Semiconductor chip packaging structure and heat dissipation method thereof

Abstract

The present invention discloses a semiconductor chip packaging structure and a heat dissipation method thereof, and relates to the technical field of semiconductor chip packaging. A semiconductor chip packaging structure comprises: a substrate; a semiconductor chip, comprising a first surface and a second surface opposite to the first surface, the first surface being mounted on the substrate; a heat spreader, comprising a heat absorbing side and a heat dissipating side, the heat absorbing side being in thermal contact with the second surface, a first liquid storage cavity for storing a cooling medium being arranged inside the heat spreader; a main radiator, connected to the heat dissipating side, a second liquid storage cavity for storing a cooling medium being arranged inside the main radiator; a circulation pipeline, arranged between the first liquid storage cavity and the second liquid storage cavity. The semiconductor chip packaging structure of the present application has high efficiency in heat dissipation performance and reliability through the unique design of the first liquid storage cavity, the second liquid storage cavity and the circulation pipeline.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip packaging, and in particular to a semiconductor chip packaging structure and a heat dissipation method thereof. Background Art

[0002] With the rapid development of electronic technology, the integration of semiconductor chips has been continuously improved, and the performance has been continuously improved, which has put forward higher requirements for packaging technology. In particular, the increase in power density and operating frequency has caused the chip to generate a lot of heat during operation, and efficient heat dissipation technology is required to ensure the normal operation and life of the chip. However, the traditional semiconductor chip packaging structure has gradually shown its limitations in terms of heat dissipation performance, with low heat dissipation efficiency, which is difficult to meet the needs of modern high-performance chips. Summary of the invention

[0003] The technical problem to be solved by the present invention is to overcome the low heat dissipation efficiency of the semiconductor chip packaging structure in the prior art and to provide a semiconductor chip packaging structure and a heat dissipation method thereof.

[0004] The present invention solves the above technical problems through the following technical solutions:

[0005] A semiconductor chip packaging structure, comprising:

[0006] substrate;

[0007] a semiconductor chip comprising a first surface and a second surface opposite to the first surface, wherein the first surface is mounted on the substrate;

[0008] A vapor chamber, comprising a heat absorbing side and a heat dissipating side, wherein the heat absorbing side is in thermal contact with the second surface, and a first liquid storage cavity for storing a cooling medium is provided inside the vapor chamber;

[0009] A main radiator connected to the heat dissipation side, wherein a second liquid storage chamber for storing a cooling medium is provided inside the main radiator;

[0010] A circulation pipeline is arranged between the first liquid storage chamber and the second liquid storage chamber, and a first one-way valve and a second one-way valve are arranged on the circulation pipeline. The first one-way valve is configured to open at a preset pressure to allow the cooling medium in the first liquid storage chamber to flow into the second liquid storage chamber, and the second one-way valve is configured to open at a preset pressure to allow the cooling medium in the second liquid storage chamber to flow into the first liquid storage chamber.

[0011] In this solution, by setting a first liquid storage chamber inside the heat spreader and setting a second liquid storage chamber inside the main radiator, the circulation flow of the cooling medium between the two liquid storage chambers is achieved. The heat-absorbing side of the heat spreader is in direct thermal contact with the second side of the semiconductor chip, and the heat generated by the chip is quickly transferred to the cooling medium. The heat is effectively transferred to the main radiator through the circulation flow of the cooling medium, so that efficient heat dissipation is achieved, ensuring the temperature stability of the semiconductor chip when working at high power density. The circulation pipeline design enables the system to dynamically respond to changes in the heat load during the operation of the semiconductor chip. By setting a first one-way valve and a second one-way valve on the circulation pipeline, the cooling medium can achieve one-way flow at a preset pressure, and can dynamically respond to fluctuations in the working power of the semiconductor chip. Before circulation, the temperature of the cooling medium in the first liquid storage chamber will be higher than the temperature of the cooling medium in the second liquid storage chamber. When working at a short time and low power, the semiconductor chip generates low heat, and the cooling medium can only circulate in the first liquid storage cavity to dissipate heat; when working at a long time and high power, the semiconductor chip generates high heat, and the temperature of the cooling medium in the first liquid storage cavity will rise. The cooling medium expands due to heat, and its pressure will also increase accordingly, and then the cooling medium can enter the second liquid storage cavity through the first one-way valve. Then, the pressure in the second liquid storage cavity will also increase, so that the cooling medium flows back to the first liquid storage cavity through the second one-way valve to reduce the temperature of the cooling medium in the first liquid storage cavity. The semiconductor chip packaging structure of the present application has efficient heat dissipation performance and reliability through the unique design of the first liquid storage cavity, the second liquid storage cavity and the circulation pipeline.

[0012] Preferably, the semiconductor chip packaging structure further comprises a cooling fin, a cooling end of the cooling fin is in contact with the second liquid storage cavity, and is used for cooling the second liquid storage cavity.

[0013] Preferably, the semiconductor chip packaging structure further comprises an auxiliary heat sink, and the auxiliary heat sink is connected to the heat dissipation end of the cooling fin.

[0014] Preferably, the cooling fins and the auxiliary radiator are not in direct contact with the main radiator.

[0015] Preferably, a heat insulating portion is further provided between the second liquid storage chamber and the main radiator.

[0016] Preferably, the main radiator includes a water cooling unit, which dissipates heat by water cooling.

[0017] Preferably, the heat absorbing side includes a recessed area, and the second surface of the semiconductor chip is arranged in the recessed area.

[0018] Preferably, the inner surface of the vapor chamber has a groove structure, and a capillary wick is further provided inside the vapor chamber to promote the recirculation of the cooling medium between the heat absorbing side and the heat dissipating side.

[0019] A heat dissipation method for a semiconductor chip packaging structure, comprising the semiconductor chip packaging structure as described above, the heat dissipation method comprising:

[0020] Acquiring the operating temperature of the semiconductor chip and presetting a first temperature;

[0021] If the operating temperature is greater than the first temperature, starting the refrigeration plate;

[0022] If the operating temperature is lower than the first temperature, the cooling fin is turned off.

[0023] In this solution, by obtaining the operating temperature of the semiconductor chip and presetting a first temperature threshold, dynamic monitoring of the chip temperature can be achieved. If the operating temperature exceeds the preset first temperature, the refrigeration plate is started for cooling to ensure that the chip can still maintain stable operation under high temperature working conditions. On the contrary, if the operating temperature is lower than the preset temperature, the refrigeration plate is turned off to avoid unnecessary energy consumption. This dynamic control method can effectively improve the heat dissipation efficiency, ensure that the chip works within a safe temperature range, realize efficient and energy-saving heat dissipation control, and optimize energy utilization efficiency.

[0024] A heat dissipation method for a semiconductor chip packaging structure, comprising the semiconductor chip packaging structure as described above, the heat dissipation method comprising:

[0025] Acquire the operating temperature of the semiconductor chip, preset a first temperature and a second temperature, wherein the first temperature is lower than the second temperature;

[0026] If the operating temperature is greater than the first temperature and less than the second temperature, start the water cooling unit and turn off the refrigeration fins;

[0027] If the working temperature is greater than the second temperature, starting the refrigeration plate;

[0028] If the operating temperature is lower than the first temperature, the water cooling unit and the refrigeration fins are turned off.

[0029] In this solution, hierarchical heat dissipation control is achieved by presetting two temperature thresholds (the first temperature and the second temperature). This hierarchical control can dynamically adjust the heat dissipation method according to the actual temperature requirements. When the temperature is low (lower than the first temperature), all heat dissipation devices are turned off to avoid unnecessary energy consumption. When the temperature is in the middle range (higher than the first temperature but lower than the second temperature), the water cooling unit with higher energy efficiency is started first. When the temperature reaches a higher level (higher than the second temperature), a more powerful cooling plate is started. This design can achieve the best balance between energy efficiency and heat dissipation effect in different temperature ranges. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a schematic diagram of a semiconductor chip packaging structure according to Embodiment 1 of the present invention;

[0031] Figure 2 is a schematic diagram of a semiconductor chip packaging structure according to Embodiment 2 of the present invention;

[0032] Figure 3 This is a flow chart of a heat dissipation method for a semiconductor chip packaging structure according to Embodiment 3 of the present invention.

[0033] Description of reference numerals:

[0034] Substrate 100, semiconductor chip 200, first surface 210, second surface 220, heat spreader 300, heat absorption side 310, heat dissipation side 320, first liquid storage chamber 330, main radiator 400, second liquid storage chamber 410, circulation pipeline 420, first one-way valve 421, second one-way valve 422, insulation part 430, cooling plate 500, auxiliary radiator 600. DETAILED DESCRIPTION

[0035] The present invention is further described below by way of examples, but the present invention is not limited to the scope of the examples.

[0036] Example 1

[0037] like Figure 1 As shown, the present embodiment provides a semiconductor chip packaging structure, which includes a substrate 100, a semiconductor chip 200, a heat spreader 300, a main heat sink 400 and a circulation pipeline 420. The semiconductor chip 200 includes a first surface 210 and a second surface 220 opposite to the first surface 210, and the first surface 210 is mounted on the substrate 100. The heat spreader 300 includes a heat absorbing side 310 and a heat dissipating side 320, and the heat absorbing side 310 is in thermal contact with the second surface 220 of the semiconductor chip 200, and a first liquid storage cavity 330 for storing a cooling medium is provided inside the heat spreader 300. The main heat sink 400 is connected to the heat dissipating side 320 of the heat spreader 300, and a second liquid storage cavity 410 for storing a cooling medium is provided inside the main heat sink 400. The circulation pipeline 420 is arranged between the first liquid storage chamber 330 and the second liquid storage chamber 410, and the first one-way valve 421 and the second one-way valve 422 are arranged on the circulation pipeline 420. The first one-way valve 421 is configured to open at a preset pressure so that the cooling medium in the first liquid storage chamber 330 flows into the second liquid storage chamber 410, and the second one-way valve 422 is configured to open at a preset pressure so that the cooling medium in the second liquid storage chamber 410 flows into the first liquid storage chamber 330.

[0038] By setting a first liquid storage chamber 330 inside the heat spreader 300 and setting a second liquid storage chamber 410 inside the main radiator 400, the circulation flow of the cooling medium between the two liquid storage chambers is realized. The heat absorption side 310 of the heat spreader 300 is in direct thermal contact with the second surface 220 of the semiconductor chip 200, and the heat generated by the chip is quickly transferred to the cooling medium. The heat is effectively transferred to the main radiator 400 through the circulation flow of the cooling medium, so as to achieve efficient heat dissipation and ensure the temperature stability of the semiconductor chip 200 when working at high power density. The design of the circulation pipeline 420 enables the system to dynamically respond to the changes in the heat load during the operation of the semiconductor chip 200. By setting the first one-way valve 421 and the second one-way valve 422 on the circulation pipeline 420, the cooling medium can achieve one-way flow at a preset pressure, and can dynamically respond to the fluctuation of the working power of the semiconductor chip 200. Before circulation, the temperature of the cooling medium in the first liquid storage chamber 330 will be higher than the temperature of the cooling medium in the second liquid storage chamber 410. When working at a short time and low power, the semiconductor chip 200 generates low heat, and the cooling medium can only circulate in the first liquid storage chamber 330 to dissipate heat; when working at a long time and high power, the semiconductor chip 200 generates high heat, and the temperature of the cooling medium in the first liquid storage chamber 330 will increase. The cooling medium expands due to heat, and its pressure will also increase accordingly, so that the cooling medium can enter the second liquid storage chamber 410 through the first one-way valve 421. As a result, the pressure in the second liquid storage chamber 410 will also increase, so that the cooling medium flows back to the first liquid storage chamber 330 through the second one-way valve 422 to reduce the temperature of the cooling medium in the first liquid storage chamber 330. The semiconductor chip 200 packaging structure of the present application has high-efficiency heat dissipation performance and reliability through the unique design of the first liquid storage chamber 330, the second liquid storage chamber 410 and the circulation pipeline 420.

[0039] Specifically, the semiconductor chip 200 may be a gallium nitride chip, a silicon carbide chip, etc., which is not specifically limited here.

[0040] In this embodiment, the cooling medium can be Freon. In other embodiments, the cooling medium can also be water.

[0041] The second surface 220 of the semiconductor chip 200 may be in direct contact with the heat absorbing side 310 of the heat spreader 300 , or may be connected via a thermal conductive paste.

[0042] In the present embodiment, the semiconductor chip 200 packaging structure further includes a cooling fin 500, the cooling end of the cooling fin 500 is in contact with the second liquid storage chamber 410, and is used to cool the second liquid storage chamber 410. The cooling fin 500 directly cools the second liquid storage chamber 410, which can quickly reduce the temperature of the cooling medium, so that the temperature of the cooling medium returned to the first liquid storage chamber 330 is lower, thereby enhancing the heat dissipation efficiency of the entire system. In this way, under high power density working conditions, the temperature of the semiconductor chip 200 can be more effectively controlled to prevent overheating. The introduction of the cooling fin 500 can provide additional active cooling means. Compared with relying solely on natural heat dissipation or passive cooling, the cooling fin 500 can more accurately control the temperature of the cooling medium. By adding the cooling fin 500, the present packaging structure can adapt to semiconductor chips 200 with higher power density, ensuring that it can still maintain a stable operating temperature under high power and high frequency working conditions to avoid performance degradation or failure.

[0043] Of course, in some embodiments, the cooling fin 500 may not be provided, and the second liquid storage chamber 410 is cooled by the main radiator 400 .

[0044] In this embodiment, the semiconductor chip 200 packaging structure further includes an auxiliary heat sink 600, which is connected to the heat dissipation end of the cooling fin 500. The auxiliary heat sink 600 can effectively dissipate the heat absorbed by the cooling fin 500 from the second liquid storage chamber 410 to the external environment, further improving the overall heat dissipation efficiency.

[0045] In this embodiment, the main radiator 400 and the auxiliary radiator 600 are both fin structures, and heat is dissipated by air cooling.

[0046] In some embodiments, the auxiliary radiator 600 may not be provided, and the volume of the main radiator 400 may be increased, and the cooling fins 500 dissipate heat through the main radiator 400 .

[0047] In this embodiment, the cooling fin 500 and the auxiliary radiator 600 are not in direct contact with the main radiator 400. The cooling fin 500 and the auxiliary radiator 600 are not in direct contact with the main radiator 400, forming an independent heat dissipation path. In this way, the cooling fin 500 and the auxiliary radiator 600 can focus on cooling the cooling medium in the second liquid storage chamber 410, while the main radiator 400 is responsible for dissipating the heat on the heat spreader 300. The design of this independent heat dissipation path can avoid mutual interference of heat between different radiators and improve the overall heat dissipation efficiency.

[0048] In this embodiment, a heat insulating portion 430 is further provided between the second liquid storage chamber 410 and the main radiator 400. The provision of the heat insulating portion 430 can effectively prevent heat transfer between the second liquid storage chamber 410 and the main radiator 400. In this way, the temperature difference between the two can be maintained, ensuring that the temperature of the cooling medium in the second liquid storage chamber 410 is maintained at a low level. When the cooling medium flows to the first liquid storage chamber 330, the temperature in the first liquid storage chamber 330 can be effectively reduced, thereby providing protection for the semiconductor chip 200 when working under high load.

[0049] In this embodiment, the inner surface of the heat spreader 300 is a groove structure (not shown in the figure), and a capillary wick is also provided inside the heat spreader 300 to promote the recycling of the cooling medium between the heat absorbing side 310 and the heat dissipating side 320. The groove structure on the inner surface increases the surface area of ​​the cooling medium in contact with the heat spreader 300, thereby improving the heat exchange efficiency. In this way, the heat generated by the semiconductor chip 200 can be more effectively transferred to the heat dissipating side 320 of the heat spreader 300, thereby improving the overall heat dissipation performance. The groove structure on the inner surface and the setting of the capillary wick can greatly improve the fluidity of the cooling medium inside the heat spreader 300, thereby improving the heat dissipation efficiency.

[0050] In this embodiment, the vapor chamber 300 and the main radiator 400 are integrally formed. The vapor chamber 300 and the main radiator 400 are integrally formed, eliminating the contact thermal resistance between the two in the traditional structure. This means that heat can be transferred from the vapor chamber 300 to the main radiator 400 more quickly and efficiently, thereby improving the overall heat dissipation efficiency. Of course, in some embodiments, the vapor chamber 300 and the main radiator 400 can also be assembled after being processed separately.

[0051] Example 2

[0052] like Figure 2 As shown, this embodiment is basically the same as the solution of embodiment 1, except that, in this embodiment, the main radiator 400 includes a water cooling unit, and heat is dissipated by water cooling. The addition of the water cooling unit greatly improves the heat dissipation efficiency. Water has a high specific heat capacity and can absorb and conduct more heat, thereby more effectively dissipating the heat conducted by the heat spreader 300 than the traditional air cooling method. By dissipating heat through the water cooling unit, the operating temperature of the semiconductor chip 200 packaging structure can be significantly reduced, ensuring that the semiconductor chip 200 operates stably at a lower temperature.

[0053] Specifically, the water cooling unit includes a water cooling pipe, a water pump (not shown in the figure), and a cooling device (not shown in the figure). A portion of the water cooling pipe 440 is arranged inside the main radiator 400 in a circuitous manner, and another portion is arranged outside the main radiator 400 to form a closed loop. A water pump is arranged on the water cooling pipe. The water cooling pipe located outside the main radiator 400 is also provided with a cooling device for cooling.

[0054] In some embodiments, the auxiliary radiator 600 may also include a water cooling unit to dissipate heat through water cooling.

[0055] In this embodiment, the heat absorbing side 310 of the vapor chamber 300 includes a recessed area, and the second surface 220 of the semiconductor chip 200 is disposed in the recessed area. The recessed area design allows the second surface 220 of the semiconductor chip 200 to be embedded in the vapor chamber 300, thereby increasing the contact area between the chip and the vapor chamber 300. Compared with the traditional planar contact design, this recessed structure can more effectively conduct the heat generated by the chip to the vapor chamber 300, thereby improving the heat dissipation efficiency.

[0056] Example 3

[0057] like Figure 3 As shown, this embodiment provides a heat dissipation method for a semiconductor chip packaging structure, which includes the semiconductor chip packaging structure as above, and the heat dissipation method includes:

[0058] S10, obtaining the operating temperature of the semiconductor chip and presetting a first temperature.

[0059] S20: If the operating temperature is greater than the first temperature, start the refrigeration plate.

[0060] S30: If the operating temperature is lower than the first temperature, turn off the refrigeration fin.

[0061] By obtaining the operating temperature of the semiconductor chip and presetting a first temperature threshold, dynamic monitoring of the chip temperature can be achieved. If the operating temperature exceeds the preset first temperature, the refrigeration plate is started for cooling to ensure that the chip can still maintain stable operation under high temperature working conditions. Conversely, if the operating temperature is lower than the preset temperature, the refrigeration plate is turned off to avoid unnecessary energy consumption. This dynamic control method can effectively improve the heat dissipation efficiency, ensure that the chip works within a safe temperature range, realize efficient and energy-saving heat dissipation control, and optimize energy utilization efficiency.

[0062] Example 4

[0063] This embodiment also provides a heat dissipation method for a semiconductor chip packaging structure, which includes the semiconductor chip packaging structure as above. The heat dissipation method includes:

[0064] S40, obtaining the operating temperature of the semiconductor chip, presetting a first temperature and a second temperature, wherein the first temperature is lower than the second temperature.

[0065] S50: If the operating temperature is greater than the first temperature and less than the second temperature, start the water cooling unit and turn off the refrigeration fins;

[0066] S60, if the working temperature is stable and greater than the second temperature, start the refrigeration plate;

[0067] S70: If the operating temperature is lower than the first temperature, turn off the water cooling unit and the refrigeration fins.

[0068] By presetting two temperature thresholds (first temperature and second temperature), hierarchical heat dissipation control is achieved. This hierarchical control can dynamically adjust the heat dissipation method according to the actual temperature requirements. When the temperature is low (lower than the first temperature), all heat dissipation devices are turned off to avoid unnecessary energy consumption. When the temperature is in the middle range (higher than the first temperature but lower than the second temperature), the water cooling unit with higher energy efficiency is started first. When the temperature reaches a higher level (higher than the second temperature), a more powerful cooling plate is started. This design can achieve the best balance between energy efficiency and heat dissipation effect in different temperature ranges.

[0069] Although the specific embodiments of the present invention are described above, it should be understood by those skilled in the art that this is only for illustration and the protection scope of the present invention is defined by the appended claims. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but these changes and modifications all fall within the protection scope of the present invention.

Claims

1. A semiconductor chip packaging structure, characterized in that: It includes: substrate; a semiconductor chip comprising a first surface and a second surface opposite to the first surface, wherein the first surface is mounted on the substrate; A vapor chamber, comprising a heat absorbing side and a heat dissipating side, wherein the heat absorbing side is in thermal contact with the second surface, and a first liquid storage cavity for storing a cooling medium is provided inside the vapor chamber; A main radiator connected to the heat dissipation side, wherein a second liquid storage cavity for storing cooling medium is provided inside the main radiator, and a heat insulation portion is further provided between the second liquid storage cavity and the main radiator; A circulation pipeline is arranged between the first liquid storage chamber and the second liquid storage chamber, and a first one-way valve and a second one-way valve are arranged on the circulation pipeline. The first one-way valve is configured to open at a preset pressure to allow the cooling medium in the first liquid storage chamber to flow into the second liquid storage chamber, and the second one-way valve is configured to open at a preset pressure to allow the cooling medium in the second liquid storage chamber to flow into the first liquid storage chamber.

2. The semiconductor chip packaging structure according to claim 1, characterized in that: The semiconductor chip packaging structure further includes a cooling fin, a cooling end of which is in contact with the second liquid storage cavity for cooling the second liquid storage cavity.

3. The semiconductor chip packaging structure according to claim 2, characterized in that: The semiconductor chip packaging structure also includes an auxiliary heat sink, which is connected to the heat dissipation end of the cooling fin.

4. The semiconductor chip packaging structure according to claim 3, characterized in that: The cooling fins and the auxiliary radiator are not in direct contact with the main radiator.

5. The semiconductor chip packaging structure according to claim 3, characterized in that: The main radiator and / or the auxiliary radiator include a water cooling unit, which dissipates heat by water cooling. The water cooling unit includes a water cooling pipe, a water pump and a cooling device. A part of the water cooling pipe is arranged inside the main radiator and / or the auxiliary radiator and is circuitous. Another part of the water cooling pipe is arranged outside the main radiator and / or the auxiliary radiator to form a closed loop. The water pump is arranged on the water cooling pipe. The cooling device is also arranged on the water cooling pipe outside the main radiator and / or the auxiliary radiator to reduce the temperature.

6. The semiconductor chip packaging structure according to claim 1, wherein: The heat absorption side includes a recessed area, and the second surface of the semiconductor chip is disposed in the recessed area.

7. The semiconductor chip packaging structure according to claim 1, characterized in that: The inner surface of the vapor chamber is a groove structure, and a capillary wick is also arranged inside the vapor chamber to promote the recirculation of cooling medium between the heat absorbing side and the heat dissipating side.

8. A heat dissipation method for a semiconductor chip packaging structure, characterized in that: It comprises the semiconductor chip packaging structure according to any one of claims 2 to 4, wherein the heat dissipation method comprises: Acquiring the operating temperature of the semiconductor chip and presetting a first temperature; If the operating temperature is greater than the first temperature, starting the refrigeration plate; If the operating temperature is lower than the first temperature, the cooling fin is turned off.

9. A heat dissipation method for a semiconductor chip packaging structure, characterized in that: It includes the semiconductor chip packaging structure as claimed in claim 5, and the heat dissipation method includes: Acquire the operating temperature of the semiconductor chip, preset a first temperature and a second temperature, wherein the first temperature is lower than the second temperature; If the operating temperature is greater than the first temperature and less than the second temperature, start the water cooling unit and turn off the refrigeration fin; If the operating temperature is greater than the second temperature, starting the refrigeration plate; If the operating temperature is lower than the first temperature, the water cooling unit and the refrigeration fins are turned off.

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