Method for forming semiconductor production line schedule

Abstract

The application provides a semiconductor production line scheduling forming method, which comprises the following steps: dividing products to be produced into batches; dividing production line equipment into equipment groups; taking out batches with short remaining residence time, and sorting the taken-out batches according to the length of the remaining residence time; taking out batches with high batch priority, and sorting the taken-out batches according to the level of the batch priority; sorting the remaining batches according to the delivery date; arranging the sorted batches in sequence; taking out the arranged batches in sequence, and selecting a preferred equipment from all the equipment groups for each batch taken out; and if the number of batches corresponding to the preferred equipment in the equipment groups is quite different, uniformly processing the number of batches corresponding to the preferred equipment in the equipment groups. The application balances the production of the production line and promotes capacity optimization.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor product process management and control, in particular to a semiconductor production line scheduling forming method. BACKGROUND

[0002] Semiconductor manufacturing has the characteristics of complex production process, long cycle, large scale, multiple entry, multiple constraints and multiple targets, and its scheduling and dispatching problem is a hybrid flow shop scheduling problem and also a fuzzy job shop scheduling problem, which has always been one of the difficulties of research.

[0003] In the prior art, the products to be produced are allocated to the equipment according to the preset scheduling.

[0004] However, there are many factors affecting the scheduling, such as remaining waiting time, lot priority, delivery date, restrictions of various equipment, same process continuity and process capacity of the same process, etc. Different equipment groups have different influencing factors, and different scheduling methods are used according to the production line situation. The scheduling of the production line directly affects the overall production capacity of the production line. Moreover, the production line is dynamic and iterative production, and in the face of real-time changes in the production line situation, the scheduling result needs to be continuously adjusted and optimized to achieve smooth production of the whole production line. Therefore, the scheduling method of the prior art cannot meet the complex and variable production line situation, cannot realize the automatic system to make the scheduling rule more flexible, cannot balance the production of the production line, and cannot promote the optimization of production capacity. SUMMARY

[0005] The purpose of the present application is to provide a semiconductor production line scheduling forming method which can meet the complex and variable production line situation, can realize the automatic system to make the scheduling rule more flexible, can balance the production of the production line, and can promote the optimization of production capacity.

[0006] In order to achieve the above purpose, the present application provides a semiconductor production line scheduling forming method, comprising:

[0007] S1: dividing the products to be produced into a plurality of batches;

[0008] S2: dividing the production line equipment into a plurality of equipment groups, the equipment in each equipment group having the same process production capacity, and the equipment groups having certain upstream or downstream relationship on the production line;

[0009] S3: in the plurality of batches, taking out a plurality of batches with shorter remaining residence time, and sorting the taken out plurality of batches according to the length of the remaining residence time;

[0010] S4: in the batches remaining in step S3, taking out a plurality of batches with high batch priority, and sorting the taken out plurality of batches according to the level of the batch priority;

[0011] S5: sorting the batches remaining in step S4 according to delivery dates;

[0012] S6: arranging the batches sorted in step S3, the batches sorted in step S4 and the batches sorted in step S5 in order;

[0013] S7: taking out the batches arranged in order one by one, and the steps completed by each batch taken out include:

[0014] S71: selecting a device in a device group that is producing a product with the same process as the batch product as a preferred device;

[0015] S72: if the device in step S71 does not exist, selecting a device in the same device group that is producing a product with the same structure as the batch product as a preferred device;

[0016] S73: if the device in step S72 does not exist, selecting a device with the shortest waiting time as a preferred device;

[0017] S74: repeating steps S71-S73 to select a preferred device from all device groups respectively;

[0018] S8: if the number of batches corresponding to the preferred device in the device group is significantly different, processing the number of batches corresponding to the preferred device in the device group evenly.

[0019] Optionally, in the method for forming a semiconductor production line schedule, each batch includes a plurality of products.

[0020] Optionally, in the method for forming a semiconductor production line schedule, the products to be produced include wafers.

[0021] Optionally, in the method for forming a semiconductor production line schedule, each device group includes a device.

[0022] Optionally, in the method for forming a semiconductor production line schedule, in step S3, the method for sorting the batches taken out according to the length of the remaining residence time includes:

[0023] The batches with shorter remaining residence time are arranged in the front row.

[0024] Optionally, in the method for forming a semiconductor production line schedule, in step S4, the method for sorting the batches taken out according to the level of batch priority includes:

[0025] The batches with higher batch priority are arranged in the front row.

[0026] Optionally, in the method for forming a semiconductor production line schedule, the method for sorting the remaining batches according to the delivery date in step S5 includes:

[0027] The batches with the nearer delivery date are arranged in the front.

[0028] Optionally, in the method for forming a semiconductor production line schedule, if the number of the preferred equipment is more than one in step S71, the equipment with the shortest waiting time is selected as the preferred equipment.

[0029] Optionally, in the method for forming a semiconductor production line schedule, if the number of the preferred equipment is more than one in step S72, the equipment with the shortest waiting time is selected as the preferred equipment.

[0030] Optionally, in the method for forming a semiconductor production line schedule, the method for uniformizing the number of batches corresponding to the preferred equipment in the equipment group in step S8 includes:

[0031] The last part of the batches of the preferred equipment with more batches is moved to the preferred equipment with less batches.

[0032] In the method for forming a semiconductor production line schedule, the production order of the batches is calculated according to the remaining stay time, the batch priority, the delivery date and other constraint conditions. The preferred equipment is selected according to the process and structure of the product being produced by the equipment. And these screening rules can be automatically performed. Therefore, the present application meets the complex and variable production line situation, realizes the automatic system, makes the scheduling rule making more flexible, balances the production of the production line, and promotes the optimization of production capacity. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 is a flow chart of the method for forming a semiconductor production line schedule according to an embodiment of the present application;

[0034] Figure 2 is a schematic diagram of the batch sorting according to an embodiment of the present application;

[0035] Figure 3 is a schematic diagram of the preferred equipment selection according to an embodiment of the present application;

[0036] Figure 4 is a schematic diagram of the batches corresponding to the preferred equipment according to an embodiment of the present application;

[0037] Figure 5 is a schematic diagram of the batches corresponding to the preferred equipment after the uniformization according to an embodiment of the present application. DETAILED DESCRIPTION

[0038] The specific embodiments of the present application will be described below in connection with the drawings. The advantages and features of the present application will become apparent from the following description. It is to be understood that the drawings are designed solely for the purpose of illustration and are not intended to limit the present application, and that the proportions may not be precise for the convenience and clarity.

[0039] In the following description, the terms "first", "second", etc. are used to distinguish between like elements and are not necessarily used to describe a particular sequential or chronological order. It is to be understood that these terms are used in the context of the specific embodiments described herein and that the use of these terms in the description is not intended to limit the scope of the present application. Similarly, if a method is described herein as comprising a series of steps, the order in which such steps are presented is not necessarily the only order in which such steps can be performed, and some of the steps can be omitted and / or other steps can be added to the method.

[0040] Also, it is to be understood that when a layer (or film), region, pattern, or structure is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, and / or intervening layers can also be present. In addition, it should be understood that when a layer is referred to as being "under" another layer, it can be directly under the other layer, and / or one or more intervening layers can also be present. In addition, relative terms such as "on", "above", "upper", "lower", and the like can be used herein to describe one structural or relative position (e.g., orientation) of one layer or structure with respect to another layer or structure as shown in the figures. It is to be understood that such relative terms are intended to encompass different positional relationships as viewed from different directions.

[0041] Reference will now be made to Figure 1 The present application provides a method for forming a semiconductor production line schedule, comprising:

[0042] S1: dividing products to be produced into a plurality of batches;

[0043] S2: dividing production line equipment into a plurality of equipment groups, the equipment in each equipment group having the same process production capacity, and there being a certain upstream or downstream relationship between different equipment groups on the production line;

[0044] S3: in the plurality of batches, removing a plurality of batches with shorter remaining residence times, and sorting the removed plurality of batches according to the lengths of the remaining residence times;

[0045] S4: in the batches remaining in step S3, removing a plurality of batches with high batch priority, and sorting the removed plurality of batches according to the levels of the batch priority;

[0046] S5: sorting the batches remaining in step S4 according to delivery dates;

[0047] S6: arranging the batches sorted in step S3, the batches sorted in step S4, and the batches sorted in step S5 in order;

[0048] S7: sequentially take out all the lots in order, and the steps completed by each taken lot include:

[0049] S71: select a device in the same device group as the device currently producing the same product as the lot product as the preferred device;

[0050] S72: if there is no such device in step S71, select a device in the same device group as the device currently producing the same product as the lot product as the preferred device;

[0051] S73: if there is no such device in step S72, select a device with the shortest waiting time as the preferred device;

[0052] S74: repeat steps S71-S73 to select a preferred device from all device groups;

[0053] S8: if the number of batches corresponding to the preferred devices in the device group is significantly different, evenly process the number of batches corresponding to the devices in the device group.

[0054] First, step S1 is performed to divide the products to be produced into several lots. Each lot includes several products. The products to be produced include wafers, and various devices will be fabricated on the wafers. Generally, each lot can include 25pcs wafers, so all the products to be produced will be divided into several lots, and the specific number of lots is determined according to the actual number of products to be produced. For examples of embodiments of the present application, please refer to Figure 2 Take 12 lots L1-L12 as an example. In order to better utilize the production line, the 12 lots of products will be allocated to devices next.

[0055] Next, step S2 is performed to divide the production line devices into several device groups, and each device group includes several devices. The devices in each device group have the same process production capacity, and there is a certain upstream or downstream relationship between different device groups on the production line. Generally, the entire process flow can be divided into several steps, and devices that can complete the same step are grouped as a device group, so if multiple steps are needed to complete the production of a product, there will be multiple device groups, and multiple device groups have a certain upstream or downstream relationship on the production line according to the order of completion of the steps, i.e. after a device group is completed, the product will flow to the next device group. However, there can be one or more than one device in each device group. For example, please refer to Figures 3 to 5 Take a device group as an example, which includes four devices E1-E4.

[0056] Next, step S3 is performed, please continue to refer to Figure 2In step S3, the batches with shorter remaining residence time are selected to be processed first. The determination of whether the remaining residence time is shorter can be made by determining whether the remaining residence time is within a preset value. If the remaining residence time is within the preset value, for example, only one hour is left, then the remaining residence time is considered to be shorter. In step S3, the method of sorting the batches according to the length of the remaining residence time includes: placing the batches with shorter remaining residence time in the front row, so that the selected batches also have a sequence.

[0057] Next, step S4 is performed, in which the batches with higher batch priority are selected from the batches remaining in step S3, and the selected batches are sorted according to the level of batch priority. Some batches of products can be required to be produced first for other reasons, so these products are given a higher batch priority. In step S4, the method of sorting the batches according to the level of batch priority includes: placing the batches with higher batch priority in the front row, so that the selected batches also have a sequence.

[0058] Next, step S5 is performed, in which the batches remaining in step S4 are sorted according to the delivery date. In step S5, the method of sorting the batches according to the delivery date includes: placing the batches with a closer delivery date in the front row, so that the selected batches also have a sequence.

[0059] Next, step S6 is performed, in which the batches sorted in step S3, the batches sorted in step S4, and the batches sorted in step S5 are arranged in sequence. For example Figure 2 , Figure 2 The batches sorted in step S6 are the batches arranged according to the method, Figure 2 The final sorting list in step S6 is all the batches arranged.

[0060] Next, step S7 is performed, please refer to Figure 3S71: selecting a device group, for example, the first device group, which is producing the same product as the batch (for example, the first batch L5) and has the same process as the product, as the preferred device, if the number of preferred devices is greater than 1, then selecting the device with the shortest waiting time from the preferred devices, as the preferred device, where the waiting time refers to the waiting time of the device for producing the next batch of products. S72: if there is no such device in step S71, selecting a device in the same device group which is producing the same product as the batch, as the preferred device, if the number of preferred devices is greater than 1, then selecting the device with the shortest waiting time from the preferred devices, as the preferred device. S73: if there is no such device in step S72, selecting the device with the shortest waiting time, as the preferred device; S74: repeating steps S71-S73 to select the preferred device from all device groups. In this way, the preferred device of each group of each batch is selected. The selected device can correspond to multiple batches, and the selected batches also have a sequence.

[0061] Next, step S8 is performed, please refer to Figure 4 and Figure 5 If the number of batches corresponding to the preferred devices in some device groups is quite different, the number of batches corresponding to the devices in the device groups is uniformly processed. In step S8, the method for uniformly processing the number of batches corresponding to the preferred devices in the device groups includes: moving the last part of the batches of the preferred device with more batches to the preferred device with fewer batches, and arranging them after the original batches. For example Figure 4 , it is found that the E3 device corresponds to four batches, the E2 device corresponds to one batch, the two devices are not uniform, the E1 device and the E4 device each correspond to three batches. Therefore, the number of batches corresponding to the four devices can be uniformly processed, and the last batch of E3 is moved to E2 and arranged after the existing batches of E2, as Figure 5 .

[0062] In summary, in the method for forming a semiconductor production line schedule provided in the embodiment of the application, the sequence of production of batches is calculated according to the remaining residence time, batch priority, delivery date and other constraint conditions. The preferred device is selected according to the process and structure of the product being produced by the device. And these screening rules can be automatically performed. Therefore, the application meets the complex and variable production line situation, realizes an automatic system that makes the scheduling rule making more flexible, balances the production of the production line, and promotes the optimization of production capacity.

[0063] The above merely describes the preferred embodiments of the present application and does not limit the present application in any way. Any person skilled in the art can make any form of equivalent replacement or modification to the technical solutions and technical contents disclosed by the present application without departing from the scope of the technical solutions of the present application, and such changes still belong to the protection scope of the present application.

Claims

1. A method for forming a semiconductor production line schedule, characterized in that: include: S1: Divide the products to be produced into several batches; S2: Divide the production line equipment into several equipment groups, where the equipment in each equipment group has the same process production capacity, and different equipment groups have certain upstream or downstream relationships on the production line; S3: Among the batches, take out the batches with shorter remaining residence time, and sort the batches taken out according to the length of the remaining residence time; S4: From the remaining batches in step S3, several batches with batch priorities at the top are taken out, and the taken out batches are sorted according to the level of batch priority; S5: Sort the remaining batches in step S4 by delivery date; S6: Arrange the batches sorted in step S3, the batches sorted in step S4, and the batches sorted in step S5 in sequence; S7: All the arranged batches are taken out in sequence. The steps to be completed for each batch taken out include: S71: Select a device in a device group that is currently producing a product with the same process as the batch of products as the preferred device; S72: If the device does not exist in step S71, then select a device in the same device group that is producing products with the same structure as the batch of products as the preferred device; S73: If the device does not exist in step S72, the device with the shortest waiting time is selected as the preferred device; S74: looping through steps S71 to S73 to select a preferred device from all device groups; S8: If the batch quantities corresponding to the preferred devices in the device group differ greatly, the batch quantities corresponding to the preferred devices in the device group are equalized.

2. The method for forming a semiconductor production line schedule according to claim 1, wherein: Each batch contains several pieces of product.

3. The method for forming a semiconductor production line schedule according to claim 1, wherein: The products to be produced include wafers.

4. The method for forming a semiconductor production line schedule according to claim 1, wherein: Each of the device groups includes several devices.

5. The method for forming a semiconductor production line schedule according to claim 1, wherein: In step S3, the method for sorting the taken-out batches according to the length of the remaining residence time includes: Put the remaining batches with shorter residence times at the front.

6. The method for forming a semiconductor production line schedule according to claim 1, wherein: In step S4, the method for sorting the taken batches according to the batch priority level includes: Put batches with higher batch priority at the front.

7. The method for forming a semiconductor production line schedule according to claim 1, wherein: In step S5, the method of sorting the remaining batches in step S4 according to the delivery date includes: Put batches with closer delivery dates at the top.

8. The method for forming a semiconductor production line schedule according to claim 1, wherein: In step S71, if the number of the preferred devices is greater than 1, a device with the shortest waiting time is selected as the preferred device.

9. The method for forming a semiconductor production line schedule according to claim 1, wherein: In step S72, if the number of the preferred devices is greater than 1, the device with the shortest waiting time is selected as the preferred device.

10. The method for forming a semiconductor production line schedule according to claim 1, wherein: In step S8, the method for equalizing the batch quantity corresponding to the preferred device in the device group includes: The last part of the batches of the preferred device with a larger batch quantity is moved to the preferred device with a smaller batch quantity.

Images