 200.

[0061] refer to Figure 2 , Figure 7 and Figure 8 The pressing device 7 is installed on the workbench 2 through the mounting plate, and can move in the height direction to approach or move away from the carrier 41, thereby realizing a fast pressing operation, reducing the time consumption in the film pasting process, and improving the production efficiency of the entire semiconductor device processing equipment.

[0062] Specifically, the laminating device 7 includes a laminating plate 71 and a second driving member 72 connected to the laminating plate 71, and the second driving member 72 can drive the laminating plate 71 to move in the height direction, so as to fit and fix the blue film 300 located above the carrier 41 and the iron ring 200 on the carrier 41 when located at the second position to the wafer 100. Among them, the laminating plate 71 is a circle adapted to the wafer 100, and the second driving member 72 is connected to the center of the laminating plate 71, so that the laminating plate 71 can be uniformly stressed, so that the blue film 300 fits tightly with the wafer 100 and the iron ring 200, and there will be no local stress and damage, and rapid laminating can eliminate the gap and bubbles between the blue film 300 and the wafer 100 and the iron ring 200, thereby improving the quality of laminating.

[0063] Furthermore, the cutting device 8 includes a connecting arm 81 disposed above the carrier 41, a cutting piece 82 disposed at the first end of the connecting arm 81, a third driving piece 83 connected to the cutting piece 82, and a fourth driving piece 84 connected to the connecting arm 81. The third driving piece 83 can drive the cutting piece 82 to move in the height direction to approach or move away from the blue film 300 above the carrier 41; the fourth driving piece 84 can drive the cutting piece 82 to rotate along the edge of the pressing plate 71 with the second end of the connecting arm 81 as the center, so as to cut the blue film 300 located above the carrier 41, thereby ensuring the consistency of the quality and appearance of the processed semiconductor device.

[0064] Furthermore, the cutting device 8 is integrated with the pressing device 7, so that the occupied area of ​​the entire processing equipment can be reduced. Specifically, the pressing device 7 also includes a first horizontal plate 73 installed on the workbench 2, and the second driving member 72 is fixed on the first horizontal plate 73 and connected to the pressing plate 71; the cutting device also includes a second horizontal plate 85 located below the first horizontal plate 73, and the fourth driving member 84 is installed on the second horizontal plate 85. The connecting arm 81 is arranged above the pressing plate 71, and the connecting arm 81 is coaxially arranged with the pressing plate 71. The second driving member 72 can drive the cutting device and the pressing plate 71 to move in the height direction at the same time, so as to ensure the consistency of the cutting and pressing operations in the height direction, avoid the error caused by asynchrony, and improve the accuracy and efficiency of pressing and cutting.

[0065] In order to prevent the blue film 300 from being deformed or wrinkled due to uneven force after cutting, which may cause the receiving assembly 62 to fail to receive the material smoothly, refer to Figure 2 and Fig.10As shown, in this embodiment, the semiconductor device processing equipment further includes a flattening device 9. The flattening device 9 includes a flattening plate 91 arranged above the blue film 300 along the second direction, a slider 92 connected to the end of the flattening plate 91, a slide rail 93 arranged on the workbench 2, and a fifth driving member 94 connected to the flattening plate 91. After the blue film 300 located between the receiving assembly 62 and the feeding assembly 61 is cut by the cutting device, the fifth driving member 94 can drive the flattening plate 91 to move in the first direction under the action of the slide rail 93 and the slider 92, thereby tightening the cut blue film 300, facilitating the smooth material collection of the receiving assembly 62, and avoiding the shutdown of the entire processing equipment.

[0066] Specifically, the flat plate 91 includes a flattening upper plate 911 and a flattening lower plate 912 located below the flattening upper plate 911. The blue film 300 is wound from the feeding assembly 61, passes between the flattening upper plate 911 and the flattening lower plate 912, and is then wound onto the receiving assembly 62. The flattening lower plate 912 can move in the height direction relative to the flattening upper plate 911 to clamp the blue film 300, further strengthening the control ability of the blue film 300, so as to adjust the clamping force as needed, and ensure the stability and tension of the blue film 300 during the receiving process. It should be noted that in this embodiment, the lower surface of the flattening upper plate 911 and the upper surface of the flattening lower plate 912 are both made of flexible materials to prevent the flattening upper plate 911 and the flattening lower plate 912 from damaging the blue film 300.

[0067] In this embodiment, reference Figure 6 As shown, the processing equipment also includes a flipping device 10 installed on the workbench 2, which can flip the wafer 100 and the iron ring 200 on the carrier 41 when they are in the first position, so that the blue film 300 is set downward to meet specific processing requirements.

[0068] Specifically, the flipping device 10 includes an adsorption frame 101 and a ninth driving member 102 and a tenth driving member 103 connected to the adsorption frame 101. The ninth driving member 102 can drive the adsorption frame 101 to flip, and the tenth driving member 103 can drive the ninth driving member 102 and the adsorption frame 101 to move closer to or away from the carrier 41 in the height direction, so as to flip the wafer 100 and the iron ring 200 after the blue film 300 is attached.

[0069] The above is only a specific implementation of the present application, and any other improvements made based on the concept of the present application are deemed to be within the protection scope of the present application.

Claims

1. A semiconductor device processing equipment, characterized in that: include: Workbench; A feeding device, arranged on the workbench, for feeding the iron ring; A carrying and transporting device is arranged at one side of the loading device, comprising a carrying platform arranged on the workbench and a first driving member connected to the carrying platform, wherein the carrying platform is used to carry the wafer and the iron ring, and the first driving member can drive the carrying platform to move between a first position and a second position along a first direction; A grabbing device is arranged on one side of the carrying and transporting device, and the grabbing device can grab the iron ring of the loading device to the carrying platform at the first position, and the iron ring is located at the periphery of the wafer; The film pasting device comprises a feeding component, a receiving component and a blue film. When the carrying platform is in the second position, in the horizontal direction, the feeding component and the receiving component are respectively located on both sides of the carrying platform along the first direction. One end of the blue film is wound on the feeding component, and the other end is wound on the receiving component. The feeding component can rotate with the receiving component. The feeding component has a first preset speed for loosening the blue film, and the receiving component has a second preset speed for tightening the blue film. The first preset speed and the second preset speed tend to be consistent, so that the blue film between the feeding component and the receiving component always has tension. A pressing device is installed on the workbench through a mounting plate, the pressing device comprises a pressing plate and a second driving member connected to the pressing plate, the second driving member can drive the pressing plate to move in the height direction, so as to fit and fix the blue film located above the carrier platform with the iron ring and the wafer on the carrier platform when the blue film is located at the second position; The cutting device comprises a connecting arm arranged above the carrying platform, a cutting piece arranged at the first end of the connecting arm, a third driving piece connected to the cutting piece, and a fourth driving piece connected to the connecting arm, wherein the third driving piece can drive the cutting piece to move in the height direction to approach or move away from the blue film above the carrying platform, and the fourth driving piece can drive the cutting piece to rotate along the edge of the pressing plate with the second end of the connecting arm as the center, so as to cut the blue film above the carrying platform; The connecting arm is arranged above the pressing plate, and the connecting arm is arranged coaxially with the pressing plate, and the second driving member can drive the cutting device and the pressing plate to move in the height direction at the same time; The processing equipment also includes a flattening device, which includes a flattening plate arranged above the blue film along the second direction, a slider connected to the end of the flattening plate, a slide rail arranged on the workbench, and a fifth driving member connected to the flattening plate. The fifth driving member can drive the flattening plate to move in the first direction under the action of the slide rail and the slider to tension the blue film.

2. The semiconductor device processing equipment according to claim 1, characterized in that The film sticking device further comprises a pair of guide assemblies, wherein the two guide assemblies are respectively arranged close to the feeding assembly and the receiving assembly; Each of the guide assemblies comprises a fixed rod fixed on the workbench, a first guide rod arranged on the fixed rod, and a second guide rod located below the guide rod, and the blue film passes through the inner side of the first guide rod and the outer side of the second guide rod in sequence from top to bottom.

3. The semiconductor device processing equipment according to claim 1, characterized in that The flattening plate includes a flattening upper plate and a flattening lower plate located below the flattening upper plate. The blue film is wound from the feeding assembly, passes between the flattening upper plate and the flattening lower plate, and then is wound onto the receiving assembly. The flattening lower plate can move in the height direction relative to the flattening upper plate to clamp the blue film.

4. The semiconductor device processing equipment according to claim 1, characterized in that The feeding device includes a connecting platform connected to the workbench, a supporting platform arranged above the connecting platform, and a sixth driving member connected to the supporting platform. The supporting platform is used to support a plurality of iron rings. The sixth driving member can drive the supporting platform to move in the height direction to feed the plurality of iron rings in sequence.

5. The semiconductor device processing equipment according to claim 1, wherein: The grabbing device includes a connecting frame, a grabbing member connected to the connecting frame, a seventh driving member connected to the connecting frame, and an eighth driving member arranged on the connecting frame and connected to the grabbing member, the eighth driving member can drive the grabbing member to move in the height direction to approach or move away from the iron ring on the feeding device, and the seventh driving member can drive the connecting frame and the grabbing member to move in the second direction to move the iron ring on the feeding device to the supporting platform in the first position.

6. The semiconductor device processing equipment according to claim 5, characterized in that: The grabbing member comprises a main body connected to the connecting frame and a plurality of first suction cups connected to the main body, and the plurality of suction cups are connected to an external air source to adsorb and fix the iron ring.

7. The semiconductor device processing equipment according to claim 1, characterized in that: The processing equipment also includes a flipping device installed on the workbench, and the flipping device can flip the wafer and the iron ring on the carrier when they are in the first position, so that the blue film is arranged downward.

8. The semiconductor device processing equipment according to claim 7, characterized in that The flipping device includes an adsorption frame and a ninth driving member and a tenth driving member connected to the adsorption frame, the ninth driving member can drive the adsorption frame to flip, and the tenth driving member can drive the ninth driving member and the adsorption frame to move closer to or away from the supporting platform in the height direction.

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