Laser displacement sensor

Abstract

The embodiment of the invention provides a laser displacement sensor. The laser displacement sensor comprises a shell assembly, a screen soft board assembly and an optical module, the screen soft board assembly and the optical module are in communication connection and are both arranged in the shell assembly; the screen soft board assembly comprises a screen PCB and a screen PCB support. The screen PCB support is connected with the shell assembly. The screen PCB is a soft board, and the screen PCB is arranged on the screen PCB bracket in a surrounding manner; a device area is arranged on the surface of the screen PCB, a reinforcing plate is arranged between the back face of the device area and the screen PCB support, and the reinforcing plate is attached to the device area and the screen PCB support. According to the embodiment of the invention, the screen PCB is a soft board, the reinforcing board is arranged on the back surface of the device area, and by adopting the mode of increasing local reinforcement for the soft board, the screen PCB can be bent, the device area can resist vibration and impact, and the screen PCB can be arranged on the screen PCB support in a surrounding manner, so that the bending complexity of the screen PCB can be reduced.

Description

Technical Field

[0001] The present application relates to the field of sensor technology, and in particular to a laser displacement sensor. Background Art

[0002] Laser displacement sensor is a sensor that uses laser technology for measurement and can accurately measure the position, displacement and other changes of the measured object without contact.

[0003] In the related art, the screen PCB board of the laser displacement sensor can usually be a hard board, a soft board or a hard-soft board. Among them, the hard board can better resist vibration and impact, but cannot be bent and cannot be used in environments that require bending or are space-constrained; the soft board has good flexibility, but poor rigidity and cannot resist vibration and impact; when assembling the flexible part and the rigid part of the hard-soft board, the bending and wiring are more complicated, and it is not easy to restore after disassembly. Summary of the invention

[0004] The purpose of the embodiment of the present application is to provide a laser displacement sensor to reduce the complexity of bending the screen PCB board. The specific technical solution is as follows:

[0005] The embodiment of the present application provides a laser displacement sensor, comprising: a shell assembly, a screen soft board assembly and an optical module; the screen soft board assembly and the optical module are communicatively connected and are both arranged inside the shell assembly; the screen soft board assembly comprises: a screen PCB board and a screen PCB board bracket; the screen PCB board bracket is connected to the shell assembly; the screen PCB board is a soft board, and the screen PCB board is arranged around the screen PCB board bracket; a device area is arranged on the surface of the screen PCB board, a reinforcement plate is arranged between the back side of the device area and the screen PCB board bracket, and the reinforcement plate is bonded to the device area and the screen PCB board bracket.

[0006] In some embodiments of the present application, the screen soft board assembly also includes: a display screen; the display screen is electrically connected to the screen PCB board through a first connecting soft board; a plurality of circuit areas are also arranged on the screen PCB board; the screen PCB board is bent at each circuit area to surround a bracket arranged on the screen PCB board; the circuit area and the device area are located on the same surface of the screen PCB board, and the circuits on the circuit area connect the electronic components on each device area.

[0007] In some embodiments of the present application, the device area includes: a first device area, a second device area, a third device area, a fourth device area and a fifth device area; the line area includes: a first line area, a second line area, a third line area and a fourth line area; the shape of each device area and line area is rectangular or quasi-rectangular; the second device area, the third device area, the fourth device area and the fifth device area are arranged in a line and spaced apart; the second line area, the third line area and the fourth line area are respectively arranged in the intervals between the second device area, the third device area, the fourth device area and the fifth device area, and are connected to the device areas at both ends; the first device area is connected to the second device area through the first line area, and the connecting edge and the connecting edge between the second line area and the second device area are at right angles to each other.

[0008] In some embodiments of the present application, it also includes: a main board; the main board is arranged inside the shell assembly; a first gold finger is arranged on the first device area, and the first gold finger is arranged on the edge opposite to the first circuit area; the display screen is electrically connected to the first device area through a first connecting soft board, and is located on one side of the first gold finger; a second gold finger is arranged on the fifth device area, and the first gold finger and the second gold finger extend in opposite directions; the first gold finger and the second gold finger are bent toward the main board and electrically connected to the main board.

[0009] In some embodiments of the present application, the third device area and the fourth device area are connected to a first protective soft board and a second protective soft board respectively; the first protective soft board and the second protective soft board are arranged in the same direction as the first device area. The first protective soft board and the second protective soft board are bent toward the third device area and the fourth device area respectively, and are arranged between the third device area and the optical module and between the fourth device area and the optical module respectively.

[0010] In some embodiments of the present application, the circumferential side of the screen PCB board bracket includes a first mounting surface, a second mounting surface, a third mounting surface, a fourth mounting surface, a fifth mounting surface and a sixth mounting surface connected in sequence end to end; the second mounting surface and the sixth mounting surface are opposite to each other and are both perpendicular to the first mounting surface; the third mounting surface is inclined toward the first mounting surface, and the angle between the third mounting surface and the second mounting surface is an acute angle; the fifth mounting surface is inclined toward the sixth mounting surface, and the angle between the fifth mounting surface and the sixth mounting surface is an acute angle; the bottom of the screen PCB board bracket is fixedly connected to the internal bottom plate of the outer shell assembly.

[0011] In some embodiments of the present application, the first device area is bonded to the first mounting surface; the first connecting flexible board and the first circuit area are bent toward the back side of the first device area, and the back side of the display screen and the back side of the second device area are both bonded to the back side of the first device area; the display screen after bonding is fitted with the edge of the second device area, wherein the length of the first device area is greater than or equal to the sum of the lengths of the display screen and the second device area; and the length of the first mounting surface is greater than the length of the first device area.

[0012] In some embodiments of the present application, the second circuit area is bent relative to the second device area, bypassing the second mounting surface and extending to the third mounting surface; the back side of the third device area is bonded to the third mounting surface, and the first protective soft board is bent toward the third device area and bonded to the third device area, wherein the length of the third mounting surface is greater than the length of the third device area.

[0013] In some embodiments of the present application, the third circuit area is bent relative to the third device area, adheres to the fourth mounting surface, and extends to the fifth mounting surface; the back side of the fourth device area is bonded to the fifth mounting surface, and the second protective soft board is bent toward the fourth device area and bonded to the fourth device area, wherein the length of the fifth mounting surface is greater than the length of the fourth device area.

[0014] In some embodiments of the present application, the fourth circuit region is bent relative to the fourth device region to the sixth mounting surface, and the back side of the fifth device region is bonded to the sixth mounting surface, wherein the length of the sixth mounting surface is greater than that of the fifth device region.

[0015] In some embodiments of the present application, a mainboard thermal pad is provided on the top of the mainboard; an electromagnetic shielding layer is provided on the top of the mainboard thermal pad; the electromagnetic shielding layer is welded to the mainboard, and the top of the electromagnetic shielding layer is bonded to the top of the shell component via thermal conductive adhesive; an electromagnetic insulating block is provided between the mainboard and the side wall of the shell component; the electromagnetic insulating block is bonded to the side wall via adhesive.

[0016] In some embodiments of the present application, it also includes: a cable; a horizontal cable groove is arranged on the side wall of the shell component; an anti-short circuit block is pasted on the bottom of one corner of the mainboard, one end of the cable passes through the anti-short circuit block and is welded to the mainboard, and the other end passes through the side wall of the shell component and is embedded in the cable groove; a glue groove is formed between the side wall of the shell component and the cable for fixing the cable by glue.

[0017] In some embodiments of the present application, the optical module includes: an optical module bracket fixedly connected to the shell assembly, and a sensor assembly, a sensor lens assembly and a laser assembly arranged on the optical module bracket; the sensor lens assembly and the laser assembly are arranged at an angle, and the sensor assembly is arranged behind the sensor lens assembly; the laser generated by the laser assembly passes through the shell assembly, is reflected by the object to be measured, passes through the sensor lens assembly, and is received by the sensor assembly; the sensor assembly and the laser assembly are both communicatively connected to the screen PCB board.

[0018] In some embodiments of the present application, the optical module bracket includes a bracket base plate, a first mounting frame and a second mounting frame; the first mounting frame and the second mounting frame are arranged side by side on the bracket base plate; the first mounting frame is inclined relative to the second mounting frame, and the inclination angle is an acute angle; the sensor lens assembly is fixed in the first mounting frame, and the laser assembly is fixed in the second mounting frame; the sensor assembly is fixed on the bracket base plate located behind the first mounting frame; the bracket base plate is arranged opposite to the screen PCB board bracket, and the bottom is fixedly connected to the internal base plate of the shell assembly.

[0019] In some embodiments of the present application, the sensor assembly includes: a sensor bracket, a sensor and a gasket; the sensor bracket is fixedly connected to the bracket base plate, and is arranged obliquely relative to the first mounting frame, and the inclination angle is an acute angle; the gasket is arranged between the sensor bracket and the bracket base plate; the sensor is fixed to a side of the sensor bracket away from the sensor lens assembly, and a through hole is provided on the sensor bracket so that the sensor can receive the laser passing through the sensor lens assembly; a sensor PCB board is provided on the sensor, and the sensor PCB board is communicatively connected to the screen PCB board through a second connecting soft board.

[0020] In some embodiments of the present application, the sensor lens assembly includes: a sensor lens and a filter; the sensor lens and the filter are sequentially arranged in the first installation frame along the direction of the laser light path.

[0021] In some embodiments of the present application, the laser assembly includes: a laser emitter, a laser lens and an aperture piece arranged in sequence along the direction of the laser light path; a through hole for laser emission is arranged inside the second mounting frame, and the laser emitter is fixed at the rear end of the second mounting frame; the laser lens and the aperture piece are fixed at the front end of the second mounting frame; a laser PCB board is arranged on the back of the laser emitter, and the laser PCB board is communicatively connected with the screen PCB board through a third connecting soft board; a laser thermal pad and a compression foam are arranged on the back of the laser PCB board, and the compression foam presses the laser thermal pad onto the second mounting frame.

[0022] In some embodiments of the present application, the shell assembly includes: a main shell and a top cover; the side wall of the main shell has a circle of bosses protruding inward, and the top of the bosses lifts up the top cover; the top cover and the main shell together form a rectangular parallelepiped; the main shell is used to accommodate the screen soft board assembly and the optical module; the screen soft board assembly is formed with a bent accommodating space, and the optical module is located in the bent accommodating space.

[0023] In some embodiments of the present application, the shell assembly also includes: a transparent cover plate and a red translucent cover plate; the side walls of the main shell include a first side wall, a second side wall, a third side wall and a fourth side wall connected in sequence, and the transparent cover plate is configured to cover the outside of the first side wall, and part of the outside of the second side wall and the fourth side wall; used to correspond to the position of the display screen of the screen soft board assembly; the red translucent cover plate is arranged on the outside of the fourth side wall, and the light emitting end and the light receiving end of the optical module are opposite to the red translucent cover plate.

[0024] In some embodiments of the present application, a light guide column and a setting button are provided on the first side wall covered by the transparent cover plate; a display window is provided in the second side wall area covered by the transparent cover plate, and the display screen is opposite to the display window; and a function button is provided in the area located on one side of the display window and not covered by the transparent cover plate.

[0025] Beneficial effects of the embodiments of the present application:

[0026] The embodiment of the present application provides such a laser displacement sensor, wherein the screen PCB board is a soft board, and a reinforcement plate is arranged on the back side of the device area for welding electronic components. This method of adding local reinforcement to the soft screen PCB board can not only ensure that the screen PCB board can be bent and the device area where the electronic components are welded can withstand vibration and impact, but also reduce the complexity of bending the screen PCB board by surrounding the screen PCB board on the screen PCB board bracket.

[0027] Of course, implementing any product or method of the present application does not necessarily require achieving all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other embodiments can also be obtained based on these drawings.

[0029] Figure 1aA three-dimensional structural diagram of a laser displacement sensor according to an embodiment of the present application;

[0030] Figure 1b for Figure 1a An exploded schematic diagram of the laser displacement sensor shown;

[0031] Figure 1c for Figure 1b A top view of the laser displacement sensor shown;

[0032] Figure 2a for Figure 1b A three-dimensional structural diagram of the screen soft board assembly at one angle;

[0033] Figure 2b for Figure 2a A three-dimensional structural diagram of the screen soft board assembly from another angle;

[0034] Figure 3a for Figure 1b The three-dimensional structure diagram of the screen PCB board is shown;

[0035] Figure 3b for Figure 3a The expanded schematic diagram of the screen PCB board is shown;

[0036] Figure 4a for Figure 2a A three-dimensional structural diagram of the screen PCB bracket at one angle;

[0037] Figure 4b for Figure 4a A three-dimensional structural diagram of the screen PCB bracket from another angle;

[0038] Figure 5 for Figure 2a The connection diagram of the screen soft board assembly and the main board is shown;

[0039] Figure 6a for Figure 1b A three-dimensional structural diagram of the optical module shown;

[0040] Figure 6b for Figure 6a An exploded schematic diagram of the optical module shown;

[0041] Figure 7 for Figure 1b The connection diagram of the screen soft board assembly and the optical module is shown;

[0042] Figure 8 for Figure 1b A three-dimensional structural diagram of the main housing shown;

[0043] Fig. 9 for Figure 8 The three-dimensional structure diagram of the function keys shown;

[0044] Fig.10 for Figure 1b An exploded schematic diagram of the various structures installed on the main board is shown.

[0045] Reference numerals:

[0046] Shell assembly 100; main shell 110; first side wall 111; second side wall 112; display window 1121; third side wall 113; fourth side wall 114; cable groove 115; top cover plate 120; boss 130; bending accommodation space 140; transparent cover plate 151; red translucent cover plate 152; light guide column 161; setting button 162; function button 163; button cap 164; silicone button seat 165; waterproof adhesive 166;

[0047] Screen soft board assembly 200; screen PCB board 210; device area 211; first device area 2111; second device area 2112; third device area 2113; fourth device area 2114; fifth device area 2115; circuit area 212; first circuit area 2121; second circuit area 2122; third circuit area 2123; fourth circuit area 2124; screen PCB board bracket 220; first mounting surface 221; second mounting surface 222; third mounting surface 223; fourth mounting surface 224; fifth mounting surface 225; sixth mounting surface 226; first mounting hole 227; screen soft board assembly fixing screw 228; reinforcement plate 230; display screen 240; first connecting soft board 241; first gold finger 251; second gold finger 252; first protective soft board 261; second protective soft board 262;

[0048] Optical module 300; optical module bracket 310; bracket bottom plate 311; first mounting frame 312; second mounting frame 313; second mounting hole 314; optical module fixing screw 315; sensor assembly 320; sensor bracket 321; sensor 322; gasket 323; sensor PCB board 324; second connecting soft board 3241; sensor lens assembly 330; sensor lens 331; filter 332; laser assembly 340; laser emitter 341; laser lens 342; aperture piece 343; laser PCB board 344; third connecting soft board 3441; laser thermal pad 345; compression foam 346;

[0049] Mainboard 400; mainboard fixing screws 401; mainboard thermal pad 410; electromagnetic shielding layer 420; electromagnetic insulation block 430; anti-short circuit block 440;

[0050] FPC socket 500; cable 600. DETAILED DESCRIPTION

[0051] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field based on the present application belong to the scope of protection of the present application.

[0052] As mentioned in the background technology, the screen PCB board of the laser displacement sensor can usually be a hard board, a soft board or a hard-soft board. Among them, the hard board can better resist vibration and impact, but it cannot be bent and cannot be used in environments that require bending or are space-constrained; the soft board has good flexibility, but poor rigidity and cannot resist vibration and impact; when the flexible part and the rigid part of the hard-soft board are assembled, the complexity of bending and wiring is high, and it is not easy to restore after disassembly.

[0053] See also Figures 1a to 2b , Figure 1a A three-dimensional structural diagram of a laser displacement sensor according to an embodiment of the present application; Figure 1b for Figure 1a An exploded schematic diagram of the laser displacement sensor shown; Figure 1c for Figure 1b A top view of the laser displacement sensor shown; Figure 2a for Figure 1b A three-dimensional structural diagram of the screen soft board assembly at one angle; Figure 2b for Figure 2a A three-dimensional structural diagram of the screen soft board assembly from another angle.

[0054] like Figures 1a to 2b As shown, in order to reduce the complexity of bending the screen PCB board, an embodiment of the present application provides a laser displacement sensor, including: a shell assembly 100, a screen soft board assembly 200 and an optical module 300; the communication connection between the screen soft board assembly 200 and the optical module 300 is both arranged inside the shell assembly 100.

[0055] The screen soft board assembly 200 includes: a screen PCB board 210 and a screen PCB board bracket 220; the screen PCB board bracket 220 is connected to the housing assembly 100.

[0056] The screen PCB board 210 is a soft board, and the screen PCB board 210 is arranged around the screen PCB board bracket 220; a device area 211 is arranged on the surface of the screen PCB board 210, and a reinforcement plate 230 is arranged between the back side of the device area 211 and the screen PCB board bracket 220, and the reinforcement plate 230 is bonded to the device area 211 and the screen PCB board bracket 220.

[0057] The embodiment of the present application provides such a laser displacement sensor, wherein the screen PCB board 210 is a soft board, and a reinforcement plate 230 is arranged on the back side of the device area 211 for welding electronic components. This method of adding local reinforcement to the screen PCB soft board 210 can not only ensure that the screen PCB board 210 can be bent and the device area 211 welded with electronic components can withstand vibration and impact, but also reduce the complexity of bending the screen PCB board 210 by surrounding the screen PCB board 210 on the screen PCB board bracket 220.

[0058] In some embodiments of the present application, see Figure 3a and Figure 3b , Figure 3a for Figure 1b The three-dimensional structure diagram of the screen PCB board is shown; Figure 3b for Figure 3a The following is a schematic diagram of the screen PCB board. Figure 3a and Figure 3b As shown, the screen soft board assembly 200 also includes: a display screen 240; the display screen 240 is electrically connected to the screen PCB board 210 through a first connecting soft board 241.

[0059] The screen PCB board 210 is further provided with a plurality of circuit areas 212 ; the screen PCB board 210 is bent at each circuit area 212 to surround and be disposed on the screen PCB board bracket 220 .

[0060] The circuit area 212 and the device area 211 are located on the same surface of the screen PCB board 210 , and the circuits on the circuit area 212 connect the electronic components on each device area 211 .

[0061] Specifically, the display screen 240 is used to display the current status information of the laser displacement sensor. The first connection soft board 241 and the subsequent second connection soft board 3241 and third connection soft board 3441 are flexible circuit boards, usually FPC. The first connection soft board 241 is specifically the FPC line of the display screen 240. Figures 2a to 3b As shown, the circuit area 212 and the device area 211 are located on the same surface of the screen PCB board 210, so that when bonding around the screen PCB board bracket 220, the circuits on the circuit area 212 and the electronic components on the device area 211 are all facing outwards.

[0062] By using the embodiment of the present application, the screen PCB board 210 is divided into a rigid device area 211 with a reinforcement plate 230 bonded thereto and a flexible circuit area 212 for bending, and in conjunction with the screen PCB board bracket 220, the bending complexity of the screen PCB board 210 can be reduced. Electronic components are arranged on the surface of the device area 211, and the back is reinforced, so that the space is reasonably utilized. In addition, compared with the prior art in which the PCB board is fixed by extrusion without rigid connection, the embodiment of the present application fixes the screen PCB board 210 by bonding the device area 211 to the screen PCB board bracket 220, thereby avoiding damage to the electronic components on the device area 211.

[0063] In some embodiments of the present application, Figure 3b As shown, the device region 211 includes a first device region 2111 , a second device region 2112 , a third device region 2113 , a fourth device region 2114 and a fifth device region 2115 .

[0064] The circuit area 212 includes a first circuit area 2121 , a second circuit area 2122 , a third circuit area 2123 and a fourth circuit area 2124 .

[0065] The shape of each device area 211 and circuit area 212 is rectangular or quasi-rectangular. The second device area 2112, the third device area 2113, the fourth device area 2114 and the fifth device area 2115 are arranged in a row and spaced apart; the second circuit area 2122, the third circuit area 2123 and the fourth circuit area 2124 are respectively arranged in the intervals between the second device area 2112, the third device area 2113, the fourth device area 2114 and the fifth device area 2115, and are connected to the device areas 211 at both ends.

[0066] The first device region 2111 is connected to the second device region 2112 through the first circuit region 2121 , and the connecting edge and the connecting edge between the second circuit region 2122 and the second device region 2112 are perpendicular edges to each other.

[0067] Specifically, Figure 3a and Figure 3b As shown, a reinforcing plate 230 is bonded to the back of each device area 211. In a specific embodiment, the reinforcing plates 230 on the back of the first device area 2111, the third device area 2113 and the fourth device area 2114 are reinforced with FR-4 material, and the reinforcing plates 230 on the back of the second device area 2112 and the fifth device area 2115 are reinforced with stainless steel plates. The second device area 2112 contacts the function button 163 on the housing assembly 100 to switch different functions, such as adjusting the sensing distance of the laser displacement sensor; the fifth device area 2115 contacts the setting button 162 on the housing assembly 100 to turn on or off the laser displacement sensor.

[0068] In the embodiment of the present application, each device area 211 and circuit area 212 is arranged at intervals so as to be bent and bonded to the screen PCB board bracket 220. It can be fully bent while ensuring the rigidity of the device area 211 to adapt to the size requirements of the whole machine and improve the space utilization inside the laser displacement sensor.

[0069] In some embodiments of the present application, see Figure 4a and Figure 4b , Figure 4a for Figure 2a A three-dimensional structural diagram of the screen PCB bracket at one angle; Figure 4b for Figure 4a The three-dimensional structure diagram of the screen PCB bracket from another angle is shown. Figure 4a and Figure 4b As shown, the peripheral side of the screen PCB board bracket 220 includes a first mounting surface 221, a second mounting surface 222, a third mounting surface 223, a fourth mounting surface 224, a fifth mounting surface 225 and a sixth mounting surface 226 which are connected in sequence end to end.

[0070] The second mounting surface 222 and the sixth mounting surface 226 are opposite to each other and are perpendicular to the first mounting surface 221 .

[0071] The third mounting surface 223 is inclined toward the first mounting surface 221 , and forms an acute angle with the second mounting surface 222 .

[0072] The fifth mounting surface 225 is inclined toward the sixth mounting surface 226 , and an acute angle is formed between the fifth mounting surface 225 and the sixth mounting surface 226 .

[0073] The bottom of the screen PCB board bracket 220 is fixedly connected to the inner bottom plate of the housing assembly 100 .

[0074] Specifically, Figure 4a and Figure 4b As shown, the internal space surrounded by the mounting surfaces of the screen PCB bracket 220 is a hollow structure, which not only ensures the rigidity and stability of the screen PCB bracket 220, but also reduces the weight of the screen PCB bracket 220. Figure 1c , Figure 4a and Figure 4b As shown, two first mounting holes 227 are provided in the inner space of the screen PCB board bracket 220, and two screen soft board assembly fixing screws 228 respectively pass through the two first mounting holes 227 to fix the screen PCB board bracket 220 on the inner bottom plate of the outer shell assembly 100.

[0075] By applying the embodiment of the present application, the screen PCB board bracket 220 is equipped with multiple mounting surfaces in different directions to cooperate with the bonded and bent screen PCB board 210, thereby reducing the bending complexity of the screen PCB board 210, adapting to the size requirements of the entire machine, and improving the space utilization inside the laser displacement sensor.

[0076] Below, according to Figures 2a to 3b , the correspondence between each area of ​​the screen PCB board 210 and the screen PCB board bracket 220 is described in detail.

[0077] In some embodiments of the present application, the first device region 2111 is bonded to the first mounting surface 221 .

[0078] The first connection flexible board 241 and the first circuit area 2121 are bent toward the back side of the first device area 2111 , and the back side of the display screen 240 and the back side of the second device area 2112 are both bonded to the back side of the first device area 2111 .

[0079] After bonding, the display screen 240 is aligned with the edge of the second device area 2112 , wherein the length of the first device area 2111 is greater than or equal to the sum of the lengths of the display screen 240 and the second device area 2112 ; the length of the first mounting surface 221 is greater than the length of the first device area 2111 .

[0080] In some embodiments of the present application, the second circuit region 2122 is bent relative to the second device region 2112 , bypassing the second mounting surface 222 and extending to the third mounting surface 223 .

[0081] The back side of the third device area 2113 is bonded to the third mounting surface 223 , and the first protective soft board 261 is bent toward the third device area 2113 and bonded to the third device area 2113 , wherein the length of the third mounting surface 223 is greater than that of the third device area 2113 .

[0082] In some embodiments of the present application, the third circuit region 2123 is bent relative to the third device region 2113 , adheres to the fourth mounting surface 224 , and extends to the fifth mounting surface 225 .

[0083] The back side of the fourth device area 2114 is bonded to the fifth mounting surface 225 , and the second protective soft board 262 is bent toward the fourth device area 2114 and bonded to the fourth device area 2114 , wherein the length of the fifth mounting surface 225 is greater than that of the fourth device area 2114 .

[0084] In some embodiments of the present application, the fourth circuit region 2124 is bent to the sixth mounting surface 226 relative to the fourth device region 2114 , and the back side of the fifth device region 2115 is bonded to the sixth mounting surface 226 , wherein the length of the sixth mounting surface 226 is greater than the length of the fifth device region 2115 .

[0085] By applying the above-mentioned embodiment of the present application, each device area 211 bonded with the reinforcement plate 230 is bonded to the mounting surface of the screen PCB board bracket 220, and each circuit area 212 is bent around the mounting surface or edge of the screen PCB board bracket 220. By means of this bonding and bending method of the screen PCB board 210 in conjunction with the screen PCB board 210, the bending complexity of the screen PCB board 210 can be reduced, the size requirements of the whole machine can be adapted, and the space utilization rate inside the laser displacement sensor can be improved.

[0086] In some embodiments of the present application, Figure 3a and Figure 3b As shown, the third device area 2113 and the fourth device area 2114 are connected to the first protective soft board 261 and the second protective soft board 262 respectively; the first protective soft board 261 and the second protective soft board 262 are arranged in the same direction as the first device area 2111. The first protective soft board 261 and the second protective soft board 262 are bent toward the third device area 2113 and the fourth device area 2114 respectively, and are arranged between the third device area 2113 and the optical module 300 and between the fourth device area 2114 and the optical module 300 respectively.

[0087] Specifically, the first protective soft board 261 is bent and bonded to the surface of the third device area 2113, and the second protective soft board 262 is bent and bonded to the surface of the fourth device area 2114. By using the embodiment of the present application, the first protective soft board 261 and the second protective soft board 262 can isolate the electromagnetic interference of the bottom of the housing and the electronic components.

[0088] In some embodiments of the present application, see Figure 5 , Figure 5 for Figure 2a The diagram below shows the connection between the screen soft board assembly and the main board. Figure 1b , Figure 3b and Figure 5 As shown, the laser displacement sensor further includes: a main board 400 ; the main board 400 is disposed inside the housing assembly 100 .

[0089] The first device area 2111 is provided with a first gold finger 251, which is provided on a side opposite to the first circuit area 2121. The display screen 240 is electrically connected to the first device area 2111 through a first connection flexible board 241, and is located on one side of the first gold finger 251.

[0090] The second golden finger 252 is disposed on the fifth device area 2115 . The first golden finger 251 and the second golden finger 252 extend in opposite directions. The first golden finger 251 and the second golden finger 252 are bent toward the mainboard 400 and are electrically connected to the mainboard 400 .

[0091] Specifically, two FPC sockets are provided on the mainboard 400, which are plugged into the first gold finger 251 and the second gold finger 252. Figure 1c As shown, the mainboard 400 is fixedly connected to the screen PCB bracket 220 and the housing assembly 100 respectively through two mainboard fixing screws 401. By applying the embodiment of the present application, the communication connection between the screen PCB board 210 and the mainboard 400 can be achieved through the first gold finger 251 and the second gold finger 252.

[0092] In some embodiments of the present application, see Figure 6a and Figure 6b , Figure 6a for Figure 1b A three-dimensional structural diagram of the optical module shown; Figure 6b for Figure 6a The exploded schematic diagram of the optical module is shown in FIG. Figure 6a and Figure 6b As shown, the optical module 300 includes: an optical module bracket 310 fixedly connected to the housing assembly 100 , and a sensor assembly 320 , a sensor lens assembly 330 and a laser assembly 340 arranged on the optical module bracket 310 .

[0093] The sensor lens assembly 330 and the laser assembly 340 are arranged at an angle, and the sensor assembly 320 is arranged behind the sensor lens assembly 330 .

[0094] The laser light generated by the laser assembly 340 passes through the housing assembly 100 , is reflected by the object to be measured, passes through the sensor lens assembly 330 , and is received by the sensor assembly 320 .

[0095] The sensor assembly 320 and the laser assembly 340 are both communicatively connected to the screen PCB board 210 .

[0096] Using the embodiment of the present application, the laser displacement sensor transmits a signal to the laser component 340 through the screen PCB board 210, and the sensor component 320 converts the optical signal into an electrical signal and transmits it to the screen PCB board 210 to achieve measurement of the object to be measured.

[0097] In some embodiments of the present application, Figure 6a and Figure 6b As shown, the optical module bracket 310 includes a bracket base plate 311 , a first mounting frame 312 and a second mounting frame 313 .

[0098] The first installation frame 312 and the second installation frame 313 are arranged side by side on the bracket bottom plate 311; the first installation frame 312 is inclined relative to the second installation frame 313, and the inclination angle is an acute angle.

[0099] The sensor lens assembly 330 is fixed in the first installation frame 312 , and the laser assembly 340 is fixed in the second installation frame 313 ; the sensor assembly 320 is fixed on the bracket bottom plate 311 located behind the first installation frame 312 .

[0100] The bracket bottom plate 311 is arranged opposite to the screen PCB board bracket 220 , and the bottom is fixedly connected to the inner bottom plate of the housing assembly 100 .

[0101] Specifically, in this embodiment, Figure 6b As shown, three second mounting holes 314 are provided on the optical module bracket 310 , and three optical module fixing screws 315 pass through the three second mounting holes 314 respectively to fix the optical module bracket 310 on the inner bottom plate of the housing assembly 100 .

[0102] In applying the embodiment of the present application, the first mounting frame 312 is tilted relative to the second mounting frame 313, so that the sensor lens assembly 330 fixed in the first mounting frame 312 and the laser assembly 340 fixed in the second mounting frame 313 are arranged at an angle, so that the light emitted by the laser assembly 340 can enter the sensor lens assembly 330 after being reflected by the object to be measured.

[0103] In some embodiments of the present application, see Figure 7 , Figure 7 for Figure 1b The connection diagram of the screen soft board assembly and the optical module is shown in FIG. Figures 6a to 7 As shown, the sensor assembly 320 includes: a sensor bracket 321 , a sensor 322 and a gasket 323 .

[0104] The sensor bracket 321 is fixedly connected to the bracket bottom plate 311 , and is arranged tilted relative to the first installation frame 312 , with an acute angle of inclination; the gasket 323 is arranged between the sensor bracket 321 and the bracket bottom plate 311 .

[0105] The sensor 322 is fixed to a side of the sensor bracket 321 away from the sensor lens assembly 330 . A through hole is provided on the sensor bracket 321 so that the sensor 322 can receive the laser passing through the sensor lens assembly 330 .

[0106] A sensor PCB board 324 is provided on the sensor 322 , and the sensor PCB board 324 is communicatively connected with the screen PCB board 210 via a second connection soft board 3241 .

[0107] Specifically, the sensor bracket 321 and the optical module bracket 310 are fixed by glue dispensing, and a gasket 323 is placed between the two. One or more gaskets 323 can be set according to the actual installation, so that the height of the sensor 322 can be adjusted. Figure 3a and Figure 7As shown, in this embodiment, the two sides of the sensor PCB board 324 are respectively welded to the sensor 322 and the second connecting soft board 3241. The second connecting soft board 3241 is the FPC line of the sensor PCB board 324, and its interface on the screen PCB board 210 is set in the third device area 2113.

[0108] By applying the embodiment of the present application, the sensor assembly 320 can receive laser light through the sensor 322 and transmit signals to the screen PCB board 210 through the sensor PCB board 324; the height of the sensor 322 can be adjusted through the gasket 323, thereby reducing the influence of system errors on the measurement accuracy of the laser displacement sensor.

[0109] In some embodiments of the present application, the sensor lens assembly 330 includes: a sensor lens 331 and a filter 332; the sensor lens 331 and the filter 332 are sequentially arranged in the first installation frame 312 along the direction of the laser light path.

[0110] Using the embodiment of the present application, the sensor lens 331 and the filter 332 are fixed in the first mounting frame 312 by dispensing glue. The laser passes through the sensor lens 331 and the filter 332 in sequence. The filter 332 selectively passes light of a specific wavelength, which can improve the accuracy of the laser displacement sensor measurement.

[0111] In some embodiments of the present application, Figure 6a and Figure 6b As shown, the laser assembly 340 includes: a laser emitter 341, a laser lens 342 and an aperture plate 343 which are sequentially arranged along the laser light path.

[0112] A through hole for laser emission is provided inside the second installation frame 313 , and the laser emitter 341 is fixed at the rear end of the second installation frame 313 ; the laser lens 342 and the aperture piece 343 are fixed at the front end of the second installation frame 313 .

[0113] A laser PCB board 344 is disposed on the back of the laser emitter 341 , and the laser PCB board 344 is communicatively connected to the screen PCB board 210 via a third connecting flexible board 3441 .

[0114] A laser thermal pad 345 and a compression foam 346 are disposed on the back of the laser PCB board 344 , and the compression foam 346 presses the laser thermal pad 345 onto the second installation frame 313 .

[0115] Specifically, Figure 3a and Figure 7As shown, in this embodiment, the two sides of the laser PCB board 344 are welded to the laser emitter 341 and the third connection soft board 3441 respectively. The third connection soft board 3441 is the FPC line of the laser PCB board 344, and its interface on the screen PCB board 210 is set in the third device area 2113. The laser PCB board 344 is limited by the through hole for laser emission in the second installation frame 313, and is fixed to the second installation frame 313 by dispensing glue.

[0116] like Figure 1c , Figures 6a to 7 As shown, the laser thermal pad 345 is arranged between the laser PCB board 344 and the compression foam 346, and is L-shaped. The laser pin of the laser emitter 341 is inserted into the vertical surface of the laser thermal pad 345; the laser thermal pad 345 is in close contact with the laser PCB board 344, and the bottom of the laser thermal pad 345 is in contact with the bottom plate of the housing assembly 100. The laser heat is transferred to the housing assembly 100 through the compression of the optical module bracket 310. The compression foam 346 is arranged between the optical module bracket 310 and the screen soft board assembly 200. The laser thermal pad 345 is compressed by the extrusion between the optical module bracket 310 and the screen soft board assembly 200 to prevent the laser thermal pad 345 from falling off.

[0117] A thin gasket is provided at the bottom of the laser lens 342. The laser lens 342 and the thin gasket are fixed by glue dispensing, and the height of the laser contact surface can be adjusted by the thin gasket.

[0118] A glue hole is provided in the area on the top of the laser emitter 341 on the second mounting frame 313. After the laser emitter 341 is assembled, the laser emitter 341 can be pre-fixed through the glue hole to prevent the laser emitter 341 from vibrating during the subsequent internal transportation process, thereby affecting the measurement accuracy of the laser displacement sensor.

[0119] By applying the embodiment of the present application, the laser assembly 340 can emit laser through the laser emitter 341, and transmit signals with the screen PCB board 210 through the laser PCB board 344; the laser emitter 341 is promptly cooled through the laser thermal pad 345 to ensure the measurement accuracy of the laser displacement sensor; the laser thermal pad 345 is pressed by pressing the foam 346 to prevent the laser thermal pad 345 from falling off.

[0120] In some embodiments of the present application, see Figure 8 , Figure 8 for Figure 1b The three-dimensional structure diagram of the main housing is shown in FIG. Figure 1a , Figure 1b and Figure 8 As shown, the housing assembly includes a main housing 110 and a top cover plate 120 .

[0121] A circle of bosses 130 protrude inward from the side wall of the main housing 110 , and the top of the bosses 130 pushes up the top cover plate 120 ; the top cover plate 120 and the main housing 110 together form a rectangular parallelepiped.

[0122] The main housing 110 is used to accommodate the screen soft board assembly 200 and the optical module 300 ; the screen soft board assembly 200 is formed with a bending accommodation space 140 , and the optical module 300 is located in the bending accommodation space 140 .

[0123] Specifically, in this embodiment, the top cover plate 120 is bonded to the boss 130 by waterproof adhesive, the bending accommodation space 140 is formed on one side of the third device area 2113, the third circuit area 2123 and the fourth device area 2114, and the sensor component 320 and the laser component 340 of the optical module 300 face the screen soft board component 200 and are connected to the FPC seat 500 on the third device area 2113. Using the embodiment of the present application, the optical module 300 is arranged in the bending accommodation space 140, which improves the internal space utilization of the housing component 100.

[0124] In some embodiments of the present application, Figure 1a , Figure 1b and Figure 8 As shown, the housing assembly 100 further includes: a transparent cover plate 151 and a red semi-transparent cover plate 152 .

[0125] The side wall of the main housing 110 includes a first side wall 111 , a second side wall 112 , a third side wall 113 and a fourth side wall 114 which are connected in sequence.

[0126] The transparent cover plate 151 is arranged to cover the outside of the first side wall 111 and part of the outside of the second side wall 112 and the fourth side wall 114, and is used to correspond to the position of the display screen 240 of the screen soft board assembly 200. The red semi-transparent cover plate 152 is arranged outside the fourth side wall 114.

[0127] Specifically, the red translucent cover plate 152 is made of a red translucent material, which only allows red light to pass through, thereby improving the accuracy of the laser displacement sensor measurement.

[0128] In the embodiment of the present application, the transparent cover 151 is used to cover the front of the display screen 240 so that the user can obtain the current status information of the laser displacement sensor; the red translucent cover 152 is used to cover one side of the optical module 300, so that the laser emitted by the laser emitter 341 can pass through the red translucent cover 152 and be projected onto the object to be measured, and the reflected laser passes through the red translucent cover 152 and is received by the sensor lens assembly 330.

[0129] In some embodiments of the present application, Figure 8As shown, a light guide column 161 and a setting button 162 are disposed on the first side wall 111 covered by the transparent cover plate 151 .

[0130] A display window 1121 is disposed in the area of ​​the second side wall 112 covered by the transparent cover plate 151 , and the display screen 240 is opposite to the display window 1121 .

[0131] A function button 163 is disposed in an area on one side of the display window 1121 that is not covered by the transparent cover 151 .

[0132] The red translucent cover plate 152 is disposed outside the fourth side wall 114 , and the light emitting end and the light receiving end of the optical module 300 are directly opposite to the red translucent cover plate 152 .

[0133] Specifically, the light emitting end of the optical module 300 refers to the end where the aperture piece 343 is located, and the light receiving end refers to the end where the sensor lens 331 is located. The transparent cover plate 151, the red translucent cover plate 152 and the light guide column 161 are all attached to the main housing 110 by waterproof adhesive. The light guide column 161 is used to guide light to the indicator light arranged outside the main housing 110.

[0134] See also Fig. 9 , Fig. 9 for Figure 8 The three-dimensional structure diagram of the function keys is shown in FIG. Fig. 9 As shown, the setting button 162 and the function button 163 are both composed of a button cap 164 and a silicone button seat 165. In this embodiment, the number of button caps 164 of the function button 163 is three, which improves the interactivity of the displacement laser sensor.

[0135] In the prior art, the waterproofing of the keys is sealed by a metal cylindrical rod and an O-ring. Since the metal cylindrical rod needs to move axially in the guide hole inside the keys, the sealing is easily affected. The key cap 164 of the key 162 and the function key 163 extends through the side wall and out of the main housing 110; the silicone key seat 165 at the bottom is bonded to the inside of the side wall of the main housing 110 through the waterproof adhesive 166 on one side, and is tightened by the fifth device area 2115 and the second device area 2112 on the other side. Compared with the prior art, this embodiment adopts two measures, namely, bonding with the waterproof adhesive 166 and tightening the device area 211, to increase the reliability of the sealing at the keys.

[0136] When applying the embodiment of the present application, the display screen 240 is opposite to the display window 1121 so that the user can obtain the current status information of the laser displacement sensor; the light emitting end and the light receiving end of the optical module 300 are opposite to the red translucent cover plate 152, so that the laser emitted by the laser emitter 341 can pass through the red translucent cover plate 152 and be projected onto the object to be measured, and the reflected laser passes through the red translucent cover plate 152 and is received by the sensor lens assembly 330.

[0137] In some embodiments of the present application, see Fig.10 , Fig.10 for Figure 1b The figure shows an exploded schematic diagram of the various structures installed on the mainboard. Figure 1b and Fig.10 As shown, a mainboard thermal pad 410 is disposed on the top of the mainboard 400 ; an electromagnetic shielding layer 420 is disposed on the top of the mainboard thermal pad 410 .

[0138] The electromagnetic shielding layer 420 is welded to the mainboard 400, and the top of the electromagnetic shielding layer 420 is bonded to the top of the housing assembly 100 via a thermally conductive adhesive.

[0139] An electromagnetic insulating block 430 is disposed between the mainboard 400 and the side wall of the housing assembly 100 ; the electromagnetic insulating block 430 is bonded to the side wall by adhesive.

[0140] Specifically, Figure 1b and Fig.10 As shown, the electromagnetic shielding layer 420 is welded to a pad at a corner of the mainboard 400, and the components on the mainboard 400 are sequentially transferred to the top cover 120 through the mainboard thermal pad 410, the electromagnetic shielding layer 420, and the thermal conductive adhesive for heat dissipation. The electromagnetic insulating block 430 is limited by the upper surface of the mainboard 400 in the vertical direction.

[0141] Two mainboard fixing screws 401 are arranged on both sides of the mainboard 400 and are fixedly connected to the screen PCB board bracket 220 and the boss 130 of the shell assembly 100 respectively.

[0142] By using the embodiment of the present application, the electromagnetic insulation block 430 and the electromagnetic shielding layer 420 can isolate the electromagnetic interference of the side wall of the main housing 110 and the top cover 120. The heat dissipation of the mainboard 400 is transmitted through the mainboard thermal pad 410, the electromagnetic shielding layer 420 and the thermal conductive adhesive, which not only realizes the heat dissipation of the mainboard 400 but also realizes the bonding and fixing of the electromagnetic shielding layer 420.

[0143] In some embodiments of the present application, Figure 1b and Fig.10 As shown, the laser displacement sensor further includes: a cable 600 ; and a horizontal cable groove 115 is provided on the side wall of the housing assembly 100 .

[0144] An anti-short-circuit block 440 is pasted on the bottom of one corner of the mainboard 400. One end of the cable 600 passes through the anti-short-circuit block 440 and is welded to the mainboard 400, and the other end passes through the side wall of the outer shell assembly 100 and is embedded in the cable groove 115. A glue groove is formed between the side wall of the outer shell assembly 100 and the cable 600 for fixing the cable 600 by glue.

[0145] Specifically, the anti-short circuit block 440 can be made of plastic, and a plurality of through holes are provided on the anti-short circuit block 440, which are respectively aligned with the welding wire holes of the main board 400. The glue dispensing groove is a circle of gaps left between the cable 600 and the side wall of the main shell 110, which is fixed by glue filling to prevent air leakage of the laser displacement sensor. The cable skin is peeled off at one end of the cable 600 that enters the interior of the main shell 110 to expose the metal core, which passes through the anti-short circuit block 440 and the corresponding welding wire holes on the main board 400, and is fixed by soldering from the upper surface of the main board 400. The anti-short circuit block 440 can prevent the metal core part of the cable 600 from being squeezed and overlapped to cause a short circuit.

[0146] By using the embodiment of the present application, the cable 600 can be extended in two directions, and when bent 90 degrees, it will not protrude from the housing and will not affect the flatness of the surface. The cable groove 115 is provided to hide the cable 600, and the structure of the laser displacement sensor is more concise after the cable is hidden. By providing the anti-short circuit block 440, the metal core part of the cable 600 can be prevented from being squeezed and overlapped to cause a short circuit.

[0147] The above description is only a preferred embodiment of the present application and is not intended to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application are included in the protection scope of the present application.

Claims

1. A laser displacement sensor, characterized in that: include: A housing component (100), a screen soft board component (200) and an optical module (300); the screen soft board component (200) and the optical module (300) are communicatively connected and are both arranged inside the housing component (100); The screen soft board assembly (200) comprises: a screen PCB board (210) and a screen PCB board bracket (220); The screen PCB board bracket (220) is connected to the housing component (100); The screen PCB board (210) is a soft board, and the screen PCB board (210) is arranged around the screen PCB board bracket (220); a device area (211) is arranged on the surface of the screen PCB board (210), a reinforcing plate (230) is arranged between the back side of the device area (211) and the screen PCB board bracket (220), and the reinforcing plate (230) is fitted with the device area (211) and the screen PCB board bracket (220).

2. The laser displacement sensor according to claim 1, characterized in that: The screen soft board assembly (200) further comprises: a display screen (240); the display screen (240) is electrically connected to the screen PCB board (210) via a first connection soft board (241); The screen PCB board (210) is also provided with a plurality of circuit areas (212); the screen PCB board (210) is bent at each circuit area (212) to surround and be arranged on the screen PCB board bracket (220); The circuit area (212) and the device area (211) are located on the same surface of the screen PCB board (210), and the circuits on the circuit area (212) connect the electronic components on each device area (211).

3. The laser displacement sensor according to claim 2, characterized in that: The device region (211) includes: a first device region (2111), a second device region (2112), a third device region (2113), a fourth device region (2114) and a fifth device region (2115); The circuit area (212) includes: a first circuit area (2121), a second circuit area (2122), a third circuit area (2123) and a fourth circuit area (2124); The shape of each device area (211) and circuit area (212) is rectangular or quasi-rectangular; The second device area (2112), the third device area (2113), the fourth device area (2114) and the fifth device area (2115) are arranged in a row and spaced apart; the second circuit area (2122), the third circuit area (2123) and the fourth circuit area (2124) are respectively arranged in the space between the second device area (2112), the third device area (2113), the fourth device area (2114) and the fifth device area (2115), and are connected to the device areas (211) at both ends; The first device region (2111) is connected to the second device region (2112) via a first circuit region (2121), and the connecting edge and the connecting edge between the second circuit region (2122) and the second device region (2112) are perpendicular to each other.

4. The laser displacement sensor according to claim 3, characterized in that: It also includes: a main board (400); the main board (400) is arranged inside the housing component (100); A first gold finger (251) is arranged on the first device area (2111), and the first gold finger (251) is arranged on an edge opposite to the first circuit area (2121); The display screen (240) is electrically connected to the first device area (2111) via a first connection soft board (241). A second gold finger (252) is disposed on the fifth device area (2115), and the first gold finger (251) and the second gold finger (252) extend in opposite directions; The first gold finger (251) and the second gold finger (252) are bent toward the main board (400) and are electrically connected to the main board (400).

5. The laser displacement sensor according to claim 4, characterized in that: The third device area (2113) and the fourth device area (2114) are respectively connected with a first protective soft board (261) and a second protective soft board (262); the first protective soft board (261) and the second protective soft board (262) are arranged in the same direction as the first device area (2111); the first protective soft board (261) and the second protective soft board (262) are respectively bent toward the third device area (2113) and the fourth device area (2114), and are respectively arranged between the third device area (2113) and the optical module (300) and between the fourth device area (2114) and the optical module (300).

6. The laser displacement sensor according to claim 5, characterized in that: The peripheral side of the screen PCB board bracket (220) comprises a first mounting surface (221), a second mounting surface (222), a third mounting surface (223), a fourth mounting surface (224), a fifth mounting surface (225) and a sixth mounting surface (226) which are connected in sequence end to end; The second mounting surface (222) and the sixth mounting surface (226) are opposite to each other and are both perpendicular to the first mounting surface (221); The third mounting surface (223) is inclined toward the first mounting surface (221), and forms an acute angle with the second mounting surface (222); The fifth mounting surface (225) is inclined toward the sixth mounting surface (226), and the angle between the fifth mounting surface (225) and the sixth mounting surface (226) is an acute angle; The bottom of the screen PCB board bracket (220) is fixedly connected to the inner bottom plate of the housing assembly (100).

7. The laser displacement sensor according to claim 6, characterized in that: The first device region (2111) is bonded to the first mounting surface (221); The first connection soft board (241) and the first circuit area (2121) are bent toward the back side of the first device area (2111), and the back side of the display screen (240) and the back side of the second device area (2112) are both bonded to the back side of the first device area (2111); After bonding, the display screen (240) is aligned with the edge of the second device area (2112), wherein the length of the first device area (2111) is greater than or equal to the sum of the lengths of the display screen (240) and the second device area (2112); and the length of the first mounting surface (221) is greater than the length of the first device area (2111).

8. The laser displacement sensor according to claim 7, characterized in that: The second circuit area (2122) is bent relative to the second device area (2112), bypassing the second mounting surface (222) and extending to the third mounting surface (223); The back side of the third device area (2113) is bonded to the third mounting surface (223), and the first protective soft board (261) is bent toward the third device area (2113) and bonded to the third device area (2113), wherein the length of the third mounting surface (223) is greater than the length of the third device area (2113).

9. The laser displacement sensor according to claim 8, characterized in that: The third circuit area (2123) is bent relative to the third device area (2113), adheres to the fourth mounting surface (224), and extends to the fifth mounting surface (225); The back side of the fourth device area (2114) is bonded to the fifth mounting surface (225), and the second protective soft board (262) is bent toward the fourth device area (2114) and bonded to the fourth device area (2114), wherein the length of the fifth mounting surface (225) is greater than the length of the fourth device area (2114).

10. The laser displacement sensor according to claim 9, characterized in that: The fourth circuit area (2124) is bent relative to the fourth device area (2114) to the sixth mounting surface (226), and the back side of the fifth device area (2115) is bonded to the sixth mounting surface (226), wherein the length of the sixth mounting surface (226) is greater than the length of the fifth device area (2115).

11. The laser displacement sensor according to claim 4, characterized in that: A mainboard thermal pad (410) is disposed on the top of the mainboard (400); an electromagnetic shielding layer (420) is disposed on the top of the mainboard thermal pad (410); The electromagnetic shielding layer (420) is welded to the mainboard (400), and the top of the electromagnetic shielding layer (420) is bonded to the top of the housing component (100) via a thermally conductive adhesive; An electromagnetic insulation block (430) is arranged between the mainboard (400) and the side wall of the housing component (100); the electromagnetic insulation block (430) is bonded to the side wall via adhesive.

12. The laser displacement sensor according to claim 4, characterized in that: Also includes: Cable (600); a horizontal cable groove (115) is provided on the side wall of the housing component (100); An anti-short circuit block (440) is pasted on the bottom of one corner of the main board (400); one end of the cable (600) passes through the anti-short circuit block (440) and is welded to the main board (400); and the other end passes through the side wall of the housing component (100) and is embedded in the cable groove (115); A glue-dispensing groove is formed between the side wall of the housing component (100) and the cable (600) for fixing the cable (600) by glue-dispensing.

13. The laser displacement sensor according to claim 1, characterized in that: The optical module (300) comprises: an optical module bracket (310) fixedly connected to the housing component (100), and a sensor component (320), a sensor lens component (330) and a laser component (340) arranged on the optical module bracket (310); The sensor lens assembly (330) and the laser assembly (340) are arranged at an angle, and the sensor assembly (320) is arranged behind the sensor lens assembly (330); The laser light generated by the laser assembly (340) passes through the housing assembly (100), is reflected by the object to be measured, passes through the sensor lens assembly (330), and is received by the sensor assembly (320); The sensor component (320) and the laser component (340) are both communicatively connected to the screen PCB board (210).

14. The laser displacement sensor according to claim 13, characterized in that: The optical module bracket (310) comprises a bracket bottom plate (311), a first installation frame (312) and a second installation frame (313); The first installation frame (312) and the second installation frame (313) are arranged side by side on the bracket bottom plate (311); the first installation frame (312) is inclined relative to the second installation frame (313), and the inclination angle is an acute angle; The sensor lens assembly (330) is fixed in the first installation frame (312), and the laser assembly (340) is fixed in the second installation frame (313); the sensor assembly (320) is fixed on the bracket bottom plate (311) located behind the first installation frame (312); The support base plate (311) is arranged opposite to the screen PCB board support (220), and the bottom is fixedly connected to the inner base plate of the housing component (100).

15. The laser displacement sensor according to claim 14, characterized in that: The sensor assembly (320) comprises: a sensor bracket (321), a sensor (322) and a gasket (323); The sensor bracket (321) is fixedly connected to the bracket bottom plate (311), and is arranged obliquely relative to the first installation frame (312), and the inclination angle is an acute angle; the gasket (323) is arranged between the sensor bracket (321) and the bracket bottom plate (311); The sensor (322) is fixed to a side of the sensor bracket (321) away from the sensor lens assembly (330), and a through hole is provided on the sensor bracket (321) so that the sensor (322) can receive laser light passing through the sensor lens assembly (330); The sensor (322) is provided with a sensor PCB board (324), and the sensor PCB board (324) is communicatively connected to the screen PCB board (210) via a second connection soft board (3241).

16. The laser displacement sensor according to claim 14, characterized in that: The sensor lens assembly (330) comprises: a sensor lens (331) and a filter (332); the sensor lens (331) and the filter (332) are sequentially arranged in the first installation frame (312) along the direction of the laser light path.

17. The laser displacement sensor according to claim 14, characterized in that: The laser assembly (340) comprises: a laser emitter (341), a laser lens (342) and an aperture plate (343) which are arranged in sequence along the direction of the laser light path; A through hole for laser emission is provided inside the second installation frame (313); the laser emitter (341) is fixed at the rear end of the second installation frame (313); the laser lens (342) and the aperture plate (343) are fixed at the front end of the second installation frame (313); A laser PCB board (344) is arranged on the back of the laser emitter (341), and the laser PCB board (344) is communicatively connected to the screen PCB board (210) via a third connection soft board (3441); A laser thermal pad (345) and a compression foam (346) are provided on the back of the laser PCB board (344), and the compression foam (346) compresses the laser thermal pad (345) onto the second installation frame (313).

18. The laser displacement sensor according to claim 2, characterized in that: The housing assembly comprises: a main housing (110) and a top cover plate (120); A circle of bosses (130) protrude inwards from the side wall of the main shell (110), and the top of the bosses (130) lifts up the top cover plate (120); the top cover plate (120) and the main shell (110) together form a rectangular parallelepiped; The main housing (110) is used to accommodate the screen soft board assembly (200) and the optical module (300); the screen soft board assembly (200) is formed with a bending accommodation space (140), and the optical module (300) is located in the bending accommodation space (140).

19. The laser displacement sensor according to claim 18, characterized in that: The housing assembly (100) further comprises: a transparent cover plate (151) and a red semi-transparent cover plate (152); The side wall of the main housing (110) comprises a first side wall (111), a second side wall (112), a third side wall (113) and a fourth side wall (114) which are connected in sequence. The transparent cover plate (151) is configured to cover the outside of the first side wall (111) and part of the outside of the second side wall (112) and the fourth side wall (114); and is used to correspond to the position of the display screen (240) of the screen soft board assembly (200); The red translucent cover plate (152) is arranged outside the fourth side wall (114), and the light emitting end and the light receiving end of the optical module (300) are directly opposite to the red translucent cover plate (152).

20. The laser displacement sensor according to claim 19, characterized in that: A light guide column (161) and a setting button (162) are arranged on the first side wall (111) covered by the transparent cover plate (151); A display window (1121) is provided in the area of ​​the second side wall (112) covered by the transparent cover plate (151), and the display screen (240) is opposite to the display window (1121); Function keys (163) are arranged in an area located on one side of the display window (1121) and not covered by the transparent cover plate (151).

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