Electronic component solder paste printing device

By introducing synchronous clamping assembly and constant temperature printing paste assembly into the solder paste printing equipment, the problems of solder paste printing equipment in printing accuracy and solder paste control are solved, and higher printing quality and efficiency are achieved, suitable for large-scale applications. .

CN119017824BActive Publication Date: 2024-12-27SHANDONG RUISHENG ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202411479970.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-10-23
Publication Date
2024-12-27
Estimated Expiration
2044-10-23

AI Technical Summary

Technical Problem

The existing solder paste printing equipment has shortcomings in printing accuracy and solder paste control, resulting in uneven printing quality of solder paste. The steel mesh and PCB board are not closely attached after the equipment is used for a long time, resulting in leaks in solder paste and viscosity changes. Printing effect.

Method used

A solder paste printing device including a synchronous clamping assembly, a constant temperature printing paste assembly and a steel mesh lifting platform assembly is designed. The positioning accuracy of the PCB board is improved by synchronous clamping assembly, and the constant temperature printing paste assembly adjusts the solder paste temperature, and Improve printing uniformity and solder paste saving through multi-node and small-channel paste output.

Benefits of technology

It improves the positioning accuracy and fitting effect of solder paste printing, ensures that the viscosity of solder paste is within a reasonable range, enhances printing quality and efficiency, reduces solder paste waste, and is suitable for large-scale promotion.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention belongs to the technical field of electronic component production and processing equipment, and proposes an electronic component solder paste printing device, including a frame, a printing support table, a steel mesh lifting platform assembly, a printing host, an X-axis drive assembly, a Z-axis drive assembly, a support frame and a synchronous clamping assembly. The printing host includes a crossbeam, a connecting seat, a printing cabin, a constant temperature printing paste output assembly, a heating source, a paste inlet pipe, a solder paste filler, a paste roller, a pressing plate and a scraper. The constant temperature printing paste output assembly includes a main board, a paste output board, a paste output channel, a heating channel and a ceramic heating core. The present invention can improve the bonding effect between the PCB board and the steel mesh template, which is beneficial to improving the quality of solder paste printing; the constant temperature printing paste output assembly can ensure that the viscosity of the solder paste meets the printing requirements, and the multi-node and small hole paste output method can improve the uniformity of solder paste printing and save solder paste; the scraper can not only scrape the solder paste flat, but also play a certain role in cleaning the surface of the steel mesh, which is beneficial to improving the efficiency of solder paste printing.
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Description

Technical Field

[0001] The invention belongs to the technical field of electronic component production and processing equipment, and in particular relates to an electronic component solder paste printing device. Background Art

[0002] Solder paste printing is a step in the surface mount process that has a great impact on product quality. There are three important parts in solder paste printing, including solder paste, steel mesh template and printing equipment. Solder paste is a slurry made by mixing solder powder with paste flux (such as rosin, diluent, stabilizer, etc.) with fluxing function. When the solder paste is printed, it is pushed by the scraper and its viscosity decreases. When it reaches the opening hole of the stencil, the viscosity reaches the lowest, so it can smoothly pass through the stencil hole and settle on the pad of the PCB. As the external force stops, the viscosity of the tin quickly rises, so that there will be no collapse and overflow of the printed molding, and a printing effect that meets certain requirements can be achieved.

[0003] The existing solder paste printing equipment has the following deficiencies: in terms of printing accuracy, the degree of fit between the steel mesh and the PCB board has a certain influence on the quality of solder paste printing. For example, after the equipment is used for a long time, the wear and deformation of the mechanical parts may cause the steel mesh and the PCB board to not fit tightly enough, resulting in a gap, which causes problems such as uneven solder paste printing and missing printing. Furthermore, in terms of solder paste control, changes in solder paste viscosity will also affect the printing quality of the solder paste. For example, the viscosity of the solder paste will change due to the influence of temperature. Although some equipment is equipped with a real-time monitoring device for solder paste thickness, such as a multi-dimensional solder paste thickness detection system disclosed in CN117968546A, it is impossible to make corresponding adjustments in time according to the change in solder paste viscosity, resulting in problems such as uneven thickness, pulling tips, and collapse in solder paste printing. Secondly, in the process of solder paste printing, the solder paste is mostly extruded by a reciprocating extrusion nozzle and then scraped flat by a scraper. Due to the large extrusion volume, a considerable portion of the solder paste will not be fully utilized, which will increase production costs and affect the solder paste printing effect of the next PCB board. Summary of the invention

[0004] In view of the technical problems existing in the above-mentioned solder paste printing equipment, the present invention proposes an electronic component solder paste printing device which has a reasonable design, good bonding effect between the steel plate and the PCB board, can adjust the solder paste temperature, can clean the solder paste online in time, and is beneficial to improving the solder paste printing quality.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted by the present invention is that the present invention provides an electronic component solder paste printing device, comprising a pair of frames symmetrically arranged front and back, a pair of printing support tables arranged between the frames, an aisle for passing PCB boards arranged between the printing support tables, a steel mesh lifting platform assembly arranged above the printing support tables, a printing host arranged above the steel mesh support platform assembly, X-axis drive assemblies for driving the printing host to move in the X-axis direction are arranged on both sides of the printing host, a Z-axis drive assembly is arranged on the top of the printing host, a support frame for supporting the bottom of the PCB board is arranged on the inner side of the aisle, a synchronous clamping assembly is arranged on each of the printing support tables, the synchronous clamping assembly is used to position the PCB board and the clamping working surface of the synchronous clamping assembly cooperates with the conveying front and rear sides of the PCB board, the printing host includes a transmission connection with the X-axis drive assembly and used to support the Z-axis A crossbeam of a driving assembly, a connecting seat connected to the Z-axis driving assembly is arranged below the crossbeam, a printing cabin is arranged at the bottom of the connecting seat, both sides of the printing cabin are arranged in an inverted V shape and a group of constant temperature printing paste output components are arranged on both sides of the printing cabin, the constant temperature printing paste output component includes a main board, a plurality of spaced paste output plates are arranged on the side facing the inner side of the printing cabin, the paste output plate is provided with a paste output channel and a heating channel, a ceramic heating core is arranged in the heating channel, the heating end of the ceramic heating core is electrically connected to the heating source arranged on the main board, the top of the paste output channel is a paste inlet end and is provided with a paste inlet tube, a solder paste filler is arranged on the supply side of the paste inlet tube, the bottom of the paste output channel is a paste output end and a paste coating roller is arranged below it, both ends of the paste coating roller are arranged on a pressing plate, the pressing plate is connected to the bottom end of the printing cabin and is used to apply pressure to the steel mesh lifting platform assembly, and a scraper is arranged on the back of the printing cabin.

[0006] Preferably, the synchronous clamping assembly includes a pair of fan-shaped plates distributed front and back along the conveying direction of the PCB board, the fan-shaped plates cooperate with the movable plate grooves arranged on the printing support table, a rotating shaft is arranged at the center of the fan-shaped plate, the rotating shaft passes through the printing platform from top to bottom and a gear is arranged at the bottom thereof, a rack is arranged on the transmission side of the gear, the rack is arranged on the rocker arm, and a tensioning wheel rollingly cooperated with the rocker arm is arranged on the side of the rocker arm facing away from the gear and the rack that meshes with each other, the two rocker arms under the printing support table are hinged to each other and a hinge joint is arranged at the hinge node, and a clamping drive cylinder for driving the hinge joint to move horizontally is arranged on one side of the hinge joint.

[0007] Preferably, the printing cabin includes an M-shaped top plate, a pair of side plates in an inverted V shape are arranged on both sides of the top plate, mounting ports are arranged on the side plates, an upper plug-in port matching with the top of the mounting port is arranged at the top of the main board, side plug-in ports matching with the two ends of the mounting port are arranged at the front and rear ends of the main board, and positioning screws connecting the main board and the side plates are arranged near the upper plug-in port and the side plug-in port.

[0008] Preferably, the side plate is provided with a slide groove near its bottom, the slide groove is used to install the scraper, and the back of the slide groove is provided with a waist-shaped hole, the waist-shaped hole is used to install the adjustment screw connecting the scraper and the side plate.

[0009] Preferably, end covers are provided at the front and rear ends of the printing cabin, and a pipe opening connected to the paste inlet pipe is provided on the end cover, and the pipe opening is connected to the solder paste filling machine through a hose.

[0010] Preferably, the heating channel includes a main hole parallel to the length direction of the paste outlet plate, and a plurality of branch holes connected to the paste outlet channels are arranged on the hole surface of the main hole. The ceramic heating core includes a ceramic main core matching with the main hole, and the ceramic main core is provided with supporting feet matching with the branch holes. A heating electrode is arranged on the top of the ceramic heating core, and the heating electrode is connected to the heating source through a wire.

[0011] Preferably, the paste output boards on the same main board are divided into two groups and the paste inlet pipes on each group of paste output boards share a solder paste filler, which is arranged at the bottom of the crossbeam.

[0012] Preferably, both ends of the pressure plate are provided with V-shaped openings, the V-shaped openings are opened in the horizontal direction and are wedged with the bottom end of the main board, and the side surfaces of the pressure plate are connected to the side surfaces of the main board by clamping screws.

[0013] Preferably, a plurality of evenly distributed grooves in a circular array are arranged on the roller surface of the paste coating roller.

[0014] Preferably, the steel mesh lifting platform assembly includes a support plate and a steel mesh template, a splint is provided on the edge of the support plate, a plurality of thin cylinders are provided on the splint, the thin cylinders are installed on the inner side of the frame through a bracket, a countersunk plate hole is provided at the center of the support plate, a template is provided on the edge of the steel mesh template, the template includes a circular segment, four angular flat plate segments are provided at the four corners of the circular segment, the template and the steel mesh template are installed in the countersunk plate hole, and the bottom surface of the steel mesh template and the bottom surface of the support plate are on the same plane.

[0015] Compared with the prior art, the advantages and positive effects of the present invention are:

[0016] 1. The electronic component solder paste printing device provided by the present invention can improve the positioning accuracy and stability of the PCB board at the printing station by adopting a synchronous clamping assembly. In addition, the supporting effect of the support frame and the pressure effect of the pressing plate that moves synchronously with the solder paste printing action are beneficial to improving the fitting effect between the PCB board and the steel mesh template, and to improving the solder paste printing quality.

[0017] 2. The electronic component solder paste printing device provided by the present invention can ensure that the solder paste is in a reasonable paste output temperature range by adopting a constant temperature printing paste output component, which is beneficial to ensure that the viscosity of the solder paste meets the printing requirements, thereby ensuring the printing quality.

[0018] 3. The present invention provides an electronic component solder paste printing device, which uses a constant temperature printing paste component to print paste in a multi-node and small hole manner, which can not only improve the uniformity of solder paste printing, but also help save solder paste. At the same time, a scraper that moves synchronously with it can not only scrape the solder paste flat, but also play a role in cleaning the surface of the steel mesh to a certain extent, which is beneficial to improving the efficiency of solder paste printing.

[0019] The invention is reasonably designed, can adjust the solder paste temperature, can clean the solder paste online in time, and is beneficial to improving the solder paste printing quality, and is suitable for large-scale promotion. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 An axonometric diagram of an electronic component solder paste printing device provided in an embodiment;

[0022] Figure 2 A bottom view of a solder paste printing device for electronic components provided in an embodiment;

[0023] Figure 3 A front view of a solder paste printing device for electronic components provided in an embodiment;

[0024] Figure 4 A cross-sectional view of a solder paste printing device for electronic components in the GG direction provided in an embodiment;

[0025] Figure 5 A cross-sectional view of a solder paste printing device for electronic components in another direction;

[0026] Figure 6 A front view of a printing cabin provided for an embodiment;

[0027] Figure 7 An axonometric view of a printing cabin provided for an embodiment;

[0028] Figure 8 A side view of a constant temperature printing paste dispensing assembly provided in an embodiment;

[0029] Fig. 9 An axonometric view of a constant temperature printing paste dispensing assembly provided in an embodiment;

[0030] Fig.10 A cross-sectional view of a constant temperature printing paste dispensing assembly provided in an embodiment in the EE direction;

[0031] Fig.11 An axonometric view of a synchronous clamping assembly provided for an embodiment;

[0032] Fig.12 Axonometric drawings of the support plate, steel mesh template, clamping plate and template provided in the embodiment;

[0033] Fig.13 A cross-sectional view of a support plate, a steel mesh template, a clamping plate and a template provided in an embodiment;

[0034] In the above figures, 1, frame; 2, printing support table; 3, aisle; 4, steel mesh lifting platform assembly; 41, support plate; 42, steel mesh template; 43, clamping plate; 44, thin cylinder; 45, bracket; 46, plate; 461, round section; 462, angle flat section; 5, printing host; 51, crossbeam; 52, connecting seat; 53, printing cabin; 531, top plate; 532, side plate; 533, installation port; 534, slide; 535, waist hole; 536, end cover; 537, pipe mouth; 54, constant temperature printing paste assembly; 541, main board; 542, paste plate; 543, paste channel; 5 44. Heating channel; 545. Ceramic heating core; 5451. Ceramic main core; 5452. Support foot; 5453. Heating electrode; 5454. Wire; 546. Heating source; 547. Paste inlet tube; 55. Solder paste filler; 56. Paste coating roller; 561. Uniform distribution groove; 57. Press plate; 571. V-shaped mouth; 58. Scraper; 6. X-axis drive assembly; 7. Z-axis drive assembly; 8. Support frame; 9. Synchronous clamping assembly; 91. Fan plate; 92. Rotating shaft; 93. Gear; 94. Rack; 95. Rocker; 96. Tensioning wheel; 97. Articulated head; 98. Clamping drive cylinder; 10. PCB board. DETAILED DESCRIPTION

[0035] In order to more clearly understand the above-mentioned objects, features and advantages of the present invention, the present invention is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict. For the convenience of description, if the words "upper", "lower", "left" and "right" appear below, they only indicate that the upper, lower, left and right directions are consistent with the accompanying drawings themselves, and do not limit the structure.

[0036] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.

[0037] Examples, such as Figures 1 to 13 As shown, the present invention provides an electronic component solder paste printing device, including a pair of racks 1 symmetrically arranged front and back, a pair of printing support tables 2 arranged between the racks 1, a passage 3 for passing a PCB board 10 arranged between the printing support tables 2, a steel mesh lifting platform assembly 4 arranged above the printing support table 2, a printing host 5 arranged above the steel mesh support platform assembly, an X-axis driving assembly 6 for driving the printing host 5 to move in the X-axis direction arranged on both sides of the printing host 5, and a Z-axis driving assembly 7 arranged on the top of the printing host 5. Among them, the X-axis driving assembly 6 can adopt a linear motor or a lead screw transmission mechanism, with the premise of realizing the X-axis movement of the printing host 5; the Z-axis driving assembly 7 can adopt a cylinder or a lead screw transmission mechanism, with the premise of realizing the lifting and lowering action of the printing cabin 53; the rack 1, the printing support table 2, the passage 3, the X-axis driving assembly 6 and the Z-axis driving assembly 7 are existing mature technologies, and this embodiment will not be repeated here.

[0038] On this basis, the present invention is provided with a support frame 8 for supporting the bottom of the PCB board 10 on the inner side of the aisle 3, and the belt for conveying the PCB board 10 is located near the inner side of the support frame 8. If the PCB board 10 is conveyed to the aisle 3 along the belt, its edge is located on the edge of the printing support platform; each of the printing support tables 2 is provided with a synchronous clamping component 9, the synchronous clamping component 9 is used to position the PCB board 10 and the clamping working surface of the synchronous clamping component 9 cooperates with the conveying front side and the conveying rear side of the PCB board 10, the printing host 5 includes a crossbeam 51 which is transmission-connected to the X-axis drive component 6 and used to support the Z-axis drive component 7, a connecting seat 52 connected to the Z-axis drive component 7 is provided below the crossbeam 51, a printing cabin 53 is provided at the bottom of the connecting seat 52, and the two sides of the printing cabin 53 are arranged in an inverted V shape and both sides of the printing cabin 53 are provided with A set of constant temperature printing paste output components 54, the constant temperature printing paste output components 54 include a main board 541, the main board 541 is provided with a plurality of spaced paste output plates 542 on a surface facing the inner side of the printing cabin 53, the paste output plates 542 are provided with paste output channels 543 and heating channels 544, a ceramic heating core 545 is provided in the heating channel 544, the heating end of the ceramic heating core 545 is electrically connected to a heating source 546 provided on the main board 541, the top of the paste output channel 543 is a paste inlet end and is provided with a paste inlet tube 547, a solder paste filler 55 is provided on the supply side of the paste inlet tube 547, the bottom of the paste output channel 543 is a paste output end and a paste coating roller 56 is provided below it, both ends of the paste coating roller 56 are provided on a pressing plate 57, the pressing plate 57 is connected to the bottom end of the printing cabin 53 and is used to apply pressure to the steel mesh lifting platform assembly 4, and a scraper 58 is provided on the back of the printing cabin 53.

[0039] Specifically, the belt conveyor PCB board 10 enters the aisle 3, and the synchronous clamping assembly 9 is activated to clamp the front and rear sides of the PCB board 10, so that it is directly below the steel mesh lifting platform assembly 4, which can improve the positioning accuracy and stability of the PCB board 10 in the printing station, and the centering quality is high. In addition, the supporting effect of the support frame 8 and the pressure applied by the pressing plate 57 that moves synchronously with the solder paste printing action make the PCB board 10 and the steel mesh template 42 have a good fit effect, which is conducive to improving the quality of solder paste printing. Further, the Z-axis drive assembly 7 can move forward and backward with the crossbeam 51 under the drive of the X-axis drive assembly 6, and the connecting seat 52 and the printing cabin 53 can be driven by the Z-axis drive assembly 7 to perform lifting and lowering actions. The printing cabin 53 provides an installation basis for two sets of constant temperature printing assemblies, two sets of scrapers 58 and the pressing plate 57.

[0040] Furthermore, the solder paste filler 55 includes a filling cylinder, a solder paste barrel and a filling nozzle, wherein the filling cylinder is used to push the piston in the solder paste barrel to squeeze the solder paste, and the solder paste can enter the corresponding paste outlet plate 542 through the filling nozzle, the hose, and the paste inlet tube 547. The multiple paste outlet plates 542 on the same main board 541 provide multiple uniform paste outlet nodes, and the aperture of the paste outlet channel 543 is much smaller than the paste outlet section of the existing solder paste applicator, so that the uniformity of solder paste printing can be improved in the form of multi-node and small-hole paste outlet, and it is also beneficial to save solder paste; the scraper 58 that moves synchronously with the printing cabin 53 can not only scrape the solder paste flat, but also play a certain role in cleaning the surface of the steel mesh, and is also beneficial to improving the efficiency of solder paste printing. In order to ensure the quality of solder paste printing, the paste outlet plates 542 on both sides of the printing cabin 53 can be staggered, so that the density of reasonable paste outlet nodes can be guaranteed and the probability of missing printing can be reduced. Furthermore, the constant temperature printing paste component 54 uses a ceramic heating core 545 corresponding to each paste plate 542 to heat the solder paste in the paste channel 543 at a constant temperature, especially in winter, so that the solder paste can be kept in a reasonable paste temperature range, which is conducive to ensuring that the viscosity of the solder paste meets the printing requirements, thereby ensuring the printing quality. By installing a laser measuring device and a three-dimensional camera device of the prior art on this device, it can be used to detect the thickness of the solder paste and the flow performance of the solder paste. The constant temperature printing paste component 54 of this device can flexibly adjust the actual temperature of the solder paste, and the refined paste channel 543 can ensure the instantaneous control of the solder paste temperature, thereby improving the paste quality and actual printing quality of the solder paste in this device, and reducing the probability of uneven solder paste thickness, tipping, and collapse.

[0041] In order to improve the online clamping efficiency of the synchronous clamping assembly 9, the synchronous clamping assembly 9 provided by the present invention includes a pair of fan-shaped plates 91 distributed front and back along the conveying direction of the PCB board 10, the fan-shaped plates 91 are matched with the movable plate grooves arranged on the printing support table 2, and a rotating shaft 92 is arranged at the center of the fan-shaped plate 91. The rotating shaft 92 passes through the printing platform from top to bottom and a gear 93 is arranged at the bottom thereof, and a rack 94 is arranged on the transmission side of the gear 93, and the rack 94 is arranged on the rocker arm 95. A tensioning wheel 96 that rolls with the rocker arm 95 is arranged on the side of the rocker arm 95 that is away from the gear 93 and meshes with the rack 94. The tensioning wheel 96 adopts an elastic wheel body, and the two rocker arms 95 below the printing support table 2 are hinged to each other and a hinge joint 97 is arranged at the hinge node, and a clamping drive cylinder 98 for driving the hinge joint 97 to move horizontally is arranged on one side of the hinge joint 97. Among them, the clamping drive cylinder 98 provides driving force to the hinge joint and the rocker arm 95 through telescopic action. During the swinging process, the rocker arm 95 can make a planar motion along the gap between the tensioning wheel 96 and the gear 93. The tensioning wheel 96 ensures the smoothness of the planar motion of the rocker arm and the meshing stability of the gear 93 and the rack 94. At the same time, the gear 93 and the rack 94 produce meshing transmission, so that the rotating shaft 92 and the fan plate 91 can produce synchronous swing, and a radius edge of the fan plate 91 can be directly clamped on the side of the PCB board 10, and the top surface of the fan plate 91 is not higher than the top surface of the PCB board 10 and the surface level of the printing support table 2, thereby ensuring the fitting quality and centering effect of the PCB board 10 and the steel mesh template 42, and then ensuring the printing quality of the equipment. Furthermore, when the clamping drive cylinder 98 contracts, the clamping working surface of the fan-shaped plate 91 can deviate from the printing station of the PCB board 10 until the fan-shaped plate 91 enters the movable plate groove, so that the PCB board 10 can be conveyed out in time under the conveying action of the belt conveyor.

[0042] In order to improve the utilization rate of the printing cabin 53, the printing cabin 53 provided by the present invention includes an M-shaped top plate 531, a pair of side plates 532 in an inverted V-shaped distribution are arranged on both sides of the top plate 531, and a mounting port 533 is arranged on the side plate 532. The top of the main board 541 is provided with an upper plug-in port that matches the top of the mounting port 533, and the front and rear ends of the main board 541 are provided with side plug-in ports that match the two ends of the mounting port 533. The main board 541 is provided with positioning screws connecting the main board 541 and the side plates 532 at positions near the upper plug-in port and the side plug-in ports. Among them, the M-shaped port of the top plate 531 matches the inclined surface of the connecting seat 52, and the top plate 531 and the connecting seat 52 can be connected by bolts to ensure that the Z-axis driving assembly 7 can drive the printing cabin 53 to move up and down. The main board 541 adopts the upper plug-in port and the side plug-in port to increase the assembly matching area between it and the side board 532 . In addition, the connection function of the positioning screw can ensure the synchronous movement effect of the constant temperature printing paste output component 54 and the printing cabin 53 .

[0043] In order to improve the scraping and cleaning effect of the scraper 58 on the solder paste, the present invention is provided with a slide groove 534 near the bottom of the side plate 532, and the slide groove 534 is used to install the scraper 58. The back of the slide groove 534 is provided with a waist-shaped hole 535, and the waist-shaped hole 535 is used to install the adjustment screw connecting the scraper 58 and the side plate 532. The purpose of adjusting the height of the scraper 58 can be achieved by adjusting the insertion depth of the slide groove 534 and the scraper 58, and the adjustment screw is used to play a role of position locking, and in this way, the height of the scraper 58 from the steel mesh template 42 can be adjusted, so that the scraper 58 can better scrape and clean the scraper 58. It should be noted that the printing cabin 53 provides installation positions for two scrapers 58, and the heights of the two scrapers 58 from the board can be designed with one high and one low. In this way, the scraper 58 with a relatively high height from the board can scrape the solder paste flat, while the other scraper 58 with a relatively low height from the board can generate greater pressure with the steel mesh template 42, thereby achieving a cleaning effect, thereby improving the printing quality of the device.

[0044] Furthermore, the present invention is provided with end caps 536 at the front and rear ends of the printing cabin 53, and the end caps 536 are provided with a pipe opening 537 connected to the paste inlet pipe 547, and the pipe opening 537 is connected to the solder paste filling machine through a hose. The two end caps 536 are used to seal the components inside the printing cabin 53 to a certain extent, so as to prevent the paste inlet pipe 547 from being entangled with the mechanical components outside the printing cabin 53, and provide a communication channel between the paste inlet pipe 547 and the hose, so as to prevent the problem of the pipe being detached or broken during the lifting and lowering process of the printing cabin 53.

[0045] In order to improve the constant temperature control effect of the constant temperature printing paste output component 54, the heating channel 544 provided by the present invention includes a main hole parallel to the length direction of the paste output plate 542, and a plurality of branch holes connected to the paste output channel 543 are arranged on the hole surface of the main hole. The ceramic heating core 545 includes a ceramic main core 5451 matched with the main hole, and the ceramic main core 5451 is provided with a support foot 5452 matched with the branch hole. A heating electrode 5453 is arranged on the top of the ceramic heating core 545, and the heating electrode 5453 is connected to the heating source 546 through a wire 5454. Among them, the heating electrode 5453 can generate heat instantly after the heating source 546 provides current, and the ceramic main core 5451 and the support leg 5452 can provide a certain heating surface and concentrated heating point for the solder paste in the paste outlet channel 543, which can improve the instant heating of the device, and the ceramic heating core 545 itself has the characteristics of long life and good heating uniformity, which can further ensure the heating effect of the solder paste, which is beneficial to ensure that the solder paste is within the constant temperature control range, thereby improving the actual printing quality of the solder paste.

[0046] In order to improve production efficiency, the paste discharge plates 542 on the same main board 541 provided by the present invention are divided into two groups, and the paste inlet pipes 547 on each group of paste discharge plates 542 share a solder paste filler 55, which is arranged at the bottom of the crossbeam 51, and does not rise or fall with the rise or fall of the printing cabin 53. By adopting multiple solder paste fillers 55, it is easier to arrange in space than solder paste fillers 55 of the same capacity, which can improve the space utilization rate of the device, and in the case of a single solder paste filler 55 being blocked, other solder paste fillers 55 can continue to maintain the paste discharge state, and the uniform distribution effect of the paste coating roller 56 will not significantly affect the overall printing quality.

[0047] For the purpose of printing quality, both ends of the pressing plate 57 provided by the present invention are provided with V-shaped openings 571, which are open in the horizontal direction and wedged with the bottom end of the main board 541. The side of the pressing plate 57 is connected to the side of the main board 541 by clamping screws, and the bottom of the pressing plate 57 is used to directly contact the steel mesh template 42. After the pressing plate 57 and the printing cabin 53 are assembled, the pressing plate 57 can always slide against the surface of the steel mesh template 42 during the forward and backward movement of the printing cabin 53, which is conducive to improving the lamination quality of the steel mesh template 42 and the PCB board 10.

[0048] In order to improve the uniformity of solder paste printing, a plurality of uniformly distributed grooves 561 distributed in a circular array are arranged on the roller surface of the paste coating roller 56 provided by the present invention. The solder paste flowing out from the paste outlet plate 542 on the same main board 541 can be distributed in the uniformly distributed grooves 561 from the paste outlet nodes. The uniformly distributed grooves 561 can cover the unit width of the steel mesh template 42, thereby ensuring the uniform distribution of the solder paste on the steel mesh template 42, which not only saves solder paste but also obtains a better printing effect under the action of the subsequent scraper 58.

[0049] In order to improve the fitting quality between the steel mesh template 42 and the PCB board 10, the steel mesh lifting platform assembly 4 provided by the present invention includes a support plate 41 and a steel mesh template 42, a clamping plate 43 is provided at the edge of the support plate 41, a plurality of thin cylinders 44 are provided on the clamping plate 43, and the thin cylinders 44 are installed on the inner side of the frame 1 through a bracket 45, a countersunk plate hole is provided at the center of the support plate 41, and the countersunk plate hole is used to ensure that the surface of the template is not higher than the surface level of the entire support plate, so as to improve the knife-moving effect of the scraper 58; a template 46 is provided at the edge of the steel mesh template 42, and the template 46 includes a circular segment 461, and four angular flat plate segments 462 are provided at the four corners of the circular segment 461, the template 46 and the steel mesh template 42 are installed in the countersunk plate hole, and the bottom surface of the steel mesh template 42 and the bottom surface of the support plate 41 are on the same plane. Among them, the clamping plate 43 and the bracket 45 are used to establish a transmission relationship between the support plate 41 and the thin cylinder 44, that is, the thin cylinder 44 drives the support plate 41 to carry the steel mesh template 42 close to the PCB board 10 and away from the PCB board 10; the steel mesh template 42 adopts an enlarged design, with the template 46 as its edge expansion part, and the template 46 is added with four angular flat plate segments 462, which can increase the resistance of the steel mesh template 42 to arcing / arching from the surface of the support plate 41, improve the levelness of the bottom surface of the steel mesh template 42 and the bottom surface of the support plate 41, so that the steel mesh template 42 can be tightly against the PCB board 10 under the action of the thin cylinder 44, improve the quality of the solder paste leaking from the steel mesh template 42 to the hole position on the PCB board 10, that is, improve the solder paste printing quality of the PCB board 10 of this equipment.

[0050] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A solder paste printing device for electronic components, comprising a pair of racks symmetrically arranged front and back, a pair of printing support tables arranged between the racks, a passage for passing PCB boards arranged between the printing support tables, a steel mesh lifting platform assembly arranged above the printing support tables, a printing host arranged above the steel mesh lifting platform assembly, X-axis drive assemblies for driving the printing host to move in the X-axis direction arranged on both sides of the printing host, and a Z-axis drive assembly arranged on the top of the printing host, characterized in that: A support frame for supporting the bottom of the PCB board is arranged on the inner side of the aisle, and a synchronous clamping assembly is arranged on each of the printing support tables. The synchronous clamping assembly is used to position the PCB board, and the clamping working surface of the synchronous clamping assembly cooperates with the conveying front side and the conveying rear side of the PCB board. The printing host includes a crossbeam that is transmission-connected to the X-axis drive assembly and used to support the Z-axis drive assembly. A connecting seat connected to the Z-axis drive assembly is arranged below the crossbeam, and a printing cabin is arranged at the bottom of the connecting seat. Both sides of the printing cabin are arranged in an inverted V shape, and a group of constant temperature printing paste output components are arranged on both sides of the printing cabin. The constant temperature printing paste output component includes A main board, wherein a plurality of paste outlet plates are arranged at intervals on a surface of the main board facing the inner side of the printing cabin, the paste outlet plate is provided with a paste outlet channel and a heating channel, a ceramic heating core is arranged in the heating channel, the heating end of the ceramic heating core is electrically connected to a heating source arranged on the main board, the top of the paste outlet channel is a paste inlet end and is provided with a paste inlet tube, a solder paste filler is arranged on the supply side of the paste inlet tube, the bottom of the paste outlet channel is a paste outlet end and a paste coating roller is arranged below it, both ends of the paste coating roller are arranged on a pressing plate, the pressing plate is connected to the bottom end of the printing cabin and is used to apply pressure to the steel mesh lifting platform assembly, and a scraper is arranged on the back of the printing cabin; The synchronous clamping assembly includes a pair of fan-shaped plates distributed front and back along the conveying direction of the PCB board, the fan-shaped plates cooperate with the movable plate grooves arranged on the printing support table, a rotating shaft is arranged at the center of the circle of the fan-shaped plate, the rotating shaft passes through the printing platform from top to bottom and a gear is arranged at the bottom thereof, a rack is arranged on the transmission side of the gear, the rack is arranged on the swing rod, a tensioning wheel rollingly matched with the swing rod is arranged on the side of the swing rod facing away from the gear and the rack meshing with each other, two swing rods under the printing support table are hinged to each other and an articulated head is arranged at the hinge node, and a clamping drive cylinder for driving the articulated head to move horizontally is arranged on one side of the articulated head; The printing cabin includes an M-shaped top plate, a pair of side plates in an inverted V shape are arranged on both sides of the top plate, mounting ports are arranged on the side plates, an upper plug-in port matching with the top of the mounting port is arranged at the top of the main board, side plug-in ports matching with the two ends of the mounting port are arranged at the front and rear ends of the main board, and positioning screws connecting the main board and the side plates are arranged at positions close to the upper plug-in port and the side plug-in port.

2. The electronic component solder paste printing device according to claim 1, characterized in that: The side plate is provided with a slide groove near its bottom, the slide groove is used to install the scraper, and the back of the slide groove is provided with a waist-shaped hole, the waist-shaped hole is used to install the adjustment screw connecting the scraper and the side plate.

3. The electronic component solder paste printing device according to claim 2, characterized in that: End covers are arranged at the front and rear ends of the printing cabin, and a pipe opening connected with the paste inlet pipe is arranged on the end cover, and the pipe opening is connected with the solder paste filling machine through a hose.

4. The electronic component solder paste printing device according to claim 1, characterized in that: The heating channel includes a main hole parallel to the length direction of the paste outlet plate, and a plurality of branch holes connected to the paste outlet channels are arranged on the hole surface of the main hole. The ceramic heating core includes a ceramic main core matched with the main hole, and the ceramic main core is provided with supporting feet matched with the branch holes. A heating electrode is arranged on the top of the ceramic heating core, and the heating electrode is connected to the heating source through a wire.

5. The electronic component solder paste printing device according to claim 1, characterized in that: The paste output boards on the same main board are divided into two groups, and the paste inlet pipes on each group of paste output boards share a solder paste filler, which is arranged at the bottom of the crossbeam.

6. The electronic component solder paste printing device according to claim 1, characterized in that: Both ends of the pressure plate are provided with V-shaped openings, the V-shaped openings are opened in the horizontal direction and are wedged with the bottom end of the main board, and the side surface of the pressure plate is connected with the side surface of the main board by clamping screws.

7. The electronic component solder paste printing device according to claim 1, characterized in that: The roller surface of the paste coating roller is provided with a plurality of evenly distributed grooves distributed in a circular array.

8. The electronic component solder paste printing device according to claim 1, characterized in that: The steel mesh lifting platform assembly includes a support plate and a steel mesh template. A clamp is provided on the edge of the support plate. A plurality of thin cylinders are provided on the clamp. The thin cylinders are installed on the inner side of the frame through a bracket. A countersunk plate hole is provided at the center of the support plate. A template is provided on the edge of the steel mesh template. The template includes a circular segment. Four angular flat plate segments are provided at the four corners of the circular segment. The template and the steel mesh template are installed in the countersunk plate hole. The bottom surface of the steel mesh template and the bottom surface of the support plate are on the same plane.