High pressure furnace tube annealing equipment

Abstract

The present invention provides a high-pressure furnace tube annealing device, comprising a shell, a heater and a quartz tube; the quartz tube is arranged in the shell, a quartz boat is arranged in the quartz tube, and the quartz boat is used to carry wafers; the heater is located in the shell and is covered on the quartz tube, and is used to heat the wafers in the quartz tube, and a first cooling channel is provided on the heater, and the first cooling channel is used to reduce the temperature in the quartz tube. The high-pressure furnace tube annealing device provided by the present invention ensures the annealing efficiency of the high-pressure furnace tube annealing device, improves the production capacity, and realizes rapid annealing to improve the performance of the chip.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing equipment, and in particular to a high-pressure furnace tube annealing equipment. Background Art

[0002] In the process of semiconductor wafer manufacturing, many wafer interfaces need to be annealed to reduce interface characteristics and improve performance, such as the interface between the metal gate and dielectric layer of the transistor, the interface between the dielectric layer and the silicon layer, and the metal pad (Alpad or Cu pad) interface. Annealing in a specific atmosphere can reduce the trap effect of the interface and improve the mobility of electrons or holes. In addition, the use of high-voltage annealing equipment can significantly improve the interface characteristics compared to normal-pressure annealing equipment, especially annealing at low temperatures can greatly enhance the performance of the chip.

[0003] The existing high-pressure annealing equipment has a quartz tube in a shell that can withstand high pressure. Inside the quartz tube is a quartz boat containing wafers. Outside the quartz tube is a heater, and the furnace door is set at the bottom of the shell. When performing the high-pressure annealing process, gas is injected according to the process requirements. As the gas enters the cavity, the pressure increases. The heater is also heated to the required temperature according to the set temperature, and then the corresponding process time is maintained. Finally, the temperature and pressure are reduced until the temperature and pressure in the shell reach room temperature and atmospheric pressure. Since the heater completely wraps the quartz tube in the shell, and the quartz tube is fully loaded with wafers, the cooling speed is very slow, which affects the production capacity and the annealing effect. Summary of the invention

[0004] The object of the present invention is to provide a high-pressure furnace tube annealing device, which can quickly cool down the wafers in the quartz tube, thereby improving the production capacity and the annealing effect.

[0005] To achieve the above-mentioned object, in a first aspect, the present invention provides a high-pressure furnace tube annealing device, comprising a shell, a heater and a quartz tube;

[0006] The quartz tube is arranged in the shell, and a quartz boat is arranged in the quartz tube, and the quartz boat is used to carry the wafer;

[0007] The heater is located in the shell and covers the quartz tube for heating the wafer in the quartz tube. The heater is provided with a first cooling channel for reducing the temperature in the quartz tube.

[0008] The high-pressure furnace tube annealing equipment provided by the present invention has the beneficial effect that a first cooling channel is provided on the heater to quickly cool the wafer in the quartz tube, thereby ensuring the annealing efficiency of the high-pressure furnace tube annealing equipment, improving the production capacity, and realizing rapid annealing to improve the performance of the chip.

[0009] In some embodiments, the heater has a heating tank, the quartz tube is arranged in the heating tank, and the heater is also provided with an input channel and a plurality of air outlets;

[0010] The input channel is opened on the outer wall of the heater and communicates with the first cooling channel, and the input channel is used to communicate with the intake pipe;

[0011] A plurality of the outlet holes are arranged at intervals on the inner side wall of the heating tank and are all connected to the first cooling channel to discharge the cooling gas toward the quartz tube. The beneficial effect is that the air inlet pipe can receive the cooling gas, and the cooling gas is discharged toward the quartz tube through the input channel, the first cooling channel and the outlet holes, thereby quickly reducing the temperature in the quartz tube.

[0012] In some embodiments, the inner wall of the air outlet is spirally arranged. The beneficial effect is that by spirally arranging the inner wall of the air outlet, the cooling gas is rotated to generate vortex when discharged into the heating tank, thereby increasing the gas cooling effect.

[0013] In some embodiments, the axis of the gas outlet is tilted toward the top of the heater. The beneficial effect is that by tilting the axis of the gas outlet toward the top of the heater, the cooling gas discharged into the heating tank can rotate to ensure that the surrounding of the quartz boat can be evenly cooled, and the flow rate of the gas is increased to further improve the efficiency of cooling the wafer in the quartz tube, thereby ensuring the annealing effect.

[0014] In some embodiments, the housing is provided with a first mounting hole corresponding to the input channel, and the first mounting hole connects the interior of the housing with the exterior of the housing;

[0015] The air intake pipe is passed through the first mounting hole and is sealed and connected to the housing. One end of the air intake pipe is connected to the input channel, and the other end is used to connect to a cooling device. The beneficial effect is that the other end of the air intake pipe is connected to the cooling device, and the cooling device is used to provide cooling gas. The cooling gas is discharged to the input channel through the air intake pipe, and then discharged to the quartz tube through the first cooling channel and the air outlet hole to cool the wafer in the quartz tube.

[0016] In some embodiments, the high pressure furnace tube annealing equipment further comprises a gas outlet pipe;

[0017] A through hole is also provided on the top of the heater, and the through hole is connected to the heating tank;

[0018] The shell is further provided with a second mounting hole, and the second mounting hole connects the inside of the shell with the outside of the shell;

[0019] The outlet pipe is passed through the second mounting hole and is sealed with the shell. One end of the outlet pipe is connected with the through hole. The outlet pipe is used to discharge the gas in the shell. The beneficial effect is that a through hole is provided on the top of the heater, the outlet pipe is connected with the through hole, and extends to the outside of the shell through the second mounting hole. After the cooling gas cools the quartz tube, it is discharged from the heating tank through the outlet pipe to ensure that the cooling gas can be continuously discharged into the heating tank to cool the wafer in the quartz tube.

[0020] In some embodiments, the high pressure furnace tube annealing equipment further comprises a heat exchanger and a fan located outside the housing;

[0021] The heat exchanger and the fan are both arranged on the outlet pipe. The beneficial effect is that the heat exchanger is used to convert hot air into cold air, and can be discharged into the heating tank again through the air inlet pipe. The fan is arranged on the outlet pipe to increase the speed of gas flow.

[0022] In some embodiments, the high pressure furnace tube annealing equipment further comprises a plugging mechanism, a liquid inlet pipe and a liquid outlet pipe;

[0023] The heater is also provided with a second cooling channel, one end of which is connected to the input channel;

[0024] An installation groove is provided at one end of the heater corresponding to the second cooling channel, and the installation groove is located on the inner side wall of the input channel;

[0025] The blocking mechanism is arranged in the installation groove, and the blocking mechanism has a movable blocking member, and the blocking member is used to block the first cooling channel or the second cooling channel;

[0026] One end of the liquid inlet pipeline is connected to the input channel, and the other end of the liquid inlet pipeline is used to communicate with an external liquid supply device;

[0027] The heater is also provided with a liquid outlet hole, and the liquid outlet hole is communicated with the second cooling channel;

[0028] One end of the liquid outlet channel is connected to the liquid outlet hole, and the other end extends out of the shell. Its beneficial effect is that: a second cooling channel is also provided on the heater, one end of the second cooling channel is connected to the input channel, and an installation groove is provided on the inner side wall of the input channel, and a blocking mechanism is installed in the installation groove. When the blocking member provided on the blocking mechanism can block the first cooling channel or the second cooling channel. Since one end of the liquid inlet pipeline is also connected to the input channel, and the other end of the liquid inlet pipeline is used to communicate with the external liquid supply device, when the liquid supply device needs to provide cooling liquid, the blocking mechanism first drives the blocking member to block the first cooling channel, and the cooling liquid flows into the second cooling channel through the liquid inlet pipeline and the input channel, which is used to quickly cool the heater, so that the high-pressure furnace tube annealing equipment can use gas cooling or liquid cooling to further improve the cooling efficiency. In addition, a liquid outlet hole is also provided on the heater, and the liquid outlet hole is connected to the liquid outlet channel, which is used to discharge the cooling liquid, so that the cooling liquid can circulate, so as to ensure the cooling effect of the heater by using the cooling liquid. Most importantly, by arranging a blocking mechanism in the mounting groove, the switching between the first cooling channel and the second cooling channel can be realized, and the internal structural characteristics of the heater are reasonably utilized to avoid arranging too many pipelines in the shell.

[0029] In some embodiments, the blocking mechanism includes a first retractor and a second retractor;

[0030] The first telescoping device is disposed on a side wall of the mounting groove, and the first telescoping device has a first telescopic end, and the first telescopic end can be telescoped laterally;

[0031] The second telescopic device is arranged at the first telescopic end, and the second telescopic device has a second telescopic end, and the second telescopic end can be telescoped along the axial direction of the housing;

[0032] The blocking member is arranged at the second telescopic end;

[0033] When the first cooling channel needs to be blocked, the first telescopic end moves to the bottom input hole of the first cooling channel, and the second telescopic end drives the blocking member to block the bottom input hole of the first cooling channel;

[0034] When the second cooling channel needs to be blocked, the first telescopic end moves to the bottom input hole of the second cooling channel, and the second telescopic end drives the blocking member to block the bottom input hole of the second cooling channel. The beneficial effect is that the first telescopic device is arranged on the side wall of the installation groove, and the first telescopic device has a first telescopic end, and the first telescopic end can be horizontally telescopic, which means that the first telescopic end can be moved to the bottom of the bottom input hole of the first cooling channel or the bottom input hole of the second cooling channel, and the first cooling channel or the second cooling channel can be blocked by using the second telescopic device.

[0035] In some embodiments, the plugging member has an embedded portion and a plugging portion, the diameter of the embedded portion is smaller than the diameter of the plugging portion, and the diameter of the plugging portion is adapted to the inner diameter of the bottom input hole of the first cooling channel and the inner diameter of the bottom input hole of the second cooling channel. The beneficial effect is that the plugging member has an embedded portion and a plugging portion, and because the diameter of the embedded portion is smaller than the diameter of the plugging portion, the overall shape of the plugging member is a truncated cone structure, so as to ensure the reliability of plugging the first cooling channel or the second cooling channel. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A schematic structural diagram of a high pressure furnace tube annealing device according to a first embodiment of the present invention;

[0037] Figure 2 A schematic structural diagram of a heater according to a first embodiment of the present invention;

[0038] Figure 3 A schematic structural diagram of a heater according to a second embodiment of the present invention;

[0039] Figure 4 A schematic structural diagram of a high pressure furnace tube annealing device according to a second embodiment of the present invention;

[0040] Figure 5 A schematic structural diagram of a high pressure furnace tube annealing device according to a third embodiment of the present invention;

[0041] Figure 6 A schematic structural diagram of a heater according to a third embodiment of the present invention;

[0042] Figure 7 for Figure 6 This is an enlarged view of point A in the middle.

[0043] Reference numerals:

[0044] Shell 1, heater 2, first cooling channel 21, heating groove 22, input channel 23, air outlet 24, through hole 25, second cooling channel 26, mounting groove 27, liquid outlet 28, quartz tube 3, cooling device 4, air inlet pipe 5, heat exchanger 6, fan 7, blocking mechanism 8, blocking member 81, embedded part 811, blocking part 812, first retractor 82, second retractor 83, liquid inlet pipe 9, liquid outlet pipe 10, liquid supply device 11, switch valve 12, circulating impeller 13, air outlet pipe 14. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical scheme and advantages of the present invention clearer, the technical scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be the usual meanings understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Unless otherwise specified, the "connection" described in this article can be a direct connection or an indirect connection, that is, connected through an intermediate.

[0046] In view of the problems existing in the prior art, the embodiment of the present invention provides a high pressure furnace tube annealing device, referring to Figure 1 and Figure 2 As shown, the high-pressure furnace tube annealing equipment includes a shell 1, a heater 2 and a quartz tube 3. The quartz tube 3 is arranged in the shell 1, and a quartz boat is arranged in the quartz tube 3, and the quartz boat is used to carry wafers. The shell 1 is connected to an external booster and a depressurization device, and the booster is used to increase the pressure inside the shell 1, and the depressurization device is used to reduce the pressure inside the shell 1. The heater 2 is located in the shell 1 and is covered by the quartz tube 3, and is used to heat the wafers in the quartz tube 3. The heater 2 is provided with a first cooling channel 21, and the first cooling channel 21 is used to reduce the temperature inside the quartz tube 3.

[0047] In this embodiment, the first cooling channel 21 is provided on the heater 2 to quickly cool the wafer in the quartz tube 3, thereby ensuring the annealing efficiency of the high-pressure furnace tube annealing equipment, improving the production capacity, and achieving rapid annealing to improve the performance of the chip.

[0048] In some embodiments, the heater 2 has a heating groove 22 so that the heater 2 is in a "U"-shaped structure. The quartz tube 3 is located in the heating groove 22 and is coaxially arranged with the heater 2. The heater 2 is also provided with an input channel 23 and a plurality of air outlets 24. The input channel 23 is provided on the outer wall of the heater 2 and communicates with the first cooling channel 21. The input channel 23 is used to communicate with the air inlet pipe 5, and the air inlet pipe 5 is used to receive cooling gas. A plurality of air outlets 24 are arranged at intervals on the inner wall of the heating groove 22 and are all communicated with the first cooling channel 21, and are used to discharge cooling gas toward the quartz tube 3.

[0049] In this embodiment, the air inlet pipe 5 is used to receive external cooling gas, and the cooling gas is discharged toward the quartz tube 3 through the input channel 23, the first cooling channel 21 and the plurality of the air outlet holes 24, so as to quickly reduce the temperature inside the quartz tube 3.

[0050] In some specific embodiments, the inner wall of the gas outlet hole 24 is spirally arranged so that the cooling gas can rotate when discharged.

[0051] In this embodiment, the inner wall of the gas outlet 24 is spirally arranged so that the cooling gas rotates and generates vortex when discharged into the heating tank 22, thereby increasing the cooling effect of the cooling gas on the wafer in the quartz tube 3.

[0052] Further, refer to Figure 1 and Figure 3 As shown, the axis of the air outlet 24 is tilted toward the top of the heater 2. In this embodiment, by tilting the axis of the air outlet 24 toward the top of the heater 2, the cooling gas discharged into the heating tank 22 can rotate around the quartz tube 3 to ensure that the surrounding of the quartz boat can be evenly cooled, and the flow rate of the cooling gas is increased to further improve the efficiency of cooling the wafer in the quartz tube 3, thereby ensuring the annealing effect.

[0053] In some embodiments, reference Figure 2 and Figure 4 As shown, the housing 1 is provided with a first mounting hole corresponding to the input channel 23, and the first mounting hole connects the interior of the housing 1 with the exterior of the housing 1. The air intake pipe 5 is passed through the first mounting hole and is sealed and connected to the housing 1. One end of the air intake pipe 5 is connected to the input channel 23, and the other end is used to connect to an external cooling device 4, and the cooling device 4 is used to provide cooling gas.

[0054] Furthermore, the high-pressure furnace tube annealing equipment also includes an outlet pipe 14, a through hole 25 is also provided on the top of the heater 2, the through hole 25 is connected to the heating tank 22, and a second mounting hole is also provided in the shell 1 corresponding to the through hole 25, the second mounting hole also connects the inside of the shell 1 with the outside of the shell 1. The outlet pipe 14 is passed through the second mounting hole and is sealed and connected to the shell 1, one end of the outlet pipe 14 is connected to the through hole 25, and the outlet pipe 14 is used to discharge the gas in the shell 1.

[0055] In this embodiment, the outlet pipe 14 is provided with a switch valve 12, a heat exchanger 6 and a fan 7, the outlet pipe 14 is connected to the cooling device 4, and the outlet pipe 14 is also provided with a switch valve 12. When the high-pressure furnace tube annealing equipment is rapidly cooled, the pressure in the shell 1 needs to be reduced to atmospheric pressure by a pressure reducing device, and then the switch valve 12 is opened, the fan 7 is turned on, and the inside of the shell 1 is rapidly cooled by the circulation of gas in the shell 1.

[0056] In other embodiments, reference Figure 1 and Figure 2 As shown, the outlet pipe 14 is provided with a switch valve 12, a heat exchanger 6 and a circulating impeller 13. The outlet pipe 14 is connected with the inlet pipe 5 through the circulating impeller 13. The outlet pipe may also be provided with a switch valve 12. It should be noted that the heat exchanger 6, the circulating impeller 13, the inlet pipe 5 and the outlet pipe 14 can all withstand the high pressure in the shell 1. When the wafer in the quartz tube 3 needs to be cooled, the circulating impeller 13 is first turned on, and the switch valve 12 is opened. The high-temperature and high-pressure gas in the shell 1 circulates along the outlet pipe 14 and the inlet pipe 5 through the circulating impeller 13. The heat exchanger 6 is used to cool the high-temperature gas and transport the cooling gas to the shell 1.

[0057] In some embodiments, reference Figures 5 to 7 As shown, the high pressure furnace tube annealing equipment further comprises a plugging mechanism 8, a liquid inlet pipe 9 and a liquid outlet pipe 10. The heater 2 is further provided with a second cooling channel 26 which is independent of the first cooling channel 21, and one end of the second cooling channel 26 is connected to the input channel 23. The heater 2 is provided with a mounting groove 27 at one end corresponding to the second cooling channel 26, and the mounting groove 27 is located on the inner side wall of the input channel 23. The plugging mechanism 8 is arranged in the mounting groove 27, and the plugging mechanism 8 has a movable plugging member 81, and the plugging member 81 is used to plug the first cooling channel 21 or the second cooling channel 26. One end of the liquid inlet pipe 9 is connected to the input channel 23, and the other end of the liquid inlet pipe 9 is used to communicate with the external liquid supply device 11. The heater 2 is further provided with a liquid outlet 28, and the liquid outlet 28 is connected to the second cooling channel 26. One end of the liquid outlet channel is connected to the liquid outlet 28, and the other end extends out of the shell 1 for discharging the coolant.

[0058] In this embodiment, one end of the liquid inlet pipe 9 can be directly connected to the air inlet pipe 5 outside the housing 1, and a switch valve 12 is provided on one side of the air inlet pipe 5 to prevent the coolant from flowing into the other side of the air inlet pipe 5. When the coolant is needed to cool the inside of the housing 1, the switch valve 12 can be closed first, and then the first cooling channel 21 can be blocked with the blocking member 81, and then the liquid supply device 11 provides the coolant, and the coolant is discharged into the second cooling channel 26 through part of the liquid inlet pipe 9, part of the air inlet pipe 5, and the input channel 23, so as to quickly reduce the temperature inside the heater 2.

[0059] It should be noted that, in this embodiment, the heater 2 may be cooled by a coolant first, and then the quartz tube 3 may be cooled by a cold zone gas to increase the cooling efficiency.

[0060] In some specific embodiments, reference Figure 6 and Figure 7 As shown, the blocking mechanism 8 includes a first telescopic device 82 and a second telescopic device 83. The first telescopic device 82 is arranged on the side wall of the installation groove 27. The first telescopic device 82 has a first telescopic end, which can be telescoped laterally, that is, it can move along the axial direction of the input pipe. The second telescopic device 83 is arranged at the first telescopic end. The second telescopic device 83 has a second telescopic end, which can be telescoped along the axial direction of the housing 1, that is, it is equivalent to the second telescopic end being able to move vertically up and down. The blocking member 81 is arranged at the second telescopic end.

[0061] When the first cooling channel 21 needs to be blocked, the control system controls the first telescopic device 82 to operate, so that the first telescopic end moves to below the bottom input hole of the first cooling channel 21, and then the second telescopic end drives the blocking member 81 to move upward to block the bottom input hole of the first cooling channel 21. When the second cooling channel 26 needs to be blocked, the control system controls the first telescopic device 82 to operate, the first telescopic end moves to below the bottom input hole of the second cooling channel 26, and the second telescopic end drives the blocking member 81 to block the bottom input hole of the second cooling channel 26.

[0062] In some embodiments, the sealing member 81 has an embedded portion 811 and a sealing portion 812, the diameter of the embedded portion 811 is smaller than the diameter of the sealing portion 812, and the diameter of the sealing portion 812 is adapted to the inner diameter of the bottom input hole of the first cooling channel 21 and the inner diameter of the bottom input hole of the second cooling channel 26.

[0063] In this embodiment, the sealing member 81 has an embedded portion 811 and a sealing portion 812, and because the diameter of the embedded portion 811 is smaller than the diameter of the sealing portion 812, the overall shape of the sealing member 81 is a truncated cone structure to ensure the reliability of the sealing member 81 in sealing the first cooling channel 21 or the second cooling channel 26.

[0064] The above is only a specific implementation of the embodiment of the present application, but the protection scope of the embodiment of the present application is not limited thereto, and any changes or replacements within the technical scope disclosed in the embodiment of the present application should be included in the protection scope of the embodiment of the present application. Therefore, the protection scope of the embodiment of the present application should be based on the protection scope of the claims.

Claims

1. A high pressure furnace tube annealing equipment, characterized in that: It includes a shell, a heater and a quartz tube; The quartz tube is arranged in the shell, and a quartz boat is arranged in the quartz tube, and the quartz boat is used to carry the wafer; The heater is located in the housing and is covered on the quartz tube, and is used to heat the wafer in the quartz tube. The heater is provided with a first cooling channel, and the first cooling channel is used to reduce the temperature in the quartz tube. The heater has a heating tank, the quartz tube is arranged in the heating tank, and the heater is also provided with an input channel and a plurality of air outlets; The input channel is opened on the outer wall of the heater and communicates with the first cooling channel, and the input channel is used to communicate with the intake pipe; A plurality of the gas outlet holes are arranged at intervals on the inner side wall of the heating tank and are all connected to the first cooling channel, and are used to discharge the cooling gas toward the quartz tube; It also includes a blocking mechanism, a liquid inlet pipe and a liquid outlet pipe; The heater is also provided with a second cooling channel, one end of which is connected to the input channel; An installation groove is provided at one end of the heater corresponding to the second cooling channel, and the installation groove is located on the inner side wall of the input channel; The blocking mechanism is arranged in the installation groove, and the blocking mechanism has a movable blocking member, and the blocking member is used to block the first cooling channel or the second cooling channel; One end of the liquid inlet pipeline is connected to the input channel, and the other end of the liquid inlet pipeline is used to communicate with an external liquid supply device; The heater is also provided with a liquid outlet hole, and the liquid outlet hole is communicated with the second cooling channel; One end of the liquid outlet channel is communicated with the liquid outlet hole, and the other end extends out of the shell.

2. The high pressure furnace tube annealing equipment according to claim 1, characterized in that: The inner wall of the air outlet is spirally arranged.

3. The high pressure furnace tube annealing equipment according to claim 1 or 2, characterized in that: The axis of the air outlet is inclined toward the top of the heater.

4. The high pressure furnace tube annealing equipment according to claim 1, characterized in that: The housing is provided with a first mounting hole corresponding to the input channel, and the first mounting hole connects the interior of the housing with the exterior of the housing; The air intake pipe is passed through the first mounting hole and is sealed and connected to the shell. One end of the air intake pipe is connected to the input channel, and the other end is used to connect to the cooling device.

5. The high pressure furnace tube annealing equipment according to claim 1, characterized in that: Also includes an air outlet duct; A through hole is also provided on the top of the heater, and the through hole is connected to the heating tank; The shell is further provided with a second mounting hole, and the second mounting hole connects the inside of the shell with the outside of the shell; The air outlet pipe is passed through the second mounting hole and is sealed and connected to the shell. One end of the air outlet pipe is connected to the through hole. The air outlet pipe is used to discharge the gas in the shell.

6. The high pressure furnace tube annealing equipment according to claim 5, characterized in that: Also included is a heat exchanger and a fan located outside the housing; The heat exchanger and the fan are both arranged on the air outlet duct.

7. The high pressure furnace tube annealing equipment according to claim 1, characterized in that: The blocking mechanism includes a first retractor and a second retractor; The first telescoping device is disposed on a side wall of the mounting groove, and the first telescoping device has a first telescopic end, and the first telescopic end can be telescoped laterally; The second telescopic device is arranged at the first telescopic end, and the second telescopic device has a second telescopic end, and the second telescopic end can be telescoped along the axial direction of the housing; The blocking member is arranged at the second telescopic end; When the first cooling channel needs to be blocked, the first telescopic end moves to the bottom input hole of the first cooling channel, and the second telescopic end drives the blocking member to block the bottom input hole of the first cooling channel; When the second cooling channel needs to be blocked, the first telescopic end moves to the bottom input hole of the second cooling channel, and the second telescopic end drives the blocking member to block the bottom input hole of the second cooling channel.

8. The high pressure furnace tube annealing equipment according to claim 7, characterized in that: The blocking member comprises an embedding portion and a blocking portion, wherein the diameter of the embedding portion is smaller than the diameter of the blocking portion, and the diameter of the blocking portion is adapted to both the inner diameter of the bottom input hole of the first cooling channel and the inner diameter of the bottom input hole of the second cooling channel.

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