Electronic packaging material and preparation method and application thereof

Abstract

The invention relates to an electronic packaging material as well as a preparation method and application thereof. The electronic packaging material is prepared from the following raw materials: at least one prepreg containing an anhydride curing agent and hydroxylated heat-conducting particles, the prepreg containing the anhydride curing agent is combined with the hydroxylated heat-conducting particles through ester groups. The problems of compatibility and dispersity of the heat-conducting particles in the prepregs are solved by utilizing transesterification between hydroxyl groups of the heat-conducting particles and ester groups in the prepregs containing the acid anhydride compounds, the prepared electronic packaging material is excellent in heat-conducting and insulating properties, the service life of a third-generation semiconductor is prolonged, and the electronic packaging material is suitable for industrial production. And the application requirements in the fields of 5G and 6G communication, big data, new energy automobiles and the like are met.

Description

Technical Field

[0001] The present invention relates to the technical field of composite materials, and in particular to an electronic packaging material and a preparation method and application thereof. Background Art

[0002] With the rapid development of microelectronics integration technology and high-density assembly technology of hollow printed circuit boards, assembly density has increased rapidly, the volume of electronic components and logic circuits has been reduced by hundreds or thousands of times, and electronic instruments and equipment are increasingly developing in the direction of ultra-light, thin, short and small. In particular, the packaging thermal insulation of silicon carbide (SiC) and gallium nitride (GaN) high-power electronic devices faces huge challenges. Therefore, in order to ensure the reliability of component operation, the heat dissipation and insulation capacity of microelectronic packaging materials has become a key limiting factor affecting their service life.

[0003] Considering the cost factor, plastic-based electronic packaging materials currently account for about 90% of the market share. There are two main methods for preparing plastic-based high thermal conductivity and high insulation electronic packaging:

[0004] (1) Preparation of intrinsic polymers, that is, improving the regularity of molecular segments and increasing their heat dissipation performance, such as CN105348809A discloses an organic siloxane polymer material for electronic packaging, which includes terminal hydroxyl polydimethylsiloxane, silane or siloxane containing at least two alkoxy groups, polymethylphenylsiloxane containing vinyl, hydrogen silicone oil, condensation catalyst, platinum catalyst, curing inhibitor, and white carbon black, wherein the vinyl-containing polymethylphenylsiloxane is located at the end group and the side chain, and based on the mass of the component, the mass content of the side chain vinyl is 3%-10%. The material is used in the field of electronic packaging and has the characteristics of good mechanical properties, high mechanical strength, and excellent transparency. However, this method is difficult and not conducive to industrial promotion, and the improvement of thermal conductivity is limited.

[0005] (2) Preparation of thermally conductive particle-filled composite materials, filling highly thermally conductive particles into the interior of the matrix resin, which is the simplest and most direct method for preparing high-conductivity and high-insulation electronic packaging materials. For example, CN102027036A provides an epoxy resin composition, which comprises: (A) an epoxy compound of a specific structure, (B) a multifunctional epoxy compound having 2 or more functional groups, and (C) an epoxy curing agent containing phenolic hydroxyl groups, wherein the proportion of the epoxy compound (A) is 1-99% by weight based on the total weight of the epoxy compound (A) and (B), and the epoxy resin composition contains silica prepared by pyrolysis, and the silica has been surface-modified with hexamethyldisilazane (HMDS) and has been structurally modified with a ball mill. However, the dispersion and compatibility of the particles and the matrix resin are poor, which will affect its application performance.

[0006] Therefore, there is an urgent need in the art to develop a method for preparing electronic packaging materials that has excellent dispersibility and compatibility between thermally conductive particles and matrix resins, and is simple, convenient to operate, and easy to promote. Summary of the invention

[0007] In order to solve the above technical problems, the present invention provides an electronic packaging material and a preparation method and application thereof. By designing the groups in the raw materials, an electronic packaging material with excellent dispersibility and compatibility between the thermally conductive particles and the matrix resin is prepared. The electronic packaging material has the advantages of high thermal conductivity, high insulation, etc., and can meet the service requirements of the third-generation semiconductor power devices.

[0008] To achieve this object, the present invention adopts the following technical solutions:

[0009] In a first aspect, the present invention provides an electronic packaging material, wherein the raw materials for preparing the electronic packaging material include at least one prepreg sheet containing an anhydride curing agent and hydroxylated thermal conductive particles;

[0010] The prepreg containing anhydride curing agent is combined with the hydroxylated thermal conductive particles via ester groups.

[0011] The electronic packaging material provided by the present invention uses hydroxylated thermally conductive particles and a semi-cured sheet containing anhydride curing agent as raw materials. The two undergo an ester exchange reaction (the reaction is shown below) and are combined through ester groups, thereby successfully solving the dispersion compatibility problem of the thermally conductive particles and the resin. At the same time, the continuous thermally conductive network formed by the two improves the thermal conductivity of the electronic packaging material.

[0012]

[0013] The present invention does not limit the stacking structure of the prepreg and the thermally conductive particles in the electronic packaging material, as long as there is at least one prepreg in direct contact with the thermally conductive particles. The structure of the electronic packaging material can be, for example, one prepreg and the thermally conductive particles bonded to it through an ester group, two prepregs and the thermally conductive particles bonded to the two prepregs through an ester group, three prepregs and the thermally conductive particles bonded to the two prepregs through an ester group between two of the prepregs, etc. Considering the actual thickness and high thermal conductivity requirements, the structure of the electronic packaging material is preferably two prepregs and the thermally conductive particles bonded to the two prepregs through an ester group between the two prepregs.

[0014] Preferably, the thermal conductivity of the electronic packaging material is ≥2.1 W / m·K, for example, it may be 2.2 W / m·K, 2.5 W / m·K, 2.8 W / m·K, 3 W / m·K, 3.5 W / m·K, 4 W / m·K, 5 W / m·K, 6 W / m·K, 7 W / m·K or 8 W / m·K, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the said range.

[0015] Preferably, the insulation strength of the electronic packaging material is ≥5kV / mm, for example, it can be 6kV / mm, 7kV / mm, 8kV / mm, 10kV / mm, 12kV / mm, 15kV / mm, 18kV / mm or 20kV / mm, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0016] Preferably, the hydroxylated thermally conductive particles are obtained by subjecting thermally conductive particles to an alkali treatment.

[0017] Preferably, the thermally conductive particles include any one of artificial diamond, boron nitride, aluminum nitride, silicon nitride or aluminum oxide, or a combination of at least two thereof.

[0018] Preferably, the particle size of the thermally conductive particles is less than 1 / 3 of the thickness of the semi-cured sheet, for example, it can be 1 / 4, 1 / 5, 1 / 6, 1 / 8, 1 / 10, 1 / 20, 1 / 50 or 1 / 100, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0019] Preferably, the particle size of the thermally conductive particles is 10-5000nm, for example, it can be 20nm, 50nm, 100nm, 200nm, 300nm, 500nm, 1000nm, 2000nm, 3000nm or 4000nm, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0020] Preferably, the alkali treatment is performed in the presence of an alkali solution.

[0021] Preferably, the alkali in the alkali solution comprises sodium hydroxide and / or potassium hydroxide.

[0022] Preferably, the solvent of the alkaline solution includes water.

[0023] Preferably, the alkali concentration in the alkaline solution is 2-5 mol / L, for example, it can be 2.5 mol / L, 3 mol / L, 3.5 mol / L, 4 mol / L or 4.5 mol / L, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0024] Preferably, the temperature of the alkali treatment is 120-140°C, for example, it can be 122°C, 125°C, 128°C, 130°C, 132°C, 135°C or 138°C, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0025] Preferably, the alkali treatment time is 18-24h, for example, it can be 19h, 20h, 21h, 22h or 23h, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0026] Preferably, the mass concentration of the thermally conductive particles in the alkaline solution during the alkaline treatment is 10-30%, for example, it can be 12%, 15%, 18%, 20%, 22%, 25% or 28%, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range, and it is further preferably 14-16%.

[0027] Preferably, the alkali treatment is followed by washing and drying.

[0028] Preferably, the drying temperature is 50-80°C, for example, 55°C, 60°C, 65°C, 70°C or 75°C, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0029] Preferably, the drying time is 18-24 hours, for example, it can be 19 hours, 20 hours, 21 hours, 22 hours or 23 hours, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0030] Preferably, the method for preparing the hydroxylated thermally conductive particles comprises the following steps:

[0031] The thermally conductive particles are mixed with a 2-5 mol / L alkaline solution to obtain a mixed solution with a thermally conductive particle mass concentration of 10-30%, and the mixture is reacted at 120-140° C. for 18-24 hours. After the reaction is completed, the residual alkaline solution is washed away, and then dried at 50-80° C. for 18-24 hours to obtain the hydroxylated thermally conductive particles.

[0032] The present invention utilizes high temperature alkali treatment to modify the thermally conductive particles, thereby obtaining thermally conductive particles with a surface rich in hydroxyl structure, which is conducive to the ester exchange reaction between the particles and the prepreg, thereby forming a continuous thermally conductive network and improving the thermal conductivity of the electronic packaging material.

[0033] Preferably, the prepreg includes epoxy resin.

[0034] Preferably, the epoxy resin includes any one or a combination of at least two of bisphenol A epoxy resin, bisphenol F epoxy resin, polypropylene epoxy resin, biphenyl epoxy resin, fluoroethylene epoxy resin, alicyclic epoxy resin or epoxy resin containing an inorganic skeleton structure. Preferably, the glass transition temperature (Tg) of the epoxy resin is ≥160°C, for example, it can be 165°C, 170°C, 175°C, 180°C, 190°C or 200°C, and specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0035] Preferably, the weight average molecular weight of the epoxy resin is 500-2000 g / mol, for example, it can be 600 g / mol, 800 g / mol, 1000 g / mol, 1200 g / mol, 1500 g / mol or 1800 g / mol, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0036] Preferably, the acid anhydride curing agent includes any one of phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, phthalic anhydride or pyromellitic dianhydride, or a combination of at least two thereof.

[0037] Preferably, the mass content of the anhydride curing agent in the semi-cured sheet is 20-40%, for example, it can be 22%, 25%, 28%, 30%, 32%, 35% or 38%, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the said range.

[0038] Preferably, the thickness of the semi-cured sheet is 50-300 μm, for example, it can be 60 μm, 80 μm, 100 μm, 120 μm, 150 μm, 200 μm or 250 μm, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0039] Preferably, the mass ratio of the hydroxylated thermally conductive particles to the semi-cured sheet is (0.3-0.6):1, wherein the specific value of (0.3-0.6) can be, for example, 0.35, 0.4, 0.45, 0.5 or 0.55, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range, and is further preferably (0.45-0.55):1.

[0040] In a second aspect, the present invention provides a method for preparing the electronic packaging material as described in the first aspect, the preparation method comprising the following steps:

[0041] The electronic packaging material is obtained by hot pressing the hydroxylated thermally conductive particles and the prepreg containing anhydride curing agent.

[0042] The present invention adopts hydroxylated thermally conductive particles, and reacts them with a prepreg containing an anhydride curing agent through a one-step hot pressing reaction, and directly prepares a high thermal conductivity and high insulation electronic packaging material from two solid reactants. The overall process is simple, easy to large-scale industrial production, and has high practical application value. The dynamic ester exchange reaction between the hydroxyl group on the surface of the modified thermally conductive particles and the ester group in the anhydride under high temperature and high pressure is utilized to improve the dispersion compatibility of the thermally conductive particles and the resin, and improve the thermal conductivity of the material.

[0043] Preferably, the hot pressing includes pre-pressing and heating hot pressing.

[0044] As a preferred technical solution of the present invention, pre-pressing is performed above the glass transition temperature of the epoxy resin. At this time, the polymer is in a highly elastic state, and the flexibility of the molecular chain becomes greater, which is conducive to the full contact between the hydroxyl group and the ester group, thereby increasing the temperature and pressure to promote the activity of the transesterification reaction, and can produce electronic packaging materials with better application effects. If the one-step hot pressing is directly performed, the transesterification reaction between the hydroxylated particles and the resin is not sufficient, and a continuous heat conductive network cannot be formed.

[0045] Preferably, the pre-pressing temperature is 160-180°C, for example, it can be 162°C, 165°C, 168°C, 170°C, 172°C, 175°C or 178°C, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0046] Preferably, the pre-pressing pressure is 3-5MPa, for example, it can be 3.2MPa, 3.5MPa, 3.8MPa, 4MPa, 4.2MPa, 4.5MPa or 4.8MPa, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0047] Preferably, the pre-pressing time is 0.5-1h, for example, it can be 0.55h, 0.6h, 0.7h, 0.8h or 0.9h, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0048] Preferably, the temperature of the heating and hot pressing is 180-220°C, for example, it can be 185°C, 190°C, 195°C, 200°C, 205°C, 210°C or 215°C, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0049] Preferably, the pressure of the heated hot pressing is 12-20 MPa, for example, it can be 13 MPa, 14 MPa, 15 MPa, 16 MPa, 17 MPa, 18 MPa or 19 MPa, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0050] Preferably, the heating and hot pressing time is 1-2h, for example, it can be 1.1h, 1.3h, 1.5h, 1.7h or 1.9h, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0051] Preferably, the preparation method comprises the following steps:

[0052] The hydroxylated thermally conductive particles and the semi-cured sheet containing anhydride curing agent are pre-pressed at a mass ratio of (0.3-0.6):1 at 160-180°C and 3-5MPa for 0.5-1h, then heated to 180-220°C and hot-pressed at 12-20MPa for 1-2h to obtain the electronic packaging material.

[0053] In a third aspect, the present invention provides a use of the electronic packaging material as described in the first aspect in a microelectronic packaging material.

[0054] Compared with the prior art, the present invention has at least the following beneficial effects:

[0055] The electronic packaging material, preparation method and application thereof provided by the present invention utilize a dynamic ester exchange reaction to solve the dispersion and compatibility problems between two solids. The prepared packaging material has excellent thermal conductivity and insulation properties, which helps to improve the service life of third-generation semiconductor silicon carbide and gallium nitride power devices. The overall process is a solid-solid one-step method with a simple process, easy large-scale industrial production, high practical application value, and capable of coping with the rapid development of 5G, 6G communications, big data, new energy vehicles and other fields. DETAILED DESCRIPTION

[0056] For the convenience of understanding the present invention, the present invention lists the following embodiments. It should be understood by those skilled in the art that the embodiments are only to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0057] The raw materials involved in the following examples can be obtained from commercial channels.

[0058] Example 1

[0059] An electronic packaging material is prepared by the following method:

[0060] (1) 3 g of boron nitride (McLean, nano hexagonal boron nitride, particle size 500 nm) was added to 30 mL of 5 mol / L sodium hydroxide aqueous solution, heated to 120 ° C for 24 h, and then the alkaline solution remaining on the surface of the particles was cleaned with a large amount of anhydrous ethanol and deionized water. Then, the particles were transferred to a 60 ° C oven and dried for 24 h to obtain hydroxylated boron nitride particles.

[0061] (2) 200 g of 150 μm bisphenol A epoxy resin prepreg (Elite material, EM-526) was selected, 200 g of hydroxylated boron nitride particles were spread between two prepregs, pre-pressed at 160° C. and 5 MPa for 0.5 h, then heated to 200° C. and 15 MPa for hot pressing for 2 h, and naturally cooled to room temperature to obtain the electronic packaging material.

[0062] Example 2

[0063] An electronic packaging material is prepared by the following method:

[0064] (1) 3 g of aluminum nitride (McLean, nano aluminum nitride, particle size 50 nm) was added to 30 mL of 5 mol / L sodium hydroxide aqueous solution, heated to 120 ° C for 24 h, and then the alkaline solution remaining on the surface of the particles was cleaned with a large amount of anhydrous ethanol and deionized water. Then, the particles were transferred to a 60 ° C oven and dried for 24 h to obtain hydroxylated aluminum nitride particles.

[0065] (2) 200 g of 150 μm bisphenol A epoxy resin prepreg (Elite material, EM-526) was selected, 200 g of hydroxylated aluminum nitride particles were spread between two prepregs, pre-pressed at 160° C. and 5 MPa for 0.5 h, then heated to 200° C. and 15 MPa for hot pressing for 2 h, and naturally cooled to room temperature to obtain the electronic packaging material.

[0066] Example 3

[0067] An electronic packaging material is prepared by the following method:

[0068] (1) 3 g of aluminum oxide (McLean, α-type, particle size 0.2 mm) was added to 30 mL of 5 mol / L sodium hydroxide aqueous solution, heated to 120 °C for reaction for 24 h, and then the alkaline solution remaining on the surface of the particles was cleaned with a large amount of anhydrous ethanol and deionized water. The particles were then transferred to a 60 °C oven and dried for 24 h to obtain hydroxylated aluminum oxide particles.

[0069] (2) 200 g of 150 μm bisphenol A epoxy resin prepreg (Elite material, EM-526) was selected, 200 g of hydroxylated alumina particles were spread between two prepregs, pre-pressed at 160° C. and 5 MPa for 0.5 h, then heated to 200° C. and 15 MPa for hot pressing for 2 h, and naturally cooled to room temperature to obtain the electronic packaging material.

[0070] Example 4

[0071] An electronic packaging material is prepared by the following method:

[0072] (1) 3 g of silicon nitride (McLean, α-type nano silicon nitride, particle size 200 nm) was added to 30 mL of 5 mol / L sodium hydroxide aqueous solution, heated to 120 ° C for reaction for 24 h, and then the alkaline solution remaining on the surface of the particles was cleaned with a large amount of anhydrous ethanol and deionized water. Then, the particles were transferred to a 60 ° C oven and dried for 24 h to obtain hydroxylated silicon nitride particles.

[0073] (2) 200 g of 150 μm bisphenol A epoxy resin prepreg (Elite material, EM-526) was selected, 200 g of hydroxylated silicon nitride particles were spread between two prepregs, pre-pressed at 160° C. and 5 MPa for 0.5 h, then heated to 200° C. and 15 MPa for hot pressing for 2 h, and naturally cooled to room temperature to obtain the electronic packaging material.

[0074] Example 5

[0075] An electronic packaging material is prepared by the following method:

[0076] (1) 3 g of artificial diamond (Zhongnan Diamond, diamond powder, particle size 2 mm) was added to 30 mL of 5 mol / L sodium hydroxide aqueous solution, heated to 120 ° C for 24 h, and then the alkaline solution remaining on the surface of the particles was cleaned with a large amount of anhydrous ethanol and deionized water. Then, the particles were transferred to a 60 ° C oven and dried for 24 h to obtain hydroxylated artificial diamond particles.

[0077] (2) 200 g of 150 μm bisphenol A epoxy resin prepreg (Elite material, EM-526) were selected, 200 g of hydroxylated artificial diamond particles were spread between two prepregs, pre-pressed at 160° C. and 5 MPa for 0.5 h, then heated to 200° C. and 15 MPa for hot pressing for 2 h, and naturally cooled to room temperature to obtain the electronic packaging material.

[0078] Example 6

[0079] An electronic packaging material is prepared by the following method:

[0080] (1) 3 g of boron nitride (McLean, nano hexagonal boron nitride, particle size 500 nm) was added to 30 mL of 5 mol / L sodium hydroxide aqueous solution, heated to 120 ° C for 24 h, and then the alkaline solution remaining on the surface of the particles was cleaned with a large amount of anhydrous ethanol and deionized water. Then, the particles were transferred to a 60 ° C oven and dried for 24 h to obtain hydroxylated boron nitride particles.

[0081] (2) 200 g of 150 μm bisphenol A epoxy resin prepreg (Elite material, EM-526) was selected, 200 g of hydroxylated boron nitride particles were spread between two prepregs, hot-pressed at 200° C. and 15 MPa for 2.5 h, and naturally cooled to room temperature to obtain the electronic packaging material.

[0082] Comparative Examples 1-5

[0083] An electronic packaging material, the preparation method of the electronic packaging material differs from that of Examples 1-5 only in that non-hydroxylated thermal conductive particles are used to react with a prepreg, and the amount of raw materials, hot pressing method, etc. are consistent with those of Examples 1-5.

[0084] The electronic packaging materials obtained in the examples and comparative examples were tested as follows:

[0085] 1) Thermal conductivity

[0086] The thermal diffusion coefficient α, m of the sample was measured using the LFA467 laser scattering thermal conductivity instrument from NETZSCH, Germany. 2 / s, using the drainage method, using an electronic balance to test the bulk density of the material, ρ, g / cm 3 The specific heat of the material Cp, J / mK, was measured using DSC. The thermal conductivity λ, W / (m·K) of the electronic packaging material was calculated using the formula: λ = α×ρ×Cp.

[0087] 2) Insulation properties

[0088] The dielectric strength of the samples was tested using Chroma 19073 from Taiwan, China.

[0089] The test results are summarized in Table 1.

[0090] Table 1

[0091]

[0092]

[0093] It can be seen from the test results that the electronic packaging material prepared by the solid-solid one-step method of the present invention significantly improves the thermal conductivity of the material due to the filling of thermally conductive particles, and its thermal conductivity is ≥2.1W / m·K, and its insulation strength is ≥5kV / mm; in addition, the thermally conductive particles modified by hydroxylation undergo an ester exchange reaction with the matrix resin during the hot pressing process, which effectively solves the compatibility and dispersion problems between the thermally conductive particles and the prepreg resin, and can meet the service requirements of the third-generation semiconductor power devices.

[0094] By comparing Example 1 with Example 6, it can be seen that the present invention uses a step-by-step hot pressing process, and the epoxy resin molecular chain segments are more flexible in the pre-pressing stage, ensuring sufficient contact between them and the hydroxylated thermal conductive particles. Subsequently, increasing the temperature and pressure promotes the dynamic ester exchange reaction between the hydroxyl group and the ester group, which can achieve better thermal conductivity and insulation effects.

[0095] By comparing Examples 1-5 with Comparative Examples 1-5, it can be seen that the unmodified particles can only be squeezed into the interior of the semi-cured sheet by physical force, which easily causes problems such as agglomeration inside, thereby failing to form a continuous thermal conductive network, and the thermal conductivity and insulation properties of the obtained electronic packaging material are poor.

[0096] The applicant declares that the above is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention shall fall within the protection scope and disclosure scope of the present invention.

Claims

1. An electronic packaging material, It is characterized in that The raw materials for preparing the electronic packaging material include at least one prepreg containing anhydride curing agent and hydroxylated thermal conductive particles; The prepreg containing anhydride curing agent is combined with the hydroxylated thermal conductive particles via ester groups.

2. The electronic packaging material according to claim 1, It is characterized in that The hydroxylated thermally conductive particles are obtained by subjecting thermally conductive particles to an alkali treatment; Preferably, the thermally conductive particles include any one or a combination of at least two of artificial diamond, boron nitride, aluminum nitride, silicon nitride or aluminum oxide; Preferably, the alkali treatment is carried out in the presence of an alkali solution; Preferably, the alkali in the alkali solution comprises sodium hydroxide and / or potassium hydroxide; Preferably, the solvent of the alkaline solution includes water; Preferably, the alkali concentration in the alkali solution is 2-5 mol / L; Preferably, the temperature of the alkali treatment is 120-140°C; Preferably, the alkali treatment time is 18-24h; Preferably, the mass concentration of the thermally conductive particles in the alkaline solution during the alkaline treatment is 10-30%; Preferably, the alkali treatment is followed by washing and drying; Preferably, the drying temperature is 50-80°C; Preferably, the drying time is 18-24 hours.

3. The electronic packaging material according to claim 2, It is characterized in that The preparation method of the hydroxylated thermally conductive particles comprises the following steps: The thermally conductive particles are mixed with a 2-5 mol / L alkaline solution to obtain a mixed solution with a thermally conductive particle mass concentration of 10-30%, and the mixture is reacted at 120-140° C. for 18-24 hours. After the reaction is completed, the residual alkaline solution is washed away, and then dried at 50-80° C. for 18-24 hours to obtain the hydroxylated thermally conductive particles.

4. The preparation method according to any one of claims 1 to 3, It is characterized in that The prepreg includes epoxy resin; Preferably, the epoxy resin includes any one or a combination of at least two of bisphenol A epoxy resin, bisphenol F epoxy resin, polypropylene epoxy resin, biphenyl epoxy resin, vinyl fluoride epoxy resin, alicyclic epoxy resin or epoxy resin containing an inorganic skeleton structure; Preferably, the glass transition temperature of the epoxy resin is ≥160°C; Preferably, the weight average molecular weight of the epoxy resin is 500-2000 g / mol.

5. The electronic packaging material according to any one of claims 1 to 4, It is characterized in that The acid anhydride curing agent includes any one of phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, phthalic anhydride or pyromellitic dianhydride, or a combination of at least two thereof; Preferably, the mass content of the anhydride curing agent in the prepreg is 20-40%.

6. The electronic packaging material according to any one of claims 1 to 5, It is characterized in that The thickness of the prepreg is 50-300 μm; Preferably, the mass ratio of the hydroxylated thermally conductive particles to the prepreg is (0.3-0.6):

1.

7. A method for preparing the electronic packaging material according to any one of claims 1 to 6, It is characterized in that The preparation method comprises the following steps: The electronic packaging material is obtained by hot pressing the hydroxylated thermally conductive particles and the prepreg containing anhydride curing agent.

8. The preparation method according to claim 7, It is characterized in that The hot pressing includes pre-pressing and heating hot pressing; Preferably, the pre-pressing temperature is 160-180°C; Preferably, the pre-pressing pressure is 3-5 MPa; Preferably, the pre-pressing time is 0.5-1h; Preferably, the temperature of the heating and hot pressing is 180-220°C; Preferably, the pressure of the heating and hot pressing is 12-20 MPa; Preferably, the heating and hot pressing time is 1-2 hours.

9. The preparation method according to claim 7 or 8, It is characterized in that The preparation method comprises the following steps: The hydroxylated thermally conductive particles and the semi-cured sheet containing anhydride curing agent are pre-pressed at a mass ratio of (0.3-0.6):1 at 160-180°C and 3-5MPa for 0.5-1h, then heated to 180-220°C and hot-pressed at 12-20MPa for 1-2h to obtain the electronic packaging material.

10. Use of the electronic packaging material according to any one of claims 1 to 6 in microelectronic packaging materials.

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