Haptics sensor stress loading device compatible with super-depth-of-field optical microscopy

By designing a stress loading device for visual-tactile sensors compatible with ultra-depth-of-field optical microscopes, and using z-axis and x-axis displacement mechanisms to clamp the sensor and apply external force, the problem of existing testing devices being large and easily damaged is solved, realizing high spatial resolution visual-tactile sensor testing, which is suitable for micro-nano scale sensing.

CN119063894BActive Publication Date: 2025-12-16SHANGHAI JIAOTONG UNIV
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Patent Information

Application Number
CN202411389221.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-10-08
Publication Date
2025-12-16
Estimated Expiration
2044-10-08

AI Technical Summary

Technical Problem

Existing testing devices for visual and tactile sensors are large and complex, making them difficult to use with micro- and nano-sized devices such as optical microscopes. Furthermore, they are prone to damage to tiny sensors, and existing testing platforms have limited spatial resolution.

Method used

Design a stress loading device for a visual-tactile sensor compatible with a super depth-of-field optical microscope. The sensor is clamped by a z-axis and x-axis displacement mechanism, and an external force is applied by a probe. The device is used in conjunction with a super depth-of-field microscope to perform tests, thereby achieving high spatial resolution surface morphology testing.

Benefits of technology

It enables small, precise testing of visual and tactile sensors, which can be used with ultra-depth-of-field microscopes to shorten the design process time and cost and obtain high-quality, high-spatial-resolution test results.

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Abstract

The application discloses a stress loading device for a visual-tactile sensor compatible with an ultra-depth optical microscope, which comprises a z-axis displacement mechanism, a probe, a bottom plate, a plug, a pair of supporting blocks, a compression block and an x-axis displacement mechanism arranged in sequence, wherein the bottom plate is provided with a hollow structure, the end of the probe is located in the hollow structure, the plug and the compression block are oppositely arranged on the two sides of the hollow structure to compress the contact module of the sensor to be tested, namely, to load a pre-stress, the pair of supporting blocks are oppositely arranged on the two sides of the hollow structure to fix a glass slide, the compression sensor to be tested is arranged at the lower part of the glass slide, the x-axis displacement mechanism realizes compression of the compression sensor to be tested in the x-axis direction through displacement, the end of the probe applies force to the compression sensor to be tested in the z-axis direction according to the z-axis displacement mechanism, and the optical microscope is arranged directly above the hollow structure and observes the whole experiment process. The application realizes clamping of the visual-tactile compression sensor and loading of external force through two precise displacement tables, and can directly cooperate with the ultra-depth optical microscope to load and test the sensor, and can meet the requirements of current visual-tactile sensor testing and experiments.
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Description

Technical Field

[0001] This invention relates to a technology in the field of visual-tactile sensing, specifically a visual-tactile sensor stress loading device compatible with ultra-depth-of-field optical microscopes. Background Technology

[0002] As an emerging tactile sensing technology, visual-tactile sensors offer advantages over traditional piezoelectric and capacitive tactile sensors, including smaller size, higher resolution, and higher sensitivity. However, current testing equipment for visual-tactile sensing technology is limited. Often, universal testing machines are used to directly test and experiment with the sensors. These machines are large, the testing process is complex, and they are difficult to integrate with micro- and nano-scale equipment such as optical microscopes and 3D profilometers. Furthermore, universal testing machines are challenging for the tiny visual-tactile sensors and can easily damage them. Therefore, there is an urgent need for a small, precise, and easily controllable stress loading device to test and experiment with visual-tactile sensors. Summary of the Invention

[0003] This invention addresses the problems of existing technologies having complex testing processes, making them unsuitable as stress loading devices for visual-tactile sensors, and being difficult to use with optical equipment such as ultra-depth-of-field microscopes. It proposes a stress loading device for visual-tactile sensors that is compatible with ultra-depth-of-field optical microscopes. The device uses two precision displacement stages to clamp the visual-tactile compression sensor and apply external forces. It can be directly used with ultra-depth-of-field optical microscopes to perform loading tests on the sensor, thus meeting the requirements of current visual-tactile sensor testing and experimentation.

[0004] This invention is achieved through the following technical solution:

[0005] This invention relates to a stress loading device for a visual-tactile sensor compatible with a super-depth-of-field optical microscope, comprising: a z-axis displacement mechanism, a probe, and a base plate arranged sequentially, as well as a blocking block, a pair of support blocks, a compression block, and an x-axis displacement mechanism disposed on the base plate. The base plate has a hollow structure, with the probe tip located within the hollow structure. The blocking block and compression block are positioned opposite each other on both sides of the hollow structure to compress the contact module of the sensor under test, i.e., to apply prestress. The pair of support blocks are positioned opposite each other on both sides of the hollow structure to fix a glass slide. The compression sensor under test is disposed at the bottom of the glass slide. The x-axis displacement mechanism compresses the compression sensor under test in the x-axis direction through displacement. The probe tip applies force to the compression sensor under test in the z-axis direction according to the z-axis displacement mechanism. The optical microscope is positioned directly above the hollow structure to observe the entire experimental process.

[0006] This invention relates to an installation and pressure loading method for a visual-tactile sensor contact module based on the aforementioned device. A base plate and a z-axis displacement mechanism are placed on the same plane. The distance between the z-axis displacement mechanism and the base plate is appropriately adjusted to ensure that the probe can reach every position of the compression sensor. The test compression sensor is placed at the rectangular opening of the base plate, and a glass slide is placed on a support block to support and fix the compression sensor. The x-axis displacement mechanism is used to apply displacement to the compression block, compressing the compression sensor and fixing it in the test area. The position of the probe is adjusted using the displacement of the z-axis displacement mechanism; that is, the external force applied by the probe changes with the z-axis displacement. Hyper-depth-of-field or other optical equipment can be placed on the same platform as the device. The lens is adjusted above the rectangular opening to capture the deformed pattern, and the z-axis displacement is recorded. The external force applied by the probe corresponding to the deformed image can be calculated, thus completing one loading test.

[0007] Technical effect

[0008] This invention comprehensively solves the problems of existing visual-tactile sensors, such as limited testing and experimental platform types, the inability to test and experiment on the stress loading of the entire sensor, the difficulty in using the testing and experimental process with micro-nano devices such as optical microscopes, and limited spatial resolution.

[0009] Compared to existing technologies, this invention is compatible with ultra-depth-of-field optical microscopes, allowing for independent testing and experimentation of the contact module of visual-tactile sensors. Utilizing ultra-depth-of-field optical microscopes, high-quality, high-spatial-resolution surface morphology test results under stress loading can be obtained without the need for illumination and imaging modules. Compared to existing visual-tactile sensor testing methods, this invention is more suitable for the design of visual-tactile sensors with micro- and nano-scale sensing capabilities, and can significantly reduce the time and cost of the design process for visual-tactile sensor contact modules. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the structure of the present invention;

[0011] Figure 2 This is a schematic diagram of the probe;

[0012] Figure 3 This is a schematic diagram of the base plate;

[0013] Figure 4 This is a schematic diagram of an L-shaped support block;

[0014] Figure 5 This diagram shows the setup of the optical microscope and the x and z axis displacements.

[0015] Figure 6 This is a schematic diagram illustrating the working principle of the present invention;

[0016] In the figure: z-axis displacement mechanism 1, probe 2, block 3, support block 4, probe end 5, compression block 6, x-axis displacement mechanism 7, base plate 8, optical microscope 9, fixing part 10, connecting part 11, glass slide 12, compression sensor 13, compression sheet 14. Detailed Implementation

[0017] like Figure 1 and Figure 5 As shown, this embodiment relates to a stress loading device for a visual-tactile sensor compatible with a super-depth-of-field optical microscope. It includes: a z-axis displacement mechanism 1, a probe 2, and a base plate 8 arranged sequentially; a blocking block 3, a pair of support blocks 4, a compression block 6, and an x-axis displacement mechanism 7 disposed on the base plate 8. The base plate 8 has a hollow structure, with the probe tip 5 located within it. The blocking block 3 and compression block 6 are positioned opposite each other on both sides of the hollow structure to compress the sensor under test, i.e., to apply prestress. The pair of support blocks 4 are positioned opposite each other on both sides of the hollow structure to fix the glass slide. The contact module of the sensor under test is located at the bottom of the glass slide. The x-axis displacement mechanism compresses the sensor under test in the x-axis direction through displacement. The probe tip 5 applies force to the sensor under test in the z-axis direction according to the z-axis displacement mechanism 1. An optical microscope 9 is positioned directly above the hollow structure to observe the entire experimental process.

[0018] The probe includes: a fixed part 10, a connecting part 11 and a probe end 5 in the z-axis direction connected in sequence, wherein: the fixed part 10 is fixedly connected to the z-axis displacement mechanism 1 as an intermediary for applying external force to the sensor, and the length of the connecting part 11 is 25mm in the z-axis direction and 40mm in the x-axis direction.

[0019] The probe end 5 has a conical structure, which ensures the accuracy of the force application point. Since the z-axis displacement mechanism is large in volume and difficult to integrate with the base plate, the connection part 11 between the probe end 5 and the displacement stage is short, which avoids the situation where the probe displacement and the displacement stage displacement are inconsistent due to its own deformation.

[0020] The aforementioned blocking block and compression block are as follows: the blocking block is a cuboid block fixed on the base plate to prevent the glass slide from being pushed out; the compression block is a cuboid block fixed on the x-axis displacement mechanism to achieve compression in the x-axis direction, thus fixing and compressing the sensor on the platform.

[0021] The support block is composed of four L-shaped blocks. Each support block is fixed to the groove of the base plate by bolts, and the support block can be adjusted to accommodate compression sensors of various sizes.

[0022] This device operates by placing the base plate 8 and the z-axis displacement mechanism 1 on the same plane and adjusting their distance appropriately to ensure that the probe tip 5 can reach every position of the compression sensor placed in the hollow structure. The x-axis displacement mechanism 7 applies displacement to the compression block 6 to compress the compression sensor under test, while fixing it in the test area. The z-axis displacement mechanism 1 is used to adjust the probe position so that the external force applied by the probe tip 5 changes with the z-axis displacement. A super depth-of-field or other optical microscope 9 can be placed on the same platform as the device. The lens is adjusted to be above the rectangular opening to capture the deformation pattern, and the z-axis displacement is recorded. The external force applied by the probe corresponding to the deformation image can be calculated, thus completing one loading test.

[0023] Through specific testing experiments, this device was fixed in the stage of an ultra-depth-of-field microscope. With the help of a high-precision force sensor, it was able to perform mechanical loading tests on the visual-tactile sensor unit. The x-axis displacement mechanism compresses the sensor unit, and the three-axis displacement stage uses probes to apply external forces to different positions of the sensor unit. With the ultra-depth-of-field microscope, the device can capture images of the deformation of the visual-tactile sensor unit in response to different external forces, thereby completing the mechanical loading test of the sensor unit.

[0024] Compared with existing technologies, this device, through the structural design of the loading stage, allows the testing device to be directly assembled onto the stage of a super depth-of-field microscope. In conjunction with the super depth-of-field microscope, it enables mechanical loading tests on tactile compression sensors. The overall size of the testing device is small, and the three-axis displacement stage, combined with a high-precision sensor, achieves relatively accurate force loading. The device is simpler and easier to operate.

[0025] The above-described specific implementations can be partially adjusted by those skilled in the art in different ways without departing from the principles and purpose of the present invention. The scope of protection of the present invention is defined by the claims and is not limited to the above-described specific implementations. All implementation schemes within the scope of the claims are bound by the present invention.

Claims

1. A stress loading device for a visual-tactile sensor compatible with a super-depth-of-field optical microscope, characterized in that, include: The experiment consists of a z-axis displacement mechanism, a probe, a base plate, a blocking block, a pair of support blocks, a compression block, and an x-axis displacement mechanism, arranged sequentially on the base plate. The base plate has a perforated structure, with the probe tip located within it. The blocking block and compression block are positioned opposite each other on either side of the perforated structure to compress the contact module of the sensor under test, i.e., to apply prestress. The pair of support blocks are positioned opposite each other on either side of the perforated structure to fix the glass slide. The compression sensor under test is positioned at the bottom of the glass slide. The x-axis displacement mechanism compresses the compression sensor under test in the x-axis direction through displacement. The probe tip applies force to the compression sensor under test in the z-axis direction according to the z-axis displacement mechanism. An optical microscope is positioned directly above the perforated structure to observe the entire experimental process.

2. The visual-tactile sensor stress loading device compatible with ultra-depth-of-field optical microscopes according to claim 1, characterized in that, The probe includes: a fixed part, a connecting part, and a probe end in the z-axis direction connected in sequence, wherein: the fixed part is fixedly connected to the z-axis displacement mechanism as an intermediary for applying external force to the sensor.

3. The visual-tactile sensor stress loading device compatible with ultra-depth-of-field optical microscopes according to claim 2, characterized in that, The probe tip has a conical structure.

4. The stress loading device for a visual-tactile sensor compatible with a super-depth-of-field optical microscope according to claim 1, characterized in that, The support block has an L-shaped structure, and each support block is bolted to the slot of the base plate to accommodate compression sensors of various sizes.

5. A method for installing and applying pressure to a visual-tactile sensor contact module based on the device described in any one of claims 1-4, characterized in that, Place the base plate and the z-axis displacement mechanism on the same plane, and adjust the distance between the z-axis displacement mechanism and the base plate appropriately to ensure that the probe can reach every position of the compression sensor. Place the compression sensor at the rectangular opening of the base plate, and use a glass slide placed on the support block to support and fix the compression sensor. Use the x-axis displacement mechanism to apply displacement to the compression block, compressing the compression sensor and fixing it in the test area. Use the displacement of the z-axis displacement mechanism to adjust the position of the probe, that is, the external force applied by the probe changes with the z-axis displacement. Hyper-depth of field or other optical equipment can be placed on the same platform as the device. Adjust the lens to above the rectangular opening to capture the deformation pattern, record the z-axis displacement, and calculate the external force applied by the probe corresponding to the deformation image to complete one loading test.

Citation Information

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