A vibration reduction base for high-precision semiconductor integrated circuit production equipment in clean rooms

Abstract

The present invention relates to the technical field of integrated circuit processing equipment, and discloses a vibration-damping base for high-precision semiconductor integrated circuit production equipment in a clean room, comprising a bottom shell, wherein the bottom shell comprises a surrounding shell and a bottom plate, a first support frame and a second support frame are arranged inside the surrounding shell, the first support frame and the second support frame are both arranged on the top of the surrounding shell through a shock-absorbing connector, a plurality of shock-absorbing connectors are arranged, and are distributed on the inner wall of the surrounding shell, the shock-absorbing connector comprises a horizontally arranged U-shaped fixing frame, both sides and the bottom surface of the U-shaped fixing frame are both provided with a first damping shock-absorbing pad, the opening of the U-shaped fixing frame faces upward and the surrounding shell is provided with a long strip hole corresponding to the U-shaped fixing frame, the side edges of the first support frame and the second support frame are both provided with a plug-in portion corresponding to the U-shaped fixing frame, a connecting nut is arranged at the end of the plug-in portion, the plug-in portion is placed in a groove of the U-shaped fixing frame, a plurality of grooves are arranged at the bottom of the surrounding shell, and a ground anchor component is detachably arranged in the groove.

Description

Technical Field

[0001] The invention relates to the technical field of integrated circuit processing equipment, in particular to a vibration-damping base for high-precision semiconductor integrated circuit production equipment in a clean room. Background Art

[0002] In today's highly digitalized and information-based era, integrated circuits are the core components of electronic devices, and their performance and quality improvement are crucial to promoting scientific and technological progress and meeting the growing market demand. As the integrated circuit manufacturing process continues to move towards smaller process nodes, the size of transistors on the chip is getting smaller and smaller, and the circuit density is getting higher and higher. In this case, the precision requirements in the processing process have reached the nanometer level. For example, in the photolithography process, the light source of the photolithography machine is projected on the silicon wafer to form a tiny pattern. Any tiny vibration may cause the pattern to shift or blur, thereby affecting the performance and yield of the chip. In addition, in processes such as etching, ion implantation, and thin film deposition, vibration may also cause instability in process parameters, thereby affecting the consistency and reliability of the chip.

[0003] In order to reduce the impact of vibration on integrated circuit processing, the vibration-damping base for integrated circuit processing came into being and became one of the key equipment to ensure the quality and efficiency of integrated circuit production. The vibration-damping base usually adopts advanced vibration-damping materials and structural design, which can effectively absorb and isolate the vibration from the external environment and the processing equipment itself.

[0004] Chinese patent CN108799404B provides a shock-absorbing CNC machine tool base, in which a shock-absorbing box is fixed in a ground support frame, and a plurality of through openings communicating with the interior of the shock-absorbing box are opened on the upper end surface of the shock-absorbing box, and a support column is inserted into each through opening; the upper end of each support column is fixedly connected to the bottom of the machine tool support platform, and the lower end of each support column is fixedly connected to the upper end of the support block, and the lower end of each support block is connected to the bottom of the shock-absorbing box through a support spring; a plurality of horizontal sliding seats are also arranged around each support block, and each horizontal sliding seat is slidably connected to the side wall of the support block, and adjacent horizontal sliding seats corresponding to different support blocks are also connected through horizontal springs.

[0005] The technical solution provided by the above patent mainly relies on the horizontal spring to support the horizontal sliding seat horizontally to support the machine tool support platform. The use of this technical solution has the problem of insufficient support stiffness. Summary of the invention

[0006] To solve the above problems, the present invention adopts the following technical solutions.

[0007] A vibration reduction base for high-precision semiconductor integrated circuit production equipment in a clean room, comprising:

[0008] The bottom shell includes a surrounding shell and a bottom plate. The surrounding shell has openings at the upper and lower ends, and the bottom plate is arranged on the bottom surface of the surrounding shell.

[0009] Inside the enclosure, a first support frame and a second support frame are horizontally arranged from top to bottom. The first support frame and the second support frame are both arranged on the top of the enclosure through a shock-absorbing connector.

[0010] The shock-absorbing connectors are provided with a plurality of them, which are distributed on the inner wall of the enclosure. The shock-absorbing connectors include a horizontally arranged U-shaped fixing frame, both sides and the bottom surface of the U-shaped fixing frame are provided with a first damping shock-absorbing pad, the opening of the U-shaped fixing frame faces upward and the enclosure is provided with a long hole corresponding to the U-shaped fixing frame, the side edges of the first support frame and the second support frame are provided with a plug-in portion corresponding to the U-shaped fixing frame, and a connecting nut is provided at the end of the plug-in portion, the plug-in portion is placed in the groove of the U-shaped fixing frame and is threadedly connected to the connecting nut by a bolt passing through the long hole,

[0011] There are several grooves at the bottom of the enclosure, and the grooves are equipped with removable anchor components.

[0012] A plurality of tower-shaped shock absorbing components are evenly arranged between the first support frame and the second support frame, and are used to connect the first support frame and the second support frame.

[0013] The tower-type shock absorbing assembly comprises a base, a plurality of intermediate ring bodies and a top ring, wherein the intermediate ring body comprises an annular intermediate plate, a first cylinder body is arranged on the outer bottom surface of the intermediate plate, a first ring groove is arranged on the inner side of the top of the intermediate plate, the plurality of intermediate ring bodies are arranged longitudinally, and the diameters of the plurality of intermediate ring bodies decrease from bottom to top, and the first cylinder body of the upper intermediate ring body is inserted into the first ring groove of the lower intermediate ring body,

[0014] The base is detachably arranged on the second support frame, and the base includes a connecting plate, a second annular groove is arranged in the middle of the top surface of the connecting plate, the first cylinder of the lowermost intermediate ring body is inserted into the second annular groove, and a plurality of connecting holes are evenly distributed in an annular manner near the edge of the connecting plate.

[0015] The top ring includes a second cylinder, which is inserted into the first ring groove of the intermediate ring body below. The top of the second cylinder is closed and connected to a first sleeve. The inner wall of the first sleeve is provided with an internal thread. The internal thread of the first sleeve is connected to a threaded rod. A pressure plate is provided on the top of the threaded rod. A locking nut is provided on the threaded rod. Second damping shock-absorbing pads are provided in the first and second ring grooves, and a plurality of vibration-reducing mechanisms are provided on the periphery of the second support frame and the bottom plate.

[0016] Preferably, the bottom plate and the surrounding shell are an integrated structure and a first reinforcing rib is provided between the bottom plate and the surrounding shell.

[0017] Preferably, a flange portion is provided on the outer side of the top end of the surrounding shell, and a second reinforcing rib is provided between the bottom surface of the flange portion and the outer wall of the surrounding shell.

[0018] Preferably, one end of the U-shaped fixing frame is fixedly connected to the inner wall of the surrounding shell, and a third reinforcing rib is provided between the bottom surface of the end of the U-shaped fixing frame connected to the surrounding shell and the inner wall of the surrounding shell.

[0019] Preferably, the tower-type shock-absorbing assembly also includes a guide locator, which includes a telescopic rod, a spring 1 and a plurality of ring sleeves. A second sleeve is vertically arranged inside the second cylinder, and the top of the telescopic rod is inserted into the second sleeve. The number of ring sleeves is consistent with the number of intermediate ring bodies. The ring sleeves slide on the telescopic rod, and the ring sleeves are connected to the intermediate ring bodies at corresponding positions by telescopic connecting arms. The two ends of the telescopic connecting arms are respectively rotatably connected to the ring sleeves and the intermediate ring bodies. The spring sleeve is arranged on the telescopic rod, the upper end of the spring 1 is in contact with the convex ring on the outside of the telescopic rod, the lower end of the spring 1 is in contact with the connecting disk, and the ring sleeve is arranged on the upper part of the convex ring.

[0020] Preferably, third damping rubber pads are provided on both the upper and lower surfaces of the ring sleeve.

[0021] Preferably, the vibration reduction mechanism includes a pressure rod, a sliding rail and a buffer cylinder. The pressure rod is tilted and its top end is rotatably connected to the bottom of the second support frame. The sliding rail is horizontally arranged on the upper part of the bottom plate. A slider is arranged on the sliding rail. The pressure rod is rotatably connected to the slider. A push rod is arranged on one side of the slider. Piston plate 1 and piston plate 2 are arranged in the buffer cylinder. The push rod is connected to piston plate 1. A plurality of through holes are arranged on piston plate 1. Piston plate 2 is connected to one end of the buffer cylinder through spring 2. Oil is arranged in the buffer cylinder.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] The first support frame and the second support frame of the present invention are connected to the bottom shell through a shock-absorbing connector, thereby forming a whole to provide stable rigid support for the processing machine tool. When the processing machine tool generates vibration during operation, part of the vibration, including lateral and longitudinal vibration, is transmitted to the first damping shock-absorbing pad for absorption through the first support frame, and part of the longitudinal vibration is transmitted downward through the tower-type shock-absorbing assembly to the second support frame via the first support frame. When the vibration passes through the tower-type shock-absorbing assembly, the longitudinal vibration is partially absorbed by a number of second damping shock-absorbing pads and gradually diffuses outward to accelerate the diffusion speed, thereby reducing the local amplitude. The vibration that is not absorbed is absorbed by the first damping shock-absorbing pad on the shock-absorbing connector between the second support frame and the bottom shell. Through the above-mentioned vibration absorption process, the effect of vibration reduction is achieved. Compared with the prior art, the present invention adopts rigid support and multi-stage shock absorption, thereby reducing the vibration amplitude and gradually absorbing it, avoiding unnecessary oscillation caused by insufficient rigidity. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 It is an overall cross-sectional view of the present invention;

[0026] Figure 3 for Figure 2 Schematic diagram of the local structure at A in the middle;

[0027] Figure 4 for Figure 2 Schematic diagram of the local structure at B in the middle;

[0028] Figure 5 for Figure 4 Schematic diagram of the local structure at C in the middle;

[0029] Figure 6 This is a schematic diagram of the structure of a tower-type shock absorbing assembly in Embodiment 2 of the present invention;

[0030] Figure 7 It is a schematic diagram of the structure of the vibration reduction mechanism of the present invention;

[0031] Figure 8 for Figure 7 Schematic diagram of the local structure at point D in the middle.

[0032] In the figure: 1, bottom shell; 1-1, surrounding shell; 1-2, bottom plate; 1-3, first reinforcing rib; 1-4, flange portion; 1-5, second reinforcing rib; 2, first support frame; 3, second support frame; 4, shock-absorbing connector; 4-1, U-shaped fixing frame; 4-2, first damping shock-absorbing pad; 4-3, third reinforcing rib; 5, long hole; 6, plug-in portion; 7, groove; 8, anchor assembly; 9, tower-type shock-absorbing assembly; 9-1, base; 9-2, middle ring body; 9-3, top ring; 9-11, connecting plate; 9-12, second ring groove; 9-13, connecting hole; 9-21, middle plate; 9-22, first cylinder; 9-23, first ring groove; 9 -31, second cylinder; 9-32, first sleeve; 9-33, threaded rod; 9-34, pressure plate; 9-35, locking nut; 9-36, second sleeve; 10, second damping shock-absorbing pad; 11, guide locator; 11-1, telescopic rod; 11-2, spring one; 11-3, ring sleeve; 11-4, telescopic connecting arm; 11-5, convex ring; 11-6, third damping shock-absorbing pad; 12, vibration reduction mechanism; 12-1, pressure rod; 12-2, slide rail; 12-3, buffer cylinder; 12-4, slider; 12-5, push rod; 12-6, piston plate one; 12-7, piston plate two; 12-8, through hole; 12-9, spring two. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making creative work are within the scope of protection of the present invention.

[0034] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "mounted / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. Embodiment 1

[0036] like Figure 1-5 As shown, in this embodiment, a vibration reduction base for high-precision semiconductor integrated circuit production equipment in a clean room includes a bottom shell 1, the bottom shell 1 includes a surrounding shell 1-1 and a bottom plate 1-2, the surrounding shell 1-1 is open at both ends, the bottom plate 1-2 is arranged on the bottom surface of the surrounding shell 1-1, and inside the surrounding shell 1-1, a first support frame 2 and a second support frame 3 are horizontally arranged from top to bottom, and the first support frame 2 and the second support frame 3 are both arranged on the top of the surrounding shell 1-1 through a shock-absorbing connector 4.

[0037] The shock-absorbing connectors 4 are provided with a plurality of them, which are distributed on the inner wall of the enclosure 1-1. The shock-absorbing connector 4 includes a horizontally arranged U-shaped fixing frame 4-1, and the first damping shock-absorbing pads 4-2 are arranged on both sides and the bottom of the U-shaped fixing frame 4-1. The opening of the U-shaped fixing frame 4-1 faces upward and the enclosure 1-1 is provided with a long hole 5 corresponding to the U-shaped fixing frame 4-1. The sides of the first support frame 2 and the second support frame 3 are provided with a plug-in portion 6 corresponding to the U-shaped fixing frame 4-1, and a connecting nut is arranged at the end of the plug-in portion 6. The plug-in portion 6 is placed in the groove 7 of the U-shaped fixing frame 4-1 and is threadedly connected to the connecting nut by bolts passing through the long hole 5.

[0038] A plurality of grooves 7 are provided at the bottom of the enclosure 1 - 1 , and anchor assemblies 8 are detachably provided in the grooves 7 .

[0039] In this embodiment, the bottom plate 1-2 and the surrounding shell 1-1 are an integrated structure and a first reinforcing rib 1-3 is provided between the bottom plate 1-2 and the surrounding shell 1-1.

[0040] In this embodiment, a flange portion 1-4 is provided on the outer side of the top end of the surrounding shell 1-1, and a second reinforcing rib 1-5 is provided between the bottom surface of the flange portion 1-4 and the outer wall of the surrounding shell 1-1.

[0041] In this embodiment, one end of the U-shaped fixing frame 4-1 is fixedly connected to the inner wall of the surrounding shell 1-1, and a third reinforcing rib 4-3 is provided between the bottom surface of the end of the U-shaped fixing frame 4-1 connected to the surrounding shell 1-1 and the inner wall of the surrounding shell 1-1.

[0042] In this embodiment, a plurality of tower-type shock absorbing components 9 are evenly arranged between the first support frame 2 and the second support frame 3 , and are used to connect the first support frame 2 and the second support frame 3 .

[0043] In this embodiment, the tower-type shock absorbing assembly 9 includes a base 9-1, a plurality of intermediate ring bodies 9-2 and a top ring 9-3. The intermediate ring body 9-2 includes an annular intermediate plate 9-21. A first cylinder 9-22 is provided on the outer bottom surface of the intermediate plate 9-21. A first annular groove 9-23 is provided on the inner side of the top of the intermediate plate 9-21. The plurality of intermediate ring bodies 9-2 are arranged longitudinally. The diameters of the plurality of intermediate ring bodies 9-2 decrease from bottom to top. The first cylinder 9-22 of the upper intermediate ring body 9-2 is inserted into the first annular groove 9-23 of the lower intermediate ring body 9-2.

[0044] The base 9-1 is detachably arranged on the second support frame 3, and the base 9-1 includes a connecting disk 9-11, a second annular groove 9-12 is arranged in the middle of the top surface of the connecting disk 9-11, and the first cylinder 9-22 of the lowermost intermediate ring body 9-2 is inserted into the second annular groove 9-12. The connecting disk 9-11 is evenly arranged with a plurality of connecting holes 9-13 in an annular shape near the edge.

[0045] The top ring 9-3 includes a second cylinder 9-31, which is inserted into the first ring groove 9-23 of the intermediate ring body 9-2 below. The top of the second cylinder 9-31 is closed and connected to the first sleeve 9-32. The inner wall of the first sleeve 9-32 is provided with an internal thread. The internal thread of the first sleeve 9-32 is connected to the threaded rod 9-33. A pressure plate 9-34 is provided on the top of the threaded rod 9-33. A locking nut 9-35 is provided on the threaded rod 9-33. The first ring groove 9-23 and the second ring groove 9-12 are both provided with a second damping shock-absorbing pad 10.

[0046] The working principle and beneficial effects of the above technical solution are:

[0047] When in use, a floor is laid on the first support frame 2, and the processing machine tool is set on the floor. The first support frame 2 and the second support frame 3 are connected to the bottom shell 1 through the shock-absorbing connector 4, thereby forming a whole to provide stable rigid support for the processing machine tool. When the processing machine tool generates vibration during operation, part of the vibration, including lateral and longitudinal vibration, is transmitted to the first damping shock-absorbing pad 4-2 for absorption through the first support frame 2, and part of the longitudinal vibration is transmitted downward through the tower-type shock-absorbing assembly 9 to the second support frame 4 through the first support frame 2. When the vibration passes through the tower-type shock-absorbing assembly 9, the longitudinal vibration is partially absorbed by a number of second damping shock-absorbing pads 10, and gradually diffuses outward to accelerate the diffusion speed, thereby reducing the local amplitude, and the vibration that is not absorbed is absorbed by the first damping shock-absorbing pad 4-2 on the shock-absorbing connector 4 between the second support frame 4 and the bottom shell 1. Through the above vibration absorption process, the effect of vibration reduction is achieved. Compared with the prior art, the present invention adopts rigid support and absorbs through multi-stage shock absorption, thereby reducing the vibration amplitude and gradually absorbing it, avoiding unnecessary oscillation caused by insufficient rigidity. Embodiment 2

[0048] like Figure 6 As shown, in this embodiment, the tower-type shock absorbing assembly 9 also includes a guide locator 11, and the guide locator 11 includes a telescopic rod 11-1, a spring 11-2 and a plurality of ring sleeves 11-3. A second sleeve 9-36 is vertically arranged inside the second cylinder 9-31, and the top of the telescopic rod 11-1 is inserted into the second sleeve 9-36. The number of the ring sleeves 11-3 is consistent with the number of the intermediate ring bodies 9-2. The ring sleeves 11-3 slide on the telescopic rod 11-1. 1-3 is connected to the middle ring body 9-2 at the corresponding position by a telescopic connecting arm 11-4, and the two ends of the telescopic connecting arm 11-4 are rotatably connected to the ring sleeve 11-3 and the middle ring body 9-2 respectively. The spring 11-2 is sleeved on the telescopic rod 11-1, and the upper end of the spring 11-2 contacts with the convex ring 11-5 on the outer side of the telescopic rod 11-1, and the lower end of the spring 11-2 contacts with the connecting plate 9-11, and the ring sleeve 11-3 is arranged on the upper part of the convex ring 11-5.

[0049] In this embodiment, third damping rubber pads 11 - 6 are provided on both the upper and lower surfaces of the ring sleeve 11 - 3 .

[0050] The working principle and beneficial effects of the above technical solution are:

[0051] During use, when vibration is transmitted to the tower-type shock-absorbing assembly 9, when the vibration is large, the compression spring 11-2 is used to assist in absorbing the vibration energy, thereby slowing down the transmission rate of the vibration. At the same time, the middle ring body is connected to the ring sleeve, which also improves the stability of the tower-type shock-absorbing assembly 9. The telescopic rod plays the role of the central axis. At the same time, when the ring sleeves are in contact, the third damping rubber pad 11-6 can also absorb a portion of the vibration energy to play a vibration reduction role. Embodiment 3

[0052] like Figure 7-8 As shown, in the present embodiment, a plurality of vibration-damping mechanisms 12 are arranged on the periphery of the second support frame 3 and the bottom plate 1-2, and the vibration-damping mechanism 12 includes a pressure rod 12-1, a slide rail 12-2 and a buffer cylinder 12-3. The pressure rod 12-1 is tilted, and its top end is rotatably connected to the bottom of the second support frame 3. The slide rail 12-2 is horizontally arranged on the upper part of the bottom plate 1-2. A slider 12-4 is arranged on the slide rail 12-2. The pressure rod 12-1 is rotatably connected to the slider 12-4. A push rod 12-5 is arranged on one side of the slider 12-4. A piston plate 12-6 and a piston plate 2 12-7 are arranged in the buffer cylinder 12-3. The push rod 12-5 is connected to the piston plate 1 12-6. A plurality of through holes 12-8 are arranged on the piston plate 1 12-6. The piston plate 1 12-7 is connected to one end of the buffer cylinder 12-3 through a spring 2 12-9. The buffer cylinder 12-3 is filled with oil.

[0053] The working principle and beneficial effects of the above technical solution are:

[0054] When in use, the vibration is further transmitted downward via the second support frame 4, and the shock absorbing mechanism 12 drives the piston plate 12-6 to move in the buffer cylinder 12-3 through the push rod, and the oil provides resistance and absorbs the vibration, thereby reducing the vibration amplitude and the vibration frequency. The piston plate 12-6 causes the oil to flow, squeezing the piston plate 2 12-7, and the piston plate 2 12-7 squeezes the spring 2 12-9, so that the spring 2 12-9 absorbs part of the vibration, further improving the shock absorbing effect.

[0055] The above are only preferred specific implementations of the present invention; however, the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and improved concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A vibration-damping base for high-precision semiconductor integrated circuit production equipment in a clean room, characterized in that: include, A bottom shell (1), the bottom shell (1) comprising a surrounding shell (1-1) and a bottom plate (1-2), the surrounding shell (1-1) having openings at upper and lower ends, and the bottom plate (1-2) being arranged on the bottom surface of the surrounding shell (1-1). Inside the enclosure (1-1), a first support frame (2) and a second support frame (3) are horizontally arranged from top to bottom. The first support frame (2) and the second support frame (3) are both arranged on the top of the enclosure (1-1) via a shock-absorbing connecting piece (4). The shock-absorbing connecting members (4) are provided in plurality and distributed on the inner wall of the enclosure (1-1). The shock-absorbing connecting members (4) include a horizontally arranged U-shaped fixing frame (4-1), both sides and the bottom of the U-shaped fixing frame (4-1) are provided with first damping shock-absorbing pads (4-2), the opening of the U-shaped fixing frame (4-1) faces upward and the enclosure (1-1) is provided with a long hole (5) corresponding to the U-shaped fixing frame (4-1), the side edges of the first support frame (2) and the second support frame (3) are provided with a plug-in portion (6) corresponding to the U-shaped fixing frame (4-1), and a connecting nut is provided at the end of the plug-in portion (6), the plug-in portion (6) is placed in a groove (7) of the U-shaped fixing frame (4-1) and is threadedly connected to the connecting nut by a bolt passing through the long hole (5). A plurality of grooves (7) are provided at the bottom of the enclosure (1-1), and a foot assembly (8) is detachably provided in the groove (7). A plurality of tower-shaped shock absorbing components (9) are evenly arranged between the first support frame (2) and the second support frame (3) and are used to connect the first support frame (2) and the second support frame (3). The tower-type shock absorbing assembly (9) comprises a base (9-1), a plurality of intermediate ring bodies (9-2) and a top ring (9-3); the intermediate ring body (9-2) comprises an annular intermediate plate (9-21); a first cylinder (9-22) is arranged on the outer bottom surface of the intermediate plate (9-21); a first annular groove (9-23) is arranged on the inner side of the top of the intermediate plate (9-21); the plurality of intermediate ring bodies (9-2) are arranged longitudinally; the diameters of the plurality of intermediate ring bodies (9-2) decrease from bottom to top; the first cylinder (9-22) of the upper intermediate ring body (9-2) is inserted into the first annular groove (9-23) of the lower intermediate ring body (9-2); The base (9-1) is detachably mounted on the second support frame (3), and the base (9-1) comprises a connecting disk (9-11), a second annular groove (9-12) is arranged in the middle of the top surface of the connecting disk (9-11), a first cylinder (9-22) of the lowermost intermediate ring body (9-2) is inserted into the second annular groove (9-12), and a plurality of connecting holes (9-13) are evenly distributed in an annular manner near the edge of the connecting disk (9-11). The top ring (9-3) comprises a second cylinder (9-31), the second cylinder (9-31) is inserted into the first ring groove (9-23) of the intermediate ring body (9-2) below, the top of the second cylinder (9-31) is closed and connected to a first sleeve (9-32), the inner side wall of the first sleeve (9-32) is provided with an internal thread, the internal thread of the first sleeve (9-32) is connected to the threaded rod (9-33), a pressure plate (9-34) is provided at the top of the threaded rod (9-33), a locking nut (9-35) is provided on the threaded rod (9-33), a second damping shock absorbing pad (10) is provided in both the first ring groove (9-23) and the second ring groove (9-12), and a plurality of vibration reduction mechanisms (12) are provided on the periphery of the second support frame (3) and the bottom plate (1-2).

2. A vibration-damping base for high-precision semiconductor integrated circuit production equipment in a clean room according to claim 1, characterized in that: The bottom plate (1-2) and the surrounding shell (1-1) are an integrated structure, and a first reinforcing rib (1-3) is provided between the bottom plate (1-2) and the surrounding shell (1-1).

3. The vibration-damping base for high-precision semiconductor integrated circuit production equipment in a clean room according to claim 1, characterized in that: A flange portion (1-4) is provided on the outer side of the top end of the surrounding shell (1-1), and a second reinforcing rib (1-5) is provided between the bottom surface of the flange portion (1-4) and the outer wall of the surrounding shell (1-1).

4. The vibration-damping base for high-precision semiconductor integrated circuit production equipment in a clean room according to claim 1, characterized in that: One end of the U-shaped fixing frame (4-1) is fixedly connected to the inner wall of the surrounding shell (1-1), and a third reinforcing rib (4-3) is provided between the bottom surface of the end of the U-shaped fixing frame (4-1) connected to the surrounding shell (1-1) and the inner wall of the surrounding shell (1-1).

5. The vibration-damping base for high-precision semiconductor integrated circuit production equipment in a clean room according to claim 1, characterized in that: The tower-type shock absorbing assembly (9) further comprises a guide locator (11), the guide locator (11) comprising a telescopic rod (11-1), a spring (11-2) and a plurality of ring sleeves (11-3), a second sleeve (9-36) being vertically arranged inside the second cylinder (9-31), the top of the telescopic rod (11-1) being inserted into the second sleeve (9-36), the number of the ring sleeves (11-3) being the same as the number of the intermediate ring bodies (9-2), the ring sleeves (11-3) sliding on the telescopic rod (11-1), the ring sleeves (11-3) The intermediate ring body (9-2) at the corresponding position is connected by a telescopic connecting arm (11-4), and the two ends of the telescopic connecting arm (11-4) are rotatably connected to the ring sleeve (11-3) and the intermediate ring body (9-2) respectively. The spring 1 (11-2) is sleeved on the telescopic rod (11-1), the upper end of the spring 1 (11-2) is in contact with the convex ring (11-5) on the outer side of the telescopic rod (11-1), the lower end of the spring 1 (11-2) is in contact with the connecting plate (9-11), and the ring sleeve (11-3) is arranged on the upper part of the convex ring (11-5).

6. The vibration-damping base for high-precision semiconductor integrated circuit production equipment in a clean room according to claim 5, characterized in that: The third damping rubber pad (11-6) is provided on both the upper and lower surfaces of the ring sleeve (11-3).

7. The vibration-damping base for high-precision semiconductor integrated circuit production equipment in a clean room according to claim 1, characterized in that: The vibration reduction mechanism (12) comprises a pressure rod (12-1), a slide rail (12-2) and a buffer cylinder (12-3); the pressure rod (12-1) is arranged obliquely, and its top end is rotatably connected to the bottom of the second support frame (3); the slide rail (12-2) is arranged horizontally on the upper part of the bottom plate (1-2); a slider (12-4) is arranged on the slide rail (12-2); the pressure rod (12-1) is rotatably connected to the slider (12-4); the slider (12-4) is A push rod (12-5) is provided on one side, a piston plate one (12-6) and a piston plate two (12-7) are provided in the buffer cylinder (12-3), the push rod (12-5) is connected to the piston plate one (12-6), a plurality of through holes (12-8) are provided on the piston plate one (12-6), the piston plate two (12-7) is connected to one end of the buffer cylinder (12-3) via a spring two (12-9), and oil is provided in the buffer cylinder (12-3).

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