Display panel, method for manufacturing the same, and electronic device including the same

Abstract

A display panel, a method for manufacturing the same, and an electronic device including the same are provided. The display panel includes: a light emitting element; and a pixel defining film having a pixel opening defined therein. The light emitting element may include: a first electrode exposed through the pixel opening; a second electrode disposed on the first electrode; and at least one functional layer disposed between the first electrode and the second electrode. The first electrode may include: a first layer including an aluminum alloy; a second layer including a transparent conductive oxide; and an anti-oxidation layer including titanium nitride (TiN) and disposed between the first layer and the second layer. When the atomic percentage of the aluminum alloy is about 100 at%, the percentage of alloy atoms other than aluminum atoms in the aluminum alloy may be about 0.01 at% to about 0.1 at%.

Description

[0001] This application claims priority to and all benefits derived from Korean Patent Application No. 10-2023-0072671, filed on Jun. 7, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present invention relates to a display panel including a light emitting element, a method for manufacturing the display panel, and an electronic device including the display panel. Background Art

[0003] Various types of electronic devices that can be worn on the human body are being developed, and these devices are generally referred to as wearable electronic devices. Wearable electronic devices may have various forms that can be detachably attached to a portion of a human body or clothing. As an example of a wearable electronic device, there is a device that can be mounted on the head of a user, and this device may be referred to as, for example, a head-mounted display (HMD) device. Devices such as HMD devices need to form microstructures with ultra-high resolutions of about 3000 ppi (pixels per inch) or more. Summary of the invention

[0004] The present disclosure provides a display panel with good display quality and an electronic device including the display panel.

[0005] The present disclosure also provides a method for manufacturing a display panel with good manufacturing efficiency and manufacturing reliability.

[0006] An embodiment provides a display panel, which includes: a light-emitting element; and a pixel defining film having a pixel opening defined therein, wherein the light-emitting element includes: a first electrode exposed through the pixel opening; a second electrode disposed on the first electrode; and at least one functional layer disposed between the first electrode and the second electrode, wherein the first electrode includes: a first layer including an aluminum alloy; a second layer including a transparent conductive oxide; and an anti-oxidation layer including titanium nitride (TiN) and disposed between the first layer and the second layer, wherein, when the atomic percentage of the aluminum alloy is approximately 100 at %, the percentage of alloy atoms other than aluminum atoms in the aluminum alloy is approximately 0.01 at % to approximately 0.1 at %.

[0007] In an embodiment, the alloy atoms may include at least one of titanium (Ti), nickel (Ni), and La.

[0008] In an embodiment, the first layer may have a thickness of about 60 nm to about 120 nm.

[0009] In an embodiment, the second layer may have a thickness of about 2 nm to about 12 nm.

[0010] In an embodiment, the transparent conductive oxide may include indium tin oxide (ITO).

[0011] In an embodiment, the anti-oxidation layer may have a thickness of about 1 nm to about 5 nm.

[0012] In an embodiment, the first electrode may have a thickness of about 63 nm to about 137 nm.

[0013] In an embodiment, the at least one functional layer may include: a first light emitting layer configured to emit a first light; and a second light emitting layer disposed on the first light emitting layer and configured to emit a second light different from the first light.

[0014] In an embodiment, the light emitting element may include a first light emitting element, a second light emitting element, and a third light emitting element spaced apart from each other in a direction perpendicular to the thickness direction, wherein the first light emitting element may emit red light, the second light emitting element may emit green light, and the third light emitting element may emit blue light.

[0015] In an embodiment, a method for manufacturing a display panel includes: preparing a base layer; forming a first electrode, the first electrode including a first layer arranged on the base layer, a second layer arranged on the first layer, and an anti-oxidation layer arranged between the first layer and the second layer; forming a functional layer on the first electrode; and forming a second electrode on the functional layer, wherein the step of forming the first electrode includes: forming a preliminary first layer by providing an aluminum alloy; forming a preliminary anti-oxidation layer on the preliminary first layer by providing titanium nitride (TiN); forming a preliminary second layer on the preliminary anti-oxidation layer by providing a transparent conductive oxide; forming a second layer by wet etching the preliminary second layer; and forming a first layer and an anti-oxidation layer by jointly etching the preliminary first layer and the preliminary anti-oxidation layer.

[0016] In an embodiment, when the atomic percentage of the aluminum alloy is about 100 at %, the percentage of alloy atoms other than aluminum atoms in the aluminum alloy may be about 0.01 at % to about 0.1 at %.

[0017] In an embodiment, the alloy atoms may include at least one of titanium (Ti), nickel (Ni), and lanthanum (La).

[0018] In an embodiment, the transparent conductive oxide may include indium tin oxide (ITO), wherein, in the step of forming the second layer, an oxalic acid-based etching solution may be provided.

[0019] In an embodiment, the preliminary first layer and the preliminary anti-oxidation layer may be dry-etched.

[0020] In an embodiment, in the step of forming the first layer and the anti-oxidation layer, fluorine gas or chlorine gas may be provided.

[0021] In an embodiment, an electronic device includes: a display panel; and a lens system, which is arranged opposite to the display panel, wherein the display panel includes: a light-emitting element; and a pixel defining film, having a pixel opening defined therein, wherein the light-emitting element includes: a first electrode, exposed through the pixel opening; a second electrode, arranged on the first electrode; and at least one functional layer, arranged between the first electrode and the second electrode, wherein the first electrode includes: a first layer, including an aluminum alloy; a second layer, including a transparent conductive oxide; and an anti-oxidation layer, including titanium nitride (TiN) and arranged between the first layer and the second layer, wherein, when the atomic percentage of the aluminum alloy is approximately 100at%, the percentage of alloy atoms other than aluminum atoms in the aluminum alloy is approximately 0.01at% to approximately 0.1at%.

[0022] In an embodiment, the alloy atoms may include at least one of titanium (Ti), nickel (Ni), and lanthanum (La).

[0023] In an embodiment, the first layer may have a thickness of about 60 nm to about 120 nm, the second layer may have a thickness of about 2 nm to about 12 nm, and the anti-oxidation layer may have a thickness of about 1 nm to about 5 nm.

[0024] In an embodiment, the at least one functional layer may include: a first light emitting layer configured to emit a first light; and a second light emitting layer disposed on the first light emitting layer and configured to emit a second light different from the first light.

[0025] In an embodiment, the light emitting element may include a first light emitting element, a second light emitting element, and a third light emitting element spaced apart from each other in a direction perpendicular to the thickness direction, wherein the first light emitting element may emit red light, the second light emitting element may emit green light, and the third light emitting element may emit blue light. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification. The accompanying drawings illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. In the drawings:

[0027] Figure 1 is a perspective view of an electronic device according to an embodiment;

[0028] Figure 2 is a perspective view of an electronic device according to an embodiment;

[0029] Figure 3 is an exploded perspective view of an electronic device according to an embodiment;

[0030] Figure 4 According to the embodiment Figure 3A cross-sectional view of a portion of the electronic device corresponding to line II';

[0031] Figure 5 is a cross-sectional view of a display panel according to an embodiment;

[0032] Figure 6 According to the embodiment Figure 5 A cross-sectional view of an enlarged area XX' of a display panel;

[0033] Fig. 7A is an image of a surface of an aluminum alloy according to an embodiment;

[0034] Figure 7B is an image of a surface of an aluminum alloy according to an embodiment;

[0035] Figure 7C is an image of a surface of aluminum according to an embodiment;

[0036] Fig. 8A is an image of a cross section of aluminum according to an embodiment;

[0037] Figure 8B is an image of a cross section of aluminum according to an embodiment;

[0038] Fig. 9 is a graph showing the results of evaluating reflectance according to wavelength according to the embodiment;

[0039] Fig.10 is a cross-sectional view of a display panel according to an embodiment;

[0040] Fig.11A is a flow chart showing a method of manufacturing a display panel according to an embodiment;

[0041] Fig. 11B is a flow chart showing a method of manufacturing a display panel according to an embodiment;

[0042] Fig.12 Schematically showing the steps of manufacturing a display panel according to an embodiment;

[0043] Fig.13 Schematically showing the steps of manufacturing a display panel according to an embodiment;

[0044] Fig.14 Schematically showing the steps of manufacturing a display panel according to an embodiment;

[0045] Fig.15 Schematically showing the steps of manufacturing a display panel according to an embodiment;

[0046] Fig.16 schematically illustrates steps of manufacturing a display panel according to an embodiment; and

[0047] Fig.17 The steps of manufacturing a display panel according to an embodiment are schematically shown. DETAILED DESCRIPTION

[0048] In the invention, various modifications may be made, various forms may be used, and specific embodiments will be shown in the drawings and described in detail in the text. However, this is not intended to limit the invention to the specific form disclosed, and it will be understood that all changes, equivalents or substitutes falling within the spirit and technical scope of the invention should be included.

[0049] In this specification, it will be understood that when an element (or region, layer, portion, etc.) is referred to as being associated with another element (such as "on", "connected to" and / or "coupled to" another element), the element (or region, layer, portion, etc.) may be directly on, directly connected to, or directly coupled to the other element, or there may be intervening elements. For example, "directly disposed on" may mean that two layers or two members are disposed without using an additional member such as a bonding member between them.

[0050] The same reference numerals always represent the same elements. In addition, in the accompanying drawings, the thickness, ratio and size of the elements are exaggerated for the effective description of the technical content. As used herein, the term "and / or" includes any and all combinations that the associated configurations can define.

[0051] It will be understood that, although the terms first, second, etc. can be used here to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, without departing from the scope of the present invention, the first element can be referred to as the second element. Similarly, the second element can also be referred to as the first element. Unless otherwise stated, the terms in the singular include plural forms.

[0052] In addition, for the convenience of description, terms such as "below", "lower", "above", "upper", etc. are used here to describe the relationship between one element and another element as shown in the figures. The above terms are relative concepts and are described based on the directions indicated in the drawings.

[0053] It will be understood that when the terms “include” and / or “have” are used in this specification, it indicates the presence of the stated features, integers, steps, operations, elements, components and / or groups thereof, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0054] As used herein, "about" or "roughly" is inclusive of the stated value and means within an acceptable range of deviation of the particular value as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0055] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. It will also be understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0056] Hereinafter, a display panel, an electronic device including the same, and a method of manufacturing the same according to embodiments will be described with reference to the accompanying drawings.

[0057] Figure 1 is a perspective view showing an electronic device EA according to an embodiment. The electronic device EA can be activated according to an electrical signal. For example, the electronic device EA can be a television, a monitor, an external billboard, a personal computer, a laptop computer, a mobile phone, a tablet computer, a game console, a navigation system, and a wearable device, but the invention is not limited thereto.

[0058] In an embodiment, Figure 1 A head mounted display (HMD) device as a wearable device is shown as an example of the electronic device EA. The head mounted display device may be mounted on the head of a user to provide the user with a screen on which an image and / or video is displayed. The head mounted display device may include a see-through type that provides augmented reality (AR) based on an actual external object and a non-see-through type that provides virtual reality (VR) to the user on a screen independently of an external object.

[0059] In the examples and with reference to Figure 1 The electronic device EA may include a display panel DP and a lens system LS disposed opposite to the display panel DP. In addition, the electronic device EA may include a main frame MF, a cover frame CF, and a fixing part FP.

[0060] In an embodiment, the main frame MF may be a portion worn on the user's face. The main frame MF may have a shape corresponding to the shape of the user's head (or face). For example, the length of the fixing part FP may be adjusted according to the circumference of the user's head. The fixing part FP may have a structure for mounting the main frame MF to the user's head or face, and may include straps and belts, etc. However, the invention is not limited thereto, and the fixing part FP may have various forms such as a helmet or glasses legs coupled to the main frame MF.

[0061] In an embodiment, the lens system LS, the display panel DP, and the cover frame CF may be mounted on the main frame MF. The main frame MF may include a space or structure in which the lens system LS and the display panel DP may be accommodated.

[0062] In an embodiment, the lens system LS may be disposed between the display panel DP and the user. The lens system LS may allow light emitted from the display panel DP to pass therethrough and provide the light to the user. For example, the lens system LS may include various types of lenses such as a multi-channel lens, a convex lens, a concave lens, a spherical lens, an aspherical lens, a single lens, a combined lens, a standard lens, a narrow-angle lens, a wide-angle lens, a fixed-focus lens, and / or a zoom lens.

[0063] In an embodiment, the lens system LS may include a first lens LS1 and a second lens LS2. The first lens LS1 and the second lens LS2 may be disposed to correspond to the positions of the left eye and the right eye of the user. The first lens LS1 and the second lens LS2 may be accommodated inside the main frame MF.

[0064] In the embodiment, the display panel DP may be provided in a state of being fixed to the main frame MF, or may be provided in a detachable state. Since the display panel DP according to the embodiment includes the first electrode EL1 (see Figure 6 ), so the display panel DP can show good display quality. The display panel DP will be described in more detail later.

[0065] In an embodiment, the cover frame CF may be disposed on or adjacent to one surface of the display panel DP to protect the display panel DP. The cover frame CF and the lens system LS may be spaced apart from each other with the display panel DP interposed therebetween.

[0066] In an embodiment, Figure 1The first direction axis DR1 to the third direction axis DR3 are shown in the drawings and other drawings, and the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 described here are relative concepts and can be converted into other directions. In addition, the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 can be described as the first direction to the third direction, respectively, and the same reference numerals can be used. In this specification, the first direction axis DR1 and the second direction axis DR2 are orthogonal to each other, and the third direction axis DR3 is a direction perpendicular to the plane defined by the first direction axis DR1 and the second direction axis DR2.

[0067] In an embodiment, the thickness direction of the electronic device EA may be parallel to the third directional axis DR3, which is a direction perpendicular to the plane defined by the first directional axis DR1 and the second directional axis DR2. In this specification, the front surface (or top surface) and the rear surface (or bottom surface) of the components constituting the electronic device EA may be defined based on the third directional axis DR3. In this specification, the term "plane" means a plane parallel to the plane defined by the first directional axis DR1 and the second directional axis DR2, and the term "section" means a plane parallel to the third directional axis DR3.

[0068] Figure 2 is a perspective view showing an electronic device EA-a according to another embodiment, and a mobile phone is shown as an example of the electronic device EA-a. The electronic device EA-a can display an image IM through a display area AA-DD. The display area AA-DD may include a plane defined by a first direction axis DR1 and a second direction axis DR2. The display area AA-DD may include a curved surface bent from at least one side of the plane defined by the first direction axis DR1 and the second direction axis DR2. However, this is an exemplary embodiment, and the shape of the display area AA-DD is not limited thereto. For example, the display area AA-DD may include only a plane, or the display area AA-DD may also include at least two curved surfaces (e.g., four curved surfaces) bent from four side surfaces of the plane, respectively.

[0069] In an embodiment, the non-display area NAA-DD may be disposed adjacent to the display area AA-DD. The non-display area NAA-DD may surround the display area AA-DD. Therefore, the shape of the display area AA-DD may be substantially defined by the non-display area NAA-DD. However, this is shown as an example, and the non-display area NAA-DD may be disposed adjacent to only one side of the display area AA-DD, or the non-display area NAA-DD may be omitted. The display area AA-DD may be disposed in various shapes and is not limited to any one embodiment.

[0070] In an embodiment, Figure 3yes Figure 2 An exploded perspective view of the electronic device EA-a shown in FIG. Figure 3 The electronic device EA-a may include a housing HAU, a display panel DP, and a window member WM. Hereinafter, the description of the display panel DP may be equally applied to Figure 1 and Figure 3 The display panel DP shown in FIG.

[0071] In an embodiment, the housing HAU may include a material having relatively high rigidity. For example, the housing HAU may include a plurality of frames and / or plates composed of glass, plastic, and / or metal. The housing HAU may provide a predetermined accommodation space. The display panel DP may be located in the accommodation space and may be protected from external impacts.

[0072] In an embodiment, the window member WM may cover the entire outer side of the display panel DP. The window member WM may include a transmission area TA and a frame area BZA. The front surface of the window member WM including the transmission area TA and the frame area BZA may correspond to the front surface of the electronic device EA-a. The transmission area TA may correspond to the front surface of the electronic device EA-a. Figure 2 The display area AA-DD of the electronic device EA-a shown in FIG. 1 corresponds to the display area AA-DD of the electronic device EA-a shown in FIG. 1 , and the frame area BZA can correspond to the display area AA-DD of the electronic device EA-a shown in FIG. Figure 2 Corresponding to the non-display area NAA-DD of the electronic device EA-a shown in FIG.

[0073] In an embodiment, the transmission area TA may be an optically transparent area. The frame area BZA may have a relatively low light transmittance compared to the transmission area TA. The frame area BZA may have a predetermined color. The frame area BZA may be positioned adjacent to the transmission area TA and may surround the transmission area TA. The frame area BZA may define the shape of the transmission area TA. However, the invention is not limited to what is shown, and the frame area BZA may be set to be adjacent to only one side of the transmission area TA, or part of the frame area BZA may be omitted.

[0074] In an embodiment, the window member WM may include a window. The window may include an optically transparent insulating material. The window may be a glass substrate or a polymer substrate. For example, the window may be a tempered glass substrate that has been tempered. Alternatively, the window may be made of polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, ethylene-vinyl alcohol copolymer, or a combination thereof. However, these are exemplary, and the materials included in the window are not limited thereto.

[0075] In an embodiment, an active area AA and a peripheral area NAA may be defined in the display panel DP. The active area AA may be Figure 2The display area AA-DD of the electronic device EA-a shown in FIG. 1 corresponds to the display area AA-DD of the electronic device EA-a shown in FIG. 1 , and the peripheral area NAA may correspond to the display area AA-DD of the electronic device EA-a shown in FIG. 1 . Figure 2 Corresponding to the non-display area NAA-DD of the electronic device EA-a shown in FIG.

[0076] In an embodiment, the active area AA may be activated according to an electrical signal. The peripheral area NAA may be disposed adjacent to at least one side of the active area AA.

[0077] In an embodiment, the peripheral area NAA may be provided to surround the active area AA. However, the present invention is not limited thereto and may be different from the Figure 3 Unlike the example shown in FIG. 1 , a portion of the peripheral area NAA may be omitted. A driving circuit and / or a driving line for driving the active area AA may be disposed in the peripheral area NAA.

[0078] In an embodiment, the display panel DP may be a component that basically generates an image. The display panel DP may be a light-emitting display panel, for example, the display panel DP may be an organic light-emitting display panel, an inorganic light-emitting display panel, a quantum dot display panel, a micro-LED display panel, or a nano-LED display panel. The display panel DP may also be referred to as a display layer.

[0079] In an embodiment, Figure 4 is shown with Figure 3 A cross-sectional view of the portion corresponding to line II'. Figure 4 2 may be a cross-sectional view schematically showing the structure of the display panel DP. Figure 4 The display panel DP may include a base layer BS, a circuit layer DP-CL, a display element layer DP-ED and an encapsulation layer TFE. In addition, the display panel DP may further include an optical layer PP.

[0080] In an embodiment, the base layer BS may be a member configured to provide a base surface on which the circuit layer DP-CL is disposed. The base layer BS may be a rigid substrate or a flexible substrate capable of bending, folding or curling. The base layer BS may be a glass substrate, a metal substrate or a polymer substrate. However, the invention is not limited thereto, and the base layer BS may be an inorganic layer, an organic layer or a composite material layer.

[0081] In an embodiment, the circuit layer DP-CL may be disposed on the upper side of the base layer BS. The circuit layer DP-CL may include an insulating layer, a semiconductor pattern, a conductive pattern, and / or a signal line, etc. After forming the insulating layer, the semiconductor layer, and the conductive layer on the base layer BS by a method such as coating or deposition, the insulating layer, the semiconductor layer, and the conductive layer may be selectively patterned by a plurality of photolithography processes. Thereafter, the semiconductor pattern, the conductive pattern, and the signal line included in the circuit layer DP-CL may be formed.

[0082] In an embodiment, the display element layer DP-ED may be disposed on the upper side of the circuit layer DP-CL. The display element layer DP-ED may include a light emitting element ED (see Figure 5 ). For example, the display element layer DP-ED may include an organic light emitting material, an inorganic light emitting material, an organic-inorganic light emitting material, a quantum dot, a quantum rod, a micro LED and / or a nano LED.

[0083] In an embodiment, the encapsulation layer TFE may be disposed on the upper side of the display element layer DP-ED. The encapsulation layer TFE may protect the display element layer DP-ED from moisture, oxygen, and foreign matter (such as dust particles). The encapsulation layer TFE may include at least one insulating layer.

[0084] In an embodiment, an optical layer PP may be disposed on the display panel DP to control light reflected from the display panel DP due to external light. The optical layer PP may include, for example, a polarization layer or a color filter layer.

[0085] Figure 5 1 is a cross-sectional view showing a display panel DP according to an embodiment. The base layer BS may have a single-layer structure or a multi-layer structure. For example, the base layer BS may include a first synthetic resin layer, a multi-layer or single-layer intermediate layer, and a second synthetic resin layer stacked sequentially. The intermediate layer may be referred to as a substrate barrier layer. The intermediate layer may include silicon oxide (SiO x ) layer and an amorphous silicon (a-Si) layer disposed on the silicon oxide layer, but the invention is not particularly limited thereto. For example, the intermediate layer may include at least one of a silicon oxide layer, a silicon nitride layer, a silicon oxynitride layer, and an amorphous silicon layer.

[0086] In an embodiment, each of the first synthetic resin layer and the second synthetic resin layer may include a polyimide resin. In addition, each of the first synthetic resin layer and the second synthetic resin layer may include at least one of an acrylate resin, a methacrylate resin, a polyisoprene resin, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a siloxane resin, a polyamide resin, and a perylene resin. In this specification, a "~~" type resin means a functional group including a "~~". For example, a "perylene" type resin may include a "perylene" group.

[0087] In an embodiment, the circuit layer DP-CL may be disposed on the base layer BS. The circuit layer DP-CL may include a plurality of transistors (not shown). Each of the transistors (not shown) may include a control electrode, an input electrode, and an output electrode. For example, the circuit layer DP-CL may include a switch transistor and a driving transistor for driving the light emitting element ED of the display element layer DP-ED.

[0088] In an embodiment, the display element layer DP-ED may include a light emitting element ED and a pixel defining layer PDL. The light emitting element ED may include a first electrode EL1, a second electrode EL2 disposed on the first electrode EL1, and at least one functional layer FL disposed between the first electrode EL1 and the second electrode EL2.

[0089] In an embodiment, the first electrode EL1 may be an anode. In an embodiment, the first electrode EL1 may include a first layer LL1 (see Figure 6 ), anti-oxidation layer LL3 (see Figure 6 ) and the second layer LL2 (see Figure 6 ). Therefore, the first electrode EL1 may be formed as a microstructure exhibiting good reliability, and the display panel DP including the first electrode EL1 may exhibit good display quality. The first electrode EL1 will be described in more detail later.

[0090] In an embodiment, the pixel defining film PDL may have a transparent property or a light absorbing property. For example, the light absorbing pixel defining film PDL may include a black colorant. The black colorant may include a black dye or a black pigment. The black colorant may include carbon black, a metal such as chromium, or its oxide. The pixel defining film PDL may correspond to a shielding pattern having a light blocking property.

[0091] In an embodiment, the pixel defining film PDL may cover a portion of the first electrode EL1. For example, a pixel opening OH exposing a portion of the first electrode EL1 may be defined in the pixel defining film PDL. The pixel defining film PDL may increase the distance between the edge of the first electrode EL1 and the second electrode EL2. Therefore, the pixel defining film PDL may prevent arcing, etc., from occurring at the edge of the first electrode EL1.

[0092] In an embodiment, the second electrode EL2 may be a cathode. The second electrode EL2 may be provided as a common layer. The second electrode EL2 may be referred to as a common electrode. A common voltage may be supplied to the second electrode EL2. For example, the second electrode EL2 may include at least one selected from the group consisting of Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn and Zn, a compound selected from two or more thereof, a mixture selected from two or more thereof, or an oxide thereof.

[0093] In an embodiment, at least one functional layer FL may include a first light-emitting layer EML-1 and a second light-emitting layer EML-2 disposed on the first light-emitting layer EML-1. The first light-emitting layer EML-1 and the second light-emitting layer EML-2 may be disposed between the first electrode EL1 and the second electrode EL2. In addition, at least one functional layer FL may further include a hole transport region HTR, an electron transport region ETR, and a light-emitting auxiliary layer OG.

[0094] In an embodiment, the light emitting element ED may have a series structure including a plurality of light emitting layers EML-1 and EML-2. The first light emitting layer EML-1 and the second light emitting layer EML-2 may be provided as a common layer. However, the invention is not limited thereto, and the light emitting element ED may include a single light emitting layer (the first light emitting layer or the second light emitting layer) provided as a common layer.

[0095] In an embodiment, each of the first light-emitting layer EML-1 and the second light-emitting layer EML-2 may include an organic light-emitting material and / or an inorganic light-emitting material. The first light-emitting layer EML-1 may emit a first light, and the second light-emitting layer EML-2 may emit a second light different from the first light. For example, the first light-emitting layer EML-1 may emit light in a wavelength range of about 450nm to about 570nm. The second light-emitting layer EML-2 may emit light in a wavelength range of about 590nm to about 750nm. However, this is exemplary, and the wavelengths of light emitted from the first light-emitting layer EML-1 and the second light-emitting layer EML-2, respectively, are not limited thereto. Alternatively, the first light-emitting layer EML-1 and the second light-emitting layer EML-2 may emit light of the same wavelength range.

[0096] In the embodiment, the light emitting element ED including the first light emitting layer EML-1 and the second light emitting layer EML-2 may emit white light. However, the invention is not limited thereto, and the light emitting element ED including the first light emitting layer EML-1 and the second light emitting layer EML-2 may emit blue light.

[0097] In an embodiment, the hole transport region HTR may be disposed between the first electrode EL1 and the first light emitting layer EML-1. The hole transport region HTR may include at least one of a hole injection layer, a hole transport layer, and an electron blocking layer. The hole transport region HTR may include a known hole injection material and / or a hole transport material. The hole transport region HTR may be provided as a common layer. However, the invention is not limited thereto, and the hole transport region HTR may be patterned and provided in the pixel opening OH.

[0098] In an embodiment, the electron transport region ETR may be disposed between the second light emitting layer EML-2 and the second electrode EL2. The electron transport region ETR may include at least one of an electron injection layer, an electron transport layer, and a hole blocking layer. The electron transport region ETR may include a known electron injection material and / or an electron transport material. The electron transport region ETR may be provided as a common layer. However, the invention is not limited thereto, and the electron transport region ETR may be patterned and provided in the pixel opening OH.

[0099] In an embodiment, the light-emitting auxiliary layer OG may be disposed between the first light-emitting layer EML-1 and the second light-emitting layer EML-2. The light-emitting auxiliary layer OG may include a single layer or multiple layers. The light-emitting auxiliary layer OG may include a charge generation layer. In addition, the light-emitting auxiliary layer OG may further include a hole transport region disposed above the charge generation layer and an electron transport region disposed below the charge generation layer. The light-emitting auxiliary layer OG may be disposed as a common layer. However, the invention is not limited thereto, and the light-emitting auxiliary layer OG may be patterned and disposed in the pixel opening OH.

[0100] In an embodiment, the encapsulation layer TFE may cover the light emitting element ED. The encapsulation layer TFE may seal the display element layer DP-ED. The encapsulation layer TFE may be disposed on the second electrode EL2 and fill the pixel opening OH.

[0101] In an embodiment, the encapsulation layer TFE may be a thin film encapsulation layer. The encapsulation layer TFE may be a single layer or multiple layers stacked on each other. The encapsulation layer TFE may include at least one insulating layer. The encapsulation layer TFE according to the embodiment may include at least one inorganic film (hereinafter referred to as an encapsulation inorganic film). In addition, the encapsulation layer TFE according to the embodiment may include at least one organic film (hereinafter referred to as an encapsulation organic film) and at least one encapsulation inorganic film.

[0102] In an embodiment, the encapsulated inorganic film can protect the display element layer DP-ED from moisture / oxygen, and the encapsulated organic film can protect the display element layer DP-ED from foreign matter such as dust particles. The encapsulated inorganic film may include silicon nitride, silicon oxynitride, silicon oxide, titanium oxide and / or aluminum oxide, and the invention is not particularly limited thereto. The encapsulated organic film may include an acrylic compound or an epoxy compound, etc. The encapsulated organic film may include a photopolymerizable organic material, and the invention is not particularly limited thereto.

[0103] In an embodiment, the display panel DP may include a light emitting region PXA and a non-light emitting region NPXA. The light emitting region PXA may be a region that emits light generated by the light emitting element ED. The light emitting region PXA may be divided by a pixel defining film PDL. The non-light emitting region NPXA may be a region disposed between adjacent light emitting regions PXA and may correspond to the pixel defining film PDL. The light emitting region PXA may correspond to a pixel.

[0104] In an embodiment, the light emitting region PXA may include a red light emitting region PXA-R, a green light emitting region PXA-G, and a blue light emitting region PXA-B. The red light emitting region PXA-R, the green light emitting region PXA-G, and the blue light emitting region PXA-B may be spaced apart from each other on a plane.

[0105] For example, in an embodiment, Figure 5 The optical layer PP is shown to include a first color filter CF1, a second color filter CF2, and a third color filter CF3. The first color filter CF1 may be disposed to correspond to the red light emitting region PXA-R, the second color filter CF2 may be disposed to correspond to the green light emitting region PXA-G, and the third color filter CF3 may be disposed to correspond to the blue light emitting region PXA-B.

[0106] For example, in an embodiment, the first color filter CF1 may be a red color filter, the second color filter CF2 may be a green color filter, and the third color filter CF3 may be a blue color filter. Each of the color filters CF1, CF2, and CF3 may include a polymer photosensitive resin and a pigment or dye. The first color filter CF1 may include a red pigment or dye, the second color filter CF2 may include a green pigment or dye, and the third color filter CF3 may include a blue pigment or dye. However, the invention is not limited thereto, and the third color filter CF3 may not include a pigment or dye. The third color filter CF3 may include a polymer photosensitive resin, and may not include a pigment or dye. The third color filter CF3 may be optically transparent. The third color filter CF3 may be formed of a transparent photosensitive resin.

[0107] In an embodiment, a portion of each of the first color filter CF1, the second color filter CF2, and the third color filter CF3 may be disposed in the non-luminous area NPXA. However, the invention is not limited thereto, and each of the first color filter CF1, the second color filter CF2, and the third color filter CF3 may not be disposed in the non-luminous area NPXA, respectively.

[0108] In an embodiment, a light blocking portion (not shown) may be disposed between two adjacent color filters among the first color filter CF1, the second color filter CF2, and the third color filter CF3, respectively. The light blocking portion may be a black matrix. The light blocking portion may include an organic light blocking material or an inorganic light blocking material containing a black pigment or a black dye. The light blocking portion may prevent light leakage and may divide the boundaries between adjacent color filters CF1, CF2, and CF3.

[0109] Figure 6 is a diagram showing a method according to an embodiment of the present invention. Figure 5 A cross-sectional view of an enlarged area XX'. Figure 6may be a cross-sectional view specifically illustrating the configuration of the first electrode EL1 according to the embodiment.

[0110] In the examples and with reference to Figure 6 , the first electrode EL1 may include a first layer LL1, a second layer LL2 disposed above the first layer LL1, and an anti-oxidation layer LL3 disposed between the first layer LL1 and the second layer LL2. The thickness T4 of the first electrode EL1 including the first layer LL1, the anti-oxidation layer LL3, and the second layer LL2 may be about 63nm to about 137nm. Since the first electrode EL1 having a thickness greater than about 137nm is not easily patterned into a microstructure, ultra-high resolution may not be achieved. In an embodiment, the first electrode EL1 having a thickness T4 of about 63nm to about 137nm may be patterned into a microstructure by dry etching. Therefore, the display panel DP including the first electrode EL1 may achieve ultra-high resolution.

[0111] In an embodiment, Figure 1 The head mounted display device (electronic device, EA) shown in FIG. 1 requires ultra-high resolution to realize virtual reality and augmented reality, and the display panel DP including the first electrode EL1 can realize an ultra-high resolution of about 3000 ppi or more. The electronic device EA including the display panel DP according to the embodiment can show good display quality.

[0112] In an embodiment, the first layer LL1 may include an aluminum alloy. The first layer LL1 may include an aluminum alloy composed of aluminum atoms and alloy atoms. In this specification, alloy atoms refer to atoms other than aluminum atoms among the atoms constituting the aluminum alloy. The alloy atoms may be single or multiple. The aluminum alloy constituting the first layer LL1 may include at least one of titanium (Ti), nickel (Ni) and lanthanum (La) as alloy atoms. For example, the first layer LL1 may include an alloy composed of aluminum and titanium. Alternatively, the first layer LL1 may include an alloy composed of aluminum, nickel and lanthanum.

[0113] In an embodiment, in the first layer LL1, when the atomic percentage of the aluminum alloy is about 100at%, the percentage of alloy atoms other than aluminum atoms may be about 0.01at% to about 0.1at%. In the first layer LL1 in which the percentage of alloy atoms other than aluminum atoms is about 0.01at% or more, hillocks may be prevented from appearing. Hillocks may be protruding surfaces of components. The first layer LL1 in which the percentage of alloy atoms other than aluminum atoms is about 0.1at% or less may maintain resistance and exhibit good light reflectivity. The first layer LL1 may reflect downwardly directed light among the light generated from the first light emitting layer EML-1 and the second light emitting layer EML-2, and may direct the light upward. Therefore, the display quality may be improved as the light reflectivity of the first layer LL1 is higher.

[0114] In an embodiment, when the percentage of alloy atoms is less than about 0.01at%, the aluminum alloy is susceptible to heat and hillocks appear in a high-temperature process. The manufacturing process of the display panel DP may include forming a pixel-defining film PDL after forming the first electrode EL1, and the formation of the pixel-defining film PDL may be performed at a high temperature of about 250°C or higher. When the percentage of alloy atoms is less than about 0.01at%, the aluminum alloy is not suitable as a first electrode because hillocks appear in a process at a high temperature of 250°C or higher. When the percentage of alloy atoms exceeds about 0.1at%, the resistance of the first layer increases and the reflectivity of light decreases. When the light reflectivity of the first layer decreases, the light directed upward decreases, and the display quality deteriorates.

[0115] 7A to 7C is an image of an aluminum alloy or aluminum after a heat treatment process at a temperature of about 250° C. according to an embodiment. Fig. 7A and Figure 7B is an image of the surface of an aluminum alloy including alloy atoms, Figure 7C It is an image of the surface of aluminum. Figure 7C is a photograph of a single sheet of aluminum without alloying atoms.

[0116] In an embodiment, Fig. 7A The aluminum alloy is formed of aluminum atoms and alloy atoms, and includes nickel and lanthanum as alloy atoms. Fig. 7A In the aluminum alloy, the atomic percentage of alloy atoms including nickel and lanthanum is about 0.06 at %. Figure 7B The aluminum alloy is formed of aluminum atoms and alloy atoms, and includes titanium as an alloy atom. Figure 7B In the aluminum alloy, the atomic percentage of titanium is about 0.06 at %. Fig. 7A and Figure 7B The aluminum alloy satisfies the atomic percentage of alloy atoms according to the embodiment.

[0117] and Fig. 7A and Figure 7B By comparison, according to the embodiment, it can be seen that in Figure 7C A small hillock HLK appears in the Figure 7C The aluminum does not include alloy atoms, so it is easily heated, resulting in the appearance of hillocks HLK. In contrast, it can be seen that in the case of satisfying the atomic percentage of the alloy atoms according to the embodiment Fig. 7A and Figure 7B Therefore, it is determined that the first layer LL1 formed of the aluminum alloy satisfying the percentage of alloy atoms according to the embodiment will exhibit good heat resistance.

[0118] In the embodiment and returning to reference Figure 6, the thickness T1 of the first layer LL1 may be about 60 nm to about 120 nm. For example, the thickness T1 of the first layer LL1 may be about 100 nm. The surface roughness of the first layer having a thickness greater than about 120 nm will increase due to the increase in the size of the aluminum particles. When the surface roughness increases, diffuse reflection occurs, which causes the display quality to deteriorate. In addition, the first layer having a thickness greater than about 120 nm is not easily formed by dry etching and may not be patterned into a microstructure.

[0119] In an embodiment, light passes through the first layer having a thickness of less than about 60 nm, and the light directed upward is reduced, resulting in deteriorated display quality. In an embodiment, the first layer LL1 having a thickness T1 of about 60 nm to about 120 nm can exhibit low transmittance and good light reflectivity, thereby improving display quality.

[0120] Fig. 8A and Figure 8B is an image of a cross section of a first layer formed of aluminum having a thickness of about 600 nm according to an embodiment. Fig. 8A and Figure 8B , it can be seen that since aluminum having a thickness of about 600 nm is formed to have a very large thickness and includes large aluminum particles, its surface is uneven and its surface roughness increases. When the surface roughness increases, diffuse reflection occurs and the display quality deteriorates.

[0121] In an embodiment, return to reference Figure 6 , the second layer LL2 may include a transparent conductive oxide (TCO). The second layer LL2 may include a material having good hole injection characteristics. The hole transport region HTR may be disposed on the second layer LL2. For example, the second layer LL2 may include indium tin oxide (ITO).

[0122] In an embodiment, the thickness T2 of the second layer LL2 may be about 2 nm to about 12 nm. For example, the thickness T2 of the second layer LL2 may be about 5 nm. A second layer having a thickness less than 2 nm is difficult to form to have a uniform thickness, and a second layer having a thickness greater than 12 nm cannot be stably formed due to self-stress. In an embodiment, the second layer LL2 having a thickness T2 of about 2 nm to about 12 nm may be formed to have a uniform thickness and exhibit good processability.

[0123] In an embodiment, the anti-oxidation layer LL3 may be directly disposed between the first layer LL1 and the second layer LL2. In this specification, when a component is directly disposed between other components, it means that the third component is not disposed between the one component and the other component. In other words, when a component is directly disposed between other components, it means that the one component and the other component are in contact with each other.

[0124] In an embodiment, the anti-oxidation layer LL3 may be a layer that prevents oxide from being formed due to contact between the first layer LL1 and the second layer LL2. When the anti-oxidation layer is not included, the first layer including the aluminum alloy and the second layer including the indium tin oxide are in contact with each other, and an aluminum oxide film is formed between the first layer and the second layer. The aluminum oxide film absorbs light, thereby reducing display quality and increasing the driving voltage of the light-emitting element. In contrast, in an embodiment, the first electrode EL1 including the anti-oxidation layer LL3 disposed between the first layer LL1 and the second layer LL2 may improve display quality. In addition, the light-emitting element ED including the first electrode EL1 (see Figure 5 ) can prevent the increase of driving voltage, and the first electrode EL1 includes an anti-oxidation layer LL3 arranged between the first layer LL1 and the second layer LL2.

[0125] In an embodiment, the anti-oxidation layer LL3 may include titanium nitride (TiN). In a method of manufacturing a display panel according to an embodiment to be described later, the anti-oxidation layer LL3 may be formed on the surface of the preliminary first layer P-LL1 (see FIG. 1 ) including an aluminum alloy. Fig.16 ) In the same step, the preliminary anti-oxidation layer P-LL3 (see Fig.16 ) is etched. The anti-oxidation layer LL3 can be formed by a preliminary anti-oxidation layer P-LL3 (see Fig.16 ), and the first layer LL1 may be formed by the preliminary first layer P-LL1. Therefore, the method for manufacturing a display panel according to the embodiment may exhibit good manufacturing efficiency. The method for manufacturing a display panel according to the embodiment will be described in more detail later.

[0126] In an embodiment, the thickness T3 of the anti-oxidation layer LL3 may be about 1 nm to about 5 nm. An anti-oxidation layer having a thickness less than about 1 nm is not easy to form, and an anti-oxidation layer having a thickness greater than about 5 nm has a high light absorption rate, thereby causing display quality degradation. In an embodiment, the anti-oxidation layer LL3 having a thickness T3 of about 1 nm to about 5 nm can be easily formed, thereby improving display quality.

[0127] Fig. 9 is a graph showing the results of evaluating light reflectance according to wavelength in Experimental Examples 1 to 3 in which the thickness T3 of the anti-oxidation layer LL3 is different from each other. In the embodiment, each of Experimental Examples 1 to 3 includes a first layer LL1 and an anti-oxidation layer LL3, and the thickness of the first layer is about 60 nm. In Experimental Examples 1 to 3, only the thickness of the anti-oxidation layer LL3 is different from each other. Fig. 9 The relative reflectivity in ∝ represents the relative light reflectivity of the anti-oxidation layer LL3 when the light reflectivity of the first layer LL1 is about 100%.

[0128] In an embodiment, Experimental Example 2 includes an anti-oxidation layer having a thickness of about 10 nm, and Experimental Example 3 includes an anti-oxidation layer having a thickness of about 20 nm. Experimental Example 1 includes an anti-oxidation layer having a thickness of about 5 nm, and satisfies the thickness range of the anti-oxidation layer LL3 according to an embodiment. The thickness T3 of the anti-oxidation layer LL3 according to an embodiment may be about 1 nm to about 5 nm.

[0129] In the examples and with reference to Fig. 9 , it can be seen that the relative reflectivity of Experimental Example 1 is higher than the relative reflectivity of Experimental Example 2 and Experimental Example 3. It can be seen that when Experimental Example 1 includes an anti-oxidation layer satisfying the thickness range according to the embodiment, Experimental Example 1 exhibits good light reflectivity. It can be seen that when Experimental Examples 2 and 3 include an anti-oxidation layer formed with a relatively large thickness, Experimental Examples 2 and 3 exhibit low light reflectivity, thereby increasing their light absorptivity. Therefore, in the embodiment, it is determined that the anti-oxidation layer LL3 having a thickness T3 of about 1 nm to about 5 nm can improve the display quality.

[0130] Fig.10 is a cross-sectional view showing a display panel DP-a according to another embodiment. Fig.10 In the description of Figures 1 to 9 The contents described are repeated, and the differences will be mainly described.

[0131] In an embodiment, Figure 5 Compared with the display panel DP shown in Fig.10 The display panel DP-a shown in FIG. 1 is different from the display panel DP-a in that the light emitting element ED includes a first light emitting element ED-1, a second light emitting element ED-2 and a third light emitting element ED-3. Fig.10 In the embodiment, the optical layer PP may include a polarizing layer or Figure 5 The first color filter CF1, the second color filter CF2 and the third color filter CF3 shown in FIG.

[0132] In an embodiment, the first light emitting element ED-1, the second light emitting element ED-2, and the third light emitting element ED-3 may be spaced apart from each other on the second direction axis DR2 perpendicular to the third direction axis DR3. Each of the first light emitting element ED-1, the second light emitting element ED-2, and the third light emitting element ED-3 may include a first electrode EL1, a second electrode EL2 disposed on the first electrode EL1, and a functional layer FL-a disposed between the first electrode EL1 and the second electrode EL2. Figure 5 Compared with the functional layer FL, Fig.10The functional layer FL-a is different therefrom in that it includes a red light emitting layer EML-R, a green light emitting layer EML-G, and a blue light emitting layer EML-B which are patterned and disposed in the pixel opening OH.

[0133] In an embodiment, the first light-emitting element ED-1 may include a red light-emitting layer EML-R and emit red light. The first light-emitting element ED-1 may be arranged to correspond to the red light-emitting region PXA-R. The second light-emitting element ED-2 may include a green light-emitting layer EML-G and emit green light. The second light-emitting element ED-2 may be arranged to correspond to the green light-emitting region PXA-G. The third light-emitting element ED-3 may include a blue light-emitting layer EML-B and emit blue light. The third light-emitting element ED-3 may be arranged to correspond to the blue light-emitting region PXA-B.

[0134] In the embodiment, although Fig.10 It is shown that each of the first light-emitting element ED-1, the second light-emitting element ED-2, and the third light-emitting element ED-3 includes one light-emitting layer, but the invention is not limited thereto. For example, each of the first light-emitting element ED-1, the second light-emitting element ED-2, and the third light-emitting element ED-3 may include a plurality of light-emitting layers configured to emit light of the same wavelength range.

[0135] The display panel may be formed by the method of manufacturing the display panel according to the embodiment. Fig.11A and Fig. 11B is a flowchart showing a method of manufacturing a display panel according to an embodiment, and Figures 12 to 17 The steps of manufacturing a display panel according to an embodiment are schematically shown. FIG. 11A to FIG. 17 In the description of Figures 1 to 10 The contents described are repeated, and the differences will be mainly described.

[0136] Reference Fig.11A , the method for manufacturing a display panel according to an embodiment may include preparing a base layer (S100), forming a first electrode (S200), forming a functional layer (S300), and forming a second electrode (S400). Although not shown, the method for manufacturing a display panel DP or DP-a according to an embodiment may further include forming a first electrode EL1 (see Figure 5 and Fig.10 ) and forming a functional layer FL or FL-a (see Figure 5 and Fig.10 ) to form a pixel definition film PDL (see Figure 5 and Fig.10 ).

[0137] In the examples and with reference to Fig. 11BThe step of forming a first electrode (S200) may include forming a preliminary first layer (S210), forming a preliminary anti-oxidation layer (S220), forming a preliminary second layer (S230), forming a second layer (S240), and forming a first layer and an anti-oxidation layer (S250). Figures 12 to 17 The formation of the first electrode ( S200 ) according to the embodiment may be schematically illustrated.

[0138] In the examples and with reference to Fig.12 , a circuit layer DP-CL may be formed on a base layer BS, and a preliminary first layer P-LL1, a preliminary anti-oxidation layer P-LL3, and a preliminary second layer P-LL2 may be sequentially formed on the circuit layer DP-CL. The preliminary first layer P-LL1 may be formed by providing an aluminum alloy consisting of aluminum atoms and alloy atoms. The preliminary first layer P-LL1 may be formed by a sputtering method. For example, the alloy atoms may include at least one of titanium (Ti), nickel (Ni), and lanthanum (La). In an embodiment, the percentage of alloy atoms other than aluminum atoms in the aluminum alloy may be about 0.01at% to about 0.1at%. The preliminary first layer P-LL1 formed by an aluminum alloy having a percentage of alloy atoms other than aluminum atoms of about 0.01at% to about 0.1at% may exhibit good heat resistance. Therefore, the first layer LL1 formed by the preliminary first layer P-LL1 may prevent hillocks from appearing in a high temperature process for forming a pixel defining film PDL, etc.

[0139] In an embodiment, a preliminary anti-oxidation layer P-LL3 may be formed on the preliminary first layer P-LL1. The preliminary anti-oxidation layer P-LL3 may be formed by depositing titanium nitride by a sputtering method. A preliminary second layer P-LL2 may be formed on the preliminary anti-oxidation layer P-LL3. The preliminary second layer P-LL2 may be formed by depositing a transparent conductive oxide by a sputtering method. For example, the preliminary second layer P-LL2 may be formed of indium tin oxide.

[0140] In the embodiments, reference Fig.13 , a photosensitive film P-PT may be disposed on the entire surface of the preliminary second layer P-LL2. The photosensitive film P-PT may be exposed to light through a mask MSK. The mask MSK may consist of a first portion M1 that blocks all irradiated light and a second portion M2 that transmits some light and blocks some light. The preliminary first layer P-LL1, the preliminary anti-oxidation layer P-LL3, and the preliminary second layer P-LL2 may be divided into a first region R1 corresponding to the first portion M1 and a second region R2 corresponding to the second portion M2.

[0141] In an embodiment, after the photosensitive film P-PT exposed through the mask MSK is developed, as shown in FIG. Fig.14As shown in , the photosensitive film pattern PT having a predetermined thickness may remain in the first region R1 blocked by the mask MSK and to which light is not provided, and in the second region R2 to which light is provided through the second portion M2 of the mask MSK, the photosensitive film P-PT may be completely removed and the surface of the preliminary second layer P-LL2 may be exposed. At the same time, Fig.13 and Fig.14 An embodiment in which the exposed portion of the photosensitive film P-PT is removed using a positive photosensitive solution is exemplarily described, but the invention is not limited thereto. A negative photosensitive solution may be used to remove the unexposed portion of the photosensitive film P-PT.

[0142] In an embodiment, the photosensitive film pattern PT may be used as a mask layer for etching the preliminary second layer P-LL2. The preliminary second layer P-LL2 may be wet etched by an etching solution ET. The etching solution ET may be a solution that etches the preliminary second layer P-LL2 and does not etch the preliminary anti-oxidation layer P-LL3 and the preliminary first layer P-LL1. For example, the preliminary second layer P-LL2 may be formed of indium tin oxide, and an oxalic acid-based etching solution may be provided as the etching solution ET. However, this is exemplary, and the etching solution ET is not limited thereto.

[0143] In the examples and with reference to Fig.15 , the second layer LL2 may be formed by wet-etching the preliminary second layer P-LL2. After the second layer LL2 is formed, the surface of the preliminary anti-oxidation layer P-LL3 may be exposed in the second region R2.

[0144] In the examples and with reference to Fig.16 and Fig.17 , the preliminary anti-oxidation layer P-LL3 and the preliminary first layer P-LL1 may be etched to form the anti-oxidation layer LL3 and the first layer LL1. After the anti-oxidation layer LL3 and the first layer LL1 are formed, the photosensitive film pattern PT may be removed. The photosensitive film pattern PT may be used as a mask layer for etching the preliminary anti-oxidation layer P-LL3 and the preliminary first layer P-LL1. When the photosensitive film pattern PT is disposed in the first region R1, the preliminary anti-oxidation layer P-LL3 and the preliminary first layer P-LL1 may be exposed in the second region R2.

[0145] In an embodiment, the preliminary anti-oxidation layer P-LL3 and the preliminary first layer P-LL1 may be dry etched by providing an etching gas DG. The preliminary anti-oxidation layer P-LL3 and the preliminary first layer P-LL1 may be dry etched and patterned into a microstructure. Fluorine gas or chlorine gas may be provided as the etching gas DG. The preliminary anti-oxidation layer P-LL3 and the preliminary first layer P-LL1 may be etched simultaneously. The preliminary anti-oxidation layer P-LL3 and the preliminary first layer P-LL1 may be etched together. The preliminary anti-oxidation layer P-LL3 may be formed of titanium nitride and etched in the same step as the preliminary first layer P-LL1 formed of an aluminum alloy. The method for manufacturing a display panel according to an embodiment including the step of jointly etching the preliminary anti-oxidation layer P-LL3 and the preliminary first layer P-LL1 in a dry process may exhibit good manufacturing efficiency and manufacturing reliability.

[0146] The display panel may be manufactured by the method for manufacturing a display panel according to an embodiment, and the display panel may include a first electrode. In an embodiment, the first electrode may include a first layer formed of an aluminum alloy, a second layer formed of a transparent conductive oxide and disposed on the first layer, and an anti-oxidation layer disposed between the first layer and the second layer. The anti-oxidation layer may be formed of titanium nitride and prevents the formation of an oxide film between the first layer and the second layer. In the first layer, the percentage of alloy atoms other than aluminum atoms in the aluminum alloy may be about 0.01 at% to about 0.1 at%. Therefore, in the method for manufacturing a display panel, the first layer may exhibit good heat resistance in a high temperature process after forming the first electrode.

[0147] The display panel and the electronic device including the display panel according to the embodiment may include a first electrode including an anti-oxidation layer disposed between a first layer and a second layer, thereby exhibiting good display quality.

[0148] The method of manufacturing a display panel according to an embodiment may include the step of jointly etching the preliminary first layer and the preliminary anti-oxidation layer, thereby exhibiting good manufacturing efficiency and manufacturing reliability.

[0149] Although the above content has been described with reference to the embodiments, it will be understood by those skilled in the art or those of ordinary skill in the art that various modifications and changes may be made to the invention without departing from the spirit and technical field of the invention. Therefore, it will be understood that the invention should not be limited to these embodiments. In addition, the embodiments or parts of the embodiments may be combined in whole or in part without departing from the scope of the invention.

Claims

1. A display panel, the display panel include: Light emitting element; as well as a pixel defining film having a pixel opening defined therein, The light emitting element includes: a first electrode exposed through the pixel opening; a second electrode disposed on the first electrode; and at least one functional layer disposed between the first electrode and the second electrode. The first electrode comprises: a first layer comprising an aluminum alloy; a second layer comprising a transparent conductive oxide; and an anti-oxidation layer comprising titanium nitride and disposed between the first layer and the second layer. Wherein, when the atomic percentage of the aluminum alloy is 100 at %, the percentage of alloy atoms other than aluminum atoms in the aluminum alloy is 0.01 at % to 0.1 at %.

2. The display panel according to claim 1, in, The alloy atoms include at least one of titanium, nickel and lanthanum, and Wherein, the transparent conductive oxide includes indium tin oxide.

3. The display panel according to claim 1, in, The first layer has a thickness of 60 nm to 120 nm, wherein the second layer has a thickness of 2 nm to 12 nm, and Wherein, the anti-oxidation layer has a thickness of 1 nm to 5 nm.

4. The display panel according to claim 1, in, The at least one functional layer comprises: A first light emitting layer configured to emit a first light; and A second light emitting layer is disposed on the first light emitting layer and is configured to emit second light, wherein the second light is different from the first light.

5. The display panel according to claim 1, in, The light emitting element includes a first light emitting element, a second light emitting element, and a third light emitting element, each of the first light emitting element, the second light emitting element, and the third light emitting element is spaced apart from each other in one direction, wherein the one direction is perpendicular to the thickness direction, The first light emitting element emits red light, the second light emitting element emits green light, and the third light emitting element emits blue light.

6. A method for manufacturing a display panel, the method include: Preparing a substrate layer; forming a first electrode, the first electrode comprising a first layer disposed on the base layer, a second layer disposed on the first layer, and an anti-oxidation layer disposed between the first layer and the second layer; forming a functional layer on the first electrode; as well as forming a second electrode on the functional layer, Among them, the step of forming the first electrode includes: forming a preliminary first layer by providing an aluminum alloy; forming a preliminary anti-oxidation layer on the preliminary first layer by providing titanium nitride; forming a preliminary second layer on the preliminary anti-oxidation layer by providing a transparent conductive oxide; forming the second layer by wet etching the preliminary second layer; and forming the first layer and the anti-oxidation layer by jointly etching the preliminary first layer and the preliminary anti-oxidation layer.

7. The method according to claim 6, in, When the atomic percentage of the aluminum alloy is 100 at %, the percentage of alloy atoms other than aluminum atoms in the aluminum alloy is 0.01 at % to 0.1 at %.

8. The method according to claim 7, in, The alloy atoms include at least one of titanium, nickel and lanthanum, Wherein, the transparent conductive oxide comprises indium tin oxide, and Wherein, an oxalic acid etching solution is provided in the step of forming the second layer.

9. The method according to claim 6, in, The preliminary first layer and the preliminary anti-oxidation layer are dry-etched, and Wherein, in the step of forming the first layer and the anti-oxidation layer, fluorine gas or chlorine gas is provided.

10. An electronic device, wherein the electronic device include: Display panel; as well as a lens system, arranged opposite to the display panel, Wherein, the display panel is the display panel according to any one of claims 1 to 5.

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