Novel semiconductor device copper sheet bonding equipment and assembly method thereof

Abstract

The present invention relates to the field of semiconductor manufacturing technology, and in particular to a novel copper sheet bonding device for semiconductor devices and an assembly method thereof. The mounting equipment includes: a mounting platform, a tray loading and gluing device, and a jumper mounting and unloading device; the tray loading and gluing device is configured to provide a copper frame mounted with a first chip and a second chip, apply glue to the two pins of the copper frame, the source of the first chip and the second chip, apply glue to the gate of the first chip, and transport it to the next process; the jumper mounting and unloading device is used to mount the first jumper and the second jumper to the corresponding positions of the first chip, the second chip and the copper frame, and complete the unloading. The advantage of the present invention is that by using the copper frame as a substrate and using copper sheet clips to interconnect the power semiconductor chip electrodes with the copper frame lead pins, compared with the traditional wire bonding process, copper sheet bonding can significantly reduce chip damage and increase chip carrying power.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor manufacturing, and in particular to a novel semiconductor device copper sheet bonding device and an assembly method thereof. Background Art

[0002] Power semiconductor devices are core components of modern power transformation devices. At present, the voltage and current levels and reliability of domestic power semiconductor devices are relatively low. High-end industries such as rail transit and new energy vehicles require ultra-high voltage, high current, and high reliability high-power semiconductor devices, which are completely monopolized by foreign products, posing a huge hidden danger to the safety of industrial development.

[0003] Mastering advanced design technology, process technology and equipment is the key for foreign semiconductor companies to stay ahead. Advanced copper sheet bonding method is the core technology for high-power semiconductor device packaging. Domestic power semiconductor devices still generally use wire bonding, which limits the improvement of device carrying power and reliability.

[0004] Researching and developing high-precision copper sheet bonding equipment for power semiconductor devices, breaking through key technologies and forming product applications will help master advanced packaging and testing technologies for power semiconductor devices, improve the performance of domestic power semiconductor devices, and have great market application potential and social benefits. Summary of the invention

[0005] In view of this, the present invention aims to provide a novel semiconductor device copper sheet bonding equipment and an assembly method thereof, which completes the assembly of flip-chips through a tray loading and gluing device, a jumper mounting and unloading device, and a second frame mounting device.

[0006] To achieve the above object, the technical solution created by the present invention is implemented as follows:

[0007] A novel semiconductor device copper sheet bonding device comprises: a mounting platform; a tray loading and glue coating device, which is arranged on the mounting platform; the tray loading and glue coating device is configured to provide a copper frame mounted with a first chip and a second chip, and to apply glue to two pins of the copper frame, a source of the first chip and a preset position of the second chip, and to apply glue to the gate of the first chip, and to transport the processed first chip, the second chip and the copper frame to the next process; a second conveying device, the second conveying device and the first conveying mechanism of the tray loading and glue coating device are located on the same straight line; the second conveying device comprises a second linear motor and a second tray, the second tray is used to carry a frame tray, the frame tray is equipped with a copper frame, a first chip and a second chip; the second linear motor drives the second tray and then drives the frame tray to reciprocate between a jumper mounting position and a material unloading position; A jumper loading device, the jumper loading device is configured to provide a first jumper and a second jumper, and drive the first jumper and the second jumper to move in two orthogonal directions; a jumper mounting device, the jumper mounting device includes a gate detection camera and a jumper mounting assembly; the gate detection camera is used to identify and locate the position of the gate located on the second conveying device; the jumper mounting assembly is configured to pick up the first jumper or the second jumper, and mount the first jumper with the gate and the pin of the corresponding gate, and mount the second jumper with the second chip, the source and the pin of the corresponding second chip; an image detection mechanism, the image detection mechanism is located between the jumper loading device and the second conveying device; image detection is used to identify the position of the contact of the first jumper picked up by the jumper mounting assembly; a feeding mechanism; the feeding mechanism feeds the mounted copper frame, the first chip, the second chip, the first jumper and the second jumper.

[0008] Furthermore, the tray loading and gluing device includes: a first conveying mechanism, including a first linear motor and a first tray, the first tray being used to carry a frame tray, on which a copper frame is placed; the first linear motor drives the first tray and then drives the frame tray to reciprocate between a frame loading position, a glue brushing position, a glue dispensing position and a transfer position; a frame loading mechanism, being configured to place a frame tray equipped with a copper frame, a first chip and a second chip on the first tray; a glue brushing mechanism, being arranged at the glue brushing position, being configured to apply glue to two pins of the copper frame, a source of the first chip and a preset position of the second chip; a glue dispensing mechanism, being arranged on the glue brushing mechanism and away from the frame loading mechanism, the glue dispensing mechanism being configured to perform glue dispensing on a gate of the first chip; a material moving mechanism, being arranged at the transfer position, being configured to move the frame tray equipped with the first chip, the second chip and the copper frame that have been glued and dispensed with glue from the transfer position to the second conveying device.

[0009] Furthermore, the frame feeding mechanism includes: a support frame; a mounting seat, which is arranged on the support frame; a motor, a movable plate fixed to the mounting seat through a motor mounting plate, and connected to the mounting seat through four first pillars; a lead screw, one end of which is fixed to the movable plate, and the other end passes through the mounting seat and is connected to the output shaft of the motor through a synchronous pulley assembly, for transmitting power to achieve lifting movement; a lifting plate, the lifting plate is located between the movable plate and the mounting seat, is connected to the four first pillars through a first lubricating bearing, and is connected to the nut of the lead screw, and moves up and down on the four first pillars as the lead screw rotates; two fixed plates are connected to the lifting plate through four second pillars, and the movable plate is connected to the four second pillars through a second self-lubricating bearing; four silos are arranged vertically in pairs. The inner side of the fixed plate is constructed into a rectangular shape for placing the frame material tray; the two discharge components each include a cylinder, a push plate, two linear guides and two discharge plates, the cylinder is arranged on the fixed plate, the push plate is connected to the output end of the cylinder, the two linear guides are arranged on the fixed plate and are located on both sides of the cylinder, the two discharge plates are arranged at both ends of the push plate and are connected to the sliders of the two linear guides, for realizing the storage and discharge of the frame material tray; the motor drives the lead screw to rotate, and drives the movable plate to move up and down through the lifting plate, thereby driving the fixed plate to move up and down; when the lifting plate is in the rising position, the cylinder extends to make the frame material tray located on the discharge plate; when the lifting plate is in the descending position, the cylinder drives the discharge plate to retract so that the frame material tray is located on the first tray.

[0010] Furthermore, the glue brushing mechanism includes: a mounting frame, a glue brushing lifting assembly, a glue brushing translation assembly, a scraper assembly and a glue brushing plate; the mounting frame is fixed on the mounting platform, the glue brushing lifting assembly is arranged on the mounting frame, the glue brushing translation assembly and the glue brushing plate are connected to the glue brushing lifting assembly through the glue brushing mounting plate to realize vertical movement; the scraper assembly is connected to the glue brushing translation assembly, and the scraper of the scraper assembly is located in the glue groove of the glue brushing plate; at the bottom of the glue groove, a glue brushing hole is provided at a preset position, and the scraper assembly brushes the glue onto the two pins of the copper frame, the source of the first chip and the preset position of the second chip through the glue brushing hole.

[0011] Furthermore, the glue dispensing mechanism is arranged on the mounting frame away from the glue brushing plate; the glue dispensing mechanism is configured to identify and locate the gate of the first chip, measure the vertical distance between the glue dispensing mechanism and the gate, and dispense glue to the gate.

[0012] Furthermore, the material moving mechanism includes a translation component, a lifting component and a grabbing component; the grabbing component is arranged on the lifting component, the translation component drives the lifting component to translate and then drives the grabbing component to move; the grabbing component includes an H-shaped plate and a pneumatic suction cup group arranged on the H-shaped plate, and the pneumatic suction cup group is arranged on the two vertical sides of the H-shaped plate.

[0013] Furthermore, the jumper wire feeding device includes: a third conveying mechanism, the third conveying mechanism is arranged in parallel with the second conveying mechanism, the third conveying mechanism includes two third linear motors, two electric slides, a first jumper wire tray and a second jumper wire tray which are arranged opposite to each other; two electric slides are respectively arranged on each third linear motor, and the movement direction of the two electric slides is perpendicular to the running direction of the third linear motor; the first jumper wire tray and the second jumper wire tray are respectively arranged on each electric slide; a first vibration feeding mechanism and a second vibration feeding mechanism; wherein the first vibration feeding mechanism is used to sort the first jumper wire according to a preset direction; the second vibration feeding mechanism is used to sort the second jumper wire according to a preset direction; a first picking mechanism and a second picking mechanism, the first picking mechanism and the second picking mechanism are combined The structures are the same, and are respectively used to pick up the first jumper wire and the second jumper wire, and place the first jumper wire and the second jumper wire on the first jumper wire tray and the second jumper wire tray, respectively; the first picking mechanism and the second picking mechanism both include a bracket, a picking motor, a motor mounting plate, a drive pulley assembly, a connecting rod assembly and a pneumatic suction nozzle; the bracket crosses the third conveying mechanism and is fixed on the mounting platform; the motor mounting plate is arranged on the bracket, and the fixed end of the picking motor is connected to the motor mounting plate; the output end of the picking motor is connected to one end of the drive pulley assembly, and the other end of the drive pulley assembly is connected to the connecting rod assembly, and the pneumatic suction nozzle is arranged on the connecting rod assembly; the picking motor drives the drive pulley assembly to drive the connecting rod assembly to move, and then the first jumper wire or the second jumper wire sucked by the pneumatic suction nozzle is placed on the first jumper wire tray or the second jumper wire tray.

[0014] Furthermore, the jumper wire mounting assembly includes a transverse movement mechanism and a picking mechanism arranged on the transverse movement mechanism, the transverse movement mechanism includes a transverse movement fixing frame and a transverse movement linear motor, the transverse movement fixing frame spans the second conveying device and the third conveying mechanism and is fixed to the mounting platform, and the transverse movement fixing frame is located between the first picking mechanism and the second picking mechanism; the picking mechanism includes a mounting base plate and a suction assembly, the mounting base plate is arranged on the transverse movement linear motor, the suction assembly is arranged on the mounting base plate, there are multiple suction heads in the suction assembly, and the suction heads are configured to rotate 360 ​​degrees around their own axes and move up and down along the axes to achieve the positioning of the contacts of the first jumper wire 84.

[0015] Furthermore, the unloading mechanism has the same structure as the frame loading mechanism and is used to unload the mounted copper frame, the first chip, the second chip, the first jumper wire and the second jumper wire.

[0016] A novel semiconductor device copper sheet bonding assembly method is implemented using the novel semiconductor device copper sheet bonding device, wherein the semiconductor device includes a copper frame, a first chip, a second chip, a first jumper wire, and a second jumper wire; the specific steps are as follows:

[0017] S1: placing the copper frame mounted with the first chip and the second chip on a frame tray, and placing the frame tray with the copper frame on a frame loading mechanism of a tray loading and gluing device.

[0018] S2: The frame loading mechanism places the frame material tray on the first tray of the first conveying mechanism of the material tray loading and gluing device, and the first conveying mechanism conveys the frame material tray to the glue brushing position, and the glue brushing mechanism of the material tray loading and gluing device brushes glue on the two pins of the copper frame, the source of the first chip and the preset position of the second chip.

[0019] S3: The first conveying mechanism transports the copper frame, the first chip and the second chip that have been brushed with glue to the glue dispensing mechanism of the material tray loading and glue coating device; the glue dispensing component of the glue dispensing mechanism fills the glue on the first chip, the second chip and the copper frame where glue is not brushed or is unqualified according to the unqualified positions detected by the detection camera of the glue dispensing mechanism and the measured distance of the distance measuring sensor of the glue dispensing mechanism.

[0020] S4: The first conveying mechanism moves the first chip, the second chip and the copper frame that have been glued from the glue dispensing position to the transfer position; the material tray loading and glue coating device's material moving mechanism moves the first chip, the second chip and the copper frame that have been glued from the transfer position to the second conveying device;

[0021] S5: The first vibration feeding mechanism and the second vibration feeding mechanism of the jumper wire feeding device respectively sort the first jumper wires and the second jumper wires according to a preset direction.

[0022] S6: The first picking mechanism and the second picking mechanism of the jumper loading device place the first jumper and the second jumper on the first jumper tray and the second jumper tray respectively.

[0023] S7: The jumper mounting device picks up the first jumper and moves it to the image detection mechanism. The image detection mechanism identifies the contact points of the first jumper and the gate, and mounts the first jumper, the gate and the pins of the corresponding gate.

[0024] S8: The jumper mounting device picks up the second jumper, and mounts the second jumper, the second chip, the source electrode, and the pins corresponding to the second chip.

[0025] S9: The second conveying device conveys the copper frame, the first chip, the second chip, the first jumper wire and the second jumper wire that have been mounted to the unloading mechanism.

[0026] S10: The unloading mechanism unloads the material.

[0027] Compared with the prior art, the invention can achieve the following beneficial effects: the invention uses the copper frame as a substrate through a tray loading and gluing device, a second conveying device, a jumper loading device, a jumper mounting device, an image detection mechanism and a unloading mechanism, and uses copper sheet bonding to interconnect the power semiconductor chip electrodes with the copper frame pins. Compared with the traditional wire bonding process, copper sheet bonding can significantly reduce chip damage and increase the chip carrying power. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The drawings constituting part of the present invention are used to provide a further understanding of the present invention. The exemplary embodiments and descriptions of the present invention are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0029] Figure 1 is a schematic structural diagram of a semiconductor device provided according to an embodiment of the present invention;

[0030] Figure 2 It is a schematic structural diagram of a novel copper sheet bonding device for semiconductor devices according to an embodiment of the present invention;

[0031] Figure 3 is a structural schematic diagram of a frame feeding mechanism provided according to an embodiment of the present invention;

[0032] Figure 4 is a structural schematic diagram of a first transmission mechanism provided according to an embodiment of the present invention;

[0033] Figure 5 is a schematic structural diagram of a first tray provided according to an embodiment of the present invention;

[0034] Figure 6 is a structural schematic diagram of a glue applying mechanism provided according to an embodiment of the present invention;

[0035] Figure 7 is a structural schematic diagram of a material transfer mechanism provided according to an embodiment of the present invention;

[0036] Figure 8 is a structural schematic diagram of a dispensing mechanism provided according to an embodiment of the present invention;

[0037] Fig. 9 is a structural schematic diagram of a jumper loading device provided according to an embodiment of the present invention;

[0038] Fig.10 is a schematic structural diagram of a third transmission mechanism provided according to an embodiment of the present invention;

[0039] Fig.11 is a schematic structural diagram of a first material picking mechanism without a motor cover provided according to an embodiment of the present invention;

[0040] Fig.12 is a structural schematic diagram of a jumper mounting device provided in an embodiment of the present invention;

[0041] Fig.13 It is a structural schematic diagram of an image detection mechanism provided according to an embodiment of the present invention.

[0042] The reference numerals include: 1, mounting platform; 2, tray loading and gluing device; 21, frame loading mechanism; 211, support frame; 212, mounting seat; 213, motor; 214, moving plate; 215, first pillar; 216, lead screw; 217, lifting plate; 218, fixed plate; 219, second pillar; 2110, silo; 2111, discharge assembly; 2112, cylinder; 2113, push plate; 2114, linear guide; 2115, discharge plate; 22, first conveying mechanism; 221, first linear motor; 222, first tray; 2221, platform seat; 2222, tray; 2223, tray clamp; 2224, clamp Plate cylinder; 23, glue brushing mechanism; 231, mounting frame; 232, glue brushing lifting assembly; 233, glue brushing translation assembly; 234, scraper assembly; 235, glue brushing plate; 24, material moving mechanism; 241, translation assembly; 2411, first translation bracket; 2412, translation bottom plate; 2413, translation motor; 2414, translation pulley assembly; 2415, translation guide rail; 242, lifting assembly; 2421, lifting motor; 2422, lifting fixed plate; 2423, lifting screw assembly; 2424, fixing block; 2425, first lifting guide rail; 243, grabbing assembly; 2431, connecting beam; 2432, H-type plate; 2433 , pneumatic suction cup assembly; 25, dispensing mechanism; 251, detection camera; 252, dispensing assembly; 253, distance sensor; 254, camera lifting assembly; 255, dispensing linear motor; 256, dispensing mounting seat;

[0043] 3. A second conveying device;

[0044] 4. Jumper loading device; 41. Third transmission mechanism; 411. Third linear motor; 412. Electric slide; 413. First jumper tray; 414. Second jumper tray; 42. First vibration loading mechanism; 43. Second vibration loading mechanism; 44. First picking mechanism; 441. Bracket; 442. Picking motor; 443. Motor mounting plate; 444. Driving pulley assembly; 445. Connecting rod assembly; 446. Pneumatic nozzle; 447. Motor cover; 45. Second picking mechanism;

[0045] 5. Jumper mounting device; 51. Transverse movement mechanism; 511. Transverse movement fixing frame; 512. Transverse movement linear motor; 52. Pick-up mechanism; 521. Mounting base plate; 522. Suction assembly; 53. Grid detection camera;

[0046] 6. Image detection mechanism; 61. Light source assembly; 62. Camera; 63. Reflector assembly; 64. Camera bracket;

[0047] 7. Unloading mechanism;

[0048] 8. semiconductor device; 81. copper frame; 82. first chip; 83. second chip; 84. first jumper wire; 85. second jumper wire. DETAILED DESCRIPTION

[0049] In order to make the purpose, technical solution and advantages of the invention more clear, the invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only used to explain the invention and do not constitute a limitation of the invention.

[0050] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0051] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0052] In the description of the invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the invention can be understood according to specific circumstances.

[0053] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0054] like Figure 1 , Figure 2 As shown, a novel semiconductor device copper sheet bonding device provided by an embodiment of the present invention, the semiconductor device 8 includes a copper frame 81, a first chip 82, a second chip 83, a first jumper 84 and a second jumper 85; the novel semiconductor device copper sheet bonding device is used to complete the bonding of the copper frame 81, the first chip 82, the second chip 83, the first jumper 84 and the second jumper 85. The novel semiconductor device copper sheet bonding device includes: a mounting platform 1, a tray feeding and gluing device 2, a second conveying device 3, a jumper feeding device 4, a jumper mounting device 5, an image detection mechanism 6 and a feeding mechanism 7.

[0055] The tray feeding and gluing device 2 comprises a frame feeding mechanism 21 , a first conveying mechanism 22 , a glue brushing mechanism 23 , a glue dispensing mechanism 25 and a material moving mechanism 24 .

[0056] like Figure 3 As shown, the frame loading mechanism 21 includes: a support frame 211, a mounting seat 212, a motor 213, a movable plate 214, four first pillars 215, a screw 216, a lifting plate 217, two fixed plates 218, four second pillars 219, four silos 2110, and a discharge assembly 2111.

[0057] The mounting seat 212 includes two L-shaped plates and a mounting plate. The horizontal plates of the two L-shaped plates are connected to the top of the support frame 211, the top surfaces of the vertical plates of the two L-shaped plates are connected to the bottom surface of the mounting plate, and the two L-shaped plates are arranged on both sides of the mounting plate back to back.

[0058] The motor 213 is fixed on the mounting plate of the mounting seat 212 via a motor mounting plate.

[0059] The lifting plate 217 is located between the movable plate 214 and the mounting seat 212. One end of the four first pillars 215 is fixed on the mounting plate of the mounting seat 212, and close to the four corners of the mounting plate. The other ends of the four first pillars 215 pass through the lifting plate 217 and are fixed to the movable plate 214. First self-lubricating bearings are respectively provided between the four first pillars 215 and the lifting plate 217.

[0060] One end of the lead screw 216 is connected to the output shaft of the motor 213 through a synchronous pulley assembly, and the other end is connected to the moving plate 214. The lifting plate 217 is connected to the nut of the lead screw 216. The motor 213 drives the lead screw 216 to rotate through the synchronous pulley assembly, thereby realizing the lifting movement of the lifting plate 217.

[0061] One end of the four second pillars 219 is fixed to the lifting plate 217 and is close to the four corners of the lifting plate 217. The other ends of the four second pillars 219 pass through the second self-lubricating bearing in the moving plate 214 and are connected to the two fixed plates 218. During assembly, the four second pillars 219 pass through the mounting platform 1, so that the four bins 2110 and the discharge assembly 2111 are located above the mounting platform, and one end of the first linear motor 221 is located between the four second pillars 219, ensuring that the frame tray is placed on the first tray 222.

[0062] Four silos 2110 are vertically arranged in pairs on the inner side of each fixed plate 218 to form a rectangular shape for placing frame trays.

[0063] The two discharge components 2111 each include a cylinder 2112, a push plate 2113, two linear guides 2114, and two discharge plates 2115. The cylinder 2112 is arranged on a fixed plate 218, the push plate 2113 is connected to the output end of the cylinder 2112, the two linear guides 2114 are arranged on the fixed plate 218 and are located on both sides of the cylinder 2112, and the two discharge plates 2115 are arranged at both ends of the push plate 2113 and are connected to the sliders of the linear guides 2114, so as to realize the storage and discharge of the frame material tray. The motor 213 drives the lead screw 216 to rotate, and drives the four second pillars 219 to move up and down through the lifting plate 217, and then drives the two fixed plates 218 to move up and down, so that when the lifting plate 217 is at the highest point, the cylinder 2112 extends to make the frame material tray located on the discharge plate 2115, and when the lifting plate 217 is at the lowest point, the cylinder 2112 drives the discharge plate 2115 to retract so that the frame material tray is located on the first tray 222.

[0064] The first conveying mechanism 22 includes a first linear motor 221 and a first tray 222. The first linear motor 221 is arranged on the mounting platform 1, and the first tray 222 is arranged on the first linear motor 221. The first tray 222 is used to place the frame tray, and is driven by the first linear motor 221 to reciprocate between the copper frame loading position at the frame loading mechanism 21, the glue brushing position at the glue brushing mechanism 23, and the transfer position where the material transfer mechanism 24 grabs the frame tray; the first tray 222 includes a platform seat 2221, a tray 2222, two tray clamps 2223 and two clamp cylinders 2224. The platform seat 2221 is arranged on the first linear motor 221, and the tray 2222 is arranged on the platform seat 2221. The upper surface of the tray 2222 is provided with a positioning hole that cooperates with the structure on the frame tray to position the frame tray. The adjacent two sides of the tray 2222 are provided with guarding edges, and the clamping cylinder 2224 is installed on the lower surface of the two sides of the tray 2222 without guarding edges. The output end of the clamping cylinder 2224 is connected to the tray clamping plate 2223, and the frame tray is clamped or released by the extension and contraction of the cylinder.

[0065] The glue brushing mechanism 23 is arranged at the glue brushing position, and is used for applying glue to the copper frame at the glue brushing position; it includes: a mounting frame 231, a glue brushing lifting assembly 232, a glue brushing translation assembly 233, a scraper assembly 234 and a glue brushing plate 235; the mounting frame 231 is fixed on the mounting platform 1, the glue brushing lifting assembly 232 is arranged on the mounting frame 231, and the glue brushing translation assembly 233 and the glue brushing plate 235 are both connected to the glue brushing lifting assembly 232 to achieve vertical movement. The scraper assembly 234 is connected to the glue brushing translation assembly 233, and the scraper of the scraper assembly 234 is located in the glue groove of the glue brushing plate 235. The glue brushing lifting assembly 232 drives the glue brushing translation assembly 233, the glue brushing plate 235 and the scraper assembly 234 to lift and lower together. The glue brushing translation assembly 233 drives the scraper assembly 234 to move back and forth in the glue groove to complete the glue brushing. At the bottom of the glue groove, glue brushing holes are provided at preset positions, and the scraper assembly 234 brushes the glue onto the two pins of the copper frame, the source of the first chip 82, and the preset positions of the second chip 83 through the glue brushing holes. In this embodiment, the scraper is a metal scraper made of stainless steel, with a flat blade shape, a sharp scraper edge, and the scraper and the glue brushing plate are set at 45° or 135°.

[0066] The glue dispensing mechanism 25 is arranged on the side of the mounting frame 231 away from the glue brushing plate 235, and the glue dispensing mechanism includes a detection camera 251, a glue dispensing assembly 252, a distance sensor 253, a camera lifting assembly 254 and a glue dispensing linear motor 255. The glue dispensing linear motor 255 is arranged on the mounting frame 231, the camera lifting assembly 254 is arranged on the glue dispensing linear motor 255, and the detection camera 251, the glue dispensing assembly 252 and the distance sensor 253 are connected to the camera lifting assembly 254 through the glue dispensing mounting seat 256. The glue dispensing assembly 252 is arranged between the detection camera 251 and the distance sensor 253, and the detection camera 251 is used to detect whether the glue brushing of the copper frame 81 is qualified, or whether there is a position where the glue is not brushed. The distance measuring sensor 253 measures the distance between the position on the copper frame 81 where glue is required and the glue dispensing component 252. The glue dispensing component 252 fills the unqualified position of the copper frame 81 with glue according to the unqualified position detected by the detection camera 251 and the measured distance of the distance measuring sensor 253.

[0067] The material transfer mechanism 24 is arranged at the transfer position and is configured to transfer the frame material tray containing the first chip 82, the second chip 83 and the copper frame 81 which have been glued and dispensed from the transfer position to the second conveyor 3. The material transfer mechanism 24 includes a translation component 241, a lifting component 242 and a grabbing component 243; the lifting component 242 is arranged on the translation component 241, the grabbing component 243 is arranged on the lifting component 242, and the translation component 241 drives the lifting component 242 to translate and then drives the grabbing component 243 to translate.

[0068] The translation assembly 241 includes a first translation bracket 2411, a translation base plate 2412, a translation motor 2413, a translation pulley assembly 2414 and two translation guide rails 2415. The first translation bracket 2411 is arranged on the mounting platform 1, the translation base plate 2412 is arranged on the first translation bracket 2411, and the two translation guide rails 2415 are arranged on the translation base plate 2412 to provide guidance for translation movement. The translation pulley assembly 2414 is located between the two translation guide rails 2415, and includes two pulleys and a synchronous belt connected to the two pulleys. The translation motor 2413 is arranged at one end of the translation base plate 2412 close to the first transmission mechanism 22, the output end of the translation motor 2413 is connected to one of the pulleys in the translation pulley assembly 2414, and the other pulley is arranged at one end of the translation base plate 2412 away from the translation motor 2413. The translation motor 2413 drives the translation pulley assembly 2414 and then drives the lifting assembly 242 to move along the two translation guide rails 2415 .

[0069] The lifting assembly 242 includes a lifting motor 2421, a lifting fixed plate 2422, a lifting screw assembly 2423, a fixing block 2424, and two first lifting guide rails 2425. The back of the lifting fixed plate 2422 is connected to the slider of the translation guide rail 2415, and is connected to the synchronous belt through the synchronous belt clamp plate to ensure synchronous movement with the translation assembly 241. The synchronous belt clamp plate includes an upper clamp plate and a lower clamp plate, one end of the upper clamp plate and the lower clamp plate is connected to the lifting fixed plate 2422, and the synchronous belt is fixed between the lifting fixed plates 242. The lifting motor 2421 is arranged on the upper part of the lifting fixed plate 2422, and the output shaft of the lifting motor 2421 is connected to one end of the lifting screw assembly 2423 through a coupling, and the lifting screw assembly 2423 is fixed to the lifting fixed plate 2422 through a bearing and a bearing seat. The two first lifting rails 2425 are respectively arranged on both sides of the lifting screw assembly 2423, the fixing block 2424 is connected to the nut of the lifting screw assembly 2423, and both ends of the fixing block 2424 are connected to the sliders of the first lifting rails 2425. The lifting motor 2421 drives the lifting screw assembly 2423 and then drives the fixing block 2424 to move up and down on the two first lifting rails 2425.

[0070] The grabbing assembly 243 includes a connecting beam 2431, an H-shaped plate 2432, and a pneumatic suction cup group 2433 arranged on the H-shaped plate 2432. The connecting beam 2431 is connected to the fixing block 2424, the H-shaped plate 2432 is arranged on the lower surface of the connecting beam 2431, and the pneumatic suction cup group 2433 is arranged on the two vertical sides of the H-shaped plate.

[0071] The second conveying device 3 has the same structure as the first conveying mechanism 22 and is located on the same straight line as the first conveying mechanism 22; it includes a second linear motor and a second tray, and the second tray is used to place the frame tray; the second linear motor drives the second tray and then drives the frame tray to reciprocate between the jumper mounting position at the jumper loading device 4 and the unloading position at the unloading mechanism 7. The structure of the second tray is the same as that of the first tray 222, and will not be described in detail here.

[0072] The jumper wire loading device 4 is configured to provide a first jumper wire 84 and a second jumper wire 85, and can drive the first jumper wire 84 and the second jumper wire 85 to move in two orthogonal directions; the jumper wire loading device 4 includes: a third conveying mechanism 41, a first vibration loading mechanism 42 and a second vibration loading mechanism 43, a first picking mechanism 44 and a second picking mechanism 45.

[0073] The third conveying mechanism 41 is arranged in parallel with the second conveying device 3, and the third conveying mechanism 41 comprises two third linear motors 411 arranged opposite to each other, two electric slides 412, a first jumper tray 413 and a second jumper tray 414. The two electric slides 412 are respectively arranged on each third linear motor 411, and the movement directions of the two electric slides 412 are perpendicular to the running directions of the two third linear motors 411; the first jumper tray 413 and the second jumper tray 414 are respectively arranged on each electric slide 412.

[0074] The first vibrating loading mechanism 42 is used to sort the first jumper wires 84 in a preset direction; the second vibrating loading mechanism 43 is used to sort the second jumper wires 85 in a preset direction; the first picking mechanism 44 and the second picking mechanism 45 have the same structure, and are used to pick up the first jumper wires 84 and the second jumper wires 85, respectively, and place the first jumper wires 84 and the second jumper wires 85 on the first jumper wire tray 413 and the second jumper wire tray 414, respectively.

[0075] The first material picking mechanism 44 and the second material picking mechanism 45 both include a bracket 441, a material picking motor 442, a motor mounting plate 443, a motor cover 447, a drive pulley assembly 444, a connecting rod assembly 445 and a pneumatic suction nozzle 446; the bracket 441 spans the third conveying mechanism 41 and is fixed on the mounting platform 1; the motor mounting plate 443 is arranged on the bracket 441, and the motor cover 447 covers the material picking motor 442 and is connected to the motor mounting plate 443 and the bracket 441. The fixed end of the picking motor 442 is connected to the motor mounting plate 443; the output end of the picking motor 442 is connected to one end of the transmission pulley assembly 444, the other end of the transmission pulley assembly 444 is connected to the connecting rod assembly 445, and the pneumatic suction nozzle 446 is set on the connecting rod assembly 445; the picking motor 442 drives the transmission pulley assembly 444 to drive the connecting rod assembly 445 to move, and then the first chip 82 or the second chip 83 sucked by the pneumatic suction nozzle 446 is placed on the first jumper tray 413 or the second jumper tray 414.

[0076] The jumper mounting device 5 includes a gate detection camera 53 and a jumper mounting assembly; the gate detection camera 53 is used to identify and locate the position of the gate, and the jumper mounting assembly is configured to pick up the first jumper 84 or the second jumper 85, and mount the first jumper 84 with the gate and the corresponding gate pins, and mount the second jumper 85 with the second chip 83, the source and the corresponding second chip 83 pins. The jumper wire mounting assembly includes a transverse movement mechanism 51 and a picking mechanism 52 arranged on the transverse movement mechanism 51, the transverse movement mechanism 51 includes a transverse movement fixing frame 511 and a transverse movement linear motor 512, the transverse movement fixing frame 511 spans the second conveying device 3 and the third conveying mechanism 41 and is fixed to the mounting platform 1, and the transverse movement fixing frame 511 is located between the first picking mechanism 44 and the second picking mechanism 45; the picking mechanism 52 includes a mounting base plate 521 and a suction assembly 522, the mounting base plate 521 is arranged on the transverse movement linear motor 512, the suction assembly 522 is arranged on the mounting base plate 521, the number of suction heads in the suction assembly 522 is multiple, and the suction heads are configured to be rotatable 360 ​​degrees around their own vertical axis and move up and down along the axis to achieve the positioning of the contacts of the first jumper wire 84.

[0077] When the suction component 522 picks up the first jumper 84, the first jumper 84 is moved to directly above the first chip 82 through the transverse movement mechanism 51, and the gate detection camera 53 detects the gate position of the first chip 82. The suction head rotates to correspond to the gate according to the gate position detected by the gate detection camera 53 and the contact position of the first jumper 84 and the gate mounting detected by the image detection mechanism 6, and mounts the first jumper 84 with the pins of the gate and the copper frame 81.

[0078] The image detection mechanism 6 is located between the jumper loading device 4 and the second conveying device 3; the image detection mechanism 6 is used to identify the contact point of the first jumper 84 and the gate. It includes a light source assembly 61, a camera 62, a reflector assembly 63 and a camera bracket 64. The camera 62 is set on the camera bracket 64. The reflector assembly 63 is arranged opposite to the camera 62. The reflector assembly 63 includes a reflector frame and a reflector. The reflector and the camera are set at 45 degrees. A light-transmitting hole is provided on the reflector frame. The light source assembly 61 is connected to the camera bracket 64, and the light source of the light source assembly 61 is illuminated on the reflector of the reflector assembly 63, and the imaging of the camera 62 is realized through the reflector.

[0079] The unloading mechanism 7 unloads the processed copper frame 81, the first chip 82, the second chip 83, the first jumper 84 and the second jumper 85. The unloading mechanism 7 has the same structure as the frame loading mechanism 21 and will not be described in detail here.

[0080] A novel semiconductor device copper sheet bonding assembly method is implemented using the novel semiconductor device copper sheet bonding device, wherein the semiconductor device includes a copper frame 81, a first chip 82, a second chip 83, a first jumper 84 and a second jumper 85; the specific steps are as follows:

[0081] S1: placing the copper frame 81 mounted with the first chip 82 and the second chip 83 on the frame tray, and placing the frame tray with the copper frame 81 on the frame loading mechanism 21 of the tray loading and gluing device 2.

[0082] S2: The frame loading mechanism 21 places the frame tray on the first tray of the first conveying mechanism 22 of the tray loading and gluing device 2, and the first conveying mechanism 22 conveys the frame tray to the glue brushing position, and the glue brushing mechanism 23 of the tray loading and gluing device 2 brushes glue on the two pins of the copper frame 81, the source and gate of the first chip 82, and the preset position of the second chip 83.

[0083] S3: The first conveying mechanism 22 transports the copper frame 81, the first chip 82 and the second chip 83 that have been brushed with glue to the glue dispensing mechanism 25 of the material tray loading and glue coating device 2; the glue dispensing component 252 of the glue dispensing mechanism 25 fills the glue on the unbrushed or unqualified positions of the first chip 82, the second chip 83 and the copper frame 81 according to the unqualified positions detected by the detection camera 251 of the glue dispensing mechanism 25 and the measured distance of the distance measuring sensor 253 of the glue dispensing mechanism 25.

[0084] The position where the first conveying mechanism 22 conveys the copper frame 81 , the first chip 82 and the second chip 83 that have been brushed with glue to the glue dispensing mechanism 25 of the material tray loading and glue coating device 2 is defined as the glue dispensing position.

[0085] S4: The first conveying mechanism 22 moves the first chip 82, the second chip 83 and the copper frame 81 that have been brushed with glue from the glue dispensing position to the transfer position; the material moving mechanism 24 of the material tray loading and glue coating device 2 moves the first chip 82, the second chip 83 and the copper frame 81 that have been glued from the transfer position to the second conveying device 3.

[0086] S5: The first vibration feeding mechanism 42 and the second vibration feeding mechanism 43 of the jumper wire feeding device 4 respectively sort the first jumper wires 84 and the second jumper wires 85 in a preset direction.

[0087] S6: The first picking mechanism 44 and the second picking mechanism 45 of the jumper loading device 4 place the first jumper 84 and the second jumper 85 onto the first jumper tray 413 and the second jumper tray 414 respectively.

[0088] S7: The jumper wire mounting device 5 picks up the first jumper wire 84 and moves it to the image detection mechanism 6. The image detection mechanism 6 identifies the contact points of the first jumper wire 84 and the gate, and mounts the first jumper wire 84, the gate and the corresponding gate pins.

[0089] S8 : the jumper wire mounting device 5 picks up the second jumper wire 85 , and mounts the second jumper wire 85 on the second chip 83 , the source electrode, and the pins corresponding to the second chip 83 .

[0090] S9: The second conveying device 3 conveys the copper frame 81 , the first chip 82 , the second chip 83 , the first jumper wire 84 and the second jumper wire 85 that have been mounted to the unloading mechanism 7 .

[0091] S10: The unloading mechanism 7 performs unloading.

[0092] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A new type of semiconductor device copper sheet bonding equipment, characterized in that: include: Mounting platform (1); A material tray loading and glue coating device (2) is arranged on the mounting platform (1); the material tray loading and glue coating device (2) is configured to provide a copper frame (81) on which a first chip (82) and a second chip (83) are mounted, and to apply glue to two pins of the copper frame (81), a source electrode of the first chip (82) and a preset position of the second chip (83), and to dispense glue to a gate electrode of the first chip (82), and to transport the processed first chip (82), the second chip (83) and the copper frame (81) to the next process; A second conveying device (3), the second conveying device (3) comprising a second linear motor and a second tray, the second tray being used to carry a frame tray, the frame tray being provided with the copper frame (81), the first chip (82) and the second chip (83); the second linear motor drives the second tray and thereby drives the frame tray to reciprocate between a jumper mounting position and a material unloading position; A jumper wire feeding device (4), the jumper wire feeding device (4) being configured to provide a first jumper wire (84) and a second jumper wire (85), and to drive the first jumper wire (84) and the second jumper wire (85) to move in two orthogonal directions; A jumper wire mounting device (5), the jumper wire mounting device (5) comprising a gate detection camera (53) and a jumper wire mounting component; the gate detection camera (53) is used to identify and locate the position of the gate on the second conveying device (3); the jumper wire mounting component is configured to pick up the first jumper wire (84) or the second jumper wire (85), and mount the first jumper wire (84) to the gate and the pin corresponding to the gate, and to mount the second jumper wire (85) to the second chip (83), the source and the pin corresponding to the second chip (83); An image detection mechanism (6), the image detection mechanism (6) being located between the jumper wire loading device (4) and the second conveying device (3); the image detection mechanism (6) being used to identify the position of the contact point of the first jumper wire (84) picked up by the jumper wire placement component; A material unloading mechanism (7); the material unloading mechanism (7) unloads the mounted copper frame (81), the first chip (82), the second chip (83), the first jumper wire (84) and the second jumper wire (85).

2. The novel semiconductor device copper sheet bonding device according to claim 1 is characterized in that: The tray feeding and gluing device (2) comprises: A first conveying mechanism (22) comprises a first linear motor (221) and a first tray (222), wherein the first tray (222) is used to carry the frame material tray, and the copper frame (81) is placed on the frame material tray; the first linear motor (221) drives the first tray (222) and thereby drives the frame material tray to reciprocate between a frame loading position, a glue brushing position, a glue dispensing position and a transfer position; A frame loading mechanism (21) configured to place the frame tray containing the copper frame (81), the first chip (82) and the second chip (83) onto the first tray (222); A glue brushing mechanism (23) is arranged at the glue brushing position and is configured to brush glue on two pins of the copper frame (81), the source electrode of the first chip (82) and a preset position of the second chip (83); A glue dispensing mechanism (25) is arranged on the glue brushing mechanism (23) and is away from the frame feeding mechanism (21), and the glue dispensing mechanism (25) dispenses glue on the gate of the first chip (82); The material transfer mechanism (24) is arranged at the transfer position and is configured to move the frame material tray containing the first chip (82) and the second chip (83) that have been glued and dispensed, and the copper frame (81) from the transfer position to the second conveying device (3).

3. The novel semiconductor device copper sheet bonding equipment according to claim 2 is characterized in that: The frame feeding mechanism comprises: Support frame (211); A mounting seat (212) is arranged on the supporting frame (211); The motor (213) is fixed on the mounting seat (212) via a motor mounting plate A movable plate (214) connected to the mounting seat (212) via four first pillars (215); A lead screw (216), one end of which is fixed on the movable plate (214), and the other end of which passes through the mounting seat (212) and is connected to the output shaft of the motor (213) via a synchronous pulley assembly, for transmitting power to achieve lifting motion; A lifting plate (217), the lifting plate (217) being located between the moving plate (214) and the mounting seat (212), being connected to the four first pillars (215) via a first self-lubricating bearing, and being connected to the nut of the lead screw (216), and moving up and down on the four first pillars (215) as the lead screw (216) rotates; Two fixed plates (218) are connected to the lifting plate (217) via four second pillars (219); the movable plate (214) is connected to the four second pillars (219) via a second self-lubricating bearing; Four material bins (2110), arranged vertically in pairs on the inner side of each of the fixing plates (218) to form a rectangular shape, for accommodating the frame material trays; Two material discharge assemblies (2111), each comprising a cylinder (2112), a push plate (2113), two linear guide rails (2114) and two material discharge plates (2115); the cylinder (2112) is arranged on the fixed plate (218); the push plate (2113) is connected to the output end of the cylinder (2112); the two linear guide rails (2114) are arranged on the fixed plate (218) and are located on both sides of the cylinder (2112); the two material discharge plates (2115) are arranged at both ends of the push plate (2113) and are connected to the sliders of the two linear guide rails (2114) to realize the storage and discharge of the frame material tray; The motor (213) drives the lead screw (216) to rotate, and drives the four second pillars (219) to move up and down through the lifting plate (217), thereby driving the fixed plate (218) to move up and down; when the lifting plate (217) is at the highest point, the cylinder (2112) extends so that the frame tray is located on the discharge plate (2115); when the lifting plate (217) is at the lowest point, the cylinder (2112) drives the discharge plate (2115) to retract so that the frame tray is located on the first tray (222).

4. The novel semiconductor device copper sheet bonding equipment according to claim 2 is characterized in that: The glue brushing mechanism (23) comprises: a mounting frame (231), a glue brushing lifting assembly (232), a glue brushing translation assembly (233), a scraper assembly (234) and a glue brushing plate (235); the mounting frame (231) is fixed on the mounting platform (1), the glue brushing lifting assembly (232) is arranged on the mounting frame (231), and the glue brushing translation assembly (233) and the glue brushing plate (235) are both connected to the glue brushing lifting assembly (232) via the glue brushing mounting plate. The scraper assembly (234) is connected to the glue brushing translation assembly (233), and the scraper of the scraper assembly (234) is located in the glue groove of the glue brushing plate (235); at the bottom of the glue groove, glue brushing holes are provided at preset positions, and the scraper assembly (234) brushes glue onto the two pins of the copper frame (81), the source of the first chip (82), and the preset positions of the second chip (83) through the glue brushing holes.

5. The novel semiconductor device copper sheet bonding equipment according to claim 4 is characterized in that: The glue dispensing mechanism (25) is arranged on the mounting frame (231) away from the glue brushing plate (235); the glue dispensing mechanism (25) is configured to identify and locate the gate of the first chip (82), measure the vertical distance between the glue dispensing mechanism (25) and the gate, and dispense glue to the gate.

6. The novel semiconductor device copper sheet bonding equipment according to claim 2 is characterized in that: The material transfer mechanism (24) comprises a translation component (241), a lifting component (242) and a gripping component (243); the gripping component (243) is arranged on the lifting component (242); the translation component (241) drives the lifting component (242) to translate and thereby drives the gripping component (243) to move; the gripping component (243) comprises an H-shaped plate (2432) and a pneumatic suction cup group (2433) arranged on the H-shaped plate (2432); the pneumatic suction cup group (2433) is arranged on two vertical sides of the H-shaped plate (2432).

7. The novel semiconductor device copper sheet bonding equipment according to claim 2 is characterized in that: The jumper feeding device (4) comprises: A third conveying mechanism (41), wherein the third conveying mechanism (41) is arranged in parallel with the second conveying device (3), and the third conveying mechanism (41) comprises two third linear motors (411) arranged opposite to each other, two electric slides (412), a first jumper tray (413) and a second jumper tray (414); the two electric slides (412) are respectively arranged on each of the third linear motors (411), and the movement directions of the two electric slides (412) are perpendicular to the running directions of the two third linear motors (411); the first jumper tray (413) and the second jumper tray (414) are respectively arranged on each of the electric slides (412); A first vibrating feeding mechanism (42) and a second vibrating feeding mechanism (43); wherein the first vibrating feeding mechanism (42) is used to sort the first jumper wires (84) in a preset direction; and the second vibrating feeding mechanism (43) is used to sort the second jumper wires (85) in a preset direction; The first picking mechanism (44) and the second picking mechanism (45) have the same structure and are used to pick up the first jumper wire (84) and the second jumper wire (85) respectively, and place the first jumper wire (84) and the second jumper wire (85) on the first jumper wire tray (413) and the second jumper wire tray (414) respectively; the first picking mechanism (44) and the second picking mechanism (45) both include a bracket (441), a picking motor (442), a motor mounting plate (443), a drive pulley assembly (444), a connecting rod assembly (445) and a pneumatic suction nozzle (446); the bracket (441) is fixed on the mounting platform (1) across the third conveying mechanism (41); the motor mounting plate (443) The picking motor (442) is arranged on the bracket (441), and the fixed end of the picking motor (442) is connected to the motor mounting plate (443); the output end of the picking motor (442) is connected to one end of the transmission pulley assembly (444), and the other end of the transmission pulley assembly (444) is connected to the connecting rod assembly (445), and the pneumatic suction nozzle (446) is arranged on the connecting rod assembly (445); the picking motor (442) drives the transmission pulley assembly (444) to drive the connecting rod assembly (445) to move, thereby placing the first jumper wire (84) or the second jumper wire (85) sucked by the pneumatic suction nozzle (446) on the first jumper wire tray (413) or the second jumper wire tray (414).

8. The novel semiconductor device copper sheet bonding equipment according to claim 7 is characterized in that: The jumper wire mounting assembly includes a transverse movement mechanism (51) and a picking mechanism (52) arranged on the transverse movement mechanism (51), the transverse movement mechanism (51) includes a transverse movement fixing frame (511) and a transverse movement linear motor (512), the transverse movement fixing frame (511) straddles the second conveying device (3) and the third conveying mechanism (41) and is fixed to the mounting platform (1), and the transverse movement fixing frame (511) is located between the first picking mechanism (44) and the second picking mechanism (45); the picking mechanism (52) includes a mounting base plate (521) and a suction assembly (522), the mounting base plate (521) is arranged on the transverse movement linear motor (512), the suction assembly (522) is arranged on the mounting base plate (521), the suction assembly (522) has a plurality of suction heads, and the suction heads are configured to be rotatable 360 ​​degrees around their own axes and to be movable up and down along the axes to achieve positioning of the contacts of the first jumper wire (84).

9. The novel semiconductor device copper sheet bonding equipment according to claim 8, characterized in that: The unloading mechanism (7) has the same structure as the frame loading mechanism (21) and is used to unload the mounted copper frame (81), the first chip (82), the second chip (83), the first jumper (84) and the second jumper (85).

10. A novel semiconductor device copper sheet bonding assembly method, implemented by using the novel semiconductor device copper sheet bonding device according to any one of claims 1 to 9, wherein the semiconductor device (8) comprises a copper frame (81), a first chip (82), a second chip (83), a first jumper (84) and a second jumper (85); characterized in that: The specific steps are as follows: S1: placing a copper frame (81) mounted with a first chip (82) and a second chip (83) on a frame tray, and placing the frame tray with the copper frame (81) on a frame loading mechanism (21) of the tray loading and gluing device (2); S2: the frame feeding mechanism (21) places the frame material tray on the first tray of the first conveying mechanism (22) of the material tray feeding and gluing device (2), and the first conveying mechanism (22) conveys the frame material tray to the glue brushing position, and the glue brushing mechanism (23) of the material tray feeding and gluing device (2) brushes glue on the two pins of the copper frame, the source of the first chip (82) and the preset position of the second chip (83); S3: the first conveying mechanism (22) conveys the copper frame (81), the first chip (82) and the second chip (83) that have been brushed with glue to the glue dispensing mechanism (25) of the material tray loading and glue coating device (2); the glue dispensing component (252) of the glue dispensing mechanism (25) performs glue filling on the positions of the first chip (82), the second chip (83) and the copper frame (81) that have not been brushed with glue or are unqualified according to the unqualified positions detected by the detection camera (251) of the glue dispensing mechanism (25) and the measured distance of the distance measuring sensor (253) of the glue dispensing mechanism (25); S4: the first conveying mechanism (22) moves the first chip (82), the second chip (83) and the copper frame (81) that have been filled with glue from the glue dispensing position to the transfer position; the material transfer mechanism (24) of the material tray loading and glue coating device (2) moves the first chip (82), the second chip (83) and the copper frame (81) that have been filled with glue from the transfer position to the second conveying device (3); S5: the first vibrating feeding mechanism (42) and the second vibrating feeding mechanism (43) of the jumper wire feeding device (4) respectively sort the first jumper wire (84) and the second jumper wire (85) in a preset direction; S6: the first material picking mechanism (44) and the second material picking mechanism (45) of the jumper wire loading device (4) respectively place the first jumper wire (84) and the second jumper wire (85) on the first jumper wire tray (413) and the second jumper wire tray (414); S7: the jumper wire mounting device (5) picks up the first jumper wire (84) and moves it to the image detection mechanism (6); the image detection mechanism (6) identifies the contact point between the first jumper wire (84) and the gate, and mounts the first jumper wire (84) to the gate and the pin corresponding to the gate; S8: the jumper mounting device (5) picks up the second jumper (85), and mounts the second jumper (85) on the second chip (83), the source electrode, and the pin corresponding to the second chip (83); S9: the second conveying device (3) conveys the copper frame (81), the first chip (82), the second chip (83), the first jumper wire (84) and the second jumper wire (85) that have been mounted to the unloading mechanism (7); S10: The material unloading mechanism (7) performs unloading.

Images