A lens-based AiP chip floating pressing test device

Abstract

The invention discloses a lens-based AiP chip floating pressing test device, comprising a test frame, a test platform arranged on the test frame, a test station arranged on the test platform, a positioning test fixture on the test station, and test plates arranged on the test stations corresponding to the positioning test fixtures, the test plates are driven to move up and down by a downward pressing driving mechanism, the downward pressing driving mechanism is connected to the test plates through a floating mechanism to form a floating pressing on the chip under test, and the floating mechanism realizes horizontal longitudinal floating and horizontal lateral floating of the test plates; the invention adopts a floating pressing technology, and in the process of testing pressing, the AiP chip can be adaptively matched to the chip surface and pressed through floating adaptive control, and can be completely pressed on the test platform, thereby ensuring the precision and accuracy of the test.

Description

Technical Field

[0001] The invention relates to a lens-based AiP chip floating pressing test device. Background Art

[0002] For the test of AiP chips, most of the existing equipment uses direct and repeated pressure to position the chips repeatedly placed in the mold. This will cause the risk of damaging the chips and the risk of poor contact. Since AiP chips have very strict requirements on the test environment, on the one hand, the repeated position accuracy must be guaranteed within plus or minus 0.02mm, and on the other hand, it must be ensured that each time the pressure is pressed down, the pressure head that applies pressure is almost completely in contact with the chip. If there is a slight deviation, the test values ​​will be far apart, resulting in inaccurate testing. Therefore, how to control the pressure of the AiP chip is crucial. Summary of the invention

[0003] In view of the above problems, the object of the present invention is to provide a lens-based AiP chip floating pressing test device.

[0004] In order to achieve the above-mentioned purpose, the scheme of the present invention is: a lens-based AiP chip floating pressing test equipment, including a test frame, a test platform is arranged on the test frame, at least two test stations are arranged on the test platform, and a positioning test fixture is arranged on the test station, and the positioning test fixture is used to place the chip under test. Each test station is respectively provided with a test pressure plate corresponding to the positioning test fixture, and the test pressure plate is used to press down the chip under test after the chip under test is placed in the positioning test fixture to press and lock the chip under test, and the test pressure plate is driven by a downward pressing driving mechanism to move up and down, wherein: the downward pressing driving mechanism is connected to the test pressure plate through a floating mechanism to form a floating pressing on the chip under test, and the floating mechanism realizes horizontal longitudinal floating and horizontal lateral floating of the test pressure plate;

[0005] The realization of horizontal longitudinal floating includes end plates respectively arranged on both sides of the horizontal lateral direction of the test platen, the end plates on both sides are respectively connected to the horizontal longitudinal micro-swing mechanism through the first rotating shaft, the horizontal longitudinal micro-swing mechanism is connected to the test platen, the first rotating shafts of the end plates on both sides are perpendicular to the chip under test relative to the center, so as to realize the horizontal longitudinal floating of the test platen with the chip under test pressed downward;

[0006] The realization of horizontal transverse floating includes a vertical upright plate connected to one end of the horizontal transverse side end plates of the test platen, the vertical upright plate is connected to the horizontal transverse micro-swing mechanism through a second rotating shaft, the extended axis of the second rotating shaft intersects with the vertical line of the center of the chip under test in the positioning mold, and the horizontal transverse micro-swing mechanism provides space for the vertical upright plate to drive the transverse plates of the end plates on both sides to swing around the second rotating shaft, thereby realizing the horizontal transverse floating of the test platen with the chip under test pressed down as the center;

[0007] The horizontal transverse micro-sway mechanism is connected to the downward pressing driving mechanism.

[0008] The solution is further as follows: the middle of the test platen is hollowed out, and slide grooves are respectively arranged on both sides of the middle of the bottom surface of the test platen. A pressure head is inserted into the slide groove and positioned in the hollowed out portion. The pressure head is used to press and lock the chip under test when the test platen is pressed down. A test lens is arranged in the pressure head, and different pressure heads can be replaced through the slide groove to adapt to the testing of different chips.

[0009] The scheme is further as follows: the horizontal longitudinal micro-swing mechanism includes a horizontal positioning bar cross block and a floating bar cross block, the horizontal positioning bar cross blocks are respectively connected and fixed on the inner sides of the end plates on both sides, the floating bar cross block is arranged under the horizontal positioning bar cross block, the floating bar cross block is connected to the end plate through the first rotating shaft, a longitudinal micro-swing gap is left between the horizontal positioning bar cross block and the floating bar cross block, and spring washers are respectively arranged on both sides of the first rotating shaft of the longitudinal micro-swing gap; in the initial state where the floating bar cross block is not subjected to force, the horizontal positioning bar cross block places the floating bar cross block in a horizontal state longitudinally through the spring washers, and the floating bar cross block is connected to the test pressure plate; when the test pressure plate moves down to press the chip under test and the front and rear forces are uneven, the two sides of the floating bar cross block swing up and down with the first rotating shaft as the center to adapt to the longitudinal deviation of the chip under test.

[0010] The scheme is further as follows: the floating strip cross block is respectively provided with blind holes on both sides of the first rotating shaft, a through hole is provided in the middle of the blind hole, a bolt is inserted into the through hole and connected to a cylindrical bushing at the blind hole, the lower end of the cylindrical bushing is an outward tapered pin, the upper end surface of the test pressure plate is provided with a through hole corresponding to the blind hole of the floating strip cross block, and the lower end of the through hole is provided with a tapered pin hole corresponding to the tapered pin, the cylindrical bushing is inserted into the test pressure plate through hole from the lower end surface of the test pressure plate and connected with the bolt, the tapered pin at the lower end of the cylindrical bushing hangs on the tapered pin hole at the lower end of the test pressure plate through hole to connect and fix the test pressure plate with the floating strip cross block, a movable gap is left between the cylindrical bushing and the test pressure plate through hole, a spring is provided in the blind hole of the floating strip cross block, the spring covers the cylindrical bushing, one end of the spring is pressed in the blind hole of the floating strip cross block, and the other end of the spring presses the test pressure plate to form a spacing gap between the test pressure plate and the floating strip cross block;

[0011] When the test pressure plate moves downward to press the chip under test, the test pressure plate is pressed by the force to shrink the spring and move upward. At this time, the cylindrical bushing does not move, and the upward-moving test pressure plate causes the tapered pin at the lower end of the bushing to be out of contact with the tapered pin hole corresponding to the lower end of the through hole of the test pressure plate. Since there is a movable gap between the cylindrical bushing and the through hole of the test pressure plate, the test pressure plate is floated in all directions. When the springs on both sides are unevenly stressed, the floating bar-shaped horizontal block is caused to swing up and down with the first rotating shaft as the center to adapt to the longitudinal deviation of the chip under test.

[0012] Wherein: the horizontal longitudinal floating and the horizontal lateral floating are realized after the test pressing plate floats in all directions.

[0013] The solution is further that: grooves are respectively arranged on both sides of the longitudinal center of the upper end surface of the test pressing plate, elastic seats are arranged in the grooves, universal balls are arranged in the elastic seats, and the universal balls are elastically pressed on the floating strip cross block.

[0014] The solution is further as follows: the horizontal transverse micro-sway mechanism includes a rectangular positioning plate arranged on the back of the vertical vertical plate, and the second rotating shaft is arranged in the center of the front end of the rectangular positioning plate. The vertical vertical plate can be rotatably mounted on the second rotating shaft, and limiting strips are respectively arranged on both sides of the rectangular positioning plate. The limiting strips are connected and fixed to the vertical vertical plate, and a limiting gap is left between the limiting strips and the rectangular positioning plate. A spring sheet is arranged in the limiting gap, and the spring sheet makes the vertical vertical plate in a transverse horizontal state in the initial state. When the test pressure plate is pressed down and the lateral left and right force is uneven, the vertical vertical plate randomly rotates and swings between the limiting gaps on both sides of the rectangular positioning plate with the second rotating shaft as the center to adapt to the lateral offset of the chip under test.

[0015] The scheme is further as follows: the downward pressure driving mechanism includes a driving column, a first slide rail is arranged on the driving column, a corresponding slide groove is arranged on the test frame, the first slide rail is inserted into the slide groove, a rack is arranged on the side of the driving column, and a motor arranged on the test frame drives the rack to move up and down through a gear, and the rack moving up and down drives the driving column to slide up and down in the slide groove of the test frame through the first slide rail, a pressure arm is arranged at the top end of the driving column and extends forward, and the front end of the pressure arm is connected to the floating mechanism, and a pressure sensor is arranged between the floating mechanism and the pressure arm, and the driving column that slides up and down drives the floating mechanism to move up and down through the pressure arm.

[0016] The scheme is further as follows: the pressure arm is provided with an elastic connecting rod between the pressure sensor and the floating mechanism, the elastic connecting rod includes a cross bar, the pressure sensor is arranged on the cross bar, through holes are respectively arranged on both ends of the cross bar, connecting rods are hung in the through holes, the lower end of the connecting rod is connected to the floating mechanism, the cross bar covers the connecting rod and slides up and down, a spring is covered on the connecting rod between the floating mechanism and the cross bar, a second slide rail is provided on the driving column facing away from the first slide rail, and the floating mechanism is connected to the second slide rail through a corresponding slide groove. When the pressure arm is lifted up with the driving column, the pressure arm lifts the floating mechanism through the cross bar and the connecting rod, and when the pressure arm is pressed down with the driving column, when the test platen touches the chip under test, the spring is compressed by the cross bar to buffer the downward pressure of the test platen.

[0017] Beneficial effects of the present invention: The equipment adopts floating pressing technology. During the test pressing process, floating adaptive control is used to enable the AiP chip to adaptively match the chip surface and press it, and it can be completely pressed onto the test platform, ensuring the precision and accuracy of the test.

[0018] The invention is described in detail below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall appearance structure of the testing device of the present invention;

[0020] Figure 2 This is a schematic diagram of the overall inner structure of the test equipment of the present invention.

[0021] Figure 3 This is a schematic diagram of the double-station pressing structure of the present invention;

[0022] Figure 4 This is a schematic diagram of the single-station pressing structure of the present invention;

[0023] Figure 5 It is a schematic diagram of the front structural section of the horizontal longitudinal micro-sway mechanism of the present invention;

[0024] Figure 6 It is a schematic diagram of the side structure section of the horizontal and longitudinal micro-sway mechanism of the present invention, Figure 5 DD profile;

[0025] Figure 7 It is a structural schematic diagram of the horizontal transverse micro-sway mechanism and the downward pressure driving mechanism of the present invention. DETAILED DESCRIPTION

[0026] A lens-based AiP chip floating pressing test device, such as Figures 1 to 7As shown, the test equipment includes a test rack 1, on which a test platform 101 is arranged. The test platform 101 is provided with a test station 2, a taping station 3, a laser marking station 4, an XY axis transmission system 5 and a chip grabbing mechanism 6 which are common to traditional equipment. The XY axis transmission system 5 drives the chip grabbing mechanism 6 to move and transfer the chip between the test station 2, the taping station 3 and the laser marking station 4. Two test stations 2 are arranged on the test platform 101. There is a positioning test fixture 7 on the test station 2. The positioning test fixture 7 is used to place the chip 8 to be tested. A test station 2 is provided with a test pressure plate 9 corresponding to the positioning test fixture 7. The test pressure plate 9 is used to press down and lock the chip under test 8 after the chip under test 8 is placed in the positioning test fixture 7. The test pressure plate 9 is driven by the downward pressing drive mechanism 10 to move up and down. Of course, the equipment also includes a test control system. The test control system includes a sorting module, a test module, and an instrument. The test control system completes the equipment's functions of loading and unloading materials, electrical performance testing, automatic sorting / plating / packaging, and ultimately realizes the automated test operation of the entire equipment under the unified support of the ATE platform software.

[0027] This device is mainly used for pressure testing of short-range millimeter wave chips. Therefore, it is different from traditional testing equipment in that: the downward pressure driving mechanism 10 is connected to the test pressure plate 9 through a floating mechanism 11 to form a floating pressure on the chip under test. The floating mechanism 11 realizes the horizontal longitudinal floating and horizontal lateral floating of the test pressure plate 9, wherein;

[0028] The realization of the horizontal longitudinal floating includes end plates 1101 respectively arranged on both horizontal lateral sides of the test platen 9, the end plates 1101 on both sides are respectively connected to the horizontal longitudinal micro-sway mechanism 1103 through the first rotating shaft 1102, the horizontal longitudinal micro-sway mechanism 1103 is connected to the test platen 9, the center of the first rotating shaft 1102 of the end plates 1101 on both sides is perpendicular to the center of the line a relative to the chip under test, thereby realizing the horizontal longitudinal floating of the test platen 9 with the chip under test as the center;

[0029] The realization of the horizontal lateral floating includes a vertical upright plate 1104 connected to one end of the horizontal lateral end plates on both sides of the test platen, the vertical upright plate 1104 is connected to the horizontal lateral micro-swing mechanism 1106 through the second rotating shaft 1105, the extended axis b of the second rotating shaft 1105 intersects with the vertical line c of the center of the chip under test in the positioning mold, and the horizontal lateral micro-swing mechanism 1106 provides space for the vertical upright plate 1104 to drive the lateral plate swing of the end plates 1101 on both sides around the second rotating shaft 1105, thereby realizing the horizontal lateral floating of the test platen 9 centered on the downward pressure on the chip under test; the horizontal lateral micro-swing mechanism 1106 is connected to the downward pressure driving mechanism 10.

[0030] Among them: the middle of the test pressure plate 9 is hollowed out, and slide grooves 901 are respectively set on both sides of the middle of the bottom surface of the test pressure plate. A pressure head 902 is inserted into the slide groove 901 and positioned in the hollow. The pressure head 902 is used to press and lock the chip under test when the test pressure plate 9 is pressed down. A test lens 903 is set in the pressure head 902. Different pressure heads 902 can be replaced through the slide groove to adapt to the test of different chips.

[0031] In the embodiment: the horizontal longitudinal micro-swing mechanism 1103 includes a horizontal positioning bar cross block 1103-1 and a floating bar cross block 1103-2. The horizontal positioning bar cross block 1103-1 is respectively connected and fixed to the inner side of the end plates 1101 on both sides. The floating bar cross block 1103-2 is arranged under the horizontal positioning bar cross block 1103-1. The floating bar cross block 1103-2 is connected to the end plate 1101 through the first rotating shaft 1102. A longitudinal micro-swing gap 1103-3 is left between the horizontal positioning bar cross block 1103-1 and the floating bar cross block 1103-2. The width of the longitudinal micro-swing gap 1103-3 is 5 mm to 10mm, and the longitudinal micro-swing gap 1103-3 is respectively provided with spring washers on both sides of the first rotating shaft 1102; when the test pressure plate 9 is not pressed down and the floating bar cross block 1103-2 is not under force in the initial state, the horizontal positioning bar cross block 1103-1 places the floating bar cross block 1103-2 in a horizontal state in the longitudinal direction through the spring washers in the longitudinal micro-swing gap 1103-3, and the floating bar cross block 1103-2 is connected to the test pressure plate 9; when the test pressure plate 9 moves down to press the chip under test and the force is uneven before and after, the two sides of the floating bar cross block 1103-2 swing up and down with the first rotating shaft as the center to adapt to the longitudinal offset of the chip under test.

[0032] Among them, the floating bar cross block 1103-2 connection is a floating connection, and the specific structure is: the floating bar cross block 1103-2 is respectively provided with blind holes 1103-5 on both sides of the first rotating shaft 1102, and a through hole 1103-6 is provided in the middle of the blind hole 1103-5. A bolt 1103-7 is inserted into the through hole and connected to a cylindrical bushing 1103-8 at the blind hole. The lower end of the cylindrical bushing 1103-8 is an outward tapered pin 1103-9. The upper end surface of the test pressure plate 9 is provided with a through hole corresponding to the blind hole 1103-5 of the floating bar cross block 1103-2. 904, a tapered pin hole 905 is provided at the lower end of the through hole 904 corresponding to the tapered pin 1103-9, the cylindrical bushing 1103-8 is inserted into the test platen through hole 904 from the lower end face of the test platen 9 and connected with the bolt 1103-7, the tapered pin 1103-9 at the lower end of the cylindrical bushing 1103-8 hangs on the tapered pin hole 905 at the lower end of the test platen through hole 904 to connect and fix the test platen 9 with the floating bar cross block 1103-2, and an active gap is left between the cylindrical bushing 1103-8 and the test platen through hole 904, the active gap is 5mm, and the floating bar cross block 1103-2 is connected and fixed. A spring 1103-10 is provided in the blind hole 1103-5 of the movable bar-shaped horizontal block 1103-2, and the spring 1103-10 is sleeved on the cylindrical bushing 1103-8. One end of the spring 1103-10 is pressed against the blind hole 1103-5 of the floating bar-shaped horizontal block, and the other end of the spring 1103-10 is pressed against the test pressure plate 9 (in the figure, the test pressure plate 9 is pressed against the process fixing block 906), and a gap 1103-11 is formed between the test pressure plate 9 and the floating bar-shaped horizontal block 1103-2; when the test pressure plate 9 moves down to press the chip under test, the test pressure plate 9 is pressed against the spring. 1103-10 shrinks and moves upwards. At this time, the cylindrical bushing 1102-8 does not move. The upward-moving test platen 9 causes the tapered pin 1103-9 at the lower end of the bushing to be out of contact with the tapered pin hole 905 corresponding to the lower end of the test platen through hole 904. Since there is a movable gap between the cylindrical bushing 1103-8 and the test platen through hole 904, the test platen 9 is floated in all directions. When the springs 1103-10 on both sides are subjected to uneven force, the two sides of the floating bar cross block 1103-2 are prompted to swing up and down with the first rotating shaft 1102 as the center to adapt to the longitudinal offset of the chip under test.

[0033] Wherein: the horizontal longitudinal floating and the horizontal lateral floating are realized after the test pressing plate 9 floats in all directions.

[0034] In the embodiment: grooves 907 are respectively arranged on both sides of the longitudinal center of the upper end surface of the test pressing plate 9, an elastic seat 908 is arranged in the groove 907, a universal ball 909 is arranged in the elastic seat, and the universal ball 909 is elastically pressed on the floating bar-shaped horizontal block 1103-2.

[0035] In the embodiment: the horizontal transverse micro-sway mechanism 1106 includes a rectangular positioning plate 1106-1 arranged on the back of the vertical upright plate, and the second rotating shaft 1105 is arranged in the center of the front end of the rectangular positioning plate 1106-1. The vertical upright plate 1104 can be rotatably sleeved on the second rotating shaft 1105, and limiting strips 1106-2 are respectively arranged on both sides of the rectangular positioning plate 1106-1. The limiting strips 1106-2 are connected and fixed to the vertical upright plate 1104 by bolts 12. A limiting gap of 3-5mm is left between the limiting strips 1106-2 and the rectangular positioning plate 1106-1, and a spring piece is arranged in the limiting gap. The spring piece makes the vertical upright plate 1104 in a horizontal horizontal state in the initial state. When the test pressing plate 9 is pressed down and the horizontal left and right forces are uneven, the vertical upright plate 1104 randomly rotates and swings between the limiting gaps on both sides of the rectangular positioning plate 1106-1 with the second rotating shaft as the center to adapt to the lateral offset of the chip under test.

[0036] In the embodiment: the downward pressing driving mechanism 10 includes a driving column 1001, a first slide rail 1002 is arranged on the driving column 1001, a slide groove 1003 corresponding to the first slide rail 1002 is arranged on the test frame, the first slide rail 1002 is inserted into the slide groove 1003, a rack 1004 is arranged on the side of the driving column 1001, and a motor 1005 arranged on the test frame drives the rack 1004 to move up and down through a gear, and the rack 1004 moving up and down drives the driving column 1001 to slide up and down in the slide groove 1003 of the test frame through the first slide rail 1002, and a pressing arm 1006 is arranged on the top of the driving column 1001, and the front end of the pressing arm 1006 is connected to the floating mechanism 11, and a pressure sensor 13 is arranged between the floating mechanism 11 and the pressing arm 1006, and the driving column 1001 that slides up and down drives the floating mechanism 11 to move up and down through the pressing arm 1006.

[0037] Wherein: the pressure arm 1006 is provided with an elastic connecting rod between the pressure sensor 13 and the floating mechanism 11, the elastic connecting rod includes a cross bar 14, the pressure sensor 13 is provided on the cross bar 14, through holes are provided at both ends of the cross bar 14, and connecting rods 15 are hung in the through holes, the lower end of the connecting rod is connected to the floating mechanism 11, the cross bar 14 covers the connecting rod 15 and slides up and down, a spring 16 is sleeved on the connecting rod 15 between the floating mechanism 11 and the cross bar 14, and the driving column 1001 is facing away from the first slide rail 1 002 is provided with a second slide rail 1007, and the floating mechanism 11 is connected to the second slide rail 1007 through a slide groove 1106-3 corresponding to the second slide rail 1007. When the pressure arm 1006 is lifted up along with the driving column 1001, the pressure arm 1006 lifts the floating mechanism 11 through the cross bar 14 and the connecting rod 15. When the pressure arm 1006 is pressed down along with the driving column 1001, when the test platen 9 touches the chip under test, the spring 16 is compressed by the cross bar 14 to buffer the downward pressure of the test platen 9.

[0038] The floating mechanism 11 is connected to the pressure arm 1006 through the rectangular positioning plate 1106-1 of the horizontal transverse micro-sway mechanism 1106, the slide groove 1106-3 corresponding to the second slide rail 1007 is arranged on the side of the rectangular positioning plate 1106-1 facing away from the second rotating shaft 1105, the connecting rod 15 is connected to the top of the rectangular positioning plate 1106-1, and the spring 16 is pressed on the top of the rectangular positioning plate 1106-1.

[0039] The above-mentioned lens-based AiP chip floating pressing test equipment embodiment adopts floating pressing technology. During the test pressing process, floating adaptive control is used to enable the AiP chip to adaptively match the chip surface and press it, and it can be completely pressed onto the test platform, ensuring the precision and accuracy of the test.

Claims

1. A lens-based AiP chip floating pressing test device, comprising a test frame, a test platform is arranged on the test frame, a test station is arranged on the test platform, a positioning test fixture is arranged on the test station, the positioning test fixture is used to place the chip under test, and the test station is respectively provided with a test pressing plate corresponding to the positioning test fixture, the test pressing plate is used to press down the chip under test after the chip under test is placed in the positioning test fixture to press and lock the chip under test, and the test pressing plate is driven by a downward pressing driving mechanism to move up and down, characterized in that, The downward pressing driving mechanism is connected to the test pressing plate through a floating mechanism to form a floating pressing on the chip under test, and the floating mechanism realizes horizontal longitudinal floating and horizontal lateral floating of the test pressing plate; The realization of horizontal longitudinal floating includes end plates respectively arranged on both sides of the horizontal lateral direction of the test platen, the end plates on both sides are respectively connected to the horizontal longitudinal micro-swing mechanism through the first rotating shaft, the horizontal longitudinal micro-swing mechanism is connected to the test platen, the first rotating shafts of the end plates on both sides are perpendicular to the chip under test relative to the center, so as to realize the horizontal longitudinal floating of the test platen with the chip under test pressed downward; The realization of horizontal transverse floating includes connecting a vertical upright plate at one end of the horizontal transverse side end plates of the test platen, the vertical upright plate is connected to the horizontal transverse micro-swing mechanism through a second rotating shaft, the extended axis of the second rotating shaft intersects with the vertical line of the center of the chip under test in the positioning mold, and the horizontal transverse micro-swing mechanism provides space for the vertical upright plate to drive the side end plates to swing transversely around the second rotating shaft, thereby realizing the horizontal transverse floating of the test platen with the chip under test pressed down as the center; The horizontal transverse micro-sway mechanism is connected to the downward pressing driving mechanism.

2. The floating pressure testing device according to claim 1, characterized in that: The middle of the test pressure plate is hollowed out, and slide grooves are respectively arranged on both sides of the middle of the bottom surface of the test pressure plate. A pressure head is inserted into the slide groove and positioned in the hollow space. The pressure head is used to press and lock the chip under test when the test pressure plate is pressed down. A test lens is arranged in the pressure head. Different pressure heads can be replaced through the slide groove to adapt to the testing of different chips.

3. The floating pressure testing device according to claim 1, characterized in that: The horizontal longitudinal micro-swing mechanism comprises a horizontal positioning bar cross block and a floating bar cross block. The horizontal positioning bar cross blocks are respectively connected and fixed on the inner sides of the end plates on both sides. The floating bar cross block is arranged under the horizontal positioning bar cross block. The floating bar cross block is connected to the end plate through the first rotating shaft. A longitudinal micro-swing gap is left between the horizontal positioning bar cross block and the floating bar cross block. The longitudinal micro-swing gap is respectively provided with spring washers on both sides of the first rotating shaft. In the initial state where the floating bar cross block is not subjected to force, the horizontal positioning bar cross block places the floating bar cross block in a horizontal state longitudinally through the spring washers, and the floating bar cross block is connected to the test pressure plate. When the test pressure plate moves down to press the chip under test and the front and rear forces are uneven, the two sides of the floating bar cross block swing up and down with the first rotating shaft as the center to adapt to the longitudinal deviation of the chip under test.

4. The floating pressure testing device according to claim 3, characterized in that: The floating bar cross block is respectively provided with blind holes on both sides of the first rotating shaft, and a through hole is provided in the middle of the blind hole, a bolt is inserted into the through hole, and a cylindrical bushing is connected at the blind hole, and the lower end of the cylindrical bushing is an outward tapered pin, and the upper end surface of the test pressure plate is provided with a through hole corresponding to the blind hole of the floating bar cross block, and the lower end of the through hole is provided with a tapered pin hole corresponding to the tapered pin, and the cylindrical bushing is inserted into the test pressure plate through hole from the lower end surface of the test pressure plate and connected with the bolt, and the tapered pin at the lower end of the cylindrical bushing hangs the lower end of the test pressure plate through hole, and the tapered pin hole connects and fixes the test pressure plate with the floating bar cross block, and a movable gap is left between the cylindrical bushing and the test pressure plate through hole, and a spring is provided in the blind hole of the floating bar cross block, and the spring covers the cylindrical bushing, one end of the spring is pressed in the blind hole of the floating bar cross block, and the other end of the spring presses the test pressure plate, so as to form a spacing gap between the test pressure plate and the floating bar cross block; When the test pressure plate moves downward to press the chip under test, the test pressure plate is pressed by the force to shrink the spring and move upward. At this time, the cylindrical bushing does not move, and the upward-moving test pressure plate causes the tapered pin at the lower end of the bushing to be out of contact with the tapered pin hole corresponding to the lower end of the through hole of the test pressure plate. Since there is a movable gap between the cylindrical bushing and the through hole of the test pressure plate, the test pressure plate is floated in all directions. When the springs on both sides are unevenly stressed, the floating bar-shaped horizontal block is caused to swing up and down with the first rotating shaft as the center to adapt to the longitudinal deviation of the chip under test. Wherein: the horizontal longitudinal floating and the horizontal lateral floating are realized after the test pressing plate floats in all directions.

5. The floating pressure testing device according to claim 4, characterized in that: The test platen is provided with grooves on both sides of the longitudinal center of the upper end surface, wherein elastic seats are provided in the grooves, and universal balls are provided in the elastic seats, and the universal balls are elastically pressed against the floating bar-shaped horizontal blocks.

6. The floating pressure testing device according to claim 1, characterized in that: The horizontal transverse micro-sway mechanism includes a rectangular positioning plate arranged on the back of the vertical vertical plate, and the second rotating shaft is arranged in the center of the front end of the rectangular positioning plate. The vertical vertical plate can be rotatably mounted on the second rotating shaft, and limiting strips are respectively arranged on both sides of the rectangular positioning plate. The limiting strips are connected and fixed to the vertical vertical plate, and a limiting gap is left between the limiting strips and the rectangular positioning plate. A spring sheet is arranged in the limiting gap, and the spring sheet makes the vertical vertical plate in a transverse horizontal state in the initial state. When the test pressure plate is pressed down and the lateral left and right force is uneven, the vertical vertical plate randomly rotates and swings between the limiting gaps on both sides of the rectangular positioning plate with the second rotating shaft as the center to adapt to the lateral offset of the chip under test.

7. The floating pressure testing device according to claim 1, characterized in that: The downward driving mechanism includes a driving column, a first slide rail is arranged on the driving column, a corresponding slide groove is arranged on the test frame, the first slide rail is inserted into the slide groove, a rack is arranged on the side of the driving column, and a motor arranged on the test frame drives the rack to move up and down through a gear, and the rack moving up and down drives the driving column to slide up and down in the slide groove of the test frame through the first slide rail, a pressure arm is arranged on the top end of the driving column, the front end of the pressure arm is connected to the floating mechanism, a pressure sensor is arranged between the floating mechanism and the pressure arm, and the driving column that slides up and down drives the floating mechanism to move up and down through the pressure arm.

8. The floating pressure testing device according to claim 7, characterized in that: The pressure arm is provided with an elastic connecting rod between the pressure sensor and the floating mechanism, and the elastic connecting rod includes a cross bar, the pressure sensor is arranged on the cross bar, through holes are respectively arranged on both ends of the cross bar, and connecting rods are hung in the through holes, and the lower end of the connecting rod is connected to the floating mechanism, the cross bar is sleeved around the connecting rod and slides up and down, a spring is sleeved on the connecting rod between the floating mechanism and the cross bar, a second slide rail is arranged on the driving column facing away from the first slide rail, and the floating mechanism is connected to the second slide rail through a corresponding slide groove. When the pressure arm is lifted up with the driving column, the pressure arm lifts the floating mechanism through the cross bar and the connecting rod, and when the pressure arm is pressed down with the driving column, when the test pressure plate touches the chip under test, the spring is compressed by the cross bar to buffer the downward pressure of the test pressure plate.

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