Carrying head for wafer processing and chemical mechanical polishing apparatus

Abstract

The embodiment of the present application provides a kind of for wafer processing's bearing head and chemical mechanical polishing equipment, bearing head includes: bearing head main body;Retaining ring, retaining ring is set to the side of bearing head main body towards wafer, and can limit wafer in middle position, retaining ring is equipped with installation hole along its axial through;Anti-skid piece mechanism, anti-skid piece mechanism is at least partially located in installation hole, the anti-skid piece main body of anti-skid piece mechanism includes axially extending lever and the anti-skid component of the end of lever towards polishing unit, lever is located in installation hole, and can reciprocate between first position and second position, anti-skid component blocks wafer.The embodiment of the present application provides a kind of for wafer processing's bearing head and chemical mechanical polishing equipment, can avoid wafer from bearing head and polishing unit between sliding out.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chemical mechanical polishing, in particular to a carrier head for wafer processing and a chemical mechanical polishing device. BACKGROUND

[0002] Chemical mechanical polishing (CMP) is a kind of global planarization ultra-precision surface processing technology. Chemical mechanical polishing usually sucks the wafer to the bottom surface of the carrier head (also known as the polishing head), and limits the wafer radially with the retaining ring at the lower part of the carrier head. The wafer to be polished is pressed against the upper surface of the polishing pad of the polishing unit. The carrier head is rotated relative to the polishing pad under the actuation of the driving assembly and gives the wafer a downward load. At the same time, the polishing liquid is supplied to the upper surface of the polishing pad and distributed between the wafer and the polishing pad, so that the wafer completes the chemical mechanical polishing of the wafer under the joint action of chemical and mechanical. However, sometimes the wafer slips out of the carrier head, resulting in damage to the wafer. SUMMARY

[0003] Therefore, the embodiments of the present application provide a carrier head for wafer processing and a chemical mechanical polishing device, which can avoid the wafer from slipping out of the carrier head and the polishing unit.

[0004] According to the first aspect of the present application, a carrier head for wafer processing is provided, which comprises: a carrier head body; a retaining ring arranged to the side of the carrier head body facing the wafer and capable of limiting the wafer at the middle position thereof, the retaining ring being provided with a mounting hole penetrating along the axial direction thereof; an anti-slip sheet mechanism located at least partially in the mounting hole, the anti-slip sheet main body of the anti-slip sheet mechanism comprising an axially extending rod and an anti-slip component arranged at the end of the rod facing the polishing unit, the rod being located in the mounting hole and capable of reciprocating between a first position and a second position, and the anti-slip component blocking the wafer; wherein, when the carrier head abuts the wafer against the polishing unit, the anti-slip sheet main body is retracted into the mounting hole to be in the first position; when the carrier head is axially separated from the polishing unit, the anti-slip sheet main body is extended from the mounting hole and is in the second position, and the wafer is blocked from slipping out of the gap formed between the retaining ring and the polishing unit by the anti-slip component.

[0005] Optionally, a mounting hole is formed on one side of the carrier head body facing the wafer, and a corresponding assembly hole is formed on the wafer; the anti-skid piece mechanism comprises an anti-skid piece seat, one end of the anti-skid piece seat extends into the assembly hole, the other end of the anti-skid piece seat extends into the mounting hole, and the anti-skid piece seat is axially through the mounting hole; the anti-skid piece seat has an accommodating cavity extending along the axial direction inside the anti-skid piece seat; the bottom of the accommodating cavity opposite to the carrier head body is configured with a through hole; the rod member is arranged in the accommodating cavity, and the anti-skid assembly can be extended out of the through hole.

[0006] Optionally, the mounting hole comprises a first hole section and a second hole section away from the carrier head body in sequence, the first hole section is configured to accommodate the anti-skid piece seat, and the second hole section corresponds to the through hole and is configured to pass through the anti-skid assembly.

[0007] Optionally, the rod member comprises a first rod section and a second rod section away from the carrier head body in sequence, the outer diameter of the second rod section is greater than the outer diameter of the first rod section and the inner diameter of the through hole, so that the anti-skid piece body can be limited in the accommodating cavity by abutting the second rod section with the through hole when the anti-skid piece body moves from the first position to the second position; the anti-skid assembly is connected to the lower surface of the second rod section.

[0008] Optionally, the anti-skid assembly comprises an anti-skid rod section connected to the lower surface of the second rod section, the anti-skid rod section can pass through the through hole and reciprocate with the rod member between the first position and the second position; when the anti-skid piece body is located at the second position, the anti-skid rod section is extended out of the second hole section to block the wafer.

[0009] Optionally, the lower surface of the retaining ring is configured with a matching groove, and the edge of the matching groove is tangent to the inner diameter of the retaining ring, or the edge of the matching groove protrudes inwardly from the inner diameter of the retaining ring and is not greater than 1mm; the second hole section and the through hole are both in communication with the matching groove.

[0010] Optionally, the anti-skid assembly comprises an anti-skid rod section connected to the lower surface of the second rod section and an anti-skid top pin, the anti-skid top pin comprises a connecting rod section and an anti-skid piece, the connecting rod section is arranged on the upper surface of the anti-skid piece and connected with the anti-skid rod section; when the anti-skid piece body moves from the second position to the first position, the anti-skid top pin can move into the matching groove; when the anti-skid piece body moves from the first position to the second position, the anti-skid top pin is extended out of the matching groove, and the edge of the anti-skid piece abuts the edge of the wafer to block the wafer from sliding out of the gap between the retaining ring and the polishing unit.

[0011] Optionally, the matching groove is a circular groove, the number of the matching grooves corresponds to the number of the anti-skid components of the anti-skid mechanism, the anti-skid piece is in a circular piece structure, and the center of the anti-skid piece coincides with the axis of the anti-skid piece body.

[0012] Optionally, the anti-skid mechanism further comprises an elastic member, the elastic member is arranged in the accommodating cavity and sleeved on the outer periphery of the first rod segment, one end of the elastic member is abutted to one side of the bearing head body facing the wafer, and the other end of the elastic member is abutted to the upper surface of the second rod end, so as to provide power for the movement of the rod member from the first position to the second position and enable the rod member to compress the elastic member to retract into the accommodating cavity.

[0013] Optionally, the elastic member comprises a spring, the spring is sleeved on the outer periphery of the first rod segment, one end of the spring is abutted to one side of the bearing head body facing the wafer, and the other end of the spring is abutted to the upper surface of the second rod segment.

[0014] Optionally, the anti-skid piece seat comprises a first seat segment and a second seat segment, and the first seat segment is threadedly connected with the assembly hole.

[0015] Optionally, the bearing head comprises a plurality of anti-skid mechanisms distributed along the circumference of the retaining ring.

[0016] Optionally, a plurality of grooves are formed in the surface of the retaining ring facing the polishing unit, the grooves are uniformly formed along the circumference of the retaining ring, the forming direction of the grooves coincides with the radial direction of the retaining ring, one anti-skid mechanism is arranged between two adjacent grooves, or two or more anti-skid mechanisms are uniformly arranged at intervals between two adjacent grooves.

[0017] Optionally, the anti-skid component is made of a first plastic material or stainless steel, and the first plastic material comprises one or more of polyether ether ketone, polyphenylene sulfide, polyimide, polyethylene terephthalate, and polytetrafluoroethylene.

[0018] Optionally, the elastic member is made of a second plastic material, and the second plastic material comprises one or more of polyamide, polyether ether ketone, and polytetrafluoroethylene.

[0019] According to the second aspect of the present application, a chemical mechanical polishing device is provided, and the chemical mechanical polishing device comprises the bearing head of the first aspect.

[0020] According to the wafer processing carrier head and the chemical mechanical polishing device provided by the embodiment of the present application, the mounting hole is formed on the retaining ring, and the anti-skid piece mechanism capable of reciprocating between the first position and the second position is arranged in the mounting hole, so that when the carrier head abuts against the polishing unit, the anti-skid piece mechanism moves into the mounting hole, and the lower surface of the retaining ring can be stably attached to the polishing unit. When the gap appears between the retaining ring and the polishing unit, the anti-skid piece mechanism can be extended from below the retaining ring, so as to block the wafer from sliding out of the gap between the retaining ring and the polishing unit. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments described in the embodiments of the present application, and other drawings can also be obtained by those skilled in the art according to these drawings.

[0022] Figure 1 It is a schematic diagram of the chemical mechanical polishing device according to the second direction of an embodiment of the present application.

[0023] Figure 2 It is a sectional view of a chemical mechanical polishing device.

[0024] Figure 3 It is Figure 2 It is an enlarged view of A in FIG.

[0025] Figure 4 It is a sectional view of an embodiment of the carrier head according to the first aspect of the present application, and the anti-skid piece body is located at the first position.

[0026] Figure 5 It is Figure 4 It is an enlarged view of B in FIG.

[0027] Figure 6 It is a sectional view of an embodiment of the carrier head according to the first aspect of the present application, and the anti-skid piece body is located at the second position.

[0028] Figure 7 It is Figure 6 It is an enlarged view of C in FIG.

[0029] Figure 8 It is a sectional view of another embodiment of the carrier head according to the first aspect of the present application, and the anti-skid piece body is located at the first position.

[0030] Figure 9 It is Figure 8 It is an enlarged view of D in FIG.

[0031] Figure 10Fig. 6 is a sectional view of another embodiment of the carrier head according to the first aspect of the present application, this time with the anti-slip sheet body in the second position;

[0032] Figure 11 Fig. 6 is a sectional view of another embodiment of the carrier head according to the first aspect of the present application, this time with the anti-slip sheet body in the second position; Figure 10 Fig. 6 is a sectional view of another embodiment of the carrier head according to the first aspect of the present application, this time with the anti-slip sheet body in the second position;

[0033] Figure 12 Fig. 6 is a sectional view of another embodiment of the carrier head according to the first aspect of the present application, this time with the anti-slip sheet body in the second position. Figure 4 Fig. 6 is a sectional view of another embodiment of the carrier head according to the first aspect of the present application, this time with the anti-slip sheet body in the second position.

[0034] Legend of reference signs:

[0035] Chemical mechanical polishing apparatus 1000;

[0036] Polishing unit 1100; carrier head 100; polishing pad 200; polishing disk 300; dresser 400; liquid supply 500;

[0037] Carrier head body 110;

[0038] Gas distribution base 111; main base 112; connection flange 113; carrier disk 114;

[0039] First cover plate 1151; second cover plate 1152; elastic membrane 116; septum 117; compression ring 118; mounting hole 1101;

[0040] Retaining ring 120; mounting hole 121; first hole section 1211; second hole section 1212; groove 122; mating groove 123;

[0041] Anti-slip sheet mechanism 130; anti-slip sheet seat 131; first seat section 131a; second seat section 131b;

[0042] Receiving cavity 1311; through hole 1312;

[0043] Anti-slip sheet body 132; lever 1321; first lever section 1321a; second lever section 1321b;

[0044] Anti-slip assembly 1322; anti-slip lever section 1322a; anti-slip pin 1322b; elastic member 133;

[0045] Wafer W; axis Ax. DETAILED DESCRIPTION

[0046] In order to make the personnel in the art better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the embodiments of the present application shall fall within the scope of protection of the embodiments of the present application.

[0047] In the description of the present application, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0048] In addition, in the description of the present application, unless otherwise specified and limited, it should be noted that the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be mechanical connection or electrical connection, it can be the communication between two elements, it can be direct connection or indirect connection through intermediate medium, and those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0049] As mentioned before, chemical mechanical polishing (Chemi ca l Mechan ica l P l anar i zat ion, CMP) is a global planarization ultra-precision surface processing technology. Chemical mechanical polishing usually attracts the wafer to the bottom surface of the carrier head (also known as the polishing head), and limits the wafer radially with the retaining ring at the lower part of the carrier head, the wafer to be polished is pressed against the upper surface of the polishing pad, the carrier head is rotated relative to the polishing pad under the actuation of the driving assembly and gives the wafer a downward load; at the same time, the polishing liquid is supplied to the upper surface of the polishing pad and distributed between the wafer and the polishing pad, so that the wafer completes the chemical mechanical polishing of the wafer under the joint action of chemical and mechanical. However, sometimes the wafer slips out of the carrier head, resulting in damage to the wafer. Therefore, in order to avoid the occurrence of the above problems and reduce the scrap rate of the wafer, a carrier head for wafer processing and a chemical mechanical polishing equipment are proposed.

[0050] First, as shown in Figure 1 the chemical mechanical polishing equipment 1000 according to the second aspect of the present application.

[0051] In some embodiments of the present application, the chemical mechanical polishing apparatus 1000 can include a carrier head 100. In addition, the chemical mechanical polishing apparatus 1000 can also include a polishing unit 1100, a conditioner 400, and a liquid supply 500. The polishing unit 1100 can specifically include a polishing disk 300 and a polishing pad 200. The polishing pad 200 is disposed on the upper surface of the polishing disk 300 and rotates together with the polishing disk 300 along an axis Ax. The axis Ax is shown in Figure 1 The carrier head 100 can be horizontally moved and is located above the polishing pad 200. The lower surface of the carrier head 100 can adsorb a wafer W to be polished. The conditioner 400 includes a conditioning arm and a conditioning head, which are disposed on one side of the polishing disk 300. The conditioning arm drives the rotating conditioning head to swing to condition the surface of the polishing pad 200. The liquid supply 500 is disposed above the polishing pad 200 to spread the polishing liquid on the surface of the polishing pad 200.

[0052] As shown in Figure 2 , a cross-sectional view of a chemical mechanical polishing apparatus 1000 is shown. Figure 3 For Figure 2 , an enlarged view of part A in FIG. 1 is shown. It shows the carrier head 100, the polishing unit 1100, and the wafer W.

[0053] In order to achieve the regulation of the edge removal rate of the wafer W, the pressure of the retaining ring 120 of the carrier head 100 can be adjusted, so that the polishing pad 200 can be locally deformed to achieve it. As shown in Figure 2 and Figure 3 , the wafer slips out from the gap between the carrier head 100 and the polishing unit 1100. During the polishing process of the wafer, it is usually necessary to adjust the pressure of the retaining ring 120. When the pressure of the retaining ring 120 is small, the retaining ring 120 can be locally separated from the polishing unit 1100 in the axial direction, thereby causing the wafer W to slip out of the carrier head 100. In order to prevent the wafer from slipping out, the pressure of the retaining ring 120 can be increased, i.e. the wafer W is pressed on the polishing unit 1100 by increasing the pressure of the retaining ring 120. However, due to the increase in pressure, the friction between the retaining ring 120 and the polishing pad 200 increases, which can easily aggravate the glazing of the polishing pad 200 (i.e. the surface of the polishing pad becomes smooth), so that the wafer W is more likely to slip out. In addition, there is a large friction between the wafer W and the polishing pad 200, which can cause the carrier head 100 to slightly deflect, and a gap is generated between the retaining ring 120 and the polishing unit 1100, thereby causing the wafer to slip out of the carrier head. Therefore, it can be understood that the pressure regulation range of the retaining ring is relatively small, and the regulation difficulty is relatively large.

[0054] In order to solve one or more of the above problems, Figure 4 , a cross-sectional view of a carrier head 100 for wafer processing according to the second aspect of the present application is shown, which can be used in Figure 1The chemical mechanical polishing apparatus 1000 shown.

[0055] The accompanying drawings are included to provide a further understanding of the present application and are incorporated in and constitute a part of this specification. Figures 4-12 The carrier head 100 for wafer W processing of the embodiments of the present application is described in detail.

[0056] The carrier head 100 for wafer W processing according to the first aspect of the present application is used to confine the wafer W between the carrier head 100 and the polishing unit 1100 when the wafer W is processed, so as to avoid the wafer W from sliding out of the gap between the carrier head 100 and the polishing unit 1100 and being broken.

[0057] As Figure 4 , the carrier head 100 mainly comprises a carrier head body 110, a retaining ring 120 and an anti-skid piece mechanism 130, and the carrier head body 110 has the ability to adsorb the wafer W. The carrier head body 110 can further comprise a gas distribution base 111, a main base 112, a connecting flange 113 for connection, a carrier disc 114, a first cover plate 1151, a second cover plate 1152 and an elastic film 116. The gas distribution base 111 is connected to the main base 112 through a diaphragm 117, and the elastic film 116 is connected to the bottom of the carrier disc 114 through a compression ring 118. The retaining ring 120 is arranged on the side of the carrier head body 110 facing the wafer W, i.e. the lower side of the carrier head body 110 in the direction of the axis L1. The retaining ring 120 is arranged around the outer periphery of the elastic film 116, the elastic film 116 carries the wafer W and presses the wafer W against the polishing pad 200 of the polishing unit 1100, and the retaining ring 120 confines the wafer W radially therein and presses against the polishing pad 200 together with the wafer W for wafer W polishing. The retaining ring 120 is configured with an axially-through mounting hole 121. Figure 4

[0058] The retaining ring 120 is provided with an axially-through mounting hole 121, as Figure 5 , Figure 7 , Figure 9 and Figure 11 shown, the axial direction of the retaining ring 120 is the axis L1 shown in the up-down direction. The anti-skid piece mechanism 130 is at least partially located in the mounting hole 121, and the anti-skid piece main body 132 of the anti-skid piece mechanism 130 is capable of reciprocating in the mounting hole 121 along the axial direction of the mounting hole 121 between a first position and a second position. Therefore, it can be understood that the anti-skid piece mechanism 130 is capable of reciprocating in the mounting hole 121 along the up-down direction, and the anti-skid piece mechanism 130 has two positions, i.e. the first position and the second position.

[0059] Further, as Figure 7 and Figure 11 shown, the anti-skid piece main body 132 of the anti-skid piece mechanism 130 is capable of reciprocating in the mounting hole 121 along the axial direction of the mounting hole 121 between a first position and a second position.As shown, the anti-skid sheet body 132 of the anti-skid sheet mechanism 130 includes an axially extending rod 1321 and an anti-skid assembly 1322 arranged at one end of the rod 1321 facing the polishing unit 1100, the rod 1321 is in contact with the polishing unit 1100 through the anti-skid assembly 1322, the rod 1321 is located in the mounting hole 121 and can reciprocate between the first position and the second position. When the anti-skid sheet body 132 is located at the second position, the wafer W is blocked by the anti-skid assembly 1322.

[0060] Specifically, when a gap appears between the lower surface of the carrier head 100, that is, the lower surface of the retaining ring 120 and the polishing unit 1100, the anti-skid assembly 1322 can move from the first position to the second position, thereby blocking the wafer W and preventing the wafer W from sliding out. That is, a limiting structure is formed at the position where a gap appears between the lower surface of the retaining ring 120 and the polishing unit 1100.

[0061] As shown in Figure 5 and Figure 9 When the carrier head abuts the wafer W against the polishing unit 1100, the anti-skid sheet body 132 is retracted into the mounting hole 121 to be at the first position. Thus, the lower surface of the carrier head 100 can be in close contact with the polishing unit 1100, ensuring the polishing effect on the wafer W.

[0062] As shown in Figure 7 and Figure 11 When the carrier head 100 is slightly tilted and the retaining ring 120 of the carrier head 100 is slightly separated from the polishing unit 1100 in the axial direction, at this time, the wafer W has a tendency to slide radially out of the retaining ring 120. The anti-skid sheet body 132 is extended from the mounting hole 121 and is at the second position, and the wafer W is blocked by the anti-skid assembly 1322 from sliding out of the gap formed between the retaining ring 120 and the polishing unit 1100. Thus, the wafer W can be prevented from being broken after sliding out, reducing the scrap rate of the wafer W.

[0063] According to the carrier head 100 for wafer W processing and the chemical mechanical polishing equipment 1000 provided by the embodiments of the present application, the mounting hole 121 is formed on the retaining ring 120, and the anti-skid sheet mechanism 130 capable of reciprocating between the first position and the second position is arranged in the mounting hole 121. Thus, when the carrier head 100 abuts against the polishing unit, the anti-skid sheet mechanism 130 can be retracted into the mounting hole 121, ensuring that the lower surface of the retaining ring 120 can be in stable close contact with the polishing unit 1100. When a gap appears between the retaining ring 120 and the polishing unit 1100, the anti-skid sheet mechanism 130 can be extended from below the retaining ring 120, thereby blocking the wafer W from sliding out of the gap between the retaining ring 120 and the polishing unit 1100.

[0064] As shown in Figure 5 ,Figure 7 、 Figure 9 and Figure 11 As shown in

[0065] The anti-skid piece seat 131 has an accommodating cavity 1311 extending along the axial direction thereof, and the bottom of the accommodating cavity 1311 opposite to the carrier head body 110 is configured with a through hole 1312, i.e., the bottom wall of the anti-skid piece seat 131 is configured with the through hole 1312. The rod piece 1321 is arranged in the accommodating cavity 1311, and the anti-skid assembly 1322 can extend out of the through hole 1312, so that the anti-skid assembly 1322 can limit the wafer W.

[0066] As shown in Figure 5 、 Figure 7 、 Figure 9 and Figure 11 The mounting hole 121 includes a first hole section 1211 and a second hole section 1212 in sequence away from the carrier head body 110, i.e., the mounting hole 121 includes two hole sections in communication, and the first hole section 1211 is located above the second hole section 1212. The first hole section 1211 is configured to accommodate the anti-skid piece seat 131, so as to ensure the stable position of the anti-skid piece seat 131. The second hole section 1212 corresponds to the through hole 1312 and is configured for the anti-skid assembly 1322 to pass through, so it can be understood that the anti-skid assembly 1322 can extend out of the through hole 1312 and pass through the second hole section 1212 to limit the wafer W.

[0067] As shown in Figure 5 、 Figure 7 、 Figure 9 and Figure 11As shown, the rod member 1321 includes a first rod segment 1321a and a second rod segment 1321b in sequence away from the carrier head body 110, i.e. the rod member 1321 includes a two-segment structure, wherein the first rod segment 1321a is closer to the carrier head body 110 than the second rod segment 1321b. And the outer diameter of the second rod segment 1321b is larger than the outer diameter of the first rod segment 1321a and the inner diameter of the through hole 1312, so as to enable the anti-slip sheet body 132 to be limited in the accommodating cavity 1311 by the abutment between the second rod segment 1321b and the through hole 1312 when moving from the first position to the second position.

[0068] In other words, as shown in Figure 5 , Figure 7 , Figure 9 and Figure 11 , the second rod segment 1321b is thicker than the first rod segment 1321a, and the radial dimension of the second rod segment 1321b is larger than the radial dimension of the through hole 1312, so as to enable the abutment between the second rod segment 1321b and the through hole 1312 to limit the rod member 1321 inside the accommodating cavity 1311, prevent the rod member 1321 from being pulled out from the through hole 1312 of the accommodating cavity 1311, and limit the amplitude and distance of the movement of the anti-slip sheet body 132 from the first position to the second position.

[0069] Further, the anti-slip assembly 1322 is connected to the lower surface of the second rod segment 1321b. Therefore, the distance of the anti-slip assembly 1322 extending out of the lower surface of the retaining ring 120 can be limited by the abutment between the second rod segment 1321b and the through hole 1312.

[0070] In some embodiments of the present application, as shown in Figures 4-7 , the anti-slip assembly 1322 includes an anti-slip rod segment 1322a connected to the lower surface of the second rod segment 1321b, which can pass through the through hole 1312 and reciprocate with the rod member 1321 between the first position and the second position. It can be understood that the outer diameter of the anti-slip rod segment 1322a is smaller than the outer diameter of the second rod segment 1321b and can pass through the through hole 1312.

[0071] When the anti-slip sheet body 132 is in the second position, the anti-slip rod segment 1322a extends out of the second hole segment 1212 to block the wafer W. As shown in Figure 4 , when the carrier head 100 and the polishing unit 1100 are in contact, the anti-slip sheet body 132 is completely retracted into the accommodating cavity 1311 and the second hole segment 1212 of the mounting hole 121 as shown in Figure 5 . As shown in Figure 6 , when there is a gap between the carrier head 100 and the polishing unit 1100. The anti-slip sheet body 132 is completely retracted into the accommodating cavity 1311 and the second hole segment 1212 of the mounting hole 121 as shown inFigure 7 As shown, the first position is moved to the second position, and the anti-skid rod segment 1322a is extended by the small surface of the retaining ring 120 to abut against the upper surface of the polishing unit 1100, so as to be able to limit the wafer W from sliding out of the position.

[0072] In some embodiments of the present application, as shown in Figures 8-11 As shown, the lower surface of the retaining ring 120 is provided with a matching groove 123, and the edge of the matching groove 123 is tangent to the inner diameter of the retaining ring 120, or the edge of the matching groove 123 protrudes inwardly of the inner diameter of the retaining ring 120 and is not greater than 1 mm, and the second hole segment 1212 and the through hole 1312 are both in communication with the matching groove 123, wherein the matching groove 123 is specifically as shown in Figure 9 and Figure 11 .

[0073] Specifically, the matching groove 123 is provided on the lower surface of the retaining ring 120, and the inner diameter of the matching groove 123 is tangent to the retaining ring 120, that is, the edge of the matching groove 123 has a tangent point with the wall surface of the inner diameter of the retaining ring 120, and when the wafer W slides out, the anti-skid top pin 1322b can abut against the wafer W at this position. Or the edge of the matching groove 123 protrudes inwardly of the inner diameter of the retaining ring 120 and is not greater than 1 mm, that is, the matching groove 123 is in communication with the space inside the retaining ring 120 from the wall surface where the inner diameter of the retaining ring 120 is located, so that when the wafer W slides out, the anti-skid top pin 1322b can abut against the wafer W at this position.

[0074] In some embodiments of the present application, as shown in Figures 8-11 As shown, the anti-skid assembly 1322 includes an anti-skid rod segment 1322a and an anti-skid top pin 1322b. The anti-skid rod segment 1322a is connected to the lower surface of the second rod segment 1321b, and the anti-skid rod segment 1322a can pass through the through hole 1312 and reciprocate with the rod 1321 between the first position and the second position. Thus it can be understood that the outer diameter of the anti-skid rod segment 1322a is smaller than the outer diameter of the second rod segment 1321b and can pass through the through hole 1312.

[0075] Wherein the anti-skid top pin 1322b includes a connecting rod segment and an anti-skid sheet, the connecting rod segment is provided to the upper surface of the anti-skid sheet and is connected with the anti-skid rod segment 1322a. The anti-skid sheet abuts against the edge of the wafer W. Thus the anti-skid sheet can always limit the wafer W by abutting against the edge of the wafer W, so as to better prevent the wafer W from sliding out.

[0076] As shown in Figure 9 and Figure 11As shown, the abutting point of the anti-slip piece and the edge of the wafer W is located within the inner diameter of the retaining ring 120, so that the wafer W can be limited in the middle region of the retaining ring 120 by the edge of the anti-slip piece. Or, the abutting point of the anti-slip piece and the edge of the wafer W is in the same vertical plane as the inner diameter of the retaining ring 120, so that the anti-slip piece can limit the position of the wafer W in the space inside the retaining ring 120.

[0077] When the anti-slip piece body 132 moves from the second position to the first position, the anti-slip top pin 1322b can move into the matching groove 123. In combination with Figure 8 and Figure 9 As shown, because the lower surface of the retaining ring 120 is provided with the matching groove 123, and the inner wall of the matching groove 123 is an open structure. Therefore, when the carrier head 100 is attached to the polishing unit 1100, the anti-slip top pin 1322b can move from the second position to the first position and enter the area inside the matching groove 123. When the anti-slip piece body 132 moves from the first position to the second position, the anti-slip top pin 1322b is extended from the matching groove 123, and the edge of the anti-slip piece abuts against the edge of the wafer W to block the wafer W from sliding out of the gap formed between the retaining ring 120 and the polishing unit 1100. That is, when a gap appears between the carrier head 100 and the polishing unit 1100, as Figure 10 and Figure 11 As shown, the anti-slip top pin 1322b can move from the first position to the second position to limit the wafer W from sliding out of it.

[0078] In combination with Figures 8-11 As shown, the way of opening the matching groove 123 below the retaining ring 120 can make the anti-slip assembly 1322 always abut against the edge of the wafer W, so that the wafer W can be stably limited in the middle region of the retaining ring 120, and the wafer W cannot slide out and be located in the area directly below the retaining ring 120. In other words, after the wafer W slides out but is blocked and limited, at least part of the wafer W is still located in the area directly below the retaining ring 120. This leads to that the polishing of the wafer W cannot be carried out smoothly.

[0079] It should be noted that the anti-slip assembly 1322 can be made of a first plastic material, that is, the anti-slip rod segment 1322a and the anti-slip top pin 1322b can be made of the first plastic material. The first plastic material can include one or more of polyether ether ketone (PEEK), polyphenylene sulfide (PPS), polyimide (PAI), polyethylene terephthalate (PET-P), and polytetrafluoroethylene (PTFE). These plastic materials have good wear resistance and chemical corrosion resistance, which is conducive to reducing the wear and chemical corrosion of the anti-slip rod segment 1322a and the anti-slip top pin 1322b, and ensuring the service life of the anti-slip rod segment 1322a and the anti-slip top pin 1322b.

[0080] In addition, the rod 1321 can also be made of the same or different plastic material as the anti-skid rod segment 1322a and the anti-skid pin 1322b. For example, the rod 1321 is made of polyether ether ketone (PEEK) or polyphenylene sulfide (PPS). The anti-skid rod segment 1322a and the anti-skid pin 1322b can also be made of the same material.

[0081] In addition, the anti-skid assembly 1322 can also be made of stainless steel. That is, the anti-skid rod segment 1322a and the anti-skid pin 1322b can be made of stainless steel, so as to ensure the rigidity thereof.

[0082] In some embodiments of the present application, the fitting groove 123 is a circular groove, the number of the fitting grooves 123 corresponds to the number of the anti-skid assemblies 1322 of the anti-skid sheet mechanism 130, and the anti-skid sheet is a circular sheet structure, the center of the circular sheet coincides with the axis of the anti-skid sheet body 132. Thus, the anti-skid sheet can more stably abut against the edge of the wafer W.

[0083] In some embodiments of the present application, as shown in Figure 5 , Figure 7 , Figure 9 and Figure 11 , the anti-skid sheet mechanism 130 further comprises an elastic member 133. The elastic member 133 is arranged into the accommodating cavity 1311 and is sleeved on the outer periphery of the first rod segment 1321a. Moreover, one end of the elastic member 133 abuts against the side of the bearing head body 110 facing the wafer W, and the other end of the elastic member 133 abuts against the upper surface of the second rod segment 1321b, so as to provide power for the movement of the rod 1321 from the first position to the second position, and to enable the rod 1321 to compress the elastic member 133 to retract into the accommodating cavity 1311. In other words, the elastic member 133 serves as the power structure for the reciprocating movement of the rod 1321 between the first position and the second position, and can be compressed by the pressure, so as to enable the rod 1321 to move from the second position to the first position. Similarly, when the external pressure disappears, the elastic member 133 can enable the rod 1321 to move from the first position to the second position by the elastic force.

[0084] Among them, the elastic member 133 comprises a spring, the spring is sleeved on the outer periphery of the first rod segment 1321a, one end of the spring abuts against the side of the bearing head body 110 facing the wafer W, and the other end of the spring abuts against the upper surface of the second rod segment 1321b. Specifically, the elastic member 133 can be a spring, which is low in cost and convenient to use.

[0085] Further, the elastic member 133 can be made of a second plastic material, which can include one or more of polyamide (PA, commonly known as nylon), polyether ether ketone (PEEK), or polytetrafluoroethylene (PTFE), for example. The elastic member 133 is made of the second plastic material, which reduces chemical corrosion of the elastic member 133, ensures the stability of the elastic performance, and further ensures the effectiveness of the elastic effect, so that the anti-skid sheet mechanism 130 can timely and effectively perform the anti-skid sheet operation to prevent the wafer W from sliding out. The first plastic material and the second plastic material can be the same or different. The spring mentioned in the foregoing can be made of one or more of the second plastic materials.

[0086] The present application is not limited thereto, and the elastic member 133 can also be a damper. The elastic member abuts against the carrier head body 110 and can axially stretch and contract to retract into the mounting hole 121 when the retaining ring 120 abuts against the polishing unit.

[0087] Similarly, in the material selection of the present application, the structure of the anti-skid assembly 1322 can be made of a corrosion-resistant material. Alternatively, the entire anti-skid sheet mechanism 130 can be made of a corrosion-resistant material to reduce corrosion of the anti-skid sheet mechanism 130 by the polishing liquid.

[0088] In some embodiments of the present application, as shown in Figure 5 、 Figure 7 、 Figure 9 and Figure 11 , the anti-skid sheet seat 131 includes a first seat section 131a and a second seat section 131b. The first seat section 131a is threadedly connected with the mounting hole 1101, which can ensure stable connection between the anti-skid sheet seat 131 and the carrier head body 110. The outer diameter of the first seat section 131a can be greater than the outer diameter of the second seat section 131b, and at the junction of the two, a smooth junction can be formed by chamfering transition due to the size difference in the outer diameters of the two, thereby avoiding the formation of a large stress concentration at this point, thereby improving the structural strength.

[0089] In some embodiments of the present application, the carrier head 100 includes a plurality of anti-skid sheet mechanisms 130 distributed along the circumference of the retaining ring 120. As shown in Figure 12 , it is a bottom view of the retaining ring 120 of the carrier head 100, which shows a plurality of anti-skid sheet mechanisms 130 distributed along the circumference of the retaining ring 120. The plurality of anti-skid sheet mechanisms 130 can be wrapped around the outer periphery of the wafer W in multiple directions to limit the position of the wafer W. The wafer W can be positioned in multiple directions to prevent the wafer W from sliding out in multiple directions.

[0090] As shown in Figure 12As shown, the retaining ring 120 is provided with a plurality of grooves 122 on the surface facing the polishing unit. The grooves 122 are recesses provided on the lower surface of the retaining ring 120 towards the upper surface of the retaining ring 120. The plurality of grooves 122 are evenly provided along the circumferential direction of the retaining ring 120, and the direction of the grooves 122 coincides with the radial direction of the retaining ring 120, that is, the direction of the grooves 122 is along the radial direction of the retaining ring 120, and in combination Figure 12 As shown, it can be understood that the grooves 122 penetrate the inner side and the outer side of the retaining ring 120 in the radial direction of the retaining ring 120, so that the area inside the retaining ring 120 and the outer area are communicated through the grooves 122, thereby allowing the polishing liquid or debris generated by polishing the wafer W to flow into or out of the retaining ring 120.

[0091] In addition, as shown in Figure 12 As shown, a slip sheet mechanism 130 is provided between two adjacent grooves 122, or two or more slip sheet mechanisms 130 are evenly spaced between two adjacent grooves 122, that is, the number of slip sheet mechanisms 130 can be an integer multiple of the number of grooves 122.

[0092] The above embodiments are only used to illustrate the application, and not to limit the application. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the application. Therefore, all equivalent technical solutions belong to the scope of the application, and the patent protection scope of the application should be defined by the claims.

Claims

1. A carrier head for wafer processing, comprising: The application relates to a carrier head, which comprises the following parts: a carrier head body; a retaining ring arranged on the side of the carrier head body facing the wafer and capable of limiting the wafer at a middle position, the retaining ring being provided with a mounting hole penetrating along the axial direction of the retaining ring; an anti-skid piece mechanism arranged at least partially in the mounting hole and comprising an anti-skid piece seat, an anti-skid piece body and an elastic piece; the anti-skid piece body comprises a shaft piece extending along the axial direction and an anti-skid assembly arranged at the end of the shaft piece facing the polishing unit, the shaft piece is arranged in the mounting hole and can reciprocate between a first position and a second position, the anti-skid assembly blocks the wafer; the elastic piece is arranged in the accommodating cavity of the anti-skid piece seat and is sleeved on the outer periphery of the first shaft section of the shaft piece, one end of the elastic piece abuts against the side of the carrier head body facing the wafer, and the other end abuts against the upper surface of the second shaft section, so that the elastic piece can provide power for the movement of the shaft piece from the first position to the second position and can compress the elastic piece to retract into the accommodating cavity; when the carrier head abuts against the polishing unit, the anti-skid piece body retracts into the mounting hole to be in the first position; when the carrier head is axially separated from the polishing unit, the anti-skid piece body extends out of the mounting hole and is in the second position, and the wafer is blocked by the anti-skid assembly from sliding out of the gap formed between the retaining ring and the polishing unit; the anti-skid assembly comprises an anti-skid top pin; the lower surface of the retaining ring is provided with a matching groove, the edge of the matching groove is tangent to the inner diameter of the retaining ring, when the wafer slides out, the anti-skid top pin can abut against the wafer at the tangent point, or the edge of the matching groove protrudes inwardly from the inner diameter of the retaining ring, when the wafer slides out, the anti-skid top pin can abut against the wafer inwardly from the inner diameter of the retaining ring, so that at least part of the wafer is still located below the retaining ring after the wafer is blocked from sliding out.

2. The load head of claim 1 wherein, The side of the carrier head body facing the wafer is provided with an assembly hole corresponding to the position of the mounting hole, the anti-skid piece mechanism comprises an anti-skid piece seat, one end of the anti-skid piece seat extends into the assembly hole, the other end of the anti-skid piece seat extends into the mounting hole and penetrates the mounting hole along the axial direction, the inside of the anti-skid piece seat is provided with an accommodating cavity extending along the axial direction of the anti-skid piece seat, the bottom of the accommodating cavity opposite to the carrier head body is provided with a through hole, the shaft piece is arranged in the accommodating cavity, and the anti-skid assembly can extend out of the through hole.

3. The load head of claim 2 wherein, The mounting hole comprises a first hole section and a second hole section successively away from the carrier head body, the first hole section is configured to accommodate the anti-skid piece seat, and the second hole section corresponds to the through hole and is configured to allow the anti-skid assembly to pass through.

4. The load head of claim 3 wherein, The shaft piece comprises a first shaft section and a second shaft section successively away from the carrier head body, the outer diameter of the second shaft section is greater than the outer diameter of the first shaft section and the inner diameter of the through hole, so that when the anti-skid piece body moves from the first position to the second position, the shaft piece is limited in the accommodating cavity by the abutment between the second shaft section and the through hole, and the anti-skid assembly is connected to the lower surface of the second shaft section.

5. The load head of claim 4 wherein, The anti-skid assembly comprises an anti-skid rod segment connected to the lower surface of the second rod segment, the anti-skid rod segment being capable of passing through the through hole and moving back and forth with the rod between the first position and the second position, the anti-skid rod segment being extended by the second hole segment to block the wafer when the anti-skid sheet body is in the second position.

6. The load head of claim 4 wherein, The edge of the fitting groove is tangent to the inner diameter of the retaining ring, or the edge of the fitting groove protrudes inward of the inner diameter of the retaining ring by no more than 1 mm; the second hole segment and the through hole are both in communication with the fitting groove.

7. The load head of claim 6 wherein, The anti-skid assembly comprises an anti-skid rod segment connected to the lower surface of the second rod segment, and an anti-skid top pin comprising a connecting rod segment and an anti-skid sheet, the connecting rod segment being arranged to the upper surface of the anti-skid sheet and connected to the anti-skid rod segment; When the anti-skid sheet body moves from the second position to the first position, the anti-skid top pin is capable of moving into the fitting groove; When the anti-skid sheet body moves from the first position to the second position, the anti-skid top pin is extended by the fitting groove, and the edge of the anti-skid sheet abuts against the edge of the wafer to block the wafer from sliding out of the gap between the retaining ring and the polishing unit.

8. The load head of claim 7 wherein, The fitting groove is a circular groove, and the number of the fitting grooves corresponds to the number of the anti-skid assemblies of the anti-skid sheet mechanism, and the anti-skid sheet is in a circular sheet structure, the center of the anti-skid sheet coinciding with the axis of the anti-skid sheet body.

9. The load head of claim 1 wherein, The elastic member comprises a spring, the spring being sleeved on the outer periphery of the first rod segment, one end of the spring abutting against the side of the carrier head body facing the wafer, and the other end of the spring abutting against the upper surface of the second rod segment.

10. The load head of any of claims 2-8, wherein, The anti-skid sheet seat comprises a first seat segment and a second seat segment, the first seat segment being threadedly connected with the assembly hole.

11. The load head of any one of claims 1-8, wherein, The carrier head comprises a plurality of anti-skid sheet mechanisms distributed along the circumference of the retaining ring.

12. The load head of claim 11, wherein The surface of the retaining ring facing the polishing unit is provided with a plurality of grooves, the grooves being evenly arranged along the circumference of the retaining ring, and the arrangement direction of the grooves coinciding with the radial direction of the retaining ring, one anti-skid sheet mechanism being arranged between two adjacent grooves, or two or more anti-skid sheet mechanisms being evenly arranged between two adjacent grooves.

13. The load head of any one of claims 1-8, wherein, The anti-skid assembly can be made of a first plastic material or stainless steel, the first plastic material comprising one or more of polyether ether ketone, polyphenylene sulfide, polyimide, polyethylene terephthalate, and polytetrafluoroethylene.

14. The load head of claim 1 wherein, The elastic member can be made of a second plastic material, the second plastic material comprising one or more of polyamide, polyether ether ketone, and polytetrafluoroethylene.

15. A chemical mechanical polishing apparatus characterized by comprising: The chemical mechanical polishing device comprises the carrier head according to any one of claims 1-14.

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