An etching machine for electronic chip production

Abstract

The present invention discloses an etching machine for electronic chip production, which relates to the field of etching technology, including an etching box, a limiting component for limiting the electronic chip, a connecting component installed on the limiting component, a driving component connected to the connecting component installed on the etching box, and the driving component is used to drive the limiting component to move through the connecting component, so that the limiting component drives the electronic chip to rise and fall and reciprocate in the horizontal direction. The present invention arranges the driving component and the connecting component so that the electronic chips can be arranged in a row in the etching box and reciprocate in the horizontal direction, so that the etching liquid in the etching box can directly etch the electronic chip from the side of the electronic chip covering the mask, thereby improving the etching accuracy of the electronic chip, ensuring the covering and protective effect of the mask, and improving the processing quality of the wafer.

Description

Technical Field

[0001] The invention relates to the technical field of etching, and in particular to an etching machine for producing electronic chips. Background Art

[0002] Etching is a very important step in semiconductor manufacturing, microelectronic IC manufacturing and micro-nano manufacturing. Etching is actually understood in a narrow sense as photolithography corrosion. First, the photoresist is exposed by photolithography, and then the part to be removed is etched away by other means. Etching is the process of selectively removing unwanted materials from the surface of silicon wafers by chemical or physical methods. Its basic goal is to correctly replicate the mask pattern on the coated silicon wafer. With the development of micro-manufacturing technology, etching has become a general term for stripping and removing materials by solutions, reactive ions or other mechanical methods, and has become a universal term for micro-machining.

[0003] For example, a Chinese patent with publication number CN214313137U discloses an etching device for ultra-thin quartz wafers, including a quartz wafer loading basket, which is composed of cylindrical axis 1, cylindrical axis 2, cylindrical axis 3, cylindrical axis 4 and cylindrical axis 5. The corresponding positions of cylindrical axis 1, cylindrical axis 2, cylindrical axis 3, cylindrical axis 4 and cylindrical axis 5 are all provided with circular grooves for placing quartz wafers. The two ends of cylindrical axis 1, cylindrical axis 2, cylindrical axis 3, cylindrical axis 4 and cylindrical axis 5 are respectively connected by fixed frames, and the tops of the two fixed frames are connected by mounting brackets. A corrosion liquid stirring mechanism is arranged below the quartz wafer loading basket. The quartz wafer loading basket and the corrosion liquid stirring mechanism are both located in a cylinder, and the cylinder is placed in a sealed tank, and a rotating magnet is arranged at the bottom of the sealed tank. The utility model specifically has the characteristics of compact structure of the device, good sealing of the tank body, safe operation, and good controllability of the wafer etching rate.

[0004] Although the above-mentioned device achieves the etching effect of the wafer and ensures the safety of the wafer etching operation, during the use of the device, multiple wafers to be etched are stacked together, resulting in the etching liquid being able to only flow between two adjacent wafers when etching the surfaces of adjacent wafers in the middle position of a group of wafers. Under the action of the anisotropy of the etching liquid, it will flow under the wafer mask material, thereby reducing the covering and protective effect of the mask, affecting the etching accuracy of the wafer, and reducing the processing quality of the wafer. Therefore, the present application provides an etching machine for electronic chip production to meet the needs. Summary of the invention

[0005] The purpose of the present application is to provide an etching machine for the production of electronic chips. By arranging driving components and connecting components, the electronic chips can be arranged in a row in an etching box and perform reciprocating motion in the horizontal direction, so that the etching liquid in the etching box can directly etch the electronic chip from the side of the electronic chip covering the mask, thereby improving the etching accuracy of the electronic chip, ensuring the covering and protective effect of the mask, and improving the processing quality of the wafer.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical solutions: an etching machine for electronic chip production, comprising an etching box, a limiting component for limiting the electronic chip, a connecting component installed on the limiting component, a driving component connected to the connecting component installed on the etching box, the driving component is used to drive the limiting component to move through the connecting component, so that the limiting component drives the electronic chip to move up and down and to reciprocate in the horizontal direction; the limiting component comprises a plurality of limiting frames, the limiting frame is a U-shaped structure, a first limiting groove adapted to the electronic chip is provided on the limiting frame, a drainage groove connected to the first limiting groove is provided at the bottom of the limiting frame, and a Hinge, adjacent limit frames are rotatably connected by the hinge, and the connecting component includes a support rod for cooperating with the limit frame to limit the electronic chip, a fixed sleeve is fixedly sleeved on the support rod, and a sliding sleeve is slidably sleeved on the support rod, and a rotating shaft is fixedly connected to the fixed sleeve and the sliding sleeve, and the two limit frames at both ends are fixedly connected to the first limit sleeve on the side away from each other, and the rotating shaft is rotatably sleeved with the first limit sleeve, and the support rod is provided with a first limit hole and a second limit hole, and the sliding sleeve is fixedly connected with a threaded sleeve, and the threaded sleeve is threadedly connected to a limit bolt, and the limit bolt is adapted to the first limit hole and the second limit hole.

[0007] Preferably, two adjacent hinges are symmetrical about the center of the limiting frame.

[0008] Preferably, guide surfaces are provided on two opposite sides of the limiting frame.

[0009] Preferably, a plane is provided on one side of two adjacent limiting frames that are close to each other, and the planes are in contact with each other.

[0010] Preferably, two adjacent limiting frames are provided with oblique grooves on their mutually adjacent sides, and a spring piece is fixedly connected to one of the oblique grooves.

[0011] Preferably, two adjacent spring pieces are symmetrical about the center of the limit frame.

[0012] Preferably, the connecting component further comprises a connecting bent rod fixedly connected to the supporting rod, the connecting bent rod is a U-shaped structure, and the first limiting hole and the second limiting hole are both located within the projection range of the connecting bent rod in the vertical direction.

[0013] Preferably, the driving component includes a mounting bracket fixedly connected to the etching box, a first push rod motor is fixedly connected to the mounting bracket, an output end of the first push rod motor is fixedly connected to a second push rod motor, an output end of the second push rod motor is fixedly connected to a connecting bracket, and the connecting bracket is fixedly sleeved with the connecting bent rod.

[0014] Preferably, a second limiting groove is provided on the mounting bracket, a limiting bent rod is fixedly connected to the connecting bracket, and the limiting bent rod is slidably sleeved in the second limiting groove.

[0015] Preferably, a pick is fixedly connected to one end of the limiting bolt away from the threaded sleeve.

[0016] In summary, the technical effects and advantages of the present invention are as follows:

[0017] The present invention has a reasonable structure. By setting a driving component and a connecting component, after the electronic chip is limited, the connecting bracket, the connecting bending rod, the supporting rod, the fixed sleeve, the sliding sleeve, the rotating shaft, the first limiting sleeve, the limiting frame and the electronic chip in the limiting frame are driven to move into the etching box through the second push rod motor. When the electronic chip is immersed in the etching liquid in the etching box, the second push rod motor is driven by the first push rod motor to perform reciprocating motion in the horizontal direction, so that the etching liquid in the etching box can directly etch the electronic chip from the side of the electronic chip covering the mask, thereby improving the etching accuracy of the electronic chip, ensuring the covering and protective effect of the mask, and improving the processing quality of the wafer.

[0018] In the present invention, by setting a driving component, a limiting component and a connecting component, under normal conditions, multiple limiting frames are stacked, that is, the U-shaped sides of the multiple limiting frames are in contact with each other. In this state, the limiting bolt is rotated under the action of the threaded sleeve to make the limiting bolt plug into the first limiting hole, and then the limiting of the multiple stacked limiting frames is achieved through the sliding sleeve, the rotating shaft and the first limiting sleeve. At this time, the first limiting groove is located on one side of the support rod, and the electronic chip to be etched is inserted into the first limiting groove from the top of the limiting frame, and then the limiting of the limiting bolt and the first limiting hole is released, and the sliding sleeve is moved. The moving sliding sleeve drives the multiple limiting frames to move to a line-up state through the rotating shaft and the first limiting sleeve, and the multiple limit frames in the line-up state are all located below the support rod. At this time, the limiting bolt is rotated to make the limiting bolt plug into the second limiting hole, and then the multiple limit frames are limited, and the top of the first limiting groove is limited by the support rod to complete the limiting of the multiple electronic chips. The structure is simple and the operation is convenient.

[0019] In the present invention, by providing a drainage groove and a guide surface, the etching liquid attached to the electronic chip can quickly flow down from the limit frame during the rising process of the limit frame, thereby preventing the etching liquid from adhering to the surface of the limit frame after the electronic chip is etched, maintaining continuous etching of the electronic chip, increasing local etching loss of the electronic chip, and reducing the etching accuracy of the electronic chip.

[0020] In the present invention, by arranging hinges and springs, when a plurality of limit frames are arranged in a row, the springs are squeezed by the inclined grooves on the ringing limit frames, so that the limit frames have a tendency to reset. After the etching of the electronic chip is completed, the limit frame is driven to rise by the second push rod motor. When the limit frame rises to above the etching box, the limit bolts and the second limit holes are released, and the first limit sleeve is pushed to one side. Under the elastic force of the springs and the connection of the hinges, the plurality of limit frames are gradually stacked together. When the first limit groove is completely moved to one side of the support rod, the etched electronic chip can be removed from the limit frame. The structure is simple and the operation is convenient.

[0021] In the present invention, a second limiting groove and a limiting bent rod are provided to limit the connection bracket during movement, thereby preventing the connection bracket from deflecting during movement, causing the limiting frame containing the electronic chip to collide with the inner wall of the etching box, causing hidden damage to the surface of the electronic chip, thereby ensuring the processing quality of the electronic chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 A schematic diagram of the three-dimensional structure of an etching machine used in the production of electronic chips;

[0024] Figure 2 It is a partial three-dimensional enlarged structural schematic diagram after the limiting components and the connecting components are assembled;

[0025] Figure 3 for Figure 2 The enlarged structural diagram at A in the middle;

[0026] Figure 4 It is a schematic diagram of a partial three-dimensional enlarged structure of a limiting component;

[0027] Figure 5 It is a schematic diagram of a partial three-dimensional enlarged structure of a connecting component;

[0028] Figure 6 It is a schematic diagram of a partial three-dimensional enlarged structure after the bending rod and the supporting rod are assembled;

[0029] Figure 7 It is a three-dimensional enlarged structural diagram of the driving component.

[0030] In the figure: 1. etching box; 2. driving component; 3. limiting component; 4. connecting component; 5. mounting bracket; 6. first push rod motor; 7. second push rod motor; 8. connecting bracket; 9. connecting bent rod; 10. supporting rod; 11. fixing sleeve; 12. sliding sleeve; 13. rotating shaft; 14. threaded sleeve; 15. limiting bolt; 16. first limiting hole; 17. second limiting hole; 18. first limiting sleeve; 19. limiting frame; 20. first limiting groove; 21. drainage groove; 22. hinge; 23. guide surface; 24. second limiting groove; 25. limiting bent rod; 26. inclined groove; 27. spring. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] Example: Reference Figure 1-7The etching machine for electronic wafer production shown in the figure comprises an etching box 1, a limiting component 3 for limiting the electronic wafer, the etching box 1 is provided with a liquid inlet and a liquid outlet, and a connecting component 4 is installed on the limiting component 3 for replacing the limiting component 3, and a driving component 2 connected to the connecting component 4 is installed on the etching box 1, and the driving component 2 is used to drive the limiting component 3 to move through the connecting component 4, so that the limiting component 3 drives the electronic wafer to move up and down and reciprocate in the horizontal direction; the limiting component 3 comprises a plurality of limiting frames 19, and the limiting frames 19 can be set to four to eight, so as to ensure that a large number of electronic wafers are etched each time. The limiting frame 19 is a U-shaped structure. The limiting frame 19 is provided with a first limiting groove 20 adapted to the electronic chip. The bottom of the limiting frame 19 is provided with a drainage groove 21 connected to the first limiting groove 20. The limiting frame 19 is fixedly connected with a hinge 22. The hinge 22 is partially embedded in the limiting frame 19, so that when the limiting frame 19 is folded, the sides of the two adjacent limiting frames 19 close to each other are fully fitted, thereby improving the limiting stability of the limiting frame 19. The adjacent limiting frames 19 are rotatably connected by the hinge 22. The connecting component 4 includes a hinge 22 for cooperating with the limiting frame 19 to couple the electronic chip. A support rod 10 for limiting the position of the piece, a fixed sleeve 11 is fixedly sleeved on the support rod 10, a sliding sleeve 12 is slidably sleeved on the support rod 10, a rotating shaft 13 is fixedly connected to the fixed sleeve 11 and the sliding sleeve 12, and a first limiting sleeve 18 is fixedly connected to the side away from each other of the two limiting frames 19 at both ends, and the rotating shaft 13 is rotatably sleeved with the first limiting sleeve 18, a first limiting hole 16 and a second limiting hole 17 are opened on the support rod 10, and a threaded sleeve 14 is fixedly connected to the sliding sleeve 12, and the threaded sleeve 14 is threadedly connected to the limiting bolt 15, and the limiting bolt 15 is connected to the The first limiting hole 16 and the second limiting hole 17 are adapted to each other, the connecting component 4 also includes a connecting bent rod 9 fixedly connected to the support rod 10, the connecting bent rod 9 is a U-shaped structure, the first limiting hole 16 and the second limiting hole 17 are both located within the projection range of the connecting bent rod 9 in the vertical direction, the driving component 2 includes a mounting bracket 5 fixedly connected to the etching box 1, a first push rod motor 6 is fixedly connected to the mounting bracket 5, the output end of the first push rod motor 6 is fixedly connected to the second push rod motor 7, the output end of the second push rod motor 7 is fixedly connected to the connecting bracket 8, and the connecting bracket 8 is fixedly sleeved with the connecting bent rod 9.

[0033] By setting the driving component 2, the limiting component 3, and the connecting component 4, under normal conditions, multiple limiting frames 19 are stacked, that is, the U-shaped sides of the multiple limiting frames 19 are pressed against each other. In this state, the limiting bolt 15 is rotated under the action of the threaded sleeve 14 to make the limiting bolt 15 plug into the first limiting hole 16, and then the limiting of the multiple stacked limiting frames 19 is achieved through the sliding sleeve 12, the rotating shaft 13, and the first limiting sleeve 18. At this time, the first limiting groove 20 is located on one side of the support rod 10, and the electronic chip to be etched is inserted into the first limiting groove 20 from the top of the limiting frame 19, and then The limiting of the limiting bolt 15 and the first limiting hole 16 is released, and the sliding sleeve 12 is moved. The moving sliding sleeve 12 drives the multiple limiting frames 19 to move to a line-up state through the rotating shaft 13 and the first limiting sleeve 18, and the multiple limiting frames 19 in the line-up state are all located below the support rod 10. At this time, the limiting bolt 15 is rotated to make the limiting bolt 15 plug into the second limiting hole 17, thereby limiting the multiple limiting frames 19, and limiting the top of the first limiting groove 20 through the support rod 10, thereby completing the limiting of multiple electronic chips. The structure is simple and the operation is convenient.

[0034] By setting the driving component 2 and the connecting component 4, after completing the limiting of the electronic chip, the second push rod motor 7 drives the connecting bracket 8, the connecting bending rod 9, the support rod 10, the fixed sleeve 11, the sliding sleeve 12, the rotating shaft 13, the first limiting sleeve 18, the limiting frame 19 and the electronic chip in the limiting frame 19 to move into the etching box 1. When the electronic chip is immersed in the etching liquid in the etching box 1, the first push rod motor 6 drives the second push rod motor 7 to reciprocate in the horizontal direction, so that the etching liquid in the etching box 1 can directly etch the electronic chip from the side of the electronic chip covering the mask, thereby improving the etching accuracy of the electronic chip, ensuring the covering and protective effect of the mask, and improving the processing quality of the wafer.

[0035] like Figure 4 As shown, in this embodiment, guide surfaces 23 are provided on the opposite sides of the limit frame 19. By providing the drainage groove 21 and the guide surface 23, the etching liquid attached to the electronic chip can quickly flow down from the limit frame 19 during the rising process of the limit frame 19, thereby preventing the etching liquid from adhering to the surface of the limit frame 19 after the electronic chip is etched, maintaining continuous etching of the electronic chip, increasing local etching loss of the electronic chip, and reducing the etching accuracy of the electronic chip.

[0036] like Figure 4 As shown, in this embodiment, a plane is provided on the side where two adjacent limit frames 19 are close to each other, and the planes fit together. By providing the plane, the limit frames 19 can fit together on one side in both the stacked and arranged states to improve the limit stability.

[0037] like Figure 4As shown, in this embodiment, two adjacent limiting frames 19 are provided with oblique grooves 26 on their sides close to each other, and a spring piece 27 is fixedly connected to one of the oblique grooves 26.

[0038] like Figure 4 As shown, in this embodiment, two adjacent hinges 22 are symmetrical about the center of the middle portion of the limiting frame 19 , and two adjacent spring sheets 27 are symmetrical about the center of the middle portion of the limiting frame 19 .

[0039] By setting the hinge 22 and the spring 27, when multiple limit frames 19 are arranged in a row, the spring 27 is squeezed by the inclined groove 26 on the ringing limit frame 19, so that the limit frame 19 has a tendency to reset. After the etching of the electronic chip is completed, the limit frame 19 is driven to rise by the second push rod motor 7. When the limit frame 19 rises to the top of the etching box 1, the limit bolt 15 and the second limit hole 17 are released, and the first limit sleeve 18 is pushed to one side. Under the elastic force of the spring 27 and the connection of the hinge 22, the multiple limit frames 19 are gradually stacked together. When the first limit groove 20 is completely moved to one side of the support rod 10, the etched electronic chip can be removed from the limit frame 19. The structure is simple and the operation is convenient.

[0040] like Figure 7 As shown, in this embodiment, a second limiting groove 24 is opened on the mounting bracket 5, and a limiting bent rod 25 is fixedly connected to the connecting bracket 8. The limiting bent rod 25 is slidably sleeved with the second limiting groove 24. By setting the second limiting groove 24 and the limiting bent rod 25, the connecting bracket 8 is limited during the movement to prevent the connecting bracket 8 from deflecting during the movement, so that the limiting frame 19 equipped with the electronic chip collides with the inner wall of the etching box 1, causing hidden damage on the surface of the electronic chip, thereby ensuring the processing quality of the electronic chip.

[0041] like Figure 5 As shown, in this embodiment, a paddle is fixedly connected to one end of the limit bolt 15 away from the threaded sleeve 14. By providing the paddle, when the limit bolt 15 needs to be rotated, force can be applied to the limit bolt 15 through the paddle, which has a simple structure and is easy to operate.

[0042] Working principle of the present invention:

[0043] By setting the driving component 2, the limiting component 3, and the connecting component 4, under normal conditions, multiple limiting frames 19 are stacked, that is, the U-shaped sides of the multiple limiting frames 19 are pressed against each other. In this state, the limiting bolt 15 is rotated under the action of the threaded sleeve 14 to make the limiting bolt 15 plug into the first limiting hole 16, and then the limiting of the multiple stacked limiting frames 19 is achieved through the sliding sleeve 12, the rotating shaft 13, and the first limiting sleeve 18. At this time, the first limiting groove 20 is located on one side of the support rod 10, and the electronic chip to be etched is inserted into the first limiting groove 20 from the top of the limiting frame 19, and then The limiting of the limiting bolt 15 and the first limiting hole 16 is released, and the sliding sleeve 12 is moved. The moving sliding sleeve 12 drives the multiple limiting frames 19 to move to a line-up state through the rotating shaft 13 and the first limiting sleeve 18, and the multiple limiting frames 19 in the line-up state are all located below the support rod 10. At this time, the limiting bolt 15 is rotated to make the limiting bolt 15 plug into the second limiting hole 17, thereby limiting the multiple limiting frames 19, and limiting the top of the first limiting groove 20 through the support rod 10, thereby completing the limiting of multiple electronic chips. The structure is simple and the operation is convenient.

[0044] By setting the driving component 2 and the connecting component 4, after completing the limiting of the electronic chip, the second push rod motor 7 drives the connecting bracket 8, the connecting bending rod 9, the support rod 10, the fixed sleeve 11, the sliding sleeve 12, the rotating shaft 13, the first limiting sleeve 18, the limiting frame 19 and the electronic chip in the limiting frame 19 to move into the etching box 1. When the electronic chip is immersed in the etching liquid in the etching box 1, the first push rod motor 6 drives the second push rod motor 7 to reciprocate in the horizontal direction, so that the etching liquid in the etching box 1 can directly etch the electronic chip from the side of the electronic chip covering the mask, thereby improving the etching accuracy of the electronic chip, ensuring the covering and protective effect of the mask, and improving the processing quality of the wafer.

[0045] By providing the drainage groove 21 and the guide surface 23, the etching liquid attached to the electronic chip can quickly flow down from the limit frame 19 during the rising process of the limit frame 19, thereby preventing the etching liquid from adhering to the surface of the limit frame 19 after the electronic chip is etched, maintaining continuous etching of the electronic chip, increasing local etching loss of the electronic chip, and reducing the etching accuracy of the electronic chip.

[0046] By setting the plane, the limiting frames 19 can be in contact with each other on one side in both the stacked and arranged states, thereby improving the limiting stability.

[0047] By setting the hinge 22 and the spring 27, when multiple limit frames 19 are arranged in a row, the spring 27 is squeezed by the inclined groove 26 on the ringing limit frame 19, so that the limit frame 19 has a tendency to reset. After the etching of the electronic chip is completed, the limit frame 19 is driven to rise by the second push rod motor 7. When the limit frame 19 rises to the top of the etching box 1, the limit bolt 15 and the second limit hole 17 are released, and the first limit sleeve 18 is pushed to one side. Under the elastic force of the spring 27 and the connection of the hinge 22, the multiple limit frames 19 are gradually stacked together. When the first limit groove 20 is completely moved to one side of the support rod 10, the etched electronic chip can be removed from the limit frame 19. The structure is simple and the operation is convenient.

[0048] By setting the second limiting groove 24 and the limiting bent rod 25, the connecting bracket 8 is limited during the movement to prevent the connecting bracket 8 from deflecting during the movement, so that the limiting frame 19 with the electronic chip collides with the inner wall of the etching box 1, causing hidden damage to the surface of the electronic chip, thereby ensuring the processing quality of the electronic chip.

[0049] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An etching machine for electronic wafer production, characterized in that: The etching box comprises an etching box (1), a limiting component (3) for limiting the position of an electronic chip, a connecting component (4) being installed on the limiting component (3), a driving component (2) connected to the connecting component (4) being installed on the etching box (1), and the driving component (2) being used to drive the limiting component (3) to move via the connecting component (4), so that the limiting component (3) drives the electronic chip to move up and down and to reciprocate in the horizontal direction; The limiting component (3) comprises a plurality of limiting frames (19), the limiting frames (19) being of a U-shaped structure, the limiting frames (19) being provided with a first limiting groove (20) adapted to the electronic chip, the bottom of the limiting frame (19) being provided with a drainage groove (21) connected to the first limiting groove (20), the limiting frame (19) being fixedly connected with a hinge (22), adjacent limiting frames (19) being rotatably connected via the hinge (22), the connecting component (4) comprising a support rod (10) for cooperating with the limiting frame (19) to limit the electronic chip, the support rod (10) being fixedly sleeved with a fixed sleeve (11), the support rod (10) being slidably connected to the fixing sleeve (11). A sliding sleeve (12) is sleeved thereon; a rotating shaft (13) is fixedly connected to the fixed sleeve (11) and the sliding sleeve (12); a first limiting sleeve (18) is fixedly connected to the side of the two limiting frames (19) at both ends that are away from each other; the rotating shaft (13) and the first limiting sleeve (18) are rotatably sleeved thereon; a first limiting hole (16) and a second limiting hole (17) are formed on the support rod (10); a threaded sleeve (14) is fixedly connected to the sliding sleeve (12); the threaded sleeve (14) is threadably connected to a limiting bolt (15); the limiting bolt (15) is matched with the first limiting hole (16) and the second limiting hole (17).

2. The etching machine for electronic wafer production according to claim 1, characterized in that: Two adjacent hinges (22) are symmetrical about the center of the middle of the limiting frame (19).

3. The etching machine for electronic wafer production according to claim 1, characterized in that: The limiting frame (19) is provided with flow guide surfaces (23) on two opposite sides.

4. The etching machine for electronic wafer production according to claim 1, characterized in that: A plane is provided on one side of two adjacent limiting frames (19) that are close to each other, and the planes fit together.

5. The etching machine for electronic wafer production according to claim 1, characterized in that: An inclined groove (26) is provided on one side of two adjacent limiting frames (19) that are close to each other, and a spring piece (27) is fixedly connected to one of the inclined grooves (26).

6. The etching machine for electronic wafer production according to claim 5, characterized in that: Two adjacent spring sheets (27) are symmetrical about the center of the middle of the limiting frame (19).

7. The etching machine for electronic wafer production according to claim 1, characterized in that: The connecting component (4) further comprises a connecting bent rod (9) fixedly connected to the supporting rod (10); the connecting bent rod (9) is a U-shaped structure; the first limiting hole (16) and the second limiting hole (17) are both located within the projection range of the connecting bent rod (9) in the vertical direction.

8. The etching machine for electronic wafer production according to claim 7, characterized in that: The driving component (2) comprises a mounting bracket (5) fixedly connected to the etching box (1); a first push rod motor (6) is fixedly connected to the mounting bracket (5); an output end of the first push rod motor (6) is fixedly connected to a second push rod motor (7); an output end of the second push rod motor (7) is fixedly connected to a connecting bracket (8); and the connecting bracket (8) is fixedly sleeved with the connecting bent rod (9).

9. The etching machine for electronic wafer production according to claim 8, characterized in that: The mounting bracket (5) is provided with a second limiting groove (24), the connecting bracket (8) is fixedly connected with a limiting bent rod (25), and the limiting bent rod (25) is slidably sleeved with the second limiting groove (24).

10. The etching machine for electronic wafer production according to claim 1, characterized in that: One end of the limiting bolt (15) away from the threaded sleeve (14) is fixedly connected to a paddle.

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