Absorption layer suitable for oblique incidence laser shock peening
By designing an absorbing layer with a micro-sloping structure in laser impact enhancement, the problem of energy density reduction caused by inclined incident laser is solved, and the efficient laser enhancement effect in complex structures is achieved.
Patent Information
- Application Number
- CN202411239300.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-05
- Publication Date
- 2024-12-10
AI Technical Summary
The prior art lacks the absorption layer structure design suitable for tilted incident laser during laser impact enhancement, resulting in a decrease in energy density and poor reinforcement effect when complex structure strengthening.
An absorption layer suitable for inclined incident laser impact reinforcement is designed, and a micro-slope structure is adopted with a plurality of periodically arranged micro-slope structures. The inclined incident light absorbing layer is arranged on the substrate of the absorption layer, and the substrate is applied to the surface of the workpiece to be strengthened by adhesive. The period of the micro-sloping structure is 30 to 200 microns, the incident light absorption surface is tilted by 10 to 30 degrees relative to the surface of the workpiece, the thickness of the absorbing layer base is 50 to 200 microns, and an indication mark is provided to indicate the direction of the incident light absorption surface, and the Preparation of metal mold method.
It effectively reduces the incident angle of the laser on the absorption surface, reduces the refractive phenomenon, improves the absorption rate and enhancement efficiency of obliquely injected laser light, and is suitable for laser impact enhancement in complex structures.
Smart Images
Figure CN119101793A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of advanced laser application technology, and in particular to an absorption layer suitable for oblique-incident laser shock strengthening. Background Art
[0002] Laser shock peening is a processing method that uses laser to bombard the surface of the absorption layer to generate induced shock waves, thereby generating compressive stress on the surface of the part to be processed. At present, with the development of laser shock peening technology, it is increasingly used in complex surface structures such as hole structures and corners. However, these structures often cannot be incident vertically with lasers, and are strengthened by oblique incidence, which leads to a decrease in energy density during strengthening.
[0003] The absorption layer is an auxiliary material used in laser shock strengthening. It is attached to the surface of the workpiece to be strengthened. Its function is to absorb the laser energy and convert it into an induced shock wave to be transmitted to the inside of the metal to be strengthened to generate compressive stress. When using an absorption layer with a specific surface structure, it can improve the absorption rate of laser incident at a specific angle when strengthening a complex surface, thereby achieving an improvement in the strengthening effect, which is of great significance for the strengthening of complex structural metal parts.
[0004] There is no absorption layer structure for oblique incidence in laser shock peening in the open literature. Patent CN116694914A reports a method for strengthening the inner surface of a hole structure by moving a laser system in conjunction with a water flow transmission system. This method achieves the strengthening of the inner surface of the hole structure to a certain extent. However, current patents and methods often focus on the design of the strengthening optical path, so that it can penetrate into complex structures for strengthening. It still cannot solve the problem that most complex structures must be strengthened by oblique laser incidence, and strengthening with oblique laser incidence will cause the energy density to decrease and affect the strengthening effect. There is currently no absorption layer structure design suitable for oblique laser incidence in laser shock peening. Summary of the invention
[0005] (1) Technical issues to be solved
[0006] The present application provides an absorption layer suitable for oblique incident laser shock peening, and the technical problem to be solved is: currently there is no absorption layer structure design suitable for oblique incident laser in laser shock peening.
[0007] (2) Technical solution
[0008] In the first aspect, the present application provides an absorption layer suitable for oblique-incident laser shock strengthening, wherein the absorption layer suitable for oblique-incident laser shock strengthening has a certain microstructure, including an oblique-incident light absorption layer and an absorption layer substrate, wherein the oblique-incident light absorption layer is arranged on the absorption layer substrate, and the absorption layer substrate is attached to the surface of the workpiece to be strengthened; the oblique-incident light absorption layer includes a plurality of periodically arranged micro-bevel structures, and an inclined incident light absorption surface is formed on the micro-bevel structure facing the direction of the oblique-incident laser, and the incident light absorption surface is inclined at a certain angle relative to the surface of the workpiece to be strengthened.
[0009] Furthermore, the arrangement period of the micro-slope structure is 30 to 200 microns.
[0010] Furthermore, the incident light absorption surface is inclined at 10 to 30 degrees relative to the workpiece surface.
[0011] Furthermore, the thickness of the absorption layer substrate is 50 to 200 microns.
[0012] Furthermore, the absorption layer base is adhered to the surface of the workpiece to be strengthened by an adhesive.
[0013] Furthermore, the absorption layer substrate is provided with an indication mark to indicate the direction of the incident light absorption surface.
[0014] Furthermore, the absorption layer suitable for oblique-incident laser shock strengthening is prepared by a metal mold method using aluminum and black glue.
[0015] In a second aspect, the present application provides an oblique-incidence laser shock peening method, which is implemented based on the absorption layer suitable for oblique-incidence laser shock peening; the oblique-incidence laser shock peening method comprises:
[0016] The absorption layer suitable for oblique-incident laser shock strengthening is pasted on the surface of the complex workpiece where the laser cannot be incident vertically;
[0017] The absorption layer suitable for oblique-incident laser shock strengthening is applied to laser shock strengthening, and the oblique-incident laser is used to strengthen the surface of the workpiece.
[0018] (3) Beneficial effects
[0019] The above technical solution of the present application has the following advantages:
[0020] The absorption layer suitable for oblique-incident laser shock strengthening provided in the first aspect of the present application can effectively reduce the incident angle of laser irradiation on the absorption surface, reduce the refraction of laser on the surface of the absorption layer, and when oblique-incident laser strengthening is unavoidable, the strengthening efficiency of laser shock strengthening using oblique-incident laser can be improved.
[0021] It can be understood that the beneficial effects of the second aspect mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0023] Figure 1 A schematic diagram of an absorption layer suitable for oblique-incident laser shock strengthening provided in the present application;
[0024] Figure 2 Schematic diagram of the application of the oblique-incident laser shock strengthening method provided in this application.
[0025] Figure numerals: 1. workpiece to be strengthened; 2. absorption layer suitable for oblique incident laser shock strengthening; 2.1. oblique incident light absorption layer; 2.2. absorption layer substrate; 3. oblique incident laser. DETAILED DESCRIPTION
[0026] The specific implementation methods of the present application are further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present application but are not intended to limit the scope of the present application.
[0027] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.
[0028] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0029] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. appearing in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways.
[0030] The specific implementation methods of the present application are further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present application but are not intended to limit the scope of the present application.
[0031] like Figure 1 As shown, an embodiment of the present application provides an absorption layer 2 suitable for oblique-incident laser shock strengthening, and the absorption layer 2 suitable for oblique-incident laser shock strengthening has a certain microstructure, including an oblique-incident light absorption layer 2.1 and an absorption layer substrate 2.2, the oblique-incident light absorption layer 2.1 is arranged on the absorption layer substrate 2.2, and the absorption layer substrate 2.2 is attached to the surface of the workpiece 1 to be strengthened; the oblique-incident light absorption layer 2.1 includes a plurality of periodically arranged micro-bevel structures, and an inclined incident light absorption surface is formed on the micro-bevel structure facing the direction of the oblique-incident laser, and the incident light absorption surface is inclined at a certain angle relative to the surface of the workpiece 1 to be strengthened.
[0032] In some embodiments, the arrangement period of the micro-slope structures is 30 to 200 micrometers.
[0033] In some embodiments, the incident light absorption surface is inclined at 10 to 30 degrees relative to the workpiece surface.
[0034] In some embodiments, the absorption layer substrate 2.2 has a thickness of 50 to 200 micrometers.
[0035] In some embodiments, the absorption layer substrate 2.2 is adhered to the surface of the workpiece 1 to be strengthened by an adhesive.
[0036] In some embodiments, the absorption layer substrate 2.2 is provided with an indicator mark to indicate the direction of the incident light absorption surface.
[0037] In some embodiments, the absorption layer 2 suitable for oblique-incident laser shock peening is prepared by a metal mold method using aluminum and black glue.
[0038] In application, the inclined incident light absorption layer has a wavy structure, and micro-nano technology or other methods can be used to manufacture a periodic micro-slope structure on the surface of the absorption layer. The period of the micro-slope structure facing the incident light direction is about 30-200 microns depending on the process level. An inclined incident light absorption surface is formed on the wavy structure facing the direction of the incident light, and it is inclined about 10 to 30 degrees relative to the workpiece surface.
[0039] The angle α between the laser and the surface of the workpiece to be strengthened corresponds to the inclination angle θ of the incident light absorption surface, and the sum of the two is 85°-95°. When the laser is incident at an angle, the incident angle on the inclined incident light absorption surface will be reduced by 10-30 degrees compared to the workpiece surface, which can increase the absorption rate of the laser compared to the flat absorption layer without micro-nano structure.
[0040] The thickness of the base material of the absorption layer is about 50-200 microns to form the bottom of the wavy structure. There is an adhesive at the bottom of the base material to firmly adhere the absorption layer to the surface of the workpiece to be strengthened.
[0041] The absorption layer suitable for oblique incident laser shock strengthening provided in the embodiment of the present application can effectively reduce the incident angle of the laser irradiation on the absorption surface, reduce the phenomenon of laser refraction on the surface of the absorption layer, and improve the strengthening efficiency when using oblique incident laser for laser shock strengthening. The absorption layer can be conveniently pasted on the surface of a complex workpiece structure, and when oblique incident laser must be used for strengthening, the absorption layer can improve the laser absorption rate and strengthening efficiency.
[0042] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In actual applications, the above-mentioned functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application.
[0043] An embodiment of the present application also provides an oblique-incidence laser shock peening method, which is implemented based on the absorption layer suitable for oblique-incidence laser shock peening; the oblique-incidence laser shock peening method comprises: pasting the absorption layer suitable for oblique-incidence laser shock peening on the surface of a complex workpiece where the laser cannot be incident vertically; applying the absorption layer suitable for oblique-incidence laser shock peening to laser shock peening, and using oblique-incidence laser to strengthen the surface of the workpiece.
[0044] In applications, such as Figure 2As shown, on a U-shaped workpiece, the surface to be strengthened is blocked by other parts of the workpiece structure and cannot be strengthened by 90-degree vertical laser irradiation. The absorption layer suitable for oblique-incident laser shock strengthening is used to improve the laser absorption rate and strengthening effect.
[0045] Specifically, the absorption layer suitable for oblique incident laser shock strengthening can be prepared by using a metal mold method or other techniques, using aluminum, black glue or other materials used to prepare the absorption layer. The absorption layer has a substrate with a thickness of 50-200 microns, and a micro-bevel structure with a period of about 30-200 microns on the surface. An inclined incident light absorption surface is formed facing the direction of the incident light, and it is inclined at an angle of about 10 to 30 degrees relative to the workpiece surface. There is an adhesive at the bottom of the substrate to stick to the workpiece surface, and there is an indicator mark to indicate the direction of the inclined incident light absorption surface.
[0046] When applied to the surface strengthening of a complex structure, the prepared absorption layer suitable for oblique incident laser shock strengthening is pasted on the surface of the complex structure where the laser cannot be incident vertically, and the oblique incident light absorption surface is directed toward the incident light direction according to the indication mark, and is firmly pasted on the surface of the workpiece.
[0047] The pasted absorption layer is applied to laser shock strengthening, and the surface of the workpiece is strengthened by inclined laser. The micro-nano structure on the surface of the absorption layer will reduce the incident angle of the laser on the absorption surface and improve the laser absorption rate.
[0048] Finally, the absorption layer suitable for oblique-incidence laser shock peening is removed by using tools or other methods, and the surface of the workpiece is cleaned to remove residues, thus completing the laser shock peening process of applying the absorption layer suitable for oblique-incidence laser shock peening to complex structures.
[0049] It should be clear that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. For the embodiments of the method, the relevant parts can refer to the partial description of the device embodiment (adopted according to the writing situation). The present application is not limited to the specific steps and structures described above and shown in the figures. In addition, for the sake of simplicity, a detailed description of known method technologies is omitted here.
[0050] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.
Claims
1. An absorption layer suitable for oblique-incidence laser shock strengthening, characterized in that: The absorption layer suitable for oblique incident laser shock strengthening has a certain microstructure, including an oblique incident light absorption layer and an absorption layer substrate, the oblique incident light absorption layer is arranged on the absorption layer substrate, and the absorption layer substrate is attached to the surface of the workpiece to be strengthened; the oblique incident light absorption layer includes a plurality of periodically arranged micro-bevel structures, and an inclined incident light absorption surface is formed on the micro-bevel structure facing the direction of the oblique incident laser, and the incident light absorption surface is inclined at a certain angle relative to the surface of the workpiece to be strengthened.
2. The absorbing layer suitable for oblique-incidence laser shock strengthening according to claim 1, characterized in that: The arrangement period of the micro-slope structure is 30 to 200 microns.
3. The absorbing layer suitable for oblique-incidence laser shock strengthening according to claim 1, characterized in that: The incident light absorption surface is inclined at 10 to 30 degrees relative to the workpiece surface.
4. The absorbing layer suitable for oblique-incidence laser shock strengthening according to claim 1, characterized in that: The thickness of the absorption layer substrate is 50 to 200 microns.
5. The absorbing layer suitable for oblique-incidence laser shock strengthening according to claim 1, characterized in that: The absorption layer base is adhered to the surface of the workpiece to be strengthened by adhesive.
6. The absorbing layer suitable for oblique-incidence laser shock strengthening according to claim 1, characterized in that: The absorption layer substrate is provided with an indication mark to indicate the direction of the incident light absorption surface.
7. The absorbing layer suitable for oblique-incidence laser shock strengthening according to claim 1, characterized in that: The absorption layer suitable for oblique-incident laser shock strengthening is prepared by a metal mold method using aluminum and black glue.
8. An oblique-incidence laser shock peening method, characterized in that: The absorption layer suitable for oblique-incidence laser shock peening according to any one of claims 1 to 7 is realized; the oblique-incidence laser shock peening method comprises: The absorption layer suitable for oblique-incident laser shock strengthening is pasted on the surface of the complex workpiece where the laser cannot be incident vertically; The absorption layer suitable for oblique-incident laser shock strengthening is applied to laser shock strengthening, and the oblique-incident laser is used to strengthen the surface of the workpiece.