A wafer film mounting machine for semiconductor devices

Abstract

The present invention provides a wafer film laminating machine for semiconductor devices, belonging to the field of wafer film laminating technology. The invention includes a machine body, a film laminating ring and a cover plate, wherein the machine body is fixedly mounted with a base, a mounting seat, a material discharging seat and a protective cover, and also includes: a cutting component, a flattening and de-bubbling component, and an outer film adsorption component; the present invention can automatically tear off the excess film material while realizing the de-bubbling of the film on the wafer; through the unique design of the flattening and de-bubbling component, the stretching and sliding of the elastic band are utilized to effectively remove the bubbles between the film material and the wafer in a non-direct stretching manner, thereby solving the problem of bubbles caused by insufficient tension in the width direction of the film body in the traditional film laminating method, and at the same time, the outer film adsorption component will automatically fix the outer film; on the basis of negative pressure adsorption to stabilize the film material, the driving rod can automatically tear off the outer film after adsorption, thereby avoiding the problem of film peeling or edge warping caused by uneven film tearing force or inaccurate direction in the traditional film laminating machine.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer film bonding, and in particular to a wafer film bonding machine for semiconductor devices. Background Art

[0002] Wafer refers to the silicon chip used in the manufacture of silicon semiconductor integrated circuits. The surface finish of the wafer is required to be high. Slicing is required during wafer processing, but it is easy to cause silicon wafers to pop out during mechanical processing, causing damage and affecting performance. Therefore, during the circulation process, the surface of the wafer needs to be covered with a protective film to prevent the wafer from popping out during slicing and other processes.

[0003] Most of the existing film laminating methods are to place the wafer and the film laminating ring at the designated position of the film laminating table, and pull the blue film or UV film on the film roll mechanically or manually and place it on the wafer. However, this method can only tension the film in the length direction, and cannot effectively tension it in the width direction. When the film is not fully tensioned, it is easy to form gaps at the edge or uneven places when it is attached to the wafer surface, and then generate bubbles. These bubbles not only affect the appearance quality of the product, but may also have an adverse effect on the subsequent processing and use performance of the wafer. In addition, in traditional semi-automatic film laminating machines, due to inaccurate film tearing force and direction, it is easy to peel off the effective film layer on the wafer while tearing off the waste film, or cause the edge of the film layer to warp. These problems will seriously affect the quality and reliability of the product.

[0004] How to invent a semiconductor device wafer bonding machine to solve these problems has become an urgent problem to be solved by technicians in this field. Summary of the invention

[0005] In order to make up for the above shortcomings, the present invention provides a wafer bonding machine for semiconductor devices, aiming to solve the problems mentioned in the above background.

[0006] The present invention is achieved in that:

[0007] The present invention provides a semiconductor device wafer film mounting machine, comprising a machine body, a film mounting ring and a cover plate, wherein the machine body is fixedly mounted with a base, a mounting seat, a material discharging seat and a protective cover, wherein the mounting seat and the material discharging seat are arranged inside the protective cover, wherein a film roll and a cleaning roller are rotatably arranged inside the mounting seat and the material discharging seat respectively, wherein the top of the base is used to place the film mounting ring, wherein a substrate is arranged at the outer side of the film mounting ring, wherein the substrate is fixedly connected to the machine body, wherein the cover plate is hinged to the outer side of the material discharging seat, wherein slide grooves are symmetrically arranged on the machine body, wherein a guide rail is fixedly mounted inside the slide groove, wherein a sliding seat is slidably arranged on the guide rail, wherein a roller pressing device for compacting the film material is fixedly mounted on the top of the two sliding seats, and further comprising:

[0008] Cutting assembly: The cutting assembly is arranged on the cover plate, and is used to cut the pulled film material;

[0009] Flattening and de-bubble assembly: The flattening and de-bubble assembly is arranged on the machine body, and is used to scrape and spread the film material and remove the excess outer film, and at the same time, it can squeeze out the bubbles between the film material and the wafer;

[0010] Outer film adsorption component: the outer film adsorption component is arranged in the machine body, and the outer film adsorption component can automatically adsorb the outer film to be removed when the flattening bubble removal component is working.

[0011] Preferably, the cutting assembly includes an annular cutter and a slide rail, the annular cutter is arranged at the bottom of the cover plate, a crank is arranged on the top of the cover plate, the end of the crank passes through the side wall of the cover plate and is fixedly connected to the annular cutter, the slide rail is fixedly arranged on the rear side of the cover plate, and a cutter for transversely cutting the film material is slidably arranged on the slide rail.

[0012] Preferably, when the cover plate is buckled with the machine body, the ends of the annular cutter and the cutter are in contact with the film material, and when the cover plate is rotated, there is a gap between the cutter and the rolling device.

[0013] Preferably, the flattening and debubble removal component includes an elastic belt, a toothed disc and an installation cavity arranged in the machine body, a motor is fixedly installed on the bottom wall of the installation cavity, a gear is fixedly connected to the output end of the motor, the gear is meshed with the toothed disc, a limiting boss is arranged on the outer side wall of the toothed disc, and the toothed disc is rotatably engaged with the machine body through the limiting boss.

[0014] Preferably, the installation cavity is located directly below the substrate and is arranged around the base, and a ventilation groove is provided between the installation cavity and the guide rail.

[0015] Preferably, the flat paving and bubble removal assembly also includes a fixed rod fixedly connected to the base plate and a driving rod fixedly connected to the side wall of the toothed disk, the two ends of the elastic band are rotatably sleeved on the fixed rod and the driving rod respectively, and a guide groove matching the driving rod is provided on the side wall of the base plate, and the end of the guide groove passes through the side wall of the base plate.

[0016] Preferably, the guide groove is an incomplete annular setting, the guide groove is located outside the cutting track of the annular cutter, the elastic band is made of elastic material and its bottom end is in contact with the top surface of the film material, the motor has a built-in speed sensor, and the motor will switch the rotation direction when the driving rod is blocked by the guide groove.

[0017] Preferably, in the initial state, the driving rod is at the lower end of the incomplete guide groove, there is a gap between the rolling device and the fixed rod and the driving rod in the initial state, the film material is located on the inner side of the guide groove, and in the initial state, there is a gap between the edge of the film material and the driving rod.

[0018] Preferably, the outer membrane adsorption assembly includes a connecting rod fixedly arranged inside the installation cavity and a plurality of toggle blocks fixedly arranged on the bottom side of the gear disc, an air storage bag is fixedly arranged on the connecting rod, and an air intake port and an air exhaust port are respectively arranged at the upper and lower ends of the air storage bag, the air storage bag and the toggle blocks are equidistantly distributed in a circular shape along the central axis of the gear disc, and a plurality of air intake channels are arranged through the side walls of the body and the substrate corresponding to the air intake port, and the air intake channels are connected to the air intake port.

[0019] Preferably, the air inlet is a one-way air inlet, the air outlet is a one-way air outlet, the air storage bag is made of a deformable material with toughness, and the toggle block conflicts with the air storage bag when it rotates.

[0020] The beneficial effects of the present invention are:

[0021] The present invention can not only remove bubbles from the film on the wafer, but also automatically tear off excess film material; the flat debubble component removes bubbles between the film material and the wafer by "pushing" or "scraping" through the stretching and sliding of the elastic band, rather than directly stretching the film material, thereby ensuring the flat fit of the film material, improving the quality of the film, and solving the bubble problem caused by insufficient tension in the width direction of the film in the traditional method; the elastic band clings to the surface of the film material during the stretching process, avoiding direct stretching of the film material, maintaining the shape and dimensional stability of the film material, and reducing the risk of physical damage; in addition, the position of the elastic band can be automatically adjusted according to the different shapes and areas of the film surface, ensuring the consistency and comprehensiveness of the debubble effect.

[0022] At the same time, when the air storage bag returns to its original shape after being squeezed by the toggle block, negative pressure is formed, which acts on the blocked film material through the suction channel to generate adsorption force, thereby realizing automatic fixation of the outer film material. This step not only stabilizes the position of the film material and reduces the movement and deviation during the film tearing process, but also further weakens the adhesion between the film material and the substrate, creating favorable conditions for subsequent film tearing operations. After the negative pressure adsorption stabilizes the film material, the driving rod can automatically tear off the outer film after adsorption. Since the film material has been firmly adsorbed on the substrate by negative pressure at this time, the driving rod can apply force more stably when tearing the film, avoiding the problem of film peeling or warping caused by uneven film tearing force or inaccurate direction in traditional film laminating machines. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 It is a schematic diagram of the overall structure of a wafer bonding machine for semiconductor devices provided by an embodiment of the present invention;

[0025] Figure 2 It is a structural schematic diagram of a semiconductor device wafer mounting machine flattening and bubble removal component when the work is about to end, provided by an embodiment of the present invention;

[0026] Figure 3 It is a structural schematic diagram of a semiconductor device wafer mounting machine flat-laying and bubble removal component in operation provided by an embodiment of the present invention;

[0027] Figure 4 It is a schematic structural diagram of a rolling device of a wafer film mounting machine for semiconductor devices provided by an embodiment of the present invention when in operation;

[0028] Figure 5 It is a schematic diagram of a cross-sectional structure of a cover plate of a wafer bonding machine for a semiconductor device provided by an embodiment of the present invention;

[0029] Figure 6 It is a schematic structural diagram of an initial state of a flattening and de-bubble assembly of a semiconductor device wafer mounter provided by an embodiment of the present invention;

[0030] Figure 7 It is a schematic diagram of a film roll structure of a wafer film mounting machine for a semiconductor device provided by an embodiment of the present invention;

[0031] Figure 8 It is a schematic diagram of a right side cross-sectional structure of a wafer bonding machine for semiconductor devices provided by an embodiment of the present invention;

[0032] Fig. 9 A semiconductor device wafer mounting machine provided by an embodiment of the present invention Figure 8 The enlarged structural diagram at A in the middle;

[0033] Fig.10 It is a schematic diagram of a partial explosion structure of a wafer mounting machine for a semiconductor device provided by an embodiment of the present invention;

[0034] Fig.11 It is a schematic diagram of a partial cross-sectional structure of a semiconductor device wafer bonding machine provided by an embodiment of the present invention;

[0035] Fig.12 It is a schematic diagram of the front cross-sectional structure of a wafer bonding machine for semiconductor devices provided in an embodiment of the present invention.

[0036] In the figure: 1. body; 2. cover plate; 3. substrate; 4. base; 5. rolling device; 6. film roll; 7. suction channel; 8. elastic belt; 9. toothed disc; 11. protective cover; 12. slide groove; 13. guide rail; 14. installation cavity; 15. ventilation groove; 21. ring cutter; 22. crank; 23. slide rail; 24. cutter; 31. guide groove; 41. film ring; 61. mounting seat; 62. discharge seat; 63. cleaning roller; 71. air storage bag; 72. suction port; 73. exhaust port; 81. fixing rod; 82. driving rod; 91. toggle block; 92. limit boss; 93. gear; 131. sliding seat; 141. motor; 142. connecting rod. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] Embodiment 1, refer to Figure 1-Figure 6 A semiconductor device wafer film mounting machine comprises a machine body 1, a film mounting ring 41 and a cover plate 2. A base 4, a mounting seat 61, a material discharging seat 62 and a protective cover 11 are fixedly mounted on the machine body 1. The mounting seat 61 and the material discharging seat 62 are arranged inside the protective cover 11. A film roll 6 and a cleaning roller 63 are rotatably arranged in the mounting seat 61 and the material discharging seat 62 respectively. The film material on the film roll 6 is pulled out, and the upper surface of the film material is cleaned by the cleaning roller 63. The top of the base 4 is used to place the film mounting ring 41. The outer side of the film mounting ring 41 is provided with a substrate 3. The plate 3 is fixedly connected to the machine body 1, the cover plate 2 is hinged to the outer side of the discharge seat 62, the machine body 1 is symmetrically provided with a slide groove 12, a guide rail 13 is fixedly installed in the slide groove 12, a sliding seat 131 is slidably provided on the guide rail 13, and a roller pressing device 5 for compacting the film material is fixedly installed on the top of the two sliding seats 131. The cover plate 2 is opened, the wafer is placed on the film sticking ring 41, the film material is pulled to completely cover the film sticking ring 41, and then the roller pressing device 5 is pulled to preliminarily compact the film material and fix it with the wafer and the film sticking ring 41, and also includes:

[0039] Cutting assembly: The cutting assembly is arranged on the cover plate 2, and is used to cut the pulled film material;

[0040] Flattening and de-bubble assembly: The flattening and de-bubble assembly is arranged on the machine body 1, and is used to scrape and spread the film material and remove the excess outer film, and at the same time, it can squeeze out the bubbles between the film material and the wafer;

[0041] Outer membrane adsorption component: The outer membrane adsorption component is arranged in the body 1, and the outer membrane adsorption component can automatically adsorb the outer membrane to be removed when the flattening and degassing component is working.

[0042] Furthermore, the cutting assembly includes an annular cutter 21 and a slide rail 23. The annular cutter 21 is arranged at the bottom of the cover plate 2. A crank 22 is arranged on the top of the cover plate 2. The end of the crank 22 passes through the side wall of the cover plate 2 and is fixedly connected to the annular cutter 21. By shaking the crank 22, the annular cutter 21 can be rotated. The slide rail 23 is fixedly arranged on the rear side of the cover plate 2. A cutter 24 for transversely cutting the film material is slidably arranged on the slide rail 23. By moving the cutter 24, the film material and the film roll 6 can be cut.

[0043] It should be noted that when the cover plate 2 is buckled with the body 1, the ends of the annular cutter 21 and the cutter 24 are in contact with the film material to ensure that the film material can be effectively cut. When the cover plate 2 rotates, there is a gap between the cutter 24 and the rolling device 5 to ensure that the two do not conflict.

[0044] In this embodiment, the film material is pulled out from the film roll 6, and the upper surface of the film material is cleaned by the cleaning roller 63 to remove dust, impurities, etc. to ensure the cleanliness of the surface of the film material. The cleaned film material passes under the rolling device 5, and then the operator opens the cover plate 2 and places the wafer on the film ring 41. The film material is manually pulled and covered on the wafer and the film ring 41 to ensure complete coverage with a margin on the edge; then, the operator pulls the rolling device 5, and the rolling device 5 slides along the guide rail 13 to preliminarily compact the film material so that it fits tightly with the wafer and the film ring 41, and preliminarily fixes the position of the film material.

[0045] After the fixation is completed, the operator buckles the cover plate 2, prepares for the cutting operation, and rotates the crank 22. The crank 22 drives the annular cutter 21 to perform a circular motion. The sharp blade of the annular cutter 21 contacts the film material during the rotation process, and cuts along the circular contour of the wafer to cut the film material into a circle that matches the shape of the wafer; after completing the circular cutting, the operator can slide the cutter 24 along the slide rail 23 to cut the film material horizontally. The sharp blade of the cutter 24 contacts the film material during the sliding process, and the film material and the film roll 6 can be separated, which is convenient for the subsequent processing of the cut film material.

[0046] In summary, the cutting assembly achieves efficient and accurate cutting of the film material through the precise cooperation between the annular cutting knife 21 and the cutting knife 24, providing important support for the film attaching process of the wafer.

[0047] Example 2, refer to Figure 2-Figure 8 The flattening and debubble removing component includes an elastic belt 8, a toothed disc 9 and an installation cavity 14 arranged in the body 1. A motor 141 is fixedly installed on the bottom wall of the installation cavity 14. A gear 93 is fixedly connected to the output end of the motor 141. The gear 93 is meshed with the toothed disc 9. A limiting boss 92 is arranged on the outer wall of the toothed disc 9. The toothed disc 9 is rotatably engaged with the body 1 through the limiting boss 92. When the motor 141 is started, the gear 93 starts to rotate, and the gear 93 drives the toothed disc 9 to rotate synchronously. The installation cavity 14 is located directly below the substrate 3 and is arranged around the base 4. A ventilation groove 15 is arranged between the installation cavity 14 and the guide rail 13 to maintain air circulation inside the installation cavity 14.

[0048] Furthermore, the flat paving and debubble removal component also includes a fixing rod 81 fixedly connected to the base plate 3 and a driving rod 82 fixedly connected to the side wall of the toothed disk 9. The two ends of the elastic belt 8 are rotatably sleeved on the fixing rod 81 and the driving rod 82 respectively. A guide groove 31 matching the driving rod 82 is provided on the side wall of the base plate 3. The end of the guide groove 31 passes through the side wall of the base plate 3. When the toothed disk 9 rotates, it drives the driving rod 82 to slide in the guide groove 31.

[0049] It should be noted that the guide groove 31 is an incomplete annular setting. The guide groove 31 is located outside the cutting track of the annular cutter 21. The elastic band 8 is made of elastic material and its bottom end is in contact with the top surface of the film material. The elastic band 8 can apply uniform pressure to the film material during movement, which helps to remove bubbles between the film material and the wafer and ensure the smooth fit of the film material. When the driving rod 82 moves, the position of the elastic band 8 can be adjusted by changing the relative positions of the fixed rod 81 and the driving rod 82, so that the film on the wafer can be effectively processed. The bottom end of the elastic band 8 will squeeze the bubbles on the film from one side to the other side of the film area. The motor 141 has a built-in speed sensor. When the driving rod 82 is blocked by the guide groove 31, the motor 141 will switch the rotation direction and can be automatically reset.

[0050] In the initial state, the driving rod 82 is at the lower end of the incomplete side of the guide groove 31. There is a gap between the rolling device 5 and the fixed rod 81 and the driving rod 82 in the initial state, which avoids the rolling device 5 from conflicting with the fixed rod 81 and the driving rod 82. The film material is located on the inner side of the guide groove 31. In the initial state, there is a gap between the edge of the film material and the driving rod 82, which ensures that the driving rod 82 will not affect the adhesion of the film material. At the same time, when the driving rod 82 moves, the excess film material can be effectively torn off.

[0051] In this embodiment, after the cutting work is completed, the driving rod 82 is located at the lower end of the incomplete side of the guide groove 31 ( Figure 6 As shown), at this time, the elastic band 8 is in a relaxed state, and a certain gap is maintained between the elastic band 8 and the film material to avoid unnecessary pressure or deformation on the newly cut film material.

[0052] When the motor 141 is started, the gear 93 driven by its output end starts to rotate. Due to the meshing relationship between the gear 93 and the toothed disc 9, the toothed disc 9 also rotates. The rotation of the toothed disc 9 further drives the driving rod 82 fixed on its upper side wall to slide in the guide groove 31 of the side wall of the base plate 3.

[0053] Stretching and debubbling of the elastic band 8: As the driving rod 82 moves in the guide groove 31, the two ends of the elastic band 8 are fixed on the fixing rod 81 and the driving rod 82 respectively, so that the elastic band 8 is gradually stretched and pressed against the surface of the film material. During this process, the elastic band 8 applies uniform pressure to the film material, which helps to remove bubbles between the film material and the wafer and ensure the smooth fit of the film material. The sliding of the elastic band 8 on the surface of the film material not only removes bubbles, but also squeezes the bubbles on the film from one side to the other side of the film area through the movement of its bottom end, thereby achieving effective debubbling and leveling of the film on the wafer, while avoiding unnecessary stretching or damage to the film material itself.

[0054] It should be noted that the sliding of the elastic band 8 on the surface of the film material is a key process. This sliding not only removes bubbles, but also squeezes the bubbles on the film from one side to the other side of the film area through the movement of its bottom end. In this process, the elastic band 8 mainly plays a role of "pushing" or "scraping" instead of stretching the film material. Therefore, the shape and size of the film material are maintained during the processing.

[0055] Automatic adjustment and position optimization: Through the relative position change of the fixing rod 81 and the driving rod 82, the position of the elastic band 8 will be automatically adjusted to adapt to different areas and shapes of the membrane surface, ensuring the consistency and comprehensiveness of the debubble effect.

[0056] Tearing off excess film material: When the driving rod 82 moves with the toothed disc 9, the driving rod 82 can contact the excess part of the film material outside the cutting. As the driving rod 82 continues to move, this part of the excess film material will be smoothly torn off and automatically detached from the wafer film after the film pasting and bubble removal treatment. Since the movement of the driving rod 82 is precisely controlled by the motor 141, the tearing process is stable and uniform, avoiding damage to the film material or wafer contamination caused by improper tearing, while also reducing the time and cost of manual operation and speeding up the entire film pasting process.

[0057] Automatic reset: When the driving rod 82 moves to the end of the guide groove 31 and is blocked, the speed sensor built into the motor 141 detects the change in resistance and automatically switches the rotation direction. At this time, the driving rod 82 starts to move in the opposite direction, and the elastic band 8 relaxes and returns to the initial position, facilitating the next film application process.

[0058] To sum up, the flattening bubble removal component removes bubbles between the film material and the wafer by stretching and sliding the elastic belt 8 in a "pushing" or "scraping" manner rather than directly stretching the film material, thereby ensuring the smooth fit of the film material, improving the quality of film lamination, and solving the bubble problem caused by insufficient tension in the width direction of the film in the traditional method; while achieving the bubble removal of the film on the wafer, the excess film material can also be automatically torn off. This design not only improves the quality of film lamination and production efficiency, but also reduces the complexity and error rate of manual operation. It is an important innovation in the wafer film lamination process.

[0059] Example 3, refer to Figure 8-Figure 12 The outer film adsorption component includes a connecting rod 142 fixedly arranged inside the installation cavity 14 and a plurality of toggle blocks 91 fixedly arranged on the bottom side of the toothed disc 9. An air storage bag 71 is fixedly arranged on the connecting rod 142. The upper and lower ends of the air storage bag 71 are respectively provided with an air suction port 72 and an air exhaust port 73. The air storage bag 71 and the toggle block 91 are equidistantly distributed in a ring shape along the central axis of the toothed disc 9. A plurality of air suction channels 7 are provided through the side walls of the body 1 and the substrate 3 corresponding to the air suction port 72. The air suction channels 7 are connected to the air suction ports 72. When the toothed disc 9 rotates, the toggle block 91 rotates accordingly. When the toggle block 91 rotates, the toggle block 91 squeezes the air storage bag 71. At this time, the gas in the air storage bag 71 will be discharged from the exhaust port 73. When the toggle block 91 leaves, the air storage bag 71 will gradually return to its original state. Since the air suction channel 7 is blocked by the film material, the air suction channel 7 will automatically adsorb the outer film material to be removed under the action of negative pressure.

[0060] It should be noted that the air intake port 72 is a one-way air intake and the air exhaust port 73 is a one-way air outlet. The air intake port 72 is used to replenish gas from the air intake channel 7, and the air exhaust port 73 is used to discharge the gas in the air bag 71. The air bag 71 is made of a deformable material with toughness. When it is not squeezed, it will gradually return to its original shape. When the toggle block 91 rotates, it will conflict with the air bag 71 to ensure that the air bag 71 can be effectively squeezed.

[0061] In this embodiment, as the motor 141 drives the gear plate 9 to rotate, the toggle block 91 fixed on the bottom side thereof also starts to rotate. When the toggle block 91 rotates to contact the air storage bag 71, due to the design of its shape and position, the toggle block 91 will effectively squeeze the air storage bag 71. Due to the toughness of the air storage bag 71, it will deform when squeezed and discharge the internal gas through the exhaust port 73.

[0062] As the toothed disc 9 continues to rotate, the toggle block 91 gradually moves away from the air bag 71. When the toggle block 91 leaves the air bag 71, the air bag 71 gradually returns to its original state due to the toughness of its material. Since the air intake channel 7 has been completely blocked by the film material at this time, the air intake port 72 cannot obtain gas from the outside to replenish the air bag 71. Therefore, in the process of the air bag 71 returning to its original state, a negative pressure is formed inside it. The negative pressure acts on the blocked film material through the air intake channel 7 to generate an adsorption force. Under the action of the negative pressure, the air intake channel 7 automatically adsorbs the outer film material to be removed, thereby realizing automatic fixation of the outer film material. At the same time, the driving rod 82 will also automatically tear off the film materials fixed by the negative pressure.

[0063] Specifically, this solution has the following advantages:

[0064] Film tearing cleanliness: Since the film tearing process is carried out under a stable state of negative pressure adsorption, the adhesion between the film material and the substrate 3 is effectively weakened, making the film tearing process smoother and reducing the generation of debris and residue. This clean film tearing effect helps to maintain the cleanliness of the wafer, substrate 3, etc., and avoids adverse effects on subsequent processes.

[0065] Avoid damage: When traditional film laminating machines peel off waste film, it is easy to peel off the effective film layer on the wafer or cause edge warping problems because they cannot accurately control the tearing force and direction. However, this solution effectively avoids these problems through the negative pressure adsorption of the outer film and the film tearing method driven by the driving rod 82, thereby protecting the integrity of the wafer film and reducing damage caused by improper film tearing.

[0066] Improve product quality: The accuracy and cleanliness of the film tearing process are directly related to the quality of the final product. Through the implementation of this solution, the product qualification rate can be significantly improved, and the scrap rate caused by film tearing problems can be reduced, thereby improving the overall product quality.

[0067] To sum up, the present solution adopts the method of tearing off the outer film after adsorption. After the film material is stably adsorbed by negative pressure, the driving rod 82 can more accurately control the position and force of film tearing to ensure that the film tearing process is both clean and thorough. This helps to reduce the debris and residue generated during the film tearing process, improve product quality, and avoid the problem of traditional film laminating machines peeling off the film on the wafer when peeling off the waste film or causing warping. At the same time, the entire adsorption and film tearing process is automated, without the need for manual intervention, thereby greatly improving production efficiency.

[0068] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0069] It should be noted that the specific model and specifications of the motor need to be selected and determined based on the actual specifications of the device, and the specific selection calculation method adopts the existing technology in this field, so it will not be described in detail.

[0070] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A semiconductor device wafer film mounting machine, comprising a machine body (1), a film mounting ring (41) and a cover plate (2), wherein the machine body (1) is fixedly mounted with a base (4), a mounting seat (61), a material discharging seat (62) and a protective cover (11), wherein the mounting seat (61) and the material discharging seat (62) are arranged inside the protective cover (11), and a film roll (6) and a cleaning roller (63) are rotatably arranged inside the mounting seat (61) and the material discharging seat (62), respectively, and the top of the base (4) is used to place the film mounting ring (41) 1), a base plate (3) is provided on the outer side of the film sticking ring (41), the base plate (3) is fixedly connected to the machine body (1), the cover plate (2) is hinged to the outer side of the discharge seat (62), the machine body (1) is symmetrically provided with slide grooves (12), a guide rail (13) is fixedly installed in the slide groove (12), a sliding seat (131) is slidably provided on the guide rail (13), and a roller pressing device (5) for compacting the film material is fixedly installed on the top of the two sliding seats (131), characterized in that: Also includes: Cutting assembly: the cutting assembly is arranged on the cover plate (2), and is used to cut the drawn film material; Flattening and de-bubble assembly: the flattening and de-bubble assembly is arranged on the machine body (1), and is used to scrape and spread the film material flat and remove excess outer film, and at the same time can squeeze out the bubbles between the film material and the wafer; The flattening and de-bubble removing component comprises an elastic belt (8), a toothed disc (9) and an installation cavity (14) arranged in a body (1); a motor (141) is fixedly installed on the bottom wall of the installation cavity (14); a gear (93) is fixedly connected to the output end of the motor (141); the gear (93) is meshed with the toothed disc (9); a limiting boss (92) is arranged on the outer side wall of the toothed disc (9); and the toothed disc (9) is rotatably engaged with the body (1) via the limiting boss (92); Outer membrane adsorption component: the outer membrane adsorption component is arranged in the machine body (1), and the outer membrane adsorption component can automatically adsorb the outer membrane to be removed when the flattening and degassing component is working; The outer membrane adsorption component comprises a connecting rod (142) fixedly arranged inside the installation cavity (14) and a plurality of toggle blocks (91) fixedly arranged on the bottom side of the toothed disc (9); an air storage bag (71) is fixedly arranged on the connecting rod (142); an air intake port (72) and an air exhaust port (73) are respectively arranged at the upper and lower ends of the air storage bag (71); the air storage bag (71) and the toggle blocks (91) are equidistantly distributed in a circular shape along the central axis of the toothed disc (9); a plurality of air intake channels (7) are arranged through the side walls of the body (1) and the base plate (3) corresponding to the air intake port (72); and the air intake channels (7) are connected to the air intake port (72).

2. A semiconductor device wafer mounter according to claim 1, characterized in that: The cutting assembly comprises an annular cutter (21) and a slide rail (23); the annular cutter (21) is arranged at the bottom of the cover plate (2); a crank (22) is arranged at the top of the cover plate (2); an end of the crank (22) passes through the side wall of the cover plate (2) and is fixedly connected to the annular cutter (21); the slide rail (23) is fixedly arranged at the rear side of the cover plate (2); a cutter (24) for transversely cutting the film material is slidably arranged on the slide rail (23).

3. A semiconductor device wafer mounting machine according to claim 2, characterized in that: When the cover plate (2) and the machine body (1) are buckled together, the ends of the annular cutter (21) and the cutting knife (24) are in contact with the film material, and when the cover plate (2) is rotated, a gap exists between the cutting knife (24) and the rolling device (5).

4. The semiconductor device wafer mounter according to claim 1, characterized in that: The installation cavity (14) is located directly below the base plate (3) and is arranged around the base platform (4); a ventilation groove (15) is provided between the installation cavity (14) and the guide rail (13).

5. The semiconductor device wafer mounter according to claim 1, characterized in that: The flattening and de-bubble removing assembly further comprises a fixing rod (81) fixedly connected to the base plate (3) and a driving rod (82) fixedly connected to the side wall of the toothed disc (9); the two ends of the elastic band (8) are rotatably sleeved on the fixing rod (81) and the driving rod (82) respectively; a guide groove (31) matching the driving rod (82) is provided on the side wall of the base plate (3); and the end of the guide groove (31) passes through the side wall of the base plate (3).

6. A semiconductor device wafer mounter according to claim 5, characterized in that: The guide groove (31) is an incomplete annular arrangement. The guide groove (31) is located outside the cutting track of the annular cutter (21). The elastic band (8) is made of an elastic material and its bottom end is in contact with the top surface of the film material. The motor (141) has a built-in speed sensor. When the driving rod (82) is blocked by the guide groove (31), the motor (141) switches its rotation direction.

7. A semiconductor device wafer mounter according to claim 6, characterized in that: In the initial state, the driving rod (82) is located at the lower end of the incomplete side of the guide groove (31), and there is a gap between the rolling device (5) and the fixed rod (81) and the driving rod (82) in the initial state. The film material is located on the inner side of the guide groove (31), and there is a gap between the edge of the film material and the driving rod (82) in the initial state.

8. The semiconductor device wafer mounter according to claim 1, characterized in that: The air intake port (72) is a one-way air intake, and the air exhaust port (73) is a one-way air exhaust. The air storage bag (71) is made of a deformable material with toughness. When the toggle block (91) rotates, it comes into conflict with the air storage bag (71).

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