A welding device and method for a field effect transistor

Abstract

The present invention discloses a welding device and method for a field effect transistor, relating to the technical field of welding devices. The welding device for the field effect transistor includes a conveyor and a welding robot arranged on the top of a bottom plate. The conveyor includes a conveyor belt, and the welding robot includes a welding head. A plurality of groups of positioning columns arranged in an array are fixedly connected to the conveyor belt, and the number of positioning columns in each group is multiple. A support plate is fixedly connected to the top of the bottom plate. The welding device and method for the field effect transistor can, before welding, center and clamp the field effect transistor body, prevent the field effect transistor body from tilting, and at the same time, facilitate adjusting and controlling the distance between the field effect transistor body and the circuit board, thereby ensuring the quality after welding. During welding, after each pin is welded, the welded solder can be closed and limited to prevent it from flowing and spreading randomly, ensuring the welding quality.

Description

Technical Field

[0001] The present invention relates to the technical field of welding devices, and particularly to a welding device and method for field effect transistors. Background Art

[0002] The MOS transistor is a metal-oxide-semiconductor field effect transistor, abbreviated as a field effect transistor. The field effect transistor is a unipolar semiconductor device that controls the current magnitude through the electric field effect. When the field effect transistor is applied in a circuit, it is necessary to weld the field effect transistor on the circuit board by a soldering iron. Due to the small volume of the field effect transistor, when welding the field effect transistor on the circuit board (PCB board), it is necessary for a person to manually hold the field effect transistor and the circuit board stably, so that multiple pins of the field effect transistor are respectively inserted into corresponding welding holes on the circuit board, and finally, each pin of the field effect transistor is welded on the circuit board in sequence by the soldering iron and solder.

[0003] However, when the existing welding device for field effect transistors is in use, by manually fixing the field effect transistor and the circuit board, it is easy to shake during the welding process, which is not convenient for centering and limiting, thus affecting the welding efficiency and quality. At the same time, during welding, it is not convenient to adjust and control the distance between the field effect transistor and the circuit board, which will also affect the welding efficiency and quality. Moreover, during welding, the solder is prone to flow and spread, which will also affect the welding quality. Summary of the Invention

[0004] The purpose of the present invention is to provide a welding device and method for field effect transistors to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A welding device for field effect transistors, including a conveyor and a welding robot arranged on the top of a bottom plate. The conveyor includes a conveyor belt, and the welding robot includes a welding head. A plurality of groups of arrayed positioning columns are fixedly connected to the conveyor belt, and the number of each group of positioning columns is multiple. A support plate is fixedly connected to the top of the bottom plate, and a first moving block is connected to the top of the support plate through a lifting module. A second moving block is connected to the side wall of the first moving block through a first moving module, and an installation plate is fixedly connected to the side wall of the second moving block. A pressing mechanism for fitting the field effect transistor body and the circuit board is arranged at the bottom of the installation plate. A clamping mechanism for centering and clamping the field effect transistor body is arranged at the bottom of the installation plate, and a limiting mechanism for limiting the solder after welding is arranged at the bottom of the installation plate.

[0006] Preferably, the pressing mechanism includes a distance sensor fixedly inserted at the bottom of the mounting plate, and two symmetrically arranged sleeves are fixedly connected to the top of the mounting plate. A sleeve rod is inserted into the sleeve, the lower end of the sleeve rod is fixedly connected to a pressing plate, and a first spring is sleeved on the side wall of each sleeve.

[0007] Preferably, the clamping mechanism includes two symmetrically arranged V-shaped blocks, and two symmetrically arranged T-shaped guide rods are fixedly connected to the side walls of the V-shaped blocks. A connecting block is sleeved on the side wall of the T-shaped guide rod, and the connecting block is fixed to the bottom of the mounting plate. A second spring is sleeved on the side wall of each T-shaped guide rod, and the movement of the V-shaped block is pushed by a first pushing mechanism.

[0008] Preferably, the first pushing mechanism includes a first electromagnet fixedly connected to the side wall of each connecting block, and a first iron block is fixedly connected to the side wall of each V-shaped block.

[0009] Preferably, the limiting mechanism includes a sliding plate slidably connected to the side wall of the mounting plate, and a second moving module is arranged between the sliding plate and the mounting plate. The bottom of the sliding plate is connected to an L-shaped plate through a first moving mechanism, and the side wall of the L-shaped plate is connected to a U-shaped plate through a reset mechanism. Two symmetrically arranged third moving blocks are connected to the inside of the U-shaped plate through a second moving mechanism, and two symmetrically arranged connecting plates are fixedly connected to the side wall of the third moving block. Two symmetrically arranged semi-circular plates are fixedly connected to the side wall of the connecting plate, and the movement of the U-shaped plate is pushed by a second pushing mechanism.

[0010] Preferably, the first moving mechanism includes a moving rod inserted into the top of the sliding plate, and a stop block is fixedly connected to the upper end of the moving rod. The lower end of the moving rod is fixed to the top of the L-shaped plate, and a third spring is sleeved on the side wall of each moving rod. A second electromagnet is fixedly connected to the bottom of the sliding plate, and a second iron block is fixedly connected to the top of the L-shaped plate.

[0011] Preferably, the reset mechanism includes two symmetrically arranged T-shaped rubber rods inserted into the side wall of the L-shaped plate. One end of the T-shaped rubber rod is fixed to the side wall of the U-shaped plate, and a fourth spring is sleeved on the side wall of each T-shaped rubber rod.

[0012] Preferably, the second moving mechanism includes two symmetrically arranged support blocks fixedly connected to the side wall of the U-shaped plate, and two symmetrically arranged guide rods are fixedly connected to the opposite side walls of the two support blocks. The third moving block is sleeved on the side wall of the guide rod, and a fifth spring is sleeved on the side wall of each guide rod. A first pushing plate is fixedly connected to the side wall of the L-shaped plate, and two symmetrically arranged first inclined surfaces are arranged on the side of the first pushing plate away from the L-shaped plate.

[0013] Preferably, the second pushing mechanism includes a second inclined surface opened on the top of the connecting plate, and a third inclined surface is arranged on the top of the semicircular plate, the bottom of the mounting plate is fixedly connected with a second pushing plate, and the second pushing plate can slide on the second inclined surface and the third inclined surface.

[0014] A method for welding a field effect tube, using the above-mentioned field effect tube welding device, comprises the following steps:

[0015] S1: When welding, first place the circuit board on the positioning column for positioning, then insert the pin of the field effect tube body into the welding hole, start the conveyor, and stop the conveyor when the circuit board is conveyed to the welding position by the conveyor belt. Then, adjust the position of the mounting plate by the first moving module. After the adjustment is completed, drive the second moving block and the mounting plate downward by the lifting module, and drive the pressing plate downward by the first spring. When the pressing plate abuts against the top of the field effect tube body, the bottom of the field effect tube body abuts against the top of the circuit board. At the same time, the first spring is compressed, and the change in the distance of the pressing plate is detected by the distance sensor, so as to determine the compression amount of the first spring, and then determine the extrusion force of the pressing plate on the field effect tube body, so as to ensure the pressing effect while avoiding excessive extrusion force between the pressing plate and the field effect tube body.

[0016] S2: The first electromagnet is powered off. After the first electromagnet is powered off, the two V-shaped blocks move closer to each other under the action of the second spring and make the V-shaped blocks abut against the side wall of the field effect tube body, so that the field effect tube body and the welding hole can be centered and clamped to avoid the field effect tube body from tilting and ensure the quality of subsequent welding. Then, the mounting plate and the field effect tube body are driven to move upward by a certain distance through the lifting module to ensure that a certain distance is left between the field effect tube body and the circuit board, thereby ensuring the quality after welding;

[0017] S3: After the position of the field effect tube body is adjusted, the pins are welded in turn by the welding head on the welding robot. After each pin is welded, the second electromagnet is powered off. After the second electromagnet is powered off, the L-shaped plate can move downward under the action of the third spring and make the semicircular plate abut against the top of the circuit board. At the same time, the second push plate gradually disengages from the second inclined surface and the third inclined surface, and under the action of the fourth spring, the U-shaped plate and the semicircular plate can gradually move toward the direction of the pin after welding. At this time, the third moving block slides on both sides of the first pushing plate. After the semicircular plate moves to both sides of the pin after welding, the third moving block slides along the first inclined surface and gradually disengages from the first pushing plate. At this time, under the action of the fifth spring, the two third moving blocks move closer to each other, and the semicircular plates are driven to move closer to each other and close to form a full circle through the connecting plate, so that the solder after welding can be closed and limited to prevent it from flowing and diffusing at will, thereby ensuring the quality of welding.

[0018] S4: After the limiting is completed, energize the second electromagnet. After the second electromagnet is energized, it attracts the second iron block, causing the L-shaped plate to move upward. At the same time, the third spring is compressed. At this time, the reset mechanism drives the U-shaped plate to move upward, and the second moving mechanism drives the connecting plate and the semi-circular plate to move synchronously. At the same time, the second inclined surface and the third inclined surface can slide along the bottom of the field effect transistor body and push the U-shaped plate to move towards the L-shaped plate. At the same time, the fourth spring is compressed to ensure that the connecting plate and the semi-circular plate can be moved out from the bottom of the field effect transistor body. When the second push plate slides on the third inclined surface and the second inclined surface, it pushes the U-shaped plate to continue to move towards the L-shaped plate. At the same time, the fourth spring continues to be compressed. When the third moving block slides along the first inclined surface to both sides of the first push plate, it can push the two third moving blocks to move away from each other. At the same time, the fifth spring is compressed, and the connecting plate drives the two semi-circular plates to move away from each other and separate, and the second moving module drives the sliding plate to move, so as to adjust the position of the semi-circular plate. Repeating this way, after each pin is welded, the welded solder can be closed and limited to prevent it from flowing and spreading randomly, ensuring the welding quality;

[0019] S5: After all pins are welded, energize the first electromagnet, thereby attracting the two V-shaped blocks to move away from each other and separating from the field effect transistor body. At the same time, the second spring is compressed, and the lifting module drives the mounting plate to lift upward. Then, start the conveyor again to continue transporting the welded circuit board forward.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] (1) The welding device and method of this kind of field effect transistor. By setting up a clamping mechanism, etc., when welding, first place the circuit board on the positioning posts for positioning. Then, insert the pins of the field effect transistor body into the welding holes. Start the conveyor. When the circuit board is conveyed to the welding position by the conveyor belt, stop the conveyor. Then, adjust the position of the mounting plate through the first moving module. After the adjustment is completed, drive the second moving block and the mounting plate to move downward through the lifting module, and drive the pressing plate to move downward through the first spring. When the pressing plate abuts against the top of the field effect transistor body, make the bottom of the field effect transistor body abut against and fit with the top of the circuit board. At the same time, the first spring is compressed. And, by detecting the change in the distance of the pressing plate through the distance sensor, the compression amount of the first spring can be determined, and then the extrusion force of the pressing plate on the field effect transistor body can be determined, ensuring the pressing effect while avoiding excessive extrusion force of the pressing plate on the field effect transistor body. Then, cut off the power supply of the first electromagnet. After the first electromagnet is powered off, the two V-shaped blocks move closer to each other under the action of the second spring and make the V-shaped blocks abut against the side walls of the field effect transistor body, so as to center and clamp the field effect transistor body and the welding hole, avoid the field effect transistor body from tilting, and ensure the quality of subsequent welding. Then, drive the mounting plate and the field effect transistor body to move upward a certain distance through the lifting module, ensuring a certain distance between the field effect transistor body and the circuit board, so as to ensure the quality after welding.

[0022] (2) The welding device and method of this kind of field effect transistor, by setting a limiting mechanism, etc., after the position of the field effect transistor body is adjusted, the welding head on the welding robot performs welding operations on the pins in sequence. After each pin is welded, the second electromagnet is powered off. After the second electromagnet is powered off, the L-shaped plate can move downward under the action of the third spring and make the semi-circular plate abut against the top of the circuit board. At the same time, the second push plate gradually disengages from the second inclined surface and the third inclined surface. And, under the action of the fourth spring, the U-shaped plate and the semi-circular plate can gradually move towards the direction close to the welded pin. At this time, the third moving block slides on both sides of the first push plate. After the semi-circular plate moves to both sides of the welded pin, the third moving block slides along the first inclined surface and gradually disengages from the first push plate. At this time, under the action of the fifth spring, the two third moving blocks move closer to each other, and drive the semi-circular plate to move closer to each other and close into a complete circle through the connecting plate, so as to be able to limit the closing of the welded solder, prevent it from flowing and spreading randomly, and ensure the welding quality. After the limiting is completed, the second electromagnet is powered on. After the second electromagnet is powered on, it attracts the second iron block, making the L-shaped plate move upward. At the same time, the third spring is compressed. At this time, the reset mechanism drives the U-shaped plate to move upward, and the second moving mechanism drives the connecting plate and the semi-circular plate to move synchronously. At the same time, the second inclined surface and the third inclined surface can slide along the bottom of the field effect transistor body and push the U-shaped plate to move towards the direction close to the L-shaped plate. At the same time, the fourth spring is compressed to ensure that the connecting plate and the semi-circular plate can move out from the bottom of the field effect transistor body. When the second push plate slides on the third inclined surface and the second inclined surface, it pushes the U-shaped plate to continue to move towards the direction close to the L-shaped plate. At the same time, the fourth spring is further compressed. When the third moving block slides along the first inclined surface to both sides of the first push plate, it can push the two third moving blocks to move away from each other. At the same time, the fifth spring is compressed, and drives the two semi-circular plates to move away from each other through the connecting plate, and drives the sliding plate to move through the second moving module, so as to adjust the position of the semi-circular plate. In this way, after each pin is welded, the welded solder can be limited in closing, preventing it from flowing and spreading randomly, and ensuring the welding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is the overall structural schematic diagram of the present invention;

[0024] Figure 2 is the overall structural schematic diagram of another perspective of the present invention;

[0025] Figure 3 is the position schematic diagram of the clamping mechanism and the limiting mechanism in the present invention;

[0026] Figure 4 is the structural schematic diagram of the clamping mechanism and the first pushing mechanism in the present invention;

[0027] Figure 5 Schematic diagram of the state of the field effect transistor body and the circuit board before welding according to the present invention;

[0028] Figure 6 is Figure 1 The enlarged structural diagram of the position A in;

[0029] Figure 7 is Figure 2 The enlarged structural diagram of the position B in;

[0030] Figure 8 is Figure 3 The enlarged structural diagram of the position C in;

[0031] Figure 9 is Figure 4 The enlarged structural diagram of the position D in;

[0032] Figure 10 is Figure 8 The enlarged structural diagram of the position E in.

[0033] In the figure: 1, bottom plate; 2, pressing mechanism; 201, pressing plate; 202, distance sensor; 203, sleeve rod; 204, sleeve; 205, first spring; 3, second pusher; 301, second inclined surface; 302, third inclined surface; 303, second push plate; 4, clamping mechanism; 401, V-shaped block; 402, connecting block; 403, T-shaped guide rod; 404, second spring; 5, first pushing mechanism; 501, first electromagnet; 502, first iron block; 6, limiting mechanism; 601, second moving module; 602, sliding plate; 603, L-shaped plate; 604, U-shaped plate; 605, third moving block; 606, connecting plate; 607, semi-circular plate; 7, first moving mechanism; 701, moving rod; 702, stop block; 703, third spring; 704, second electromagnet; 705, second iron block; 8, reset mechanism; 801, T-shaped rubber rod; 802, fourth spring; 9, second moving mechanism; 901, guide rod; 902, fifth spring; 903, first push plate; 904, first inclined surface; 905, support block; 10, conveyor; 1001, conveyor belt; 11, welding robot; 1101, welding head; 12, positioning column; 13, support plate; 14, first moving block; 15, second moving block; 16, mounting plate; 17, lifting module; 18, first moving module; 19, welding hole; 20, circuit board; 2001, positioning hole; 21, field effect transistor body; 2101, pin. Detailed implementation method

[0034] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0035] Please refer to Figures 1 - 10 , the present invention provides a technical solution: a welding device for a field effect transistor, including a conveyor 10 and a welding robot 11 arranged on the top of a bottom plate 1. The conveyor 10 includes a conveyor belt 1001, and the welding robot 11 includes a welding head 1101. A plurality of sets of positioning columns 12 arranged in an array are fixedly connected to the conveyor belt 1001, and the number of each set of positioning columns 12 is multiple. A support plate 13 is fixedly connected to the top of the bottom plate 1, and a first moving block 14 is connected to the top of the support plate 13 through a lifting module 17. A second moving block 15 is connected to the side wall of the first moving block 14 through a first moving module 18, and an installation plate 16 is fixedly connected to the side wall of the second moving block 15. A pressing mechanism 2 for fitting the field effect transistor body 21 and the circuit board 20 is arranged at the bottom of the installation plate 16. A clamping mechanism 4 for centering and clamping the field effect transistor body 21 is arranged at the bottom of the installation plate 16, and a limiting mechanism 6 for limiting the soldering tin after welding is arranged at the bottom of the installation plate 16. Before welding, the field effect transistor body 21 can be centered and positioned and clamped to prevent the field effect transistor body 21 from tilting. At the same time, it is convenient to adjust and control the distance between the field effect transistor body 21 and the circuit board 20, thereby ensuring the quality after welding. During welding, after each lead 2101 is welded, the soldering tin after welding can be closed and limited to prevent it from flowing and spreading randomly, ensuring the quality of welding.

[0036] Please refer to Figure 3 and Figure 4, the pressing mechanism 2 includes a distance sensor 202 fixedly inserted at the bottom of the mounting plate 16. Two symmetrically arranged sleeves 204 are fixedly connected to the top of the mounting plate 16. A sleeve rod 203 is inserted into the sleeve 204. The lower end of the sleeve rod 203 is fixedly connected to a pressing plate 201. A first spring 205 is sleeved on the side wall of each sleeve 204. When welding, first place the circuit board 20 on the positioning posts 12 for positioning. Then, insert the pins 2101 of the field effect transistor body 21 into the welding holes 19. Start the conveyor 10. When the circuit board 20 is conveyed to the welding position through the conveyor belt 1001, stop the conveyor 10. Then, adjust the position of the mounting plate 16 through the first moving module 18. After the adjustment is completed, drive the second moving block 15 and the mounting plate 16 to move downward through the lifting module 17, and drive the pressing plate 201 to move downward through the first spring 205. When the pressing plate 201 abuts against the top of the field effect transistor body 21, the bottom of the field effect transistor body 21 is abutted and fitted against the top of the circuit board 20. At the same time, the first spring 205 is compressed. And by detecting the change in the distance of the pressing plate 201 through the distance sensor 202, the compression amount of the first spring 205 can be determined, and then the pressing force of the pressing plate 201 on the field effect transistor body 21 can be determined, ensuring the pressing effect while avoiding excessive pressing force of the pressing plate 201 on the field effect transistor body 21.

[0037] Please refer to Figure 3 and Figure 4 , the clamping mechanism 4 includes two symmetrically arranged V-shaped blocks 401. Two symmetrically arranged T-shaped guide rods 403 are fixedly connected to the side walls of the V-shaped blocks 401. A connecting block 402 is sleeved on the side wall of the T-shaped guide rod 403, and the connecting block 402 is fixed to the bottom of the mounting plate 16. A second spring 404 is sleeved on the side wall of each T-shaped guide rod 403. The movement of the V-shaped blocks 401 is pushed by the first pushing mechanism 5. After the pressing is completed, the first pushing mechanism 5 is used to make the two V-shaped blocks 401 move closer to each other under the action of the second spring 404 and make the V-shaped blocks 401 abut against the side wall of the field effect transistor body 21, so as to center and clamp the field effect transistor body 21 and the welding hole 19, avoid the field effect transistor body 21 from tilting, and ensure the quality of subsequent welding.

[0038] Please refer to Figure 4 , the first pushing mechanism 5 includes a first electromagnet 501 fixedly connected to the side wall of each connecting block 402, and a first iron block 502 is fixedly connected to the side wall of each V-shaped block 401. After the welding of the pins 2101 is completed, the first electromagnet 501 is energized, so as to attract the two V-shaped blocks 401 to move away from each other and separate from the field effect transistor body 21.

[0039] Please refer to Figures 8 - 10, the limiting mechanism 6 includes a sliding plate 602 slidably connected to the side wall of the mounting plate 16, and a second moving module 601 is arranged between the sliding plate 602 and the mounting plate 16. The bottom of the sliding plate 602 is connected to an L-shaped plate 603 through a first moving mechanism 7, and the side wall of the L-shaped plate 603 is connected to a U-shaped plate 604 through a reset mechanism 8. Two symmetrically arranged third moving blocks 605 are connected in the U-shaped plate 604 through a second moving mechanism 9, and two symmetrically arranged connecting plates 606 are fixedly connected to the side walls of the third moving blocks 605. Two symmetrically arranged semi-circular plates 607 are fixedly connected to the side walls of the connecting plates 606, and the movement of the U-shaped plate 604 is pushed by a second pushing mechanism 3. After each pin 2101 is welded, the first moving mechanism 7 is used to move the L-shaped plate 603 downward so that the semi-circular plate 607 abuts against the top of the circuit board 20. At the same time, through the reset mechanism 8 and the second pushing mechanism 3, the connecting plates 606 and the semi-circular plates 607 can gradually move towards the direction close to the welded pins 2101. After the semi-circular plate 607 moves to both sides of the welded pin 2101, under the action of the second moving mechanism 9, the two third moving blocks 605 move closer to each other, and the connecting plates 606 drive the semi-circular plates 607 to move closer to each other and close into a complete circle, so as to be able to limit the closing of the welded solder, avoid its random flow and diffusion, and ensure the welding quality.

[0040] Please refer to Figure 8 , the first moving mechanism 7 includes a moving rod 701 inserted into the top of the sliding plate 602, and a stopper 702 is fixedly connected to the upper end of the moving rod 701. The lower end of the moving rod 701 is fixed to the top of the L-shaped plate 603, and a third spring 703 is sleeved on the side wall of each moving rod 701. A second electromagnet 704 is fixedly connected to the bottom of the sliding plate 602, and a second iron block 705 is fixedly connected to the top of the L-shaped plate 603. After the second electromagnet 704 is powered off, the L-shaped plate 603 can move downward under the action of the third spring 703 so that the semi-circular plate 607 abuts against the top of the circuit board 20.

[0041] Please refer to Figure 8 and Figure 9 , the reset mechanism 8 includes two symmetrically arranged T-shaped rubber rods 801 inserted into the side wall of the L-shaped plate 603. One end of the T-shaped rubber rod 801 is fixed to the side wall of the U-shaped plate 604, and a fourth spring 802 is sleeved on the side wall of each T-shaped rubber rod 801, which plays a guiding and resetting role for the movement of the U-shaped plate 604. And by setting the T-shaped rubber rod 801 to have a certain resistance with the L-shaped plate 603, it is ensured that the semi-circular plate 607 can first abut against the top of the circuit board 20, and then, under the action of the fourth spring 802, the U-shaped plate 604 and the semi-circular plate 607 can gradually move towards the direction close to the welded pins 2101.

[0042] See also Figure 9 and Figure 10 The second moving mechanism 9 includes two symmetrically arranged support blocks 905 fixedly connected to the side walls of the U-shaped plate 604, and the side walls opposite to the two support blocks 905 are fixedly connected to two symmetrically arranged guide rods 901, the third moving block 605 is sleeved on the side walls of the guide rods 901, and the side walls of each guide rod 901 are sleeved with a fifth spring 902, the side wall of the L-shaped plate 603 is fixedly connected to the first push plate 903, and the first push plate 903 is provided with two symmetrical first inclined surfaces 904 on the side away from the L-shaped plate 603, when the U-shaped plate 604 and the semicircular plate 607 can gradually approach the welding When the semicircular plate 607 moves in the direction of the pin 2101 after welding, the third moving block 605 slides on both sides of the first pushing plate 903. After the semicircular plate 607 moves to both sides of the pin 2101 after welding, the third moving block 605 slides along the first inclined surface 904 and gradually separates from the first pushing plate 903. At this time, under the action of the fifth spring 902, the two third moving blocks 605 move closer to each other, and the semicircular plates 607 are driven by the connecting plate 606 to move closer to each other and close in a full circle, so that the solder after welding can be closed and limited to prevent it from flowing and diffusing at will, thereby ensuring the quality of welding.

[0043] See also Figure 1 The second pushing mechanism 3 includes a second inclined surface 301 opened at the top of the connecting plate 606, and a third inclined surface 302 is arranged on the top of the semicircular plate 607. A second pushing plate 303 is fixedly connected to the bottom of the mounting plate 16, and the second pushing plate 303 can slide on the second inclined surface 301 and the third inclined surface 302. When the second pushing plate 303 gradually disengages from the second inclined surface 301 and the third inclined surface 302, under the action of the fourth spring 802, the U-shaped plate 604 and the semicircular plate 607 can gradually move toward the direction close to the welded pin 2101.

[0044] A field effect tube welding method, using the above field effect tube welding device, comprises the following steps:

[0045] S1: When performing welding, first place the circuit board 20 on the positioning posts 12 for positioning. Then, insert the pins 2101 of the FET body 21 into the welding holes 19. Start the conveyor 10. When the circuit board 20 is conveyed to the welding position by the conveyor belt 1001, stop the conveyor 10. Then, adjust the position of the mounting plate 16 through the first moving module 18. After the adjustment is completed, drive the second moving block 15 and the mounting plate 16 to move downward through the lifting module 17, and drive the pressing plate 201 to move downward through the first spring 205. When the pressing plate 201 abuts against the top of the FET body 21, abut and fit the bottom of the FET body 21 against the top of the circuit board 20. At the same time, the first spring 205 is compressed. And, by detecting the change in the distance of the pressing plate 201 through the distance sensor 202, the compression amount of the first spring 205 can be determined, and then the extrusion force of the pressing plate 201 on the FET body 21 can be determined, ensuring the pressing effect while avoiding excessive extrusion force of the pressing plate 201 on the FET body 21;

[0046] S2: Cut off the power supply of the first electromagnet 501. After the power supply of the first electromagnet 501 is cut off, the two V-shaped blocks 401 move closer to each other under the action of the second spring 404 and make the V-shaped blocks 401 abut against the side wall of the FET body 21, so as to center and clamp the FET body 21 and the welding hole 19, avoid tilting of the FET body 21, and ensure the quality of subsequent welding. Then, drive the mounting plate 16 and the FET body 21 to move upward a certain distance through the lifting module 17 to ensure a certain distance between the FET body 21 and the circuit board 20, so as to ensure the quality after welding;

[0047] S3: After the position of the FET body 21 is adjusted, the welding head 1101 on the welding robot 11 performs welding operations on the pins 2101 in sequence. After each pin 2101 is welded, the second electromagnet 704 is powered off. After the second electromagnet 704 is powered off, the L-shaped plate 603 can move downward under the action of the third spring 703 and make the semi-circular plate 607 abut against the top of the circuit board 20. At the same time, the second push plate 303 gradually disengages from the second inclined surface 301 and the third inclined surface 302. And, under the action of the fourth spring 802, the U-shaped plate 604 and the semi-circular plate 607 can gradually move in the direction close to the welded pins 2101. At this time, the third moving block 605 slides on both sides of the first push plate 903. After the semi-circular plate 607 moves to both sides of the welded pin 2101, the third moving block 605 slides along the first inclined surface 904 and gradually disengages from the first push plate 903. At this time, under the action of the fifth spring 902, the two third moving blocks 605 move closer to each other, and drive the semi-circular plate 607 to move closer to each other and close into a complete circle through the connecting plate 606, so as to limit the closing of the welded solder, prevent it from flowing and spreading randomly, and ensure the welding quality;

[0048] S4: After the limiting is completed, the second electromagnet 704 is powered on. After the second electromagnet 704 is powered on, it attracts the second iron block 705, making the L-shaped plate 603 move upward. At the same time, the third spring 703 is compressed. At this time, the reset mechanism 8 drives the U-shaped plate 604 to move upward, and the second moving mechanism 9 drives the connecting plate 606 and the semi-circular plate 607 to move synchronously. At the same time, the second inclined surface 301 and the third inclined surface 302 can slide along the bottom of the FET body 21 and push the U-shaped plate 604 to move in the direction close to the L-shaped plate 603. At the same time, the fourth spring 802 is compressed, ensuring that the connecting plate 606 and the semi-circular plate 607 can move out from the bottom of the FET body 21. When the second push plate 303 slides on the third inclined surface 302 and the second inclined surface 301, it pushes the U-shaped plate 604 to continue to move in the direction close to the L-shaped plate 603. At the same time, the fourth spring 802 is continuously compressed. When the third moving block 605 slides along the first inclined surface 904 to both sides of the first push plate 903, it can push the two third moving blocks 605 to move away from each other. At the same time, the fifth spring 902 is compressed, and drives the two semi-circular plates 607 to move away from each other through the connecting plate 606, and drives the sliding plate 602 to move through the second moving module 601, so as to adjust the position of the semi-circular plate 607. In this way, after each pin 2101 is welded, the welded solder can be limited in closing, preventing it from flowing and spreading randomly, and ensuring the welding quality;

[0049] S5: After the welding of the pin 2101 is completed, the first electromagnet 501 is energized to attract the two V-shaped blocks 401 to move away from each other and disengage from the FET body 21. At the same time, the second spring 404 is compressed, and the lifting module 17 drives the mounting plate 16 to lift upward. Then, the conveyor 10 is started again to continue conveying the welded circuit board 20 forward.

Claims

1. A welding device for a field effect transistor, comprising a conveyor (10) and a welding robot (11) arranged on the top of a bottom plate (1). The conveyor (10) includes a conveyor belt (1001), and the welding robot (11) includes a welding head (1101), characterized in that: A plurality of groups of positioning columns (12) arranged in an array are fixedly connected to the conveyor belt (1001), and the number of positioning columns (12) in each group is multiple. A support plate (13) is fixedly connected to the top of the bottom plate (1), and a first moving block (14) is connected to the top of the support plate (13) through a lifting module (17). The side wall of the first moving block (14) is connected to a second moving block (15) through a first moving module (18), and a mounting plate (16) is fixedly connected to the side wall of the second moving block (15). A pressing mechanism (2) for fitting the field effect transistor body (21) and the circuit board (20) is arranged at the bottom of the mounting plate (16). A clamping mechanism (4) for centering and clamping the field effect transistor body (21) is arranged at the bottom of the mounting plate (16), and a limiting mechanism (6) for limiting the soldering tin after welding is arranged at the bottom of the mounting plate (16). The limiting mechanism (6) includes a sliding plate (602) slidably connected to the side wall of the mounting plate (16), and a second moving module (601) is arranged between the sliding plate (602) and the mounting plate (16). The bottom of the sliding plate (602) is connected to an L-shaped plate (603) through a first moving mechanism (7), and the side wall of the L-shaped plate (603) is connected to a U-shaped plate (604) through a reset mechanism (8). Two symmetrically arranged third moving blocks (605) are connected to the inside of the U-shaped plate (604) through a second moving mechanism (9), and two symmetrically arranged connecting plates (606) are fixedly connected to the side walls of the third moving blocks (605). Two symmetrically arranged semi-circular plates (607) are fixedly connected to the side walls of the connecting plates (606), and the movement of the U-shaped plate (604) is pushed by a second pushing mechanism (3).

2. The soldering device for a field effect transistor according to claim 1, characterized in that: The pressing mechanism (2) includes a distance sensor (202) fixedly inserted at the bottom of the mounting plate (16), and two symmetrically arranged sleeves (204) are fixedly connected to the top of the mounting plate (16). A sleeve rod (203) is inserted into the sleeve (204). The lower end of the sleeve rod (203) is fixedly connected to a pressing plate (201), and a first spring (205) is sleeved on the side wall of each sleeve (204).

3. The welding device for a field effect transistor according to claim 2, characterized in that: The clamping mechanism (4) includes two symmetrically arranged V-shaped blocks (401), and two symmetrically arranged T-shaped guide rods (403) are fixedly connected to the side walls of the V-shaped blocks (401). A connecting block (402) is sleeved on the side wall of the T-shaped guide rod (403), and the connecting block (402) is fixed to the bottom of the mounting plate (16). A second spring (404) is sleeved on the side wall of each T-shaped guide rod (403), and the movement of the V-shaped block (401) is pushed by a first pushing mechanism (5).

4. A welding device for a field effect transistor according to claim 3, characterized in that: The first pushing mechanism (5) includes a first electromagnet (501) fixedly connected to the side wall of each connecting block (402), and a first iron block (502) is fixedly connected to the side wall of each V-shaped block (401).

5. The soldering device for a field effect transistor according to claim 4, characterized in that: The first moving mechanism (7) includes a moving rod (701) inserted into the top of the sliding plate (602), and a stopper (702) is fixedly connected to the upper end of the moving rod (701). The lower end of the moving rod (701) is fixed to the top of the L-shaped plate (603), and a third spring (703) is sleeved on the side wall of each moving rod (701). A second electromagnet (704) is fixedly connected to the bottom of the sliding plate (602), and a second iron block (705) is fixedly connected to the top of the L-shaped plate (603).

6. The welding device for a field effect transistor according to claim 5, characterized in that: The reset mechanism (8) includes two symmetrically arranged T-shaped rubber rods (801) inserted into the side wall of the L-shaped plate (603). One end of the T-shaped rubber rod (801) is fixed to the side wall of the U-shaped plate (604), and a fourth spring (802) is sleeved on the side wall of each T-shaped rubber rod (801).

7. The welding device for a field effect transistor according to claim 6, characterized in that: The second moving mechanism (9) includes two symmetrically arranged support blocks (905) fixedly connected to the side wall of the U-shaped plate (604). Two symmetrically arranged guide rods (901) are fixedly connected to the opposite side walls of the two support blocks (905). The third moving block (605) is sleeved on the side wall of the guide rod (901), and a fifth spring (902) is sleeved on the side wall of each guide rod (901). A first push plate (903) is fixedly connected to the side wall of the L-shaped plate (603), and two symmetric first inclined surfaces (904) are arranged on the side of the first push plate (903) away from the L-shaped plate (603).

8. A soldering device for a field effect transistor according to claim 7, characterized in that: The second pushing mechanism (3) includes a second inclined surface (301) formed on the top of the connecting plate (606), and a third inclined surface (302) is arranged on the top of the semi-circular plate (607). A second push plate (303) is fixedly connected to the bottom of the mounting plate (16), and the second push plate (303) can slide on the second inclined surface (301) and the third inclined surface (302).

9. A welding method for a field effect transistor, using a welding device for a field effect transistor according to claim 8, characterized in that: Comprising the following steps: S1: When welding, first place the circuit board (20) on the positioning posts (12) for positioning. Then, insert the pins (2101) of the field effect transistor body (21) into the welding holes (19). Start the conveyor (10), and when the circuit board (20) is conveyed to the welding position by the conveyor belt (1001), stop the conveyor (10). Then, adjust the position of the mounting plate (16) through the first moving module (18). After the adjustment is completed, drive the second moving block (15) and the mounting plate (16) to move downward through the lifting module (17), and drive the pressing plate (201) to move downward through the first spring (205). When the pressing plate (201) abuts against the top of the field effect transistor body (21), abut the bottom of the field effect transistor body (21) against the top of the circuit board (20). At the same time, the first spring (205) is compressed, and the change in the distance of the pressing plate (201) is detected by the distance sensor (202), so as to determine the compression amount of the first spring (205), and further determine the pressing force of the pressing plate (201) on the field effect transistor body (21), ensuring the pressing effect while avoiding excessive pressing force of the pressing plate (201) on the field effect transistor body (21); S2: Cut off the power supply of the first electromagnet (501). After the power supply of the first electromagnet (501) is cut off, the two V-shaped blocks (401) move closer to each other under the action of the second spring (404) and make the V-shaped blocks (401) abut against the side wall of the field effect transistor body (21), so as to center and clamp the field effect transistor body (21) and the welding hole (19), avoid tilting of the field effect transistor body (21), and ensure the quality of subsequent welding. Then, drive the mounting plate (16) and the field effect transistor body (21) to move upward a certain distance through the lifting module (17), ensuring a certain distance between the field effect transistor body (21) and the circuit board (20), so as to ensure the quality after welding; S3: After the position of the FET body (21) is adjusted, the welding head (1101) on the welding robot (11) performs welding operations on the pins (2101) in sequence. After each pin (2101) is welded, the second electromagnet (704) is powered off. After the second electromagnet (704) is powered off, the L-shaped plate (603) can move downward under the action of the third spring (703) and make the semi-circular plate (607) abut against the top of the circuit board (20). At the same time, the second push plate (303) gradually disengages from the second inclined surface (301) and the third inclined surface (302). Moreover, under the action of the fourth spring (802), the U-shaped plate (604) and the semi-circular plate (607) can gradually move in the direction close to the welded pins (2101). At this time, the third moving block (605) slides on both sides of the first push plate (903). After the semi-circular plate (607) moves to both sides of the welded pins (2101), the third moving block (605) slides along the first inclined surface (904) and gradually disengages from the first push plate (903). At this time, under the action of the fifth spring (902), the two third moving blocks (605) move closer to each other, and drive the semi-circular plate (607) to move closer to each other and close into a complete circle through the connecting plate (606), so as to be able to perform closing and limiting on the welded solder, avoid its random flow and diffusion, and ensure the welding quality; S4: After the limiting is completed, energize the second electromagnet (704). After the second electromagnet (704) is energized, it attracts the second iron block (705), causing the L-shaped plate (603) to move upward. At the same time, the third spring (703) is compressed. At this time, the reset mechanism (8) drives the U-shaped plate (604) to move upward, and the second moving mechanism (9) drives the connecting plate (606) and the semi-circular plate (607) to move synchronously. Meanwhile, the second inclined surface (301) and the third inclined surface (302) can slide along the bottom of the field effect transistor body (21) and push the U-shaped plate (604) to move towards the L-shaped plate (603). At the same time, the fourth spring (802) is compressed to ensure that the connecting plate (606) and the semi-circular plate (607) can be moved out from the bottom of the field effect transistor body (21). When the second push plate (303) slides on the third inclined surface (302) and the second inclined surface (301), it pushes the U-shaped plate (604) to continue moving towards the L-shaped plate (603). At the same time, the fourth spring (802) continues to be compressed. When the third moving block (605) slides along the first inclined surface (904) to both sides of the first push plate (903), it can push the two third moving blocks (605) to move away from each other. At the same time, the fifth spring (902) is compressed, and the connecting plate (606) drives the two semi-circular plates (607) to move away from each other and separate, and the second moving module (601) drives the sliding plate (602) to move, so as to adjust the position of the semi-circular plate (607). Repeating this process can, after the welding of each pin (2101) is completed, limit the welded solder to prevent it from flowing and spreading randomly, ensuring the welding quality; S5: After the welding of all pins (2101) is completed, energize the first electromagnet (501), thereby attracting the two V-shaped blocks (401) to move away from each other and detach from the field effect transistor body (21). At the same time, the second spring (404) is compressed, and the lifting module (17) drives the mounting plate (16) to lift upward. Then, start the conveyor (10) again to continue transporting the welded circuit board (20) forward.

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