Automatic alignment device for wafer inspection

Abstract

The present invention provides an automatic alignment device for wafer detection, and relates to the technical field of wafer detection. The automatic alignment device for wafer detection comprises a fixed plate, an adjustment mechanism is arranged above the fixed plate, the adjustment mechanism comprises a worm gear 1, the bottom surface of the worm gear 1 is rotatably connected to the fixed plate, the top surface of the worm gear 1 is fixedly connected to a rotating rod, and the outer surface of the rotating rod is rotatably connected to a worm gear 2 and a rotating cylinder. The automatic alignment device for wafer detection is arranged by the coordination of a worm gear 1, a rotating rod, a worm gear 2, a rotating cylinder, a bevel gear 1, a moving frame, a rotating rod, a bevel gear 2, a motor 1, a worm gear 1, a fixed block, a motor 2 and a worm gear 2, so that the present invention realizes the multi-directional automatic adjustment of the bearing plate through the rotation of the rotating rod and the moving frame, effectively enables the microscope body to perform multi-angle alignment detection on each position of the side of the wafer, and further makes the device more practical.

Description

Technical Field

[0001] The invention relates to an alignment device, in particular to an automatic alignment device for wafer detection, belonging to the technical field of wafer detection. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, also known as a wafer.

[0003] After searching, a Chinese patent with publication number CN220455183U discloses an automatic alignment device for wafer detection, which includes a workbench, a detection device is arranged above the workbench, a support frame is fixed on the top of the workbench, and a clamping mechanism is arranged on the support frame. The invention is suitable for the correction of wafers of different sizes, and can realize detection conveniently and quickly.

[0004] Although the above scheme can be used for alignment inspection of wafers of different sizes, the microscope is fixed directly above the wafer, so that only the top surface of the wafer can be inspected, which is less practical and does not allow the microscope to perform multi-angle alignment inspection on each position on the side of the wafer. To this end, we provide an automatic alignment device for wafer inspection to solve the above problems. In addition, the conventional clamping structure of the wafer is unstable, lacks up and down positioning methods, has the possibility of jumping, and also has the risk of dust falling, and there is no cleaning mechanism in the prior art. Summary of the invention

[0005] 1. Technical issues to be solved

[0006] The purpose of the present invention is to provide an automatic alignment device for wafer inspection in order to solve the above-mentioned problems, so as to solve the problem in the prior art that the microscope cannot perform multi-angle alignment detection on each position of the wafer side, and at the same time provide more stable clamping.

[0007] (II) Technical solution

[0008] The present invention is implemented through the following technical scheme: an automatic alignment device for wafer inspection, comprising a fixed plate, the fixed plate is made of metal, an adjustment mechanism is arranged above the fixed plate, the adjustment mechanism comprises a worm gear 1, the bottom surface of the worm gear 1 is rotatably connected to the fixed plate, the top surface of the worm gear 1 is fixedly connected to a rotating rod, the outer surface of the rotating rod is rotatably connected to a worm gear 2 and a rotating drum, the top surface of the worm gear 2 is fixedly connected to the rotating drum, the end of the rotating rod away from the worm gear 1 is fixedly connected to a bevel gear 1, the bottom surface of the bevel gear 1 is rotatably connected to a moving frame, the bottom surface of the moving frame is fixedly connected to the rotating drum, and the inner wall of the moving frame is rotatably connected to a rotating rod.

[0009] Preferably, the outer surface of the rotating rod is fixedly connected with bevel gear 2, and the outer surface of bevel gear 2 is meshed with bevel gear 1. The rotation of bevel gear 2 can effectively drive the rotating rod to rotate at the same time.

[0010] Preferably, the inner wall of the fixed plate is fixedly connected to motor 1, the output end of the motor 1 is fixedly connected to worm 1, the outer surface of the worm 1 is meshed with worm wheel 1, and a control button of motor 1 is installed on the outer surface of the fixed plate, and the control button can effectively turn on motor 1 to make it work.

[0011] Preferably, a fixing block is fixedly connected to the top surface of the fixing plate, a motor 2 is fixedly connected to the inner wall of the fixing block, a worm 2 is fixedly connected to the output end of the motor 2, an outer surface of the worm 2 is meshed with a worm wheel 2, and a control button for the motor 2 is installed on the outer surface of the fixing plate, and the motor 2 can be effectively turned on by the control button to make it work.

[0012] Preferably, a connecting plate is fixedly connected to the top surface of the fixing plate, and a microscope body is fixedly connected to the inner wall of the connecting plate. The wafer can be effectively observed and inspected through the arrangement of the microscope body.

[0013] Preferably, an alignment mechanism is arranged above the fixed plate, and the alignment mechanism includes a bearing plate, the inner wall of the bearing plate is slidably connected with a sliding block, the inner wall of the sliding block is threadedly connected with a bidirectional screw, both ends of the bidirectional screw are rotatably connected to the bearing plate, and a rotating handle is fixedly installed at one end of the bidirectional screw, and the bidirectional screw can be driven to rotate more conveniently by rotating the handle.

[0014] Preferably, the top surface of the sliding block is fixedly connected to a clamping plate, the inner wall of the supporting plate is fixedly connected to a sliding rod, the outer surface of the sliding rod is slidably connected to the sliding block, and by driving the bidirectional screw to rotate, the two clamping plates can be effectively driven to move relative to the center of the supporting plate at the same time.

[0015] Preferably, a driven plate is fixedly connected to the outer surface of the rotating rod, and the top surface of the driven plate is fixedly connected to the bearing plate, so that the driven plate can be driven to move simultaneously through the movement of the rotating rod.

[0016] Preferably, it also includes multiple groups of upper and lower positioning mechanisms, with racks on both sides of the clamping plate, the upper and lower positioning mechanisms including a control rod, a control head, control teeth, and a control ball. A threaded hole is provided on the bearing plate, and a round hole is provided on the threaded hole, which can accommodate the control teeth. A control head is fixed on the top of the control rod, and the control head is disc-shaped. The control teeth are fixed on the upper part of the control rod, and the control ball is fixed on the lower end of the control rod. The control head is used to control the upper clamping part to achieve clamping, and the control ball is used to control the lower clamping part to achieve clamping, thereby achieving upper and lower clamping of the wafer, and the rack clamps the wafer through an intermediate transmission structure or directly cooperates with the control teeth.

[0017] Preferably, multiple upper clamping parts are arranged and connected along the circumference of the control head, and the upper clamping part includes a limit part 1, which is fixed on the upper side of the control head, the control head is hingedly connected to the right side of the suspension clamping plate 1, the suspension clamping plate 1 is arranged on the lower side of the limit part, the left side of the suspension clamping plate 1 is hinged to the right side of the suspension clamping plate 2, the upper end of the left side of the suspension clamping plate 1 is provided with a limit part 2, and the suspension clamping plate 2 is arranged at the lower end of the limit part 2.

[0018] Preferably, it also includes a cleaning device 1, which is arranged on the suspended clamping plate 2. The cleaning device 1 includes a cleaning plate, and bristles are arranged at the lower end of the cleaning plate. The cleaning plate is arranged in a slide groove 1 opened at the lower end of the suspended clamping plate 2. The cleaning plate is connected to the bottom of the slide groove 1 through a spring. The clamping block 1 is fixedly arranged in the fixed groove of the suspended clamping plate 2. The clamping block 1 can be made of deformable material, such as a rubber block, etc. A lifting mechanism is arranged in the clamping block 1 to control the lifting of the cleaning plate.

[0019] The present invention provides an automatic alignment device for wafer inspection, which has the following beneficial effects:

[0020] 1. The automatic alignment device for wafer detection is configured by the coordination of worm gear 1, rotating rod, worm gear 2, rotating drum, bevel gear 1, moving frame, rotating rod, bevel gear 2, motor 1, worm 1, fixed block, motor 2 and worm 2. By driving worm 1 to rotate alone, the rotating rod can be effectively driven to rotate. By driving worm 1 and worm 2 to rotate at the same time, the moving frame can be effectively driven to rotate. Thus, the present invention realizes multi-directional automatic adjustment of the carrying plate through the rotation of the rotating rod and the moving frame, effectively enabling the microscope body to perform multi-angle alignment detection on each position on the side of the wafer, further making the device more practical.

[0021] 2. The automatic alignment device for wafer inspection is arranged through the coordination of a carrying plate, a sliding block, a bidirectional screw, a clamping plate, a sliding rod and a bidirectional screw. By rotating the bidirectional screw, the two clamping plates are simultaneously moved toward the center of the carrying plate, which can effectively squeeze and align the wafer. The present invention realizes that through the relative movement of the two clamping plates, wafers of different sizes can be automatically aligned and aligned more quickly and conveniently, thereby further making the device more flexible.

[0022] 3. The present invention provides an up-down positioning mechanism and a cleaning structure to clamp the wafer and remove dust, which has an ingenious structure and low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 It is a schematic diagram of the three-dimensional structure of the adjustment mechanism of the present invention;

[0025] Figure 3 It is a schematic diagram of the three-dimensional structure of the rotating rod of the present invention;

[0026] Figure 4 It is a schematic diagram of the three-dimensional structure of the alignment mechanism of the present invention;

[0027] Figure 5 It is a schematic diagram of the clamping plate of the present invention;

[0028] Figure 6 It is a schematic diagram of the upper and lower positioning mechanism and the cleaning mechanism of the present invention.

[0029] Figure 7 It is an enlarged schematic diagram of part A of the present invention.

[0030] Figure 8 It is an enlarged schematic diagram of part B of the present invention.

[0031]

Main component symbol description

[0032] 1. Fixed plate;

[0033] 2. Adjustment mechanism; 201. Worm gear 1; 202. Rotating rod; 203. Worm gear 2; 204. Rotating drum; 205. Bevel gear 1; 206. Moving frame; 207. Rotating rod; 208. Bevel gear 2; 209. Motor 1; 210. Worm 1; 211. Fixed block; 212. Motor 2; 213. Worm 2;

[0034] 3. Connecting plate; 4. Microscope body;

[0035] 5. Alignment mechanism; 501. Loading plate; 502. Sliding block; 503. Bidirectional screw; 504. Clamping plate; 505. Sliding rod; 506. Follower plate;

[0036] 601, rack; 602, control head; 603, control tooth; 605, control ball; 606, control rod; 608, suspension clamping plate one; 609, suspension clamping plate two; 610, limit part one; 611, cleaning plate; 612, starting block; 613, rack one; 614, electrostatic rod one; 618, clamping block one; 619, limit part two; 701, clamping block two; 703, rocking rod; 702, driving rod. DETAILED DESCRIPTION

[0037] An embodiment of the present invention provides an automatic alignment device for wafer inspection.

[0038] See also Figure 1 , including a fixing plate 1, a power supply is installed above the fixing plate 1, which can supply power to the electrical equipment in this application.

[0039] Please refer again Figure 2 and Figure 3 An adjusting mechanism 2 is arranged above the fixed plate 1, and the adjusting mechanism 2 includes a worm gear 201. The bottom surface of the worm gear 201 is rotatably connected to the fixed plate 1, and a rotating rod 202 is fixedly connected to the top surface of the worm gear 201. By driving the worm gear 201 to rotate, the rotating rod 202 can be effectively driven to rotate at the same time.

[0040] The outer surface of the rotating rod 202 is rotatably connected to the worm gear 203 and the rotating cylinder 204, the top surface of the worm gear 203 is fixedly connected to the rotating cylinder 204, a bearing is arranged between the worm gear 203 and the rotating cylinder 204 and the rotating rod 202, the inner wall of the bearing is fixedly connected to the rotating rod 202, and the outer surface of the bearing is fixedly connected to the worm gear 203 and the rotating cylinder 204, so that the worm gear 203 and the rotating cylinder 204 are fixed on the outer surface of the rotating rod 202 more stably.

[0041] One end of the rotating rod 202 away from the worm gear 201 is fixedly connected to a bevel gear 205, and the bottom surface of the bevel gear 205 is rotatably connected to a moving frame 206. The bottom surface of the moving frame 206 is fixedly connected to the rotating drum 204. By simultaneously driving the worm gear 203 and the rotating drum 204 to rotate, the moving frame 206 can be effectively rotated.

[0042] The inner wall of the moving frame 206 is rotatably connected to a rotating rod 207, and the outer surface of the rotating rod 207 is fixedly connected to a bevel gear 208. The outer surface of the bevel gear 208 is meshed with the bevel gear 1 205. By driving the bevel gear 1 205 to rotate, the bevel gear 208 can be effectively driven to rotate.

[0043] The inner wall of the fixed plate 1 is fixedly connected to a motor 209, and the output end of the motor 209 is fixedly connected to a worm 210. The outer surface of the worm 210 is meshed with the worm wheel 201. By turning on the motor 209, the worm 210 is rotated, thereby effectively driving the worm wheel 201 to rotate.

[0044] The top surface of the fixed plate 1 is fixedly connected with a fixed block 211, the inner wall of the fixed block 211 is fixedly connected with a motor 212, the output end of the motor 212 is fixedly connected with a worm 213, the outer surface of the worm 213 is meshed with the worm wheel 203, and the setting of the fixed block 211 effectively supports and fixes the motor 212, and the other end of the worm 213 and the worm 1 210 is rotatably connected with a limiting plate, so that the worm 213 and the worm 1 210 are more stable when rotating.

[0045] Please refer again Figure 1 The top surface of the fixing plate 1 is fixedly connected with a connecting plate 3, and the inner wall of the connecting plate 3 is fixedly connected with a microscope body 4. Through the setting of the connecting plate 3, the microscope body 4 is effectively fixed and clamped.

[0046] Please refer again Figure 2 and Figure 4 A positioning mechanism 5 is arranged above the fixed plate 1, and the positioning mechanism 5 includes a supporting plate 501, and the inner wall of the supporting plate 501 is slidably connected with a sliding block 502, and the inner wall of the sliding block 502 is threadedly connected with a bidirectional screw 503, and the two ends of the bidirectional screw 503 are rotatably connected to the supporting plate 501. By driving the bidirectional screw 503 to rotate, the two sliding blocks 502 can be effectively driven to move relative to each other in the inner wall of the fixed plate 1.

[0047] The top surface of the sliding block 502 is fixedly connected with a clamping plate 504, the inner wall of the supporting plate 501 is fixedly connected with a sliding rod 505, and the outer surface of the sliding rod 505 is slidably connected to the sliding block 502. Through the setting of the sliding rod 505, the clamping plate 504 is more stable when moving.

[0048] The outer surface of the rotating rod 207 is fixedly connected with a driven plate 506, and the top surface of the driven plate 506 is fixedly connected to the supporting plate 501. The movement of the driven plate 506 can effectively drive the wafer on the top surface of the supporting plate 501 to perform multi-directional position angle adjustment.

[0049] Motor 1 209 and motor 2 212 in the present application are both common electrical devices in the prior art. The present application will not elaborate on their models or internal structures, and they can also be replaced by other power sources.

[0050] When the present invention is in use: first, a wafer is placed on the top surface of a carrier plate 501 and then the bidirectional screw 503 is rotated. The rotation of the bidirectional screw 503 drives the two sliding blocks 502 to move relative to the center of the carrier plate 501 at the same time. The movement of the sliding block 502 drives the two clamping plates 504 to move relative to each other, thereby effectively clamping and aligning the wafer and effectively placing it directly below the microscope body 4. When it is necessary to detect multiple angles at each position on the side of the wafer, the worm 210 is rotated by starting the operation of the motor 209 alone. The rotation of the worm 210 drives the worm wheel 201 to rotate. The rotation of the worm wheel 201 drives the rotating rod 202 to rotate. The rotation of the rotating rod 202 drives the bevel gear 205 to rotate. The rotation of the bevel gear 205 drives the rotating rod 207 in the inner wall of the bevel gear 208 to rotate. The rotating rod 207 rotates to And the setting of the driven plate 506 is cooperated to drive the carrier plate 501 to perform angular displacement with the rotating rod 207 as the axis, until the carrier plate 501 carries the wafer and is offset to the angle required for detection, when the operation of motor 1 209 and motor 2 212 is turned on at the same time, the worm 1 210 and the worm 2 213 are rotated at the same time, so that the meshing force of the two can effectively drive the rotating rod 202 and the moving frame 206 to rotate at the same time, the rotation of the moving frame 206 and the setting of the driven plate 506 can make the carrier plate 501 rotate with the rotating rod 202 as the center axis, and the rotation of the carrier plate 501 effectively drives the wafer after the angle displacement to rotate until the wafer is rotated to the orientation required for detection, so that the microscope body 4 can perform multi-angle alignment detection on each position on the side of the wafer, further making the device more practical.

[0051] Further, see Figure 5 and Figure 6 In order to better fix the wafer and prevent the wafer from jumping up and down, it is necessary to position the wafer up and down. The present application also includes multiple groups of up and down positioning mechanisms. The clamping plate 504 is provided with racks 601 on both sides. The up and down positioning mechanisms include a control rod 606, a control head 602, a control tooth 603, and a control ball 605. A threaded hole is provided on the carrier plate 501, and a round hole is provided on the threaded hole. The round hole can accommodate the control tooth. A control head 602 is fixed on the top of the control rod 606. The control head 602 is disc-shaped. The control tooth 603 is fixedly arranged on the upper part of the control rod 606. The control ball 605 is fixedly arranged on the lower end of the control rod 606. The control head 602 is used to control the upper clamping part to achieve clamping, and the control ball is used to control the lower clamping part to achieve clamping, thereby achieving up and down clamping of the wafer. The rack 601 clamps the wafer through an intermediate transmission structure or directly cooperates with the control tooth 603.

[0052] Further, see Figure 6 , Figure 7 and Figure 8, multiple upper clamping parts are arranged and connected along the circumference of the control head 602, the upper clamping part includes a limiting part 610, the limiting part 610 is fixed on the upper side of the control head 602, the control head 602 is hingedly connected to the right side of the suspension clamping plate 608, the suspension clamping plate 608 is arranged on the lower side of the limiting part 610, the left side of the suspension clamping plate 608 is hinged to the right side of the suspension clamping plate 2 609, a limiting part 2 619 is arranged on the upper end of the left side of the suspension clamping plate 1 608, and the suspension clamping plate 2 609 is arranged at the lower end of the limiting part 2 619. During operation, as the control rod 606 rotates, the suspension clamping plate 1 608 and the suspension clamping plate 2 609 will change from a natural drooping state to a nearly horizontal state due to the centrifugal rotation, and as the control rod 606 rotates and moves downward in the threaded hole, the two suspension clamping plates are finally used to clamp the wafer, and the two limiting parts are both for achieving support under clamping.

[0053] Furthermore, the present application also includes a cleaning device 1, which is arranged on the suspended clamping plate 609. The cleaning device 1 includes a cleaning plate 611. The lower end of the cleaning plate 611 is provided with bristles. The cleaning plate 611 is arranged in a slide groove 1 provided at the lower end of the suspended clamping plate 609. The cleaning plate 611 is connected to the bottom of the slide groove 1 through a spring. The clamping block 1 618 is fixedly arranged in the fixed groove of the suspended clamping plate 609. The clamping block 1 618 can be made of a deformable material, such as a rubber block, etc. A lifting mechanism is provided in the clamping block 618 for controlling the lifting of the cleaning plate 611 to achieve the storage of the cleaning plate 611 after cleaning.

[0054] Furthermore, the lifting mechanism includes a starting block 612, which is arranged in a slide groove 2 opened at the lower end of a clamping block 1 618, and the starting block 612 is connected to the bottom of the slide groove 2 through a spring, and a rack 1 613 is arranged on the top of the starting block 611, and the left side of the top of the rack 1 613 is meshed with a gear 1, and the gear 1 is rotatably arranged in the suspended clamping plate 2 609, and the gear 1 is coaxially fixed with a pulley 1 615, and the pulley 1 615 fixes a rope 1, and the rope 1 passes through a fixed pulley 1 and is connected to the top of the cleaning plate 611. The specific working process is that during the rotation of the suspended clamping plate 2 609, appropriate wind force can be generated to clean the wafer by wind, and the bristles at the lower end of the cleaning plate 611 are lower than the clamping block 1 618 and the starting block 612, and the cleaning Plate 611 first contacts the upper end of the wafer to achieve cleaning, and as the bristles deform, the starting block 612 contacts the wafer, compressing the starting block 611, causing the starting block 612 to move upward, driving the rack 613 to move upward, driving the gear 1 to rotate, and the rotation of the gear 1 then drives the pulley 1 to rotate. The pulley begins to wrap around the rope 1, and then drives the cleaning plate 611 to move upward, and finally the clamping block 1 618 contacts the wafer to achieve positioning. At the same time, the cleaning plate 611 can be stored. In order to prevent the clamping plate 504 and the clamping block 1 618 from being in contact with the wafer at the same time, rubber or other buffering deformation materials can be set on the inner side of the clamping plate 504 or the lower side of the clamping block 1 618 or a certain section of the control rod 606.

[0055] Furthermore, the present application also includes a second cleaning device, which is arranged on a suspended clamping plate 608. The arrangement of the second cleaning device is the same as that of the first cleaning device, with the only difference being that the second cleaning device includes an electrostatic rod 614, and a buffer ball is arranged at the lower end of the electrostatic rod 614 to prevent the electrostatic rod 614 from accidentally falling and damaging itself and other objects. The two different cleaning devices can achieve a better combination of multiple cleaning methods and thus better dust removal.

[0056] Furthermore, the present application also includes a plate fastening structure, which includes a tensioning block 617. The tensioning block 617 is arranged in the slideway 616 of the suspended clamping plate 608, and the slideway 616 is arranged horizontally. The left end of the tensioning block 617 is connected to the inner wall of the left end of the slideway 616 through a spring. Gear 2 is rotatably arranged in the suspended clamping plate 609, and gear 2 is arranged on the right side of rack 1 613. Gear 2 and pulley 3 are coaxially fixed. Pulley 3 is fixed with rope 2. Rope 2 bypasses fixed pulley 2 and passes through the left inner wall of the slideway to connect with the left side of the tensioning block 617. The working process is that when rack 1 613 moves upward, it drives gear 2 to rotate, and then drives rope 2 to pull the tensioning block to move to the left, so as to realize the fastening of the suspended clamping plate 608 and the suspended clamping plate 2 609.

[0057] Furthermore, the lower clamping part includes a rocking arm 703, a driving rod 702, and a clamping block 701. The supporting plate 501 is provided with a stepped through hole. The stepped through hole includes three sections from top to bottom, and the radius gradually decreases. The first section is provided with a clamping block 701. The driving rod 702 includes a driving rod head and a driving rod portion. The diameter of the driving rod head is larger than the diameter of the driving rod portion. The driving rod head is arranged in the second section, and the driving rod portion is arranged in the third section and passes through the third section. A protrusion is arranged at the lower end of the supporting plate 501, and the middle part of the rocking arm 703 is hinged to the protrusion. The right side of the rocking arm 703 is located under the control ball 605, and the left side of the rocking arm 703 is located under the driving rod 702. The working process is that when the control ball 605 moves downward, the driving rod 702 is driven to move upward through the rocking arm 703, thereby causing the clamping block 701 to clamp the wafer.

[0058] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. An automatic alignment device for wafer inspection, comprising a fixing plate (1), the fixing plate being made of metal, and characterized in that: An adjusting mechanism (2) is arranged above the fixing plate (1), and the adjusting mechanism (2) comprises a worm gear 1 (201), the bottom surface of the worm gear 1 (201) is rotatably connected to the fixing plate (1), the top surface of the worm gear 1 (201) is fixedly connected to a rotating rod (202), the outer surface of the rotating rod (202) is rotatably connected to a worm gear 2 (203) and a rotating cylinder (204), the top surface of the worm gear 2 (203) is fixedly connected to the rotating cylinder (204), and the end of the rotating rod (202) away from the worm gear 1 (201) is fixedly connected to a bevel gear 1 ( 205), the bottom surface of the bevel gear 1 (205) is rotatably connected to a moving frame (206), the bottom surface of the moving frame (206) is fixedly connected to the rotating drum (204), the inner wall of the moving frame (206) is rotatably connected to a rotating rod (207), an alignment mechanism (5) is arranged above the fixed plate (1), the alignment mechanism (5) comprises a bearing plate (501), the inner wall of the bearing plate (501) is slidably connected to a sliding block (502), the inner wall of the sliding block (502) is threadedly connected to a bidirectional screw (503), the bidirectional screw ( The two ends of the sliding block (502) are rotatably connected to the bearing plate (501), the top surface of the sliding block (502) is fixedly connected to the clamping plate (504), the inner wall of the bearing plate (501) is fixedly connected to the sliding rod (505), the outer surface of the sliding rod (505) is slidably connected to the sliding block (502), and also includes a plurality of groups of upper and lower positioning mechanisms, the two sides of the clamping plate (504) are racks (601), the upper and lower positioning mechanisms include a control rod (606), a control head (602), a control tooth (603), and a control ball (605), and a screw is provided on the bearing plate (501). The threaded hole is a round hole which can accommodate a control tooth. A control head (602) is fixed on the top of the control rod (606). The control head (602) is in the shape of a disc. The control tooth (603) is fixedly arranged on the upper part of the control rod (606). The control ball (605) is fixedly arranged on the lower end of the control rod (606). The control head (602) is used to control the upper clamping part to achieve clamping. The control ball is used to control the lower clamping part to achieve clamping, thereby achieving upper and lower clamping of the wafer. The rack (601) is used to clamp the wafer through an intermediate transmission structure or directly cooperates with the control tooth (603).

2. The automatic alignment device for wafer inspection according to claim 1, characterized in that: A plurality of upper clamping parts are arranged and connected along the circumference of the control head (602), and the upper clamping parts include a limiting part 1 (610), which is fixed on the upper side of the control head (602), and the control head (602) is hingedly connected to the right side of the suspension clamping plate 1 (608), and the suspension clamping plate 1 (608) is arranged on the lower side of the limiting part 1 (610), and the left side of the suspension clamping plate 1 (608) is hingedly connected to the right side of the suspension clamping plate 2 (609), and a limiting part 2 (619) is arranged at the upper end of the left side of the suspension clamping plate 1 (608), and the suspension clamping plate 2 (609) is arranged at the lower end of the limiting part 2 (619).

3. The automatic alignment device for wafer inspection according to claim 2, characterized in that: The invention also includes a cleaning device 1, which is arranged on the suspended clamping plate 2 (609). The cleaning device 1 includes a cleaning plate (611). The lower end of the cleaning plate (611) is provided with bristles. The cleaning plate (611) is arranged in a slide groove 1 provided at the lower end of the suspended clamping plate 2 (609). The cleaning plate (611) is connected to the bottom of the slide groove 1 through a spring. A clamping block 1 (618) is fixedly arranged in the fixed groove of the suspended clamping plate 2 (609). The clamping block 1 (618) can be made of a deformable material. A lifting mechanism is provided in the clamping block 1 (618) for controlling the lifting of the cleaning plate (611).

4. The automatic alignment device for wafer inspection according to claim 1, characterized in that: The outer surface of the rotating rod (207) is fixedly connected to a second bevel gear (208), and the outer surface of the second bevel gear (208) is meshed with the first bevel gear (205).

5. The automatic alignment device for wafer inspection according to claim 1, characterized in that: The inner wall of the fixed plate (1) is fixedly connected to a motor 1 (209), the output end of the motor 1 (209) is fixedly connected to a worm 1 (210), and the outer surface of the worm 1 (210) is meshed with a worm wheel 1 (201).

6. The automatic alignment device for wafer inspection according to claim 1, characterized in that: The top surface of the fixed plate (1) is fixedly connected to a fixed block (211), the inner wall of the fixed block (211) is fixedly connected to a second motor (212), the output end of the second motor (212) is fixedly connected to a second worm (213), and the outer surface of the second worm (213) is meshed with a second worm wheel (203).

7. The automatic alignment device for wafer inspection according to claim 1, characterized in that: The top surface of the fixing plate (1) is fixedly connected to a connecting plate (3), and the inner wall of the connecting plate (3) is fixedly connected to a microscope body (4).

8. The automatic alignment device for wafer inspection according to claim 1, characterized in that: A driven plate (506) is fixedly connected to the outer surface of the rotating rod (207), and the top surface of the driven plate (506) is fixedly connected to the bearing plate (501).

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