Laser cutting system, method, equipment, and storage medium

Abstract

The embodiments of the present application disclose a laser cutting system and method, equipment, and storage medium, including a transmitting device, a focal depth control device, and an optical lens device. The focal depth control device includes a movable optical component, wherein: the transmitting device is used to transmit a laser beam to the focal depth control device; the focal depth control device is used to control the movable optical component to move to a target position corresponding to the target cutting area of ​​the tab to change the focal depth of the received laser beam, obtain a first beam, and transmit the first beam to the optical lens device. The focal depth of the first beam is the target focal depth. The target focal depth varies depending on the type of target cutting area; the optical lens device is used to cut the target cutting area with the first beam. It can achieve precise cutting of different types of cutting areas in the tab, improving cutting quality and tab manufacturing quality.

Description

Technical Field

[0001] The embodiments of the present application relate to control technology, and relate to but are not limited to a laser cutting system and method, equipment, and storage medium. Background Art

[0002] Tab formation is a critical step in battery cell manufacturing. Laser cutting is typically used to create the desired tab shape. However, laser cutting can be disruptive due to the high cutting speed of the cutting equipment and other factors, resulting in uncut tabs and defective products.

[0003] Therefore, how to improve the cutting quality and manufacturing quality of tabs is an urgent problem that needs to be solved in the industry. Summary of the Invention

[0004] In view of this, the laser cutting system and method, equipment, and storage medium provided in the embodiments of the present application can achieve precise cutting of different types of cutting areas in the tab, improving the cutting quality and the manufacturing quality of the tab. The laser cutting system and method, equipment, and storage medium provided in the embodiments of the present application are implemented as follows:

[0005] In a first aspect, an embodiment of the present application provides a laser cutting system, comprising a launch device, a focus depth control device, and an optical lens device, wherein the launch device is sequentially connected to the focus depth control device and the optical lens device, and the focus depth control device includes a movable optical component, wherein:

[0006] The emitting device is used to emit a laser beam toward the focal depth control device;

[0007] The focal depth control device is used to control the movable optical component to move to a target position corresponding to the target cutting area of ​​the tab, so as to change the focal depth of the received laser beam, obtain a first beam, and emit the first beam to the optical lens device. The focal depth of the first beam is a target focal depth. The target focal depth varies depending on the type of the target cutting area.

[0008] The optical lens device is used to cut the target cutting area through the first light beam.

[0009] In some embodiments, the target cutting area includes a foil and a coating. When the target cutting area is a foil area, the focal depth of the first light beam is a first focal depth. When the target cutting area is a coating area, the focal depth of the first light beam is a second focal depth. The length of the first focal depth is greater than the length of the second focal depth.

[0010] In some embodiments, the movable optical assembly includes a first optical element and a second optical element, and the focus depth control device further includes a driving device, wherein:

[0011] The focal depth control device is specifically configured to, when the target cutting area is a foil, drive the first optical element to move to a first position and the second optical element to move to a second position by the driving device, so as to obtain the first light beam, wherein the focal depth of the first light beam is a first focal depth;

[0012] And, when the type of the target cutting area is a coating, the first optical element is driven by the driving device to move to the third position and the second optical element is moved to the fourth position to obtain the first light beam, and the focal depth of the first light beam is the second focal depth.

[0013] In some embodiments, the focus depth control device is used to control the movable optical component to move to a target position corresponding to the target cutting area according to the type or movement path of the received target cutting area.

[0014] In some embodiments, the system further includes a command control device, wherein the command control device establishes a communication connection with the depth of focus control device, wherein:

[0015] The instruction control device is used to send a target control instruction to the focal depth control device when it is detected that the emitting device emits a laser beam, and the target control instruction includes the type of the target cutting area.

[0016] In some embodiments, the optical lens device includes a galvanometer and a field lens, the galvanometer is connected to the focal depth control device, and the field lens is connected to the galvanometer, wherein:

[0017] The galvanometer is used to control the first light beam to be transmitted to the field lens along a preset path to obtain a diffused light beam;

[0018] The field lens is used to focus the diffuse light beam to obtain the focused light beam, and cut the target cutting area through the focused light beam.

[0019] In some embodiments, the focal depth control device changes the focal depth of the received laser beam to obtain a target focal depth of the first beam, which is achieved by the following formula:

[0020]

[0021] Among them, Z R is the target focal depth, λ is the wavelength of the laser beam, M 2 is the quality of the laser beam, f is the focal length of the field lens, is the diameter of the laser beam.

[0022] In some embodiments, the driving device includes a voice coil motor and a slide rail linear motion mechanism, the slide rail linear motion mechanism includes a slide rail and a slider, the voice coil motor drives the slider to move on the slide rail at a preset speed, and the preset speed is greater than a speed threshold.

[0023] In some embodiments, the cutting path of the focused light beam on the coating area and the cutting path of the focused light beam on the foil area are continuous paths.

[0024] In a second aspect, an embodiment of the present application provides a laser cutting method, which is applied to a laser cutting system. The system includes a launch device, a focus depth control device, and an optical lens device. The launch device is sequentially connected to the focus depth control device and the optical lens device. The focus depth control device includes a movable optical component. The method includes:

[0025] emitting a laser beam toward the focal depth control device via the emitting device;

[0026] The movable optical component is controlled to move to a target position corresponding to a target cutting area of ​​the tab by the focal depth control device, so as to change the focal depth of the received laser beam to obtain a first beam, and the first beam is emitted to the optical lens device. The focal depth of the first beam is a target focal depth. The target focal depth varies depending on the type of the target cutting area.

[0027] The target cutting area is cut using the first light beam through the optical lens arrangement.

[0028] In a third aspect, an embodiment of the present application provides a computer device comprising a memory and a processor, wherein the memory stores a computer program that can be run on the processor, and when the processor executes the program, the method described in the embodiment of the present application is implemented.

[0029] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the method provided in the embodiment of the present application.

[0030] The laser cutting system and method, device, and storage medium provided in the embodiments of the present application emit a laser beam to the focal depth control device through an emitting device; the focal depth control device controls the movable optical component to move to a target position corresponding to the target cutting area of ​​the tab to change the focal depth of the received laser beam, thereby obtaining a first beam, and emitting the first beam to an optical lens device. The focal depth of the first beam is the target focal depth, and the target focal depth varies depending on the type of target cutting area; the target cutting area is cut using the first beam through the optical lens device. In this way, it is possible to achieve precise cutting of different types of cutting areas in the tab, improve cutting quality and tab manufacturing quality, and solve the technical problems raised in the background technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The drawings herein are incorporated into and constitute a part of the specification. These drawings illustrate embodiments consistent with the present application and, together with the specification, are used to illustrate the technical solutions of the present application.

[0032] Figure 1 A schematic structural diagram of a laser cutting system provided in an embodiment of the present application;

[0033] Figure 2 A schematic diagram of the effects of different types of target cutting areas provided in an embodiment of the present application;

[0034] Figure 3 A schematic structural diagram of another laser cutting system provided in an embodiment of the present application;

[0035] Figure 4 A schematic diagram of the formation of a first light beam corresponding to a foil area provided in an embodiment of the present application;

[0036] Figure 5 A schematic diagram of the formation of a first light beam corresponding to a coating area provided in an embodiment of the present application;

[0037] Figure 6 A schematic diagram of the effect of a laser cutting method provided in an embodiment of the present application;

[0038] Figure 7 A schematic diagram of the structure of a computer device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0039] To make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the specific technical solutions of the present application will be further described in detail below in conjunction with the drawings in the embodiments of the present application. The following embodiments are used to illustrate the present application but are not intended to limit the scope of the present application.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein are for the purpose of describing the embodiments of this application only and are not intended to limit this application.

[0041] In the following description, reference is made to “some embodiments”, which describes a subset of all possible embodiments, but it will be understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.

[0042] It should be pointed out that the terms "first\second\third" involved in the embodiments of the present application are used to distinguish similar or different objects, and do not represent a specific ordering of the objects. It can be understood that "first\second\third" can be interchanged with a specific order or sequence where permitted, so that the embodiments of the present application described here can be implemented in an order other than that illustrated or described here.

[0043] Tabs are the polar collectors of a battery, typically made of aluminum or copper. Their primary function is to connect the battery cells, enabling the conduction and distribution of current. They primarily transmit current between the electrode material and the battery terminals, completing the circuit between the positive and negative electrodes.

[0044] During the production or processing of tabs, tab vibration may occur, which can affect the cutting accuracy and subsequent assembly quality of the tabs. Furthermore, during the tab forming and cutting process, different types of materials are generally required to be cut, and different types of materials require different laser cutting energies to achieve precise cutting. In this case, if a fixed laser cutting energy is used to cut the tabs, the tabs may not be cut, resulting in defective products.

[0045] In view of this, an embodiment of the present application provides a laser cutting system that can achieve precise cutting of different types of cutting areas in a tab, thereby improving the cutting quality and the manufacturing quality of the tab.

[0046] Figure 1 This is a schematic diagram of the structure of the laser cutting system provided in the embodiment of the present application. Figure 1 As shown, the laser cutting system may include an emitting device 1 , a focal depth control device 2 and an optical lens device 3 .

[0047] The emitting device 1 is connected to the focal depth control device 2 and the optical lens device 3 in sequence, and the focal depth control device 2 includes a movable optical component 22 .

[0048] The so-called movable optical component refers to an optical component that can be moved to change its position.

[0049] The emitting device 1 can be used to emit a laser beam to the focal depth control device 2 .

[0050] In the embodiment of the present application, the emitting device may include a laser, which is responsible for generating a laser beam. Depending on the application requirements, the laser may be a continuous laser or a pulsed laser.

[0051] The laser generates a laser beam under the action of an excitation source. Parameters such as the wavelength, pulse repetition frequency, and single pulse energy of the laser beam are set according to application requirements.

[0052] In the embodiment of the present application, the emitting device 1 emits a laser beam, which can be used to cut different types of target cutting areas of the tab.

[0053] Cutting is primarily based on the high energy density and focusing properties of the laser beam. When the laser beam strikes the surface of the material, it absorbs the laser energy and rapidly heats up to a melting or vaporizing temperature, enabling cutting. During the cutting process, an auxiliary gas (such as nitrogen, oxygen, or an inert gas) is often injected through a nozzle to protect the laser cutting area, remove melted material, and help speed up the cutting process.

[0054] In the embodiments of the present application, the laser may include multiple types.

[0055] For example, the laser can be a fiber laser cutter, which can achieve fast and precise cutting of various materials through high-quality beam quality and high energy density. Fiber laser cutters are widely used in processes such as cutting, punching, and engraving of metal sheets, pipes, stainless steel, and other materials.

[0056] Alternatively, the laser can be an ultrafast laser cutter, which features short pulse widths and high peak power, enabling precise processing of materials and high-quality cutting. Ultrafast laser cutters are primarily used for precise processing of materials in fields such as microelectronics manufacturing, optoelectronic devices, and biomedicine.

[0057] The focal depth control device 2 is used to control the movable optical component 22 to move to a target position corresponding to the target cutting area of ​​the tab to change the focal depth of the received laser beam, obtain a first beam, and emit the first beam to the optical lens device 3.

[0058] In the embodiments of the present application, movable optical assembly 22 refers to a movable optical assembly. An optical assembly, also known as an optical element or optical device, refers to a device or component used to control, adjust, change, or transmit light. An optical assembly may include lenses, prisms, reflectors, filters, and the like.

[0059] After receiving the laser beam, the focus depth control device 2 controls the movable optical assembly 22 included therein to move to a corresponding target position. This target position is determined based on the type of target cutting area of ​​the tab to be cut. In other words, the target position to which the movable optical assembly 22 moves varies depending on the type of target cutting area of ​​the tab to be cut.

[0060] In the embodiment of the present application, there is no limitation on the manner in which the focal depth control device 2 controls the movable optical component 22 to move to the target position corresponding to the target cutting area.

[0061] For example, in some embodiments, the focus depth control device 2 may control the movable optical component 22 to move to a target position corresponding to the target cutting area according to the type of the received target cutting area.

[0062] Of course, there is no limitation on the manner in which the focal depth control device 2 obtains the type of the target cutting area. For example, other devices may send a signal to the focal depth control device 2 so that the focal depth control device 2 obtains the type of the current target cutting area.

[0063] In other embodiments, the focus depth control device 2 can also control the movable optical component 22 to move to a target position corresponding to the target cutting area based on the movement path. Here, the focus depth control device 2 can know in advance the movement path when cutting materials in different areas of the tab. In this way, when moving to the corresponding path, the type of the current target cutting area can be obtained.

[0064] After the movable optical component 22 moves to the target position, it can change the focal depth of the laser beam incident thereon by its own characteristics to obtain the first beam, and can continue to emit the first beam to the optical lens device 3.

[0065] In the embodiment of the present application, the focal depth of the first light beam is the target focal depth, and the target focal depth varies depending on the type of the target cutting area.

[0066] That is, for different target cutting areas of the tab, after the movable optical assembly 22 is moved to the target position relative to the type of the target cutting area, it can change the focal depth of the laser beam incident thereon based on its own characteristics and positional relationship to obtain the target focal depth required for cutting according to the type of the current target cutting area. In this way, the target focal depth required varies depending on the type of the target cutting area.

[0067] For example, in some embodiments, the types of target cutting areas may include foils and coatings. When the target cutting area is a foil area, the focal depth of the first light beam is a first focal depth. When the target cutting area is a coating area, the focal depth of the first light beam is a second focal depth. The length of the first focal depth is greater than the length of the second focal depth.

[0068] This is because the material in the coating area is thicker and requires a relatively high laser energy density, while the material in the foil area is thinner and requires a relatively low laser energy density. A short focal depth of the laser beam can obtain a high energy density, while a long focal depth of the laser beam can obtain a low energy density.

[0069] Therefore, when the target cutting area is the foil area, the focal depth of the laser beam incident therein can be changed to a first focal depth by the focal depth control device; when the target cutting area is the coating area, the focal depth of the laser beam incident therein can be changed to a second focal depth by the focal depth control device, and the focal depth length of the first focal depth is greater than the focal depth length of the second focal depth, that is, the laser energy density of the foil area is set to be lower than the laser energy density of the coating area, such as Figure 1 The laser energy density at the short focal depth shown is higher than that at the long focal depth, so that the target cutting area is cut with a laser energy density that matches the type of the target cutting area, thereby achieving precise cutting of different types of cutting areas in the tab, and improving the cutting quality and the manufacturing quality of the tab.

[0070] In the production of full-tab batteries, the foil area typically refers to the empty foil area reserved at the edge of the current collector. This area will be cut into multiple tabs in subsequent processes. The quality of the foil area (such as flatness and thickness uniformity) has a significant impact on the cutting quality of the tabs and the overall performance of the battery.

[0071] Figure 2 A schematic diagram of the effect of different types of target cutting areas is given. Figure 2 As shown, the tab includes a foil area and a coating area, and different areas require different focal depths of the laser beam.

[0072] The optical lens device 3 is used to cut the target cutting area through the first light beam.

[0073] In an embodiment of the present application, after the focal depth control device changes the focal depth of the laser beam incident therein to the target focal depth required by the type of the target cutting area, the changed first light beam can be emitted to the optical lens device 3 so as to cut the target cutting area using the first light beam through the optical lens device 3.

[0074] In an embodiment of the present application, a laser beam is emitted from a transmitting device to the focal depth control device. The focal depth control device controls the movable optical component to move to a target position corresponding to the target cutting area of ​​the tab, thereby changing the focal depth of the received laser beam to obtain a first beam. The first beam is then emitted to an optical lens device. The focal depth of the first beam is the target focal depth. The target focal depth varies depending on the type of target cutting area. The first beam is then used by the optical lens device to cut the target cutting area. In this way, precise cutting of different cutting areas in the tab can be achieved, improving cutting quality and tab manufacturing quality.

[0075] Figure 3 This is a schematic diagram of the structure of the laser cutting system provided in the embodiment of the present application. Figure 3 As shown, the laser cutting system may include an emitting device 1 , a focal depth control device 2 , an optical lens device 3 and a command control device 4 .

[0076] The transmitting device 1 is sequentially connected to the focal depth control device 2 and the optical lens device 3. The command control device 4 establishes a communication connection with the focal depth control device 2. The focal depth control device 2 includes a driving device 21 and a movable optical assembly 22. The movable optical assembly 22 includes a first optical element 221 and a second optical element 222. The optical lens device 3 includes a galvanometer 31 and a field lens 32. The galvanometer 31 is connected to the focal depth control device 2, and the field lens 32 is connected to the galvanometer 31.

[0077] The emitting device 1 can be used to emit a laser beam to the focal depth control device 2 .

[0078] Here, the method of transmitting the laser beam by the transmitting device 1 to the focal depth control device 2 is the same as that described in the above embodiment, and will not be repeated here.

[0079] The instruction control device 4 is used to send a target control instruction to the focus depth control device 2 when it is detected that the emitting device 1 emits a laser beam. The target control instruction includes the type of the target cutting area.

[0080] In the embodiments of the present application, there is no limitation on the specific type of the command control device 4. For example, in some embodiments, the command control device may be a control card in the galvanometer 31, which can output a target control instruction to the focal depth control device 2 in real time upon detecting that the emitting device 1 is emitting a laser beam, so that the focal depth control device 2 can determine the focal depth of the laser beam that needs to be adjusted based on the type of the target cutting area included in the target control instruction.

[0081] In other embodiments, the instruction control device 4 can also be triggered according to the position of the tab. For example, after the control card determines the type of the current target cutting area, it can generate a target control instruction according to the type of the target cutting area and send it to the depth of focus control device 2.

[0082] The depth of focus control device 2 is used to drive the first optical element 221 to move to the first position and the second optical element 222 to the second position through the driving device 21 when the type of the target cutting area is a foil, so as to obtain a first light beam, and the focal depth of the first light beam is the first focal depth; and when the type of the target cutting area is a coating, drive the first optical element 221 to move to the third position and the second optical element 222 to the fourth position through the driving device 21 to obtain the first light beam, and the focal depth of the first light beam is the second focal depth, and the length of the first focal depth is greater than the length of the second focal depth.

[0083] In an embodiment of the present application, after determining the type of the target cutting area, the depth of focus control device 2 can control the first optical element 221 and the second optical element 222 to move to a preset position according to the type of the target cutting area, so that the first light beam is changed to a focal depth corresponding to the type of the target cutting area.

[0084] In some embodiments, the focal depth control device 2 further includes a group of fixing elements, which together with the first optical element 221 and the second optical element 222 realize the control of the focal depth of the laser beam.

[0085] In some embodiments, when the target cutting area is a foil, the depth of focus control device 2 can drive the first optical element 221 to move to a first position and the second optical element 222 to move to a second position through the driving device 21 included therein to obtain a first light beam, and the focal depth of the first light beam is a first focal depth.

[0086] For example, Figure 4 As shown in FIG, a schematic diagram of the formation of the first light beam corresponding to a foil area is given. Figure 3 As shown, the driving device 21 drives the first optical element 221 to move a distance of L1 to the first position, and at the same time the second optical element 222 moves a distance of L2 to the second position. At this time, the spot size is 0.5X magnification, and a spot energy distribution state with a long focal depth is obtained.

[0087] When the target cutting area is a coating, the driving device 21 drives the first optical element 221 to move to the third position and the second optical element 222 to move to the fourth position to obtain a first light beam, and the focal depth of the first light beam is the second focal depth.

[0088] For example, Figure 5As shown in FIG, a schematic diagram of the formation of the first light beam corresponding to a coating area is given. Figure 5 As shown, the driving device 21 drives the first optical element 221 to move a distance of L3 to the third position, and at the same time the second optical element 222 moves a distance of L4 to the fourth position. At this time, the spot size is 2X magnification, and a spot energy distribution state with a short focal depth is obtained.

[0089] Here, there is no limitation on the type of the driving device 21 , for example, the driving device 21 may be a motor.

[0090] In some embodiments, the focal depth control device changes the focal depth of the received laser beam to obtain a target focal depth of the first beam, which is achieved by the following formula:

[0091]

[0092] Among them, Z R is the target focal depth, λ is the wavelength of the laser beam, M 2 is the quality of the laser beam, f is the focal length of the field lens, is the diameter of the laser beam.

[0093] In some embodiments, the driving device includes a voice coil motor and a slide rail linear motion mechanism, the slide rail linear motion mechanism includes a slide rail and a slider, and the voice coil motor drives the slider to move on the slide rail at a preset speed, and the preset speed is greater than a speed threshold.

[0094] The voice coil motor (VCM) is a special type of linear motor, named for its similar operating principle to a loudspeaker. It utilizes electromagnetic principles, moving an energized coil within the magnetic field of a permanent magnet to achieve linear motion or limited oscillation. VCMs offer advantages such as simple structure, compact size, high power efficiency, no need for commutation, low hysteresis, excellent linear control characteristics, and high acceleration.

[0095] A linear motion mechanism (LAM) provides smooth linear motion and is typically composed of a slide rail, a slider, and transmission components. The slide rail provides a path for the slider, while transmission components (such as a lead screw and gears) enable the slider's linear motion. These mechanisms offer smooth motion, precise positioning, and a high load-bearing capacity.

[0096] By combining the voice coil motor and the slide rail linear motion mechanism, the movement speed requirement of the focal depth control device for the optical components can be met.

[0097] The focal depth control device 2 is further configured to emit the first light beam to the galvanometer mirror 31 .

[0098] The galvanometer 31 is used to control the first light beam to be transmitted to the field lens 32 along a preset path to obtain a diffused light beam.

[0099] The galvanometer mainly consists of a fixed reflector and a movable reflector. When an electrical signal acts on the movable reflector, it vibrates at an extremely high speed, thereby changing the direction of the light beam.

[0100] In this way, after the focal depth control device 2 emits the first light beam to the galvanometer mirror 31 , the galvanometer mirror 31 can control the first light beam to be transmitted to the field lens 32 along a preset path to obtain a diffused light beam.

[0101] In some embodiments, when using a laser beam to cut the tab, the galvanometer 31 and the depth of focus control device 2 can be controlled in real-time linkage. The galvanometer 31 controls its laser cutting plane path trajectory, and the depth of focus control device 2 distributes its laser energy in the focal depth range in the z-axis direction. The two jointly control the three-dimensional motion mode of the laser beam cutting to achieve cutting of the target cutting area.

[0102] The field lens 32 is used to focus the diffused light beam to obtain a focused light beam, and cut the target cutting area with the focused light beam.

[0103] The field lens 32 is mainly used to focus the light from the galvanometer 31 on a plane, improving the ability of the edge beam to enter the detector. In this way, the diffuse light beam can be focused by the field lens 32 to obtain a focused beam, which can be used to cut the target cutting area.

[0104] In the embodiment of the present application, the cutting path of the focused light beam on the coating area and the cutting path on the foil area are continuous paths.

[0105] In an embodiment of the present application, a laser beam is emitted from a transmitting device to the focal depth control device. The focal depth control device controls the movable optical component to move to a target position corresponding to the target cutting area of ​​the tab, thereby changing the focal depth of the received laser beam to obtain a first beam. The first beam is then emitted to an optical lens device. The focal depth of the first beam is the target focal depth. The target focal depth varies depending on the type of target cutting area. The first beam is then used by the optical lens device to cut the target cutting area. In this way, precise cutting of different cutting areas in the tab can be achieved, improving cutting quality and tab manufacturing quality.

[0106] Furthermore, in an embodiment of the present application, when the laser cutting path is cutting in two different areas, the coating area and the foil area, the depth of focus control device automatically changes the energy distribution state of the focused light spot according to the target control instruction, and uses a short focal depth with higher energy density when moving to the cutting coating area, and uses a long focal depth with low energy density when cutting the foil area. Therefore, the energy distribution state of the light spot in the process of completing the tab forming is a continuously changing process. The long focal depth is better compatible with the unstable factor of jitter in the foil area, and can also be compatible with incoming materials with wavy edges on the pole pieces, thereby improving the production yield and stability of the equipment products.

[0107] Figure 6 A laser cutting method is provided in the embodiment of the present application, such as Figure 6 As shown, the method includes steps 601 to 603:

[0108] Step 601: transmit a laser beam to a focal depth control device via a transmitting device.

[0109] The launch device is connected to the focus depth control device and the optical lens device in sequence. The focus depth control device includes a driving device and a movable optical component. The so-called movable optical component refers to an optical component that can be moved to change its position.

[0110] In the embodiment of the present application, the emitting device may include a laser, which is responsible for generating a laser beam. Depending on the application requirements, the laser may be a continuous laser or a pulsed laser.

[0111] The laser generates a laser beam under the action of an excitation source. Parameters such as the wavelength, pulse repetition frequency, and single pulse energy of the laser beam are set according to application requirements.

[0112] In an embodiment of the present application, the emitting device emits a laser beam, which can be used to cut different types of target cutting areas of the tab.

[0113] Cutting is primarily based on the high energy density and focusing properties of the laser beam. When the laser beam strikes the surface of the material, it absorbs the laser energy and rapidly heats up to a melting or vaporizing temperature, enabling cutting. During the cutting process, an auxiliary gas (such as nitrogen, oxygen, or an inert gas) is often injected through a nozzle to protect the laser cutting area, remove melted material, and help speed up the cutting process.

[0114] In the embodiments of the present application, the laser may include multiple types.

[0115] For example, the laser can be a fiber laser cutter, which can achieve fast and precise cutting of various materials through high-quality beam quality and high energy density. Fiber laser cutters are widely used in processes such as cutting, punching, and engraving of metal sheets, pipes, stainless steel, and other materials.

[0116] Alternatively, the laser can be an ultrafast laser cutter, which features short pulse widths and high peak power, enabling precise processing of materials and high-quality cutting. Ultrafast laser cutters are primarily used for precise processing of materials in fields such as microelectronics manufacturing, optoelectronic devices, and biomedicine.

[0117] In step 602, the movable optical component is controlled to move to a target position corresponding to the target cutting area of ​​the tab through the depth of focus control device to change the focal depth of the received laser beam, obtain a first beam, and emit the first beam to the optical lens device. The focal depth of the first beam is the target focal depth. The target focal depth is different for different types of target cutting areas.

[0118] In the embodiments of this application, a movable optical component refers to an optical component that can be moved. An optical component, also known as an optical element or optical device, refers to a device or component used to control, adjust, change, or transmit light. Optical components may include lenses, prisms, reflectors, filters, etc.

[0119] Upon receiving the laser beam, the focus depth control device controls the movable optical assembly to move to a corresponding target position. This target position is determined based on the type of target cutting area of ​​the tab being cut. In other words, the target position to which the movable optical assembly moves varies depending on the type of target cutting area of ​​the tab being cut.

[0120] In the embodiment of the present application, there is no limitation on the manner in which the depth of focus control device controls the movable optical component to move to the target position corresponding to the target cutting area.

[0121] For example, in some embodiments, the focus depth control device may control the movable optical component to move to a target position corresponding to the target cutting area according to the type of the received target cutting area.

[0122] Of course, there is no limitation on the manner in which the focal depth control device obtains the type of the target cutting area. For example, other devices may send a signal to the focal depth control device so that the focal depth control device obtains the type of the current target cutting area.

[0123] In other embodiments, the focus depth control device can further control the movable optical assembly to move to a target position corresponding to the target cutting area based on the movement path. Here, the focus depth control device can pre-know the movement path for cutting different areas of the tab material. In this way, when the focus depth control device moves to the corresponding path, it can obtain the type of the current target cutting area.

[0124] After the movable optical component moves to the target position, it can change the focal depth of the laser beam incident thereon through its own characteristics to obtain the first beam, and can continue to emit the first beam to the optical lens device.

[0125] In the embodiment of the present application, the focal depth of the first light beam is the target focal depth, and the target focal depth varies depending on the type of the target cutting area.

[0126] That is, for different target cutting areas of the tab, after the movable optical assembly 22 is moved to the target position relative to the type of the target cutting area, it can change the focal depth of the laser beam incident thereon based on its own characteristics and positional relationship to obtain the target focal depth required for cutting according to the type of the current target cutting area. In this way, the target focal depth required varies depending on the type of the target cutting area.

[0127] For example, in some embodiments, the types of target cutting areas may include foils and coatings. When the target cutting area is a foil area, the focal depth of the first light beam is a first focal depth. When the target cutting area is a coating area, the focal depth of the first light beam is a second focal depth. The length of the first focal depth is greater than the length of the second focal depth.

[0128] This is because the material in the coating area is thicker and requires a relatively high laser energy density, while the material in the foil area is thinner and requires a relatively low laser energy density. A short focal depth of the laser beam can obtain a high energy density, while a long focal depth of the laser beam can obtain a low energy density.

[0129] Therefore, when the target cutting area is set to the foil area, the focal depth of the laser beam incident therein can be changed to the first focal depth through the focal depth control device; when the target cutting area is the coating area, the focal depth of the laser beam incident therein can be changed to the second focal depth through the focal depth control device, and the focal depth length of the first focal depth is greater than the focal depth length of the second focal depth, that is, the laser energy density of the foil area is set to be lower than the laser energy density of the coating area, so that the target cutting area is cut with a laser energy density that matches the type of the target cutting area, so as to achieve precise cutting of different types of cutting areas in the tab, thereby improving the cutting quality and the manufacturing quality of the tab.

[0130] In the production of full-tab batteries, the foil area typically refers to the empty foil area reserved at the edge of the current collector. This area will be cut into multiple tabs in subsequent processes. The quality of the foil area (such as flatness and thickness uniformity) has a significant impact on the cutting quality of the tabs and the overall performance of the battery.

[0131] Step 603: Cut the target cutting area using the first light beam through the optical lens device.

[0132] In an embodiment of the present application, after the focal depth control device changes the focal depth of the laser beam incident therein to the target focal depth required by the type of target cutting area, the changed first light beam can be emitted to the optical lens device so that the target cutting area can be cut using the first light beam through the optical lens device.

[0133] In an embodiment of the present application, a laser beam is emitted from a transmitting device to the focal depth control device. The focal depth control device controls the movable optical component to move to a target position corresponding to the target cutting area of ​​the tab, thereby changing the focal depth of the received laser beam to obtain a first beam. The first beam is then emitted to an optical lens device. The focal depth of the first beam is the target focal depth. The target focal depth varies depending on the type of target cutting area. The first beam is then used by the optical lens device to cut the target cutting area. In this way, precise cutting of different cutting areas in the tab can be achieved, improving cutting quality and tab manufacturing quality.

[0134] It should be understood that, although the steps in the above-mentioned flowcharts are shown in sequence according to the instructions of the arrows, these steps are not necessarily performed in sequence in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and these steps can be performed in other orders. Moreover, at least a portion of the steps in the above-mentioned flowcharts may include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily performed at the same time, but can be performed at different times, and the execution order of these sub-steps or stages is not necessarily to be performed in sequence, but can be performed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.

[0135] It should be noted that, in the embodiment of the present application, if the above method is implemented in the form of a software function module and sold or used as an independent product, it can also be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the embodiment of the present application is essentially or the part that contributes to the relevant technology can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for enabling an electronic device to execute all or part of the method described in each embodiment of the present application. The aforementioned storage medium includes various media that can store program codes, such as a U disk, a mobile hard disk, a read-only memory (ROM), a magnetic disk or an optical disk. In this way, the embodiment of the present application is not limited to any specific combination of hardware and software.

[0136] The embodiment of the present application provides a computer device, which may be a server, and its internal structure diagram may be as follows: Figure 7 As shown. The computer device includes a processor, a memory, and a network interface connected via a system bus. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program, and a database. The internal memory provides an environment for the operation of the operating system and computer program in the non-volatile storage medium. The database of the computer device is used to store data. The network interface of the computer device is used to communicate with an external terminal via a network connection. When the computer program is executed by the processor, the above method is implemented.

[0137] An embodiment of the present application provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the steps of the method provided in the above embodiment are implemented.

[0138] An embodiment of the present application provides a computer program product containing instructions, which, when executed on a computer, enables the computer to execute the steps of the method provided in the above method embodiment.

[0139] Those skilled in the art will understand that Figure 7 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than shown in the figure, or combine certain components, or have a different component arrangement.

[0140] It should be noted that the description of the above storage medium and device embodiments is similar to the description of the above method embodiments and has similar beneficial effects as the method embodiments. For technical details not disclosed in the storage medium, storage medium, and device embodiments of this application, please refer to the description of the method embodiments of this application for understanding.

[0141] It should be understood that "one embodiment" or "an embodiment" or "some embodiments" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" or "in some embodiments" appearing throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application. The above-mentioned serial numbers of the embodiments of the present application are for description only and do not represent the advantages and disadvantages of the embodiments. The above description of the various embodiments tends to emphasize the differences between the various embodiments. The same or similar aspects can be referenced to each other. For the sake of brevity, they will not be repeated here.

[0142] The term "and / or" in this article is only a description of the association relationship between associated objects, indicating that there can be three relationships. For example, object A and / or object B can mean: object A exists alone, object A and object B exist at the same time, and object B exists alone.

[0143] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0144] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. The embodiments described above are merely illustrative. For example, the division of the modules is merely a logical function division. In actual implementation, there may be other division methods, such as: multiple modules or components can be combined, or can be integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the components shown or discussed can be through some interfaces, and the indirect coupling or communication connection of devices or modules can be electrical, mechanical or other forms.

[0145] The modules described above as separate components may or may not be physically separated, and the components displayed as modules may or may not be physical modules; they may be located in one place or distributed across multiple network units; some or all of the modules may be selected according to actual needs to achieve the purpose of this embodiment.

[0146] In addition, all functional modules in the embodiments of the present application can be integrated into one processing unit, or each module can be a separate unit, or two or more modules can be integrated into one unit; the above-mentioned integrated modules can be implemented in the form of hardware or in the form of hardware plus software functional units.

[0147] Those skilled in the art will understand that all or part of the steps of implementing the above-mentioned method embodiment can be completed by hardware related to program instructions, and the aforementioned program can be stored in a computer-readable storage medium. When the program is executed, it executes the steps of the above-mentioned method embodiment; and the aforementioned storage medium includes: mobile storage devices, read-only memories (ROM), magnetic disks or optical disks, and other media that can store program codes.

[0148] Alternatively, if the above-mentioned integrated unit of the present application is implemented in the form of a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the embodiment of the present application, or the part that contributes to the relevant technology, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes a number of instructions for enabling an electronic device to execute all or part of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as mobile storage devices, ROMs, magnetic disks or optical disks.

[0149] The methods disclosed in the several method embodiments provided in this application can be arbitrarily combined without conflict to obtain new method embodiments.

[0150] The features disclosed in the several product embodiments provided in this application can be arbitrarily combined without conflict to obtain new product embodiments.

[0151] The features disclosed in the several method or device embodiments provided in this application can be arbitrarily combined without conflict to obtain new method embodiments or device embodiments.

[0152] The above is merely an embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A laser cutting system, comprising a launch device, a focus depth control device, and an optical lens device, wherein the launch device is sequentially connected to the focus depth control device and the optical lens device, the focus depth control device includes a movable optical assembly, the movable optical assembly includes a first optical element and a second optical element, and the focus depth control device further includes a drive device, wherein: The emitting device is used to emit a laser beam toward the focal depth control device; The focal depth control device is used to control the movable optical component to move to a target position corresponding to the target cutting area of ​​the tab, so as to change the focal depth of the received laser beam, obtain a first beam, and emit the first beam to the optical lens device. The focal depth of the first beam is a target focal depth. The target focal depth varies depending on the type of the target cutting area. The focal depth control device is specifically configured to, when the target cutting area is a foil, drive the first optical element to move to a first position and the second optical element to move to a second position by the driving device, so as to obtain the first light beam, and the focal depth of the first light beam is a first focal depth; Furthermore, when the target cutting area is a coating, the driving device drives the first optical element to move to a third position and the second optical element to move to a fourth position to obtain the first light beam, the focal depth of the first light beam is the second focal depth, and the length of the first focal depth is greater than the length of the second focal depth; The optical lens device is used to cut the target cutting area through the first light beam; The focal depth control device changes the focal depth of the received laser beam to obtain the target focal depth of the first beam, which is achieved by the following formula: = ； in, is the target focal depth, is the wavelength of the laser beam, is the quality of the laser beam, is the focal length of the field lens, is the diameter of the laser beam.

2. The system according to claim 1, wherein: The focus depth control device is used to control the movable optical component to move to a target position corresponding to the target cutting area according to the type or moving path of the received target cutting area.

3. The system according to claim 2, characterized in that The system further includes a command control device, which establishes a communication connection with the depth of focus control device, wherein: The instruction control device is used to send a target control instruction to the focal depth control device when it is detected that the emitting device emits a laser beam, and the target control instruction includes the type of the target cutting area.

4. The system according to claim 1, wherein: The optical lens device includes a galvanometer and a field lens, the galvanometer is connected to the focal depth control device, and the field lens is connected to the galvanometer, wherein: The galvanometer is used to control the first light beam to be transmitted to the field lens along a preset path to obtain a diffused light beam; The field lens is used to focus the diffuse light beam to obtain a focused light beam, and cut the target cutting area with the focused light beam.

5. The system according to claim 1, wherein: The driving device includes a voice coil motor and a slide rail linear motion mechanism, the slide rail linear motion mechanism includes a slide rail and a slider, the voice coil motor drives the slider to move on the slide rail at a preset speed, and the preset speed is greater than a speed threshold.

6. The system according to claim 4, characterized in that The cutting path of the focused light beam on the coating area and the cutting path on the foil area are continuous paths.

7. A laser cutting method, characterized in that: The method is applied to the laser cutting system according to any one of claims 1 to 6, and the method comprises: emitting a laser beam toward the focal depth control device via the emitting device; The movable optical component is controlled to move to a target position corresponding to a target cutting area of ​​the tab by the focal depth control device, so as to change the focal depth of the received laser beam to obtain a first beam, and the first beam is emitted to the optical lens device. The focal depth of the first beam is a target focal depth. The target focal depth varies depending on the type of the target cutting area. Wherein, when the type of the target cutting area is a foil, the driving device drives the first optical element to move to a first position, and the second optical element to move to a second position, so as to obtain the first light beam, and the focal depth of the first light beam is a first focal depth; Furthermore, when the target cutting area is a coating, the driving device drives the first optical element to move to a third position and the second optical element to move to a fourth position to obtain the first light beam, the focal depth of the first light beam is the second focal depth, and the length of the first focal depth is greater than the length of the second focal depth; cutting the target cutting area using the first light beam through the optical lens device; The focal depth control device changes the focal depth of the received laser beam to obtain the target focal depth of the first beam, which is achieved by the following formula: = ； in, is the target focal depth, is the wavelength of the laser beam, is the quality of the laser beam, is the focal length of the field lens, is the diameter of the laser beam.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program that can be run on the processor, characterized in that: When the processor executes the program, the steps of the method according to claim 7 are implemented.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method according to claim 7 is implemented.

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