Heat treatment device, process equipment and heat treatment method

Abstract

The present disclosure provides a heat treatment device, a process equipment and a heat treatment method, which relate to the field of semiconductor processing technology. The heat treatment device includes: a lamp board, the lamp board is provided with a receiving groove; a radiation heater, at least part of the radiation heater is located in the receiving groove, and the heat energy radiated by the radiation heater is used to heat the workpiece; a shield, the inner surface of the shield facing the radiation heater is provided with a reflective layer, and the reflective layer is used to reflect heat energy; the shield is movably connected to the lamp board, and the shield is used to switch between a first position and a second position under the action of a driving force; when located in the first position, the shield is located between the radiation heater and the lamp board, so that the heat energy released by the radiation heater can be radiated to the workpiece; when located in the second position, the shield is located between the radiation heater and the workpiece, so that the shield can block the heat energy released by the radiation heater from being radiated to the workpiece; a driving mechanism, the driving mechanism is connected to the shield, and the driving mechanism is used to provide a driving force.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor processing technology, and in particular to a heat treatment device, process equipment and a heat treatment method. Background Art

[0002] In semiconductor technology, rapid thermal processing is a process that uses a thermal processing device to heat the wafer to a high temperature (about 1000 degrees Celsius) in a short time (a few seconds or less). How to design the thermal processing device to ensure the production yield of the wafer is one of the current research directions. Summary of the invention

[0003] The present disclosure provides a heat treatment device, process equipment and a heat treatment method.

[0004] According to one aspect of the present disclosure, a heat treatment device is provided, comprising: a lamp board, the lamp board being provided with a receiving groove; a radiation heater, at least a part of the radiation heater being located in the receiving groove, and heat energy radiated by the radiation heater being used to heat a workpiece; a shield, the inner surface of the shield facing the radiation heater being provided with a reflection layer, and the reflection layer being used to reflect the heat energy; the shield being movably connected to the lamp board, and the shield being used to switch between a first position and a second position under the action of a driving force; when located at the first position, the shield is located between the radiation heater and the lamp board, so that the heat energy released by the radiation heater can be radiated to the workpiece; when located at the second position, the shield is located between the radiation heater and the workpiece, so that the shield can block the heat energy released by the radiation heater from being radiated to the workpiece; a driving mechanism, the driving mechanism being connected to the shield, and the driving mechanism being used to provide the driving force.

[0005] In some embodiments, a groove wall of the receiving groove is connected to a first absorption layer, and the first absorption layer is used to absorb the heat energy.

[0006] In some embodiments, a second absorption layer is disposed on an outer surface of the shield facing away from the radiant heater, and the second absorption layer is used to absorb thermal energy.

[0007] In some embodiments, the shield is arc-shaped, and a focal point of the shield is located on the radiation heater.

[0008] In some embodiments, the groove wall of the receiving groove is arc-shaped, and the focus of the groove wall of the receiving groove is located on the radiation heater.

[0009] In some embodiments, the groove wall of the receiving groove has a first edge facing the workpiece; when the shield is in the second position, the inner surface of the shield has a second edge facing away from the workpiece; the first edge, the second edge and the radiation heater respectively correspond to a first orthographic projection, a second orthographic projection and a third orthographic projection on a preset projection plane, and the second orthographic projection is located on the side of the first orthographic projection facing the third orthographic projection; the preset projection plane is parallel to the surface of the workpiece facing the radiation heater.

[0010] In some embodiments, the distance between the first edge and the workpiece is less than or equal to the distance between the second edge and the workpiece.

[0011] In some embodiments, a cooling channel is provided in the lamp board, so that the fluid entering the cooling channel can exchange heat with the lamp board.

[0012] In some embodiments, the driving mechanism includes: a motor and a transmission gear, the output end of the motor is meshed with the transmission gear, and the transmission gear is connected to the shield to drive the shield to rotate between the first position and the second position.

[0013] In some embodiments, there are multiple radiation heaters, and the multiple radiation heaters are arranged side by side; the multiple radiation heaters are respectively provided with corresponding shields; the multiple shields are respectively connected to the transmission gears; and two adjacent transmission gears are meshed.

[0014] In some embodiments, among the plurality of transmission gears arranged side by side, the relatively middle transmission gear is meshed with the output end of the motor.

[0015] In some embodiments, the heat treatment device also includes: a first fixing frame, the first fixing frame is respectively connected to the radiation heater and the lamp board, and the first fixing frame is arranged close to the end of the radiation heater; a second fixing frame, the second fixing frame is connected to the light board; the second fixing frame is provided with a mounting hole, and the protective cover is rotatably arranged in the mounting hole.

[0016] In some embodiments, the radiation heater is inserted into the mounting hole, and the second fixing bracket is located on a side of the first fixing bracket that is away from a corresponding end of the radiation heater.

[0017] According to another aspect of the present disclosure, a process equipment is provided, comprising: a heat treatment device as described in any one of the above.

[0018] According to another aspect of the present disclosure, there is provided a heat treatment method, comprising:

[0019] Before heat treatment, controlling the driving mechanism to drive the shield to move to a first position;

[0020] When performing heat treatment, the radiation heater is controlled to work so that the heat energy released by the radiation heater can be radiated to the workpiece; wherein a part of the heat energy released by the radiation heater can be radiated to the shield and reflected to the workpiece by the reflective layer inside the shield;

[0021] After the heat treatment is completed, the driving mechanism is controlled to drive the shield to move to the second position, so that the shield can block the heat energy released by the radiation heater from being radiated to the workpiece.

[0022] According to the heat treatment device disclosed in the present invention, when the workpiece is heat treated, the shield can move between the radiation heater and the lamp board, and the heat energy radiated to the workpiece by the radiation heater can be accumulated with the heat energy reflected to the workpiece by the reflective layer of the shield, so as to achieve lower energy consumption and higher heating efficiency; after the heat treatment is completed, the shield can move between the radiation heater and the workpiece, so that the shield can block the heat energy released by the radiation heater from being radiated to the workpiece, thereby facilitating the rapid cooling of the space where the workpiece is located.

[0023] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings are used to better understand the present solution and do not constitute a limitation of the present disclosure.

[0025] Figure 1 is a schematic structural diagram of a heat treatment device according to an embodiment of the present disclosure;

[0026] Figure 2 is a schematic structural diagram of a heat treatment device (when the shield is located at a first position) according to an embodiment of the present disclosure;

[0027] Figure 3 is a structural schematic diagram of a heat treatment device according to an embodiment of the present disclosure (when the shield is located at the second position);

[0028] Figure 4 is a schematic structural diagram of a heat treatment device (when the shield is located at a first position) according to another embodiment of the present disclosure;

[0029] Figure 5 is a structural schematic diagram of a heat treatment device according to another embodiment of the present disclosure (when the shield is located at the second position);

[0030] Figure 6is a partial structural schematic diagram of a heat treatment device according to an embodiment of the present disclosure;

[0031] Figure 7 is a schematic diagram of the coordination of the shield, the transmission gear and the output end of the motor according to an embodiment of the present disclosure;

[0032] Figure 8 It is a schematic flow chart of a heat treatment method according to an embodiment of the present disclosure.

[0033] Explanation of the reference numerals: 100 - lamp board; 101 - receiving groove; 102 - first absorption layer; 103 - cooling channel; 200 - shield; 201 - reflection layer; 202 - second absorption layer; 203 - transmission gear; 204 - second fixing frame; 300 - radiation heater; 301 - wick; 302 - glass cover; 303 - end seat; 304 - first fixing frame; 400 - driving mechanism; 401 - motor; 402 - output gear; 500 - workpiece. DETAILED DESCRIPTION

[0034] The following is a description of exemplary embodiments of the present disclosure in conjunction with the accompanying drawings, including various details of the embodiments of the present disclosure to facilitate understanding, which should be considered as merely exemplary. Therefore, it should be recognized by those of ordinary skill in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the present disclosure. Similarly, for the sake of clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0035] Figure 1 is a schematic structural diagram of a heat treatment device according to an embodiment of the present disclosure; Figure 2 is a schematic structural diagram of a heat treatment device (when the shield is located at a first position) according to an embodiment of the present disclosure; Figure 3 is a schematic diagram of the structure of a heat treatment device according to an embodiment of the present disclosure (when the shield is in the second position). Figure 2 and Figure 3 Is the heat treatment device along Figure 1 A schematic diagram of a partial cross section in the left-right direction (lateral direction); Figure 2 and Figure 3 The dashed arrows in the figure are used to indicate the radiation direction of some heat energy.

[0036] Please refer to Figure 1 and Figure 3 The heat treatment device provided in this embodiment includes: a lamp board 100, a shield 200, a radiation heater 300, and a driving mechanism 400. For ease of description, the direction from the lamp board 100 toward the workpiece 500 is referred to as the downward direction, and the upward and downward directions are referred to as the vertical direction.

[0037] The light board 100 is used to install components such as the shield 200 and the radiation heater 300. Exemplarily, the light board 100 may be a plate body with a preset thickness, and the light board 100 may be in a rectangular or circular shape.

[0038] The lamp board 100 is provided with a receiving groove 101, and at least part of the radiation heater 300 is located in the receiving groove 101. Exemplarily, the notch of the receiving groove 101 is located on the lower surface of the lamp board 100 facing the workpiece 500. The depth and width of the receiving groove 101 can be set according to actual needs.

[0039] The upper portion of the radiation heater 300 is located in the receiving groove 101 , so that more heat energy released by the radiation heater 300 can be radiated to the workpiece 500 . In other examples, the radiation heater 300 may also be entirely located in the receiving groove 101 .

[0040] The radiation heater 300 is in a columnar shape (or a long strip shape). For ease of description, the axial direction of the radiation heater 300 is taken as its length direction (or longitudinal direction), the direction in which the radiation heater 300 radiates vertically to the workpiece 500 is taken as the height direction (or vertical direction), and the direction perpendicular to the height direction and the length direction is taken as the width direction (or transverse direction, i.e., left-right direction). The longitudinal, vertical and transverse directions of the heat treatment device are consistent with the radiation heater 300 as an example for description.

[0041] In some examples, the radiation heater 300 includes a wick 301 and a glass cover 302, wherein the wick 301 is located in the glass cover 302. The wick 301 includes a tungsten wire. In other examples, the radiation heater 300 may also be a laser device or a heating wire.

[0042] Generally speaking, the lamp panel 100 is provided with a plurality of receiving slots 101, and the plurality of receiving slots 101 are arranged side by side along the width direction. Each receiving slot 101 is respectively provided with a radiation heater 300, and the distribution of the radiation heater 300 is the same as the distribution of the receiving slots 101. Accordingly, each radiation heater 300 is correspondingly provided with a shield 200, and the distribution of the shield 200 is the same as the distribution of the radiation heater 300.

[0043] The shield 200 is movably connected to the lamp board 100, and the shield 200 is used to switch between the first position and the second position under the action of the driving force. When the shield 200 is in the first position, the shield 200 is located between the radiation heater 300 and the lamp board 100, so that the heat energy released by the radiation heater 300 can be radiated to the workpiece 500. When the shield 200 is in the second position, the shield 200 is located between the radiation heater 300 and the workpiece 500, so that the shield 200 can block the heat energy released by the radiation heater 300 from being radiated to the workpiece 500.

[0044] The inner surface of the shield 200 facing the radiation heater 300 is provided with a reflective layer 201, and the reflective layer 201 is used to reflect heat energy. The reflective layer 201 can be a gold-plated layer or a layer structure made of other materials capable of reflecting heat energy. The reflective layer 201 can be bonded and fixed to the inner surface of the shield 200, or the reflective layer 201 can be prepared on the inner surface of the reflective layer 201 by a sputtering process, a surface coating technology, or a thin film deposition technology.

[0045] Take one of the corresponding radiation heaters 300, shield 200 and receiving slot 101 as an example. Figure 2 As shown, when the shield 200 is located at the first position, at least a portion of the shield 200 is located in the receiving groove 101, and the shield 200 is located between the groove wall of the receiving groove 101 and the radiation heater 300. For example, the lower edge of the shield 200 when located at the first position is flush with the lower edge of the receiving groove 101, or the lower edge of the shield 200 when located at the first position is located above the lower edge of the receiving groove 101, or the lower edge of the shield 200 when located at the first position is located below the lower edge of the receiving groove 101.

[0046] There are spacings between the shield 200 and the radiation heater 300 and the groove wall of the receiving groove 101, so that the shield 200 has enough movement space. The spacings between the shield 200 and the radiation heater 300 and the spacings between the shield 200 and the groove wall of the receiving groove 101 can be equal or unequal, and can be set according to actual needs.

[0047] When the radiation heater 300 is working, the radiation heater 300 releases heat energy uniformly in all directions. A portion of the heat energy released by the radiation heater 300 can be radiated to the workpiece 500. The area covered by the heat energy radiated by the radiation heater 300 on the workpiece 500 is roughly rectangular, hereinafter referred to as the rectangular area. Figure 2 In the left and right directions of the figure, the heat energy directly radiated by the radiant heater 300 to the rectangular area is distributed in a gradient. Specifically, the heat energy radiated by the radiant heater 300 vertically to the workpiece 500 near the center of the rectangular area is higher; along the direction from the center of the rectangular area to the edge, the heat energy radiated by the radiant heater 300 to the rectangular area is distributed in a linear decreasing manner.

[0048] like Figure 2 As shown by the dotted arrows in , part of the heat energy released by the radiation heater 300 can be radiated to the shield 200, and under the reflection effect of the reflective layer 201 inside the shield 200, this part of the heat energy can be irradiated to the workpiece 500. The heat energy reflected by the reflective layer 201 to the rectangular area is distributed in a state where the area close to the center is low and the area close to the edge is high; that is, the heat energy reflected by the reflective layer 201 to the rectangular area gradually increases from the center to the edge.

[0049] In this way, the heat energy radiated to the workpiece 500 by the radiation heater 300 can be accumulated with the heat energy reflected to the workpiece 500 by the reflective layer 201, thereby reducing the lateral temperature gradient of the workpiece 500 and improving the consistency of the heat energy irradiated to the workpiece 500, achieving lower energy consumption and higher heating efficiency, thereby improving the yield and quality of the workpiece 500.

[0050] like Figure 3 As shown, after the heat treatment is completed, under the action of the driving force provided by the driving mechanism 400, when the shield 200 moves to the second position, the shield 200 is located between the radiation heater 300 and the workpiece 500, and the radiation heater 300 is located in the space surrounded by the shield 200 and the groove wall of the receiving groove 101. At this time, the radiation heater 300 will still release some heat energy, part of which will be radiated in the direction toward the workpiece 500. Since the shield 200 is located between the radiation heater 300 and the workpiece 500, and the surface of the shield 200 facing the radiation heater 300 is provided with a reflective layer 201, the reflective layer 201 reflects this part of the heat energy in the direction toward the groove wall of the receiving groove 101, so that the shield 200 can block the heat energy released by the radiation heater 300 from being radiated to the workpiece 500, which is conducive to the rapid cooling of the space where the workpiece 500 is located and ensures the quality of the workpiece 500.

[0051] Optionally, the groove wall of the receiving groove 101 is connected with an absorption layer for absorbing heat energy, or a cooling channel is provided in the lamp board 100, so as to further improve the cooling speed.

[0052] like Figure 1 and Figure 6 As shown, the driving mechanism 400 mainly provides a driving force for driving the shield 200 to move from the first position to the second position, and a driving force for driving the shield 200 to move from the second position to the first position. Exemplarily, the driving mechanism 400 includes a motor 401, and the motor 401 is connected to the shield 200 by transmission, for example, the output shaft of the motor 401 is connected to the shield 200 through a coupling, or the motor 401 is connected to the shield 200 through a gear; when the motor 401 rotates in a clockwise direction, it can drive the shield 200 to rotate from the first position to the second position; when the motor 401 rotates in a counterclockwise direction, it can drive the shield 200 to rotate from the second position to the first position. Among them, multiple shields 200 can be respectively provided with corresponding motors 401, or at least two shields 200 are connected to one motor 401 by transmission. In other examples, the driving mechanism 400 may include a linear drive member such as a cylinder that outputs linear motion, and a transmission component such as a screw nut or a gear rack that can convert linear motion into rotational motion.

[0053] In other embodiments, the driving mechanism 400 can realize the switching of the shield 200 between the first position and the second position by driving the shield 200 to move and rotate. The specific structure of the driving mechanism 400 can be set according to actual needs.

[0054] The heat treatment device provided in the present embodiment, through the above-mentioned arrangement, when the workpiece 500 is heat treated, the shield 200 can move between the radiation heater 300 and the lamp board 100, and the heat energy radiated to the workpiece 500 by the radiation heater 300 can be accumulated with the heat energy reflected to the workpiece 500 by the reflective layer 201 of the shield 200, thereby reducing the lateral temperature gradient of the workpiece 500, improving the consistency of the heat energy irradiated to the workpiece 500, and achieving lower energy consumption and higher heating efficiency; after the heat treatment is completed, the shield 200 can move between the radiation heater 300 and the workpiece 500, so that the shield 200 can block the heat energy released by the radiation heater 300 from being radiated to the workpiece 500, thereby facilitating the rapid cooling of the space where the workpiece 500 is located, thereby improving the yield rate and the quality of the workpiece 500.

[0055] In some embodiments, in order to make the arrangement of the components of the heat treatment device more compact, the groove wall of the receiving groove 101 is arc-shaped, and the focus of the groove wall of the receiving groove 101 is located on the radiation heater 300, specifically, it can be located on the wick 301. The cross-section of the groove wall of the receiving groove 101 is roughly semicircular. In this way, it can not only prevent the groove wall of the receiving groove 101 from interfering with the heat energy released by the radiation heater 300 to radiate to the workpiece 500, but also provide sufficient space for the movement of the shield 200; moreover, when the shield 200 is in the second position, the groove wall of the receiving groove 101 and the shield 200 can confine the heat energy released by the radiation heater 300 to a smaller space, which is conducive to the rapid cooling of the space where the workpiece 500 is located. In other embodiments, the cross-section of the receiving groove 101 can be roughly rectangular or trapezoidal.

[0056] Figure 4 is a schematic structural diagram of a heat treatment device (when the shield is located at a first position) according to another embodiment of the present disclosure; Figure 5 is a schematic structural diagram of a heat treatment device according to another embodiment of the present disclosure (when the shield is in the second position). Figure 4 and Figure 5 Is the heat treatment device along Figure 1 A schematic diagram of a partial cross section in the left-right direction (lateral direction); Figure 4 and Figure 5 The dashed arrows in the figure are used to indicate the radiation direction of some heat energy.

[0057] In some examples, the groove wall of the receiving groove 101 is connected to a first absorption layer 102, and the first absorption layer 102 is used to absorb heat energy. The first absorption layer 102 is made of a material that can absorb heat. The first absorption layer 102 can be bonded and fixed to the groove wall of the receiving groove 101, or the first absorption layer 102 can be prepared on the groove wall of the receiving groove 101 by surface coating technology or thin film deposition technology.

[0058] like Figure 5 As shown, after the heat treatment is completed and after the shield 200 moves to the second position, a portion of the heat energy radiated by the radiation heater 300 will be radiated in the direction toward the workpiece 500, and the reflective layer 201 of the shield 200 will reflect this portion of the heat energy in the direction toward the groove wall of the receiving groove 101, so that the first absorption layer 102 can absorb this portion of the heat energy, thereby facilitating the rapid cooling of the space where the workpiece 500 is located.

[0059] In some embodiments, the shield 200 is arc-shaped, the inner surface of the shield 200 is concave, and the outer surface of the shield 200 is convex; the focus of the inner surface of the shield 200 is located on the radiation heater 300, specifically on the wick. Among them, the rotation axis of the shield 200 passes through its focus. The receiving groove 101, the shield 200 and the radiation heater 300 can be coaxially arranged. The cross section of the shield 200 is roughly semicircular. This is conducive to the shield 200 located in the first position to reflect more heat energy to the workpiece 500, and it is conducive to the shield 200 located in the second position to better block the heat energy released by the radiation heater 300 from radiating to the workpiece 500. In other embodiments, the cross section of the shield 200 can be a rectangular shape with an opening or a trapezoidal shape with an opening.

[0060] In some examples, the outer surface of the shield 200 facing away from the radiation heater 300 is provided with a second absorption layer 202, and the second absorption layer 202 is used to absorb heat energy. The second absorption layer 202 is made of a material capable of absorbing heat. The second absorption layer 202 can be bonded and fixed to the outer surface of the radiation heater 300, or the second absorption layer 202 can be prepared on the outer surface of the radiation heater 300 by surface coating technology or thin film deposition technology.

[0061] like Figure 5As shown, after the heat treatment is completed and the shield 200 moves to the second position, part of the heat energy radiated by the radiation heater 300 will be radiated in the direction toward the workpiece 500, and the reflective layer 201 of the shield 200 will reflect most of the heat energy in the direction toward the groove wall of the receiving groove 101, so that the first absorption layer 102 can absorb this part of the heat energy, and the second absorption layer 202 of the shield 200 can absorb a small amount of heat energy that is not reflected, thereby facilitating the rapid cooling of the space where the workpiece 500 is located. In addition, most of the heat energy in the space where the workpiece 500 is located, such as the heat energy released by the workpiece 500, the quartz plate used to carry the workpiece 500, etc., can be absorbed by the second absorption layer 202, and a small part is reflected to the outside of the workpiece 500 through the convex surface, which is conducive to the rapid cooling of the workpiece 500.

[0062] In a specific implementation, the first absorption layer 102 is connected to the groove wall of the receiving groove 101, and the second absorption layer 202 is provided on the outer surface of the shield 200 away from the radiation heater 300. In this way, when the shield 200 is located at the second position, the heat energy radiated downward by the radiation heater 300 is irradiated to the shield 200, and the reflection layer 201 of the shield 200 reflects most of the heat energy in the direction toward the groove wall of the receiving groove 101, and the second absorption layer 202 of the shield 200 can absorb a small amount of heat energy that is not reflected; the heat energy reflected by the reflection layer 201 will irradiate to the first absorption layer 102 in the receiving groove 101, and most of the heat energy will be absorbed by the first absorption layer 102, and the heat energy that is not absorbed will irradiate to the shield 200 again, and the reflection layer 201 of the shield 200 will reflect most of the heat energy to the first absorption layer 102 again, and the second absorption layer 202 of the shield 200 can absorb a small amount of heat energy that is not reflected. In this way, the heat energy radiated by the radiation heater 300 can be repeatedly reflected and absorbed in the space defined by the groove wall of the receiving groove 101 and the protective cover 200, thereby quickly reducing the temperature of the space where the workpiece 500 is located; wherein a small amount of heat energy radiated by the radiation heater 300 is absorbed by the second absorption layer 202, and most of the heat energy is absorbed by the first absorption layer 102.

[0063] like Figure 3 or Figure 5 As shown, in some embodiments, the groove wall of the receiving groove 101 has a first edge facing the workpiece 500 (i.e., the lower edge of the receiving groove 101); when the shield 200 is located at the second position, the inner surface of the shield 200 has a second edge facing away from the workpiece 500 (i.e., the upper edge of the shield 200 located at the second position). Taking the surface parallel to the upper surface of the workpiece 500 as the preset projection surface, the first edge, the second edge and the heating radiator respectively correspond to the first orthographic projection, the second orthographic projection and the third orthographic projection on the projection surface, and the second orthographic projection is located on the side of the first orthographic projection facing the third orthographic projection; in other words, Figure 3 or Figure 5The vertical center line passing through the center of the cross section of the radiation heater 300 is a reference line, and the distance between the first edge and the reference line is greater than the distance between the second edge and the reference line. In this way, the reflective layer 201 of the shield 200 can reflect the heat energy radiated downward by the radiation heater 300 into the receiving groove 101.

[0064] In some examples, the distance between the first edge and the upper surface of the workpiece 500 is less than or equal to the distance between the second edge and the upper surface of the workpiece 500. That is, the first edge may be flush with the second edge, or the first edge may be lower than the second edge. In this way, the groove wall of the receiving groove 101 and the shield 200 can better surround the radiation heater 300, reduce or even prevent the heat energy released by the radiation heater 300 from being radiated to the outer side of the shield 200 away from the radiation heater 300, thereby facilitating the rapid cooling of the space where the workpiece 500 is located.

[0065] In other examples, the first edge may also be slightly higher than the second edge, as long as the reflective layer 201 of the shield 200 can reflect the heat energy radiated downward by the radiation heater 300 into the receiving groove 101 .

[0066] like Figure 1 As shown, in some embodiments, a cooling channel 103 is provided in the lamp board 100 , so that the fluid entering the cooling channel 103 can exchange heat with the lamp board 100 , thereby achieving cooling of the radiation heater 300 .

[0067] The cooling channel 103 may include a plurality of sub-channels, and the axial directions of the plurality of sub-channels are respectively perpendicular to the axial direction of the radiation heater 300, that is, the axial directions of the plurality of sub-channels are parallel to the width direction of the lamp board 100. There is a preset spacing between two adjacent sub-channels, and the inlet ends of the two adjacent sub-channels can be connected by a diverter, and the outlet ends of the two adjacent sub-channels can be connected by a confluence, so as to simplify the cooling pipeline; wherein the diverter is used to divert the cooling fluid so that the diverted fluid can enter the corresponding plurality of sub-channels; the confluence is used to converge the fluid flowing out of the plurality of sub-channels and then discharge it outside the heat treatment device. In other examples, the axial direction of the sub-channel may also be parallel to the axial direction of the radiation heater 300 (that is, the length direction of the lamp board 100).

[0068] In other examples, the lower surface of the lamp board 100 has an installation area for installing each radiant heater 300. The lamp board 100 is a hollow board, and the orthographic projection of the hollow part of the lamp board 100 on the lower surface of the lamp board 100 can cover the installation area, and the hollow part of the lamp board 100 forms a cooling channel 103. Among them, the orthographic projection of the hollow part of the lamp board 100 on the lower surface of the lamp board 100 is slightly larger than the installation area, or the orthographic projection of the hollow part of the lamp board 100 on the lower surface of the lamp board 100 coincides with the installation area.

[0069] In other embodiments, a cooling channel 103 may also be provided in the shield 200 .

[0070] Please refer to Figure 1 , Figure 6 and Figure 7 In some embodiments, the driving mechanism 400 includes: a motor 401 and a transmission gear 203, wherein the output end of the motor 401 is meshed with the transmission gear 203; the transmission gear 203 is connected to the shield 200, and optionally, the transmission gear 203 is disposed near the end of the shield 200. The motor 401 drives the shield 200 to rotate between the first position and the second position through the transmission gear 203.

[0071] In some examples, the plurality of shields 200 are respectively connected to transmission gears 203; two adjacent transmission gears 203 are meshed. The output end of the motor 401 includes an output shaft and an output gear 402 fixedly connected to the output shaft.

[0072] Optionally, among the plurality of transmission gears 203 arranged side by side, the transmission gear 203 relatively located in the middle is meshed with the output end of the motor 401, thereby reducing the gap between the output end of the motor 401 and the end gear (relatively located at the edge of the transmission gear, such as Figure 1 The distance between the transmission gear located on the far left and the transmission gear located on the far right) is reduced, thereby reducing the rotation deviation of the end gear and improving the movement accuracy of the end gear.

[0073] In other examples, each shield 200 is respectively provided with a motor 401 , and the output end of each motor 401 includes an output shaft and an output gear 402 fixedly connected to the output shaft.

[0074] like Figure 1 and Figure 6 As shown, in some embodiments, the heat treatment device further includes: a first fixing frame 304 and a second fixing frame 204. The first fixing frame 304 is connected to the radiation heater 300 and the light board 100, respectively, and the first fixing frame 304 is arranged near the end of the radiation heater 300. In order to improve the installation reliability of the radiation heater 300, the parts of the radiation heater 300 near the two ends can be matched with the corresponding first fixing frames 304 respectively.

[0075] In some examples, the first fixing frame 304 may include a first base (not shown in the figure), and the first base may be fastened to the light board 100; the lower end of the first base to which it can be connected may be provided with two clamping parts, and the lower ends of the two clamping parts facing away from the first can be fastened to each other by fasteners, and the space surrounded by the two clamping parts in the fastened connection state can cooperate with the radiation heater 300 to clamp and fix the radiation heater 300. Alternatively, the lower end of the first base to which it can be connected is provided with a first mounting groove, and the first fixing frame 304 also includes a clamping member fastened to the first base, and the clamping member has a second mounting groove, and when the clamping member is used to fasten the first base, the space surrounded by the first mounting groove and the second mounting groove can cooperate with the radiation heater 300 to clamp and fix the radiation heater 300.

[0076] Each radiation heater 300 may be provided with a first fixing frame 304 that is independent of each other, so as to improve the flexibility of installing the radiation heater 300. Alternatively, at least two adjacent radiation heaters 300 share a first base, so as to reduce the number of parts in the heat treatment device and simplify the assembly process of the heat treatment device. The specific structure of the first fixing frame 304 is not limited thereto, and this embodiment is only used as an example, as long as the radiation heater 300 can be fixed on the light board 100.

[0077] In some examples, such as Figure 6 As shown, the end of the radiation heater 300 may be provided with an end seat 303, which is used to connect the wick 301 to the glass cover 302, and the end seat 303 has a wire, which is used to electrically connect the radiation heater 300 to a controller or a circuit board, etc. A preset interval may be provided between the first fixing frame 304 and the end seat 303.

[0078] In some examples, the second fixing bracket 204 is connected to the light board 100; the second fixing bracket 204 is provided with a mounting hole, and the shield 200 is rotatably disposed in the mounting hole. The second fixing bracket 204 can be disposed near the end of the shield 200, and the two ends of the shield 200 can be respectively provided with the second fixing bracket 204.

[0079] The second fixing frame 204 can be prismatic, and the upper end of the second fixing frame 204 can be fastened to the lamp board 100; a mounting hole is provided in the second fixing frame 204, and the axial direction of the mounting hole is parallel to the circumference of the radiation heater 300 (that is, the length direction of the lamp board 100); the mounting hole can be arranged through the second fixing frame 204 along the length direction, and the shield 200 can be rotatably arranged in the mounting hole, wherein a rotating bearing can be provided in the mounting hole, and the shield 200 cooperates with the mounting hole through the rotating bearing to reduce or even avoid the generation of particles due to friction loss.

[0080] Each shield 200 may be provided with an independent second fixing frame 204 to improve the installation flexibility of the shield 200 and the heating radiator. Alternatively, at least two adjacent shields 200 correspond to one second fixing frame 204, and a corresponding number of mounting holes are provided in the second fixing frame 204 to reduce the number of parts in the heat treatment device and simplify the assembly process of the heat treatment device. The specific structure of the second fixing frame 204 is not limited to this, and this embodiment is only used as an example, as long as it can support the rotatable shield 200.

[0081] Optionally, when at least two adjacent shields 200 correspond to one second fixing frame 204 , the mounting hole in the second fixing frame 204 may be an oblong hole, thereby providing a certain reserve for mounting the shield 200 and reducing the difficulty of mounting the shield 200 .

[0082] In addition, the radiation heater 300 can be inserted into the mounting hole of the second fixing frame 204. The second fixing frame 204 is located on the side of the end of the first fixing frame 304 away from the radiation heater 300. In other words, the second fixing seat is located on the side of the first fixing seat away from the connection end seat 303. In other words, the two second fixing frames 204 can be located at the ends facing each other of the two first fixing frames 304. The transmission gear 203 is located on the side of one of the second fixing frames 204 away from the first fixing frame 304.

[0083] The heat treatment device provided in this embodiment can improve the lateral temperature gradient of the radiation heater 300, improve the temperature consistency of the space where the workpiece 500 is located, and thus improve the temperature uniformity of the workpiece 500; by setting a reflective layer 201 on the inner side of the shield 200 facing the workpiece 500, the effective energy of the radiation heater 300 acting on the workpiece 500 can be increased, the energy consumption of the heat treatment device can be reduced, and the heating rate of the chamber can be increased; by setting a first absorption layer 102, a second absorption layer 202, and setting a cooling channel in the lamp board 100, the cooling rate of the chamber where the workpiece 500 is located can be increased, which is beneficial to improve the yield rate and quality of the workpiece 500.

[0084] This embodiment also provides a process equipment, including: a heat treatment device in any of the above embodiments. The process equipment may also include a chamber body, and the heat treatment device may be connected to the chamber body. Among them, the light board in the heat treatment device can be used to block the open end of the chamber body, or the heat treatment device can be located in the chamber body. It can be understood that: the part of the chamber body not described in this embodiment can adopt a conventional setting, and this embodiment will not be repeated.

[0085] This embodiment also provides a heat treatment method, which is implemented based on the heat treatment device in any of the above embodiments. The similarities between this embodiment and the above embodiments are not repeated here.

[0086] Figure 8 is a schematic diagram of a heat treatment method according to an embodiment of the present disclosure. Figure 8 , the heat treatment method provided in this embodiment includes:

[0087] Step S801, before heat treatment, controlling the driving mechanism to drive the shield to move to a first position;

[0088] Step S802: during heat treatment, controlling the radiation heater to work so that the heat energy released by the radiation heater can be radiated to the workpiece; wherein a portion of the heat energy released by the radiation heater can be radiated to the shield and reflected to the workpiece by the reflective layer inside the shield;

[0089] Step S803: After the heat treatment is completed, the driving mechanism is controlled to drive the shield to move to the second position, so that the shield can block the heat energy released by the radiation heater from being radiated to the workpiece.

[0090] In step S801, generally speaking, after the heat treatment, the shield is located at the second position. Therefore, when the process equipment is ready to perform heat treatment on the workpiece, the position of the shield can be detected by the detection element first, and if the shield is not at the first position, the driving mechanism is controlled to drive the shield to move to the first position, so that the shield is located between the radiation heater and the lamp board.

[0091] In step S802, after the shield moves to the first position, the radiation heater is controlled to work so that the temperature of the workpiece reaches the target temperature. The target temperature can be set according to actual needs. After the temperature of the workpiece reaches the target temperature, the workpiece can be subjected to oxidation treatment, etc.

[0092] In step S803, after the heat treatment is completed, the radiation heater is controlled to stop working, and the driving mechanism is controlled to drive the shield to move to the second position. The order of controlling the radiation heater to stop working and controlling the driving mechanism to drive the shield to move to the second position is not specifically limited in this embodiment and can be set according to actual needs.

[0093] In addition, after the heat treatment is completed, the heat treatment method may further include: introducing a cooling fluid into the cooling channel of the lamp board; the cooling fluid may be a liquid or a gas. When the temperature of the space where the workpiece is located, or the temperature of the lower surface of the lamp board, etc., drops to a threshold value, the introduction of the cooling fluid into the cooling channel of the lamp board may be stopped, and the cooling fluid in the cooling channel may be discharged to the outside of the lamp board.

[0094] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0095] In the description of the present disclosure, it is necessary to understand that the terms "up", "down", "left", "right", "top", "bottom", "inside", "outside", "axial", "longitudinal", "lateral", "vertical", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0096] In addition, the terms "first", "second", etc. used in the embodiments of the present disclosure are only used for descriptive purposes and should not be understood as indicating or implying relative importance, or implicitly indicating the number of technical features indicated in the embodiments. Therefore, the features defined by the terms "first", "second", etc. in the embodiments of the present disclosure may explicitly or implicitly indicate that at least one of the features is included in the embodiment. In the description of the present disclosure, the word "multiple" means at least two or two or more, such as two, three, four, etc., unless otherwise clearly and specifically defined in the embodiments.

[0097] In the present disclosure, unless otherwise clearly specified or limited in the embodiments, the terms "installed", "connected", "connected" and "fixed" etc. appearing in the embodiments should be understood in a broad sense. For example, the connection can be a fixed connection, a detachable connection, or an integrated connection. It can be understood that it can also be a mechanical connection, an electrical connection, etc.; of course, it can also be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements, or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to the specific implementation situation.

[0098] In the present disclosure, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0099] Although the embodiments of the present disclosure have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present disclosure. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present disclosure.

Claims

1. A heat treatment device, comprising: A light board, wherein the light board is provided with a receiving slot; a radiation heater, at least a portion of which is located in the receiving groove, and heat energy radiated by the radiation heater is used to heat the workpiece; a shield, wherein a reflective layer is provided on the inner surface of the shield facing the radiation heater, and the reflective layer is used to reflect the heat energy; the shield is movably connected to the lamp board, and the shield is used to switch between a first position and a second position under the action of a driving force; when located at the first position, the shield is located between the radiation heater and the lamp board, so that the heat energy released by the radiation heater can be radiated to the workpiece; when located at the second position, the shield is located between the radiation heater and the workpiece, so that the shield can block the heat energy released by the radiation heater from being radiated to the workpiece; A driving mechanism, the driving mechanism is connected to the shield, and the driving mechanism is used to provide the driving force; The groove wall of the receiving groove is connected with a first absorption layer, and the first absorption layer is used to absorb the heat energy; The groove wall of the receiving groove has a first edge facing the workpiece; When the shield is in the second position, the inner surface of the shield has a second edge facing away from the workpiece; The first edge, the second edge and the radiation heater respectively correspond to a first orthographic projection, a second orthographic projection and a third orthographic projection on the preset projection plane, and the second orthographic projection is located on a side of the first orthographic projection facing the third orthographic projection; The preset projection plane is parallel to the surface of the workpiece facing the radiation heater; A cooling channel is provided in the lamp board, so that the fluid entering the cooling channel can exchange heat with the lamp board; the cooling channel includes a plurality of sub-channels, and the axial directions of the plurality of sub-channels are respectively perpendicular to the axial direction of the radiation heater.

2. The heat treatment device according to claim 1, wherein: A second absorption layer is disposed on the outer surface of the shield facing away from the radiation heater, and the second absorption layer is used for absorbing heat energy.

3. The heat treatment device according to claim 1, wherein: The shield is arc-shaped, and the focus of the shield is located on the radiation heater; And / or, the groove wall of the receiving groove is arc-shaped, and the focus of the groove wall of the receiving groove is located on the radiation heater.

4. The heat treatment device according to claim 1, wherein: The distance between the first edge and the workpiece is less than or equal to the distance between the second edge and the workpiece.

5. The heat treatment device according to claim 1, wherein: The driving mechanism comprises: a motor and a transmission gear, wherein the output end of the motor is meshed with the transmission gear, and the transmission gear is connected to the shield to drive the shield to rotate between the first position and the second position.

6. The heat treatment device according to claim 5, wherein: There are a plurality of the radiation heaters, and the plurality of the radiation heaters are arranged side by side; the plurality of the radiation heaters are respectively provided with the protective covers; The plurality of shields are respectively connected to the transmission gears; two adjacent transmission gears are meshed; Among the plurality of transmission gears arranged side by side, the transmission gear relatively located in the middle is meshed with the output end of the motor.

7. The heat treatment device according to claim 1, further comprising: A first fixing frame, wherein the first fixing frame is connected to the radiation heater and the light panel respectively, and the first fixing frame is arranged close to an end of the radiation heater; A second fixing bracket, the second fixing bracket is connected to the lamp panel; the second fixing bracket is provided with a mounting hole, the shield is rotatably arranged in the mounting hole; the radiation heater is inserted into the mounting hole, and the second fixing bracket is located on a side of the first fixing bracket away from the corresponding end of the radiation heater.

8. A process equipment comprising: A heat treatment apparatus as claimed in any one of claims 1 to 7.

9. A heat treatment method based on the heat treatment device according to any one of claims 1 to 7, comprising: Before heat treatment, controlling the driving mechanism to drive the shield to move to a first position; When performing heat treatment, the radiation heater is controlled to work so that the heat energy released by the radiation heater can be radiated to the workpiece; wherein a part of the heat energy released by the radiation heater can be radiated to the shield and reflected to the workpiece by the reflective layer inside the shield; After the heat treatment is completed, the driving mechanism is controlled to drive the shield to move to a second position, so that the shield can block the heat energy released by the radiation heater from being radiated to the workpiece; At least part of the radiation heater is located in a receiving groove of the lamp board, a groove wall of the receiving groove is connected to a first absorption layer, and the first absorption layer is used to absorb the heat energy; The groove wall of the receiving groove has a first edge facing the workpiece; when the shield is located at the second position, the inner surface of the shield has a second edge facing away from the workpiece; The first edge, the second edge and the radiation heater respectively correspond to a first orthographic projection, a second orthographic projection and a third orthographic projection on a preset projection plane, the second orthographic projection is located on a side of the first orthographic projection facing the third orthographic projection; the preset projection plane is parallel to the surface of the workpiece facing the radiation heater; A cooling channel is provided in the lamp board, so that the fluid entering the cooling channel can exchange heat with the lamp board; the cooling channel includes a plurality of sub-channels, and the axial directions of the plurality of sub-channels are respectively perpendicular to the axial direction of the radiation heater.

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