Direct injection type electroplating pressing plate mold device

Abstract

The direct injection type electroplating pressing plate mold device comprises an electroplating module and a mask forming module, the electroplating module comprises a panel, a mask unit is attached to the top of the panel, an anode plate is arranged at the bottom of the panel, and a plurality of anode tubes are inserted into the inner side of the anode plate; the forming module comprises an aluminum film unit and is used for being matched with a panel to form a mask unit; and the glue pouring plate is used for being matched with the aluminum film unit and the panel to tear off redundant melt glue after the mask unit is formed. Through the design of the electroplating module, a bottom plate needed during traditional electroplating is omitted, the cost is saved, meanwhile, a gap existing between a panel and the bottom plate during traditional electroplating is avoided, and therefore the overflow condition is avoided, and through the design of the electroplating module, silver plating water is directly sprayed to the surface of an electroplated product through the anode pipe for electroplating, and the electroplating efficiency is improved. And the silver plating water is uniformly and timely supplied during electroplating, so that the electroplating is more uniform and clear, and the electroplating effect is greatly improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor electroplating, and in particular to a direct-injection electroplating platen mold device. Background Art

[0002] Electroplating refers to the process of plating a thin layer of other metals or alloys on the surface of a workpiece using the principle of electrolysis, thereby preventing metal oxidation (such as rust), improving wear resistance, conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and enhancing aesthetics. Due to its advantages such as high plating efficiency, suitability for large-area metal wiring and thicker thickness processes, it is widely used in the manufacture of some metal layers in semiconductors. For example, in the semiconductor back-end packaging manufacturing process, the electroplating process is often used to make metal layers and metal bumps on the surface of the substrate. Before electroplating, semiconductors are generally arranged in an orderly manner and then integrated on a whole semiconductor strip. The purpose of electroplating is to plate a circle around the periphery of each semiconductor.

[0003] The electroplating methods for semiconductor strips are generally sheet plating and roll plating. The principle of the electroplating mold in sheet plating is to use a mask to cover the non-plated area on the product, exposing only the plating area, and then plate a thin layer of other metals or alloys on its surface through the principle of electrolysis.

[0004] like Figure 1 As shown, the traditional electroplating mold usually includes an aluminum film, a base plate, an anode plate, a mask and a panel, and is used in two situations:

[0005] First, during electroplating, the panel and the bottom plate are installed in mutual interlocking, the anode plate is installed between the panel and the bottom plate, the mask is mounted on the top of the panel, the semiconductor tape is pressed on the mask during electroplating, the anode plate is powered, the bottom plate is installed on the electroplating machine, the electroplating machine sprays silver plating water, the silver plating water enters the water tank of the bottom plate, first passes through the water tank and then passes through the large hole 71, which makes the water flow turbulent, passes through the anode plate and flows into the large hole 71 to contact the semiconductor, and after electroplating, flows out from the small hole 72 and enters between the panel and the bottom plate, and then flows out from the bottom plate to form a cycle; this electroplating method has the following disadvantages:

[0006] 1. Due to the problem of processing accuracy, there will be a gap between the panel and the bottom plate, which may cause water overflow, resulting in a decrease in the internal water pressure, causing the silver plating water to be supplied untimely during electroplating, thus affecting the electroplating effect;

[0007] 2. Due to the small size of semiconductors, the plating area is also small. Water inlet and outlet holes must be reserved in the plating area. Therefore, there are usually only two thin ribs left to connect the support parts of the non-plating area and the panel. If the number of ribs is increased, it will affect the water supply. After a period of use, the connecting ribs may break, making it impossible to support the non-plating area. At this time, the entire panel needs to be replaced, resulting in a short service life and increased production costs.

[0008] Second, when pouring glue to form a mask, the traditional glue pouring steps are: pour a degumming agent on the aluminum film, fill the aluminum film surface with molten glue, evacuate, and press the panel front side down. Excess molten glue can be squeezed out from the panel cavity. At this time, pour molten glue on the back of the panel to adhere to the excess molten glue squeezed out of the panel. After the silicone is cooled, it can be torn off at one time to obtain a mask. Since the removal of excess molten glue requires filling the back of the panel with molten glue, this method of glue pouring and pulling is more wasteful of silicone.

[0009] Based on this, a direct-injection electroplating platen mold device is proposed, which provides a new solution to the above technical problems. Summary of the invention

[0010] Based on this, it is necessary to provide a direct-injection electroplating platen mold device to address the problems raised in the above background technology.

[0011] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0012] A direct-injection electroplating platen mold device specifically includes an electroplating module and a mask forming module, wherein the electroplating module includes a panel, a mask unit is attached to the top of the panel, an anode plate is provided at the bottom of the panel, and a plurality of anode tubes are plugged into the inner side of the anode plate;

[0013] The molding module includes an aluminum film unit for cooperating with the panel to mold the mask unit; and also includes a glue filling plate for cooperating with the aluminum film unit and the panel to tear off excess molten glue after molding the mask unit.

[0014] Preferably, a reflux cavity is opened at the bottom of the panel, a plurality of flow grooves are opened at the bottom of the reflux cavity, and a cross-support area is formed at the end corners of four adjacent flow grooves that are close to each other. An isolation support platform is fixed at the top of the panel and above the cross-support area, and an annular electroplating cavity is opened at the top of the panel and at the outer periphery of the isolation support platform. The annular electroplating cavity is interconnected with the four adjacent flow grooves at the bottom, and a cross-isolation support circuit is formed between the plurality of annular electroplating cavities.

[0015] Preferably, positioning protrusions are fixed on the top of the panel and on both sides of the cross-isolation support line, and a plurality of avoidance grooves are opened on the top of the panel and on both sides of the cross-isolation support line.

[0016] Preferably, the mask unit comprises a mask body, and a protective coating is provided on the top of the mask body to improve the strength of the mask unit and the stability of the plating area.

[0017] Preferably, the anode tube comprises a hanging platform, an interference fit section and a tube section, the interference fit section is inserted into the inner side of the anode plate and interference fits therewith, and its diameter is larger than the diameter of the tube section, the hanging platform has a diameter larger than the interference fit section diameter, and is used for axial positioning of the anode tube when the anode tube and the anode plate are installed, and a flow channel is provided on the inner side of the anode tube.

[0018] Preferably, the top of the flow passage and located at the top of the inner side of the pipe section is set as a divergent conical hole with a divergent angle of 3° to 20°.

[0019] Preferably, the anode tube is installed on the inner side of the anode plate by means of liquid nitrogen shrinkage.

[0020] Preferably, the aluminum film unit includes an aluminum film body, a molding cavity is opened at the top of the aluminum film body, a plurality of molding grooves matching the isolation support platform are opened at the top of the aluminum film body and located inside the molding cavity, and a molding frame matching the corresponding annular electroplating cavity is provided on the outer periphery of the molding groove. When the aluminum film unit is used in combination with the panel, the molding frame is sleeved on the outer side of the corresponding isolation support platform and plugged into the inner side of the cross isolation support line. At this time, the isolation support platform is plugged into the inner side of the molding groove, and positioning holes matching the positioning protrusions are opened at the top of the aluminum film body and located on both sides of the molding cavity.

[0021] Preferably, a plurality of glue injection holes are provided on the inner side of the glue injection plate.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1. The present invention eliminates the need for a base plate required for traditional electroplating through the design of an electroplating module, the arrangement of a flow trough, an isolation support platform, an annular electroplating chamber, a cross isolation support line, a cross support area, etc., thereby saving costs and avoiding the gap between the panel and the base plate during traditional electroplating, thereby avoiding water overflow. In addition, the design of the electroplating module allows the silver-plating water to be directly sprayed through the anode tube onto the surface of the electroplated product for electroplating. The silver-plating water is supplied evenly and timely during electroplating, thereby making the electroplating more uniform and clear, greatly improving the electroplating effect.

[0024] 2. The present invention adopts the structural design of the flow groove, the isolation support platform, the annular electroplating cavity, the cross isolation support line, and the cross support area, so that each isolation support platform is supported by the cross support area, and the four ribs extending from the cross support area evenly support the isolation support platform, thereby greatly improving the support effect of the isolation support platform and improving its support strength, thereby greatly improving the overall life of the panel and reducing production costs.

[0025] 3. By using the glue filling board for glue filling, there is no need to fill the back of the panel with molten glue. After squeezing the molten glue on the aluminum film unit through the panel, the excess molten glue can be directly torn off. This glue filling and glue pulling method greatly saves the amount of silicone and reduces production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the scheme of the present invention, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0027] Figure 1 It is a structural schematic diagram of a conventional electroplating mold of the present invention;

[0028] Figure 2 The structure of the electroplating module of the present invention is shown in FIG. Figure 1 ;

[0029] Figure 3 The structure of the electroplating module of the present invention is shown in FIG. Figure 2 ;

[0030] Figure 4 It is a schematic diagram of the exploded structure of the electroplating module of the present invention;

[0031] Figure 5 This is a schematic diagram of the structure of the positioning protrusion and the avoidance groove of the present invention;

[0032] Figure 6 It is a schematic diagram of the structure of the reflux chamber and the flow channel of the present invention;

[0033] Figure 7 It is a structural schematic diagram of the isolation support platform of the present invention;

[0034] Figure 8 It is a partial structural schematic diagram of the flow channel, the isolation support platform, the annular electroplating cavity and the cross isolation support circuit of the present invention;

[0035] Fig. 9 is a schematic diagram of the cross-section structure of the panel of the present invention;

[0036] Fig.10is a schematic diagram of the structure of the panel of the present invention;

[0037] Fig.11 It is a schematic diagram of the structure of the flow channel, the isolation support platform, the annular electroplating chamber, the cross isolation support circuit and the cross support area of ​​the present invention;

[0038] Fig.12 The structure diagram of the panel, anode plate and anode tube after assembly of the present invention is shown in FIG. Figure 1 ;

[0039] Fig.13 The structure diagram of the panel, anode plate and anode tube after assembly of the present invention is shown in FIG. Figure 2 ;

[0040] Fig.14 It is a schematic diagram of the structure of the flow channel, the isolation support platform, the annular electroplating chamber, the cross isolation support circuit and the anode tube of the present invention;

[0041] Fig.15 It is a structural schematic diagram of the anode tube of the present invention;

[0042] Fig.16 Schematic diagram of the cross-section structure of the anode tube of the present invention;

[0043] Fig.17 It is a schematic diagram of the structure of the anode plate and the anode tube after being assembled in the present invention;

[0044] Fig.18 It is a schematic diagram of the structure of the mask body and the protective coating of the present invention;

[0045] Fig.19 It is a structural schematic diagram of the mask forming module of the present invention;

[0046] Fig. 20 It is a schematic diagram of the exploded structure of the mask forming module of the present invention;

[0047] Fig.21 It is a structural schematic diagram of the aluminum film unit of the present invention;

[0048] Fig. 22 It is a structural schematic diagram of the molding cavity, molding groove and molding frame of the present invention;

[0049] Fig.23 It is a structural schematic diagram of the glue filling plate and the glue filling holes of the present invention.

[0050] The markings in the figure are as follows:

[0051] 10. Panel; 20. Mask unit; 30. Anode plate; 40. Anode tube; 50. Aluminum film unit; 60. Glue filling board; 90. Electroplating product; 11. Positioning protrusion; 12. Avoidance groove; 13. Reflow cavity; 14. Flow groove; 15. Isolation support platform; 16. Annular electroplating cavity; 17. Cross isolation support line; 18. Cross support area; 21. Mask body; 22. Protective coating; 41. Hanging platform; 42. Interference fit section; 43. Pipe section; 44. Water flow trajectory; 45. Flow channel; 51. Aluminum film body; 52. Molding cavity; 53. Molding groove; 54. Molding frame; 55. Positioning hole; 61. Glue filling hole. DETAILED DESCRIPTION

[0052] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0053] Please refer to Figure 2-23 The present invention provides a direct-injection electroplating platen mold device, which includes an electroplating module and a mask forming module. The electroplating module includes a panel 10, a mask unit 20 is attached to the top of the panel 10, an anode plate 30 is provided at the bottom of the panel 10, and a plurality of anode tubes 40 are plugged into the inner side of the anode plate 30. Specifically, during electroplating, the anode tubes 40 are plugged into the inner side of the anode plate 30 and assembled with the panel 10, and installed on the inner side of the bottom of the panel 10. The mask unit 20 is attached to the top of the panel. The electroplating product 90 is pressed on the top of the mask unit 20. The anode plate 30 is powered. The panel 10 and the anode plate 30 are both installed on an electroplating machine. The electroplating machine sprays silver-plated water, and the silver-plated water enters the anode tubes 40 and is directly sprayed. It is sprayed onto the electroplated product 90 to contact it, and after electroplating, it flows into the space between the panel 10 and the anode plate 30. It should be noted that after the panel 10 and the anode plate 30 are installed, there is a reflux gap between the two. The silver-plated water after electroplating flows out from the reflux gap to form a cycle. This electroplating scheme eliminates the base plate required for traditional electroplating, saves costs, and avoids the gap between the panel and the base plate during traditional electroplating, thereby avoiding overflow. In addition, through the design of this electroplating module, the silver-plated water is directly sprayed onto the surface of the electroplated product 90 through the anode tube 40 for electroplating. The silver-plated water is supplied evenly and timely during electroplating, so that the electroplating is more uniform and clear, greatly improving the electroplating effect.

[0054] The molding module includes an aluminum film unit 50, which is used to cooperate with the panel 10 to mold the mask unit 20; it also includes a glue pouring plate 60, which is used to cooperate with the aluminum film unit 50 and the panel 10 to tear off the excess molten glue after the mask unit 20 is molded; by using the glue pouring plate 60 for glue pouring, there is no need to fill the back of the panel with molten glue. After the molten glue on the aluminum film unit 50 is squeezed by the panel 10, the excess molten glue can be directly torn off. This glue pouring and glue pulling method greatly saves the amount of silicone and reduces production costs.

[0055] Please refer to Figure 2-14 A reflux chamber 13 is provided at the bottom of the panel 10, and a plurality of flow slots 14 are provided at the bottom of the reflux chamber 13. A cross support area 18 is formed at the end corners of four adjacent flow slots 14. An isolation support platform 15 is fixed at the top of the panel 10 and located above the cross support area 18. An annular electroplating chamber 16 is provided at the top of the panel 10 and located on the outer periphery of the isolation support platform 15. The annular electroplating chamber 16 is communicated with the four adjacent flow slots 14 at the bottom thereof, and a cross isolation support line 17 is formed between the plurality of annular electroplating chambers 16. Specifically, the number of anode tubes 40 corresponds to the number of flow slots 14. When the panel 10, the anode plate 30 and the anode tubes 40 are assembled and installed, the anode tubes 40 are inserted into the inner side of the corresponding flow slots 14 and abut against the bottom surface thereof. Each annular electroplating chamber 16 is communicated with the four adjacent flow slots 14. The intersection of each cross isolation support line 17 is located just above one flow slot 14 and at the top center of the corresponding flow slot 14. When the anode tubes 40 are assembled and installed, the anode tubes 40 are inserted into the inner side of the corresponding flow slots 14 and abut against the bottom surface thereof. Each annular electroplating chamber 16 is communicated with the four adjacent flow slots 14. The intersection of each cross isolation support line 17 is located just above one flow slot 14 and at the top center of the corresponding flow slot 14. When the anode tube 40 is inserted into the inner side of the flow slot 14, the anode tube 40 is just located below the intersection of the corresponding cross-isolation support line 17, and the opening area of ​​the anode tube 40 is larger than the area of ​​the intersection of the cross-isolation support line 17, so that when the silver-plated water is sprayed out through the anode tube 40, it will be evenly sprayed to the inner side of the four corresponding annular electroplating cavities 16, that is, the four end corners of each annular electroplating cavity 16 are respectively facing the opening of an anode tube 40, so that during electroplating, the four end corners of each annular electroplating cavity 16 simultaneously enter the silver-plated water, which is uniform and sufficient, greatly improving the electroplating effect, and effectively avoiding the occurrence of uneven electroplating and unclear electroplating effect. After entering the annular electroplating cavity 16, the silver-plated water directly contacts the electroplating area of ​​the electroplated product 90 for electroplating. The electroplated silver-plated water flows back through the annular electroplating cavity 16 to between the panel 10 and the anode plate 30, and flows back through the reflux gap between the panel 10 and the anode plate 30, thereby completing the circulation of the silver-plated water;

[0056] At the same time, in this embodiment, each isolation support platform 15 is supported by the cross support area 18, and the four ribs extending from the cross support area 18 evenly support the isolation support platform 15, which can greatly improve the supporting effect of the isolation support platform 15 and improve its supporting strength, thereby greatly improving the overall life of the panel 10 and reducing production costs.

[0057] Please refer to Figure 2-14 A positioning protrusion 11 is fixed on the top of the panel 10 and on both sides of the cross-isolation support line 17. A plurality of avoidance grooves 12 are provided on the top of the panel 10 and on both sides of the cross-isolation support line 17. Specifically, the setting of the positioning protrusion 11 facilitates the positioning of the panel 10 and the aluminum film unit 50 during installation, thereby improving the molding accuracy of the mask unit 20. The setting of the avoidance groove 12 facilitates the robot to grasp and move the panel 10, and is used as an avoidance position for the robot.

[0058] Please refer to Fig.18 The mask unit 20 includes a mask body 21, and a protective coating 22 is provided on the top of the mask body 21 to improve the strength of the mask unit 20 and the stability of the plating area. Specifically, in the present embodiment, the mask body 21 may adopt a carbon coating to improve the strength of the mask unit 20, making it less likely to deform and improving the stability of the plating area. When in use, the mask body 21 is attached to the top of the cross isolation support line 17 and the isolation support platform 15.

[0059] Please refer to Figure 12-16 The anode tube 40 includes a hanging platform 41, an interference fit section 42 and a tube section 43. The interference fit section 42 is inserted into the inner side of the anode plate 30 and is interference fit therewith. Its diameter is larger than the diameter of the tube section 43. The diameter of the hanging platform 41 is larger than the diameter of the interference fit section 42. It is used for axial positioning of the anode tube 40 when the anode tube 40 and the anode plate 30 are installed. A flow channel 45 is provided inside the anode tube 40. Through the setting of the anode tube 40, the silver-plated water can be directly sprayed through the anode tube 40 to improve the electroplating effect. When in use, the interference fit section 42 is inserted into the inner side of the anode plate 30 and is interference fit therewith. After the installation is completed, the hanging platform 41 is against the bottom surface of the anode plate 30.

[0060] Please refer to Figure 12-16 The top of the flow channel 45 and the top position of the inner side of the pipe section 43 are set as a divergent tapered hole, and the divergent angle is 3° to 20°. Through the setting of the divergent tapered hole, the silver-plated water is sprayed out in a divergent shape when passing through the top of the pipe section 43, thereby increasing the area of ​​the silver-plated water when spraying, and increasing the contact area between the silver-plated water and the electroplating area of ​​the electroplated product 90, thereby improving the electroplating effect. At the same time, due to the setting of the divergent tapered hole, compared with the straight hole, to achieve the same effect in specific use, the overall diameter of the anode tube 40 can be reduced, thereby reducing the inner diameter of the flow channel 45, thereby increasing the water pressure passing through the flow channel 45, thereby improving the electroplating effect, and at the same time, the material loss of the anode tube 40 can be reduced, thereby reducing the cost. It should be noted that the flow mode of the silver-plated water inside the flow channel 45 is to flow along the water flow trajectory 44.

[0061] It should be noted that the anode tube 40 is installed inside the anode plate 30 by means of liquid nitrogen shrinkage.

[0062] Please refer to Figure 19-23 The aluminum film unit 50 includes an aluminum film body 51, a molding cavity 52 is provided at the top of the aluminum film body 51, a plurality of molding grooves 53 matching the isolation support platform 15 are provided at the top of the aluminum film body 51 and located inside the molding cavity 52, and a molding frame 54 matching the corresponding annular electroplating cavity 16 is provided on the outer periphery of the molding groove 53. When the aluminum film unit 50 is used in combination with the panel 10, the molding frame 54 is sleeved on the outer side of the corresponding isolation support platform 15 and plugged into the inner side of the cross isolation support line 17. At this time, the isolation support platform 15 is plugged into the inner side of the molding groove 53, and positioning holes 55 matching the positioning protrusions 11 are provided at the top of the aluminum film body 51 and located on both sides of the molding cavity 52. ​​The glue filling plate 60 A plurality of glue injection holes 61 are provided on the inner side. Specifically, when the mask body 21 is molded, a degumming agent is first sprayed on the molding cavity 52, the molding groove 53, and the molding frame 54. Then, the molten glue is poured into the molding cavity 52 and the inner side of the molding groove 53. At the same time, the overall molding environment is evacuated. Subsequently, the glue injection plate 60 is installed on the inner side of the panel 10, and the panel 10 is pressed face down onto the aluminum film body 51. Excess molten glue can be squeezed out from the molding cavity 52 and the molding groove 53. At this time, the excess molten glue will enter the inner side of the glue injection hole 61. After the silicone gel is cooled, the glue injection plate 60 can be removed and the excess molten glue can be torn off at one time, thereby obtaining the mask body 21, which greatly reduces the consumption of molten glue and saves production costs.

[0063] The specific working principle of a direct-injection electroplating platen mold device provided by the present invention is:

[0064] When performing electroplating, the anode tube 40 is plugged into the inner side of the anode plate 30 and installed in combination with the panel 10, installed on the inner side of the bottom of the panel 10, the mask unit 20 is mounted on the top of the panel, the electroplated product 90 is pressed on the top of the mask unit 20, the anode plate 30 is powered, the panel 10 and the anode plate 30 are both installed on the electroplating machine, the electroplating machine sprays out silver-plated water, the silver-plated water enters the anode tube 40 and is directly sprayed onto the electroplated product 90 to contact it, and flows into between the panel 10 and the anode plate 30 after electroplating. It should be noted that after the panel 10 and the anode plate 30 are installed, there is a reflux gap between the two, and the silver-plated water that has been electroplated flows out from the reflux gap to form a cycle, thereby completing the electroplating of the electroplated product 90;

[0065] When molding the mask body 21, first spray a debonding agent on the molding cavity 52, the molding groove 53, and the molding frame 54, then fill the molding cavity 52 and the inner side of the molding groove 53 with molten glue, and at the same time evacuate the entire molding environment. Subsequently, install the glue filling plate 60 on the inner side of the panel 10 and press the panel 10 face down onto the aluminum film body 51. Excess molten glue can be squeezed out from the molding cavity 52 and the molding groove 53. At this time, the excess molten glue will enter the inner side of the glue filling hole 61. After the silicone gel is cooled, remove the glue filling plate 60 and tear off the excess molten glue at one time, thereby obtaining the mask body 21.

[0066] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0067] Obviously, the embodiments described above are only some embodiments of the present invention, rather than all embodiments. The preferred embodiments of the present invention are given in the accompanying drawings, but they do not limit the patent scope of the present invention. The present invention can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive. Although the present invention has been described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific embodiments, or to perform equivalent replacements for some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of the present invention, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the present invention.

Claims

1. A direct injection electroplating platen mold device, It is characterized in that It comprises an electroplating module and a mask forming module, wherein the electroplating module comprises a panel (10), a mask unit (20) is attached to the top of the panel (10), an anode plate (30) is provided at the bottom of the panel (10), and a plurality of anode tubes (40) are plugged into the inner side of the anode plate (30); The molding module comprises an aluminum film unit (50) for cooperating with the panel (10) to mold the mask unit (20); and also comprises a glue filling plate (60) for cooperating with the aluminum film unit (50) and the panel (10) to tear off excess molten glue after the mask unit (20) is molded.

2. A direct injection electroplating platen mold device according to claim 1, It is characterized in that A reflux chamber (13) is provided at the bottom of the panel (10), a plurality of flow grooves (14) are provided at the bottom of the reflux chamber (13), and a cross-support area (18) is formed at the end corners of four adjacent flow grooves (14) that are close to each other. An isolation support platform (15) is fixed at the top of the panel (10) and located above the cross-support area (18). An annular electroplating chamber (16) is provided at the top of the panel (10) and located on the outer periphery of the isolation support platform (15). The annular electroplating chamber (16) is interconnected with the four adjacent flow grooves (14) at the bottom thereof, and a cross-isolation support circuit (17) is formed between the plurality of annular electroplating chambers (16).

3. A direct injection electroplating platen mold device according to claim 2, It is characterized in that A positioning protrusion (11) is fixed on the top of the panel (10) and located on both sides of the cross-isolation support line (17), and a plurality of avoidance grooves (12) are provided on the top of the panel (10) and located on both sides of the cross-isolation support line (17).

4. A direct injection electroplating platen mold device according to claim 1, It is characterized in that The mask unit (20) comprises a mask body (21), and a protective coating (22) is provided on the top of the mask body (21) to improve the strength of the mask unit (20) and the stability of the plating area.

5. A direct injection electroplating platen mold device according to claim 1, It is characterized in that The anode tube (40) comprises a hanging platform (41), an interference fit section (42) and a tube section (43); the interference fit section (42) is inserted into the inner side of the anode plate (30) and is interference fit therewith, and its diameter is larger than the diameter of the tube section (43); the diameter of the hanging platform (41) is larger than the diameter of the interference fit section (42), and is used for axial positioning of the anode tube (40) when the anode tube (40) and the anode plate (30) are installed; and a flow passage (45) is provided inside the anode tube (40).

6. A direct-injection electroplating platen mold device according to claim 5, It is characterized in that The top of the flow passage (45) and located at the top of the inner side of the pipe section (43) is set as a divergent conical hole with a divergent angle of 3° to 20°.

7. A direct-injection electroplating platen mold device according to claim 5, It is characterized in that The anode tube (40) is installed inside the anode plate (30) by means of liquid nitrogen shrinkage.

8. A direct-injection electroplating platen mold device according to claim 1, It is characterized in that The aluminum film unit (50) includes an aluminum film body (51), a molding cavity (52) is provided at the top of the aluminum film body (51), a plurality of molding grooves (53) matching the isolation support platform (15) are provided at the top of the aluminum film body (51) and located inside the molding cavity (52), and a molding frame (54) matching the corresponding annular electroplating cavity (16) is provided on the outer periphery of the molding groove (53). When the aluminum film unit (50) is used in combination with the panel (10), the molding frame (54) is sleeved on the outer side of the corresponding isolation support platform (15) and plugged into the inner side of the cross isolation support line (17). At this time, the isolation support platform (15) is plugged into the inner side of the molding groove (53), and positioning holes (55) matching the positioning protrusions (11) are provided at the top of the aluminum film body (51) and located on both sides of the molding cavity (52).

9. A direct-injection electroplating platen mold device according to claim 1, It is characterized in that A plurality of glue injection holes (61) are provided on the inner side of the glue injection plate (60).

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