A chip plastic packaging equipment with automatic loading function

Abstract

The present invention is directed to the field of chip plastic encapsulation technology, and in particular to a chip plastic encapsulation device with an automatic loading function. It comprises a housing, a lower mold being fixedly connected to the housing, a first electrically controlled telescopic rod being fixedly connected inside the housing, a connecting plate being fixedly connected to the telescopic end of the first electrically controlled telescopic rod, an injection barrel being fixedly connected inside the injection barrel in a sealing and sliding manner to a glue injection rod, a rotating rod being rotatably connected inside the glue injection rod, a limiting rod being slidably connected to the rotating rod, an elastic member being fixedly connected between the limiting rod and the adjacent rotating rod, and a limiting portion being provided on the limiting rod. The present invention causes the limiting rod and the adjacent glue injection rod to have their wear notches misaligned with each other through relative rotation between the limiting rod and the adjacent glue injection rod, automatically restoring the seal between the glue injection rod and the adjacent injection barrel, thereby avoiding the problem of a reduced amount of glue extruded by the glue injection rod when the seal fails, thereby preventing a reduction in the amount of plastic encapsulation glue adhering to the chip, which may lead to a decrease in its quality.

Description

Technical Field

[0001] The present invention relates to the technical field of chip plastic packaging, and in particular to a chip plastic packaging device with an automatic loading function. Background Art

[0002] Chip encapsulation equipment is an indispensable device in the integrated circuit manufacturing process. In order to protect the tiny and fragile chips, the chips need to be encapsulated. The original encapsulation form was a metal shell. With the development of science and technology and social progress, the chip encapsulation shell has gradually developed into a lightweight and low-cost plastic package. The existing encapsulation process is to first use an automatic loading structure to clamp the bonded lead frame and place it in the cavity of a specified mold. Then, the encapsulation block is added to the barrel and hot-melted into liquid encapsulation glue. Subsequently, the encapsulation glue in the barrel is squeezed into the mold cavity through the injection rod, so that the encapsulation glue wraps the chip. The encapsulation glue on the chip is cooled and formed.

[0003] However, since a large number of chips need to be plastic-sealed at the same time during the plastic-sealing process, a large number of injection rods are required, and the injection rods rub against the inner wall of the barrel during continuous use, which inevitably leads to wear of the injection rods. Once the injection rods are worn, the seal between the injection rods and the barrel will fail, and the amount of glue squeezed out by the injection rods will become less, resulting in different filling levels of the plastic sealing compound in different cavities, making some chips unable to be completely wrapped by the plastic sealing compound, which in turn affects the quality of the chips. Summary of the Invention

[0004] In order to overcome the disadvantage that after the seal between the injection rod and the barrel fails, the amount of solution squeezed out by the injection rod becomes less, resulting in different filling levels of the molding compound in different cavities, the present invention provides a chip molding device with automatic loading function.

[0005] The technical solution of the present invention is: a chip molding device with an automatic loading function, comprising a shell, a lower mold with a cavity fixedly connected to the shell, and an exhaust hole provided on the cavity of the lower mold, the shell being slidably connected to a first electromagnetic slider through a first electromagnetic slide rail, the first electromagnetic slider being fixed to the upper mold, a first electrically-controlled telescopic rod being fixedly connected to a position near the lower mold in the shell, the telescopic end of the first electrically-controlled telescopic rod being fixedly connected to a connecting plate, an injection cylinder distributed in a linear array being fixedly connected to the lower side of the lower mold, a glue injection rod being sealingly and slidingly connected in the injection cylinder, the glue injection rod being fixed to the connecting plate, a rotating rod rotatably connected to the glue injection rod and connected to the shell for sliding and rotation, the rotating rod being slidably connected to a symmetrically distributed limiting rod on a side of the rotating rod close to an adjacent injection cylinder, an elastic member being fixedly connected between the limiting rod and the adjacent rotating rod, a limiting portion being provided on the limiting rod, and a loading assembly for loading is provided on the shell.

[0006] In addition, it is particularly preferred that a symmetrically distributed arc plate is slidably connected to the symmetrically distributed limit rod in the injection rod, an elastic member is fixed between the arc plate and the adjacent injection rod, and the arc plate is limitedly matched with the adjacent limit rod.

[0007] In addition, it is particularly preferred that the material of the limiting rod close to the adjacent injection cylinder is flexible, the limiting rod is sealed to the inner wall of the adjacent injection cylinder, there is a gap between the limiting portion and the adjacent injection cylinder, and there is also a gap between the arc plate and the adjacent injection cylinder.

[0008] In addition, it is particularly preferred that a first inclined surface is provided on a side of the glue injection rod located in the adjacent injection cylinder and close to the connecting plate.

[0009] In addition, it is particularly preferred that a first pneumatic telescopic rod distributed in a linear array is fixedly connected in the shell, the first pneumatic telescopic rod is connected to the adjacent injection cylinder through a conduit, an airbag is fixed to and connected to the conduit of the first pneumatic telescopic rod, the telescopic end of the first pneumatic telescopic rod is fixedly connected to a support plate, a tension spring is fixed between the first pneumatic telescopic rod and the adjacent support plate, a rack slidingly connected to the shell is fixedly connected to the support plate, a gear meshing with the adjacent rack is splined on the rotating rod, a rotating ring distributed in a linear array is fixedly connected in the shell near the gear distributed in the linear array, and the rotating ring is rotatably connected to the adjacent gear.

[0010] Furthermore, it is particularly preferred that the number of teeth of the gear is four times the number of teeth of the adjacent rack.

[0011] In addition, it is particularly preferred that a second pneumatic telescopic rod distributed in a linear array is fixedly connected to the support plate distributed in a linear array in the shell, the telescopic end of the second pneumatic telescopic rod is fixedly connected to the adjacent support plate, the second pneumatic telescopic rod is connected to the exhaust hole of the upper cavity of the lower mold through a conduit, and a one-way valve is installed on the conduit near the position adjacent to the second pneumatic telescopic rod, an exhaust hole is provided on the fixed part of the second pneumatic telescopic rod, an exhaust valve is installed at the exhaust hole, and the exhaust valve of the second pneumatic telescopic rod is squeezed together with its telescopic end.

[0012] In addition, it is particularly preferred that a second inclined surface is provided on the telescopic end of the second pneumatic telescopic rod at a position away from the adjacent support plate.

[0013] In addition, it is particularly preferred that the loading assembly includes a second electromagnetic slider, a second electromagnetic slide rail is provided on the outer shell, the second electromagnetic slider is slidably connected to the second electromagnetic slide rail of the outer shell, the second electromagnetic slider is fixedly connected to a sliding frame, a second electrically-controlled telescopic rod is fixedly connected to the sliding frame, the telescopic end of the second electrically-controlled telescopic rod is fixedly connected to a sliding plate, the sliding plate is slidably connected to a circumferentially distributed third electromagnetic slider through a circumferentially distributed third electromagnetic slide rail, and the third electromagnetic slider is fixedly connected to a connecting rod.

[0014] In addition, it is particularly preferred that it also includes circumferentially distributed fixed blocks, which are fixedly connected to the adjacent connecting rods, and the number of the fixed blocks is the same as the number of the third electromagnetic sliders. An exhaust pipe connected to an external heating device is provided in the fixed block, and the exhaust pipe is provided with an exhaust port. A sealing plate that is limitedly and slidingly connected in the fixed block and cooperates with the exhaust port of the adjacent exhaust pipe is sealed. A thermistor block is provided in the fixed block near the adjacent sealing plate, and the sealing plate is fixedly connected to the adjacent thermistor block.

[0015] The beneficial effects produced by utilizing the above technical solution are:

[0016] 1. The present invention achieves mutual displacement of the wear notches of the limit rod and the adjacent injection rod by relative rotation between the limit rod and the adjacent injection rod, automatically restoring the seal between the injection rod and the adjacent injection barrel. This avoids the problem of reduced glue extrusion when the injection rod seal fails, thereby preventing the amount of plastic sealant adhering to the chip from decreasing, leading to a decrease in its quality. Furthermore, the chip is automatically loaded using a loading assembly, reducing work intensity.

[0017] 2. The arc plate is unlocked by moving the limiter. When the seal between the injection rod and the adjacent injection barrel fails, the arc plate is tightly attached to the inner wall of the adjacent injection barrel to provide an emergency seal between the injection rod and the adjacent injection barrel. This prevents the seal failure from causing the plastic sealant to leak into the adjacent injection barrel during injection, thereby reducing the amount of plastic sealant during chip sealing and affecting the quality of chip sealing.

[0018] 3. The gas in the lower mold cavity is extracted by the second pneumatic telescopic rod. After the seal between the injection rod and the adjacent injection barrel fails, a negative pressure is formed inside the cavity of the lower mold. The gas in the first pneumatic telescopic rod is injected into the bottom of the adjacent injection barrel, temporarily preventing the plastic sealant from flowing downward along the sealing gap between the injection rod and the adjacent injection barrel. The gas squeezes and guides the plastic sealant into the cavity of the lower mold, preventing the plastic sealant from flowing downward and reducing the amount of glue squeezed out by the injection rod 107, thereby ensuring the quality of the chip plastic sealing.

[0019] 4. The amount of hot steam discharged from the exhaust port on the adjacent exhaust pipe is adjusted by the sealing plate to slowly cool down the chip after plastic sealing, so as to avoid the chip temperature dropping suddenly due to the low external ambient temperature after the chip is plastic sealed, thereby preventing the chip from cracking or delamination due to sudden cooling after plastic sealing. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0021] Figure 2 is a sectional view of the three-dimensional structure of the housing of the present invention;

[0022] Figure 3 Schematic diagram of the three-dimensional structure of the upper mold of the present invention;

[0023] Figure 4 Schematic diagram of the three-dimensional structure of the lower mold of the present invention;

[0024] Figure 5 This is a sectional view of the three-dimensional structure of the lower mold of the present invention;

[0025] Figure 6 This is a sectional view of the three-dimensional structure of the injection cylinder of the present invention;

[0026] Figure 7 This is a sectional view of the three-dimensional structure of the glue injection rod of the present invention;

[0027] Figure 8 Schematic diagram of the three-dimensional structure of the limiting rod of the present invention;

[0028] Figure 9 This is an exploded view of the three-dimensional structure of the limiting rod and the arc plate of the present invention;

[0029] Figure 10 Schematic diagram of the three-dimensional structure of the support plate of the present invention;

[0030] Figure 11 is a sectional view of the three-dimensional structure of the second pneumatic telescopic rod of the present invention;

[0031] Figure 12 Schematic diagram of the three-dimensional structure of the sliding plate of the present invention;

[0032] Figure 13 Schematic diagram of the three-dimensional structure of the fixing block of the present invention;

[0033] Figure 14 It is a sectional view of the three-dimensional structure of the fixing block of the present invention.

[0034] : The marks in the accompanying drawings are as follows: 1: shell, 101: lower mold, 102: first electromagnetic slider, 103: upper mold, 104: first electrically controlled telescopic rod, 105: connecting plate, 106: injection cylinder, 107: glue injection rod, 108: rotating rod, 109: limiting rod, 1091: limiting part, 110: arc plate, 3: first inclined plane, 401: first pneumatic telescopic rod, 402: support plate, 403: rack, 404: gear, 405: rotating ring, 6: second pneumatic telescopic rod, 7: second inclined plane, 9: feeding assembly, 901: second electromagnetic slider, 902: sliding frame, 903: second electrically controlled telescopic rod, 904: sliding plate, 905: third electromagnetic slider, 906: connecting rod, 10: fixed block, 1001: exhaust pipe, 1002: sealing plate, 1003: thermal block. DETAILED DESCRIPTION

[0035] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further elaborated below.

[0036] The existing injection rod constantly rubs against the inner wall of the barrel during use, which can easily cause the injection rod to wear. Once the injection rod is worn, the operator cannot detect it in time, which will cause the seal between the injection rod and the barrel to fail, and the amount of glue squeezed out by the injection rod will become less, resulting in different filling levels of plastic encapsulation compound in different cavities, making some chips unable to be completely wrapped by the plastic encapsulation compound, which in turn affects the chip quality.

[0037] Example 1: A chip encapsulation device with automatic loading function, combined with Figures 1-9As shown, it includes a shell 1, a control panel is installed on the shell 1, a lower mold 101 with a cavity is fixed to the shell 1, and the cavity of the lower mold 101 is provided with an exhaust hole. The shell 1 is slidably connected to the first electromagnetic sliders 102 distributed symmetrically on the left and right through two first electromagnetic slide rails distributed symmetrically on the left and right. The first electromagnetic sliders 102 are electrically connected to the control panel, and an upper mold 103 is fixedly connected between the symmetrically distributed first electromagnetic sliders 102. The lower mold 101 and the upper mold 103 are both connected to an external heating device, wherein the external heating device is electrically connected to the control panel and is not shown in the figure. A first electrically controlled telescopic rod 104 electrically connected to the control panel is fixed near the lower mold 101 in the shell 1. The telescopic end of the electric telescopic rod 104 is fixedly connected to a connecting plate 105, and the lower side of the lower mold 101 is fixedly connected to an injection cylinder 106 distributed in a linear array, and a glue injection rod 107 is sealed and slidably connected inside the injection cylinder 106. The glue injection rod 107 is located in the adjacent injection cylinder 106 and is provided with a first inclined surface 3 on the lower side, which is used to make a gap between the glue injection rod 107 and the adjacent injection cylinder 106 for gas to enter. The glue injection rod 107 is fixed to the connecting plate 105, and the glue injection rod 107 is rotatably connected to a rotating rod 108 that is slidably and rotatably connected to the outer shell 1. The upper side of the rotating rod 108 is slidably connected to a symmetrically distributed limit rod 109, which is arc-shaped, and an elastic member is fixed between the limit rod 109 and the adjacent rotating rod 108. , wherein the elastic member is a compression spring and is initially in a stored force state, which is used to make the limiting rod 109 close to the inner wall of the adjacent injection cylinder 106. An arc-shaped limiting portion 1091 is provided on the limiting rod 109. The material of the position where the limiting rod 109 contacts the adjacent injection cylinder 106 is flexible. The limiting rod 109 is sealed and fits the inner wall of the adjacent injection cylinder 106. There is a gap between the limiting portion 1091 and the adjacent injection cylinder 106. When the limiting rod 109 is worn out after long-term use, the elastic member of the limiting rod 109 drives it to pop up, and the limiting portion 1091 and the adjacent injection cylinder 106 will be close to each other, which is used to protect the limiting portion 1091 from friction loss in the initial state. The limiting rods 109 are symmetrically distributed in the injection rod 107. There is a symmetrically distributed arc plate 110 slidingly connected at 09, and there is also a gap between the arc plate 110 and the adjacent injection cylinder 106, which is used to prevent the arc plate 110 from generating friction loss in the initial state. An elastic part is fixed between the arc plate 110 and the adjacent injection rod 107, wherein the elastic part is a compression spring and is initially in a force storage state. A limit pin is fixed on the arc plate 110, and a limit groove is provided on the limit rod 109 for limiting the limit pin on the adjacent arc plate 110. The arc plate 110 is limited and matched with the adjacent limit rod 109 to limit the arc plate 110 to avoid contact between the arc plate 110 and the adjacent injection cylinder 106 in the initial state. A loading component 9 for loading is provided on the outer shell 1.

[0038] Combine Figure 4-Figure 7As shown, a plurality of first pneumatic telescopic rods 401 distributed in a linear array are fixedly connected in the housing 1. The first pneumatic telescopic rod 401 is connected to the adjacent injection cylinder 106 through a conduit. An air bag is fixedly connected to and connected to the conduit of the first pneumatic telescopic rod 401. The air bag is initially in an expanded state. The telescopic end of the first pneumatic telescopic rod 401 is fixedly connected to a support plate 402. A tension spring is fixedly connected between the first pneumatic telescopic rod 401 and the adjacent support plate 402. The tension spring between the first pneumatic telescopic rod 401 and the adjacent support plate 402 is initially in a stored state. The pneumatic telescopic rod 401 and its conduit and airbag are all filled with gas to prevent the tension spring from resetting. A rack 403 slidingly connected to the housing 1 is fixedly connected to the support plate 402. A gear 404 meshing with the adjacent rack 403 is splined on the rotating rod 108. A rotating ring 405 distributed in a linear array is fixedly connected near the gears 404 distributed in a linear array in the housing 1. The rotating ring 405 is rotatably connected to the adjacent gear 404. The number of teeth on the gear 404 is four times the number of teeth on the adjacent rack 403, so that the gear 404 can rotate at most 90°.

[0039] Combine Figure 4 、 Figure 10 and Figure 11 As shown, a second pneumatic telescopic rod 6 distributed in a linear array is fixedly connected to the support plate 402 distributed in a linear array in the housing 1, and the telescopic end of the second pneumatic telescopic rod 6 is fixedly connected to the adjacent support plate 402. The second pneumatic telescopic rod 6 is connected to the exhaust hole of the upper cavity of the lower mold 101 through a conduit. A one-way valve is installed at the position of the conduit near the adjacent second pneumatic telescopic rod 6. When the gas flows out from the exhaust hole of the upper cavity of the lower mold 101 into the conduit, the one-way valve opens and circulates, and is used to prevent the gas in the other second pneumatic telescopic rods 6 from being extracted when the telescopic end of one of the second pneumatic telescopic rods 6 is extended. An exhaust hole is provided on the fixed part of the second pneumatic telescopic rod 6, and an exhaust valve is installed at the exhaust hole, wherein the exhaust valve is composed of a circular block. The plate is composed of a tension spring which is initially in a stored-force state. A protrusion is provided on the telescopic end of the second pneumatic telescopic rod 6 near its exhaust valve. The exhaust valve of the second pneumatic telescopic rod 6 is squeezed and fitted with the protrusion at its telescopic end. When the telescopic end of the second pneumatic telescopic rod 6 is extended, the telescopic end of the second pneumatic telescopic rod 6 drives its protrusion to move to the left and loses contact with the exhaust valve. The tension spring of the exhaust valve drives its circular baffle to move to the left to block the exhaust hole on the adjacent second pneumatic telescopic rod 6. A second inclined surface 7 is provided on the right side of the telescopic end of the second pneumatic telescopic rod 6. The second inclined surface 7 is used to create a gap for gas to enter between the telescopic end and the fixed part of the second pneumatic telescopic rod 6, so that gas can enter its exhaust hole through the second pneumatic telescopic rod 6.

[0040] Combine Figure 1-Figure 3 、 Figure 12 and Figure 13As shown, the loading assembly 9 includes a second electromagnetic slider 901 electrically connected to the control panel, a second electromagnetic slide rail is provided on the outer shell 1, the second electromagnetic slider 901 is slidably connected to the second electromagnetic slide rail of the outer shell 1, a sliding frame 902 is fixed to the second electromagnetic slider 901, a second electrically controlled telescopic rod 903 electrically connected to the control panel is fixed to the sliding frame 902, the telescopic end of the second electrically controlled telescopic rod 903 is fixed to a sliding plate 904, the sliding plate 904 is slidably connected to a circumferentially distributed third electromagnetic slider 905 through a circumferentially distributed third electromagnetic slide rail, the third electromagnetic slider 905 is electrically connected to the control panel, the third electromagnetic slider 905 is fixed to a connecting rod 906, and the circumferentially distributed connecting rod 906 is used to clamp the chip.

[0041] When the operator needs to use this device to plastic-seal the chip, the operator first turns on the second electromagnetic slide 901 through the control panel, and the second electromagnetic slide 901 drives the sliding frame 902 to move backward, and the sliding frame 902 drives the sliding plate 904 to move backward through the second electrically-controlled telescopic rod 903, and the sliding plate 904 drives the parts on it to move backward. When the sliding frame 902 moves to the top of the chip to be plastic-seal, the operator turns on the second electrically-controlled telescopic rod 903 through the control panel, and the telescopic end of the second electrically-controlled telescopic rod 903 drives the sliding plate 904 to move downward, and the sliding plate 904 drives the circumferentially distributed connecting rods 906 to move downward, and the circumferentially distributed connecting rods 906 move to the four sides of the chip to be plastic-seal respectively. Then the operator turns on the circumferentially distributed third electromagnetic slide 905 through the control panel, and the third electromagnetic slide 905 drives the adjacent connecting rods 906 to move to clamp the chip. Then the operator turns on the second electromagnetic slide 901 through the control panel, and controls the telescopic end of the second electrically-controlled telescopic rod 903 to extend through the control panel, and the extension of the second electrically-controlled telescopic rod 903 The retracted end drives all connecting rods 906 upward through the sliding plate 904, and the second electromagnetic slider 901 drives the sliding frame 902 to move forward. The sliding frame 902 drives the parts and chips on it to move to the top of the lower mold 101. At this time, the operator controls the telescopic end of the second electrically-controlled telescopic rod 903 to retract through the control panel, so that the clamped chip is located above the lower mold 101. Finally, the operator controls the movement of the circumferentially distributed third electromagnetic slider 905 through the control panel. The third electromagnetic slider 905 drives the adjacent connecting rods 906 to move, releases the clamping of the chip, and places the chip in the cavity of the lower mold 101. The operator controls the movement of the second electromagnetic slider 901 through the control panel, and controls the telescopic end of the second electrically-controlled telescopic rod 903 to extend through the control panel. The telescopic end of the second electrically-controlled telescopic rod 903 drives all connecting rods 906 to move upward through the sliding plate 904. The second electromagnetic slider 901 drives the sliding frame 902 and the parts on it to move and away from the top of the lower mold 101, so that the sliding frame 902 and the parts on it move backward and reset.

[0042] Before the operator places the chip in the cavity of the lower mold 101 , the operator first places several plastic encapsulation blocks in the corresponding injection cylinders 106 .

[0043] After the operator places the chip in the cavity of the lower mold 101, the operator controls the two first electromagnetic slides 102 to move downward along the adjacent first electromagnetic slide rails on the shell 1 through the control panel. The two first electromagnetic slides 102 synchronously drive the upper mold 103 to move downward, and the upper mold 103 and the lower mold 101 are fitted together. Then the operator heats the upper mold 103 and the lower mold 101 through an external heating device, so that the plastic sealing block in the injection cylinder 106 is gradually heated and melted into liquid plastic sealing glue. The operator turns on the first electrically controlled telescopic rod 104 through the control panel. The telescopic end of the first electrically controlled telescopic rod 104 drives all the injection rods 107 to move upward through the connecting plate 105. The injection rods 107 squeeze the plastic sealing glue in the adjacent injection cylinders 106, so that the plastic sealing glue is pressurized and moves upward to fill the cavity between the upper mold 103 and the lower mold 101. The gas in the cavity passes through the lower mold 101 The exhaust hole is discharged into all the second air pressure telescopic rods 6. At this time, all the one-way valves in the conduits of the second air pressure telescopic rods 6 are opened (in the process of the injection rod 107 moving up and down, along with the wear of the injection rod 107 and the adjacent limit rod 109, the elastic part of the limit rod 109 constantly pops out and sticks to the inner wall of the adjacent injection cylinder 106, so that the limit rod 109 is always in close contact with the inner wall of the adjacent injection cylinder 106. Along with the wear of the limit rod 109, the limit rod 109 drives the adjacent limit part 1091 to gradually stick to the inner wall of the injection cylinder 106). At this time, the telescopic end of the second air pressure telescopic rod 6 squeezes open its exhaust valve, and the gas is discharged to the outside through the exhaust valve. When the injection rod 107 squeezes out all the plastic sealing glue in the adjacent injection cylinder 106, the operator turns off the external heating equipment, so that the plastic sealing glue gradually cools down and solidifies. During this period, the upper mold 103 and the lower mold 101 are fitted to pressurize and shape the plastic sealing glue.

[0044] When the plastic encapsulation glue is completely solidified, the operator turns on the two first electromagnetic sliders 102 through the control panel. The two first electromagnetic sliders 102 jointly drive the upper mold 103 to move upward, so that the upper mold 103 moves until it loses contact with the plastic-encapsulated chip. Then the operator drives the connecting rod 906 to clamp and unload the chip through the reverse action of the above-mentioned chip loading. The connecting rod 906 removes the plastic-encapsulated chip and brings the next un-plasticized chip into the cavity of the lower mold 101.

[0045] During the upward movement of the glue injection rod 107, the telescopic end of the first pneumatic telescopic rod 401 is initially in an extended state, and the airbag on the conduit of the first pneumatic telescopic rod 401 is initially in an expanded state. The glue injection rod 107 extracts the gas in the airbag thereon through the conduit into the adjacent injection cylinder 106. When the glue injection rod 107 has squeezed out all the plastic sealing glue in the adjacent injection cylinder 106, the glue injection rod 107 moves downward and resets. The glue injection rod 107 squeezes the gas in the adjacent injection cylinder 106 back into the conduit of the adjacent first pneumatic telescopic rod 401, and then the gas is squeezed back into the airbag of the upper conduit of the first pneumatic telescopic rod 401. The airbag of the upper conduit of the first pneumatic telescopic rod 401 is expanded and reset. When the seal between the glue injection rod 107 and the adjacent injection cylinder 106 has not failed, the airbag is used to prevent the tension spring on the telescopic end of the adjacent first pneumatic telescopic rod 401 from contracting.

[0046] During the process of chip plastic sealing, with the continuous movement of the injection rod 107, when the seal between the injection rod 107 and the adjacent injection cylinder 106 fails due to wear, the gas in the first pneumatic telescopic rod 401 is discharged along its conduit and air bag into the adjacent injection cylinder 106, and then the gas is discharged upward into the cavity of the lower mold 101 through the injection rod 107 with failed seal. The gas in the first pneumatic telescopic rod 401 is reduced, causing its telescopic end to gradually shrink. The tension spring of the first pneumatic telescopic rod 401 shrinks, and the telescopic end of the first pneumatic telescopic rod 401 drives the adjacent support plate 402 to move, the support plate 402 drives the adjacent rack 403 to move, the rack 403 drives the adjacent gear 404 to rotate, the gear 404 drives the adjacent rotating rod 108 to rotate, the rotating rod 108 drives the two limit rods 109 to rotate, and the limit rod 109 drives the adjacent limit part 1091 to rotate.

[0047] When the seal between the injection rod 107 and the adjacent injection cylinder 106 fails due to wear, the limiting rod 109 and the adjacent injection rod 107 gradually rotate relative to each other, causing the worn position on the injection rod 107 and the worn position on the adjacent limiting rod 109 to gradually misalign, until the injection rod 107 and the adjacent limiting rod 109 together form a sealed piston (for example, two tightly attached discs, the upper disc and the lower disc are worn at one position or multiple positions, and the projections of the two discs have gaps. When the two discs rotate relative to each other, the gaps caused by wear on the two discs are misaligned with each other, and the projections of the two discs are still a complete disc). When the injection rod 107 is sealed again with the adjacent injection cylinder 106 through the adjacent limiting rod 109, the gas in the first pneumatic telescopic rod 401 can no longer be discharged, and the support plate 402 no longer drives the adjacent rack 403 to move, thereby causing the gear 404 to stop rotating.

[0048] When the limit rod 109 drives the adjacent limit part 1091 to start rotating, the limit groove on the limit rod 109 loses contact with the limit pin on the adjacent arc plate 110, and the elastic part of the limit rod 109 pops out and drives the adjacent limit part 1091 to move, so that the limit rod 109 and the adjacent limit part 1091 both move in the direction away from the axis of the adjacent rotating rod 108, and the position of the limit rod 109 and the adjacent limit part 1091 is adjusted. The rotation of the limit rod 109 in the above steps restores the seal between the adjacent injection rod 107 and the adjacent injection cylinder 106. If the limit rod 109 is severely worn and cannot form a complete sealing piston with the adjacent injection rod 107, the limit rod 109 drives the adjacent limit part 1091 to rotate to 90°. At this time, the limit rod 109 is severely worn, and the limit part 1091 with less contact with the adjacent injection cylinder 106 pops out and forms a seal with the adjacent injection rod 107. The sealed piston is used until the relative positions of the injection rod 107, the limit rod 109 and the adjacent limit part 1091 are adjusted to restore the seal between the adjacent injection cylinder 106, and the limit pin of the arc plate 110 and the limit groove on the adjacent limit rod 109 lose their limit, and the elastic part of the arc plate 110 drives it to pop out, and the arc plate 110 is tightly attached to the inner wall of the adjacent injection cylinder 106, so that a seal is formed between the arc plate 110 and the adjacent injection cylinder 106. After the seal between the injection rod 107 and the adjacent limit rod 109 is lost, a temporary emergency sealing effect is provided for the adjacent injection rod 107 and the adjacent injection cylinder 106 by changing the position of the limit rod 109, the limit part 1091 and the adjacent arc plate 110, thereby avoiding the failure of the seal causing part of the plastic sealing glue to flow into the bottom of the injection cylinder 106, thereby reducing the amount of glue during chip plastic sealing, thereby affecting the quality of chip plastic sealing.

[0049] When the tension spring of the first pneumatic telescopic rod 401 contracts, the first pneumatic telescopic rod 401 drives the adjacent support plate 402 to move to the left, and the support plate 402 drives the telescopic end of the adjacent second pneumatic telescopic rod 6 to move to the left. The second pneumatic telescopic rod 6 extracts the gas in the cavity of the lower mold 101 through the conduit. After the seal between the injection rod 107 and the adjacent injection cylinder 106 fails, a negative pressure is formed inside the cavity of the lower mold 101, and the gas in the first pneumatic telescopic rod 401 is injected into the bottom of the adjacent injection cylinder 106, temporarily preventing the plastic encapsulating glue from flowing downward along the sealing gap between the injection rod 107 and the adjacent injection cylinder 106, thereby squeezing and guiding the plastic encapsulating glue into the cavity of the lower mold 101 through the gas, preventing the plastic encapsulating glue from flowing downward and causing the amount of glue squeezed out by the injection rod 107 to decrease, thereby ensuring the quality of the chip plastic encapsulation.

[0050] When a chip is sealed, the operator opens the second electromagnetic slider 901 through the control panel, and clamps the chip through the above steps, removes and collects the sealed chip, and then the operator seals the next chip through the above steps. When the operator needs to stop using the device, the operator controls the first electromagnetic slider 102, the first electrically controlled telescopic rod 104, the second electromagnetic slider 901, the second electrically controlled telescopic rod 903 and the third electromagnetic slider 905 to reset through the control panel, and closes the first electromagnetic slider 102, the first electrically controlled telescopic rod 104, the second electromagnetic slider 901, the second electrically controlled telescopic rod 903 and the third electromagnetic slider 905. If the telescopic end of the first pneumatic telescopic rod 401 moves, it means that the sealing effect between the corresponding injection cylinder 106 and the adjacent glue injection rod 107 is reduced, and the operator disassembles and repairs it for the next use.

[0051] Existing chips require heating the sealing block during the sealing process, which causes the chip temperature to be high after sealing. If the external ambient temperature is low at this time, when the sealed chip is removed, the temperature of the high-temperature chip drops suddenly, causing the chip to crack or delaminate.

[0052] Example 2: Based on Example 1, Figure 13 and Figure 14 As shown, it also includes circumferentially distributed fixed blocks 10, which are fixedly connected to adjacent connecting rods 906. The number of fixed blocks 10 is the same as the number of third electromagnetic sliders 905. An exhaust pipe 1001 connected to an external heating device is provided in the fixed block 10. The external heating device is electrically connected to the control panel, wherein the external heating device is not shown in the figure. The exhaust pipe 1001 is provided with an exhaust port. A sealing plate 1002 is slidingly connected in the fixed block 10 to seal the exhaust port of the adjacent exhaust pipe 1001. The cross-section of plate 1002 is L-shaped. The sealing plate 1002 is used to seal the exhaust port of the adjacent exhaust pipe 1001. A thermistor block 1003 is provided in the fixed block 10 near the adjacent sealing plate 1002. The thermistor block 1003 will expand when heated (for example, paraffin, which will begin to melt and expand at 60°). The sealing plate 1002 is fixedly connected to the adjacent thermistor block 1003, and is used to drive the adjacent sealing plate 1002 to move up and down according to the external ambient temperature, and adaptively seal the exhaust port of the adjacent exhaust pipe 1001.

[0053] During the process of the connecting rod 906 clamping the chip, the connecting rod 906 drives the fixed block 10 to move so that the fixed block 10 is located at the lower side of the chip. The operator transports hot steam to the exhaust pipe 1001 through an external heating device. The hot steam is discharged through the exhaust port of the exhaust pipe 1001 to preheat the chip before plastic sealing, so as to avoid the chip being deformed by thermal stress due to the high plastic sealing temperature when the chip is directly plastic sealed. The thermistor 1003 drives the adjacent sealing plate 1002 to move according to the ambient temperature. When the ambient temperature is high, the thermistor 1003 expands and drives the adjacent sealing plate 1002 to move downward, which discharges the adjacent exhaust pipe 1001. The air vent is blocked to reduce the discharge of hot steam. When the ambient temperature is low, the thermistor block 1003 contracts and drives the adjacent blocking plate 1002 to move upward, and the blocking plate 1002 gradually loses its blocking of the exhaust port on the adjacent exhaust pipe 1001. The chip before plastic sealing is preheated according to the external ambient temperature. After the chip is plastic-sealed, the temperature of the chip after plastic sealing is high. As the chip temperature decreases, the amount of hot steam discharged from the exhaust port on the exhaust pipe 1001 gradually increases, and the chip after plastic sealing is slowly cooled to avoid a sudden drop in chip temperature due to the low external ambient temperature after the chip is plastic-sealed, thereby preventing the chip from cracking or stratification due to sudden cooling of the chip after plastic sealing.

[0054] In summary, the above are only preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A chip encapsulation device with an automatic loading function, comprising a housing (1), a lower mold (101) with a cavity fixedly connected to the housing (1), the cavity of the lower mold (101) being provided with an exhaust hole, a first electromagnetic slider (102) being slidably connected to the housing (1) via a first electromagnetic slide rail, an upper mold (103) being fixedly connected to the first electromagnetic slider (102), a first electrically controlled telescopic rod (104) being fixedly connected to a position near the lower mold (101) in the housing (1), a connecting plate (105) being fixedly connected to the telescopic end of the first electrically controlled telescopic rod (104), and injection cylinders (106) distributed in a linear array being fixedly connected to the lower side of the lower mold (101), wherein: The invention also includes injection rods (107) distributed in a linear array, the injection rods (107) are sealingly and slidingly connected to the adjacent injection cylinders (106), the injection rods (107) are fixedly connected to the connecting plate (105), the injection rods (107) are rotatably connected to a rotating rod (108) that is slidably and rotatably connected to the housing (1), the rotating rods (108) are slidably connected to a symmetrically distributed limiting rod (109) on a side close to the adjacent injection cylinder (106), an elastic member is fixedly connected between the limiting rod (109) and the adjacent rotating rod (108), a limiting portion (1091) is provided on the limiting rod (109), and a loading assembly (9) for loading is provided on the housing (1); A symmetrically distributed arc-shaped plate (110) is slidably connected to the symmetrically distributed limiting rod (109) in the injection rod (107), an elastic member is fixed between the arc-shaped plate (110) and the adjacent injection rod (107), and the arc-shaped plate (110) is limitedly matched with the adjacent limiting rod (109); The material of the limiting rod (109) on the side close to the adjacent injection cylinder (106) is flexible, and the limiting rod (109) is sealed and fitted with the inner wall of the adjacent injection cylinder (106). There is a gap between the limiting portion (1091) and the adjacent injection cylinder (106), and there is also a gap between the arc plate (110) and the adjacent injection cylinder (106); the injection rod (107) is located in the adjacent injection cylinder (106) and is close to the connecting plate (105) and is provided with a first inclined surface (3).

2. The chip encapsulation equipment with automatic loading function according to claim 1, characterized in that: A first pneumatic telescopic rod (401) distributed in a linear array is fixedly connected in the shell (1), and the first pneumatic telescopic rod (401) is connected to the adjacent injection cylinder (106) through a conduit. An air bag is fixedly connected to and connected to the conduit of the first pneumatic telescopic rod (401), and a support plate (402) is fixedly connected to the telescopic end of the first pneumatic telescopic rod (401). A tension spring is fixedly connected between the first pneumatic telescopic rod (401) and the adjacent support plate (402). A rack (403) slidably connected to the shell (1) is fixedly connected to the support plate (402), and a gear (404) meshing with the adjacent rack (403) is spline-connected on the rotating rod (108). A rotating ring (405) distributed in a linear array is fixedly connected in the shell (1) near the gear (404) distributed in the linear array, and the rotating ring (405) is rotatably connected to the adjacent gear (404).

3. The chip encapsulation equipment with automatic loading function according to claim 2, characterized in that: The number of teeth of the gear (404) is four times the number of teeth of the adjacent rack (403).

4. The chip encapsulation equipment with automatic loading function according to claim 2, characterized in that: A second pneumatic telescopic rod (6) distributed in a linear array is fixedly connected to the support plate (402) distributed in a linear array in the housing (1), and the telescopic end of the second pneumatic telescopic rod (6) is fixedly connected to the adjacent support plate (402). The second pneumatic telescopic rod (6) is connected to the exhaust hole of the upper cavity of the lower mold (101) through a conduit. A one-way valve is installed at a position of the conduit adjacent to the second pneumatic telescopic rod (6). An exhaust hole is provided on the fixed part of the second pneumatic telescopic rod (6), and an exhaust valve is installed at the exhaust hole. The exhaust valve of the second pneumatic telescopic rod (6) is squeezed and fitted with its telescopic end.

5. The chip encapsulation equipment with automatic loading function according to claim 4, characterized in that: A second inclined surface (7) is provided on the telescopic end of the second pneumatic telescopic rod (6) at a position away from the adjacent support plate (402).

6. The chip encapsulation equipment with automatic loading function according to claim 4, characterized in that: The loading assembly (9) includes a second electromagnetic slider (901), a second electromagnetic slide rail is provided on the housing (1), the second electromagnetic slider (901) is slidably connected to the second electromagnetic slide rail of the housing (1), a sliding frame (902) is fixedly connected to the second electromagnetic slider (901), a second electrically controlled telescopic rod (903) is fixedly connected to the sliding frame (902), the telescopic end of the second electrically controlled telescopic rod (903) is fixedly connected to a sliding plate (904), the sliding plate (904) is slidably connected to a circumferentially distributed third electromagnetic slider (905) through a circumferentially distributed third electromagnetic slide rail, and the third electromagnetic slider (905) is fixedly connected to a connecting rod (906).

7. The chip encapsulation equipment with automatic loading function according to claim 6, characterized in that: The invention also includes circumferentially distributed fixed blocks (10), the fixed blocks (10) being fixedly connected to the adjacent connecting rods (906), the number of the fixed blocks (10) being the same as the number of the third electromagnetic sliders (905), an exhaust pipe (1001) communicating with an external heating device being provided in the fixed blocks (1001), the exhaust pipe (1001) being provided with an exhaust port, a blocking plate (1002) being slidingly connected in the fixed blocks (10) and cooperating with the exhaust port of the adjacent exhaust pipe (1001), a thermal block (1003) being provided in the fixed blocks (10) near the adjacent blocking plate (1002), the blocking plate (1002) being fixedly connected to the adjacent thermal block (1003).

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