Method and device for determining thermal resistance of heat source, and method for manufacturing packaging structure

Abstract

The present application discloses a method and device for determining the thermal resistance of a heat source in an electronic device, and a method for manufacturing a packaging structure, and relates to the field of heat dissipation. The determination method includes: establishing a thermal resistance model based on the heat dissipation path of the heat source in the electronic device, the thermal resistance model includes a first type of thermal resistance and a second type of thermal resistance, the first type of thermal resistance is related to the heat source, and the second type of thermal resistance is related to the heat dissipation path of the heat source in the electronic device; based on the thermal design power consumption of the heat source and the junction temperature threshold of the heat source, the shell temperature threshold of the first shell of the electronic device, the shell temperature threshold of the second shell of the electronic device, and the second type of thermal resistance, using the thermal resistance model, multiple boundary conditions of the first type of thermal resistance are determined, and based on the multiple boundary conditions of the first type of thermal resistance, the value range of the first type of thermal resistance is determined; wherein the first shell and the second shell are relative shells of the electronic device. The present application can obtain the value range of the first type of thermal resistance related to the heat source through one calculation.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a method and device for determining the thermal resistance of a heat source, and a method for manufacturing a packaging structure. Background Art

[0002] Chip packaging is one of the most important links in the semiconductor manufacturing process. It not only protects the chip from physical damage and environmental impact, but also provides mechanical support and electrical connection. As electronic devices develop towards high performance and miniaturization, the technical requirements for chip packaging are becoming higher and higher. Especially for high-power devices, effective heat dissipation design is directly related to the performance and reliability of the device.

[0003] In chip packaging, thermal resistance is a parameter that measures the ability of a material or structure to conduct heat. The dual thermal resistance range refers to the range of thermal resistance values ​​from the inside of the chip package to the external environment in an electronic device under different operating conditions. This parameter is crucial to ensure that the chip can maintain a suitable operating temperature under various load conditions. Therefore, how to obtain a reasonable range of thermal resistance in the package structure under various operating temperature limits in advance has become a research direction for technicians in this field. Summary of the invention

[0004] In view of the above problems, the present application provides a method and device for determining the thermal resistance of a heat source, and a method for manufacturing a packaging structure. The specific scheme is as follows:

[0005] A method for determining thermal resistance of a heat source in an electronic device, comprising:

[0006] Establishing a thermal resistance model based on a heat dissipation path of a heat source in an electronic device, the thermal resistance model comprising a first type of thermal resistance and a second type of thermal resistance, wherein the first type of thermal resistance is related to the heat source, the second type of thermal resistance is related to the heat dissipation path of the heat source in the electronic device, and the resistance value of the second type of thermal resistance is a known resistance value;

[0007] Based on the thermal design power consumption of the heat source and the junction temperature threshold of the heat source, the shell temperature threshold of the first shell of the electronic device, the shell temperature threshold of the second shell of the electronic device, and the second type of thermal resistance, the thermal resistance model is used to determine multiple boundary conditions of the first type of thermal resistance, and based on the multiple boundary conditions of the first type of thermal resistance, the value range of the first type of thermal resistance is determined; wherein the first shell and the second shell are relative shells of the electronic device.

[0008] Optionally, the thermal resistance model includes at least two parallel branches, which correspond one-to-one to the heat dissipation paths from the heat source in the electronic device to the outside of the electronic device; each of the parallel branches includes at least one first-type thermal resistance and at least one second-type thermal resistance connected in series; the first-type thermal resistance is related to the internal structure of the component where the heat source is located, and the second-type thermal resistance is related to the path structure for the component where the heat source is located to dissipate heat to the outside.

[0009] Optionally, the at least two parallel branches include a first branch and a second branch in parallel, the first branch includes a first thermal resistor, a third thermal resistor and a fifth thermal resistor connected in series, and the second branch includes a second thermal resistor, a fourth thermal resistor and a sixth thermal resistor connected in series, wherein the heat source is a chip, and the component is a chip packaging structure; the first thermal resistor is an equivalent thermal resistance of a heat dissipation path between a thermal junction of the chip and a packaging cover of the chip packaging structure, the second thermal resistor is an equivalent thermal resistance of a heat dissipation path between a thermal junction of the chip and a substrate of the chip packaging structure, the third thermal resistor is an equivalent thermal resistance of a heat dissipation path between the packaging cover and a first shell of the electronic device, the fifth thermal resistor is an equivalent thermal resistance of a heat dissipation path between the first shell of the electronic device and the external environment, the fourth thermal resistor is an equivalent thermal resistance of a heat dissipation path between the substrate of the packaging structure and the second shell of the electronic device, and the sixth thermal resistor is an equivalent thermal resistance of a heat dissipation path between the second shell of the electronic device and the external environment; wherein,

[0010] The first thermal resistor and the second thermal resistor are the first type of thermal resistors, and the third thermal resistor, the fourth thermal resistor, the fifth thermal resistor and the sixth thermal resistor are the second type of thermal resistors.

[0011] Optionally, based on the thermal design power consumption of the heat source and the junction temperature threshold of the heat source, the shell temperature threshold of the first shell of the electronic device, the shell temperature threshold of the second shell of the electronic device, and the second type of thermal resistance, using the thermal resistance model, determining the value range of the first type of thermal resistance includes:

[0012] Based on the thermal resistance model, determining a basic relationship between the thermal design power consumption of the heat source and the junction temperature of the heat source, the shell temperature of the first shell of the electronic device, the shell temperature of the second shell of the electronic device, the second type of thermal resistance, and the first type of thermal resistance;

[0013] Determining the constraints of the first type of thermal resistance;

[0014] Based on the basic relationship and the constraint conditions of the first type of thermal resistance, a value range of the first type of thermal resistance is determined.

[0015] Optionally, the basic relationship is obtained when the thermal resistance model includes two parallel branches; the at least two parallel branches include a first branch and a second branch connected in parallel, the first branch includes a first thermal resistor, the second branch includes a second thermal resistor, and the first thermal resistor and the second thermal resistor are the first type of thermal resistor; based on the basic relationship and the constraint conditions of the first type of thermal resistor, determining the value range of the first type of thermal resistor includes:

[0016] Based on the basic relationship and the constraint condition of the first type of thermal resistance, determining a critical value condition of the first thermal resistance and a critical value condition of the second thermal resistance;

[0017] A value range of the first thermal resistance and a value range of the second thermal resistance that simultaneously satisfy a critical value condition of the first thermal resistance and a critical value condition of the second thermal resistance are obtained.

[0018] Optionally, the constraints of the first type of thermal resistance include:

[0019] The junction temperature of the heat source is not greater than the junction temperature threshold of the heat source;

[0020] The shell temperature of the first shell is not greater than the shell temperature threshold of the first shell;

[0021] The shell temperature of the second shell is not greater than a shell temperature threshold of the second shell.

[0022] Optionally, the at least two parallel branches include a first branch and a second branch connected in parallel, the first branch corresponds to a heat dissipation path of the heat source in the electronic device toward the first shell, the second branch corresponds to a heat dissipation path of the heat source in the electronic device toward the second shell, the first branch includes a first thermal resistor, the second branch includes a second thermal resistor, and the first thermal resistor and the second thermal resistor are first-type thermal resistors;

[0023] Based on the basic relationship and the constraint conditions of the first type of thermal resistance, the value range of the first type of thermal resistance is determined to include:

[0024] Based on the basic relationship and the shell temperature threshold of the second shell, obtaining a first critical value condition of the first thermal resistance;

[0025] Based on the basic relationship and the shell temperature threshold of the first shell, obtaining a first critical value condition of the second thermal resistance;

[0026] Based on the basic relationship and the junction temperature threshold of the heat source, obtaining a second critical value condition of the first thermal resistance or a second critical value condition of the second thermal resistance;

[0027] Obtaining a value range of the first thermal resistance that satisfies the second critical value condition of the first thermal resistance and satisfies the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance, or obtaining a value range of the first thermal resistance that satisfies the second critical value condition of the second thermal resistance and satisfies the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance;

[0028] Obtain a value range of the second thermal resistance that satisfies the second critical value condition of the first thermal resistance and satisfies the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance, or obtain a value range of the second thermal resistance that satisfies the second critical value condition of the second thermal resistance and satisfies the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance.

[0029] Optionally, the method for obtaining the value of the second type of thermal resistance includes:

[0030] Replacing the heat source of the thermal resistance to be confirmed in the thermal resistance model with a first heat source, wherein the value of the first type of thermal resistance of the first heat source is a known value;

[0031] Based on the temperature of each node in the thermal resistance model and the first type of thermal resistance, the value of the second type of thermal resistance is determined using the thermal resistance model.

[0032] A device for determining thermal resistance of a heat source in an electronic device, comprising:

[0033] A model building unit, in response to a user instruction, builds a thermal resistance model based on a heat dissipation path of a heat source in the electronic device, the thermal resistance model comprising a first type of thermal resistance and a second type of thermal resistance, wherein the first type of thermal resistance is related to the heat source, the second type of thermal resistance is related to the heat dissipation path of the heat source in the electronic device, and the resistance value of the second type of thermal resistance is a known resistance value;

[0034] The calculation unit determines multiple boundary conditions of the first type of thermal resistance using the thermal resistance model based on the thermal design power consumption of the heat source and the junction temperature threshold of the heat source, the shell temperature threshold of the first shell of the electronic device, the shell temperature threshold of the second shell of the electronic device, and the second type of thermal resistance, and determines a value range of the first type of thermal resistance based on the multiple boundary conditions of the first type of thermal resistance.

[0035] A method for manufacturing a packaging structure, comprising:

[0036] When the packaging structure is applied to an electronic device, a thermal resistance model is established for the heat dissipation path of the heat source in the packaging structure, the thermal resistance model includes a first type of thermal resistance and a second type of thermal resistance, wherein the first type of thermal resistance is related to the heat source, the second type of thermal resistance is related to the heat dissipation path of the heat source in the electronic device, and the resistance value of the second type of thermal resistance is a known resistance value;

[0037] Based on the thermal design power consumption of the heat source and the junction temperature threshold of the heat source, the shell temperature threshold of the first shell of the electronic device, the shell temperature threshold of the second shell of the electronic device, and the second type of thermal resistance, using the thermal resistance model, multiple boundary conditions of the first type of thermal resistance are determined, and based on the multiple boundary conditions of the first type of thermal resistance, a value range of the first type of thermal resistance is determined;

[0038] The packaging structure is designed based on the value range of the first type of thermal resistance.

[0039] Optionally, the method further includes: determining whether the first type of thermal resistance of the heat source in the existing packaging structure meets a preset condition based on the value range of the first type of thermal resistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The above and other features, advantages and aspects of the embodiments of the present disclosure will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. Throughout the accompanying drawings, the same or similar reference numerals represent the same or similar elements. It should be understood that the drawings are schematic and the originals and elements are not necessarily drawn to scale.

[0041] Figure 1 A flow chart of a method for determining the thermal resistance of a heat source in an electronic device provided in the present application;

[0042] Figure 2 A schematic diagram of the circuit structure of a thermal resistance model in a method for determining the thermal resistance of a heat source in an electronic device provided by the present application;

[0043] Figure 3 A schematic diagram of a relationship curve between a first thermal resistance and a second thermal resistance in a method for determining a thermal resistance of a heat source in an electronic device provided by the present application;

[0044] Figure 4 A schematic diagram of the structure of a device for determining the thermal resistance of a heat source in an electronic device provided by the present application;

[0045] Figure 5 A flowchart of a method for manufacturing a packaging structure provided in the present application. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the embodiments in the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0047] It is obvious to those skilled in the art that various modifications and changes can be made in this application without departing from the spirit or scope of this application. Therefore, this application is intended to cover modifications and changes of this application that fall within the scope of the corresponding claims (technical solutions claimed for protection) and their equivalents. It should be noted that the implementation methods provided in the embodiments of this application can be combined with each other without contradiction.

[0048] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0049] As described in the background technology section, how to obtain the dual thermal resistance range of chip packaging in electronic equipment has become a research direction for those skilled in the art.

[0050] It should be noted that the two most important parameters for thermal evaluation of chip packages are TDP and junction temperature threshold. Therefore, providing the package dual thermal resistance range that satisfies these two constraint parameters can greatly simplify the thermal design of the package and quickly evaluate whether the package selection meets the thermal design requirements. Among them, the full name of TDP in English is "Thermal Design Power", which is literally translated into Chinese as "heat dissipation design power consumption"; the junction temperature threshold refers to the maximum internal temperature that a power semiconductor device can withstand. Exceeding this temperature may cause the device performance to degrade or even be damaged.

[0051] In view of this, an embodiment of the present application provides a method for determining the thermal resistance of a heat source in an electronic device, such as Figure 1 As shown, the thermal resistance determination method includes:

[0052] S1: A thermal resistance model is established based on a heat dissipation path of a heat source in an electronic device, wherein the thermal resistance model includes a first type of thermal resistance and a second type of thermal resistance, wherein the first type of thermal resistance is related to the heat source, and the second type of thermal resistance is related to the heat dissipation path of the heat source in the electronic device, and the resistance value of the second type of thermal resistance is a known resistance value.

[0053] Optionally, in one embodiment of the present application, the thermal resistance model includes at least two parallel branches, which correspond one-to-one to the heat dissipation paths from the heat source in the electronic device to the outside of the electronic device, and different parallel branches correspond to heat dissipation paths in different directions; specifically, each parallel branch includes at least one first-type thermal resistance and at least one second-type thermal resistance connected in series, wherein the first-type thermal resistance is related to the internal structure of the component where the heat source is located, and the second-type thermal resistance is related to the heat dissipation path from the component where the heat source is located to the outside. Taking chip packaging as an example, the component where the heat source is located is the chip and its packaging structure, and the heat dissipation path from the component where the heat source is located to the outside is the heat dissipation path from the packaging structure of the chip to the outside of the electronic device.

[0054] Specifically, in one embodiment of the present application, Figure 2 As shown, the at least two parallel branches include a first branch and a second branch in parallel, wherein the first branch corresponds to a heat dissipation path from a heat source to a first housing (such as an upper housing) of the electronic device, and the second branch corresponds to a heat dissipation path from a heat source to a second housing (such as a lower housing) of the electronic device, but the present application does not limit this. In other embodiments of the present application, the at least two parallel branches may also include other numbers of branches. The following describes the thermal resistance determination method provided in the present application by taking the at least two parallel branches including the first branch and the second branch in parallel as an example.

[0055] Optionally, in one embodiment of the present application, continue as Figure 2 As shown, the first branch includes a first thermal resistor R1, a third thermal resistor R3 and a fifth thermal resistor R5 connected in series, and the second branch includes a second thermal resistor R2, a fourth thermal resistor R4 and a sixth thermal resistor R6 connected in series; optionally, the heat source is a chip, and the component where the heat source is located is a chip packaging structure. In this embodiment, the first thermal resistor is the equivalent thermal resistance of the heat dissipation path between the thermal junction of the chip and the packaging cover of the chip packaging structure, the second thermal resistor is the equivalent thermal resistance of the heat dissipation path between the thermal junction of the chip and the substrate of the chip packaging structure, the third thermal resistor is the equivalent thermal resistance of the heat dissipation path between the packaging cover and the first shell of the electronic device, the fifth thermal resistor is the equivalent thermal resistance of the heat dissipation path between the first shell of the electronic device and the external environment, the fourth thermal resistor is the equivalent thermal resistance of the heat dissipation path between the substrate of the packaging structure and the second shell of the electronic device, and the sixth thermal resistor is the equivalent thermal resistance of the heat dissipation path between the second shell of the electronic device and the external environment. It should be noted that, in the above embodiment, the first shell and the second shell are two opposite shells of the electronic device. Specifically, the first shell is the upper shell of the electronic device, and the second shell is the back shell of the electronic device.

[0056] In the above embodiment, the first thermal resistor and the second thermal resistor are the first type of thermal resistors, and the third thermal resistor, the fourth thermal resistor, the fifth thermal resistor and the sixth thermal resistor are the second type of thermal resistors.

[0057] S2: Based on the thermal design power consumption of the heat source and the junction temperature threshold of the heat source, the shell temperature threshold of the first shell of the electronic device, the shell temperature threshold of the second shell of the electronic device, and the second type of thermal resistance, using the thermal resistance model, determine multiple boundary conditions of the first type of thermal resistance, and determine the value range of the first type of thermal resistance based on the multiple boundary conditions; wherein the first shell and the second shell are relative shells of the electronic device.

[0058] Optionally, in an embodiment of the present application, based on the thermal design power consumption of the heat source and the junction temperature threshold of the heat source, the shell temperature threshold of the first shell of the electronic device, the shell temperature threshold of the second shell of the electronic device, and the second type of thermal resistance, the thermal resistance model is used to determine multiple boundary conditions of the first type of thermal resistance, and the value range of the first type of thermal resistance is determined based on the multiple boundary conditions, including:

[0059] Based on the thermal resistance model, determining a basic relationship between the thermal design power consumption of the heat source and the junction temperature of the heat source, the shell temperature of the first shell of the electronic device, the shell temperature of the second shell of the electronic device, the second type of thermal resistance, and the first type of thermal resistance;

[0060] Determining the constraints of the first type of thermal resistance;

[0061] Based on the basic relationship and the constraint conditions of the first type of thermal resistance, determining a plurality of boundary conditions of the first type of thermal resistance;

[0062] The value range of the first type of thermal resistance is determined based on multiple boundary conditions of the first type of thermal resistance.

[0063] On the basis of the above-mentioned embodiments, in one embodiment of the present application, the basic relationship is obtained when the thermal resistance model includes two parallel branches, specifically, the first branch includes a first thermal resistor, a third thermal resistor and a fifth thermal resistor connected in series, and the second branch includes a second thermal resistor, a fourth thermal resistor and a sixth thermal resistor connected in series, wherein the first thermal resistor and the second thermal resistor are the first type of thermal resistors, and the third thermal resistor, the fourth thermal resistor, the fifth thermal resistor and the sixth thermal resistor are the second type of thermal resistors. In this embodiment, based on the thermal resistance model, determining the basic relationship between the thermal design power consumption of the heat source and the junction temperature of the heat source, the shell temperature of the first shell of the electronic device, the shell temperature of the second shell of the electronic device, the second type of thermal resistor and the first type of thermal resistor includes: based on the thermal resistance model, obtaining the following relationship:

[0064] The heat dissipation design power consumption of the heat source is equal to the sum of the heat dissipation design power consumption of the at least two parallel branches, that is, the sum of the heat dissipation design power consumption of the first branch and the second branch (similar to the current at the common end of each parallel branch in a circuit being equal to the sum of the currents of all parallel branches):

[0065] (1);

[0066] In the first branch, the heat loss is equal everywhere (similar to the current being equal everywhere in the same branch of a circuit):

[0067] (2);

[0068] In the second branch, the heat loss is equal everywhere (similar to the current being equal everywhere in the same branch of a circuit):

[0069] (3).

[0070] It should be noted that in the above formula, Characterize the junction temperature of the heat source (i.e., the temperature at the chip die); Represents the ambient temperature (i.e. the temperature of the air); Characterize the temperature of the chip package cover (i.e. the temperature at the chip case); Characterizing the temperature of the first housing (such as the temperature of the screen housing); Characterize the temperature of the substrate of the package structure (i.e. the temperature at the substrate (Board)); Characterize the temperature of the second shell (such as the temperature at the back shell (Cover)).

[0071] On the basis of the above embodiments, in one embodiment of the present application, based on the basic relationship and the constraint conditions of the first type of thermal resistance, multiple boundary conditions of the first type of thermal resistance are determined, and based on the multiple boundary conditions of the first type of thermal resistance, the value range of the first type of thermal resistance is determined to include:

[0072] Based on the basic relationship and the constraint condition of the first type of thermal resistance, determining a critical value condition (i.e., boundary condition) of the first thermal resistance and a critical value condition (i.e., boundary condition) of the second thermal resistance;

[0073] A value range of the first thermal resistance that simultaneously satisfies a critical value condition of the first thermal resistance and a critical value condition of the second thermal resistance is obtained, and a value range of the second thermal resistance that simultaneously satisfies a critical value condition of the first thermal resistance and a critical value condition of the second thermal resistance is obtained.

[0074] Optionally, in one embodiment of the present application, the constraints of the first type of thermal resistance include: the junction temperature of the heat source is not greater than the junction temperature threshold of the heat source; the shell temperature of the first shell is not greater than the shell temperature threshold of the first shell; the shell temperature of the second shell is not greater than the shell temperature threshold of the second shell.

[0075] On the basis of the above embodiments, in one embodiment of the present application, based on the basic relationship and the constraint conditions of the first type of thermal resistance, determining the value range of the first type of thermal resistance includes:

[0076] Based on the basic relationship and the shell temperature threshold of the second shell, a first critical value condition of the first thermal resistance is obtained. (4), where the temperature of the second shell is T c2 is a fixed value, is the shell temperature threshold of the second shell, is the heat flow in the second branch, is the heat flow in the first branch, is the temperature difference T at both ends of the first branch j -T a ;

[0077] Based on the basic relationship and the shell temperature threshold of the first shell, a first critical value condition of the second thermal resistance is obtained. (5), where the temperature of the first shell is T s is a fixed value, is the shell temperature threshold of the first shell, is the heat flow in the first branch, is the heat flow in the second branch, is the temperature difference T at both ends of the second branch j -T a ;

[0078] Based on the basic relationship and the junction temperature threshold of the heat source, a second critical value condition of the first thermal resistance or a second critical value condition of the second thermal resistance is obtained, wherein the second critical value condition of the first thermal resistance is: (6) The second critical value condition of the second thermal resistance is (7), where the temperature of the hot junction of the heat source is T j is a fixed value, which is the junction temperature threshold;

[0079] Obtaining a value range of the first thermal resistance and a value range of the second thermal resistance that satisfy the second critical value condition of the first thermal resistance or the second critical value condition of the second thermal resistance, and that satisfy the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance.

[0080] Specifically, obtaining the second critical value condition of the first thermal resistance or the second critical value condition of the second thermal resistance, and the value range of the first thermal resistance and the value range of the second thermal resistance that satisfy the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance include:

[0081] Obtaining a value range of the first thermal resistance that satisfies the second critical value condition of the first thermal resistance and satisfies the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance, or obtaining a value range of the first thermal resistance that satisfies the second critical value condition of the second thermal resistance and satisfies the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance;

[0082] Obtain a value range of the second thermal resistance that satisfies the second critical value condition of the first thermal resistance and satisfies the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance, or obtain a value range of the second thermal resistance that satisfies the second critical value condition of the second thermal resistance and satisfies the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance.

[0083] Taking obtaining the second critical value condition of the second thermal resistance and the value range of the first thermal resistance and the value range of the second thermal resistance that satisfy the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance (that is, obtaining the value range of the first thermal resistance that satisfies the second critical value condition of the second thermal resistance and the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance, and obtaining the value range of the second thermal resistance that satisfies the second critical value condition of the second thermal resistance and the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance) as an example, optionally, in one embodiment of the present application, obtaining the value range of the first thermal resistance and the value range of the second thermal resistance that satisfies the second critical value condition of the second thermal resistance and the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance includes:

[0084] The horizontal axis is R jc Thermal resistance value, the vertical axis is R jb Establish a coordinate system based on the thermal resistance value;

[0085] Based on formula (4), the relationship curve between the first thermal resistance value and the second thermal resistance value under the shell temperature threshold constraint of the second shell is obtained, which is recorded as curve 1, as shown in Figure 3 As shown;

[0086] Based on formula (5), the relationship curve between the first thermal resistance value and the second thermal resistance value under the shell temperature threshold constraint of the first shell is obtained, which is recorded as curve 2, as shown in Figure 3 As shown;

[0087] Based on formula (7), the relationship curve between the first thermal resistance value and the second thermal resistance value under the junction temperature threshold constraint is obtained, which is recorded as curve 3, as shown in Figure 3 As shown;

[0088] Based on curve 1, curve 2, and curve 3, a value range of the first thermal resistance and a value range of the second thermal resistance that satisfy the second critical value condition of the second thermal resistance and satisfy the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance are obtained. Specifically, the value range of the first thermal resistance and the value range of the second thermal resistance include the area defined by curve 1, curve 2, and curve 3 (such as Figure 3 The shaded filled part S in the figure) and the corresponding value points of curve 1, curve 2 and curve 3 in the limited area.

[0089] It should be noted that in practical applications, the thermal resistance values ​​of the first thermal resistor and the second thermal resistor cannot be negative. Therefore, in one embodiment of the present application, based on experience, only the portion of the curve obtained based on formula (4), formula (5), formula (6) and formula (7) located in the first quadrant can be retained, and the portions in other quadrants can be discarded to obtain Figure 3 The curve shown.

[0090] In another embodiment of the present application, the minimum value of the first thermal resistance and the second thermal resistance may also be calculated based on the thermal resistance model and the constraint conditions of the first type of thermal resistance.

[0091] Specifically, in one embodiment of the present application, when the second thermal resistance R jb When the temperature of the first shell is 0 and the temperature of the first shell is the shell temperature threshold of the first shell, the first thermal resistance R jc There is a minimum value R jc_min At this time, the temperature of the first shell is T s is a fixed value, is the shell temperature threshold of the first shell, according to formula (2), the heat flow of the first branch is (8), the heat flow in the second branch is (9), the temperature difference between the two ends of the first branch is (10), combining formula (8), formula (9) and formula (10), the minimum value of the first thermal resistance can be obtained:

[0092] .

[0093] When the first thermal resistance R jc Less than R jc_min When the second thermal resistance R jb For any value, the temperature of the first shell will exceed the shell temperature threshold.

[0094] When the first thermal resistance R jcWhen the temperature of the second shell is 0 and the temperature of the second shell is the shell temperature threshold of the second shell, the second thermal resistance R jb There is a minimum value R jb_min At this time, the temperature of the second shell is T c is a fixed value, is the shell temperature threshold of the second shell, according to formula (3), the heat flow of the second branch is (11), the heat flow of the first branch is (12), the temperature difference between the two ends of the second branch is (13), combining formula (11), formula (12) and formula (13), the minimum value of the second thermal resistance can be obtained:

[0095] .

[0096] When the second thermal resistance R jb Less than R jb_min When , no matter what the value of the first thermal resistance Rjc is, the temperature of the second shell will exceed the shell temperature threshold.

[0097] In addition, the embodiment of the present application can also obtain the maximum values ​​of the first thermal resistance and the second thermal resistance based on the thermal resistance model and the constraints of the first type of thermal resistance.

[0098] Optionally, the first thermal resistance R jc The maximum value R jc_max Based on the junction temperature threshold, specifically, according to formula (1), we can get: The second thermal resistance R jb The maximum value R jb_max It can be obtained based on the junction temperature threshold, or based on the maximum and minimum values ​​of the first thermal resistance. This application does not limit this, and it depends on the specific situation.

[0099] On the basis of any of the above embodiments, in an embodiment of the present application, the method for determining the thermal resistance further includes: simulating the thermal resistance model to obtain the resistance value of the second type of thermal resistance.

[0100] It should be noted that, in this embodiment, since the second type of thermal resistance is only related to the heat dissipation path of the heat source in the electronic device, and has nothing to do with the heat source itself, in this embodiment, as long as the heat dissipation path of the heat source in the electronic device is fixed, the second type of thermal resistance is fixed, that is, when different heat sources are replaced at the same position in the electronic device, the value of the second type of thermal resistance is a fixed value. Therefore, in this embodiment, a heat source with a known first type of thermal resistance can be used first, and the thermal resistance model can be used to obtain the thermal resistance value of the second type of thermal resistance.

[0101] Specifically, in one embodiment of the present application, the method for obtaining the value of the second type of thermal resistance includes:

[0102] Replacing the heat source of the thermal resistance to be confirmed in the thermal resistance model with a first heat source, wherein the value of the first type of thermal resistance of the first heat source is a known value;

[0103] Based on the temperature of each node in the thermal resistance model and the first type of thermal resistance, the value of the second type of thermal resistance is determined using the thermal resistance model.

[0104] Optionally, in an embodiment of the present application, taking the thermal resistance model including two parallel branches, namely, a first branch and a second branch, as an example, based on the temperature of each node in the thermal resistance model and the first type of thermal resistance, using the thermal resistance model, determining the value of the second type of thermal resistance includes:

[0105] Based on the junction temperature T of the first heat source j , the temperature T of the package cover of the component where the heat source is located c1 And the first thermal resistance Rjc_1 of the first heat source, the heat flux of the first branch is obtained ;

[0106] Based on the temperature T of the package cover of the component where the heat source is located c1 , the temperature of the first shell T s And the heat flow of the first branch, the third thermal resistance is obtained ;

[0107] Based on the temperature T of the first shell s 、Ambient temperature T a And the heat flow of the first branch, the fifth thermal resistance is obtained ;

[0108] Based on the junction temperature T of the first heat source j , the temperature T of the substrate of the component where the heat source is located b And the second thermal resistance Rjb_1 of the first heat source, the heat flux of the second branch is obtained ;

[0109] Based on the temperature T of the substrate of the component where the heat source is located b , the temperature of the second shell T c2 And the heat flow of the second branch, the fourth thermal resistance is obtained ;

[0110] Based on the temperature T of the second shell c2 、Ambient temperature T a And the heat flow of the second branch, the sixth thermal resistance is obtained .

[0111] In another embodiment of the present application, the method for obtaining the value of the second type of thermal resistance includes:

[0112] Based on the heat design power consumption of the first heat source and the heat flow ratio of each branch in the at least two parallel branches, the heat flow in each branch is obtained;

[0113] Based on the heat flow in each branch and the temperature of each node in the thermal resistance model, the value of the second type of thermal resistance is obtained by using the thermal resistance model.

[0114] Taking the thermal resistance model including two parallel branches, a first branch and a second branch, as an example, the method for obtaining the value of the second type of thermal resistance includes:

[0115] First, the heat flow I1 of the first branch and the heat flow I2 of the second branch are obtained by using the thermal design power consumption TDP of the first heat source and the ratio of the heat flow in the first branch and the second branch;

[0116] Then based on the temperature T of the package cover of the component where the heat source is located c1 , the temperature of the first shell T s And the heat flow of the first branch, the third thermal resistance is obtained ;

[0117] Based on the temperature T of the first shell s 、Ambient temperature T a And the heat flow of the first branch, the fifth thermal resistance is obtained ;

[0118] Based on the temperature T of the substrate of the component where the heat source is located b , the temperature of the second shell T c2 And the heat flow of the second branch, the fourth thermal resistance is obtained ;

[0119] Based on the temperature T of the second shell c2 、Ambient temperature T a And the heat flow of the second branch, the sixth thermal resistance is obtained .

[0120] In other embodiments of the present application, the value of the second type of thermal resistance may also be obtained by other methods, which is not limited in the present application and depends on the specific circumstances.

[0121] In summary, the method for determining the thermal resistance of a heat source in an electronic device provided in an embodiment of the present application establishes a thermal resistance model according to the heat dissipation path of the heat source, and obtains the value range of the first type of thermal resistance related to the heat source under the operating temperature limit of the device through a single simulation calculation, such as the dual thermal resistance range of the chip package that can be used in the electronic device, which is time-saving and has high accuracy.

[0122] Accordingly, the embodiment of the present application also provides a device for determining the thermal resistance of a heat source in an electronic device, such as Figure 4 Said thermal resistance determining device comprises:

[0123] The model building unit 10, in response to a user instruction, builds a thermal resistance model based on a heat dissipation path of a heat source in the electronic device, the thermal resistance model comprising a first type of thermal resistance and a second type of thermal resistance, wherein the first type of thermal resistance is related to the heat source, the second type of thermal resistance is related to the heat dissipation path of the heat source in the electronic device, and the resistance value of the second type of thermal resistance is a known resistance value;

[0124] The calculation unit 20 determines multiple boundary conditions of the first type of thermal resistance using the thermal resistance model based on the thermal design power consumption of the heat source and the junction temperature threshold of the heat source, the shell temperature threshold of the first shell of the electronic device, the shell temperature threshold of the second shell of the electronic device, and the second type of thermal resistance, and determines the value range of the first type of thermal resistance based on the multiple boundary conditions of the first type of thermal resistance.

[0125] Optionally, in one embodiment of the present application, the thermal resistance model includes at least two parallel branches, which correspond one-to-one to the heat dissipation paths from the heat source in the electronic device to the outside of the electronic device, and different parallel branches correspond to heat dissipation paths in different directions; specifically, each parallel branch includes at least one first-type thermal resistance and at least one second-type thermal resistance connected in series, wherein the first-type thermal resistance is related to the internal structure of the component where the heat source is located, and the second-type thermal resistance is related to the heat dissipation path from the component where the heat source is located to the outside. Taking chip packaging as an example, the component where the heat source is located is the chip and its packaging structure, and the heat dissipation path from the component where the heat source is located to the outside is the heat dissipation path from the packaging structure of the chip to the outside of the electronic device.

[0126] Specifically, in one embodiment of the present application, Figure 2 As shown, the at least two parallel branches include a first branch and a second branch in parallel, wherein the first branch corresponds to a heat dissipation path from a heat source to a first housing (such as an upper housing) of the electronic device, and the second branch corresponds to a heat dissipation path from a heat source to a second housing (such as a lower housing) of the electronic device, but the present application does not limit this. In other embodiments of the present application, the at least two parallel branches may also include other numbers of branches. The thermal resistance determination device provided by the present application is described below by taking the at least two parallel branches including the first branch and the second branch in parallel as an example.

[0127] Optionally, in one embodiment of the present application, continue as Figure 2As shown, the first branch includes a first thermal resistor R1, a third thermal resistor R3 and a fifth thermal resistor R5 connected in series, and the second branch includes a second thermal resistor R2, a fourth thermal resistor R4 and a sixth thermal resistor R6 connected in series; optionally, the heat source is a chip, and the component where the heat source is located is a chip packaging structure. In this embodiment, the first thermal resistor is the equivalent thermal resistance of the heat dissipation path between the thermal junction of the chip and the packaging cover of the chip packaging structure, the second thermal resistor is the equivalent thermal resistance of the heat dissipation path between the thermal junction of the chip and the substrate of the chip packaging structure, the third thermal resistor is the equivalent thermal resistance of the heat dissipation path between the packaging cover and the first shell of the electronic device, the fifth thermal resistor is the equivalent thermal resistance of the heat dissipation path between the first shell of the electronic device and the external environment, the fourth thermal resistor is the equivalent thermal resistance of the heat dissipation path between the substrate of the packaging structure and the second shell of the electronic device, and the sixth thermal resistor is the equivalent thermal resistance of the heat dissipation path between the second shell of the electronic device and the external environment. It should be noted that, in the above embodiment, the first shell and the second shell are two opposite shells of the electronic device. Specifically, the first shell is the upper shell of the electronic device, and the second shell is the back shell of the electronic device.

[0128] In the above embodiment, the first thermal resistor and the second thermal resistor are the first type of thermal resistors, and the third thermal resistor, the fourth thermal resistor, the fifth thermal resistor and the sixth thermal resistor are the second type of thermal resistors.

[0129] Specifically, in one embodiment of the present application, the calculation unit is used to perform, based on the thermal design power consumption of the heat source and the junction temperature threshold of the heat source, the shell temperature threshold of the first shell of the electronic device, the shell temperature threshold of the second shell of the electronic device, and the second type of thermal resistance, using the thermal resistance model to determine multiple boundary conditions of the first type of thermal resistance, and determine the value range of the first type of thermal resistance based on the multiple boundary conditions. Specifically used for:

[0130] Based on the thermal resistance model, determining a basic relationship between the thermal design power consumption of the heat source and the junction temperature of the heat source, the shell temperature of the first shell of the electronic device, the shell temperature of the second shell of the electronic device, the second type of thermal resistance, and the first type of thermal resistance;

[0131] Determining the constraints of the first type of thermal resistance;

[0132] Based on the basic relationship and the constraint conditions of the first type of thermal resistance, a plurality of boundary conditions of the first type of thermal resistance are determined, and based on the plurality of boundary conditions, a value range of the first type of thermal resistance is determined.

[0133] On the basis of the above embodiments, in one embodiment of the present application, the calculation unit is used to determine multiple boundary conditions of the first type of thermal resistance based on the basic relationship and the constraint conditions of the first type of thermal resistance, and determine the value range of the first type of thermal resistance based on the multiple boundary conditions, and is specifically used to perform:

[0134] Based on the basic relationship and the constraint condition of the first type of thermal resistance, determining a critical value condition (i.e., boundary condition) of the first thermal resistance and a critical value condition (i.e., boundary condition) of the second thermal resistance;

[0135] A value range of the first thermal resistance and a value range of the second thermal resistance that simultaneously satisfy the critical value condition of the first thermal resistance and the critical value condition of the second thermal resistance are obtained, that is, a value range of the first thermal resistance that simultaneously satisfies the critical value condition of the first thermal resistance and the critical value condition of the second thermal resistance are obtained, and a value range of the second thermal resistance that simultaneously satisfies the critical value condition of the first thermal resistance and the critical value condition of the second thermal resistance are obtained.

[0136] Optionally, in one embodiment of the present application, the constraints of the first type of thermal resistance include: the junction temperature of the heat source is not greater than the junction temperature threshold of the heat source; the shell temperature of the first shell is not greater than the shell temperature threshold of the first shell; the shell temperature of the second shell is not greater than the shell temperature threshold of the second shell.

[0137] On the basis of the above embodiments, in one embodiment of the present application, the calculation sheet is used to determine multiple boundary conditions of the first type of thermal resistance based on the basic relationship and the constraint conditions of the first type of thermal resistance, and determine the value range of the first type of thermal resistance based on the multiple boundary conditions of the first type of thermal resistance, and is specifically used to perform:

[0138] Based on the basic relationship and the shell temperature threshold of the second shell, obtaining a first critical value condition of the first thermal resistance;

[0139] Based on the basic relationship and the shell temperature threshold of the first shell, obtaining a first critical value condition of the second thermal resistance;

[0140] Based on the basic relationship and the junction temperature threshold of the heat source, obtaining a second critical value condition of the first thermal resistance or a second critical value condition of the second thermal resistance;

[0141] Obtaining a value range of the first thermal resistance and a value range of the second thermal resistance that satisfy the second critical value condition of the first thermal resistance or the second critical value condition of the second thermal resistance, and that satisfy the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance. Specifically, obtaining a value range of the first thermal resistance and a value range of the second thermal resistance that satisfy the second critical value condition of the first thermal resistance or the second critical value condition of the second thermal resistance, and that satisfy the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance includes:

[0142] Obtaining a value range of the first thermal resistance that satisfies the second critical value condition of the first thermal resistance and satisfies the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance, or obtaining a value range of the first thermal resistance that satisfies the second critical value condition of the second thermal resistance and satisfies the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance;

[0143] Obtain a value range of the second thermal resistance that satisfies the second critical value condition of the first thermal resistance and satisfies the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance, or obtain a value range of the second thermal resistance that satisfies the second critical value condition of the second thermal resistance and satisfies the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance.

[0144] Taking obtaining the second critical value condition of the second thermal resistance, and the value range of the first thermal resistance and the value range of the second thermal resistance that satisfy the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance as an example, optionally, in one embodiment of the present application, obtaining the second critical value condition of the second thermal resistance, and the value range of the first thermal resistance and the value range of the second thermal resistance that satisfy the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance includes:

[0145] The horizontal axis is R jc Thermal resistance value, the vertical axis is R jb Establish a coordinate system based on the thermal resistance value;

[0146] Based on the first critical value condition of the first thermal resistance, a relationship curve between the first thermal resistance value and the second thermal resistance value under the shell temperature threshold constraint of the second shell is obtained, which is recorded as curve 1;

[0147] Based on the first critical value condition of the second thermal resistance, a relationship curve between the first thermal resistance value and the second thermal resistance value under the shell temperature threshold constraint of the first shell is obtained, which is recorded as curve 2;

[0148] A relationship curve between the first thermal resistance value and the second thermal resistance value under the junction temperature threshold constraint is obtained based on the second critical value condition of the second thermal resistance, which is recorded as curve 3;

[0149] Based on curve 1, curve 2 and curve 3, the value range of the first thermal resistance and the value range of the second thermal resistance that satisfy the second critical value condition of the second thermal resistance and satisfy the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance are obtained.

[0150] It should be noted that in practical applications, the thermal resistance values ​​of the first thermal resistor and the second thermal resistor cannot be negative. Therefore, in one embodiment of the present application, based on experience, only the portions of curve 1, curve 2 and curve 3 located in the first quadrant are retained, and the portions in other quadrants are discarded to obtain Figure 3 The curve shown.

[0151] Based on any of the above embodiments, in one embodiment of the present application, the calculation unit is further used to simulate the thermal resistance model to obtain the resistance value of the second type of thermal resistance.

[0152] It should be noted that, in this embodiment, since the second type of thermal resistance is only related to the heat dissipation path of the heat source in the electronic device, and has nothing to do with the heat source itself, in this embodiment, as long as the heat dissipation path of the heat source in the electronic device is fixed, the second type of thermal resistance is fixed, that is, when different heat sources are replaced at the same position in the electronic device, the value of the second type of thermal resistance is a fixed value. Therefore, in this embodiment, a heat source with a known first type of thermal resistance can be used first, and the thermal resistance model can be used to obtain the thermal resistance value of the second type of thermal resistance.

[0153] Specifically, in one embodiment of the present application, the method for obtaining the value of the second type of thermal resistance includes:

[0154] Replacing the heat source of the thermal resistance to be confirmed in the thermal resistance model with a first heat source, wherein the value of the first type of thermal resistance of the first heat source is a known value;

[0155] Based on the temperature of each node in the thermal resistance model and the first type of thermal resistance, the value of the second type of thermal resistance is determined using the thermal resistance model.

[0156] In another embodiment of the present application, the method for obtaining the value of the second type of thermal resistance includes:

[0157] Based on the heat design power consumption of the first heat source and the heat flow ratio of each branch in the at least two parallel branches, the heat flow in each branch is obtained;

[0158] Based on the heat flow in each branch and the temperature of each node in the thermal resistance model, the value of the second type of thermal resistance is obtained by using the thermal resistance model.

[0159] In other embodiments of the present application, the value of the second type of thermal resistance may also be obtained by other methods, which is not limited in the present application and depends on the specific circumstances.

[0160] In summary, the thermal resistance determination device for a heat source in an electronic device provided in an embodiment of the present application establishes a thermal resistance model according to the heat dissipation path of the heat source, and can obtain the value range of the first type of thermal resistance related to the heat source through a single simulation calculation, such as the dual thermal resistance range of the chip package in the electronic device, with short time consumption and high accuracy.

[0161] The embodiment of the present application can abstract the packaging structure as a heat source before a specific chip packaging structure solution is formed. Through the electronic device shell temperature, design power consumption and other limiting conditions, the range of the dual thermal resistance of the available chip packaging structure can be obtained in advance, so as to effectively guide the selection and design of the packaging structure, form a packaging structure that meets the operating temperature limit, effectively simplify the difficulty of packaging structure design and selection, and improve efficiency.

[0162] In addition, the present application also provides a method for manufacturing a packaging structure. Figure 5 As shown, including:

[0163] S10: establishing a thermal resistance model based on the heat dissipation path of the heat source in the packaging structure when the packaging structure is applied to the electronic device, the thermal resistance model including a first type of thermal resistance and a second type of thermal resistance, wherein the first type of thermal resistance is related to the heat source, the second type of thermal resistance is related to the heat dissipation path of the heat source in the electronic device, and the resistance value of the second type of thermal resistance is a known resistance value;

[0164] S20: Based on the thermal design power consumption of the heat source and the junction temperature threshold of the heat source, the shell temperature threshold of the first shell of the electronic device, the shell temperature threshold of the second shell of the electronic device, and the second type of thermal resistance, using the thermal resistance model, determining multiple boundary conditions of the first type of thermal resistance, and determining a value range of the first type of thermal resistance based on the multiple boundary conditions of the first type of thermal resistance;

[0165] S30: Based on the value range of the first type of thermal resistance, design the packaging structure so that the first type of thermal resistance in the packaging structure is within the value range of the first type of thermal resistance.

[0166] Optionally, based on the above embodiments, in an embodiment of the present application, the method further includes: determining whether the first type of thermal resistance of the heat source in the existing packaging structure meets a preset condition based on the value range of the first type of thermal resistance.

[0167] Optionally, in one embodiment of the present application, the preset condition includes: a first type of thermal resistance in an existing packaging structure is within a value range of the first type of thermal resistance determined using the thermal resistance model; taking an existing packaging structure including two parallel branches, a first branch and a second branch, as an example, the preset condition includes the first thermal resistance in the existing packaging structure being within a value range of the first thermal resistance, and the second thermal resistance in the existing packaging structure being within a value range of the second thermal resistance.

[0168] Based on the above embodiment, in one embodiment of the present application, the method further includes:

[0169] If the first type of thermal resistance in the existing packaging structure does not meet the preset conditions, adjust the preset parameters of at least one constituent film layer in the existing packaging structure to adjust the value of the first type of thermal resistance in the existing packaging structure until the first type of thermal resistance in the existing packaging structure meets the preset conditions.

[0170] Optionally, in one embodiment of the present application, adjusting the preset parameters of at least one constituent film layer in the existing packaging structure includes at least one of the following:

[0171] Adjusting the material of at least one film layer in the existing packaging structure to adjust the thermal conductivity of the film layer;

[0172] The thickness of at least one constituent film layer in the existing packaging structure is adjusted.

[0173] In summary, the manufacturing method of the packaging structure provided in the embodiment of the present application establishes a thermal resistance model based on the heat dissipation path of the heat source in the packaging structure when the packaging structure is applied to the electronic device, and determines the value range of the first type of thermal resistance in the packaging structure based on the thermal resistance model and the design limitations of the electronic device shell temperature and junction temperature, so as to guide the design of the packaging structure, thereby greatly reducing the phenomenon that the yield of mass-produced packaging structure products is low because the first type of thermal resistance cannot be located within the value range of the first type of thermal resistance, that is, the phenomenon that the yield of mass-produced packaging structure products is low due to the inability to meet the thermal design requirements is greatly reduced, and at the same time, the thermal design work of the packaging is greatly simplified.

[0174] In addition, for the selected packaging structure, the manufacturing method of the packaging structure provided in the embodiment of the present application can also determine the resistance value of the first type of thermal resistor in the existing packaging structure based on the specific structure and material of the selected packaging structure through simulation and other means, and judge whether the resistance value is within the value range of the first type of thermal resistor determined by the thermal resistance model in the aforementioned embodiment, so as to determine whether the first type of thermal resistor in the selected packaging structure meets the constraints of TDP and chip junction temperature, and when the first type of thermal resistor in the existing packaging structure does not meet the constraints of TDP and chip junction temperature, adjust the existing packaging structure until the first type of thermal resistor in the existing packaging structure meets the constraints of TDP and chip junction temperature, so that the existing packaging structure can meet the requirements of thermal design, while greatly simplifying the thermal design work of the packaging.

[0175] In this specification, each embodiment is described in a progressive, parallel, or progressive and parallel manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0176] It should be noted that in the description of the present application, it should be understood that the description of the drawings and embodiments is illustrative rather than restrictive. The same reference numerals throughout the embodiments of the specification mark the same structure. In addition, for the purpose of understanding and ease of description, the drawings may exaggerate the thickness of some layers, films, panels, regions, etc. It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the term "includes", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that the article or equipment including a series of elements includes not only those elements, but also includes other elements that are not clearly listed, or also includes elements inherent to such articles or equipment. In the absence of more restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the articles or equipment including the above elements.

[0177] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for determining the thermal resistance of a heat source in an electronic device, comprising: Establishing a thermal resistance model based on a heat dissipation path of a heat source in an electronic device, the thermal resistance model comprising a first type of thermal resistance and a second type of thermal resistance, wherein the first type of thermal resistance is related to the heat source, the second type of thermal resistance is related to the heat dissipation path of the heat source in the electronic device, and the resistance value of the second type of thermal resistance is a known resistance value; Based on the thermal design power consumption of the heat source and the junction temperature threshold of the heat source, the shell temperature threshold of the first shell of the electronic device, the shell temperature threshold of the second shell of the electronic device, and the second type of thermal resistance, the thermal resistance model is used to determine multiple boundary conditions of the first type of thermal resistance, and based on the multiple boundary conditions of the first type of thermal resistance, the value range of the first type of thermal resistance is determined; wherein the first shell and the second shell are relative shells of the electronic device.

2. According to the method for determining the thermal resistance of a heat source in an electronic device according to claim 1, the thermal resistance model includes at least two parallel branches, which correspond one-to-one to the heat dissipation paths from the heat source in the electronic device to the outside of the electronic device; each of the parallel branches includes at least one first-type thermal resistance and at least one second-type thermal resistance connected in series; the first-type thermal resistance is related to the internal structure of the component where the heat source is located, and the second-type thermal resistance is related to the path structure from the component where the heat source is located to the outside of the heat dissipation.

3. The method for determining the thermal resistance of a heat source in an electronic device according to claim 2, wherein the at least two parallel branches include a first branch and a second branch connected in parallel, the first branch includes a first thermal resistor, a third thermal resistor and a fifth thermal resistor connected in series, and the second branch includes a second thermal resistor, a fourth thermal resistor and a sixth thermal resistor connected in series, wherein: The heat source is a chip, and the component is a chip packaging structure; the first thermal resistance is the equivalent thermal resistance of the heat dissipation path between the thermal junction of the chip and the packaging cover of the chip packaging structure, the second thermal resistance is the equivalent thermal resistance of the heat dissipation path between the thermal junction of the chip and the substrate of the chip packaging structure, the third thermal resistance is the equivalent thermal resistance of the heat dissipation path between the packaging cover and the first shell of the electronic device, the fifth thermal resistance is the equivalent thermal resistance of the heat dissipation path between the first shell of the electronic device and the external environment, the fourth thermal resistance is the equivalent thermal resistance of the heat dissipation path between the substrate of the chip packaging structure and the second shell of the electronic device, and the sixth thermal resistance is the equivalent thermal resistance of the heat dissipation path between the second shell of the electronic device and the external environment; wherein, The first thermal resistor and the second thermal resistor are the first type of thermal resistors, and the third thermal resistor, the fourth thermal resistor, the fifth thermal resistor and the sixth thermal resistor are the second type of thermal resistors.

4. The method for determining the thermal resistance of a heat source in an electronic device according to claim 1, based on the thermal design power consumption of the heat source and the junction temperature threshold of the heat source, the shell temperature threshold of the first shell of the electronic device, the shell temperature threshold of the second shell of the electronic device, and the second type of thermal resistance, using the thermal resistance model, determining the value range of the first type of thermal resistance comprises: Based on the thermal resistance model, determining a basic relationship between the thermal design power consumption of the heat source and the junction temperature of the heat source, the shell temperature of the first shell of the electronic device, the shell temperature of the second shell of the electronic device, the second type of thermal resistance, and the first type of thermal resistance; Determining the constraints of the first type of thermal resistance; Based on the basic relationship and the constraint conditions of the first type of thermal resistance, a value range of the first type of thermal resistance is determined.

5. The method for determining the thermal resistance of a heat source in an electronic device according to claim 4, wherein the basic relationship is obtained when the thermal resistance model includes two parallel branches; the thermal resistance model includes a first branch and a second branch connected in parallel, the first branch includes a first thermal resistor, the second branch includes a second thermal resistor, and the first thermal resistor and the second thermal resistor are the first type of thermal resistors; Based on the basic relationship and the constraint conditions of the first type of thermal resistance, the value range of the first type of thermal resistance is determined to include: Based on the basic relationship and the constraint condition of the first type of thermal resistance, determining a critical value condition of the first thermal resistance and a critical value condition of the second thermal resistance; A value range of the first thermal resistance and a value range of the second thermal resistance that simultaneously satisfy a critical value condition of the first thermal resistance and a critical value condition of the second thermal resistance are obtained.

6. The method for determining the thermal resistance of a heat source in an electronic device according to claim 4, wherein the constraint conditions of the first type of thermal resistance include: The junction temperature of the heat source is not greater than the junction temperature threshold of the heat source; The shell temperature of the first shell is not greater than the shell temperature threshold of the first shell; The shell temperature of the second shell is not greater than a shell temperature threshold of the second shell.

7. The method for determining the thermal resistance of a heat source in an electronic device according to claim 6, wherein the thermal resistance model comprises a first branch and a second branch connected in parallel, the first branch corresponds to a heat dissipation path of the heat source in the electronic device toward the first shell, the second branch corresponds to a heat dissipation path of the heat source in the electronic device toward the second shell, the first branch comprises a first thermal resistor, the second branch comprises a second thermal resistor, and the first thermal resistor and the second thermal resistor are first-type thermal resistors; Based on the basic relationship and the constraint conditions of the first type of thermal resistance, the value range of the first type of thermal resistance is determined to include: Based on the basic relationship and the shell temperature threshold of the second shell, obtaining a first critical value condition of the first thermal resistance; Based on the basic relationship and the shell temperature threshold of the first shell, obtaining a first critical value condition of the second thermal resistance; Based on the basic relationship and the junction temperature threshold of the heat source, obtaining a second critical value condition of the first thermal resistance or a second critical value condition of the second thermal resistance; Obtaining a value range of the first thermal resistance that satisfies the second critical value condition of the first thermal resistance and satisfies the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance, or obtaining a value range of the first thermal resistance that satisfies the second critical value condition of the second thermal resistance and satisfies the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance; Obtain a value range of the second thermal resistance that satisfies the second critical value condition of the first thermal resistance and satisfies the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance, or obtain a value range of the second thermal resistance that satisfies the second critical value condition of the second thermal resistance and satisfies the first critical value condition of the first thermal resistance and the first critical value condition of the second thermal resistance.

8. The method for determining the thermal resistance of a heat source in an electronic device according to claim 1, wherein the method for obtaining the value of the second type of thermal resistance comprises: Replacing the heat source of the thermal resistance to be confirmed in the thermal resistance model with a first heat source, wherein the value of the first type of thermal resistance of the first heat source is a known value; Based on the temperature of each node in the thermal resistance model and the first type of thermal resistance, the value of the second type of thermal resistance is determined using the thermal resistance model.

9. A device for determining thermal resistance of a heat source in an electronic device, comprising: A model building unit, in response to a user instruction, builds a thermal resistance model based on a heat dissipation path of a heat source in the electronic device, the thermal resistance model comprising a first type of thermal resistance and a second type of thermal resistance, wherein the first type of thermal resistance is related to the heat source, the second type of thermal resistance is related to the heat dissipation path of the heat source in the electronic device, and the resistance value of the second type of thermal resistance is a known resistance value; The calculation unit determines multiple boundary conditions of the first type of thermal resistance using the thermal resistance model based on the thermal design power consumption of the heat source and the junction temperature threshold of the heat source, the shell temperature threshold of the first shell of the electronic device, the shell temperature threshold of the second shell of the electronic device, and the second type of thermal resistance, and determines a value range of the first type of thermal resistance based on the multiple boundary conditions of the first type of thermal resistance.

10. A method for manufacturing a packaging structure, comprising: When the packaging structure is applied to an electronic device, a thermal resistance model is established for the heat dissipation path of the heat source in the packaging structure, the thermal resistance model includes a first type of thermal resistance and a second type of thermal resistance, wherein the first type of thermal resistance is related to the heat source, the second type of thermal resistance is related to the heat dissipation path of the heat source in the electronic device, and the resistance value of the second type of thermal resistance is a known resistance value; Based on the thermal design power consumption of the heat source and the junction temperature threshold of the heat source, the shell temperature threshold of the first shell of the electronic device, the shell temperature threshold of the second shell of the electronic device, and the second type of thermal resistance, using the thermal resistance model, multiple boundary conditions of the first type of thermal resistance are determined, and based on the multiple boundary conditions of the first type of thermal resistance, a value range of the first type of thermal resistance is determined; The packaging structure is designed based on the value range of the first type of thermal resistance.

11. The manufacturing method according to claim 10, further comprising: Based on the value range of the first type of thermal resistance, it is determined whether the first type of thermal resistance of the heat source in the existing packaging structure meets a preset condition.

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