Display device and electronic equipment
By attaching a semiconductor refrigeration module to the backlight side of the projector display panel, rapid heat dissipation is achieved using the phase change material layer and semiconductor refrigeration unit, the problems of noise and efficiency reduction in traditional heat dissipation systems are solved, and miniaturization and efficient heat dissipation are achieved.
Patent Information
- Application Number
- CN202411480110.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-22
- Publication Date
- 2024-12-10
AI Technical Summary
The cooling system of traditional projectors uses fans and heat sinks, which leads to noise, increased volume and weight, and reduces efficiency after long-term use, which may lead to damage to the equipment and cannot effectively solve the rapid cooling problem of the display panel.
The semiconductor refrigeration module is adopted, including a phase change material layer and a semiconductor refrigeration unit, which is attached to the backlight side of the display panel, heat is transferred through the phase change material layer and emitted by the semiconductor refrigeration unit, achieving rapid and effective heat dissipation, and through the temperature control module Adjust the heat flow density.
It realizes rapid and effective heat dissipation of the display panel, reduces the size and weight of the equipment, facilitates miniaturization design, and avoids the problems of fan noise and efficiency reduction.
Smart Images
Figure CN119105209A_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present application relate to the field of display technology, and in particular, to a display device and an electronic device. Background Art
[0002] When the projector is in use, the display panel will generate a lot of heat. If the heat is not dissipated in time, it will affect the normal operation of the display panel and even cause damage to the projector. The traditional projector cooling system usually uses a combination of fans and heat sinks to dissipate heat.
[0003] However, although fans and heat sinks can achieve a certain heat dissipation effect, there are several problems: first, the noise generated by the fan may interfere with the user experience; second, the fan and heat sink occupy additional space, increasing the volume and weight of the projector; finally, after long-term use, the efficiency of the fan and heat sink may decrease, resulting in a decrease in the working efficiency of the projector or even damage. Therefore, how to achieve fast and effective heat dissipation of the display panel has become a problem that needs to be solved in the field. Summary of the invention
[0004] The embodiments of the present application provide a display device and an electronic device, aiming to solve the problem of how to achieve rapid and effective heat dissipation of a display panel.
[0005] A first aspect of an embodiment of the present application provides a display device, the display device comprising: A box body, wherein the box body is enclosed to form a containing space; A display panel, wherein the display panel is arranged inside the accommodation space; A semiconductor refrigeration module, wherein the semiconductor refrigeration module is attached to the backlight side of the display panel, and the semiconductor refrigeration module comprises: a phase change material layer, wherein the orthographic projection of the phase change material layer on the display panel at least covers a display area of the display panel, and the phase change material layer is used to transfer heat generated by the display panel; A semiconductor refrigeration unit is arranged on one side of the phase change material layer along a first direction, and is used to receive and conduct heat transferred by the phase change material layer. The first direction is the direction from the central area of the phase change material layer to the edge.
[0006] In an optional implementation, the display panel includes: Display substrate; An upper polarizer and a lower polarizer, wherein the upper polarizer and the lower polarizer are arranged on opposite sides of the display substrate; The phase change material layer is attached to a side of the lower polarizer away from the display substrate, and the semiconductor refrigeration unit is arranged on a side of the lower polarizer along the first direction.
[0007] In an optional implementation, an orthographic projection of the phase change material layer on the display substrate coincides with an orthographic projection of the lower polarizer on the display substrate.
[0008] In an optional embodiment, the thickness of the semiconductor refrigeration unit along the second direction is equal to the sum of the thicknesses of the lower polarizer and the phase change material layer along the second direction, and the second direction is the arrangement direction of the display substrate and the lower polarizer.
[0009] In an optional implementation, within the accommodation space of the box body, the display device further includes: a light valve, the light valve being arranged on the backlight side of the display panel; A temperature control module is respectively connected to the light valve, the display panel, the phase change material layer and the semiconductor refrigeration unit.
[0010] In an optional implementation, the temperature control module includes a temperature sensor and a control unit; The temperature sensor is used to monitor the target temperature respectively and send the target temperature to the control unit, wherein the target temperature at least includes the temperature of the light valve, the display panel, the phase change material layer and the semiconductor refrigeration unit; The control unit is used to receive the target temperature and control the heat flux density of the semiconductor refrigeration unit based on the target temperature.
[0011] In an optional embodiment, the semiconductor refrigeration unit includes at least one refrigeration element, the refrigeration element includes a cold end and a hot end connected to each other, and the cold end is connected to the phase change material layer.
[0012] In an optional implementation, the refrigeration element further includes a heat dissipation unit, and the heat dissipation unit is connected to the cold end and the hot end respectively.
[0013] In an optional embodiment, a portion of the box body close to the semiconductor refrigeration unit is provided with heat dissipation holes.
[0014] A second aspect of the embodiments of the present application provides an electronic device, which includes the display device described in any one of the first aspect of the embodiments of the present application.
[0015] Beneficial effects: The present application provides a display device and an electronic device, wherein the display device comprises: a box body, wherein the box body is enclosed to form a storage space; a display panel, wherein the display panel is arranged inside the storage space; a semiconductor refrigeration module, wherein the semiconductor refrigeration module is attached to the backlight side of the display panel, wherein the semiconductor refrigeration module comprises: a phase change material layer, wherein the orthographic projection of the phase change material layer on the display panel at least covers the display area of the display panel, wherein the phase change material layer is used to transfer heat generated by the display panel; and a semiconductor refrigeration unit, wherein the semiconductor refrigeration unit is arranged on one side of the phase change material layer along a first direction, wherein the semiconductor refrigeration unit is used to receive and conduct heat transferred by the phase change material layer, wherein the first direction is a direction from the central area of the phase change material layer to the edge.
[0016] The present application achieves rapid and effective heat dissipation of the display panel by attaching a semiconductor refrigeration module to the backlight side of the display panel, quickly transferring the heat generated by the display panel to the semiconductor refrigeration unit through the phase change material layer of the semiconductor refrigeration module, and then dissipating the heat through the semiconductor refrigeration unit. The semiconductor refrigeration module is attached to the display panel and does not need to occupy additional storage space in the box body, which is conducive to the miniaturization and lightweight design of the display device.
[0017] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.
[0019] Figure 1 is a structural schematic diagram of a display device proposed in one embodiment of the present application; Figure 2 is a schematic diagram of a hierarchical structure of a display panel proposed in an embodiment of the present application; Figure 3 It is a schematic diagram of a top view of a semiconductor refrigeration module proposed in one embodiment of the present application; Figure 4 This is a schematic diagram of the working principle of a refrigeration element proposed in one embodiment of the present application.
[0020] Explanation of the reference numerals: 11, box body; 111, heat dissipation hole; 12, display panel; 13, semiconductor refrigeration module; 131, phase change material layer; 132, semiconductor refrigeration unit; 1321, refrigeration element; 14, light valve; 15, temperature control module; 16, first lens module; 17, second lens module; 21, display substrate; 211, driving back plate; 212, cover plate; 213, liquid crystal layer; 22, upper polarizer; 23, lower polarizer; 31, cold end; 32, hot end; 33, heat dissipation unit; F1, first direction; F2, second direction. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0022] In the drawings, the size of the constituent elements, the thickness of the layer or the area may be exaggerated for the sake of clarity. Therefore, any implementation of the present disclosure is not necessarily limited to the size shown in the drawings, and the shapes and sizes of the components in the drawings do not reflect the true proportions. In addition, the drawings schematically show ideal examples, and any implementation of the present disclosure is not limited to the shapes or values shown in the drawings.
[0023] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.
[0024] When the projector is in use, the display panel will generate a lot of heat. If the heat is not dissipated in time, it will affect the normal operation of the display panel and even cause damage to the projector. The traditional projector cooling system usually uses a combination of fans and heat sinks to dissipate heat.
[0025] However, although setting up fans and heat sinks can achieve a certain heat dissipation effect, there are several problems: first, the noise generated by the fan may interfere with the user experience; second, the fan and heat sink take up extra space, increasing the size and weight of the projector; finally, after long-term use, the efficiency of the fan and heat sink may decrease, resulting in reduced working efficiency of the projector or even damage.
[0026] In view of this, an embodiment of the present application provides a display device. Figure 1 A schematic diagram of the structure of a display device proposed in an embodiment of the present application is shown. Figure 1As shown, the display device comprises: a box body 11, the box body 11 encloses a receiving space, and a display panel 12, the display panel 12 is arranged inside the receiving space, and the display panel 12 is used to display images. Optionally, the display panel 12 is a liquid crystal display (LCD) display panel.
[0027] In some optional embodiments, Figure 2 A schematic diagram of a hierarchical structure of a display panel proposed in an embodiment of the present application is shown. Figure 2 As shown, the display panel 12 includes: a display substrate 21; an upper polarizer 22 and a lower polarizer 23, wherein the upper polarizer 22 and the lower polarizer 23 are arranged on opposite sides of the display substrate 21, the upper polarizer 22 is configured to modulate the polarized light emitted from the display substrate 21, and the lower polarizer 23 is configured to modulate the polarized light incident on the display substrate 21.
[0028] In some optional embodiments, such as Figure 2 As shown, the display substrate 21 includes a driving backplane 211, a cover plate 212 and a liquid crystal layer 213. The driving backplane 211 and the cover plate 212 are arranged in a box, and the liquid crystal layer 213 is arranged between the driving backplane 211 and the cover plate 212, wherein the driving backplane 211 is used to process and transmit signals, thereby controlling the display of the liquid crystal layer 213; the cover plate 212 is used to protect the liquid crystal layer 213 from external factors; the liquid crystal layer 213 receives signals from the driving backplane 211 and adjusts the arrangement of liquid crystal molecules according to changes in the signals, thereby changing the polarization state of light. When light passes through the liquid crystal layer 213, it will be modulated by the liquid crystal molecules to form an image with light and dark contrasts.
[0029] In the present application embodiment, Figure 1 and Figure 2As shown, the display device further includes a semiconductor refrigeration module 13, which is used to dissipate heat for the display panel 12, and the semiconductor refrigeration module 13 is attached to the backlight side of the display panel 12. In the embodiment of the present application, the semiconductor refrigeration module 13 is provided, and the semiconductor refrigeration module 13 is integrated on the backlight side of the display panel 13, so that the semiconductor refrigeration module 13 is in close contact with the display panel 12, thereby quickly transferring the heat of the display panel 12 to the semiconductor refrigeration module 13, and then dissipating the heat through the semiconductor refrigeration module 13, thereby achieving rapid and efficient heat dissipation of the display panel 12. In addition, since the semiconductor refrigeration module 13 is integrated on the backlight side of the display panel 12, there is no need to set up an additional area in the accommodating space of the box body 11 to place an independent heat dissipation unit, thereby reducing the volume of the box body 11, which is conducive to the miniaturization and lightweight design of the display device.
[0030] Specifically, the semiconductor refrigeration module 13 includes a phase change material layer 131, which is used to transfer heat generated by the display panel 12. In order to improve the heat transfer efficiency of the phase change material layer 131, the orthographic projection of the phase change material layer 131 on the display panel 12 at least covers the display area of the display panel 12.
[0031] In some optional embodiments, such as Figure 2 As shown, in order to maximize the heat transfer efficiency of the phase change material layer 131 , the orthographic projection of the phase change material layer 131 on the display substrate 21 coincides with the orthographic projection of the lower polarizer 23 on the display substrate 21 .
[0032] In some optional embodiments, since the phase change material layer 131 is arranged on the backlight side of the display panel 12, the incident light generated by the light source needs to pass through the phase change material layer 131 when entering the display panel 12. In order to avoid the phase change material layer 131 affecting the display effect of the display panel 12, the material of the phase change material layer 131 is a transparent material.
[0033] In the embodiment of the present application, the semiconductor refrigeration module 13 further includes a semiconductor refrigeration unit 132, which is connected to the phase change material layer 131 and is in close contact with the display panel 12. The semiconductor refrigeration unit 132 is arranged on one side of the phase change material layer 131 along the first direction F1, and is used to receive and export the heat transferred by the phase change material layer 131. The first direction F1 is the direction from the central area of the phase change material layer 131 to the edge. Optionally, the orthographic projection of the semiconductor refrigeration unit 132 on the display panel 12 is located in the non-display area of the display panel 12, so that the semiconductor refrigeration unit 132 will not have an adverse effect on the image display of the display panel 12.
[0034] In some optional embodiments, the thickness of the semiconductor refrigeration unit 132 along the second direction F2 is equal to the sum of the thicknesses of the lower polarizer 23 and the phase change material layer 131 along the second direction F2, and the second direction F2 is the arrangement direction of the display substrate 21 and the lower polarizer 23.
[0035] In some optional embodiments, a portion of the box body 11 close to the semiconductor refrigeration unit 132 is provided with a heat dissipation hole 111, and the heat dissipation hole 111 is used to dissipate the heat of the semiconductor refrigeration unit 132 out of the box body 11 of the display device.
[0036] In some optional embodiments, Figure 3 FIG. 1 shows a schematic diagram of a top view of a semiconductor refrigeration module proposed in an embodiment of the present application. Figure 3 As shown, the semiconductor refrigeration unit 132 includes at least one refrigeration element 1321, wherein, in the case where there are multiple refrigeration elements 1321, the multiple refrigeration elements 1321 are arranged in sequence along the extension direction of the edge of the phase change material layer 131 close to the multiple refrigeration elements 132, and the multiple refrigeration elements 1321 are connected in parallel to jointly achieve the regulation of the heat generated by the display panel 12. Optionally, each of the refrigeration elements 1321 is fixedly connected to the phase change material layer 131 by a thermally conductive adhesive to ensure good thermal conductivity between the phase change material layer 131 and the refrigeration element 1321.
[0037] In some optional embodiments, Figure 4 FIG. 1 shows a schematic diagram of the working principle of a refrigeration element proposed in an embodiment of the present application. Figure 4As shown, the cooling element 1321 includes a cold end 31 and a hot end 32 connected to each other, wherein the cold end 31 is arranged close to the phase change material layer 131 relative to the hot end 32, and the cold end 31 is closely connected to the phase change material layer 131. Specifically, the direction of heat transfer is from an object with a high temperature or a high temperature part of an object to an object with a low temperature or a low temperature part of an object. In the cooling element 1321, the temperature of the cold end 31 is lower than the temperature of the hot end 32. When the display panel 12 generates heat, the heat is transferred through the phase change material layer 131. Since the cold end 31 is connected to one end of the phase change material layer 131, the heat is gradually transferred in the phase change material layer 131 to the end connected to the cooling element 1321 until it is conducted to the cooling element 1321.
[0038] In the embodiment of the present application, the semiconductor refrigeration unit 132 is electrically connected to the power supply of the display device through a wire, and the refrigeration element 1321 also includes a heat dissipation unit 33, and the heat dissipation unit 33 is respectively connected to the cold end 31 and the hot end 32. When heat is transferred to the refrigeration element 1321 through the phase change material layer 131, the cold end 31 and the hot end 32 of the refrigeration element 1321 generate a temperature difference under the action of electric current, and the heat is quickly discharged through the heat dissipation module 33, thereby achieving effective heat dissipation of the display panel 12 without changing the structure of the display panel 12.
[0039] In some optional embodiments, such as Figure 1 As shown, in the accommodating space of the box body 11, the display device further includes: a light valve 14, the light valve 14 is arranged on the backlight side of the display panel 12, there is a gap between the light valve 14 and the display panel 12, and the light valve 14 is used to control the light transmission of the display panel 12; a temperature control module 15, the temperature control module 15 is respectively connected to the light valve 14, the display panel 12, the phase change material layer 131 and the semiconductor refrigeration unit 132, the temperature control module 15 is used to monitor the temperatures of the light valve 14, the display panel 12, the phase change material layer 131 and the semiconductor refrigeration unit 132 respectively, and control the operating state of the semiconductor refrigeration unit 132 according to the temperature, so that the semiconductor refrigeration unit 132 adjusts the temperature of the target component to the optimal working temperature.
[0040] Specifically, the temperature control module 15 includes a temperature sensor and a control unit that are interconnected: the temperature sensor is used to monitor the target temperature respectively and send the target temperature to the control unit, wherein the target temperature includes at least the temperature of the light valve 14, the display panel 12, the phase change material layer 131 and the semiconductor refrigeration unit 132; the control unit is used to receive the target temperature and control the heat flux density of the semiconductor refrigeration unit 132 based on the target temperature, thereby adjusting the temperature difference between the cold end 31 and the hot end 32 of the refrigeration element 1321, so that the refrigeration element 1321 adjusts the temperature of the target component to the optimal working temperature.
[0041] Exemplarily, the temperature sensor monitors and obtains the current temperature of the display panel 12, and the temperature sensor sends the current temperature of the display panel 12 to the control unit. When the current temperature of the display panel 12 is greater than or equal to the preset temperature of the display panel 12, it is determined that the temperature of the display panel 12 needs to be adjusted to the optimal operating temperature, and the operating current of the semiconductor refrigeration unit 132 is adjusted. Under the action of the operating current, the cold end 31 and the hot end 32 of the cooling element 1321 of the semiconductor refrigeration unit 132 produce a temperature difference, so that the heat generated by the display panel 12 is conducted to the semiconductor refrigeration unit 132 through the phase change material layer 131, and the heat is dissipated through the heat dissipation unit 33 of the cooling element 1321, thereby adjusting the temperature of the display panel 12 to the optimal operating temperature, thereby achieving rapid and effective heat dissipation of the display panel 12.
[0042] In some optional embodiments, the display device further includes: a first lens module 16 and a second lens module 17, the first lens module 16 is arranged at a preset angle to the light emitting side of the display panel 12, the first lens module 16 is used to reflect the light emitted from the display panel 12 into the second lens module 17, the second lens module 17 is arranged on the box body 11, and the second lens module 17 is used to emit light out of the display device to realize the display function of the display device.
[0043] The present application provides a display device, which includes: a box body, which is enclosed to form a storage space; a display panel, which is arranged inside the storage space; a semiconductor refrigeration module, which is attached to the backlight side of the display panel, and the semiconductor refrigeration module includes: a phase change material layer, the orthographic projection of the phase change material layer on the display panel at least covers the display area of the display panel, and the phase change material layer is used to transfer heat generated by the display panel; a semiconductor refrigeration unit, which is arranged on one side of the phase change material layer along a first direction, and the semiconductor refrigeration unit is used to receive and export the heat transferred by the phase change material layer, and the first direction is the direction from the central area of the phase change material layer to the edge.
[0044] The present application achieves rapid and effective heat dissipation of the display panel by attaching a semiconductor refrigeration module to the backlight side of the display panel, quickly transferring the heat generated by the display panel to the semiconductor refrigeration unit through the phase change material layer of the semiconductor refrigeration module, and then dissipating the heat through the semiconductor refrigeration unit. The semiconductor refrigeration module is attached to the display panel and does not need to occupy additional storage space in the box body, which is conducive to the miniaturization and lightweight design of the display device.
[0045] Based on the same inventive concept, an embodiment of the present application discloses an electronic device, which includes the display device described in the embodiment of the present application.
[0046] It should be noted that, since the electronic device provided in the present application includes the display device of the technical solution described in the embodiments of the present application, the electronic device provided in the present application has all the beneficial effects of the above-mentioned display device, which will not be elaborated here.
[0047] In some optional embodiments, the display device includes but is not limited to a projector, a television, a laptop, a tablet computer, a wearable device, a virtual reality (VR) device, and any other product or component with a display function. Those skilled in the art may make corresponding selections based on the actual use of the display device, and this application will not go into details herein.
[0048] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.
[0049] In the description of this specification, it should be understood that the terms "center", "thickness", "up", "down", "front", "back", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0050] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0051] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0052] The above application provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.
[0053] The term "one embodiment", "embodiment" or "one or more embodiments" herein means that a particular feature, structure or characteristic described in conjunction with the embodiment is included in at least one embodiment of the present application. In addition, please note that the examples of the term "in one embodiment" here do not necessarily all refer to the same embodiment.
[0054] In the description provided herein, a large number of specific details are described. However, it is understood that the embodiments of the present application can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.
[0055] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the process, method, article or terminal device including the elements.
[0056] The display device and electronic device provided by the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for general technicians in this field, according to the idea of the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.
Claims
1. A display device, characterized in that: The display device comprises: A box body, wherein the box body is enclosed to form a containing space; a display panel, wherein the display panel is arranged inside the accommodation space; A semiconductor refrigeration module, wherein the semiconductor refrigeration module is attached to the backlight side of the display panel, and the semiconductor refrigeration module comprises: a phase change material layer, wherein the orthographic projection of the phase change material layer on the display panel at least covers a display area of the display panel, and the phase change material layer is used to transfer heat generated by the display panel; A semiconductor refrigeration unit is arranged on one side of the phase change material layer along a first direction, and is used to receive and conduct heat transferred by the phase change material layer. The first direction is the direction from the central area of the phase change material layer to the edge.
2. The display device according to claim 1, characterized in that The display panel comprises: Display substrate; An upper polarizer and a lower polarizer, wherein the upper polarizer and the lower polarizer are arranged on opposite sides of the display substrate; The phase change material layer is attached to a side of the lower polarizer away from the display substrate, and the semiconductor refrigeration unit is arranged on a side of the lower polarizer along the first direction.
3. The display device according to claim 2, characterized in that: The orthographic projection of the phase change material layer on the display substrate coincides with the orthographic projection of the lower polarizer on the display substrate.
4. The display device according to claim 1, characterized in that The thickness of the semiconductor refrigeration unit along the second direction is equal to the sum of the thicknesses of the lower polarizer and the phase change material layer along the second direction, and the second direction is the arrangement direction of the display substrate and the lower polarizer.
5. The display device according to claim 1, characterized in that In the accommodating space of the box body, the display device further includes: a light valve, the light valve being arranged on the backlight side of the display panel; A temperature control module is respectively connected to the light valve, the display panel, the phase change material layer and the semiconductor refrigeration unit.
6. The display device according to claim 5, characterized in that: The temperature control module includes a temperature sensor and a control unit; The temperature sensor is used to monitor the target temperature respectively and send the target temperature to the control unit, wherein the target temperature at least includes the temperature of the light valve, the display panel, the phase change material layer and the semiconductor refrigeration unit; The control unit is used to receive the target temperature and control the heat flux density of the semiconductor refrigeration unit based on the target temperature.
7. The display device according to claim 1, characterized in that: The semiconductor refrigeration unit includes at least one refrigeration element, wherein the refrigeration element includes a cold end and a hot end connected to each other, and the cold end is connected to the phase change material layer.
8. The display device according to claim 7, characterized in that: The refrigeration element further includes a heat dissipation unit, and the heat dissipation unit is connected to the cold end and the hot end respectively.
9. The display device according to claim 1, characterized in that: The portion of the box body close to the semiconductor refrigeration unit is provided with heat dissipation holes.
10. An electronic device, characterized in that: The electronic device comprises the display device according to any one of claims 1-9.