Semiconductor device flip chip mounting equipment and assembly method thereof

Abstract

The present invention relates to the field of semiconductor manufacturing technology, and in particular to a mounting device for flip-chip semiconductor devices and an assembly method thereof, wherein the mounting device comprises: a mounting platform, a first tray loading and gluing device, a chip mounting device, and a second frame mounting device; the first tray loading and gluing device is configured to provide a first frame, apply glue, and transport to the next process; the chip mounting device is configured to provide a first chip and a second chip, which are respectively glued to the corresponding positions of the first frame pre-glued, apply glue to the outer surfaces of the first and second chips after gluing, and transport to the next process; the second frame mounting device is configured to provide a second frame, mount the second frame on the first frame, and unload the material. The advantage of the present invention is that the IGBT packaging device using the flip-chip process is realized by the first tray loading and gluing device, the chip mounting device, and the second frame mounting device, thereby reducing the cost.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a mounting device for flip-chip semiconductor devices and an assembly method thereof. Background Art

[0002] Power semiconductor devices are core components of modern power transformation devices. At present, the voltage and current levels and reliability of domestic power semiconductor devices are relatively low. High-end industries such as rail transit and new energy vehicles require ultra-high voltage, high current, and high reliability high-power semiconductor devices, which are completely monopolized by foreign products, posing a huge hidden danger to the safety of industrial development.

[0003] Mastering advanced design technology, process technology and equipment is the key for foreign semiconductor companies to stay ahead. Advanced copper sheet bonding method is the core technology for high-power semiconductor device packaging. Due to restrictions on this technology and equipment by foreign manufacturers, domestic power semiconductor devices still generally use wire bonding, which limits the improvement of device carrying power and reliability.

[0004] Researching and developing high-precision copper sheet bonding equipment for power semiconductor devices, breaking through key technologies and forming product applications will help master advanced packaging and testing technologies for power semiconductor devices, improve the performance of domestic power semiconductor devices, and have great market application potential and social benefits. Summary of the invention

[0005] In view of this, the present invention aims to provide a semiconductor device flip chip mounting device and an assembly method thereof, which completes the assembly of the flip chip through a first material tray loading and gluing device, a chip mounting device configuration and a second frame mounting device.

[0006] To achieve the above object, the technical solution created by the present invention is implemented as follows:

[0007] A semiconductor device flip chip mounting device comprises: a mounting platform;

[0008] The first tray loading and gluing device is arranged on the mounting platform; the first tray loading and gluing device is configured to provide a first frame, apply glue to the first frame, and transport the first frame to the next process; the chip mounting device is arranged at the end of the first tray loading and gluing device; the chip mounting device is configured to provide a first chip and a second chip, respectively glue the first chip and the second chip to the corresponding positions of the first frame pre-glued, apply glue to the outer surfaces of the first chip and the second chip after gluing, and transport the first chip, the second chip and the first frame that have been glued and applied glue to the next process; the second frame mounting device is arranged at the end of the chip mounting device, the second frame mounting device is configured to provide a second frame, mount the second frame with the first chip, the second chip and the first frame, and complete the unloading of the mounted second frame, the first chip, the second chip and the first frame.

[0009] Furthermore, the first material tray loading and gluing device includes: a first conveying mechanism, including a first linear motor and a first tray, the first tray is used to carry the first material tray, the first linear motor drives the first tray and then drives the first material tray to reciprocate between the first frame loading position, the first glue brushing position and the first transfer position; the first frame loading mechanism is configured to place the first material tray equipped with the first frame on the first pallet; the first glue brushing mechanism is arranged at the first glue brushing position, and performs glue brushing on the first frame located at the first glue brushing position; the first moving mechanism is arranged at the first transfer position, and is configured to move the first material tray equipped with the first frame that has been glued from the first transfer position to the chip mounting device.

[0010] Furthermore, the first frame feeding mechanism includes: a support frame; a mounting seat, which is arranged on the support frame; a motor, a movable plate fixed to the mounting seat through a motor mounting plate, and connected to the mounting seat through four first pillars; a lead screw, one end of which is fixed to the movable plate, and the other end passes through the mounting seat and is connected to the output shaft of the motor through a synchronous pulley assembly, for transmitting power to achieve lifting movement; a lifting plate, the lifting plate is located between the movable plate and the mounting seat, is connected to the four first pillars through a first self-lubricating bearing, and is connected to the nut of the lead screw, and moves up and down on the four first pillars as the lead screw rotates; two fixed plates are connected to the lifting plate through four second pillars, and the movable plate is connected to the four second pillars through a second self-lubricating bearing; four silos are vertically arranged in pairs on each The inner side of a fixed plate is constructed into a rectangular shape for placing the first material tray; the two discharge components each include a cylinder, a push plate, two linear guides and two discharge plates, the cylinder is arranged on the fixed plate, the push plate is connected to the output end of the cylinder, the two linear guides are arranged on the fixed plate and are located on both sides of the cylinder, the two discharge plates are arranged at both ends of the push plate and are connected to the sliders of the two linear guides for storing and discharging the first material tray; the motor drives the lead screw to rotate, and drives the movable plate to move up and down through the lifting plate, and then drives the fixed plate to move up and down, so that when the lifting plate is in the rising position, the cylinder extends to make the first material tray be located on the discharge plate, and when the lifting plate is in the descending position, the cylinder drives the discharge plate to retract so that the first material tray is located on the first tray.

[0011] Furthermore, the first moving mechanism includes a translation component, a lifting component and a grabbing component; the grabbing component is arranged on the lifting component, the translation component drives the lifting component to translate and then drives the grabbing component to move; the grabbing component includes an H-shaped plate and a pneumatic suction cup group arranged on the H-shaped plate, and the pneumatic suction cup group is arranged on the two vertical sides of the H-shaped plate.

[0012] Furthermore, it also includes a glue filling mechanism, which is arranged on the mounting frame of the first glue brushing mechanism and is arranged away from the first glue brushing mechanism; the glue filling mechanism is constructed to perform visual inspection on the glue brushing quality of the first frame, measure the vertical distance between the glue filling mechanism and the glue filling position of the first frame, and fill glue to the position on the first frame where glue is not brushed or is unqualified.

[0013] Furthermore, the chip mounting device includes: a second conveying mechanism, the second conveying mechanism and the first conveying mechanism are located on the same straight line, including a second linear motor and a second tray, the second tray is used to place the first material tray; the second linear motor drives the second tray and then drives the first material tray to reciprocate between the chip mounting position, the second glue brushing position and the second transfer position; the chip loading mechanism is configured to complete the loading of the first chip and the second chip, and drive the first chip and the second chip to move in two orthogonal directions; the first mounting mechanism is arranged at the chip mounting position, including a contact recognition camera and a chip moving component; the contact recognition camera is used to identify And record the position coordinates of the contact points where the first frame contacts the gate of the first chip; the chip moving component is configured to move the first chip or the second chip to the chip mounting position, and place the first chip or the second chip at the corresponding position of the first frame; the image detection mechanism is configured to detect the position of the gate of the first chip; the chip glue brushing mechanism is arranged at the second glue brushing position, and is used to brush glue on the first chip and the second chip mounted on the first frame; the second moving mechanism is arranged at the second transfer position, and is configured to move the first chip, the second chip and the first frame that have been glued from the second transfer position to the second frame mounting device.

[0014] Furthermore, the chip loading mechanism includes: a third conveying mechanism, which is arranged in parallel with the second conveying mechanism, and the third conveying mechanism includes two third linear motors, two electric slides, a first chip tray and a second chip tray which are arranged opposite to each other; two electric slides are respectively arranged on each third linear motor, and the movement directions of the two electric slides are perpendicular to the running directions of the two third linear motors; the first chip tray and the second chip tray are respectively arranged on each electric slide; a first vibration loading mechanism and a second vibration loading mechanism; wherein the first vibration loading mechanism is used to sort the first chip in a preset direction; the second vibration loading mechanism is used to sort the second chip in a preset direction; the first picking mechanism and the second picking mechanism have the same structure, respectively Used to pick up the first chip and the second chip, and place the first chip and the second chip on the first chip tray and the second chip tray respectively; the first picking mechanism and the second picking mechanism both include a bracket, a picking motor, a motor mounting plate, a transmission pulley assembly, a connecting rod assembly and a pneumatic suction nozzle; the bracket crosses the third conveying mechanism and is fixed on the mounting platform; the motor mounting plate is arranged on the bracket, and the fixed end of the picking motor is connected to the motor mounting plate; the output end of the picking motor is connected to one end of the transmission pulley assembly, and the other end of the transmission pulley assembly is connected to the connecting rod assembly, and the pneumatic suction nozzle is arranged on the connecting rod assembly; the picking motor drives the transmission pulley assembly to drive the connecting rod assembly to move, and then the first chip or the second chip picked up by the pneumatic suction nozzle is placed on the first chip tray or the second chip tray.

[0015] Furthermore, the chip moving assembly includes a transverse movement mechanism and a picking mechanism arranged on the transverse movement mechanism, the transverse movement mechanism includes a transverse movement fixed frame and a transverse movement linear motor, the transverse movement fixed frame spans the second conveying mechanism and the third conveying mechanism and is fixed to the mounting platform, and the transverse movement fixed frame is located between the first picking mechanism and the second picking mechanism; the picking mechanism includes a mounting base plate and a suction assembly, the mounting base plate is arranged on the transverse movement linear motor, and the suction assembly is arranged on the mounting base plate.

[0016] Furthermore, the second frame mounting device includes: a fourth conveying mechanism, which is located on the same straight line as the first conveying mechanism; the fourth conveying mechanism includes a fourth package linear motor and a third tray, and the third tray is used to place the first material tray; the fourth linear motor drives the third tray and then drives the first material tray to move between the frame mounting position and the unloading position; a second material tray transmission mechanism, which is arranged in parallel with the fourth conveying mechanism, and the second material tray transmission mechanism is configured to provide a second frame and complete the unloading of the second material tray; a second mounting mechanism, which is arranged at the frame mounting position, and the second mounting mechanism crosses the fourth conveying mechanism and the second material tray transmission mechanism and is connected to the mounting platform; the second mounting mechanism has the same structure as the first mounting mechanism, and is used to place the second frame at the corresponding position of the first frame; a mounting unloading mechanism, which is arranged at the unloading position, and the mounting unloading mechanism has the same structure as the first frame loading mechanism, and is used to unload the mounted first frame, second frame, first chip and second chip.

[0017] Furthermore, the second material tray transmission mechanism includes a fifth conveying mechanism, a second frame loading mechanism, and a second frame unloading mechanism; the structures of the second frame loading mechanism and the second frame unloading mechanism are the same as those of the first frame loading mechanism, and are respectively arranged at both ends of the fifth conveying mechanism.

[0018] A method for assembling a flip chip of a semiconductor device is implemented by using the above-mentioned flip chip mounting equipment of the semiconductor device, wherein the semiconductor device comprises a first frame, a second frame, a first chip and a second chip; the specific steps are as follows:

[0019] S1. Place the first frame on the first material tray, and place the first material tray equipped with the first frame on the first frame feeding mechanism of the first material tray feeding and gluing device.

[0020] S2. The first frame loading mechanism places the first material tray on the first tray of the first conveying mechanism of the first material tray loading and gluing device, and the first conveying mechanism conveys the first material tray to the first glue brushing position, and the first glue brushing mechanism of the first material tray loading and gluing device brushes glue on the first frame; finally, the first conveying mechanism transports the first frame brushed with glue to the first transfer position.

[0021] S3. The first moving mechanism of the first tray loading and gluing device moves the first frame located at the first transfer position to the second conveying mechanism of the chip mounting device.

[0022] S4. The first vibration loading mechanism and the second vibration loading mechanism of the chip mounting device respectively sort the first chip and the second chip in a preset direction.

[0023] S5. The first picking mechanism and the second picking mechanism of the chip mounting device place the first chip and the second chip on the first chip tray and the second chip tray respectively.

[0024] S6. The image detection mechanism of the chip mounting device is used to detect the position of the gate of the first chip.

[0025] S7. The first mounting mechanism of the chip mounting device picks up the first chip and the second chip respectively and moves them to the chip mounting position; the contact recognition camera of the first mounting mechanism first recognizes and records the position coordinates of the contacts where the first frame contacts the gate of the first chip; and then the picking mechanism of the first mounting mechanism mounts the chips on the first frame.

[0026] S8. The second conveying mechanism conveys the first frame, the first chip and the second chip that have been mounted to the second glue application position, and the chip glue application mechanism of the chip mounting device applies glue to the first chip and the second chip.

[0027] S9. The second moving mechanism of the chip mounting device transfers the first frame, the first chip and the second chip after the glue is applied to the fourth conveying mechanism of the second frame mounting device at the second transfer position. ;

[0028] S10. The second tray transmission mechanism of the second frame mounting device completes loading of the second frame, and then the second mounting mechanism of the second frame mounting device mounts the second frame with the first frame, the first chip and the second chip.

[0029] S11. The mounting and unloading mechanism of the second frame mounting device unloads the mounted first frame, second frame, first chip and second chip.

[0030] Compared with the prior art, the invention can achieve the following beneficial effects: the invention realizes that the IGBT packaging equipment using the flip-chip process does not need to perform the ClipBonding process through the first material tray loading and gluing device, the chip mounting device and the second frame mounting device, thereby reducing the control cost caused by the bonding accuracy, avoiding the damage to the chip surface caused by the glue brushing, and compared with the traditional wire bonding equipment (generally aluminum wire welding), the IGBT packaging using the flip-chip process can significantly reduce chip damage and improve the chip carrying power. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The drawings constituting part of the present invention are used to provide a further understanding of the present invention. The exemplary embodiments and descriptions of the present invention are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0032] Figure 1 is a schematic structural diagram of a semiconductor device provided according to an embodiment of the present invention;

[0033] Figure 2 is a schematic structural diagram of a placement device for flip-chip semiconductor devices according to an embodiment of the present invention;

[0034] Figure 3 is a structural schematic diagram of a first frame feeding mechanism provided according to an embodiment of the present invention;

[0035] Figure 4 is a structural schematic diagram of a first transmission mechanism provided according to an embodiment of the present invention;

[0036] Figure 5 is a schematic structural diagram of a first tray provided according to an embodiment of the present invention;

[0037] Figure 6 is a structural schematic diagram of a first glue applying mechanism provided according to an embodiment of the present invention;

[0038] Figure 7 is a structural schematic diagram of a first moving mechanism provided according to an embodiment of the present invention;

[0039] Figure 8 is a structural schematic diagram of a glue filling mechanism provided according to an embodiment of the present invention;

[0040] Fig. 9 is a structural schematic diagram of a chip loading mechanism provided according to an embodiment of the present invention;

[0041] Fig.10 is a schematic structural diagram of a third transmission mechanism provided according to an embodiment of the present invention;

[0042] Fig.11 is a structural schematic diagram of a first material picking mechanism without a motor cover provided according to an embodiment of the present invention;

[0043] Fig.12 is a structural schematic diagram of a first mounting mechanism provided according to an embodiment of the present invention;

[0044] Fig.13 It is a structural schematic diagram of an image detection mechanism provided according to an embodiment of the present invention.

[0045] The reference numerals include: 1, mounting platform; 2, first tray loading and gluing device; 21, first frame loading mechanism; 211, support frame; 212, mounting seat; 213, motor; 214, moving plate; 215, first pillar; 216, lead screw; 217, lifting plate; 218, fixed plate; 219, second pillar; 2110, silo; 2111, discharge assembly; 2112, cylinder; 2113, push plate; 2114, linear guide; 2115, discharge plate; 22, first conveying mechanism; 221, first linear motor; 222, first tray; 2221, platform seat; 2222, tray; 2223, tray clamp; 2224, clamp cylinder; 23, first glue brushing mechanism; 231, mounting frame; 232, glue brushing lifting assembly; 23 3. Glue brushing translation assembly; 234. Scraper assembly; 235. Glue brushing plate; 24. First moving mechanism; 241. Translation assembly; 2411. Translation bracket; 2412. Translation bottom plate; 2413. Translation motor; 2414. Translation pulley assembly; 2415. Translation guide rail; 242. Lifting assembly; 2421. Lifting motor; 2422. Lifting fixed plate; 2423. Lifting screw assembly; 2424. Fixed block; 2425. Lifting guide rail; 243. Grasping assembly; 2431. Connecting beam; 2432. H-type plate; 2433. Pneumatic suction cup assembly; 25. Glue filling mechanism; 251. Detection camera; 252. Glue dispensing assembly; 253. Distance sensor; 254. Camera lifting assembly; 255. Glue filling linear motor; 256. Glue dispensing mounting seat;

[0046] 3. Chip mounting device; 31. Second conveying mechanism; 32. Chip loading mechanism; 321. Third conveying mechanism; 322. First vibration loading mechanism; 3211. Third linear motor; 3212. Electric slide; 3213. First chip tray; 3214. Second chip tray; 323. Second vibration loading mechanism; 324. First picking mechanism; 3241. Bracket; 3242. Picking motor; 3243. Motor mounting plate; 3244. Driving pulley assembly; 3245. Connecting rod assembly; 3 246, pneumatic suction nozzle; 3247, motor cover; 325, second picking mechanism; 33, first mounting mechanism; 331, lateral movement mechanism; 3311, lateral movement fixing frame; 3312, lateral movement linear motor; 332, picking mechanism; 3321, mounting base plate; 3322, suction assembly; 333, contact recognition camera; 34, image detection mechanism; 341, light source assembly; 342, camera; 343, reflector assembly; 344, camera bracket; 35, chip glue brushing mechanism; 36, second moving mechanism;

[0047] 4. Second frame mounting device; 41. Fourth conveying mechanism; 42. Second tray transmission mechanism; 421. Fifth conveying mechanism; 422. Second frame loading mechanism; 423. Second frame unloading mechanism; 43. Second mounting mechanism; 44. Mounting unloading mechanism;

[0048] 5. Semiconductor device; 51. First frame; 52. Second frame; 53. First chip; 54. Second chip. DETAILED DESCRIPTION

[0049] In order to make the purpose, technical solution and advantages of the invention more clear, the invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only used to explain the invention and do not constitute a limitation of the invention.

[0050] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0051] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0052] In the description of the invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the invention can be understood according to specific circumstances.

[0053] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0054] like Figure 1 , Figure 2 As shown, an embodiment of the present invention provides a semiconductor device flip chip mounting device, wherein the semiconductor device 5 includes a first frame 51, a second frame 52, a first chip 53 and a second chip 54; the semiconductor device flip chip mounting device is used to bond the first frame 51, the second frame 52, the first chip 53 and the second chip 54. The semiconductor device flip chip mounting device includes: a mounting platform 1, a first tray loading and glue coating device 2, a chip mounting device 3 and a second frame mounting device 4.

[0055] The first chip 53 has a side with a gate and a source as the front side, and the other side is the back side. The second chip 54 has a side with the same gate as the first chip 53 as the front side, and the other side is the back side. The conventional chip bonding is to first paste the back side of the first chip 53 and the other side of the second chip 54 to the frame, and then bond the first chip 53 with the gate and the source and the front side of the second chip 54. The flip chip of the present invention means that the front side of the first chip 53 and the front side of the second chip 54 are first mounted on the first frame 51, and then the second frame 52 is mounted on the back side of the first chip 53 and the back side of the second chip 54.

[0056] The first tray feeding and gluing device 2 comprises a first frame feeding mechanism 21 , a first conveying mechanism 22 , a first gluing mechanism 23 and a first moving mechanism 24 .

[0057] like Figure 3 As shown, the first frame loading mechanism 21 includes: a support frame 211, a mounting seat 212, a motor 213, a movable plate 214, four first pillars 215, a screw 216, a lifting plate 217, two fixed plates 218, four second pillars 219, four silos 2110, and a discharge assembly 2111.

[0058] The mounting seat 212 includes two L-shaped plates and a mounting plate. The horizontal plates of the two L-shaped plates are connected to the top of the support frame 211, the top surfaces of the vertical plates of the two L-shaped plates are connected to the bottom surface of the mounting plate, and the two L-shaped plates are arranged on both sides of the mounting plate back to back.

[0059] The motor 213 is fixed on the mounting plate of the mounting seat 212 via a motor mounting plate.

[0060] The lifting plate 217 is located between the movable plate 214 and the mounting seat 212. One end of the four first pillars 215 is fixed on the mounting plate of the mounting seat 212, and close to the four corners of the mounting plate. The other ends of the four first pillars 215 pass through the lifting plate 217 and are fixed to the movable plate 214. First self-lubricating bearings are respectively provided between the four first pillars 215 and the lifting plate 217.

[0061] One end of the lead screw 216 is connected to the movable plate 214, and the other end passes through the mounting seat 212 and is connected to the output shaft of the motor 213 through a synchronous pulley assembly. The lifting plate 217 is connected to the nut of the lead screw 216. The motor 213 drives the lead screw 216 to rotate through the synchronous pulley assembly, thereby realizing the lifting and lowering movement of the lifting plate 217.

[0062] One end of the four second pillars 219 is fixed to the lifting plate 217 and is close to the four corners of the lifting plate 217. The other ends of the four second pillars 219 pass through the second self-lubricating bearings in the moving plate 214 and are connected to the two fixed plates 218. During assembly, the four second pillars 219 pass through the mounting platform 1, so that the four bins 2110 and the material discharge assembly 2111 are located above the mounting platform, and one end of the first linear motor 221 is located between the four second pillars 219, ensuring that the first material tray is placed on the first tray 222.

[0063] Four material bins 2110 are arranged vertically in pairs on the inner side of each fixed plate 218 to form a rectangular shape for placing the first material tray.

[0064] The two discharge components 2111 each include a cylinder 2112, a push plate 2113, two linear guides 2114, and two discharge plates 2115. The cylinder 2112 is arranged on a fixed plate 218, the push plate 2113 is connected to the output end of the cylinder 2112, the two linear guides 2114 are arranged on the fixed plate 218 and are located on both sides of the cylinder 2112, and the two discharge plates 2115 are arranged at both ends of the push plate 2113 and are connected to the sliders of the linear guides 2114, so as to realize the storage and discharge of the first material tray. The motor 213 drives the lead screw 216 to rotate, and drives the four second pillars 219 to move up and down through the lifting plate 217, and then drives the two fixed plates 218 to move up and down, so that when the lifting plate 217 is at the highest point, the cylinder 2112 extends to make the first material tray be located on the discharge plate 2115, and when the lifting plate 217 is at the lowest point, the cylinder 2112 drives the discharge plate 2115 to retract so that the first material tray is located on the first tray 222.

[0065] In the present invention, the position where the first frame loading mechanism 21 places the first frame 51 on the first tray 222 is defined as the first frame loading position, the position where the first glue brushing mechanism 23 brushes glue on the first frame 51 is defined as the first glue brushing position, the position where the first moving mechanism 24 sucks the first material tray with the first frame 51 that has been glued is defined as the first transfer position, the first mounting mechanism 33 defines the position where the first chip 53, the second chip 54 and the first frame 51 are mounted on the chip mounting position, the chip glue brushing mechanism 35 defines the position where the first chip 53 and the second chip 54 are glued on the second glue brushing position, the position where the second moving mechanism 36 sucks the first material tray with the first chip 53, the second chip 54 and the first frame 51 that have been glued is defined as the second transfer position, and the second mounting mechanism 43 defines the position where the second frame 52 is placed on the first frame 51 as the frame mounting position.

[0066] The first conveying mechanism 22 includes a first linear motor 221 and a first tray 222. The first linear motor 221 is arranged on the mounting platform 1, and the first tray 222 is arranged on the first linear motor 221. The first tray 222 is used to place the first material tray, and is driven by the first linear motor 221 to reciprocate between the first frame loading position, the first glue brushing position, and the first transfer position; the first tray 222 includes a platform seat 2221, a tray 2222, two material tray clamps 2223 and two clamp cylinders 2224. The platform seat 2221 is arranged on the first linear motor 221, and the tray 2222 is arranged on the platform seat 2221. The upper surface of the tray 2222 is provided with a positioning hole that cooperates with the structure on the first material tray to position the first material tray. The adjacent two sides of the tray 2222 are provided with guarding edges, and the clamping cylinder 2224 is installed on the lower surface of the two sides of the tray 2222 without guarding edges. The output end of the clamping cylinder 2224 is connected to the tray clamping plate 2223, and the first tray is clamped or released by the extension and contraction of the cylinder.

[0067] The first glue brushing mechanism 23 is used to apply glue to the first frame 51 located at the first glue brushing position, and includes: a mounting frame 231, a glue brushing lifting assembly 232, a glue brushing translation assembly 233, a scraper assembly 234 and a glue brushing plate 235; the mounting frame 231 is fixed on the mounting platform 1, the glue brushing lifting assembly 232 is arranged on the mounting frame 231, and the glue brushing translation assembly 233 and the glue brushing plate 235 are both connected to the glue brushing lifting assembly 232 to achieve vertical movement. The scraper assembly 234 is connected to the glue brushing translation assembly 233, and the scraper of the scraper assembly 234 is located in the glue groove of the glue brushing plate 235. The glue brushing lifting assembly 232 drives the glue brushing translation assembly 232, the glue brushing plate 235 and the scraper assembly 234 to lift and lower together. The glue brushing translation assembly 233 drives the scraper assembly 234 to move back and forth in the glue groove to complete the glue brushing. At the bottom of the glue groove, a glue brushing hole is provided at a preset position, and the scraper assembly 234 brushes the glue onto the first frame 51 through the glue brushing hole.

[0068] The first moving mechanism 24 is configured to move the first material tray with the first frame 51 having the glue applied thereon from the first transfer position to the chip mounting device 3. The first moving mechanism 24 includes a translation component 241, a lifting component 242 and a grabbing component 243; the lifting component 242 is arranged on the translation component 241, and the grabbing component 243 is arranged on the lifting component 242. The translation component 241 drives the lifting component 242 to translate and then drives the grabbing component 243 to translate.

[0069] The translation assembly 241 includes a translation bracket 2411, a translation base plate 2412, a translation motor 2413, a translation pulley assembly 2414 and two translation guide rails 2415. The translation bracket 2411 is arranged on the mounting platform 1, the translation base plate 2412 is arranged on the translation bracket 2411, and the two translation guide rails 2415 are arranged on the translation base plate 2412 to provide guidance for translation movement. The translation pulley assembly 2414 is located between the two translation guide rails 2415, and includes two pulleys and a synchronous belt connected to the two pulleys. The translation motor 2413 is arranged at one end of the translation base plate 2412 close to the glue filling mechanism 25, the output end of the translation motor 2413 is connected to one of the pulleys in the translation pulley assembly 2414, and the other pulley is arranged at one end of the translation base plate 2412 away from the translation motor 2413. The translation motor 2413 drives the translation pulley assembly 2414 and then drives the lifting assembly 242 to move along the two translation guide rails 2415 .

[0070] The lifting assembly 242 includes a lifting motor 2421, a lifting fixed plate 2422, a lifting screw assembly 2423, a fixing block 2424, and two lifting guide rails 2425. The back of the lifting fixed plate 2422 is connected to the slider of the translation guide rail 2415, and is connected to the synchronous belt through the synchronous belt clamp plate to ensure synchronous movement with the translation assembly 241. The synchronous belt clamp plate includes an upper clamp plate and a lower clamp plate, one end of the upper clamp plate and the lower clamp plate is connected to the lifting fixed plate 2422, and the synchronous belt is fixed between the lifting fixed plates 242. The lifting motor 2421 is arranged on the upper part of the lifting fixed plate 2422, and the output shaft of the lifting motor 2421 is connected to one end of the lifting screw assembly 2423 through a coupling, and the lifting screw assembly 2423 is fixed to the lifting fixed plate 2422 through a bearing and a bearing seat. The two lifting rails 2425 are respectively arranged on both sides of the lifting screw assembly 2423, the fixing block 2424 is connected to the nut of the lifting screw assembly 2423, and the two ends of the fixing block 2424 are connected to the sliders of the lifting rails 2425. The lifting motor 2421 drives the lifting screw assembly 2423 and then drives the fixing block 2424 to move up and down on the two lifting rails 2425.

[0071] The grabbing assembly 243 includes a connecting beam 2431, an H-shaped plate 2432, and a pneumatic suction cup group 2433 arranged on the H-shaped plate 2432. The connecting beam 2431 is connected to the fixing block 2424, the H-shaped plate 2432 is arranged on the lower surface of the connecting beam 2431, and the pneumatic suction cup group 2433 is arranged on the two vertical sides at both ends of the H-shaped plate 2432.

[0072] In this embodiment, a glue replenishing mechanism 25 is further provided on the side of the mounting frame 231 away from the first glue brushing mechanism 23, and the glue replenishing mechanism includes a detection camera 251, a glue dispensing assembly 252, a distance sensor 253, a camera lifting assembly 254, and a glue replenishing linear motor 255. The glue replenishing linear motor 255 is arranged on the mounting frame 231, the camera lifting assembly 254 is arranged on the glue replenishing linear motor 255, and the detection camera 251, the glue dispensing assembly 252 and the distance sensor 253 are connected to the camera lifting assembly 254 through the glue dispensing mounting seat 256. The glue dispensing assembly 252 is arranged between the detection camera 251 and the distance sensor 253, and the detection camera 251 is used to detect whether the glue brushing of the first frame 51 is qualified, or whether there is a position where the glue is not brushed. The distance measuring sensor 253 measures the distance between the position of the first frame 51 where glue is required and the glue dispensing component 252. The glue dispensing component 252 fills the position of the first frame 51 where glue is not applied or is unqualified according to the position detected by the detection camera 251 and the measured distance of the distance measuring sensor 253.

[0073] The chip mounting device 3 is disposed at the end of the first tray loading and gluing device 2, and the end of the first tray loading and gluing device 2 is an end away from the first frame loading mechanism 21. The chip mounting device 3 is configured to provide the first chip 53 and the second chip 54, respectively glue the first chip 53 and the second chip 54 to the corresponding positions of the first frame 51 pre-glued, apply glue to the outer surfaces of the first chip 53 and the second chip 54 after gluing, and transport the first chip 53, the second chip 54 and the first frame 51 that have been glued and glued to the next process.

[0074] The chip mounting device 3 comprises: a second conveying mechanism 31 , a chip loading mechanism 32 , a first mounting mechanism 33 , an image detection mechanism 34 , a chip glue brushing mechanism 35 and a second moving mechanism 36 .

[0075] The second conveying mechanism 31 has the same structure as the first moving mechanism 24 and is located on the same straight line as the first moving mechanism 24, and includes: a second linear motor and a second tray, the second tray is used to place the first material tray with the first frame 51; the second linear motor drives the second tray and then drives the first material tray to move back and forth between the chip mounting position, the second glue brushing position and the second transfer position. The structure of the second tray is the same as that of the first tray 222, and will not be described in detail here.

[0076] The chip loading mechanism 32 is configured to load the first chip 53 and the second chip 54, and can drive the first chip 53 and the second chip 54 to move in two orthogonal directions. The chip loading mechanism 32 includes: a third conveying mechanism 321, a first vibration loading mechanism 322 and a second vibration loading mechanism 323, a first picking mechanism 324 and a second picking mechanism 325.

[0077] The third conveying mechanism 321 is arranged in parallel with the second conveying mechanism 31, and the third conveying mechanism 321 comprises two third linear motors 3211 arranged opposite to each other, two electric slides 3212, a first chip tray 3213 and a second chip tray 3214. The two electric slides 3212 are respectively arranged on each third linear motor 3211, and the movement directions of the two electric slides 3212 are perpendicular to the running directions of the two third linear motors 3211; the first chip tray 3213 and the second chip tray 3214 are respectively arranged on each electric slide 3212.

[0078] The first vibration loading mechanism 322 is used to sort the first chip 53 in a preset direction; the second vibration loading mechanism 323 is used to sort the second chip 54 in a preset direction; the first picking mechanism 324 and the second picking mechanism 325 have the same structure, and are used to pick up the first chip 53 and the second chip 54 respectively, and place the first chip 53 and the second chip 54 on the first chip tray 3213 and the second chip tray 3214 respectively.

[0079] The first material picking mechanism 324 and the second material picking mechanism 325 each include a bracket 3241, a material picking motor 3242, a motor mounting plate 3243, a motor cover 3247, a drive pulley assembly 3244, a connecting rod assembly 3245 and a pneumatic suction nozzle 3246. The bracket 3241 is fixed on the mounting platform 1 across the third conveying mechanism 321. The motor mounting plate 3243 is arranged on the bracket 3241, and the motor cover 3247 covers the material picking motor 3242 and is connected to the motor mounting plate 3243 and the bracket 3241. The fixed end of the material picking motor 3242 is connected to the motor mounting plate 3243. The output end of the material picking motor 3242 is connected to one end of the drive pulley assembly 3244, and the other end of the drive pulley assembly 3244 is connected to the connecting rod assembly 3245, and the pneumatic suction nozzle 3246 is arranged on the connecting rod assembly 3245. The picking motor 3242 drives the transmission pulley assembly 3244 to drive the connecting rod assembly 3245 to move, and then places the first chip 53 or the second chip 54 sucked by the pneumatic suction nozzle 3246 on the first chip tray 3213 or the second chip tray 3214.

[0080] The first mounting mechanism 33 includes a contact recognition camera 333 and a chip moving assembly. The contact recognition camera 333 is used to recognize and record the position coordinates of the contact points of the first frame 51 in contact with the gate of the first chip 53. The chip moving assembly is configured to move the first chip 53 or the second chip 54 to the chip mounting position and place the first chip 53 or the second chip 54 at the corresponding position of the first frame 51. The chip moving assembly includes a transverse movement mechanism 331 and a picking mechanism 332 arranged on the transverse movement mechanism. The transverse movement mechanism 331 includes a transverse movement fixing frame 3311 and a transverse movement linear motor 3312. The transverse movement fixing frame 3311 is fixed to the mounting platform 1 across the second conveying mechanism 31 and the third conveying mechanism 321, and the transverse movement fixing frame 3311 is located between the first material picking mechanism 324 and the second material picking mechanism 325. The picking mechanism 332 includes a mounting base plate 3321 and a suction assembly 3322. The mounting base plate 3321 is arranged on the transverse movement linear motor 3312, and the suction assembly 3322 is arranged on the mounting base plate 3321. There are multiple suction heads in the suction assembly 3322, and the suction heads are configured to be rotatable 360 ​​degrees around their own axis and to be movable up and down along the axis.

[0081] When the suction component 3322 picks up the first chip 53, the first chip 53 is moved to the top of the first frame 51 by the transverse movement mechanism 331, and the contact recognition camera 333 recognizes and records the position coordinates of the contacts of the first frame 51 and the gate of the first chip 53. The suction head matches the position of the contacts of the gate of the first chip 53 and the first frame 51 according to the position coordinates of the contacts recognized by the contact recognition camera 333 and the position of the gate of the first chip 53 detected by the image detection mechanism 34, and mounts the first chip 53 on the first frame 51.

[0082] The image detection mechanism 34 is located between the second transmission mechanism 31 and the third transmission mechanism 321, and is configured to detect the position of the gate of the first chip 53. The image detection mechanism 34 includes a light source assembly 341, a camera 342, a reflector assembly 343 and a camera bracket 344. The camera 342 is arranged on the camera bracket 344. The reflector assembly 343 is arranged opposite to the camera 342. The reflector assembly 343 includes a reflector frame and a reflector. The reflector is arranged at 45 degrees to the camera. A light-transmitting hole is provided on the reflector frame. The light source assembly 341 is connected to the camera bracket 344, and the light source of the light source assembly 341 is irradiated onto the reflector of the radiation mirror assembly 343, and the imaging of the camera 342 is realized through the reflector.

[0083] The chip glue brushing mechanism 35 is used to apply glue to the first chip 53 and the second chip 54 mounted on the first frame 51; the chip glue brushing mechanism 35 has the same structure as the first glue brushing mechanism 23 and will not be described in detail here.

[0084] The second moving mechanism 36 is configured to move the first tray containing the first chip 53, the second chip 54 and the first frame 51 after the glue is applied from the second transfer position to the second frame mounting device 4. The second moving mechanism 36 has the same structure as the first moving mechanism 24 and will not be described in detail here.

[0085] The second frame mounting device 4 is arranged at the end of the chip mounting device 3, and the end of the chip mounting device 3 is an end away from the first tray loading and gluing device 2. The second frame mounting device 4 is configured to provide a second frame 52, mount the second frame 52 with the first chip 53, the second chip 54 and the first frame 51, and complete the unloading of the mounted semiconductor device 5.

[0086] The second frame mounting device 4 includes: a fourth conveying mechanism 41, a second tray transmission mechanism 42, a second mounting mechanism 43 and a mounting unloading mechanism 44. The fourth conveying mechanism 41 is located on the same straight line as the first conveying mechanism 22. The fourth conveying mechanism 41 includes a fourth linear motor and a third tray, and the third tray is used to place the first tray. The fourth linear motor drives the third tray and then drives the first tray to move between the frame mounting position and the unloading position. The third tray has the same structure as the first tray 222, and will not be described in detail here.

[0087] The second material tray transmission mechanism 42, the second material tray transmission mechanism 42 is arranged in parallel with the fourth transmission mechanism 41, the second frame 52 is pre-installed on the second material tray, the second material tray transmission mechanism 42 is constructed to provide the second frame 52 and complete the unloading of the second material tray; the second material tray transmission mechanism 42 includes a fifth transmission mechanism 421, a second frame loading mechanism 422, and a second frame unloading mechanism 423; the structure of the second frame loading mechanism 422 and the second frame unloading mechanism 423 is the same as that of the first frame loading mechanism 21, and are respectively arranged at both ends of the fifth transmission mechanism 421.

[0088] The second mounting mechanism 43 is arranged at the frame mounting position, and the second mounting mechanism 43 is connected to the mounting platform 1 across the fourth conveying mechanism 41 and the second tray conveying mechanism 42. The second mounting mechanism 43 has the same structure as the first mounting mechanism 33, and is used to place the second frame 52 at the corresponding position of the first frame 51.

[0089] The mounting and unloading mechanism 44 is arranged at the unloading position. The mounting and unloading mechanism 44 has the same structure as the first frame loading mechanism 21 and is used for unloading the mounted semiconductor devices 5 .

[0090] A semiconductor device flip chip assembly method is implemented using the above-mentioned semiconductor device flip chip mounting equipment, the semiconductor device includes a first frame 51, a second frame 52, a first chip 53 and a second chip 54; the specific steps are as follows:

[0091] S1. Place the first frame 51 on the first material tray, and place the first material tray equipped with the first frame 51 on the first frame loading mechanism 21 of the first material tray loading and gluing device 2.

[0092] S2. The first frame loading mechanism 21 places the first tray on the first tray 222 of the first conveying mechanism 22 of the first tray loading and gluing device 2, and the first conveying mechanism 22 conveys the first tray to the first gluing position, and the first gluing mechanism 23 of the first tray loading and gluing device 2 applies glue to the first frame 51;

[0093] S3. The first conveying mechanism 22 transports the first frame 51 that has been brushed with glue to the glue filling mechanism 25 of the first material tray loading and glue coating device 2; the glue dispensing component 252 of the glue filling mechanism 25 fills the unqualified positions of the first frame 51 with glue according to the unqualified positions detected by the detection camera 251 of the glue filling mechanism 25 and the measured distance of the distance measuring sensor 253 of the glue filling mechanism 25, and the first conveying mechanism 22 transports the first frame 51 that has been brushed with glue to the first transfer position.

[0094] S4. The first moving mechanism 24 of the first tray loading and gluing device 2 moves the first frame 51 located at the first transfer position to the second conveying mechanism 31 of the chip mounting device 3.

[0095] S5. The first vibration loading mechanism 322 and the second vibration loading mechanism 323 of the chip mounting device 3 respectively sort the first chip 53 and the second chip 54 in a preset direction.

[0096] S6. The first picking mechanism 324 and the second picking mechanism 325 of the chip mounting device 3 place the first chip 53 and the second chip 54 on the first chip tray 3213 and the second chip tray 3214 respectively.

[0097] S7 . The image detection mechanism 34 of the chip mounting device 3 detects the position of the gate of the first chip 53 .

[0098] S8. The first mounting mechanism 33 of the chip mounting device 3 picks up the first chip 53 and the second chip 54 respectively and moves them to the chip mounting position, and the contact recognition camera 333 of the first mounting mechanism 33 first recognizes and records the position coordinates of the contacts where the first frame 51 contacts the gate of the first chip 53, and then the picking mechanism 332 of the first mounting mechanism 33 mounts the gate of the first chip 53 and the contacts of the first frame 51.

[0099] S9. The second conveying mechanism 31 conveys the first frame 51, the first chip 53 and the second chip 54 that have been mounted to the second glue application position, and the chip glue application mechanism 35 of the chip mounting device 3 applies glue to the first chip 53 and the second chip 54.

[0100] S10. The second moving mechanism 36 of the chip mounting device 3 transports the first frame 51 , the first chip 53 and the second chip 54 after being coated with glue to the fourth transport mechanism 41 of the second frame mounting device 4 located at the second transfer position.

[0101] S11. The second tray transmission mechanism 42 of the second frame mounting device 4 completes the loading of the second frame 52, and then the second mounting mechanism 43 of the second frame mounting device 4 mounts the second frame 52 with the first frame 51, the first chip 53 and the second chip 54.

[0102] S12. The mounting and unloading mechanism 44 of the second frame mounting device 4 unloads the mounted semiconductor devices 5.

[0103] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor device flip chip placement device, characterized in that: include: Mounting platform (1); A first material tray loading and gluing device (2) is arranged on the mounting platform (1); the first material tray loading and gluing device (2) is configured to provide a first frame (51), apply glue to the first frame (51), and transport the first frame (51) to the next process; A chip mounting device (3) is arranged at the end of the first material tray feeding and gluing device (2); the chip mounting device (3) is configured to provide a first chip (53) and a second chip (54), respectively gluing the first chip (53) and the second chip (54) to corresponding positions of the first frame (51) pre-glued, applying glue to the outer surfaces of the first chip (53) and the second chip (54) after gluing, and transporting the first chip (53), the second chip (54) and the first frame (51) that have been glued and glued to the next process; A second frame mounting device (4) is arranged at the end of the chip mounting device (3), the second frame mounting device (4) being configured to provide a second frame (52), mount the second frame (52) with the first chip (53), the second chip (54) and the first frame (51), and complete the blanking of the mounted second frame (52), the first chip (53), the second chip (54) and the first frame (51); Wherein, the first tray feeding and gluing device (2) comprises: A first conveying mechanism (22) comprises a first linear motor (221) and a first tray (222), wherein the first tray (222) is used to carry a first material tray, and the first linear motor (221) drives the first tray (222) to thereby drive the first material tray to reciprocate between a first frame loading position, a first glue brushing position, and a first transfer position; A first frame loading mechanism (21) configured to place the first material tray equipped with the first frame (51) onto the first tray (222); A first glue brushing mechanism (23) for brushing glue on the first frame (51) located at the first glue brushing position; A first moving mechanism (24) is disposed at the first transfer position and is configured to move the first material tray containing the first frame (51) on which glue is applied from the first transfer position to the chip mounting device (3); The semiconductor device flip chip mounting equipment further comprises a glue filling mechanism (25), wherein the glue filling mechanism (25) is arranged on a mounting frame (231) of the first glue brushing mechanism (23) and is arranged away from the first glue brushing mechanism (23); the glue filling mechanism (25) is configured to perform visual inspection on the glue brushing quality of the first frame (51), measure the vertical distance between the glue filling mechanism (25) and the glue filling position of the first frame (51), and fill glue at the position on the first frame (51) where glue is not brushed or is unqualified.

2. The semiconductor device flip chip mounting equipment according to claim 1, characterized in that: The first frame feeding mechanism comprises: Support frame (211); A mounting seat (212) is arranged on the supporting frame (211); The motor (213) is fixed on the mounting seat (212) via a motor mounting plate A movable plate (214) connected to the mounting seat (212) via four first pillars (215); A lead screw (216), one end of which is connected to the movable plate (214), and the other end of which passes through the mounting seat (212) and is connected to the output shaft of the motor (213) via a synchronous pulley assembly, for transmitting power to achieve lifting motion; A lifting plate (217), the lifting plate (217) being located between the moving plate (214) and the mounting seat (212), being connected to the four first pillars (215) via a first self-lubricating bearing, and being connected to the nut of the lead screw (216), and moving up and down on the four first pillars (215) as the lead screw (216) rotates; Two fixed plates (218) are connected to the lifting plate (217) via four second pillars (219); the movable plate (214) is connected to the four second pillars (219) via a second self-lubricating bearing; Four material bins (2110), arranged vertically in pairs on the inner side of each of the fixing plates (218) to form a rectangular shape, for accommodating the first material trays; Two material discharge assemblies (2111), each comprising a cylinder (2112), a push plate (2113), two linear guide rails (2114) and two material discharge plates (2115); the cylinder (2112) is arranged on the fixed plate (218); the push plate (2113) is connected to the output end of the cylinder (2112); the two linear guide rails (2114) are arranged on the fixed plate (218) and are located on both sides of the cylinder (2112); the two material discharge plates (2115) are arranged at both ends of the push plate (2113) and are connected to the sliders of the two linear guide rails (2114), so as to realize the storage and discharge of the first material tray; The motor (213) drives the lead screw (216) to rotate, and drives the four second pillars (219) to move up and down through the lifting plate (217), thereby driving the fixed plate (218) to move up and down, so that when the lifting plate (217) is at the highest point, the cylinder (2112) extends so that the first material tray is located on the discharge plate (2115); and when the lifting plate (217) is at the lowest point, the cylinder (2112) drives the discharge plate (2115) to retract so that the first material tray is located on the first tray (222).

3. The semiconductor device flip chip mounting equipment according to claim 1, characterized in that: The first moving mechanism (24) comprises a translation component (241), a lifting component (242) and a gripping component (243); the gripping component (243) is arranged on the lifting component (242), the translation component (241) drives the lifting component (242) to translate and thereby drives the gripping component (243) to move; the gripping component (243) comprises an H-shaped plate (2432) and a pneumatic suction cup group (2433) arranged on the H-shaped plate (2432), and the pneumatic suction cup group (2433) is arranged on two vertical sides of the H-shaped plate (2432).

4. The semiconductor device flip chip mounting equipment according to claim 1, characterized in that: The chip mounting device (3) comprises: a second conveying mechanism (31), the second conveying mechanism (31) being located on the same straight line as the first conveying mechanism (22), comprising a second linear motor and a second tray, the second tray being used to place the first material tray; the second linear motor drives the second tray and thereby drives the first material tray to reciprocate between a chip mounting position, a second glue brushing position and a second transfer position; A chip loading mechanism (32) is configured to complete loading of the first chip (53) and the second chip (54), and drive the first chip (53) and the second chip (54) to move in two orthogonal directions; A first mounting mechanism (33) is arranged at the chip mounting position, comprising a contact recognition camera (333) and a chip moving component; the contact recognition camera (333) is used to recognize and record the position coordinates of the contact points of the first frame (51) in contact with the gate of the first chip (53); the chip moving component is configured to move the first chip (53) or the second chip (54) to the chip mounting position, and place the first chip (53) or the second chip (54) at a corresponding position of the first frame (51); An image detection mechanism (34) configured to detect the position of the gate of the first chip (53); A chip glue brushing mechanism (35) is arranged at the second glue brushing position and is used to brush glue on the first chip (53) and the second chip (54) mounted on the first frame (51); The second moving mechanism (36) is arranged at the second transfer position and is configured to move the first chip (53), the second chip (54) and the first frame (51) that have been glued from the second transfer position to the second frame mounting device (4).

5. The semiconductor device flip chip mounting equipment according to claim 4, characterized in that: The chip loading mechanism (32) comprises: a third conveying mechanism (321), the third conveying mechanism (321) being arranged in parallel with the second conveying mechanism (31), the third conveying mechanism (321) comprising two third linear motors (3211) arranged opposite to each other, two electric slides (3212), a first chip tray (3213) and a second chip tray (3214); the two electric slides (3212) being arranged on each of the third linear motors (3211), respectively, and the movement direction of the two electric slides (3212) being perpendicular to the running direction of the two third linear motors (3211); the first chip tray (3213) and the second chip tray (3214) being arranged on each of the electric slides (3212); A first vibration loading mechanism (322) and a second vibration loading mechanism (323); wherein the first vibration loading mechanism (322) is used to sort the first chips (53) in a preset direction; and the second vibration loading mechanism (323) is used to sort the second chips (54) in a preset direction; The first picking mechanism (324) and the second picking mechanism (325) have the same structure and are used to pick up the first chip (53) and the second chip (54) respectively, and place the first chip (53) and the second chip (54) on the first chip tray (3213) and the second chip tray (3214) respectively; the first picking mechanism (324) and the second picking mechanism (325) both include a bracket (3241), a picking motor (3242), a motor mounting plate (3243), a transmission pulley assembly (3244), a connecting rod assembly (3245) and a pneumatic suction nozzle (3246); the bracket (3241) is fixed on the mounting platform (1) across the third conveying mechanism (321); the motor mounting plate (3243) The picking motor (3242) is arranged on the bracket (3241), and the fixed end of the picking motor (3242) is connected to the motor mounting plate (3243); the output end of the picking motor (3242) is connected to one end of the transmission pulley assembly (3244), and the other end of the transmission pulley assembly (3244) is connected to the connecting rod assembly (3245), and the pneumatic suction nozzle (3246) is arranged on the connecting rod assembly (3245); the picking motor (3242) drives the transmission pulley assembly (3244) to drive the connecting rod assembly (3245) to move, thereby placing the first chip (53) or the second chip (54) sucked by the pneumatic suction nozzle (3246) on the first chip tray (3213) or the second chip tray (3214).

6. The semiconductor device flip chip mounting equipment according to claim 5, characterized in that: The chip moving component includes a transverse movement mechanism (331) and a picking mechanism (332) arranged on the transverse movement mechanism (331), the transverse movement mechanism (331) includes a transverse movement fixed frame (3311) and a transverse movement linear motor (3312), the transverse movement fixed frame (3311) straddles the second conveying mechanism (31) and the third conveying mechanism (321) and is fixed to the installation platform (1), and the transverse movement fixed frame (3311) is located between the first picking mechanism (324) and the second picking mechanism (325); the picking mechanism (332) includes a mounting base plate (3321) and a suction component (3322), the mounting base plate (3321) is arranged on the transverse movement linear motor (3312), and the suction component (3322) is arranged on the mounting base plate (3321).

7. The semiconductor device flip chip mounting equipment according to claim 4, characterized in that: The second frame mounting device (4) comprises: a fourth conveying mechanism (41), the fourth conveying mechanism (41) and the first conveying mechanism (22) being located on the same straight line; the fourth conveying mechanism (41) comprising a fourth linear motor and a third tray, the third tray being used to place the first material tray; the fourth linear motor drives the third tray and thereby drives the first material tray to move between a frame mounting position and a material unloading position; a second material tray transmission mechanism (42), the second material tray transmission mechanism (42) being arranged in parallel with the fourth transmission mechanism (41), the second material tray transmission mechanism (42) being configured to provide a second frame (52) and complete unloading of the second material tray; a second mounting mechanism (43) disposed at the frame mounting position, the second mounting mechanism (43) crossing the fourth conveying mechanism (41) and the second tray conveying mechanism (42) and connected to the mounting platform (1); the second mounting mechanism (43) has the same structure as the first mounting mechanism (33) and is used to place the second frame (52) at a corresponding position of the first frame (51); A mounting and unloading mechanism (44) is arranged at the unloading position, and the mounting and unloading mechanism (44) has the same structure as the first frame loading mechanism (21), and is used to unload the mounted first frame (51), the second frame (52), the first chip (53), and the second chip (54).

8. The semiconductor device flip chip mounting equipment according to claim 7, characterized in that: The second material tray transmission mechanism (42) comprises a fifth transmission mechanism (421), a second frame loading mechanism (422), and a second frame unloading mechanism (423); the structures of the second frame loading mechanism (422) and the second frame unloading mechanism (423) are the same as those of the first frame loading mechanism (21), and are respectively arranged at two ends of the fifth transmission mechanism (421).

9. A method for assembling a semiconductor flip chip, implemented by using the semiconductor flip chip mounting device of any one of claims 1 to 8, wherein the semiconductor device (5) comprises a first frame (51), a second frame (52), a first chip (53) and a second chip (54); characterized in that: The specific steps are as follows: S1. placing the first frame (51) on the first material tray, and placing the first material tray equipped with the first frame (51) on the first frame loading mechanism (21) of the first material tray loading and gluing device (2); S2. The first frame loading mechanism (21) places the first material tray on the first tray (222) of the first conveying mechanism (22) of the first material tray loading and gluing device (2), and the first conveying mechanism (22) conveys the first material tray to the first gluing position, and the first gluing mechanism (23) of the first material tray loading and gluing device (2) applies glue to the first frame (51); S3. The first conveying mechanism (22) conveys the first frame (51) after being brushed with glue to the glue filling mechanism (25) of the first material tray loading and glue coating device (2); the glue dispensing component (252) of the glue filling mechanism (25) fills the unbrushed or unqualified positions of the first frame (51) according to the unqualified positions detected by the detection camera (251) of the glue filling mechanism (25) and the measured distance of the distance measuring sensor (253) of the glue filling mechanism (25), and the first conveying mechanism (22) conveys the first frame (51) after being brushed with glue to the first transfer position; S4. The first moving mechanism (24) of the first tray loading and gluing device (2) moves the first frame (51) located at the first transfer position to the second conveying mechanism (31) of the chip mounting device (3); S5. The first vibration loading mechanism (322) and the second vibration loading mechanism (323) of the chip mounting device (3) respectively sort the first chip (53) and the second chip (54) in a preset direction; S6. The first picking mechanism (324) and the second picking mechanism (325) of the chip mounting device (3) place the first chip (53) and the second chip (54) on the first chip tray (3213) and the second chip tray (3214), respectively; S7. The image detection mechanism (34) of the chip mounting device (3) detects the position of the gate of the first chip (53); S8. The first mounting mechanism (33) of the chip mounting device (3) picks up the first chip (53) and the second chip (54) respectively and moves them to the chip mounting position; the contact recognition camera (333) of the first mounting mechanism (33) first recognizes and records the position coordinates of the contact points where the first frame (51) contacts the gate of the first chip (53); and the picking mechanism (332) of the first mounting mechanism (33) mounts the first chip (53) on the first frame (51); S9. The second conveying mechanism (31) conveys the first frame (51), the first chip (53) and the second chip (54) that have been mounted to a second glue application position, and the chip glue application mechanism (35) of the chip mounting device (3) applies glue to the first chip (53) and the second chip (54); S10. The second moving mechanism (36) of the chip mounting device (3) transports the first frame (51), the first chip (53) and the second chip (54) coated with glue to the fourth transport mechanism (41) at the second transfer position of the second frame mounting device (4); S11. The second tray transmission mechanism (42) of the second frame mounting device (4) completes loading of the second frame (52), and then the second mounting mechanism (43) of the second frame mounting device (4) mounts the second frame (52) with the first frame (51), the first chip (53) and the second chip (54); S12. The mounting and unloading mechanism (44) of the second frame mounting device (4) unloads the mounted semiconductor device (5).

Images