Transceiver chip radiator, ultrasonic mainboard and ultrasonic equipment

Abstract

The invention discloses a transceiver chip radiator, an ultrasonic mainboard and ultrasonic equipment, and the transceiver chip radiator comprises a radiator substrate which is suitable for covering all transceiver chips on the mainboard; the plurality of radiating fins extend along the length direction of the radiator substrate and are arranged at intervals along the width direction of the radiator substrate; a first flow guide groove is formed between every two adjacent heat dissipation fins. Each heat dissipation fin is provided with a notch groove, and the multiple notch grooves corresponding to the positions of the multiple heat dissipation fins are arranged in the same direction to form second flow guide grooves. By arranging the second diversion trenches to be matched with the first diversion trenches, the airflow flowing path is increased, heat can be prevented from being accumulated in the first diversion trenches to generate heat transfer resistance, and therefore the heat dissipation effect can be improved; the design that the heat dissipation effect is improved by arranging the second flow guide grooves replaces the design that the heat dissipation effect is improved by additionally arranging a heat dissipation fan to enable the heat dissipation fan to directly face the first flow guide grooves, the width size of the equipment cannot be increased, and miniaturization of the equipment is facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of medical devices, and in particular to a transceiver chip radiator, an ultrasonic mainboard and an ultrasonic device. Background Art

[0002] The ultrasonic device includes a housing and a mainboard disposed in the housing. An air inlet and an air outlet are respectively disposed on opposite sides of the housing. A cooling fan module is installed at the air outlet. Functional modules such as a data processing module, a power module, a signal processing module, a transceiver chip, and an ultrasonic probe module are integrated on the mainboard. The data processing module, the power module, the signal processing module, the transceiver chip, and the ultrasonic probe module are all located on one side of the mainboard close to the cooling fan module and are arranged in sequence along the length direction of the mainboard.

[0003] Usually, the cooling fan module is located in the middle of the air outlet side of the housing, and the cooling fan module is composed of one or more fans. Since the power module and the signal processing module generate a large amount of heat, in order to facilitate the heat dissipation of the power module and the signal processing module, the power module and the signal processing module are arranged directly opposite the cooling fan module.

[0004] In the prior art, the installation space on the mainboard is limited, while the number of transceiver chips on the mainboard is relatively large, and the installation space required for multiple transceiver chips in the width direction of the mainboard is relatively large. During operation, since the transceiver chip needs to send and receive a large amount of information, the transceiver chip does more work per unit time and generates more heat. If the heat cannot be dissipated well inside the shell, it will cause the ultrasonic equipment to heat up and cause damage to the ultrasonic equipment. If the number of cooling fans on the cooling fan module is increased, the added cooling fans can be set directly opposite the transceiver chip. Although this can improve the heat dissipation effect of the transceiver chip, given that the installation space required for the transceiver chip in the width direction of the mainboard is relatively large, if cooling fans are added, the shell width of the ultrasonic equipment will increase, which is not conducive to the miniaturization design of the ultrasonic equipment.

[0005] Therefore, how to improve the heat dissipation efficiency of the transceiver chip on the mainboard without increasing the overall width of the ultrasonic equipment is a technical problem that needs to be solved urgently. Summary of the invention

[0006] Therefore, the technical problem to be solved by the present invention is how to improve the heat dissipation efficiency of the transceiver chip on the mainboard without increasing the overall width of the ultrasonic device, thereby providing a transceiver chip heat sink, an ultrasonic mainboard and an ultrasonic device.

[0007] In order to solve the above technical problems, the technical solution of the present invention is as follows:

[0008] A transceiver chip radiator, comprising:

[0009] A heat sink substrate, suitable for covering all transceiver chips on the mainboard;

[0010] A plurality of heat sink fins extend along the length direction of the heat sink substrate and are arranged at intervals along the width direction of the heat sink substrate; a first guide groove is formed between two adjacent heat sink fins; each heat sink fin is provided with a notch groove, and a plurality of notch grooves corresponding to positions on the plurality of heat sink fins are arranged in the same direction to form a second guide groove.

[0011] Furthermore, the notched grooves on the heat dissipation fins at the edge positions on both sides penetrate the first guide grooves and the external space, and the notched grooves on the heat dissipation fins at the middle position penetrate two adjacent first guide grooves.

[0012] Furthermore, the guide direction of the second guide groove points to a position where a heat dissipation fan module is installed on the air outlet side of the mainboard.

[0013] Furthermore, there are multiple notch grooves arranged at intervals along the length direction of the heat sink fins; along the length direction of the heat sink fins, the multiple notch grooves are first-level notch grooves, second-level notch grooves,..., N-level notch grooves in sequence, and the notch grooves at the same level on the multiple heat sink fins are arranged along the same direction to form the second guide groove.

[0014] Furthermore, two groove side surfaces of the notch groove are inclined surfaces, and the groove side surfaces on the same side of the notch groove at the same level are arranged in the same plane.

[0015] Furthermore, an airflow turning angle of the airflow flowing from the first guide groove to the second guide groove is α, and a value range of α is 90°<α<180°.

[0016] Furthermore, it also includes a radiator heat pipe located on the side of the radiator substrate facing away from the heat dissipation fins, and a heat-conducting medium is filled between adjacent radiator heat pipes and between the radiator heat pipe and the radiator substrate.

[0017] 1. The transceiver chip heat sink provided by the present invention has a heat sink substrate covering all transceiver chips on the main board, a plurality of heat sinks extend along the length direction of the heat sink substrate and are arranged at intervals along the width direction of the heat sink substrate, a first guide groove is formed between two adjacent heat sinks, each heat sink is provided with a notch groove, and a plurality of notches corresponding to the positions on the plurality of heat sinks are arranged in the same direction to form a second guide groove. In this way, the airflow entering the first guide groove can partially flow out from the second guide groove. Compared with only guiding the airflow direction through the first guide groove, the path for the airflow to carry away heat is increased, and heat accumulation in the first guide groove to generate heat transfer resistance can be avoided, thereby improving the heat dissipation effect. The design of improving the heat dissipation effect by setting the second guide groove replaces the design of additionally adding a heat dissipation fan to face the first guide groove to improve the heat dissipation effect. The width of the device will not be increased, which is conducive to the miniaturization of the device.

[0018] 2. In the transceiver chip heat sink provided by the present invention, the guide direction of the second guide groove points to the position where the cooling fan module is installed on the air outlet side of the mainboard. In this way, the airflow carrying heat is facilitated to flow quickly to the cooling fan module so that it can be quickly discharged from the device.

[0019] 3. In the transceiver chip heat sink provided by the present invention, the airflow turning angle of the airflow flowing from the first guide groove to the second guide groove is α, and the value range of α is 90°<α<180°. In this way, the influence of the second guide groove on the airflow velocity can be minimized, the airflow is avoided from bending back, and the airflow carrying heat is ensured to flow quickly to the cooling fan module.

[0020] 4. The transceiver chip heat sink provided by the present invention also includes a heat pipe located on the side of the heat sink substrate facing away from the heat sink fins. The setting of the heat pipe can reduce the temperature difference between the position close to the heat source and the position far away from the heat source on the transceiver chip heat sink, thereby improving the efficiency of heat radiation to the outside at each position on the transceiver chip heat sink. A heat conductive medium is filled between adjacent heat pipes and between the heat pipes and the heat sink substrate. This is beneficial for quickly transferring the heat generated by the transceiver chip to the heat sink substrate.

[0021] An ultrasonic mainboard comprises a mainboard, a signal processing module and a transceiver chip integrated on the mainboard, the mainboard having an air inlet side and an air outlet side arranged relatively to each other, the air outlet side of the mainboard being equipped with a cooling fan module for driving airflow from the air inlet side of the mainboard to the air outlet side of the mainboard, the signal processing module and the cooling fan module being arranged opposite to each other, the transceiver chip being located on one side of the signal processing module, an air duct opening being formed between the signal processing module and the cooling fan module, the transceiver chip being provided with the aforementioned transceiver chip radiator, and the guide direction of the second guide groove of the transceiver chip radiator pointing to the air duct opening.

[0022] Furthermore, the signal processing module is provided with a guide slope at a position corresponding to the air duct opening to facilitate airflow to flow through the air duct opening to the cooling fan module.

[0023] 1. The ultrasonic mainboard provided by the present invention has all the advantages of the aforementioned transceiver chip heat sink.

[0024] 2. In the ultrasonic mainboard provided by the present invention, the signal processing module and the cooling fan module are arranged opposite to each other, which is conducive to accelerating the discharge of heat generated during the operation of the signal processing module. The transceiver chip is located on one side of the signal processing module, which is conducive to making full use of the limited space on the mainboard and making the arrangement of components on the mainboard more compact. An air duct opening is formed between the signal processing module and the cooling fan module, and the transceiver chip is provided with the aforementioned transceiver chip heat sink. The guide direction of the second guide groove of the transceiver chip heat sink points to the air duct opening. In this way, the heat-carrying airflow flowing out of the second guide groove will flow directly to the air duct opening, thereby improving the heat dissipation efficiency.

[0025] An ultrasonic device comprises a shell and the ultrasonic mainboard arranged in the shell, wherein an air inlet and an air outlet are arranged on opposite sides of the shell, the air inlet side of the mainboard is arranged corresponding to the air inlet of the shell, and the air outlet side of the mainboard is arranged corresponding to the air outlet of the shell.

[0026] The technical solution of the present invention has the following advantages:

[0027] The ultrasonic device provided by the present invention has all the advantages of the aforementioned ultrasonic mainboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 It is a three-dimensional schematic diagram of an ultrasonic mainboard without a transceiver chip heat sink in the present invention;

[0030] Figure 2 It is a three-dimensional schematic diagram of an ultrasonic mainboard provided with a transceiver chip heat sink in the present invention;

[0031] Figure 3 A top view of the transceiver chip heat sink of the present invention;

[0032] Figure 4 It is a partial enlarged view of the heat sink of the transceiver chip of the present invention;

[0033] Figure 5 The figure is a bottom view of the transceiver chip heat sink of the present invention.

[0034] Description of reference numerals:

[0035] 1. Main board; 11. Air inlet side; 12. Air outlet side; 2. Data processing module; 3. Power module; 4. Signal processing module; 41. Guide slope; 5. Transceiver chip; 6. Ultrasonic probe module; 7. Transceiver chip heat sink; 71. Heat sink substrate; 72. Heat sink fins; 73. First guide groove; 74. Notch groove; 75. Second guide groove; 76. Heat sink heat pipe; 8. Air duct outlet; 9. Cooling fan module. DETAILED DESCRIPTION

[0036] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0038] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0040] Example

[0041] like Figures 1 to 5As shown, this embodiment provides an ultrasonic device, including a housing and an ultrasonic mainboard arranged in the housing. An air inlet and an air outlet are respectively arranged on opposite sides of the housing.

[0042] exist Figure 1 From the perspective of the ultrasound main board, the ultrasound main board includes a main board 1, and a data processing module 2, a power module 3, a signal processing module 4, multiple transceiver chips 5, and an ultrasound probe module 6 which are integrated on the main board 1 from left to right.

[0043] The main board 1 has an air inlet side 11 and an air outlet side 12 that are relatively arranged. The air inlet side 11 of the main board 1 is arranged corresponding to the air inlet of the shell, and the air outlet side 12 of the main board 1 is arranged corresponding to the air outlet of the shell. The air outlet side 12 of the main board 1 is provided with a notch (not marked), and a cooling fan module 9 is embedded in the notch for driving the air flow from the air inlet side 11 of the main board 1 to the air outlet side 12 of the main board 1. Since the cooling fan module 9 is embedded in the notch, it is helpful to reduce the width of the ultrasonic equipment. Of course, the air outlet side 12 of the main board 1 may not be provided with a notch, then the cooling fan module 9 is directly arranged on the main board 1, rather than embedded in the notch on the main board 1. The cooling fan module 9 includes a plurality of cooling fans.

[0044] The signal processing module 4 is arranged opposite to the cooling fan module 9 to enhance the cooling effect of the signal processing controller in the signal processing module 4. The transceiver chip 5 is located on one side of the signal processing module 4. A heat sink of the signal processing controller is provided above the signal processing controller to further enhance the cooling effect of the signal processing controller. The heat sink of the signal processing controller covers the entire signal processing controller to better dissipate heat for the signal processing controller. An air duct opening 8 is formed between the signal processing module 4 and the cooling fan module 9, and a guide slope 41 is provided at a position corresponding to the air duct opening 8 on the signal processing module 4 to facilitate the airflow to flow through the air duct opening 8 to the cooling fan module 9.

[0045] A transceiver chip heat sink 7 is provided on the transceiver chip 5 to dissipate the heat generated during the operation of the transceiver chip 5. The head end of the transceiver chip heat sink 7 is adjacent to the air inlet side of the mainboard 1, and the tail end of the transceiver chip heat sink 7 is adjacent to the air outlet side 12 of the mainboard 1. The transceiver chip heat sink 7 includes a heat sink substrate 71, a plurality of heat sink fins 72, a plurality of heat sink heat pipes 76, and a heat conducting medium.

[0046] The heat sink substrate 71 is suitable for covering the tops of all the transceiver chips 5 on the mainboard 1 to ensure heat dissipation of each transceiver chip 5 .

[0047] The plurality of heat sink fins 72 are all in the shape of sheets and are arranged perpendicular to the heat sink substrate 71. The plurality of heat sink fins 72 extend along the length direction of the heat sink substrate 71 and are arranged at intervals along the width direction of the heat sink substrate 71. A first guide groove 73 is formed between two adjacent heat sink fins 72. Since the heat sink fins 72 are in the shape of sheets and have a large surface area, the airflow entering the first guide groove 73 has a large contact area with the heat sink fins 72, and the airflow can efficiently take away the heat emitted by the heat sink fins 72 on both sides, thereby improving the heat dissipation effect on the transceiver chip 5.

[0048] In particular, each heat sink fin 72 is provided with a notch groove 74. A plurality of notch grooves 74 corresponding to the positions on a plurality of heat sink fins 72 are arranged in the same direction to form a second guide groove 75, and a plurality of second guide grooves 75 are parallel to each other. Specifically, a plurality of notch grooves 74 are arranged at intervals along the length direction of each heat sink fin 72. Along the length direction of each heat sink fin 72, extending from the head end to the tail end of the transceiver chip heat sink 7, a plurality of notch grooves 74 are sequentially a first-level notch groove, a second-level notch groove, ..., an N-th-level notch groove. The notch grooves 74 at the same level on a plurality of heat sink fins 72 are arranged in the same direction to form the aforementioned second guide groove 75. The notch grooves 74 on the heat dissipation fins 72 at the edge positions on both sides penetrate the first guide grooves 73 and the external space, while the notch grooves 74 on the heat dissipation fins 72 at the middle position penetrate the two adjacent first guide grooves 73, and the guiding direction of the second guide groove 75 points to the position where the heat dissipation fan module 9 is installed on the air outlet side 12 of the mainboard 1, so that the airflow on both sides of the transceiver chip heat sink 7 can easily flow to the air duct opening 8 through the second guide groove 75. In addition, the two groove sides of each notch groove 74 are inclined surfaces, and the same side groove sides of the notch grooves 74 of the same level are arranged in the same plane, so that it is conducive to the airflow to flow in the same direction along the second guide groove 75. Furthermore, the airflow turning angle of the airflow from the first guide groove 73 to the second guide groove 75 is α, and the value range of α is 90°<α<180°. In this way, the influence of the second guide groove 75 on the airflow velocity can be minimized, the airflow is avoided from flowing back, and the airflow carrying heat is ensured to flow quickly to the heat dissipation fan module 9.

[0049] The heat pipe 76 of the radiator is installed on the side of the radiator substrate 71 facing away from the heat dissipation fins 72. The setting of the heat pipe 76 of the radiator can reduce the temperature difference between the position close to the heat source and the position far away from the heat source on the transceiver chip radiator 7, thereby improving the efficiency of heat radiation from each position on the transceiver chip radiator 7. A heat conducting medium is filled between adjacent heat pipes of the radiator 76 and between the heat pipe 76 of the radiator and the radiator substrate 71. In this embodiment, the heat conducting medium is heat conducting silica gel.

[0050] The following describes the working process of the heat dissipation device for the transceiver chip 5 provided in this embodiment:

[0051] The transceiver chip 5 generates heat when it is working, and the heat is transferred to the heat pipe 76, the heat sink substrate 71, and the heat sink fins 72 in sequence through the thermally conductive silicone.

[0052] The cooling fan module 9 is turned on. Under the action of the cooling fan in the cooling fan module 9, the airflow entering the first guide groove 73 from the air inlet of the shell flows along the first guide groove 73. During the flow of the airflow, the airflow contacts the cooling fins 72 and absorbs the heat emitted by the cooling fins 72. The airflow carrying the heat flows forward along the first guide groove 73. After encountering the second guide groove 75, a part of the airflow enters the second guide groove 75 and flows along the second guide groove 75. After flowing out of the second guide groove 75, under the action of the cooling fan, this part of the airflow carrying the heat flows to The airflow carrying heat continues to flow along the first guide groove 73, encounters the second guide groove 75 one by one, is diverted by the second guide groove 75 one by one and reaches the air duct opening 8, and the rest of the airflow carrying heat continues to flow along the first guide groove 73, and finally, under the action of the cooling fan, flows out from the first guide groove 73 and reaches the air duct opening 8; no matter the airflow carrying heat flows out from the first guide groove 73 or the second guide groove 75 and reaches the air duct opening 8, it will be discharged from the ultrasonic equipment by the cooling fan module 9 after reaching the air duct opening 8, so as to avoid the inside of the ultrasonic equipment from getting hot.

[0053] In this embodiment, the guide direction of the second guide groove 75 points to the position where the cooling fan module 9 is installed on the air outlet side 12 of the mainboard 1, so that the airflow entering the first guide groove 73 can partially flow out from the second guide groove 75 and flow to the cooling fan module 9. Compared with only guiding the airflow direction through the first guide groove 73, the path for the airflow to carry away heat is increased, which can avoid the accumulation of heat in the first guide groove 73 and the generation of heat transfer resistance, thereby improving the heat dissipation effect. The design of improving the heat dissipation effect by setting the second guide groove 75 replaces the design of adding an additional cooling fan to face the first guide groove 73 to improve the heat dissipation effect. The width dimension of the ultrasonic equipment will not be increased, which is conducive to the miniaturization of the ultrasonic equipment.

[0054] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. However, the obvious changes or modifications derived therefrom are still within the scope of protection of the present invention.

Claims

1. A transceiver chip heat sink, It is characterized in that include: A heat sink substrate (71) suitable for covering the top of all transceiver chips (5) on the mainboard (1); A plurality of heat dissipation fins (72) extend along the length direction of the heat dissipation substrate (71) and are arranged at intervals along the width direction of the heat dissipation substrate (71); a first guide groove (73) is formed between two adjacent heat dissipation fins (72); each heat dissipation fin (72) is provided with a notch groove (74), and a plurality of notch grooves (74) corresponding to positions on the plurality of heat dissipation fins (72) are arranged in the same direction to form a second guide groove (75).

2. The transceiver chip heat sink according to claim 1, It is characterized in that The notched grooves (74) on the heat dissipation fins (72) located at the edge positions of both sides penetrate the first guide grooves (73) and the external space, and the notched grooves (74) on the heat dissipation fins (72) located at the middle position penetrate two adjacent first guide grooves (73).

3. The transceiver chip heat sink according to claim 1, It is characterized in that The guide direction of the second guide groove (75) points to the position where the cooling fan module (9) is installed on the air outlet side (12) of the mainboard (1).

4. The transceiver chip heat sink according to claim 1, It is characterized in that A plurality of the notched grooves (74) are arranged at intervals along the length direction of each of the heat dissipation fins (72); along the length direction of each of the heat dissipation fins (72), the plurality of notched grooves (74) are sequentially a first-stage notched groove, a second-stage notched groove, ..., an Nth-stage notched groove, and the notched grooves (74) at the same stage on the plurality of heat dissipation fins (72) are arranged in the same direction to form the second guide groove (75).

5. The transceiver chip heat sink according to claim 4, It is characterized in that The two groove side surfaces of the notch groove (74) are inclined surfaces, and the same side groove side surfaces of the notch grooves (74) at the same level are arranged in the same plane.

6. The transceiver chip heat sink according to claim 1, It is characterized in that The airflow turning angle of the airflow flowing from the first guide groove (73) to the second guide groove (75) is α, and the value range of α is 90°<α<180°.

7. The transceiver chip heat sink according to claim 1, It is characterized in that It also includes a radiator heat pipe (76) located on the side of the radiator substrate (71) facing away from the heat dissipation fins (72), and a heat-conducting medium is filled between adjacent radiator heat pipes (76) and between the radiator heat pipes (76) and the radiator substrate (71).

8. An ultrasonic mainboard, It is characterized in that The invention comprises a mainboard (1), a signal processing module (4) and a transceiver chip (5) integrated on the mainboard (1); the mainboard (1) has an air inlet side (11) and an air outlet side (12) arranged opposite to each other; the air outlet side (12) of the mainboard (1) is provided with a cooling fan module (9) for driving an air flow from the air inlet side (11) of the mainboard (1) to the air outlet side (12) of the mainboard (1); the signal processing module (4) and the cooling fan module (9) are arranged opposite to each other; the transceiver chip (5) is located on one side of the signal processing module (4); an air duct opening (8) is formed between the signal processing module (4) and the cooling fan module (9); the transceiver chip (5) is provided with a transceiver chip heat sink (7) as claimed in any one of claims 1 to 7; the air flow direction of the second guide groove (75) of the transceiver chip heat sink (7) points to the air duct opening (8).

9. The ultrasonic mainboard according to claim 8, It is characterized in that The signal processing module (4) is provided with a guide slope (41) at a position corresponding to the air duct opening (8) to facilitate airflow to flow through the air duct opening (8) toward the cooling fan module (9).

10. An ultrasonic device, It is characterized in that It comprises a shell and an ultrasonic mainboard as described in claim 8 arranged in the shell, wherein an air inlet and an air outlet are arranged on opposite sides of the shell, the air inlet side (11) of the mainboard (1) is arranged corresponding to the air inlet of the shell, and the air outlet side (12) of the mainboard (1) is arranged corresponding to the air outlet of the shell.

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