Radiator, ultrasonic mainboard and medical equipment

Abstract

The invention discloses a radiator, an ultrasonic mainboard and medical equipment, and the radiator comprises a radiating substrate, a plurality of first radiating fins which are arranged at intervals and a plurality of second radiating fins which are arranged at intervals, wherein the first radiating fins and the second radiating fins are connected to the same side surface of the radiating substrate; the distance between the second heat dissipation fins and the heat dissipation substrate is larger than the distance between the first heat dissipation fins and the heat dissipation substrate, and a first flow guide groove is formed between every two adjacent first heat dissipation fins. The side faces, connected with the upper top faces of the first heat dissipation fins, of the row of second heat dissipation fins closest to the air inlet side are flow guide faces, and the multiple flow guide faces are located on the same streamline flow guide curved face. The streamline flow guide curved surfaces can guide the trend of airflow on the first heat dissipation fins, the airflow can flow along the first flow guide grooves and also can flow in the other direction along the streamline flow guide curved surfaces, the paths for the airflow to flow outwards are increased, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of medical devices, and in particular to a radiator, an ultrasonic mainboard and medical equipment. Background Art

[0002] The portable ultrasonic device includes a housing, a mainboard and a cooling fan module arranged in the housing. The cooling fan module is used to drive airflow to flow on the mainboard to dissipate heat from various functional modules including a digital processing module on the ultrasonic mainboard. Since the digital processing module generates a large amount of heat, a heat sink needs to be separately arranged on the digital processing module to dissipate heat from the digital processing module.

[0003] In the prior art, a heat sink having a plurality of cooling fins arranged side by side is usually arranged in the top space of the digital processing module, guide grooves are formed between adjacent cooling fins, and a cooling fan module drives airflow through the guide grooves to dissipate heat from the digital processing module.

[0004] However, the heat dissipation fins on the existing heat sinks are all of the same height, and the airflow can only flow out along the limited direction of the guide grooves arranged in the same direction, resulting in poor heat dissipation effect, which is not conducive to the rapid discharge of heat generated by the digital processing module. Summary of the invention

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the defects in the prior art that the heat dissipation effect of the radiator on the digital processing module is poor and it is difficult to discharge the heat generated by the digital processing module in time, thereby providing a radiator, an ultrasonic motherboard and a medical device.

[0006] In order to solve the above technical problems, the technical solution of the present invention is as follows:

[0007] A radiator comprises a heat dissipation substrate and a plurality of first heat dissipation fins and a plurality of second heat dissipation fins connected to the same side of the heat dissipation substrate, wherein the height of the second heat dissipation fin from the heat dissipation substrate is greater than the height of the first heat dissipation fin from the heat dissipation substrate, and a first guide groove is formed between two adjacent first heat dissipation fins; the side surface where the upper top surface of a row of the second heat dissipation fins closest to the air inlet side is connected to the first heat dissipation fin is a guide surface, and the plurality of guide surfaces are located on the same streamlined guide curved surface.

[0008] Furthermore, a first guide slope is provided on a side of the first heat dissipation fin close to the air inlet side.

[0009] Furthermore, the second heat dissipation fins and the first heat dissipation fins are an integrally formed structure, and a portion of the second heat dissipation fins that is higher than the first heat dissipation fins forms a plurality of guide columns arranged at intervals above the first heat dissipation fins.

[0010] Furthermore, a second guide slope is provided on a side of some of the guide columns facing the air inlet side.

[0011] Furthermore, a U-shaped heat conducting pipe is provided on the other side of the heat dissipation substrate facing away from the first heat dissipation fins, and positions of the U-shaped heat conducting pipe close to two ports are connected to heat conducting blocks.

[0012] Furthermore, the two heat-conducting blocks are of different sizes.

[0013] An ultrasonic mainboard comprises a mainboard, a digital processing module connected to the mainboard via a board-to-board connector, and the above-mentioned heat sink arranged on the digital processing module.

[0014] Furthermore, the digital processing module outer cover is provided with a shielding cover, the shielding cover includes a top wall and side walls surrounded on four sides on the top wall, the side walls are supported on the mainboard and form a accommodating cavity for accommodating the digital processing module and the radiator; the side walls include a first side wall facing the air inlet side, a second side wall arranged opposite to the first side wall, and a third side wall connected between the first side wall and the second side wall; the first side wall is an open structure for external airflow to enter the shielding cover, and the second side wall and the third side wall are provided with first heat dissipation holes for the airflow in the shielding cover to be discharged to the outside; the first guide groove guides the airflow from the first side wall to the second side wall, and the guide curved surface guides the airflow from the first side wall to the third side wall.

[0015] Furthermore, an air inlet cover is connected to the outer side of the first side wall, and a fan module for supplying air into the shielding cover is arranged inside the air inlet cover; a vent is arranged on the third side wall, and an exhaust cover covering the vent is connected to the outer side of the third side wall.

[0016] A medical device comprises a shell and an ultrasonic mainboard as described above arranged in the shell, wherein adjacent two sides of the shell are provided with side air inlets and rear air outlets, the first side wall of the shielding cover faces the side air inlets, and the third side wall of the shielding cover faces the rear air outlet.

[0017] The technical solution of the present invention has the following advantages:

[0018] 1. The heat sink provided by the present invention has first heat sink fins and second heat sink fins of different heights arranged on a heat sink substrate, and a first guide groove is formed between two adjacent first heat sink fins; the guide surfaces of the plurality of second heat sink fins are located on the same streamlined guide curved surface, and the guide curved surface can guide the direction of the airflow on the first heat sink fins. In addition to flowing along the first guide groove, the airflow can also flow in another direction along the streamlined guide curved surface, thereby increasing the outflow path of the airflow and improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of the ultrasonic mainboard in an embodiment of the present invention;

[0021] Figure 2 A schematic diagram of a partial half-section structure of a medical device in an embodiment of the present invention;

[0022] Figure 3 It is a schematic structural diagram of the first surface of the shielding cover, the air inlet cover and the air exhaust cover in an embodiment of the present invention;

[0023] Figure 4 It is a schematic structural diagram of the second surface of the shielding cover, the air inlet cover and the air exhaust cover in an embodiment of the present invention;

[0024] Figure 5 is a schematic diagram of the three-dimensional structure of the shielding cover in an embodiment of the present invention;

[0025] Figure 6 A schematic diagram of the air flow direction on the radiator in an embodiment of the present invention;

[0026] Figure 7 The front structure of the radiator in the embodiment of the present invention is shown in FIG. Figure 1 ;

[0027] Figure 8 The front structure of the radiator in the embodiment of the present invention is shown in FIG. Figure 2 ;

[0028] Fig. 9 Schematic diagram of the structure of the back side of the radiator in the embodiment of the present invention.

[0029] Description of reference numerals: 100, housing; 101, side air inlet; 102, rear air outlet; 10, mainboard; 11, power module; 12, signal processing controller module; 13, transceiver chip module; 14, ultrasound probe module; 15, cooling fan module; 20, digital processing module; 21, memory bar; 30, shielding cover; 30a, return air gap; 31, first side wall; 32, second side wall; 33, third side wall; 33a, wind shield; 34, Fourth side wall; 35, first heat dissipation hole; 36, vent; 37, top wall; 40, radiator; 41, heat dissipation substrate; 42, first heat dissipation fin; 421, first guide slope; 43, second heat dissipation fin; 431, guide surface; 432, second guide slope; 44, U-shaped heat pipe; 45, heat conductive block; 50, back radiator; 60, board-to-board connector; 70, air inlet cover; 80, exhaust cover; 81, second heat dissipation hole; 90, fan module. DETAILED DESCRIPTION

[0030] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0032] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] This embodiment provides an ultrasound device, which is specifically a handheld portable ultrasound diagnostic device.

[0034] like Figure 1As shown, the ultrasound device includes a housing 100 and an ultrasound mainboard 10 disposed in the housing 100. Side air inlets 101 and rear air outlets 102 are disposed on adjacent two sides of the housing 100. The rear air outlet 102 is located on the side of the housing 100 away from the user end. A digital processing module, a power module 11, a signal processing controller module 12, a transceiver chip module 13 and an ultrasound probe module 14 are sequentially disposed on the side of the ultrasound mainboard 10 near the rear air outlet 102. A cooling fan module 15 for cooling various functional modules on the ultrasound mainboard 10 is disposed in the middle of the housing 100 near the rear air outlet 102.

[0035] Among them, the power module 11 includes a power supply plugged into the mainboard 10 and a power shielding cover 30 covering the power supply. The signal processing controller module includes a signal processing controller plugged into the mainboard 10, a signal processing controller radiator arranged on the signal processing controller for dissipating heat for the signal processing controller, and a signal processing controller shielding cover 30 covering the signal processing controller radiator and the periphery of the signal processing controller. The transceiver chip module includes a plurality of transceiver chips integrated on the mainboard 10, and a transceiver chip radiator arranged on the transceiver chip for dissipating heat for the transceiver chip. The ultrasound probe module 14 includes an ultrasound probe for collecting human ultrasound signals.

[0036] like Figure 2 As shown in FIG. 5 , the digital processing module includes a digital processing module 20, a heat sink 40, a back heat sink 50 and a shielding cover 30. The digital processing module 20 is specifically a PCB board with integrated functional chips. The digital processing module 20 is connected to the top of the main board 10 through a board-to-board connector 60. The side of the digital processing module 20 facing away from the main board 10 is the front side of the digital processing module 20, and the side of the digital processing module 20 facing the main board 10 is the back side of the digital processing module 20. The heat sink 40 is located on the front side of the digital processing module 20, and the back heat sink 50 is located on the back side of the digital processing module 20. The heat sink 40 and the back heat sink 50 are used to dissipate heat for the digital processing module 20. The shielding cover 30 is connected to the main board 10 and is arranged on the periphery of the digital processing module 20 and the heat sink 40. The shielding cover 30 is made of metal and is used to shield the digital processing module 20 to reduce the interference of the digital processing module 20 to other functional modules on the main board 10.

[0037] In this embodiment, the shielding cover 30 includes a top wall 37 and side walls enclosed on the top wall 37 on four sides. The side walls are supported on the mainboard 10 and enclose a housing cavity for accommodating the digital processing module 20 and the heat sink 40. The side walls include a first side wall 31, a second side wall 32, a third side wall 33 and a fourth side wall 34; the first side wall 31 is arranged facing the air inlet side, and the air inlet side is specifically the side of the housing 100 provided with a side air inlet 101; the second side wall 32 is arranged opposite to the first side wall 31, and the third side wall 33 and the fourth side wall 34 are arranged opposite to each other, and the third side wall 33 and the fourth side wall 34 are both connected between the first side wall 31 and the second side wall 32. The first side wall 31 is specifically an open structure for allowing external airflow to enter the shielding cover 30, and the second side wall 32 and the third side wall 33 are provided with first heat dissipation holes 35 for the airflow in the shielding cover 30 to be discharged to the outside. The fourth side wall 34 and the top wall 37 are both sealed plates.

[0038] This shielding cover 30 is configured with an open structure on the first side wall 31 of the shielding cover 30, and first heat dissipation holes 35 are provided on the second side wall 32 and the third side wall 33 of the shielding cover 30. After the airflow passes through the first side wall 31 and inside the shielding cover 30, it can be discharged to the outside through the first heat dissipation holes 35 on the second side wall 32 and the third side wall 33. In this way, the shielding effect of the shielding cover 30 can be utilized to reduce the interference of the digital processing module 20 on other functional modules on the mainboard 10, and an air duct can be formed inside the shielding cover 30, which is beneficial to the rapid dissipation of the heat generated by the digital processing module 20 inside the shielding cover 30.

[0039] In this embodiment, the first heat dissipation holes 35 are arranged in the upper part of the second side wall 32 and the third side wall 33 near the top wall 37, and the lower part of the second side wall 32 and the third side wall 33 where the first heat dissipation holes 35 are not arranged is a sealing baffle, and the height difference between the upper end of the sealing baffle and the main board 10 is not less than the height difference between the upper end of the digital processing module 20 and the main board 10. In this way, the sealing baffle can shield the digital processing module 20 to ensure the shielding effect.

[0040] In this embodiment, an air inlet cover 70 is connected to the outer side of the first side wall 31, and the connection position between the air inlet cover 70 and the shielding cover 30 is a sealed connection. A fan module 90 is provided in the air inlet cover 70 for supplying air into the shielding cover 30. The fan module 90 can drive air to enter the shielding cover 30 from the first side wall 31, and then radiate air outward through the first heat dissipation holes 35 on the second side wall 32 and the third side wall 33, thereby improving the ventilation rate in the shielding cover 30, and further improving the heat dissipation effect of the digital processing module 20.

[0041] In this embodiment, a square vent 36 is provided in the upper part of the third side wall 33 near the top wall 37, and a windshield 33a is formed on the third side wall 33 below the vent 36, and the height difference between the upper end of the windshield 33a and the main board 10 is not less than the height difference between the upper end of the digital processing module 20 and the main board 10. An exhaust hood 80 covering the vent 36 is connected to the outer side of the third side wall 33, and a second heat dissipation hole 81 is provided on the side plate of the exhaust hood 80 opposite to the vent 36. A return air gap 30a is provided between the digital processing module 20 and the fourth side wall 34, and the vent 36, the space above the digital processing module, the return air gap 30a, and the space below the digital processing module form a return air channel, and the gas in the space below the digital processing module flows to the vent 36 along the return air channel. Figure 2 The direction of the middle arrow is the flow direction of the air in the return air channel. When the gas in the space above the digital processing module is discharged outward under the action of the fan module 90, since a negative pressure is formed in the space above the digital processing module 20, the gas in the space below the digital processing module 20 will flow to the space above the digital processing module 20 through the return air gap 30a, which is conducive to the rapid dissipation of heat in the space below the digital processing module 20 and improves the heat dissipation effect.

[0042] In this embodiment, a through hole corresponding to the position of the digital processing module 20 is provided on the mainboard 10, and the back heat sink 50 extends to the back of the digital processing module 20 through the through hole. The back heat sink 50 is in direct contact with the back of the digital processing module 20, or the back heat sink 50 is in contact with the back of the digital processing module 20 through a heat-conducting medium; the heat-conducting medium is specifically heat-conducting silica gel. The heat sink 40 and the back heat sink 50 are respectively arranged on the opposite sides of the digital processing module 20, so that the front and back of the digital processing module 20 can be directly dissipated, and the local accumulation of heat on the back of the digital processing module 20 can be avoided. Compared with the method of only arranging a heat sink on the front of the digital processing module 20 in the prior art, the heat dissipation speed is accelerated and the heat dissipation effect is enhanced. Moreover, the structural form in which the back heat sink 50 is embedded in the through hole of the mainboard 10 is conducive to directly transferring the heat on the back of the digital processing module 20 to the back of the mainboard 10, improving the heat dissipation effect on the back of the digital processing module 20, and also saving the installation space occupied by the back heat sink 50.

[0043] In this embodiment, the back radiator 50 includes a back radiator substrate and a plurality of back radiator fins arranged side by side and connected to the back radiator substrate on the side facing away from the digital processing module 20. A heat conduction channel is formed between two adjacent back radiator fins, and the heat conduction channel is in the same direction as the return air channel in the space below the digital processing module 20. Furthermore, the back radiator 50 is arranged corresponding to the position of the heat source on the digital processing module 20, which can accelerate the rapid outward dissipation of the heat generated by the heat source. The bottom of the back radiator fins is against the metal shell 100, and the lower end of the metal bottom shell 100 is hollow, which can directly dissipate heat from the back radiator 50.

[0044] In this embodiment, the height of the fan module 90 is smaller than the height of the shielding cover 30 . In addition to supplying air to the radiator 40 , the fan module 90 also supplies air to the rear radiator 50 .

[0045] like Figure 6 As shown in Figure 9, the heat sink 40 includes a heat sink substrate 41 and a plurality of first heat sink fins 42 and a plurality of second heat sink fins 43 connected to the same side of the heat sink substrate 41. The heat sink substrate 41, the first heat sink fins 42 and the second heat sink fins 43 are an integrally formed structure. A first guide groove is formed between two adjacent first heat sink fins 42, and the height of the second heat sink fin 43 from the heat sink substrate 41 is greater than the height of the first heat sink fin 42 from the heat sink substrate 41. The side surface where the second heat sink fins 43 in a row closest to the air inlet side are connected to the top surface of the first heat sink fin 42 is a guide surface 431, and multiple guide surfaces 431 are located on the same streamlined guide curved surface. Figure 6 The direction of the arrow in the middle is the direction of air flow over the heat sink fins.

[0046] This heat sink 40 is provided with first heat sink fins 42 and second heat sink fins 43 of different heights on a heat sink substrate 41, and a first guide groove is formed between two adjacent first heat sink fins 42; the guide surfaces 431 of the plurality of second heat sink fins 43 are located on the same streamlined guide curved surface, and the guide curved surface can guide the direction of the airflow on the first heat sink fins 42. In addition to flowing along the first guide groove, the airflow can also flow in another direction along the streamlined guide curved surface, thereby increasing the outflow path of the airflow and improving the heat dissipation efficiency.

[0047] In this embodiment, the first heat sink fin 42 is further provided with a first guide slope 421 on the side close to the air inlet side, and the heat sink substrate 41 is also arranged at an angle on the side close to the air inlet side. The second heat sink fin 43 is higher than the first heat sink fin 42, and a plurality of guide columns arranged at intervals are formed above the first heat sink fin 42. The gap between adjacent guide columns can be used for air flow, and the second heat sink fin 43 on the side of the heat sink substrate 41 close to the rear air outlet 102 can be directly integrally formed on the heat sink substrate 41. A second guide slope 432 is provided on the side of some guide columns facing the air inlet side; the first guide slope 421 and the second guide slope 432 can reduce the wind resistance from the air inlet side.

[0048] In this embodiment, a U-shaped heat pipe 44 is provided on the other side of the heat dissipation substrate 41 facing away from the first heat dissipation fin 42, and a heat conduction block 45 is connected to the U-shaped heat conduction pipe 44 near the two ports. The heat conduction block 45 can transfer the heat of the local area on the digital processing module 20 from one end to the other end through the U-shaped heat conduction pipe 44, and can transfer the heat of the main heat source area to the secondary heat source area; thus, the heat on the radiator is balanced. The heat conduction blocks 45 are of different sizes, and the heat conduction blocks 45 with large areas correspond to chips with large heat generation; the heat conduction blocks 45 with small areas correspond to chips with small heat generation; therefore, the heat transfer and balance of each area on the digital processing module 20 can be maintained.

[0049] In this embodiment, a memory bar 21 is also installed above the digital processing module 20. The memory bar 21 and the heat sink are located on the same plane, and the memory bar 21 occupies a portion of the space above the digital processing module 20. In this structural layout, although the memory bar 21 installed on the digital processing module 20 occupies a portion of the heat dissipation area above the digital processing module 20, resulting in a reduction in the heat dissipation area of ​​the heat sink, the heat dissipation efficiency of the heat sink is high, and the rapid heat dissipation requirements of the digital processing module 20 can still be met. There is no need to install additional memory bars 21 at other locations, making the overall structure more compact, which is conducive to the compact design of medical equipment.

[0050] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. A radiator, characterized in that: The invention comprises a heat dissipation substrate (41) and a plurality of first heat dissipation fins (42) and a plurality of second heat dissipation fins (43) arranged at intervals and connected to the same side surface of the heat dissipation substrate (41); the height of the second heat dissipation fins (43) from the heat dissipation substrate (41) is greater than the height of the first heat dissipation fins (42) from the heat dissipation substrate (41); a first guide groove is formed between two adjacent first heat dissipation fins (42); the side surface where the upper top surface of a row of the second heat dissipation fins (43) closest to the air inlet side is connected to the first heat dissipation fins (42) is a guide surface (431); and the plurality of guide surfaces (431) are located on the same streamlined guide curved surface.

2. The heat sink according to claim 1, characterized in that: A first flow guiding inclined surface (421) is provided on one side of the first heat dissipation fin (42) close to the air inlet side.

3. The heat sink according to claim 1, characterized in that: The second heat dissipation fins (43) and the first heat dissipation fins (42) are an integrally formed structure, and a portion of the second heat dissipation fins (43) that is higher than the first heat dissipation fins (42) forms a plurality of guide columns arranged at intervals above the first heat dissipation fins (42).

4. The heat sink according to claim 3, characterized in that: A second flow guiding slope (432) is provided on a side of some of the flow guiding columns facing the air inlet side.

5. The heat sink according to claim 1, characterized in that: A U-shaped heat conducting pipe (44) is provided on the other side of the heat dissipation substrate (41) facing away from the first heat dissipation fins (42), and the U-shaped heat conducting pipe (44) is connected to heat conducting blocks (45) at positions close to two ports.

6. The heat sink according to claim 5, characterized in that The two heat conducting blocks (45) are of different sizes.

7. An ultrasonic mainboard, characterized in that: It comprises a mainboard (10), a digital processing module (20) connected to the mainboard (10) via a board-to-board connector, and a heat sink as claimed in any one of claims 1 to 6 arranged on the digital processing module (20).

8. The ultrasonic mainboard according to claim 7, characterized in that: The digital processing module (20) is provided with a shielding cover (30) on its outer cover, the shielding cover (30) comprising a top wall (37) and side walls surrounding the top wall (37) on four sides, the side walls being supported on the main board (10) and forming a receiving cavity for receiving the digital processing module (20) and the heat sink; the side walls comprising a first side wall (31) facing the air inlet side, a second side wall (32) arranged opposite to the first side wall (31), and a second side wall (32) connected to the first side wall (31) and the second side wall (32). ) between the first side wall (31) and the third side wall (33); the first side wall (31) is an open structure for allowing external airflow to enter the shielding cover (30); the second side wall (32) and the third side wall (33) are provided with first heat dissipation holes (35) for allowing airflow in the shielding cover (30) to be discharged to the outside; the first guide groove guides airflow from the first side wall (31) to flow toward the second side wall (32); and the guide curved surface guides airflow from the first side wall (31) to flow toward the third side wall (33).

9. The ultrasonic mainboard according to claim 8, characterized in that: The outer side of the first side wall (31) is connected to an air inlet cover (70), and a fan module (90) is provided inside the air inlet cover (70) for supplying air into the shielding cover (30); the third side wall (33) is provided with a vent (36), and the outer side of the third side wall (33) is connected to an exhaust cover (80) covering the vent (36).

10. A medical device, characterized in that: The invention comprises a shell (100) and an ultrasonic mainboard (10) as described in claim 9 and arranged in the shell (100), wherein adjacent two sides of the shell (100) are provided with side air inlets (101) and rear air outlets (102), a first side wall (31) of the shielding cover (30) faces the side air inlets (101), and a third side wall (33) of the shielding cover (30) faces the rear air outlet (102).

Images