PCB component mounting quality optimization method and system

Abstract

The present invention discloses a PCB component mounting quality optimization method and system, and relates to the field of component mounting technology. The method includes: obtaining a first printing result under a first printing strategy; detecting and analyzing the first printing result to obtain a first printing feedback coefficient, and forming a first solder paste printing characteristic parameter group; matching to obtain a first simulation mounting record; if the first simulation mounting quality does not reach the mounting quality threshold value, issuing a first optimization instruction, and performing optimization analysis to obtain an optimal printing strategy; obtaining the optimal printing result of a PCB board according to the optimal printing strategy. The present invention solves the technical problems in the prior art that quality control lacks scientificity, mounting quality assessment is inaccurate, and solder paste quality is difficult to ensure, and achieves the technical effect of realizing accurate quality assessment, ensuring solder paste quality, and improving PCB component mounting quality and efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of component mounting, and in particular to a method and system for optimizing PCB component mounting quality. Background Art

[0002] In the field of electronic manufacturing, the quality of PCB component mounting is of vital importance. As electronic products develop towards miniaturization and multifunctionality, the requirements for the accuracy and reliability of PCB component mounting are becoming higher and higher. In the traditional PCB component mounting process, parameter setting and quality control often rely on experience, and lack of systematic optimization methods, resulting in problems such as uneven solder paste printing, unreasonable steel mesh design, and unstable component mounting quality. At the same time, due to the lack of effective detection and analysis methods, it is difficult to accurately evaluate the mounting quality, and it is also difficult to quickly find the optimal printing strategy and parameter combination, which affects the production efficiency and quality of electronic products.

[0003] There are technical problems in the existing technology, such as lack of scientific quality control, inaccurate mounting quality assessment, and difficulty in ensuring solder paste quality. Summary of the invention

[0004] The present application provides a PCB component mounting quality optimization method and system, which is used to solve the technical problems in the prior art of lack of scientific quality control, inaccurate mounting quality assessment, and difficulty in ensuring solder paste quality.

[0005] In view of the above problems, the present application provides a method and system for optimizing PCB component mounting quality.

[0006] In a first aspect of the present application, a method for optimizing the quality of PCB component placement is provided, the method comprising:

[0007] Under a first printing strategy, a PCB pad is printed by distributing a PCB steel mesh coated with PCB solder paste to obtain a first printing result; a printing detection device is activated to detect and analyze the first printing result to obtain a first printing feedback coefficient; the steel mesh feedback coefficient and the solder paste feedback coefficient are read in sequence, and a first solder paste printing characteristic parameter group is formed with the first printing feedback coefficient; the first solder paste printing characteristic parameter group is traversed in a PCB board mounting simulation database to match and obtain a first simulation mounting record, wherein the first simulation mounting record includes a first simulation mounting quality; if the first simulation mounting quality does not reach a mounting quality threshold value, a first optimization instruction is issued, and based on the first optimization instruction, an optimization analysis is performed on the first printing strategy to obtain an optimal printing strategy; according to the optimal printing strategy, an optimal printing result of the PCB board is obtained, wherein the optimal printing result is used to optimize the mounting quality of the PCB board.

[0008] A second aspect of the present application provides a PCB component placement quality optimization system, the system comprising:

[0009] A printing result acquisition module, the printing result acquisition module is used to print the PCB pad under the first printing strategy by distributing the PCB steel mesh coated with PCB solder paste to obtain the first printing result; a printing feedback coefficient acquisition module, the printing feedback coefficient acquisition module is used to activate the printing detection equipment to detect and analyze the first printing result to obtain the first printing feedback coefficient; a solder paste printing characteristic parameter group formation module, the solder paste printing characteristic parameter group formation module is used to read the steel mesh feedback coefficient and the solder paste feedback coefficient in sequence, and form the first solder paste printing characteristic parameter group with the first printing feedback coefficient; a simulation mounting record matching module, the simulation mounting record matching module is used to simulate the mounting record The first solder paste printing characteristic parameter group is traversed in the PCB board mounting simulation database to match and obtain a first simulation mounting record, wherein the first simulation mounting record includes a first simulation mounting quality; an optimal printing strategy acquisition module, wherein the optimal printing strategy acquisition module is used to issue a first optimization instruction if the first simulation mounting quality does not reach a mounting quality threshold value, and perform optimization analysis on the first printing strategy based on the first optimization instruction to obtain an optimal printing strategy; an optimal printing result acquisition module, wherein the optimal printing result acquisition module is used to obtain an optimal printing result of the PCB board according to the optimal printing strategy, wherein the optimal printing result is used to optimize the mounting quality of the PCB board.

[0010] One or more technical solutions provided in this application have at least the following technical effects or advantages:

[0011] Under the first printing strategy, the PCB pad is printed by spreading a PCB steel mesh coated with PCB solder paste to obtain the first printing result; the printing detection equipment is activated to perform detection and analysis to obtain the first printing feedback coefficient; the steel mesh feedback coefficient and the solder paste feedback coefficient are read in sequence to form the first solder paste printing characteristic parameter group; the first solder paste printing characteristic parameter group is traversed in the PCB board mounting simulation database, the first simulation mounting record is matched, the first optimization instruction is issued, and the first printing strategy is optimized based on the first optimization instruction to obtain the optimal printing strategy; the optimal printing result of the PCB board is obtained according to the optimal printing strategy. The technical effect of achieving accurate quality evaluation, ensuring solder paste quality, and improving the quality and efficiency of PCB component mounting is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0013] Figure 1 A schematic diagram of a PCB component placement quality optimization method flow chart provided in an embodiment of the present application;

[0014] Figure 2 A schematic diagram of the structure of a PCB component placement quality optimization system provided in an embodiment of the present application.

[0015] Explanation of the reference numerals: printing result acquisition module 10 , printing feedback coefficient acquisition module 20 , solder paste printing characteristic parameter group building module 30 , simulation mounting record matching module 40 , optimal printing strategy acquisition module 50 , optimal printing result acquisition module 60 . DETAILED DESCRIPTION

[0016] The present application provides a PCB component mounting quality optimization method and system to solve the technical problems in the prior art such as lack of scientific quality control, inaccurate mounting quality assessment, and difficulty in ensuring solder paste quality.

[0017] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0018] Embodiment 1, as Figure 1 As shown, the present application provides a method for optimizing the quality of PCB component mounting, the method comprising:

[0019] Step S100: Under a first printing strategy, a PCB pad is printed by using a PCB steel mesh coated with PCB solder paste to obtain a first printing result.

[0020] Specifically, first of all, it is clear to adopt the first printing strategy for operation. The first printing strategy is a printing scheme based on a series of predetermined printing indicators. The indicators cover key parameters such as pressure, speed and solder paste scraper angle. The selection of these parameters plays a vital role in the final printing results. Use a PCB steel mesh coated with PCB solder paste to print the PCB pads to ensure that the PCB components can be firmly mounted on the PCB board. The opening design on the PCB steel mesh corresponds to the PCB pads. Through precise control, the right amount of solder paste is accurately printed on the PCB pads. In the actual printing process, the size of the pressure will affect the degree of adhesion of the solder paste on the PCB pads. If the pressure is too high, the solder paste will be over-extruded, resulting in uneven printing or solder paste overflow; if the pressure is too low, it cannot ensure that the solder paste is fully attached to the pad, affecting the subsequent mounting quality. The choice of speed is also important. Too fast speed will lead to incomplete printing or missing printing, while too slow speed will reduce production efficiency. The adjustment of the solder paste scraper angle can control the uniformity of solder paste distribution. Different angles will have different effects on the flow and filling of solder paste. After this printing process, the first printing result is obtained. This result is the basis for subsequent testing and analysis, and it will reflect the printing quality status under the current printing strategy and parameter combination.

[0021] Step S200: activating a printing detection device to detect and analyze the first printing result to obtain a first printing feedback coefficient.

[0022] Specifically, after the printing operation is completed, the printing detection equipment needs to be activated to perform detailed detection and analysis on the first printing result. The printing detection equipment is specially designed for PCB printing quality detection, with high precision and high reliability, including solder joint volume probe and printability probe. The solder joint volume probe is mainly used to detect the volume corresponding to multiple solder joints in the first printing result. In the PCB printing process, the volume of the solder joint directly affects the quality and reliability of subsequent component mounting. If the solder joint volume is too large, it will cause a short circuit between components; if the solder joint volume is too small, it will not provide sufficient connection strength. Through the detection of the solder joint volume probe, the specific volume data of each solder joint is obtained, which provides a basis for subsequent analysis. The printability probe is used to evaluate the printing uniformity of the first printing result. Printing uniformity is an important indicator for measuring PCB printing quality, reflecting whether the distribution of solder paste on the PCB pad is uniform. If the printing is uneven, it will cause poor component mounting in some areas, affecting the performance of the entire PCB. After obtaining these detection data, the first average solder joint volume and the first printing uniformity are analyzed using the coefficient of variation principle. The coefficient of variation is a statistic that reflects the degree of discreteness of data. By calculating the coefficient of variation, data of different dimensions are analyzed uniformly to obtain a first printing feedback coefficient that can comprehensively reflect the printing quality. This coefficient can quantitatively evaluate the quality of the current printing result and provide a clear direction and basis for subsequent optimization steps. If the first printing feedback coefficient is high, it means that the printing quality is poor and further optimization is needed; if the coefficient is low, it means that the printing quality is good and the subsequent processes can be continued.

[0023] Step S300: reading the steel mesh feedback coefficient and the solder paste feedback coefficient in sequence, and forming a first solder paste printing characteristic parameter group with the first printing feedback coefficient.

[0024] Specifically, first, the steel mesh feedback coefficient and the solder paste feedback coefficient are read in turn. The steel mesh feedback coefficient is obtained by performing a multi-faceted evaluation of the PCB steel mesh. This evaluation process includes obtaining solder paste printing preparation information, that is, confirming the PCB pads and PCB solder paste of the PCB board to be printed with solder paste, where the PCB pads correspond to specific PCB steel meshes. Multi-dimensional features of the PCB pads are collected to obtain pad feature information, such as pad shape and pad size. Taking these pad feature information as design evaluation constraints, the PCB steel mesh is evaluated for opening design to obtain the steel mesh design index. At the same time, the wear, deformation and contamination of the steel mesh are also considered. After weighted normalization, the steel mesh quality index is obtained. Finally, the average of the steel mesh design index and the steel mesh quality index is recorded as the steel mesh feedback coefficient, which reflects the degree of influence of the PCB steel mesh on solder paste printing in the current state. The solder paste feedback coefficient is obtained by reading the predetermined solder paste indicators and performing characteristic analysis on the PCB solder paste. The predetermined solder paste indicators usually include viscosity and fluidity. The viscosity of the solder paste will affect its adhesion and flow performance on the steel mesh, while the fluidity determines the distribution of the solder paste on the PCB pad. By analyzing these indicators, the solder paste feedback coefficient is obtained, which reflects the quality and applicability of the PCB solder paste. Then, the read steel mesh feedback coefficient, solder paste feedback coefficient and the first printing feedback coefficient are used to form the first solder paste printing characteristic parameter group. This parameter group integrates information from three key aspects of the printing process, namely, printing results, steel mesh status and solder paste characteristics. The first printing feedback coefficient reflects the quality status of the current printing result, the steel mesh feedback coefficient reflects the impact of the steel mesh on printing, and the solder paste feedback coefficient represents the quality and applicability of the solder paste. By forming this parameter group, comprehensive and accurate parameter information is provided for subsequent traversal matching in the PCB board mounting simulation database, so as to more effectively evaluate the PCB component mounting quality under different parameter combinations and provide strong support for finding the optimal printing strategy.

[0025] Step S400: traverse the first solder paste printing characteristic parameter group in the PCB board mounting simulation database to match and obtain a first simulation mounting record, wherein the first simulation mounting record includes a first simulation mounting quality.

[0026] Specifically, after the first solder paste printing characteristic parameter group is formed, it is traversed in the mounting simulation database of the PCB board. The mounting simulation database is established through a large number of experiments and simulations, which contains PCB component mounting records under various parameter combinations. These records cover the combination of different printing strategies, steel mesh states, solder paste characteristics and other aspects, as well as the corresponding simulation mounting results. During the traversal process, the parameters of the first solder paste printing characteristic parameter group and each record in the database are compared one by one to find the closest match. In this way, the simulation mounting record that is most similar to the current actual printing situation is found, that is, the first simulation mounting record. The first simulation mounting record includes the important information of the first simulation mounting quality. This quality index is obtained by simulating and evaluating the mounting of PCB components under the corresponding parameter combination. It comprehensively considers the adhesion of solder paste on the PCB pad, the accuracy of component mounting, the reliability of connection and other factors. By analyzing the first simulation mounting quality, the quality level of the PCB component after mounting is predicted under the current actual printing parameters. If the quality of the first simulated placement is high, it means that the current printing parameter combination is ideal and better quality can be obtained in the actual placement. On the contrary, if the quality of the first simulated placement does not reach the expected placement quality threshold, it means that the current printing parameters need to be optimized and adjusted to improve the final PCB component placement quality.

[0027] Step S500: If the first simulated mounting quality does not reach the mounting quality threshold value, a first optimization instruction is issued, and based on the first optimization instruction, an optimization analysis is performed on the first printing strategy to obtain an optimal printing strategy.

[0028] Specifically, if the first simulated mounting quality fails to reach the preset mounting quality threshold, a first optimization instruction is issued, which starts the optimization analysis process for the first printing strategy. First, an initialization operation is performed to set the initial first printing strategy parameter range, including the pressure range, the speed range, and the solder paste scraper angle range. At the same time, a larger number of iterations and a mounting quality threshold are set, and a fitness function is defined. The specific form is exemplarily expressed as: F(x)=w1 Q1+w2Q2+w3Q3, where: F(x) represents the fitness value under the current parameter combination x. w1, w2, and w3 are the weights of each quality indicator, reflecting the importance of different quality indicators to the overall performance. Q1 represents the quality indicators of the solder joint, such as the volume, shape, and integrity of the solder joint. Q2 represents the printing uniformity of solder paste, that is, the uniformity of solder paste distribution, and Q3 represents the measured value of adhesion. This function is used to evaluate the simulated mounting quality under each printing strategy. It is designed according to actual quality indicators, such as the comprehensive evaluation function of multiple indicators such as solder joint quality and uniformity. The comprehensive evaluation function is used to integrate multiple quality indicators into a single evaluation value for comparison in the optimization process. It integrates different indicators together through weighted average or normalization methods to form a comprehensive score to help determine which combination of parameters is optimal. The comprehensive evaluation function can be exemplarily represented as: ,in is a comprehensive evaluation value. is the number of quality indicators evaluated, It is The measured value of a quality indicator, and are the maximum and minimum values ​​of all quality indicators, respectively, for normalization. Then, the iterative optimization stage is entered, and a set of initial printing strategy parameter combinations are randomly generated, including specific values ​​of pressure, speed and scraper angle. These values ​​are randomly selected within their respective initial ranges, and then the fitness value under this parameter combination is calculated, which is the corresponding simulated placement quality. After that, the iteration begins. In each iteration, a new parameter combination is randomly generated. This new parameter combination can be generated by performing a small-range random perturbation near the current optimal parameter. For example, for the pressure parameter, a new pressure value is obtained by adding a random number in a small range near the current optimal pressure value, and similar operations are performed on the speed and scraper angle. The fitness value of the new parameter combination is calculated. If the fitness value of the new parameter combination is better than the fitness value of the current optimal parameter combination, the optimal parameter combination is updated to the new parameter combination. This iterative process is repeated until the termination condition is met, such as reaching the maximum number of iterations or the current optimal fitness value reaches the quality threshold. Finally, when the algorithm terminates, the optimal printing strategy parameter combination is output. This combination is the optimal printing strategy required, which can make the simulated mounting quality of the PCB reach the optimal or near-optimal state.

[0029] Step S600: obtaining an optimal printing result of the PCB board according to the optimal printing strategy, wherein the optimal printing result is used to optimize the mounting quality of the PCB board.

[0030] Specifically, once the optimal printing strategy is determined through the previous steps, the actual PCB board printing operation is carried out according to this strategy. The optimal printing strategy is obtained after repeated adjustment of various parameters and continuous optimization analysis in the mounting simulation database. It comprehensively considers multiple key factors such as printing pressure, speed, solder paste scraper angle, as well as the state of the PCB steel mesh and the characteristics of the PCB solder paste. When operating according to the optimal printing strategy, it can ensure that the right amount of solder paste is accurately printed on the PCB pad. For example, the appropriate pressure allows the solder paste to be fully attached to the pad without excessive squeezing to cause overflow or unevenness; the appropriate speed ensures the integrity and efficiency of printing; the correct solder paste scraper angle can promote the uniform distribution of solder paste. The optimal printing result of the PCB board obtained in this way means that the solder paste is evenly distributed on the PCB pad, the thickness is moderate, and the shape is regular, which can provide good connection conditions for the components. Such an optimal printing result can greatly optimize the mounting quality of the PCB board. During the component mounting process, due to the good state of the solder paste, the components can be more accurately positioned on the pad, and the reliability and stability of welding will also be greatly improved. The probability of component placement misalignment, cold soldering, short circuit and other problems caused by poor printing is reduced, thereby improving the quality and performance of the entire PCB board. Ultimately, the produced PCB products can play a better role in electronic equipment, improving the reliability and service life of the equipment.

[0031] In a possible implementation, step S300 further includes:

[0032] Step S310: Determine whether the steel mesh feedback coefficient and / or the solder paste feedback coefficient is within a feedback coefficient threshold.

[0033] Step S320: If yes, issue a build instruction, and build the first solder paste printing characteristic parameter group based on the build instruction and the first printing feedback coefficient.

[0034] Step S330: If not, issue an optimization instruction, and optimize and adjust the PCB steel mesh and / or the PCB solder paste based on the optimization instruction.

[0035] Specifically, determine whether the stencil feedback coefficient and / or solder paste feedback coefficient are within the feedback coefficient threshold. This threshold is determined based on experience and a large amount of experimental data, and it represents the parameter range that the stencil and solder paste should meet under normal working conditions. If the stencil feedback coefficient and solder paste feedback coefficient are both within this range, it means that the stencil and solder paste are in relatively good condition, which can provide a relatively stable foundation for subsequent printing and placement.

[0036] If the result of the judgment is within the threshold, a build instruction will be issued. The purpose of this instruction is to combine the steel mesh feedback coefficient, solder paste feedback coefficient and the first printing feedback coefficient to form the first solder paste printing characteristic parameter group. Because the state of the steel mesh and solder paste is considered to be appropriate at this time, these parameters are combined to prepare for the subsequent traversal matching in the placement simulation database. By forming this parameter group, the quality of PCB component placement is more comprehensively evaluated by comprehensively considering multiple aspects of information such as printing results, steel mesh status and solder paste characteristics.

[0037] However, the result of the judgment is that it is not within the threshold value, and an optimization instruction is issued. This means that there is a problem with the state of the steel mesh and / or solder paste, which will affect the quality of printing and mounting. Based on this optimization instruction, the PCB steel mesh and / or PCB solder paste are optimized and adjusted. For the PCB steel mesh, it is necessary to check whether its opening design is reasonable and whether there are problems such as wear, deformation or contamination. If the opening design is unreasonable, re-evaluate and adjust it according to the pad feature information; if there are problems such as wear, deformation or contamination, it is necessary to clean, repair or replace it. For PCB solder paste, it is necessary to check whether its viscosity and fluidity meet the requirements. If the viscosity is too high or too low, improve its performance by adjusting the composition or temperature of the solder paste; if the fluidity is not good, replace it with a more suitable solder paste brand or model. By optimizing and adjusting the steel mesh and solder paste, their parameters are returned to the threshold range, providing better conditions for subsequent printing and mounting.

[0038] In a possible implementation, step S300 further includes:

[0039] Step S340: obtaining solder paste printing preparation information, wherein the solder paste printing preparation information refers to a PCB pad and a PCB solder paste for solder paste printing on the PCB board, wherein the PCB pad corresponds to a PCB steel mesh.

[0040] Step S350: Collect multi-dimensional features of the PCB pad to obtain pad feature information.

[0041] Step S360: using the pad feature information as a design evaluation constraint, performing an opening design evaluation on the PCB steel mesh to obtain a steel mesh design index.

[0042] Step S370: combining the stencil design index with the stencil characteristic information of the PCB stencil to obtain the stencil feedback coefficient.

[0043] Specifically, obtaining solder paste printing preparation information covers two key elements necessary for solder paste printing on PCB boards, namely PCB pads and PCB solder paste. PCB pads are specific areas on PCB boards used to connect electronic components, and their shape, size, and layout are crucial for accurate component placement. PCB solder paste is a key material that connects and fixes components during the printing process. It is worth noting that the PCB pads mentioned here correspond to specific PCB steel meshes. PCB steel meshes play an important role in solder paste printing. The openings on them correspond to the position and shape of the PCB pads, ensuring that the solder paste can be accurately printed on the PCB pads. Obtaining these solder paste printing preparation information provides basic data and objects for subsequent quality optimization steps, and can conduct targeted analysis and evaluation on specific PCB pads and PCB solder pastes, thereby continuously optimizing the placement quality of PCB components.

[0044] Multi-dimensional feature collection is performed on PCB pads to analyze and extract key information of pads from multiple different angles. First, the shape of the pad is an important feature. Pads present various geometric shapes, such as round, square, rectangular, etc. Pads of different shapes will have different performances in terms of solder paste adhesion, component positioning, and soldering reliability. Secondly, the size of the pad is also a crucial feature. The size of the pad includes parameters such as length, width, and area. The size directly determines the amount of solder paste required and the range of component sizes that can be accommodated. Larger pads require more solder paste to ensure a good connection, while smaller pads require more precise printing control to avoid solder paste overflow or insufficient. By collecting these multi-dimensional features of PCB pads, comprehensive and accurate pad feature information is obtained. This information will serve as an important basis for subsequent evaluation and optimization processes, helping to determine appropriate printing strategies, steel mesh designs, and solder paste characteristics, thereby improving the quality and reliability of PCB component placement.

[0045] The collected pad feature information is used as the constraint condition for design evaluation. The pad feature information includes multi-dimensional data such as the shape and size of the pad. These data provide clear requirements and restrictions for the opening design of the PCB steel mesh. For example, if the pad is circular, the opening shape of the steel mesh should also be close to circular to ensure that the solder paste can be accurately printed on the pad and evenly distributed. If the pad size is small, the size of the steel mesh opening also needs to be adjusted accordingly to avoid too much or too little solder paste. Next, the PCB steel mesh is evaluated for opening design. This evaluation process comprehensively considers multiple factors between the pad feature information and the steel mesh opening. For example, the matching degree between the pad shape and the steel mesh opening shape is evaluated. If the shape matching degree is high, the solder paste can be transferred from the steel mesh opening to the pad more smoothly during the printing process, reducing the occurrence of printing defects. At the same time, the matching degree between the pad size and the steel mesh opening size is also evaluated to ensure that the amount of solder paste can meet the connection requirements of the pad, neither too much to cause overflow nor too little to affect the reliability of the connection. Through comprehensive analysis of these factors, the stencil design index is obtained. This index is a quantitative indicator that reflects the performance of the PCB stencil opening design in meeting the pad feature requirements. The higher the stencil design index, the better the match between the stencil opening design and the pad, and the more conducive to improving the quality of PCB component placement. On the contrary, if the stencil design index is low, the stencil opening design needs to be adjusted and optimized to meet the pad feature requirements, thereby improving the printing quality and subsequent placement quality.

[0046] At the same time, the steel mesh characteristic information of the PCB steel mesh is considered, including the wear, deformation and contamination of the steel mesh. The wear of the steel mesh will affect the flow and transfer of solder paste on the steel mesh. Severely worn steel meshes will cause uneven distribution of solder paste; the deformation of the steel mesh will cause the opening position to shift, affecting the accuracy of printing; the contamination of the steel mesh will hinder the smooth passage of solder paste and reduce the printing quality. The steel mesh design index is combined with these steel mesh characteristic information, and through weighted normalization, the importance of each factor is comprehensively considered, and reasonable weights are allocated to different indicators. Finally, the steel mesh feedback coefficient is obtained. This coefficient comprehensively reflects the influence of the PCB steel mesh on solder paste printing and subsequent component mounting quality under the design and actual use conditions.

[0047] In a possible implementation, step S360 further includes:

[0048] Step S361: The pad feature information includes pad shape and pad size.

[0049] Step S362: The steel mesh characteristic information includes the steel mesh opening shape and the steel mesh opening size.

[0050] Step S363: According to the design evaluation constraints, respectively obtain the shape matching degree between the pad shape and the steel mesh opening shape, and the size matching degree between the pad size and the steel mesh opening size.

[0051] Step S364: The shape matching degree and the size matching degree after weighted normalization processing are used to obtain the steel mesh design index.

[0052] Specifically, the pad feature information includes pad shape and pad size. The different pad shapes will affect the distribution and flow of solder paste on them, while the pad size directly determines the amount of solder paste required and the connection area between the component and the pad.

[0053] The steel mesh characteristic information includes the steel mesh opening shape and steel mesh opening size. The design of the steel mesh opening shape and size needs to match the pad to ensure that the solder paste can be accurately transferred to the pad through the steel mesh.

[0054] According to the design evaluation constraints, the pad shape and the steel mesh opening shape, as well as the pad size and the steel mesh opening size, are analyzed in depth to obtain the corresponding matching degree. For the shape matching degree between the pad shape and the steel mesh opening shape, the specific shape of the pad, such as round, square, rectangular, etc., is compared with the shape of the steel mesh opening. If the pad is round and the steel mesh opening is also close to round, and the detailed features of the shape are relatively consistent, then the shape matching degree will be high. If the shapes of the two are very different, for example, the pad is square and the steel mesh opening is irregular, then the shape matching degree will be low. Similarly, for the size matching degree between the pad size and the steel mesh opening size, the dimensional parameters such as the length, width, and diameter of the pad are accurately measured and compared with the corresponding size of the steel mesh opening. If the steel mesh opening size can adapt well to the pad size, it is neither too large to cause solder paste waste nor too small to affect the full coverage of solder paste, then the size matching degree will be high. Through such analysis, the matching degree of the pad and the steel mesh in shape and size is quantitatively determined.

[0055] The shape matching and size matching are weighted and normalized, and different weights are assigned according to the relative importance of shape and size in stencil design. For example, if the accuracy of the shape has a greater impact on the subsequent component placement quality, the shape matching will be assigned a higher weight. After weighting, the two matching degrees are normalized so that their values ​​fall within a specific range for better comprehensive evaluation. Finally, the stencil design index is obtained through this processing method. This index comprehensively reflects the matching degree between the pad shape and the stencil opening shape, and the matching degree between the pad size and the stencil opening size, and is used to measure the rationality and effectiveness of the stencil design. The higher the stencil design index, the better the stencil matches the pad in terms of shape and size, and the more conducive it is to improving the quality and reliability of PCB component placement. On the contrary, if the stencil design index is low, the stencil design needs to be adjusted and optimized to ensure that the solder paste can be accurately transferred to the pad, so as to achieve high-quality component placement.

[0056] In a possible implementation, step S370 further includes:

[0057] Step S371: The steel mesh characteristic information also includes steel mesh wear, steel mesh deformation and steel mesh contamination.

[0058] Step S372: Obtain a steel mesh quality index by weighted normalization of the steel mesh wear degree, the steel mesh deformation degree and the steel mesh contamination degree.

[0059] Step S373: Record the average of the steel mesh design index and the steel mesh quality index as the steel mesh feedback coefficient.

[0060] Specifically, in addition to the previously considered factors related to pad matching, the stencil feature information also includes stencil wear, stencil deformation, and stencil contamination. Stencils will inevitably wear out during use. As the number of prints increases, the surface of the stencil will become rough, affecting the flow and transfer of solder paste. Stencil deformation is caused by external forces or long-term use. Once the stencil is deformed, its opening position and size will change, resulting in inaccurate printing. Stencil contamination comes from the accumulation of impurities such as solder paste residue and dust. Severely contaminated stencils will hinder the smooth passage of solder paste and reduce printing quality.

[0061] The steel mesh wear, steel mesh deformation and steel mesh contamination are weighted and normalized to obtain the steel mesh quality index. Weighted normalization is a method that comprehensively considers multiple factors and converts them into a unified standard. Different weights are assigned to different features to make a reasonable evaluation based on their impact on printing quality. For example, if the steel mesh wear has a greater impact on printing quality, a higher weight can be given when calculating the steel mesh quality index. After weighted normalization, the obtained steel mesh quality index can more accurately reflect the impact of the actual use status of the steel mesh on printing quality.

[0062] The average of the stencil design index and the stencil quality index is recorded as the stencil feedback coefficient. The stencil design index mainly reflects the degree of matching between the stencil and the pad at the design level, while the stencil quality index reflects the status of the stencil in actual use. By taking the average of the two and comprehensively considering the design and actual use of the stencil, a more comprehensive stencil feedback coefficient is obtained. This coefficient is used as an important indicator to evaluate the impact of the stencil on the quality of PCB component placement and provide a basis for subsequent optimization decisions. For example, if the stencil feedback coefficient is low, it means that there are problems with the design or use of the stencil, and the stencil needs to be adjusted or replaced to improve the printing quality and component placement quality.

[0063] In a possible implementation, step S300 further includes:

[0064] Step S380: Reading a predetermined solder paste index, and performing a characteristic analysis on the PCB solder paste based on the predetermined solder paste index to obtain the solder paste feedback coefficient.

[0065] Step S390: wherein the predetermined solder paste indicators include viscosity and fluidity.

[0066] Specifically, the predetermined solder paste indicators should be read first, among which the key indicators are viscosity and fluidity. These indicator data are obtained through professional measuring equipment, such as using a viscometer to accurately measure the viscosity of the solder paste, and using a specific experimental device to simulate the external force in the actual printing process to evaluate the fluidity of the solder paste. At the same time, refer to the technical specifications of the solder paste to obtain the relevant parameter information provided by the manufacturer. For viscosity analysis, solder pastes of different viscosities are placed under the same printing conditions for testing. High-viscosity solder pastes require greater pressure to be squeezed out on the PCB steel mesh and are prone to residue, while low-viscosity solder pastes flow excessively and increase the risk of short circuits. Through multiple experimental comparisons, the viscosity range suitable for specific PCB pads and printing requirements is determined. In terms of fluidity analysis, the actual printing process is simulated, such as using a printer scraper to apply pressure and observe the filling of solder paste on the PCB pad. Solder pastes with good fluidity can smoothly fill all parts of the pad and reduce voids and unfilled areas; solder pastes with poor fluidity are prone to uneven filling. By changing parameters such as printing speed and pressure, the impact of solder paste fluidity on printing quality is observed, and the appropriate fluidity range is determined. Finally, the analysis results of viscosity and fluidity are comprehensively considered. Different weights are assigned to viscosity and fluidity according to their importance to printing quality and component placement quality, and the solder paste feedback coefficient is calculated using the weighted average method. For example, if fluidity has a greater impact on quality, a higher weight is given to fluidity. In this way, a solder paste feedback coefficient that can comprehensively reflect the performance and applicability of the solder paste is obtained.

[0067] In a possible implementation, step S200 further includes:

[0068] Step S210: The printing detection equipment includes a solder joint volume probe and a printability probe.

[0069] Step S220: Detecting and obtaining multiple volumes corresponding to multiple solder joints in the first printing result through the solder joint volume probe, and calculating and obtaining a first average solder joint volume.

[0070] Step S230: obtaining a first printing uniformity of the first printing result through the printability probe.

[0071] Step S240: analyzing the first average solder joint volume and the first printing uniformity using the coefficient of variation principle to obtain the first printing feedback coefficient.

[0072] Specifically, the printing inspection equipment includes a solder joint volume probe and a printability probe. The solder joint volume probe is mainly responsible for detecting the volumes corresponding to multiple solder joints in the first printing result. During the PCB printing process, the volume of the solder joint directly affects the quality and reliability of subsequent component mounting. Through the precise detection of the solder joint volume probe, the volume data of each solder joint can be accurately obtained to provide specific quantitative indicators for subsequent analysis and optimization. The printability probe focuses on evaluating the printing uniformity of the first printing result. Printing uniformity is one of the important criteria for measuring PCB printing quality. It is related to whether the solder paste is evenly distributed on the PCB pad, which in turn affects the connection stability and electrical performance after component mounting. The printability probe can comprehensively evaluate the printing results to ensure that the printing quality meets the requirements.

[0073] The solder joint volume probe in the printing detection equipment is used to detect multiple solder joints in the first printing result. This probe can accurately measure the volume corresponding to each solder joint. Since there are usually multiple solder joints on the PCB board, the volume data corresponding to multiple different solder joints are obtained by detecting them one by one with the solder joint volume probe. These data reflect the accumulation of solder paste at each solder joint. Then, these multiple volume data are calculated, and the first average solder joint volume is obtained by averaging. This average volume value, as an overall indicator, comprehensively reflects the overall level of the solder joint volume in the first printing result, and provides an important reference for the subsequent evaluation of printing quality and optimization and adjustment.

[0074] As a professional testing tool, the printability probe can conduct a detailed analysis of the first printing results on the PCB board, and determine the uniformity of printing by detecting the distribution of solder paste on the PCB pads. If the distribution of solder paste on each pad is uniform, the uniformity of the first printing is high; conversely, if the solder paste accumulates too much in some areas and too little in other areas, the uniformity of the first printing will be reduced. This first printing uniformity is crucial for subsequent component placement, because uneven printing will affect the connection quality between components and pads, which may cause problems such as cold solder joints and short circuits.

[0075] The coefficient of variation is a statistic used to measure the degree of data dispersion. In this step, the first average solder joint volume and the first printing uniformity are analyzed using the principle of coefficient of variation, aiming to comprehensively evaluate the first printing result of the PCB board. For the first average solder joint volume, it reflects the overall level of solder joint volume. By calculating the coefficient of variation of the solder joint volume, the degree of difference in volume between different solder joints can be understood. If the coefficient of variation is small, it means that the volume of each solder joint is relatively close, and the consistency of the solder joint volume is high, which helps to ensure that the components can be in good contact with the pad during welding and improve the reliability of welding. On the contrary, if the coefficient of variation is large, it means that the difference in solder joint volume is large, which will lead to poor welding quality of some solder joints and affect the performance of the entire PCB board. The first printing uniformity reflects the uniformity of the distribution of solder paste on the PCB board. Similarly, by calculating its coefficient of variation, the stability of solder paste distribution is judged. A smaller coefficient of variation means that the solder paste distribution is more uniform, which can ensure that the components can get the right amount of solder paste at each position, thereby improving the quality and consistency of welding. A larger coefficient of variation means that the printing uniformity is poor, and there will be too much or too little solder paste in some areas, which will increase the risk of welding defects. The coefficients of variation of the first average solder joint volume and the first printing uniformity are comprehensively considered, and in-depth analysis is performed. Different weights are assigned to these two indicators according to the actual situation to reflect their relative importance in evaluating the printing results. To fuse the two coefficients of variation, the weights must first be determined. According to the actual situation, such as experimental data or an assessment of the importance of solder joint volume and printing uniformity in the overall printing quality, the proportion of each of the two coefficients of variation is determined. For example, if it is believed that the consistency of solder joint volume has a greater impact on the final quality and the proportion is set at 60%, then the corresponding proportion of the impact of printing uniformity is 40%. In this way, the weight of the coefficient of variation of solder joint volume is determined to be 0.6, and the weight of the coefficient of variation of printing uniformity is determined to be 0.4. Then the operation of standardizing the coefficient of variation is performed. For the coefficient of variation of solder joint volume and the coefficient of variation of printing uniformity, standardization is required to facilitate the subsequent fusion calculation. Assume that the existing coefficient of variation of solder joint volume is "CV (volume)" and the coefficient of variation of printing uniformity is "CV (uniformity)". The standardized solder joint volume coefficient of variation is obtained by subtracting the minimum value of the coefficient of variation from the current solder joint volume coefficient of variation, and then dividing it by the difference between the maximum and minimum values ​​of the coefficient of variation. Similarly, the standardized printing uniformity coefficient of variation is calculated in the same way. The maximum and minimum values ​​here can be obtained by analyzing a batch of sample data, or a reasonable range can be set based on past experience. Finally, the fusion calculation is performed.The first printing feedback coefficient = the weight of the solder joint volume variation coefficient × the standardized solder joint volume variation coefficient + the weight of the printing uniformity variation coefficient × the standardized printing uniformity variation coefficient. Through such a series of operations, the solder joint volume variation coefficient and the printing uniformity variation coefficient are integrated to obtain a first printing feedback coefficient that can comprehensively reflect the quality of the first printing result. This coefficient can be used as a clear quantitative indicator for subsequent printing process adjustment and quality optimization, helping to improve the quality of PCB component placement.

[0076] In a possible implementation, step S100 further includes:

[0077] Step S110: The first printing strategy refers to a printing scheme composed of parameters corresponding to predetermined printing indicators, and the predetermined printing indicators at least include pressure, speed and solder paste scraper angle.

[0078] Specifically, the first printing strategy is a printing scheme composed of parameters corresponding to predetermined printing indicators, and the predetermined printing indicators include at least pressure, speed and solder paste scraper angle. Pressure plays a key role in the printing process. Appropriate pressure can ensure that the solder paste can be smoothly transferred from the steel mesh to the PCB pad. If the pressure is too high, the steel mesh will be deformed, affecting the accuracy of printing; if the pressure is too low, the solder paste cannot fully fill the pad, affecting the welding quality. Speed ​​is also an important indicator. The speed of printing will directly affect the production efficiency and printing quality. Too fast speed will cause the solder paste to not be evenly distributed on the pad in time, resulting in uneven printing; too slow speed will reduce production efficiency and increase production costs. The solder paste scraper angle also has an important impact on the printing quality. Different scraper angles will affect the flow and distribution of solder paste on the steel mesh. The appropriate scraper angle can make the solder paste better fill the pad and reduce the appearance of voids and unfilled areas. By setting reasonable parameters for these predetermined printing indicators, an effective first printing strategy is formed. This strategy will provide clear guidance for the printing process of PCB components, ensure the stability and reliability of printing quality, and thus improve the quality and efficiency of the entire PCB component mounting.

[0079] Embodiment 2, based on the same inventive concept as the PCB component mounting quality optimization method in the previous embodiment, Figure 2 As shown, the present application provides a PCB component mounting quality optimization system, and the embodiments of the present application and the method embodiments are based on the same inventive concept. The system includes:

[0080] The printing result acquisition module 10 is used to print the PCB pads by distributing the PCB steel mesh coated with PCB solder paste under a first printing strategy to obtain a first printing result.

[0081] The printing feedback coefficient acquisition module 20 is used to activate the printing detection device to detect and analyze the first printing result to obtain a first printing feedback coefficient.

[0082] The solder paste printing characteristic parameter group forming module 30 is used to read the steel mesh feedback coefficient and the solder paste feedback coefficient in sequence, and form a first solder paste printing characteristic parameter group with the first printing feedback coefficient.

[0083] The simulation mounting record matching module 40 is used to simulate the mounting record, traverse the first solder paste printing feature parameter group in the mounting simulation database of the PCB board, and match to obtain the first simulation mounting record, wherein the first simulation mounting record includes the first simulation mounting quality.

[0084] The optimal printing strategy acquisition module 50 is used to issue a first optimization instruction if the first simulated mounting quality does not reach the mounting quality threshold value, and perform optimization analysis on the first printing strategy based on the first optimization instruction to obtain the optimal printing strategy.

[0085] The optimal printing result acquisition module 60 is used to acquire the optimal printing result of the PCB board according to the optimal printing strategy, wherein the optimal printing result is used to optimize the mounting quality of the PCB board.

[0086] Furthermore, the solder paste printing characteristic parameter group building module 30 also includes:

[0087] The feedback coefficient threshold value judgment unit is used to judge whether the steel mesh feedback coefficient and / or the solder paste feedback coefficient is within the feedback coefficient threshold value.

[0088] The assembly instruction issuing unit is used to issue an assembly instruction if it is in the state, and to assemble the first solder paste printing characteristic parameter group based on the assembly instruction and the first printing feedback coefficient.

[0089] An optimization instruction issuing unit, wherein the optimization instruction issuing unit is used to issue an optimization instruction if it is not in the state, and optimize and adjust the PCB steel mesh and / or the PCB solder paste based on the optimization instruction.

[0090] Furthermore, the solder paste printing characteristic parameter group building module 30 also includes:

[0091] A solder paste printing preparation information acquisition unit, the solder paste printing preparation information acquisition unit is used to acquire solder paste printing preparation information, the solder paste printing preparation information refers to a PCB pad and a PCB solder paste for solder paste printing on the PCB board, wherein the PCB pad corresponds to a PCB steel mesh.

[0092] A pad feature information acquisition unit, wherein the pad feature information acquisition unit is used to collect multi-dimensional features of the PCB pad to obtain pad feature information.

[0093] The steel mesh design index acquisition unit is used to perform an opening design evaluation on the PCB steel mesh using the pad feature information as a design evaluation constraint to obtain a steel mesh design index.

[0094] A steel mesh feedback coefficient acquisition unit is used to combine the steel mesh design index and the steel mesh characteristic information of the PCB steel mesh to obtain the steel mesh feedback coefficient.

[0095] Furthermore, the steel mesh design index acquisition unit also includes:

[0096] The pad feature information includes pad shape and pad size.

[0097] The steel mesh characteristic information includes the steel mesh opening shape and the steel mesh opening size.

[0098] According to the design evaluation constraints, the shape matching degree between the pad shape and the steel mesh opening shape, and the size matching degree between the pad size and the steel mesh opening size are respectively obtained.

[0099] The shape matching degree and the size matching degree after weighted normalization processing obtain the steel mesh design index.

[0100] Furthermore, the steel mesh feedback coefficient acquisition unit also includes:

[0101] The steel mesh characteristic information also includes steel mesh wear, steel mesh deformation and steel mesh contamination.

[0102] The steel mesh quality index acquisition unit is used to perform weighted normalization on the steel mesh wear degree, the steel mesh deformation degree and the steel mesh contamination degree to obtain the steel mesh quality index.

[0103] A steel mesh feedback coefficient calculation unit, wherein the steel mesh feedback coefficient calculation unit is used to record the average of the steel mesh design index and the steel mesh quality index as the steel mesh feedback coefficient.

[0104] Furthermore, the solder paste printing characteristic parameter group building module 30 also includes:

[0105] A predetermined solder paste index reading unit is used to read a predetermined solder paste index, and perform a feature analysis on the PCB solder paste based on the predetermined solder paste index to obtain the solder paste feedback coefficient.

[0106] Wherein, the predetermined solder paste indicators include viscosity and fluidity.

[0107] Furthermore, the printing feedback coefficient acquisition module 20 also includes:

[0108] The printing detection equipment includes a solder joint volume probe and a printability probe.

[0109] The first average solder joint volume calculation unit is used to detect and obtain multiple volumes corresponding to multiple solder joints in the first printing result through the solder joint volume probe, and calculate and obtain the first average solder joint volume.

[0110] A first printing uniformity acquisition unit is used to obtain a first printing uniformity of the first printing result through the printability probe.

[0111] A printing uniformity analysis unit, wherein the printing uniformity analysis unit is used to analyze the first average solder joint volume and the first printing uniformity by using a coefficient of variation principle to obtain the first printing feedback coefficient.

[0112] Furthermore, the printing result acquisition module 10 further includes:

[0113] The first printing strategy refers to a printing scheme composed of parameters corresponding to predetermined printing indicators, and the predetermined printing indicators at least include pressure, speed and solder paste scraper angle.

[0114] It should be noted that the above-mentioned sequence of the embodiments of the present application is only for description and does not represent the advantages and disadvantages of the embodiments. And the above-mentioned specific embodiments of this specification are described. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0115] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

[0116] This specification and the drawings are merely exemplary illustrations of the present application and are deemed to cover any and all modifications, variations, combinations or equivalents within the scope of the present application. Obviously, a person skilled in the art may make various modifications and variations to the present application without departing from the scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the present application and its equivalents, the present application intends to include these modifications and variations.

Claims

1. A method for optimizing the quality of PCB component placement, characterized in that: include: Under the first printing strategy, the PCB pad is printed by spreading a PCB steel mesh coated with PCB solder paste to obtain a first printing result; activating a printing detection device to detect and analyze the first printing result to obtain a first printing feedback coefficient; Reading the steel mesh feedback coefficient and the solder paste feedback coefficient in sequence, and forming a first solder paste printing characteristic parameter group with the first printing feedback coefficient; Traversing the first solder paste printing characteristic parameter group in a PCB board mounting simulation database to obtain a first simulation mounting record by matching, wherein the first simulation mounting record includes a first simulation mounting quality; If the first simulated placement quality does not reach the placement quality threshold value, a first optimization instruction is issued, and based on the first optimization instruction, an optimization analysis is performed on the first printing strategy to obtain an optimal printing strategy; Obtaining an optimal printing result of the PCB board according to the optimal printing strategy, wherein the optimal printing result is used to optimize the mounting quality of the PCB board; Also includes: Obtain solder paste printing preparation information, wherein the solder paste printing preparation information refers to a PCB pad and a PCB solder paste for solder paste printing on the PCB board, wherein the PCB pad corresponds to a specific PCB steel mesh, and the opening on the PCB steel mesh corresponds to the position and shape of the PCB pad, ensuring that the solder paste can be accurately printed on the PCB pad; Collect multi-dimensional features of the PCB pad to obtain pad feature information; Taking the pad feature information as a design evaluation constraint, performing an opening design evaluation on the PCB steel mesh to obtain a steel mesh design index; Combining the stencil design index with the stencil characteristic information of the PCB stencil to obtain the stencil feedback coefficient; The steel mesh characteristic information also includes steel mesh wear, steel mesh deformation and steel mesh contamination; The steel mesh wear degree, the steel mesh deformation degree and the steel mesh contamination degree are weighted and normalized to obtain a steel mesh quality index; The average of the steel mesh design index and the steel mesh quality index is recorded as the steel mesh feedback coefficient; Reading a predetermined solder paste index, and performing a feature analysis on the PCB solder paste based on the predetermined solder paste index to obtain the solder paste feedback coefficient; Wherein, the predetermined solder paste index includes viscosity and fluidity; The printing detection equipment includes a solder joint volume probe and a printability probe; Detecting with the solder joint volume probe to obtain a plurality of volumes corresponding to a plurality of solder joints in the first printing result, and calculating a first average solder joint volume; Obtaining a first printing uniformity of the first printing result by using the printability probe; The first average solder joint volume and the first printing uniformity are analyzed using the coefficient of variation principle to obtain the first printing feedback coefficient.

2. The PCB component mounting quality optimization method according to claim 1, characterized in that: Before forming the first solder paste printing characteristic parameter group, it also includes: Determining whether the stencil feedback coefficient and / or the solder paste feedback coefficient is within a feedback coefficient threshold range; If yes, issuing a build instruction, and building the first solder paste printing characteristic parameter group based on the build instruction and the first printing feedback coefficient; If not, an optimization instruction is issued, and the PCB steel mesh and / or the PCB solder paste are optimized and adjusted based on the optimization instruction.

3. The PCB component mounting quality optimization method according to claim 1, characterized in that: include: The pad feature information includes pad shape and pad size; The steel mesh characteristic information includes the steel mesh opening shape and steel mesh opening size; According to the design evaluation constraints, respectively obtaining a shape matching degree between the pad shape and the steel mesh opening shape, and a size matching degree between the pad size and the steel mesh opening size; The shape matching degree and the size matching degree after weighted normalization processing obtain the steel mesh design index.

4. The PCB component mounting quality optimization method according to claim 1, characterized in that: The first printing strategy refers to a printing scheme composed of parameters corresponding to predetermined printing indicators, and the predetermined printing indicators at least include pressure, speed and solder paste scraper angle.

5. PCB component placement quality optimization system, characterized by: The method for optimizing the quality of PCB component mounting according to any one of claims 1 to 4 comprises: A printing result acquisition module, wherein the printing result acquisition module is used to print a PCB pad by distributing a PCB steel mesh coated with PCB solder paste under a first printing strategy to obtain a first printing result; A printing feedback coefficient acquisition module, the printing feedback coefficient acquisition module is used to activate the printing detection device to detect and analyze the first printing result to obtain a first printing feedback coefficient; A solder paste printing characteristic parameter group forming module, the solder paste printing characteristic parameter group forming module is used to read the steel mesh feedback coefficient and the solder paste feedback coefficient in sequence, and form a first solder paste printing characteristic parameter group with the first printing feedback coefficient; A simulation mounting record matching module, wherein the simulation mounting record matching module is used to traverse the first solder paste printing characteristic parameter group in the mounting simulation database of the PCB board, and match to obtain a first simulation mounting record, wherein the first simulation mounting record includes a first simulation mounting quality; An optimal printing strategy acquisition module, wherein the optimal printing strategy acquisition module is used to issue a first optimization instruction if the first simulated mounting quality does not reach the mounting quality threshold value, and perform optimization analysis on the first printing strategy based on the first optimization instruction to obtain an optimal printing strategy; An optimal printing result acquisition module is used to obtain the optimal printing result of the PCB board according to the optimal printing strategy, wherein the optimal printing result is used to optimize the mounting quality of the PCB board.

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