Integrated heat dissipation device and electronic equipment

By designing an integrated heat dissipation device, the vibration of the piezoelectric actuator and the diaphragm is used to form a connecting channel between the heat exchange chamber and the heat dissipation chamber, solving the problem of reducing heat dissipation efficiency caused by local hot gas circulation in the prior art, and achieving efficient thermal management and high heat benefits.

CN119095344BActive Publication Date: 2025-03-04CHANGZHOU VITO FLUID TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202411319105.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-09-21
Publication Date
2025-03-04
Estimated Expiration
2044-09-21

AI Technical Summary

Technical Problem

In the prior art, the air outlet of the gas generator is located on a single side, resulting in a local hot gas circulation between the heat source and the air outlet, reducing the heat exchange and heat dissipation efficiency, and making it difficult to obtain high heat benefits.

Method used

An integrated heat dissipation device is designed, including a housing and a piezoelectrically driven actuator. The actuator has a first main surface and a second main surface arranged in the thickness direction. The first chamber and the second chamber are formed through the spacer and the diaphragm. The actuator causes the diaphragm to vibrate, causing the chamber volume to periodically change, and gas flows between the heat exchange chamber and the heat dissipation chamber through the connecting channel, forming a one-way flow characteristic to avoid local hot gas circulation.

Benefits of technology

By decoupling the heat exchange process and the heat dissipation process, efficient heat exchange and heat dissipation are achieved, local hot gas circulation is avoided, and the heat benefit of the heat dissipation device is significantly improved.

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Abstract

The present invention relates to the technical field of electronic equipment, and in particular to an integrated heat dissipation device and electronic equipment, comprising a shell and a piezoelectrically driven actuator; the actuator accommodating chamber is divided into a heat exchange chamber located on the side of a first chamber and a heat dissipation chamber located on the side of a second chamber, a first hole portion is penetrated through the area of ​​the diaphragm opposite to the first chamber, and a second hole portion is penetrated through the area of ​​the diaphragm opposite to the second chamber, and the first hole portion is used to impact a heat source area when the gas is discharged from the first chamber, and the heat exchange process and the heat dissipation process are decoupled, and the heat exchange chamber inhales fresh gas under the action of negative pressure formed in the peripheral area to perform efficient heat exchange, while the heat dissipation chamber continues to perform efficient heat dissipation, and the gas carrying heat enters the heat dissipation chamber through a connecting channel under the action of continuous negative pressure formed on the periphery of the heat dissipation chamber, and is finally ejected to the external environment through a jet hole, and the process of converting the inflow of fresh gas into the outflow of hot gas carrying heat presents a unidirectional flow characteristic, and no local hot gas circulation will be formed.
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Description

Technical Field

[0001] The present invention relates to the technical field of electronic equipment, and in particular to an integrated heat dissipation device, and also to an electronic equipment comprising the integrated heat dissipation device. Background Art

[0002] As 3C terminal products gradually develop towards intelligence, lightness and thinness, the heat load of internal electronic devices is gradually increasing, and efficient thermal management technology has become a hot topic of research. In recent years, gas generating devices that use piezoelectric transducers as actuators, such as a piezoelectric pump declared in publication number CN101490419B, a fluid pump declared in publication number CN102597520B, and a piezoelectric micro blower declared in publication number CN101542122B, are set in the internal space of terminal products and are believed to generate greater thermal benefits.

[0003] The above-mentioned gas generating device uses gas as a heat exchange and heat dissipation medium. The heat source is usually arranged directly opposite the gas outlet of the gas generating device so that the airflow ejected from the gas generating device directly impacts the surface of the heat source, thereby improving the heat exchange and heat dissipation efficiency.

[0004] However, since the gas outlets in the above-mentioned gas generating device are all located on a single side of the device, after working for a period of time, the heat-carrying gas formed by the airflow ejected from the outlet hitting the surface of the heat source will form a local hot air circulation between the heat source and the gas outlet because the hot air cannot be dispersed to the environment far away from the heat source in time, resulting in a continuous decrease in the heat exchange and heat dissipation efficiency, making it difficult to obtain the desired thermal benefits. Summary of the invention

[0005] The technical problem to be solved by the present invention is: in order to solve the deficiencies in the prior art, an integrated heat dissipation device and an electronic device are provided to solve the problem in the prior art that the heat exchange and heat dissipation efficiency is reduced due to the formation of local hot air circulation between the air outlet and the heat source, making it difficult to obtain high thermal benefits.

[0006] The technical solution adopted by the present invention to solve the technical problem is: an integrated heat dissipation device, including a housing and a piezoelectrically driven actuator;

[0007] The actuator has a first main surface and a second main surface arranged opposite to each other in the thickness direction;

[0008] The first main surface and the second main surface are respectively provided with a diaphragm through a spacer, so that a first cavity is formed between the first main surface and the spacer on its side and the diaphragm, and a second cavity is formed between the second main surface and the spacer on its side and the diaphragm; a first hole portion communicating with the first cavity is penetrated in a region of the diaphragm opposite to the first cavity, and a second hole portion communicating with the second cavity is penetrated in a region of the diaphragm opposite to the second cavity;

[0009] The shell has a containing cavity, the actuator is arranged in the containing cavity, and the containing cavity is divided into a heat exchange cavity located on the side of the first cavity and a heat dissipation cavity on the side of the second cavity, the heat exchange cavity is connected with the heat dissipation cavity through a connecting channel, the outer wall of the shell is provided with a vent hole connected with the heat exchange cavity and a jet hole connected with the heat dissipation cavity, the inner wall of the heat exchange cavity has a heat source area, a gap is left between the diaphragm of the first cavity and the heat source area to form a heat exchange channel, and a gap is left between the inner wall of the heat dissipation cavity at one end opposite to the second hole and the diaphragm of the second cavity to form a heat dissipation channel;

[0010] When the actuator causes the diaphragm to vibrate, the volume of the first chamber changes periodically, and gas is sucked in or discharged from the heat exchange chamber through the first hole portion, and the volume of the second chamber changes periodically, and gas is sucked in or discharged from the heat dissipation chamber through the second hole portion, and external gas enters the heat exchange chamber through the vent hole, and the gas in the heat exchange chamber enters the heat dissipation chamber through the connecting channel, and the gas in the heat dissipation chamber is discharged through the jet hole;

[0011] One end of the first hole portion facing away from the first chamber faces the heat source area, so as to impact the heat source area when the gas is exhausted from the first chamber.

[0012] Furthermore, the actuator causes the diaphragm to generate vibrations of a high-order resonance mode having at least two antinodes;

[0013] At least one first hole is formed at at least one antinode position of the diaphragm vibration on the side where the first chamber is located or in the vicinity of the antinode position;

[0014] At least one second hole portion is formed at at least one antinode position of diaphragm vibration on the side where the second chamber is located or in a region adjacent to the antinode position.

[0015] Further, at least one first hole portion is formed at each antinode position or an adjacent area of ​​the antinode position of the diaphragm vibration on the side where the first chamber is located;

[0016] At least one second hole portion is formed at each antinode position of the diaphragm vibration on the side where the second chamber is located or in the vicinity of the antinode position.

[0017] Further, the range of the high-order resonance mode is from the second-order resonance mode to the ninth-order resonance mode;

[0018] The resonance modes of the diaphragms that enclose the first chamber and the diaphragms that enclose the second chamber when vibrating are the same or different.

[0019] Further, the shell has a side wall, a top wall and a bottom wall, the side wall is arranged around the outer side of the outer periphery of the actuator with a gap, one end of the side wall is connected to the top wall, and the other end is connected to the bottom wall, the bottom wall, the side wall and the actuator are surrounded to form a heat exchange cavity, the top wall, the side wall and the actuator are surrounded to form a heat dissipation cavity, and the connecting channel is located between the outer peripheral surface of the side wall and the outer peripheral surface of the actuator;

[0020] The heat source area is a groove structure opened on the bottom wall or a hole structure penetrating the bottom wall;

[0021] The shell is located on the side of the heat source area for connecting the heat source, and when the shell is connected to the heat source, one end of the heat source area away from the heat exchange cavity is fully or partially covered by the heat source.

[0022] Furthermore, it also includes an elastic supporting portion, which elastically supports the actuator in the accommodating cavity.

[0023] A configuration scheme of the elastic support portion: the elastic support portion is configured in a gap between the side wall and the actuator;

[0024] One end of the elastic support portion is fixedly connected to the side wall, and the other end is fixedly connected to the actuator, and the elastic support portion separates the heat dissipation cavity and the heat exchange cavity;

[0025] The elastic supporting portion and / or the side wall are provided with the connecting channel.

[0026] Another arrangement scheme of the elastic support part, the heat dissipation cavity and / or the heat exchange cavity is provided with the elastic support part, and the gap between the side wall and the actuator forms the communication channel;

[0027] One end of the elastic support portion in the heat dissipation cavity is fixedly connected to the top wall, and the other end is fixedly connected to the second main surface;

[0028] One end of the elastic support portion in the heat exchange cavity is fixedly connected to the bottom wall, and the other end is fixedly connected to the first main surface.

[0029] Furthermore, the distance between the outer peripheral surface of the actuator on the side close to the vent hole and the side wall is smaller than the distance between the outer peripheral surface of the actuator on the side away from the vent hole and the side wall.

[0030] Furthermore, the connecting channel is arranged on a side of the heat exchange cavity away from the vent hole, and the heat exchange channel is located between the connecting channel and the vent hole.

[0031] Further, the actuator comprises a substrate, and at least one piezoelectric sheet is bonded to one or both sides of the substrate in the thickness direction, and the piezoelectric sheet and the substrate constitute the actuator;

[0032] The spacer is engaged with the actuator at one end close to the actuator, and the spacer and the actuator form a groove with an opening at one end facing away from the actuator. The diaphragm is fixedly connected to the end of the spacer facing away from the actuator on its side and covers the opening of the groove.

[0033] Furthermore, the piezoelectric sheet is in a ring-shaped structure with a hole running through the center, and the hole is arranged opposite to the first cavity and the second cavity.

[0034] Furthermore, the spacer is an annular structure, the first main surface and the second main surface respectively enclose an annular groove with the inner peripheral wall of the spacer thereon, and the diaphragm and the end of the spacer on its side away from the actuator are fully or partially engaged on an annular path around the groove;

[0035] Alternatively, the spacer portion has a plurality of spacers, and the plurality of spacers are spaced apart and distributed along a circular path, the inner peripheral wall of the spacer on the first main surface and the first main surface form the groove portion, and the inner peripheral wall of the spacer on the second main surface and the second main surface form the groove portion; the end of the spacer facing away from the actuator is fully or partially combined with the diaphragm on its side.

[0036] Furthermore, the diaphragm is made of a polymer material, or a composite material of a polymer material and a metal material.

[0037] The present invention also provides an integrated electronic device, comprising the above-mentioned integrated heat dissipation device.

[0038] The beneficial effects of the present invention are as follows: the integrated heat dissipation device of the present invention is formed as a gas generator with flow outputs on both sides, and a heat exchange cavity is constructed on one side of the actuator, and a heat dissipation cavity is constructed on the other side, and a connecting channel connecting the heat exchange cavity and the heat dissipation cavity is also formed, so that the heat exchange process and the heat dissipation process are decoupled, the heat exchange cavity inhales fresh gas under the negative pressure formed in the peripheral area, and continuously performs efficient heat exchange, while the heat dissipation cavity continuously performs efficient heat dissipation, the heat-carrying gas enters the heat dissipation cavity through the connecting channel under the continuous negative pressure formed on the periphery of the heat dissipation cavity, and is finally ejected from the jet hole to the external environment, the process of converting the inflow of fresh gas into the outflow of hot gas carrying heat presents a unidirectional flow characteristic, and will not form a local hot gas circulation, which can greatly improve the thermal benefit of the heat dissipation device;

[0039] For the first chamber, the gas with a certain momentum flows out of the first hole and forms a jet in the heat exchange chamber, which can directly impact the heat source area and can draw in the surrounding fluid to achieve efficient heat dissipation; similarly, for the second chamber, the gas with a certain momentum flows out of the second hole and forms a jet in the heat dissipation chamber, and can draw in the surrounding fluid to further increase the output flow rate.

[0040] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0042] Figure 1 is a schematic diagram of an integrated heat dissipation device in which the vent hole is located on the side wall when the elastic support portion is arranged on the side wall;

[0043] Figure 2 A schematic diagram of an integrated heat dissipation device in which the vent hole is located on the elastic supporting part when the elastic supporting part is arranged on the side wall;

[0044] Figure 3 is a schematic diagram of an integrated heat dissipation device when the elastic support portion is arranged on the bottom wall;

[0045] Figure 4 It is a schematic diagram of an integrated heat dissipation device in which the jet holes are located on the side wall when the elastic support part is arranged on the bottom wall;

[0046] Figure 5 It is a schematic diagram of an integrated heat dissipation device in which the jet holes are located on the top wall and the side wall when the elastic support part is arranged on the bottom wall;

[0047] Figure 6 It is a schematic diagram of an integrated heat dissipation device in which the jet holes are located on the bottom wall when the elastic support part is arranged on the bottom wall;

[0048] Figure 7 A schematic diagram of a structure in which both main surfaces of the actuator are provided with spacers combined with the substrate, and a piezoelectric sheet is provided on any side surface of the substrate in the thickness direction;

[0049] Figure 8 A schematic diagram of a structure in which piezoelectric sheets and spacers are provided on both main surfaces of the actuator, and the spacers are bonded to the piezoelectric sheets;

[0050] Fig. 9 A schematic diagram of a structure in which spacers are provided on both main surfaces of the actuator, and the spacers on one side are bonded to the piezoelectric sheet, and the spacers on the other side are bonded to the substrate;

[0051] Fig.10 A schematic diagram showing a first chamber and a second chamber formed on two sides of an actuator;

[0052] Fig.11 It is a schematic diagram of the first hole portions of the first chamber sucking fluid relatively independently during operation;

[0053] Fig.12 It is a schematic diagram of the first hole portions of the first chamber discharging fluid relatively independently during operation;

[0054] Fig.13 It is a schematic diagram of the second hole portions of the second chamber sucking the fluid relatively independently during the working process;

[0055] Fig.14 It is a schematic diagram showing that the second hole portions of the second chamber discharge fluid relatively independently during operation;

[0056] Fig.15 It is a schematic diagram of the structure of the integrated heat dissipation device and the vibration state of the diaphragm when the diaphragm is in the third-order resonance mode;

[0057] Fig.16 An exploded schematic diagram of a spacer and a diaphragm provided on one side of the actuator;

[0058] Fig.17 It is a schematic diagram of the structure in which the diaphragm is convexly deformed in one direction in the second-order sub-resonance mode;

[0059] Fig.18 It is a schematic diagram of the structure in which the diaphragm is convexly deformed in another direction in the second-order resonance mode;

[0060] Fig.19 It is a schematic diagram of the structure in which the diaphragm is convexly deformed in one direction in the fourth-order resonance mode;

[0061] Fig. 20 It is a schematic diagram of the structure of the square diaphragm convexly deforming in one direction under the second-order subresonance mode when both sides of the short sides are fixed;

[0062] Fig.21 It is a schematic diagram of the structure of the square diaphragm convexly deforming in another direction under the second-order subresonance mode when both sides of the short sides are fixed;

[0063] Fig. 22 It is a schematic diagram of a structure in which a square diaphragm is convexly deformed in one direction under a second-order subresonance mode when both the short sides and the long sides are fixed;

[0064] Fig.23 It is a schematic diagram of a structure in which a square diaphragm is convexly deformed in one direction under a higher-order resonance mode when both short sides and long sides of the diaphragm are fixed;

[0065] Fig.24 The schematic diagram of the structure of the spacer portion in Example 2 is a plurality of spacers arranged at intervals;

[0066] Fig.25 This is a schematic diagram of the structure of the piezoelectric sheet provided with a cavity in Example 3;

[0067] Fig.26 is a schematic diagram of a heat dissipation device in Example 4 configured in the internal space of an electronic device;

[0068] Fig. 27 It is a schematic diagram of the heat dissipation device in Example 4 being configured in a receiving slot of an electronic device;

[0069] Fig.28 is a schematic diagram of a gas generating device in the prior art;

[0070] Fig.29 It is a schematic diagram of the structure of the gas generator and the vibration state of the diaphragm when the diaphragm is in the third-order resonance mode.

[0071] In the figure: 1, shell, 11, heat exchange cavity, 11a, heat exchange channel, 12, heat dissipation cavity, 12a, heat dissipation channel, 13, connecting channel, 14, vent hole, 15, jet hole, 1-1, top wall, 1-2, side wall, 1-3, bottom wall, 1-31, heat source area;

[0072] 2. actuator, 21. substrate, 22. piezoelectric sheet, 221. cavity, 2a. first main surface, 2b. second main surface;

[0073] 3. diaphragm, 31. first hole portion, 32. second hole portion, 33. hole portion, 3-1. antinode position, 3-1a. central antinode, 3-1b. annular antinode;

[0074] 4, spacer, 41, groove, 4a, spacer;

[0075] 5. First chamber;

[0076] 6. Second chamber;

[0077] 7. Elastic supporting part;

[0078] 8. heat source, 81. housing, 811. air inlet, 812. air outlet, 813. receiving tank, 82. heat dissipation device.

[0079] 9. Chamber;

[0080] 10. Flexible plate, 10-1. Drainage hole. DETAILED DESCRIPTION

[0081] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams that only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention, and directions and references (e.g., up, down, left, right, etc.) may only be used to help describe the features in the drawings. Therefore, the following specific embodiments are not to be taken in a limiting sense, and the scope of the subject matter claimed is limited only by the attached claims and their equivalents.

[0082] The gas generating devices in the prior art, such as a piezoelectric pump declared in Patent No. CN101490419B, a fluid pump declared in Patent No. CN102597520B, and a piezoelectric micro blower declared in Patent No. CN101542122B, are known to be the same or similar in the principle of gas generation, and their composition structures at least include a piezoelectric driven actuator 2, a central position and a nearby deformable flexible plate 10 (or a resonance plate, a resonance sheet, a flexible plate, a thin-walled portion, etc.) arranged relative to the actuator 2 with a gap, and a drainage hole 10-1 for gas to pass through is also arranged on the flexible plate 10 relative to the central area of ​​the actuator 2, such as Fig.28 As shown, the actuator 2 vibrates under external excitation. Along with the vibration of the actuator 2, the gas pressure in the chamber 9 formed by the gap between the actuator 2 and the flexible plate 10 changes, thereby causing the flexible plate 10 centered on the drainage hole 10-1 to vibrate. As a result, the volume of the chamber 9 formed by the gap between the actuator 2 and the flexible plate 10 expands or contracts periodically, and the gas enters the chamber 9 through the drainage hole 10-1. The pressurized gas formed after being squeezed flows toward the periphery of the actuator 2, or the gas enters the chamber 9 from the periphery of the actuator 2, and the pressurized gas formed after being squeezed is ejected from the chamber 9 through the drainage hole 10-1.

[0083] In the above structure, the vibration energy of the actuator 2 is transmitted to the flexible plate 10 through the change of gas pressure in the chamber 9, thereby forcing the flexible plate 10 to resonate. Due to the existence of pneumatic damping, there is a large loss in the vibration energy transmitted through fluid-solid coupling, and the energy transfer efficiency is not high. At the same time, the effective working space of the above resonance system is mainly concentrated in the area of ​​the chamber 9 opposite to the central large amplitude of the piezoelectric actuator 2 and the flexible plate 10, while the vibration energy of the area outside the central large amplitude area of ​​the piezoelectric actuator 2 and the flexible plate 10 is not effectively utilized, resulting in low overall energy utilization. The gap volume change under this structure is limited, and the flow output performance is poor. When used as a heat dissipation device, it cannot meet the use requirements.

[0084] Based on this, the inventor of the present application has studied a gas generator having the structure shown below;

[0085] Fig.292 is a cross-sectional view of a gas generator, the gas generator includes a piezoelectric actuator 2, a spacer 4 and a diaphragm 3, the piezoelectric actuator 2 includes a substrate 21 and at least one piezoelectric sheet 22 bonded to one side or both sides of the substrate 21, the piezoelectric sheet 22 causes the actuator 2 to vibrate under the stimulation of an electrical signal, a spacer 4 is provided on one side or both sides of the actuator 2, and the spacer 4 and the actuator 2 form a groove 41 with an opening at one end away from the actuator 2; the diaphragm 3 is connected to the spacer 4 at one end away from the actuator 2. end, and seals the opening of the groove 41, so that a chamber 9 is formed among the actuator 2, the groove 41 and the diaphragm 3. A hole 33 connected to the chamber 9 passes through the area of ​​the diaphragm 3 opposite to the chamber 9. When the actuator 2 vibrates under the excitation of an electrical signal, the vibration energy is transferred to the diaphragm 3 to cause the diaphragm 3 to generate a vibration of a high-order resonance mode with at least two antinodes. At least one hole 33 is respectively formed at at least two antinode positions 3-1 of the vibration of the diaphragm 3 or in the vicinity of the antinode position 3-1.

[0086] Thus, the diaphragm 3 is fixedly connected to the actuator 2 through the spacer 4, and the vibration of the actuator 2 causes the diaphragm 3 to vibrate, and this process is accompanied by the transfer of energy. The vibration energy generated by the actuator 2 under the excitation of the external electrical signal, on the one hand, is transferred to the diaphragm 3 by driving the fluid in the chamber 9 to produce pressure changes when the actuator 2 vibrates, thereby causing the diaphragm 3 to vibrate. More importantly, the energy is directly transferred to the diaphragm 3 by the mechanical coupling formed by the actuator 2 and the diaphragm 3. Compared with the prior art that only relies on the fluid to transfer vibration energy, the energy transfer efficiency is higher. In addition, the diaphragm 3 generates vibrations in a high-order resonant mode, and at least two wave-node positions 3-1 or the adjacent areas of the wave-node positions 3-1 are respectively formed with at least one hole portion 33. At this time, the effective working space of the chamber 9 between the actuator 2 and the diaphragm 3 is no longer mainly concentrated in the central area of ​​the diaphragm 3, but extends to a larger area than the central area, and the utilization rate of the vibration energy is higher.

[0087] However, although the gas generator can obtain a larger flow output compared with the prior art, when the gas generator is used as a heat exchange and heat dissipation device, there is still local hot gas circulation, which will have an adverse effect on the improvement of heat exchange and heat dissipation efficiency; it is not difficult to understand that the heat source 8 is arranged at a position opposite to the hole 33. When the gas generator is working, each hole 33 inhales and discharges gas relatively independently. When the gas is discharged, the gas forms a jet, which impacts the surface of the heat source 8 to form heat exchange. When the gas is inhaled, most of the heat-carrying gas formed in the heat exchange process will be sucked into the chamber 9 again, thereby forming a local hot gas circulation, which in turn affects the improvement of heat exchange and heat dissipation efficiency when used as a heat exchange and heat dissipation device.

[0088] In view of this, the present invention designs the following scheme:

[0089] Example 1

[0090] like Figure 1-6 As shown, an integrated heat dissipation device can be used for efficient thermal management of electronic equipment, including a housing 1 and a piezoelectrically driven actuator 2;

[0091] The actuator 2 has a substrate 21, and at least one piezoelectric sheet 22 is bonded to one side or both sides of the substrate 21 in the thickness direction. The piezoelectric sheet 22 may be a piezoelectric ceramic sheet. The piezoelectric sheet 22 and the substrate 21 constitute the actuator 2. The actuator 2 has a first main surface 2a and a second main surface 2b that are relatively arranged in the thickness direction. The substrate 21 may be, but is not limited to, circular, rectangular, polygonal or elliptical, etc. In this embodiment, the substrate 21 is in the shape of a circular plate as an example. A single piezoelectric sheet 22 can be bonded to any side surface of the substrate 21 in the thickness direction to constitute a piezoelectric single-chip actuator 2; or two piezoelectric sheets 22 are respectively arranged on the two side surfaces of the substrate 21 in the thickness direction to constitute a piezoelectric dual-chip actuator 2; or a plurality of piezoelectric sheets 22 are arranged on the same side surface of the substrate 21 in the thickness direction to constitute a composite multilayer piezoelectric actuator 2, etc. The piezoelectric sheet 22 causes the actuator 2 to vibrate under the excitation of an external periodic electrical signal.

[0092] The actuator 2 has a spacer 4, and the spacer 4 is joined to the first main surface 2a and the second main surface 2b of the actuator 2 respectively by integral molding or fixed connection. The spacer 4 is connected to the actuator 2 at one end close to the actuator 2, and the spacer 4 and the actuator 2 form a groove 41 with an opening at one end away from the actuator 2. It is not difficult to understand that the spacer 4 joined to the first main surface 2a and the second main surface 2b of the actuator 2 can be joined to the surface of the substrate 21 constituting the actuator 2, such as Figure 7 As shown, they can also be bonded to the surface of the piezoelectric sheet 22 constituting the actuator 2, such as Figure 8 As shown, of course, the spacer 4 located on one main surface of the actuator 2 may be bonded to the surface of the substrate 21 constituting the actuator 2, while the spacer 4 located on the other main surface of the actuator 2 may be bonded to the surface of the piezoelectric sheet 22 constituting the actuator 2, as shown in FIG. Fig. 9 As shown; it should be noted that, when the actuator 2 is formed as a piezoelectric single-crystal actuator 2, the spacer 4 bonded to the first main surface 2a and the second main surface 2b of the actuator 2 are bonded to the surface of the substrate 21 constituting the actuator 2, the piezoelectric sheet 22 is arranged in the groove 41 surrounded by the spacer 4 on the same side as the piezoelectric sheet 22, and the spacer 4 on the same side as the piezoelectric sheet 22 has a height protruding from the surface of the piezoelectric sheet 22, as shown in FIG. Figure 7 When the spacer 4 is bonded to the surface of the substrate 21 constituting the actuator 2, the bonding between the spacer 4 and the substrate 21 may be bonding or integrally formed, such as Figure 7 and Fig. 9As shown; of course, the joining method of the spacer 4 is not limited to this. The joining method of the spacer 4 follows the principle that the end of the spacer 4 close to the actuator 2 is connected to the actuator 2, and the spacer 4 and the actuator 2 form a groove 41 with an opening at the end away from the actuator 2.

[0093] like Fig.10 As shown, the actuator 2 is provided with a diaphragm 3, and the first main surface 2a and the second main surface 2b are respectively provided with diaphragms 3 by spacing parts 4, and the diaphragm 3 is fixedly connected to the end of the spacing part 4 on the side where the diaphragm 3 is located away from the actuator 2, and covers the opening of the groove part 41, so that a first chamber 5 is formed between the first main surface 2a and the spacing part 4 on the side where the diaphragm 3 is located, that is, the first chamber 5 is formed between the actuator 2, the groove part 41 on the side where the first main surface 2a is located, and the diaphragm 3 on the side where the first main surface 2a is located, and the second chamber 6 is formed between the second main surface 2b and the spacing part 4 on the side where the diaphragm 3 is located, that is, the second chamber 6 is formed between the actuator 2, the groove part 41 on the side where the second main surface 2b is located, and the diaphragm 3 on the side where the second main surface 2b is located,

[0094] A first hole portion 31 communicating with the first chamber 5 is formed through the area of ​​the diaphragm 3 opposite to the first chamber 5, and a second hole portion 32 communicating with the second chamber 6 is formed through the area of ​​the diaphragm 3 opposite to the second chamber 6. Fig.10 As shown;

[0095] Thus, the diaphragm 3 is fixedly connected to the actuator 2 through the spacer 4, and the vibration of the actuator 2 causes the diaphragm 3 to vibrate. This process is accompanied by the transfer of energy. The vibration energy generated by the actuator 2 under the excitation of the external electrical signal, on the one hand, drives the gas in the chamber 9 to produce pressure changes when the actuator 2 vibrates, thereby causing the diaphragm 3 to vibrate and transfer the energy to the diaphragm 3. More importantly, the energy is directly transferred to the diaphragm 3 through the mechanical coupling formed by the actuator 2 and the diaphragm 3. Compared with the prior art that only relies on the fluid to transfer vibration energy, the energy transfer efficiency is higher. Under the same excitation conditions, the diaphragm 3 can be caused to produce a larger amplitude to achieve a higher flow output. Under the same amplitude requirement, the input power of the actuator 2 can be reduced, the heat can be reduced, and the energy utilization rate, product stability and service life can be improved.

[0096] When the actuator 2 vibrates under the excitation of the electrical signal, the actuator 2 transmits the vibration energy to the diaphragm 3, so as to cause the diaphragm 3 to vibrate in a first-order resonance mode;

[0097] Alternatively, when the actuator 2 vibrates under the excitation of the electrical signal, it transmits the vibration energy to the diaphragm 3, so as to cause the diaphragm 3 to vibrate in a high-order resonance mode having at least two antinodes;

[0098] The range of the high-order resonance mode is from the second-order resonance mode to the ninth-order resonance mode. Specifically, the vibration of the high-order resonance mode generated by the diaphragm 3 may be, but is not limited to, the vibration of the second-order resonance mode, the vibration of the third-order resonance mode, the vibration of the fourth-order resonance mode, the vibration of the fifth-order resonance mode, the vibration of the sixth-order resonance mode, the vibration of the seventh-order resonance mode, the vibration of the eighth-order resonance mode, or the vibration of the ninth-order resonance mode.

[0099] At least one first hole portion 31 is formed at at least one antinode position 3-1 of the vibration of the diaphragm 3 on the side where the first chamber 5 is located or in the vicinity of the antinode position 3-1;

[0100] At least one second hole portion 32 is formed at at least one antinode position 3-1 of the vibration of the diaphragm 3 on the side where the second chamber 6 is located or in the vicinity of the antinode position 3-1;

[0101] The adjacent area of ​​the antinode position 3-1 refers to an area in the interval between the node position of the vibration of the diaphragm 3 and the antinode position 3-1, which is close to the side of the antinode position 3-1 but does not include the antinode position 3-1.

[0102] In the present embodiment, at least one first hole portion 31 may be formed at least two antinode positions 3-1 of the vibration of the diaphragm 3 that encloses the first chamber 5 or in the vicinity of the antinode position 3-1; at least one second hole portion 32 may be formed at least two antinode positions 3-1 of the vibration of the diaphragm 3 that encloses the second chamber 6 or in the vicinity of the antinode position 3-1; or at least one first hole portion 31 may be formed at each antinode position 3-1 of the vibration of the diaphragm 3 on the side where the first chamber 5 is located or in the vicinity of the antinode position 3-1; at least one second hole portion 32 may be formed at each antinode position 3-1 of the vibration of the diaphragm 3 on the side where the second chamber 6 is located or in the vicinity of the antinode position 3-1.

[0103] For the first chamber 5 of the actuator 2, the piezoelectric sheet 22 causes the actuator 2 to vibrate under the stimulation of the electrical signal, and transmits the vibration energy to the diaphragm 3, so as to cause the diaphragm 3 to generate a vibration of a high-order resonance mode with at least two antinodes. The first hole portions 31 formed at at least one or two antinode positions 3-1 of the vibration of the diaphragm 3 or in the adjacent area of ​​the antinode position 3-1 in the working process inhale and discharge gas relatively independently. When the area where the first hole portion 31 is located is deformed toward the side away from the actuator 2, the local volume of the area corresponding to the first hole portion 31 in the first chamber 5 increases, the pressure decreases, and the gas in the heat exchange cavity 11 enters the first chamber 5 along the first hole portion 31. Fig.11As shown; when the area where the first hole portion 31 is located is deformed toward the actuator 2, the local volume of the area corresponding to the first hole portion 31 in the first chamber 5 becomes smaller, and the pressure increases. The gas sucked into the first chamber 5 in the previous process has a certain momentum when it is discharged from the first chamber 5 along the first hole portion 31. After the gas with a certain momentum flows out of the first hole portion 31, it forms a jet in the heat exchange chamber 11 and can entrain the surrounding fluid, further increasing the output flow rate, as shown in FIG. Fig.12 As shown, this goes back and forth.

[0104] In addition, it should be noted that the height of the first chamber 5 in the thickness direction of the actuator 2 may be greater than the sum of the maximum displacements of the actuator 2 and the diaphragm 3 when they vibrate and deform toward each other, so as to avoid motion interference between the actuator 2 and the diaphragm 3 during the vibration process and make full use of the vibration energy. In addition, if the height of the first chamber 5 is too large, the gas pressure and flow rate discharged from the first chamber 5 by the first hole 31 will be reduced, which will affect the formation of the jet and even make it impossible to form a jet, and it will be impossible to suck in the surrounding fluid, thereby resulting in a reduction in the final output flow rate. Preferably, the height of the first chamber 5 in the thickness direction of the actuator 2 is not greater than 20 times the sum of the maximum displacements of the actuator 2 and the diaphragm 3 when they vibrate and deform toward each other.

[0105] The vibration generated by the diaphragm 3 can be a centrally symmetrical vibration mode. For example, when the diaphragm 3 vibrates in a first-order resonance mode, the vibration displacement at the center of the diaphragm 3 is the largest. Since there is only one central antinode 3-1a, its effective working space is mainly concentrated in the area of ​​the chamber 9 opposite to the central antinode 3-1a of the actuator 2 and the diaphragm 3, while the vibration energy in areas outside the central antinode 3-1a of the actuator 2 and the diaphragm 3 is not effectively utilized, resulting in low overall energy utilization.

[0106] This situation can be effectively improved when the diaphragm 3 vibrates in a high-order resonance mode, because the diaphragm 3 in the high-order central symmetric resonance mode not only has a central antinode 3-1a, but also has an annular antinode 3-1b surrounding the central antinode 3-1a at a position further outward of the central antinode 3-1a, and the number of the annular antinodes 3-1b is related to the order of the resonance mode;

[0107] The spacer 4 is an annular structure, and the inner peripheral wall of the spacer 4 and the actuator 2 enclose an annular groove 41, and the end of the spacer 4 away from the actuator 2 is fully or partially engaged with the diaphragm 3 on an annular path around the groove 41;

[0108] When the end of the annular spacer 4 facing away from the actuator 2 is completely engaged with the diaphragm 3 along the annular path around the groove 41:

[0109] The diaphragm 3 vibrates in a third-order resonance mode, and the antinode position 3-1 can be a central antinode 3-1a and an annular antinode 3-1b, respectively. The diaphragm 3 has a central antinode 3-1a at the central position, and the central antinode 3-1a has an annular antinode 3-1b surrounding the central antinode 3-1a at a position closer to the outside. At this time, since the vibration displacement of the diaphragm 3 is significantly increased compared with the prior art, even if the first hole portion 31 is only provided in the central antinode 3-1a or in the vicinity of the central antinode 3-1a, or the first hole portion 31 is only provided in the annular antinode 3-1b or in the vicinity of the annular antinode 3-1b, a higher output flow rate can be obtained. Of course, preferably, the first hole portion 31 is provided in the central antinode 3-1a and the annular antinode 3-1b or in the vicinity of the annular antinode 3-1b, such as Figure 15-16 As shown ( Fig.15 The middle curve Q1 represents the extreme position state of the area where each first hole portion 31 is located when it is vibrated and deformed in the first direction during the vibration of the diaphragm 3, and Q2 represents the extreme position state of the area where each first hole portion 31 is located when it is vibrated and deformed in the second direction opposite to the first direction during the vibration of the diaphragm 3). The effect that can be achieved is that the effective working space of the first chamber 5 between the actuator 2 and the diaphragm 3 is no longer mainly concentrated in the central area of ​​the diaphragm, but extends to a larger area than the central area, and the utilization rate of vibration energy is higher;

[0110] The vibration generated by the diaphragm 3 may also be a vibration of a higher-order resonance mode other than the centrally symmetrical vibration mode; for example, when the diaphragm 3 vibrates in the second-order resonance mode, there are two antinodes that are axially symmetrically distributed. At this time, since the vibration displacement of the diaphragm 3 is significantly increased compared with the prior art, even if the first hole portion 31 is only provided at one of the antinode positions 3-1 or in the vicinity of the antinode position 3-1, a higher output flow rate can be obtained. Of course, preferably, the first hole portion 31 is provided at both the antinode positions 3-1 that are axially symmetrically distributed or in the vicinity of the antinode position 3-1, such as Figure 17-18 As shown, "+" indicates that the diaphragm 3 is convexly deformed in one direction, "-" indicates that the diaphragm 3 is convexly deformed in another direction, and the "area circled by a long line and a double short line" indicates the area where the antinode position 3-1 is located; when the diaphragm 3 vibrates in the fourth-order resonance mode, there are four antinodes that are axially symmetrically distributed. Similarly, at this time, since the vibration displacement of the diaphragm 3 is significantly increased compared with the prior art, even if the first hole portion 31 is only provided at one of the antinode positions 3-1 or the adjacent area of ​​the antinode position 3-1, a higher output flow rate can be obtained. Preferably, the first hole portions 31 are simultaneously provided at the four antinode positions 3-1 or the adjacent areas that are axially symmetrically distributed. The effect that can be achieved is that the effective working space of the first chamber 5 between the actuator 2 and the diaphragm 3 is no longer mainly concentrated in the central area of ​​the diaphragm 3, but is extended to a larger area than the central area, and the utilization rate of the vibration energy is higher; as shown Fig.19 It is shown that the diaphragm of the second chamber is provided with second holes 32 at four antinode positions 3 - 1 or adjacent areas which are axially symmetrically distributed.

[0111] The actuator 2 generates vibration under external excitation and transmits the vibration energy to the diaphragm 3, thereby causing the diaphragm 3 to vibrate. The resonance mode of the coordinated vibration of the actuator 2 and the diaphragm 3 is related to the structural shape of the actuator 2, the structural shape of the diaphragm 3 and the connection method between the two. The above factors do not constitute a limitation on the protection scope of the claims of the present invention. The substrate 21 and the piezoelectric sheet 22 constituting the actuator 2 can be, but are not limited to, circular, rectangular, polygonal or elliptical, etc., the shape of the diaphragm 3 can also be, but are not limited to, circular, rectangular, polygonal or elliptical, etc., and the spacer 4 connected between the actuator 2 and the diaphragm 3 can also be, but are not limited to, a circular ring structure, a rectangular ring structure, a polygonal ring structure or an elliptical ring structure.

[0112] As for the diaphragm 3 alone, the diaphragm 3 may be rectangular, and the two sides of the short sides of the diaphragm 3 are fixedly connected to the actuator 2 through the spacer 4, and the two sides of the long sides of the diaphragm 3 are not fixed:

[0113] When the diaphragm 3 vibrates in the second-order resonance mode, there are two antinodes distributed along the long side. At this time, since the vibration displacement of the diaphragm 3 is significantly increased compared with the prior art, even if the first hole portion 31 is only provided at one of the antinode positions 3-1 or in the vicinity of the antinode position 3-1, a higher output flow rate can be obtained. Of course, preferably, the first hole portion 31 is provided at both the antinode positions 3-1 distributed along the long side or in the vicinity of the antinode position 3-1, such as Figure 20-21 As shown;

[0114] When the diaphragm 3 vibrates in the third-order resonance mode, there are three antinodes distributed along the long side. At this time, since the vibration displacement of the diaphragm 3 is significantly increased compared with the prior art, even if the first hole portion 31 is only set at one of the antinode positions 3-1 or in the adjacent area of ​​the antinode position 3-1, a higher output flow rate can be obtained. Of course, preferably, the first hole portion 31 is simultaneously set at the three antinode positions 3-1 distributed along the long side or in the adjacent area of ​​the antinode position 3-1.

[0115] For another example, still only referring to the diaphragm 3, the diaphragm 3 is rectangular, and both the short side and the long side of the diaphragm 3 are fixedly connected to the actuator 2 through the spacer 4:

[0116] When the diaphragm 3 vibrates in the second-order resonance mode, there are two antinodes distributed along the long side. At this time, since the vibration displacement of the diaphragm 3 is significantly increased compared with the prior art, even if the first hole portion 31 is only provided at one of the antinode positions 3-1 of the vibration of the diaphragm 3 or in the vicinity of the antinode position 3-1, a higher output flow rate can be obtained. Of course, preferably, the first hole portion 31 is provided at both the antinode positions 3-1 distributed along the long side of the vibration of the diaphragm 3 or in the vicinity of the antinode position 3-1, such as Fig. 22 As shown;

[0117] When the diaphragm 3 vibrates in a higher order resonance mode, there are also Fig.23 The resonance mode shown has six wave troughs. At this time, since the vibration displacement of the diaphragm 3 is significantly increased compared with the prior art, even if the first hole portion 31 is set at only one of the wave trough positions 3-1 or in the vicinity of the wave trough position 3-1, a higher output flow rate can be obtained. Of course, preferably, the first hole portion 31 is set at the six wave trough positions 3-1 or in the vicinity of the wave trough position 3-1 at the same time.

[0118] For the second chamber 6, when the area where the second hole portion 32 is located is deformed toward the side away from the actuator 2, the local volume of the area corresponding to the second hole portion 32 in the second chamber 6 becomes larger, the pressure decreases, and the gas in the heat dissipation cavity 12 enters the second chamber 6 along the second hole portion 32. Fig.13 As shown; when the area where the second hole portion 32 is located is deformed toward the actuator 2, the local volume of the area corresponding to the second hole portion 32 in the second chamber 6 becomes smaller, and the pressure increases. The gas sucked into the second chamber 6 in the previous process has a certain momentum when it is discharged from the second chamber 6 along the second hole portion 32. The gas with a certain momentum forms a jet in the heat dissipation cavity 12 after flowing out of the second hole portion 32, and can entrain the surrounding fluid, further increasing the output flow rate, as shown in FIG. Fig.14 As shown, so on and so forth;

[0119] It is easy to understand that the principle of the second chamber 6 sucking and exhausting gas through the second hole portion 32 is the same as the principle of the first chamber 5 sucking and exhausting gas through the first hole portion 31, and will not be repeated here.

[0120] In addition, it should be noted that the resonance modes of the diaphragms 3 that enclose the first cavity 5 and the diaphragms 3 that enclose the second cavity 6 when vibrating may be the same or different.

[0121] The diaphragm 3 can be made of metal film materials, such as copper foil, titanium foil, stainless steel foil, etc. Preferably, the diaphragm 3 is made of polymer materials, such as PET, PI, PPS, PEI, FEP or other polymer films, or the diaphragm 3 is made of a composite material composed of polymer materials and metal materials, such as PI copper clad plate / film, PET copper clad plate / film, PET nickel-plated plate / film, carbon fiber metal composite plate / film, etc. Whether it is a polymer material or a composite material composed of a polymer material and other materials, compared with metal materials, they all show the characteristics of light weight and high elastic strain limit, and the limit amplitude during resonance is usually much higher than that of metal materials, which is particularly suitable for high requirements on flow output, such as heat dissipation of smart 3C terminal products.

[0122] like Figure 1 As shown, the housing 1 has a containing cavity, the actuator 2 is arranged in the containing cavity, and the containing cavity is divided into a heat exchange cavity 11 located on the side of the first cavity 5 and a heat dissipation cavity 12 located on the side of the second cavity 6. The housing 1 has a side wall 1-2, a top wall 1-1 and a bottom wall 1-3. The side wall 1-2 is arranged around the outer side of the outer periphery of the actuator 2 with a gap. One end of the side wall 1-2 is connected to the top wall 1-1, and the other end is connected to the bottom wall 1-3. The bottom wall 1-3, the side wall 1-2 and the actuator 2 are enclosed to form a heat exchange cavity 11, and the top wall 1-1, the side wall 1-2 and the actuator 2 are enclosed to form a heat dissipation cavity 12. The connecting channel 13 is located between the outer peripheral surface of the side wall 1-2 and the outer peripheral surface of the actuator 2.

[0123] The heat source area 1-31 is a groove structure opened on the bottom wall 1-3 or a hole structure penetrating the bottom wall 1-3;

[0124] The shell 1 is located on the side where the heat source area 1-31 is located and is used to connect the heat source 8. When the shell 1 is connected to the heat source 8, the end of the heat source area 1-31 away from the heat exchange cavity 11 is fully or partially covered by the heat source 8;

[0125] The heat exchange chamber 11 is connected with the heat dissipation chamber 12 through a connecting channel 13. The connecting channel 13 can be arranged on the side wall 1-2 of the shell 1 or in the area outside the actuator 2, the first chamber 5 and the second chamber 6 in the shell 1. The outer wall of the shell 1 is provided with a vent hole 14 connected with the heat exchange chamber 11 and a jet hole 15 connected with the heat dissipation chamber 12. The inner wall of the heat exchange chamber 11 has a heat source area 1-31. A gap is left between the diaphragm 3 of the first chamber 5 and the heat source area 1-31 to form a heat exchange channel 11a. A gap is left between the inner wall of the heat dissipation chamber 12 at one end opposite to the second hole portion 32 and the diaphragm 3 of the second chamber 6 to form a heat dissipation channel 12a.

[0126] When the actuator 2 causes the diaphragm 3 to vibrate, the volume of the first chamber 5 changes periodically, and gas is sucked in or discharged from the heat exchange chamber 11 through the first hole 31. The volume of the second chamber 6 changes periodically, and gas is sucked in or discharged from the heat dissipation chamber 12 through the second hole 32. External gas enters the heat exchange chamber 11 through the vent hole 14, and the gas in the heat exchange chamber 11 enters the heat dissipation chamber 12 through the connecting channel 13. The gas in the heat dissipation chamber 12 is discharged through the jet hole 15.

[0127] One end of the first hole portion 31 away from the first chamber 5 faces the heat source area 1-31, that is, the first hole portion 31 is exposed on the side of the heat source area 1-31 away from the first chamber 5, so as to impact the heat source area 1-31 when the gas is discharged from the first chamber 5.

[0128] It may also include an elastic support portion 7, which elastically supports the actuator 2 in the accommodating cavity;

[0129] The actuator 2 is elastically supported on the side wall 1-2 constituting the housing 1, and the elastic support portion 7 can also elastically support the actuator 2 on the top wall 1-1 and / or the bottom wall 1-3 constituting the housing 1, which may include but not be limited to the following support methods:

[0130] First, the side wall 1-2 surrounds the outer side of the outer periphery of the actuator 2 with a gap therebetween, and the elastic support portion 7 is arranged in the gap between the side wall 1-2 and the outer side of the outer periphery of the actuator 2. One end of the elastic support portion 7 is fixedly connected to the side wall 1-2, and the other end is fixedly connected to the actuator 2, so that the actuator 2 is elastically supported on the side wall 1-2. The elastic support portion 7 separates the heat dissipation cavity 12 and the heat exchange cavity 11. For example, the elastic support portion 7 can be a thin plate-shaped planar spring with a central opening, and the outer peripheral surface of the thin plate-shaped planar spring is connected to the side wall 1-2, and the inner peripheral wall of the thin plate-shaped planar spring is connected to the outer side of the outer periphery of the actuator 2, so that the actuator 2 is elastically supported on the side wall 1-2 constituting the shell 1 in a substantially unconstrained manner. At this time, a connecting channel 13 connecting the heat exchange cavity 11 and the heat dissipation cavity 12 is formed inside the side wall 1-2, as shown in FIG. Figure 1 shown.

[0131] Secondly, the side wall 1-2 surrounds the outer side of the outer periphery of the actuator 2 with a gap therebetween, and the elastic support portion 7 is arranged in the gap between the side wall 1-2 and the outer side of the outer periphery of the actuator 2. One end of the elastic support portion 7 is fixedly connected to the side wall 1-2, and the other end is fixedly connected to the actuator 2, so that the actuator 2 is elastically supported on the side wall 1-2. The elastic support portion 7 separates the heat dissipation cavity 12 and the heat exchange cavity 11. For example, the elastic support portion 7 can be a thin plate-shaped planar spring with a central opening, the outer peripheral surface of the thin plate-shaped planar spring is connected to the side wall 1-2, and the inner peripheral wall of the thin plate-shaped planar spring is connected to the outer side of the outer periphery of the actuator 2, so that the actuator 2 is elastically supported on the side wall 1-2 constituting the shell 1 in a substantially unconstrained manner. A through hole is arranged within the range of the outer peripheral surface and the inner peripheral surface of the thin plate-shaped planar spring, and the through hole is formed as a connecting channel 13 connecting the heat exchange cavity 11 and the heat dissipation cavity 12. The number of the through holes can be one, or it can be a plurality of through holes arranged at intervals, such as Figure 2 As shown; it is not difficult to understand that, at this time, it is not necessary to additionally set up a connecting channel 13 connecting the heat exchange chamber 11 and the heat dissipation chamber 12 inside the side wall 1-2. Of course, the through-hole and the connecting channel 13 on the side wall 1-2 can be set at the same time.

[0132] Third, the side wall 1-2 surrounds the outer side of the outer periphery of the actuator 2 with a gap therebetween, the heat dissipation cavity 12 and / or the heat exchange cavity 11 are provided with an elastic support portion 7, and the gap between the side wall 1-2 and the actuator 2 forms a connecting channel 13; one end of the elastic support portion 7 in the heat dissipation cavity 12 is fixedly connected to the top wall 1-1, and the other end is fixedly connected to the second main surface 2b; one end of the elastic support portion 7 in the heat exchange cavity 11 is fixedly connected to the bottom wall 1-3, and the other end is fixedly connected to the first main surface 2a;

[0133] For example, the elastic support portion 7 is arranged along the thickness direction of the actuator 2. The elastic support portion 7 can be arranged in the heat exchange cavity 11 alone, or in the heat dissipation cavity 12 alone. Of course, the elastic support portion 7 can also be arranged in both the heat exchange cavity 11 and the heat dissipation cavity 12.

[0134] When the elastic support part 7 is arranged in the heat dissipation cavity 12, one end of the elastic support part 7 in the heat dissipation cavity 12 is connected to the top wall 1-1, and the other end is connected to the area of ​​the actuator 2 that is further outside the area where the second main surface 2b of the top wall 1-1 is opposite to the second cavity 6; when the elastic support part 7 is arranged in the heat exchange cavity 11, one end of the elastic support part 7 in the heat exchange cavity 11 is connected to the bottom wall 1-3, and the other end is connected to the area of ​​the actuator 2 that is further outside the area where the first main surface 2a of the bottom wall 1-3 is opposite to the first cavity 5;

[0135] Taking the case where the elastic support portion 7 is provided in the heat exchange chamber 11 alone as an example, at this time, since the elastic support portion 7 is equivalent to the outer peripheral area provided in the area of ​​the heat exchange chamber 11 opposite to the actuator 2 and closer to the outside than the second chamber 6, the elastic support portion 7 cannot close the area of ​​the heat exchange chamber 11 opposite to the first chamber 5 and has a heat dissipation channel 12a for gas circulation; for example, the elastic support portion 7 can be a plurality of coil springs provided at intervals along the circumference of the actuator 2, one end of the coil springs being connected to the bottom wall 1-3, and the other end being connected to the area on the first main surface 2a closer to the outside of the area opposite to the first chamber 5, thereby elastically supporting the actuator 2 on the bottom wall 1-3 constituting the shell 1 in a substantially unconstrained manner, as shown in FIG. Fig.24 As shown; when the gap between the side wall 1-2 and the actuator 2 is formed into a connecting channel 13, the distance between the outer peripheral surface of the actuator 2 close to the vent 14 and the side wall 1-2 can be made smaller than the distance between the outer peripheral surface of the actuator 2 away from the vent 14 and the side wall 1-2, that is, the actuator 2 is offset in the accommodating cavity, which can prevent the gas flowing into the heat exchange cavity 11 through the vent 14 from easily flowing from the outer peripheral surface of the actuator 2 close to the vent 14 and the side wall 1-2 to the heat dissipation cavity 12, so that the gas flows into the heat exchange cavity 11 from the vent 14 and passes through the heat dissipation channel 12a, and then flows from the outer peripheral surface of the actuator 2 away from the vent 14 and the side wall 1-2 to the heat dissipation cavity 12.

[0136] In addition, the jet hole 15 can be arranged on the top wall 1-1, such as Figure 1-3 As shown, a forward outflow is formed. At this time, the jet hole 15 can also penetrate the top wall 1-1, and one end of the jet hole 15 located in the heat dissipation cavity 12 can also be arranged opposite to the diaphragm 3 of the second chamber 6, and even the jet hole 15 can be aligned with the second hole portion 32;

[0137] The jet hole 15 can also be arranged on the side wall 1-2 of the shell 1 that encloses the heat dissipation cavity 12, such as Figure 4 As shown, a lateral outflow is formed. Of course, jet holes 15 can also be set on the top wall 1-1 and the side walls 1-2 that enclose the heat dissipation cavity 12.

[0138] When working:

[0139] The heat source 8 is arranged opposite to the heat source area 1-31. The actuator 2 vibrates under external excitation, and at the same time, the diaphragm 3 is vibrated, so that the first chamber 5 and the second chamber 6 produce periodic volume changes, and then produce periodic pressure changes. The external gas continuously enters the heat exchange chamber 11 through the vent hole 14. After the gas in the heat exchange chamber 11 is sucked into the first chamber 5 from the first hole portion 31, it is discharged from the first chamber 5 through the first hole portion 31 to the heat exchange channel 11a in the heat exchange chamber 11, forming a gas jet, and the gas jet impacts the heat source area 1-31 for heat exchange (when the heat source area 1-31 is a hole structure penetrating the bottom wall 1-3, the gas jet impacts the surface of the heat source 8 for heat exchange), the heat-carrying gas enters the heat dissipation cavity 12 through the connecting channel 13 under the action of the continuous negative pressure formed on the periphery of the heat dissipation cavity 12, and the heat-carrying gas in the heat dissipation cavity 12 is sucked into the second cavity 6 from the second hole portion 32, and then discharged from the second cavity 6 through the second hole portion 32 to the heat dissipation channel 12a in the heat dissipation cavity 12, forming a gas jet, and ejected through the jet hole 15 to form heat dissipation.

[0140] In the heat exchange chamber 11, since the gas jet itself has a certain pressure, the heat exchange channel 11a in the heat exchange chamber 11 is formed into a positive pressure zone, and the peripheral area outside the heat exchange channel 11a in the heat exchange chamber 11 forms a negative pressure zone. Under the negative pressure of the negative pressure zone, the external gas is continuously replenished to the heat exchange chamber 11 through the vent 14; similarly, in the heat dissipation chamber 12, since the gas jet itself has a certain pressure, the heat dissipation channel 12a in the heat dissipation chamber 12 is formed into a positive pressure zone, and the peripheral area outside the heat dissipation channel 12a of the heat dissipation chamber 12 forms a negative pressure zone. Under the action of negative pressure, the heat-carrying gas formed in the heat exchange chamber 11 is sucked into the heat dissipation chamber 12 through the connecting channel 13.

[0141] The vent hole 14 can be arranged on the side wall 1-2, the top wall 1-1 or / and the bottom wall 1-3 constituting the shell 1. Preferably, the vent hole 14 is arranged away from the side where the connecting channel 13 is located, that is, the connecting channel 13 is arranged on the side of the heat exchange chamber 11 away from the vent hole 14, and the heat exchange channel 11a is located on the fluid flow path between the vent hole 14 and the connecting channel 13. The gas entering through the vent hole 14 exchanges heat through the heat exchange channel 11a and enters the heat dissipation chamber 12 through the connecting channel 13 after carrying heat; the technical effect that can be achieved is to minimize the gas entering through the vent hole 14 from directly entering the heat dissipation chamber 12 through the connecting channel 13 without heat exchange in the heat exchange chamber 11, thereby weakening the heat dissipation effect; It is not difficult to understand that, assuming that a vent hole 14 is provided on the side adjacent to the connecting channel 13, part of the gas entering through the vent hole 14 enters the heat exchange chamber 11, and the other part will enter the heat dissipation chamber 12 through the connecting channel 13 together with part of the heat-carrying gas discharged from the heat exchange chamber 11 under the action of the continuous negative pressure formed on the periphery of the heat dissipation chamber 12, which will cause the hot gas that has undergone heat exchange in the heat exchange chamber 11 to be unable to be discharged efficiently, and it is easy for part of the hot gas to remain in the heat exchange chamber 11, resulting in an increase in the temperature in the heat exchange chamber 11 and a decrease in the heat exchange efficiency; and it will also cause the gas that has not undergone heat exchange in the heat exchange chamber 11 to enter the heat dissipation chamber 12 and be sucked into the second chamber 6 and then discharged, so the heat dissipation efficiency of the heat dissipation chamber 12 is naturally reduced;

[0142] It should be noted that when the vent hole 14 is provided on the top wall 1-1 or the side wall 1-2, the vent hole 14 extends on the side wall 1-2 away from the connecting passage 13. Figure 5 When the vent hole 14 is disposed on the bottom wall 1-3, the vent hole 14 is disposed in an area further outward from the heat source area 1-31. The vent hole 14 on the bottom wall 1-3 can extend to the heat source area 1-31 and communicate with the heat source area 1-31. Figure 6 As shown, of course, the vent hole 14 may not extend to the heat source area 1-31.

[0143] Compared with the prior art, the actuator 2 is formed as a gas generator with flow output on both sides, and a heat exchange chamber 11 is constructed on one side of the actuator 2, and a heat dissipation chamber 12 is constructed on the other side. At the same time, the heat exchange chamber 11 and the heat dissipation chamber 12 on both sides are connected by a connecting channel 13, so as to decouple the heat exchange process and the heat dissipation process. The heat exchange chamber 11 inhales fresh gas under the action of the negative pressure formed in the peripheral area, and continues to perform efficient heat exchange, while the heat dissipation chamber 12 continues to perform efficient heat dissipation. The heat-carrying gas enters the heat dissipation chamber 12 through the connecting channel 13 under the action of the continuous negative pressure formed on the periphery of the heat dissipation chamber 12, and is finally ejected to the external environment through the jet hole 15. The process of transforming the inflow of fresh gas into the outflow of hot gas carrying heat presents a unidirectional flow characteristic, and will not form a local hot gas circulation, which can greatly improve the thermal benefit of the heat dissipation device 82.

[0144] Example 2

[0145] The difference between Example 2 and Example 1 is that the spacer 4 has a plurality of spacers 41a, the spacer 41a is connected to the actuator 2 at one end close to the actuator 2, the plurality of spacers 41a are spaced apart along a circular path, the inner circumferential wall of the spacer 41a on the first main surface 2a and the first main surface 2a form a groove 41, the inner circumferential wall of the spacer 41a on the second main surface 2b and the second main surface 2b form a groove 41; the end of the spacer 41a facing away from the actuator 2 is fully or partially combined with the diaphragm 3 on its side.

[0146] For the first chamber 5, that is, the actuator 2, the diaphragm 3 and the partition 4 form the first chamber 5, and the partition 4 forms the inner wall of the first chamber 5. The inner wall of the first chamber 5 can be closed and has no channel connected to the outside, and the partition 4 is an annular structure; the inner wall of the first chamber 5 can also be open, and the gaps between the multiple spacers 41a arranged at intervals form channels connected to the heat exchange chamber 11, and the channels are connected to the first chamber 5.

[0147] Although, when the volume of the first chamber 5 increases, the gas in the heat exchange chamber 11 can enter the first chamber 5 through the above-mentioned hole and flow toward the center of the first chamber 5, when the volume of the first chamber 5 decreases, the gas entering the first chamber 5 from the above-mentioned hole reverses its flow direction before reaching the area in the first chamber 5 opposite to and adjacent to the first hole portion 31, and flows out of the first chamber 5 along the original path, which does not substantially affect or has little effect on the suction and discharge of the gas from the first hole portion 31, so the inner peripheral wall of the first chamber 5 can be open;

[0148] Of course, the inner wall of the second chamber 6 can be closed, without a channel connected to the outside, and the partition part 4 is a ring structure; the inner wall of the second chamber 6 can also be open, and the gaps between the multiple spacers 41a arranged at intervals form a channel connected to the heat dissipation cavity 12, and the channel is connected to the second chamber 6. It is not difficult to understand that the suction and discharge process for the second chamber 6 is the same as that of the first chamber 5, and will not be repeated here.

[0149] Example 3

[0150] like Fig.29As shown, the difference between Example 3 and Example 1 or 2 is that: the piezoelectric sheet 22 is an annular structure with a hole 221 running through the center. For the first chamber 5, the hole 221 is arranged opposite to the first chamber 5. The effect brought about by this is that the vibration displacement of the area where the actuator 2 is opposite to the hole 221 of the piezoelectric sheet 22 is much larger than the displacement at the periphery. At this time, if the effective vibration area of ​​the diaphragm 3 is also arranged to correspond to the hole 221 of the piezoelectric sheet 22, the diaphragm 3 can also produce a larger displacement after being excited. In this way, the first chamber 5 can obtain a larger volume change, which can further increase the output flow rate to meet the application requirements. Of course, it is not difficult to understand that the same is true for the second chamber 6, and the hole 221 is arranged opposite to the second chamber 6.

[0151] Example 4

[0152] An integrated electronic device comprising the integrated heat dissipation device of any one of embodiments 1 to 3;

[0153] The heat sink 82 can be arranged in the internal space of the electronic device, and the heat source area 1-31 of the heat sink 82 faces the heat generating electronic components located inside the electronic device, such as the CPU. The housing 81 of the electronic device is correspondingly provided with an air inlet 811 for fresh air to flow into the electronic device and an air outlet 812 for hot air carrying heat to flow out of the electronic device. An air inlet channel connecting the air inlet 811 and the air vent 14 and an air outlet channel connecting the jet hole 15 and the air outlet 812 are formed inside the electronic device. Fig.26 As shown;

[0154] Alternatively, a housing 81 of the electronic device is formed with a receiving groove 813 for receiving the heat sink 82, and the heat sink 82 is adapted to be installed in the receiving groove 813 by elastic snap connection, magnetic attraction, etc. This method provides convenience for the installation and removal and replacement of the heat sink 82. Of course, the vent 14 and the jet hole 15 of the heat sink 82 are respectively connected to the external environment, such as Fig. 27 shown.

[0155] The above-mentioned ideal embodiments of the present invention are for inspiration. Through the above-mentioned description, relevant staff can make various changes and modifications without departing from the technical idea of ​​the present invention. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. An integrated heat dissipation device, characterized in that: It comprises a housing (1) and a piezoelectrically driven actuator (2); The actuator (2) has a first main surface (2a) and a second main surface (2b) arranged opposite to each other in the thickness direction; The first main surface (2a) and the second main surface (2b) are respectively provided with a diaphragm (3) separated by a spacer (4), so that a first chamber (5) is formed between the first main surface (2a) and the spacer (4) on its side and the diaphragm (3), and a second chamber (6) is formed between the second main surface (2b) and the spacer (4) on its side and the diaphragm (3); a first hole (31) communicating with the first chamber (5) is penetrated in a region of the diaphragm (3) opposite to the first chamber (5), and a second hole (32) communicating with the second chamber (6) is penetrated in a region of the diaphragm (3) opposite to the second chamber (6); The shell (1) has a containing cavity, the actuator (2) is arranged in the containing cavity, and the containing cavity is divided into a heat exchange cavity (11) located on the side where the first cavity (5) is located, and a heat dissipation cavity (12) located on the side where the second cavity (6) is located, the heat exchange cavity (11) is connected with the heat dissipation cavity (12) through a connecting channel (13), and an air vent (14) connected with the heat exchange cavity (11) and a jet hole (15) connected with the heat dissipation cavity (12) are provided on the outer wall of the shell (1), the inner wall of the heat exchange cavity (11) has a heat source area (1-31), a gap is left between the diaphragm (3) of the first cavity (5) and the heat source area (1-31) to form a heat exchange channel (11a), and a gap is left between the inner wall of the heat dissipation cavity (12) at one end opposite to the second hole (32) and the diaphragm (3) of the second cavity (6) to form a heat dissipation channel (12a); When the actuator (2) causes the diaphragm (3) to vibrate, the volume of the first chamber (5) changes periodically, and gas is sucked in or discharged from the heat exchange chamber (11) through the first hole (31); the volume of the second chamber (6) changes periodically, and gas is sucked in or discharged from the heat dissipation chamber (12) through the second hole (32); external gas enters the heat exchange chamber (11) through the vent hole (14); gas in the heat exchange chamber (11) enters the heat dissipation chamber (12) through the connecting channel (13); and gas in the heat dissipation chamber (12) is discharged through the jet hole (15); One end of the first hole portion (31) facing away from the first chamber (5) faces the heat source area (1-31) so as to impact the heat source area (1-31) when gas is discharged from the first chamber (5).

2. The integrated heat dissipation device according to claim 1, characterized in that: The actuator (2) causes the diaphragm (3) to generate a vibration in a high-order resonance mode having at least two antinodes; At least one first hole portion (31) is formed at at least one antinode position (3-1) of vibration of the diaphragm (3) on the side where the first chamber (5) is located or in a region adjacent to the antinode position (3-1); At least one second hole portion (32) is formed at at least one antinode position (3-1) of vibration of the diaphragm (3) on the side where the second chamber (6) is located or in a region adjacent to the antinode position (3-1).

3. The integrated heat dissipation device according to claim 2, characterized in that: At least one first hole portion (31) is formed at each antinode position (3-1) of the vibration of the diaphragm (3) on the side where the first chamber (5) is located or at a region adjacent to the antinode position (3-1); At least one second hole portion (32) is formed at each antinode position (3-1) of vibration of the diaphragm (3) on the side where the second chamber (6) is located or in the vicinity of the antinode position (3-1).

4. The integrated heat dissipation device according to claim 2, characterized in that: The high-order resonance mode ranges from the second-order resonance mode to the ninth-order resonance mode; The resonance modes of the diaphragm (3) enclosing the first chamber (5) and the diaphragm (3) enclosing the second chamber (6) when vibrating are the same or different.

5. The integrated heat dissipation device according to claim 1, characterized in that: The housing (1) comprises a side wall (1-2), a top wall (1-1) and a bottom wall (1-3); the side wall (1-2) is arranged around the outer side of the outer periphery of the actuator (2) with a gap therebetween; one end of the side wall (1-2) is connected to the top wall (1-1), and the other end is connected to the bottom wall (1-3); a heat exchange cavity (11) is enclosed between the bottom wall (1-3), the side wall (1-2) and the actuator (2); a heat dissipation cavity (12) is enclosed between the top wall (1-1), the side wall (1-2) and the actuator (2); and the connecting channel (13) is located between the outer peripheral surface of the side wall (1-2) and the outer peripheral surface of the actuator (2); The heat source area (1-31) is a groove structure opened on the bottom wall (1-3) or a hole structure penetrating the bottom wall (1-3); The shell (1) is located on the side of the heat source area (1-31) for connecting to the heat source (8), and when the shell (1) is connected to the heat source (8), one end of the heat source area (1-31) facing away from the heat exchange cavity (11) is fully or partially covered by the heat source (8).

6. The integrated heat dissipation device according to claim 5, characterized in that: It also comprises an elastic support portion (7), wherein the elastic support portion (7) elastically supports the actuator (2) in the accommodating cavity.

7. The integrated heat dissipation device according to claim 6, characterized in that: The elastic support portion (7) is arranged in a gap between the side wall (1-2) and the actuator (2); One end of the elastic support portion (7) is fixedly connected to the side wall (1-2), and the other end is fixedly connected to the actuator (2), and the elastic support portion (7) separates the heat dissipation cavity (12) and the heat exchange cavity (11); The elastic support portion (7) and / or the side wall (1-2) are provided with the connecting channel (13).

8. The integrated heat dissipation device according to claim 6, characterized in that: The heat dissipation cavity (12) and / or the heat exchange cavity (11) is provided with the elastic support portion (7), and the gap between the side wall (1-2) and the actuator (2) forms the connecting channel (13); One end of the elastic support portion (7) in the heat dissipation cavity (12) is fixedly connected to the top wall (1-1), and the other end is fixedly connected to the second main surface (2b); One end of the elastic support part (7) in the heat exchange cavity (11) is fixedly connected to the bottom wall (1-3), and the other end is fixedly connected to the first main surface (2a).

9. The integrated heat dissipation device according to claim 8, characterized in that: The distance between the outer peripheral surface of the actuator (2) on the side close to the vent hole (14) and the side wall (1-2) is smaller than the distance between the outer peripheral surface of the actuator (2) on the side away from the vent hole (14) and the side wall (1-2).

10. The integrated heat dissipation device according to claim 1, characterized in that: The connecting channel (13) is arranged on a side of the heat exchange cavity (11) away from the vent hole (14), and the heat exchange channel (11a) is located between the connecting channel (13) and the vent hole (14).

11. The integrated heat dissipation device according to claim 1, characterized in that: The actuator (2) comprises a substrate (21), at least one piezoelectric sheet (22) being bonded to one or both surfaces of the substrate (21) in a thickness direction, and the piezoelectric sheet (22) and the substrate (21) constitute the actuator (2); The end portion of the spacer (4) close to the actuator (2) is engaged with the actuator (2), and the spacer (4) and the actuator (2) form a groove (41) having an opening at one end facing away from the actuator (2). The diaphragm (3) is fixedly connected to the end of the spacer (4) facing away from the actuator (2) on the side where the diaphragm (3) is located, and covers the opening of the groove (41).

12. The integrated heat dissipation device according to claim 11, characterized in that: The piezoelectric sheet (22) is in the form of an annular structure with a cavity (221) passing through the center, and the cavity (221) is arranged opposite to the first chamber (5) and the second chamber (6).

13. The integrated heat dissipation device according to claim 11, characterized in that: The spacer (4) is an annular structure, the first main surface (2a) and the second main surface (2b) respectively enclose an annular groove (41) with the inner peripheral wall of the spacer (4) thereon, and the diaphragm (3) and the end of the spacer (4) on the side thereof facing away from the actuator (2) are fully or partially engaged on an annular path around the groove (41); Alternatively, the spacer portion (4) comprises a plurality of spacers (41a), wherein the plurality of spacers (41a) are spaced apart and distributed along an annular path, wherein the inner peripheral wall of the spacer (41a) on the first main surface (2a) and the first main surface (2a) enclose the groove portion (41), and the inner peripheral wall of the spacer (41a) on the second main surface (2b) and the second main surface (2b) enclose the groove portion (41); and the end of the spacer (41a) facing away from the actuator (2) is fully or partially combined with the diaphragm (3) on the side where it is located.

14. The integrated heat dissipation device according to claim 11, characterized in that: The diaphragm (3) is made of a polymer material, or a composite material consisting of a polymer material and a metal material.

15. An electronic device, characterized in that: An integrated heat dissipation device comprising any one of claims 1-14.

Citation Information

Patent Citations

  • Piezoelectric pump

    CN101490419B

  • Piezoelectric micro-blower

    CN101542122B

  • fluid pump

    CN102597520B

  • Air-cooling heat-dissipation device

    CN108112215A

  • Heat dissipation assembly of mobile device

    CN112788910A