Pixel defining layer preparation method

Abstract

The invention relates to a preparation method of a pixel defining layer, which comprises the following steps: coating and coating a photosensitive composition containing a coloring agent, and the average particle size of the coloring agent is 60-140 nm; pre-baking is conducted; performing exposure; developing is conducted; post exposure; and carrying out post-baking treatment. The post-baking treatment step is implemented for 30-120 minutes in an oven at the temperature of 200-300 DEG C, and after the post-baking treatment step, the thickness of the Full-tone is 2.80-3.20 microns, the thickness of the Half-tone is 1.00-1.90 microns, and no residue exists.

Description

Technical Field

[0001] The invention relates to a method for preparing a pixel defining layer of a light-emitting display device by utilizing a photosensitive composition. Background Art

[0002] Flat panel display devices widely use liquid crystal display devices (LCD: Liquid crystal display device), organic light emitting display devices (OLED: Organic light emitting display device), etc. Among them, organic light emitting display devices have the advantages of low power consumption, fast response speed, high color reproduction rate, high brightness, wide viewing angle, etc.

[0003] The purpose of using the polarizing film in the organic light emitting display device is to shield the light reflected from the panel after incident external light. However, the disadvantage is that due to the lack of bending properties, the polarizing film is not suitable for use in flexible devices.

[0004] In order to solve the above problems, it has been suggested to use color filters and black matrices and to form a light-shielding inorganic film on the upper substrate. However, this method has limitations in obtaining the desired level of anti-reflection effect, and no specific method for replacing the polarizing film is provided.

[0005] In addition, the colored patterns are used as red, green, and blue color filters not only in liquid crystal displays but also in organic light-emitting displays.

[0006] When manufacturing the colored pattern, not only a variety of organic pigments but also carbon black and inorganic pigments are used as colorants. The equally dispersed pigment dispersion is mixed with other compositions to form a pattern. Before vapor-depositing the organic light-emitting layer, in order to support the metal mask for vapor deposition, a photolithography process is added and then the vapor deposition process is carried out.

[0007] Such a pattern needs to be formed with a suitable thickness so as to shield the externally projected light or the light reflected from the bottom. When the pixels formed in this way are used to prepare an organic light-emitting display, more vivid colors can be achieved.

[0008] However, the larger the particles of the inorganic pigment used for coloring the pattern, the thicker the pattern thickness, which may reduce visibility, while the smaller the particles, the thinner the pattern thickness, which may become a cause of reduced brightness reliability. Summary of the invention

[0009] Issues to be solved

[0010] In order to solve the above-mentioned drawbacks of the conventional technology, an implementation example of the present invention adjusts the size of the inorganic pigment to adjust the thickness of the pattern, thereby realizing an organic light-emitting display, which can not only make the color brighter, but also improve the reliability and extend the life of the display.

[0011] In another implementation example, in order to reduce damage to the panel, the processes of preparing two layers are integrated into a single process, thereby realizing a colored pattern with a short process time on the electrode substrate, which not only makes the color brighter, but also improves the reliability of the display and extends its life.

[0012] That is, on a negative type photomask that transmits light to achieve curing, if the transmittance of a local section is reduced to change the exposure amount, after development, the degree of curing will vary depending on the exposure amount, and steps will appear on the pattern.

[0013] Yet another implementation example provides an organic light emitting display device including a pixel defining layer prepared by the method.

[0014] Yet another implementation example provides an electronic device including the organic light emitting display device.

[0015] Problem Solution

[0016] The method for preparing a pixel defining layer according to the present invention comprises the steps of: coating and coating a photosensitive composition containing a colorant, wherein the average particle size of the colorant is 60 nm to 140 nm; pre-baking; exposure; development; post-exposure; and post-baking treatment. Preferably, the post-baking treatment step is performed in an oven at 200°C to 300°C for 30 minutes to 120 minutes. After the post-baking treatment step, the thickness of Full-tone is 2.80 μm to 3.20 μm, and the thickness of Half-tone is 1.00 μm to 1.90 μm, without residue.

[0017] Further preferably, the average particle size is 70 nm to 130 nm.

[0018] More preferably, the average particle size is 80 nm to 120 nm.

[0019] Preferably, the colorant comprises one or more of an inorganic dye, an organic dye, an inorganic pigment and an organic pigment.

[0020] Preferably, the content of the colorant in the total amount of the photosensitive composition is 1 to 40 wt %.

[0021] Preferably, the colorant is pretreated with a dispersant; or a water-soluble inorganic salt and a wetting agent.

[0022] Preferably, after the development step, the half-tone thickness is 1.40 to 2.00 μm.

[0023] Further preferably, after the development step, the full-tone thickness is 3.20 to 3.42 μm.

[0024] Preferably, after the post-baking step, the half-tone thickness of the pattern is 1.20 to 1.80 μm.

[0025] Further preferably, after the post-baking step, the full-tone thickness of the pattern is 2.90 to 3.10 μm.

[0026] Further preferably, the temperature of the hot plate in the pre-baking step is 90°C to 120°C.

[0027] More preferably, the pre-baking step is performed for 100 seconds to 150 seconds.

[0028] More preferably, the developing step is performed for 35 to 55 seconds.

[0029] Further preferably, the post-exposure step irradiates 100 to 900 mJ / cm 2 Actinic rays.

[0030] More preferably, the post-baking step is performed at a temperature of 230 to 270°C.

[0031] Preferably, the photosensitive composition comprises a photolithography resin, and the photolithography resin comprises an acrylic binder resin, a cardo binder resin, or a combination thereof.

[0032] Preferably, the acrylic binder resin has a weight average molecular weight of 3,000 g / mol to 150,000 g / mol.

[0033] Preferably, the cardo-based binder resin includes a repeating structure represented by the following chemical formula 1:

[0034] <Chemical Formula 1>

[0035]

[0036] In the chemical formula 1,

[0037] 1) R 1 and R 2 Independently of each other: hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C30 Heterocyclyl group; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group,

[0038] 2) R 1 and R 2 Rings can be formed between adjacent bases.

[0039] 3) m or n is independently an integer from 0 to 4,

[0040] 4) A1 and A2 are independently of each other represented by the following chemical formula 2 or chemical formula 3,

[0041] <Chemical Formula 2>

[0042]

[0043] <Chemical formula 3>

[0044]

[0045] In the chemical formula 2 and the chemical formula 3,

[0046] 4-1)* indicates the connected parts,

[0047] 4-2) R 3 ~R 6 Independently of each other: hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 Heterocyclyl group; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20Alkyl group; C2~C 20 alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group,

[0048] 4-3) R 3 ~R 6 Rings can be formed between adjacent bases.

[0049] 4-4)Y 1 and Y 2 Independently of each other, they are the following chemical formulas: Chemical formula 6 or Chemical formula 7,

[0050] <Chemical Formula 6>

[0051]

[0052] <Chemical Formula 7>

[0053]

[0054] In the chemical formula 6 and the chemical formula 7,

[0055] 4-4-1)* indicates the bonding position,

[0056] 4-4-2)R 9 is hydrogen or methyl ester;

[0057] 4-4-3)R 10 ~R 13 Independently of each other: hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 heterocyclic group; C6~C 30 The fused ring group of the aliphatic ring and the aromatic ring (cycl o group); C1~C 20 Alkyl group; C2~C 20alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group,

[0058] 4-4-4)L 1 ~L 3 are independently: a single bond; a fluorenyl group; C2~C 30 Alkylene; C6~C 30 Arylene; C2~C 30 Heterocyclic ring; C1~C 30 Alkoxylene; C2~C 30 Alkyleneoxy; C6~C 30 aryloxy group; C2~C 30 The polyethyleneoxy group,

[0059] 4-4-5) q and r are independently integers from 0 to 3; however, q+r=3,

[0060] 5) The resin includes a repeating unit represented by Chemical Formula 1, wherein within the polymer chain, the ratio of A1 to A2 is 9:1 to 1:9,

[0061] 6)X 1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; the following chemical formula 4; or chemical formula 5,

[0062] 6-1) R' and R" are independently: hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 Heterocyclyl group; C6~C 30 The fused ring group of aliphatic ring and aromatic ring (cyclo group); C1~C 20Alkyl group; C2~C 20 alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group,

[0063] 6-2) R' and R" can form a ring between adjacent groups,

[0064] <Chemical Formula 4>

[0065]

[0066] <Chemical Formula 5>

[0067]

[0068] In the chemical formula 4 and the chemical formula 5,

[0069] 6-3)* indicates the bonding position,

[0070] 6-4) R 7 ~R 8 Independently of each other: hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 Heterocyclyl group; C6~C 30 The fused ring group of aliphatic ring and aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group,

[0071] 6-5) o and p are independently integers from 0 to 4,

[0072] 7)X 2 It is C6~C 30 an aryl group; a C2-C 30 heterocyclic group; C6~C 30 The fused ring group of aliphatic ring and aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group,

[0073] 8) R', R", X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 may be further substituted with one or more substituents selected from the group consisting of the following components: deuterium; halogen; substituted or unsubstituted C1-C 30 Alkyl group or C6~C 30aryl group, silane group, siloxane group, boron group, germanium group, cyano group, amino group, nitro group, C1~C 30 Alkylthio group; C1~C 30 Alkoxy group; C6~C 30 Aryl alkoxy group; C1~C 30 Alkyl group; C2~C 30 alkenyl group; C2~C 30 Alkinyl group; C6~C 30 aryl group; C6~C 30 aryl group; fluorenyl group; C2~C 30 A heterocyclic group comprising at least one heteroatom selected from the group consisting of O, N, S, Si and P; C3~C 30 Aliphatic ring group; C7~C 30 Aryl alkyl group; C8~C 30 and combinations thereof, and adjacent substituents may form a ring.

[0074] Preferably, the cardo-based resin has a weight average molecular weight of 1,000 to 100,000 g / mol.

[0075] Preferably, the content of the cardo-based resin in the total amount of the photosensitive composition is 1 to 30 weight %.

[0076] Preferably, as described above, the photosensitive composition comprises: the reactive unsaturated compound in an amount of 1 to 40 wt % in the total amount thereof.

[0077] Preferably, the photosensitive composition comprises: a photoinitiator in an amount of 0.01 to 10 wt % based on the total amount of the photosensitive composition.

[0078] In yet another specific example, preferably, the present invention provides a pixel defining layer prepared by the preparation method.

[0079] In yet another specific example, preferably, the present invention provides an organic light emitting display device including the pixel defining layer.

[0080] In yet another specific example, preferably, the present invention provides an electronic device, which includes the display device and a control unit for driving the display device.

[0081] Effects of the Invention

[0082] The purpose of the present invention is to realize a coloring pattern of appropriate thickness on an electrode substrate, so as to make the color vivid while improving the reliability and extending the life of the display. That is, when the half-tone thickness exceeds 1.90 μm or is less than 1.00 μm after post-baking, it may lead to reduced adhesion, reduced visibility, reduced brightness, and shortened life in subsequent processes. Therefore, the size of the inorganic pigment is made into 80 nm to 120 nm, and the inorganic pigment contains the colorant of the present invention, which improves visibility after the post-baking process and reduces the possibility of reduced brightness and shortened life. BRIEF DESCRIPTION OF THE DRAWINGS

[0083] Figure 1 This is a schematic diagram showing a cross section of the pixel defining layer described in the examples and comparative examples, taken with a scanning electron microscope. DETAILED DESCRIPTION

[0084] Hereinafter, some embodiments of the present invention will be described in detail with reference to the schematic diagrams. When components of each drawing are denoted by reference symbols, the same components are given the same symbols as much as possible even if they are shown in other drawings.

[0085] In the process of describing the present invention, if it is considered that the detailed description of the relevant known structure or function will confuse the main points of the present invention, the detailed description thereof may be omitted. When the present invention adopts "including", "having", "comprising", etc., other parts may be added unless "to only" is used. When the constituent elements are expressed in the singular, unless otherwise clearly stated, the case of expressing them in the plural is included.

[0086] Furthermore, in describing the components of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only used to distinguish the components from other components, and the nature, order, sequence or number of the components are not limited by these terms.

[0087] In the process of describing the positional relationship of constituent elements, when it is mentioned that two or more constituent elements are "connected", "combined" or "accessed", it should be understood that the two or more constituent elements can be directly "connected", "combined" or "accessed", but can also be further "carried with" the two or more constituent elements and other constituent elements to achieve "connection", "combination" or "access". Among them, the other constituent elements can include one or more of the two or more constituent elements that are "connected", "combined" or "accessed" to each other.

[0088] Furthermore, when a component such as a layer, film, region, or plate is located “on” or “over” another component, it should be understood that it includes not only the case where it is located “directly above” another component, but also the case where there is another component in between. Conversely, when a component is located “directly above” another part, it should be understood that there is no other part in between.

[0089] When describing the time flow relationship related to constituent elements, working methods, or manufacturing methods, for example, when describing the time sequence relationship or process sequence relationship such as "after", "next to", "then", "before", etc., since "immediately" or "directly" is not used, discontinuous situations can be further included.

[0090] In addition, when referring to the numerical value of a constituent element or the information corresponding thereto, even if not clearly stated separately, it should be interpreted that the numerical value or the information corresponding thereto includes: the error range caused by various factors (for example, engineering factors, internal or external impact, noise, etc.).

[0091] Unless otherwise described, the terms used in this specification and the appended claims are as follows within the scope that does not depart from the spirit of the present invention.

[0092] Unless otherwise described, the term "halo" or "halogen" used in the present application includes fluorine (F), chlorine (Cl), bromine (Br) and iodine (I).

[0093] Unless otherwise specified, the term "alkyl" or "alkyl group" used in this application contains 1 to 60 carbon atoms connected by single bonds, and refers to a free radical of a saturated aliphatic functional group represented by a straight chain alkyl group, a branched chain alkyl group, a cycloalkyl (alicyclic) group, an alkyl-substituted cycloalkyl group, and a cycloalkyl-substituted alkyl group.

[0094] Unless otherwise described, the term "haloalkyl group" or "halogenalkyl group" used in the present application refers to an alkyl group substituted with halogen.

[0095] Unless otherwise described, the term "alkenyl" or "alkynyl" used in the present application respectively has a double bond or a triple bond, contains a straight chain or a side chain, and has 2 to 60 carbon atoms, but is not limited thereto.

[0096] Unless otherwise described, the term "cycloalkyl" used in the present application means a cyclic alkane having 3 to 60 carbon atoms, but is not limited thereto.

[0097] The term "alkoxy group" or "alkyloxy group" used in the present application refers to an alkyl group to which an oxygen radical is bonded, and unless otherwise specified, has 1 to 60 carbon atoms, but is not limited thereto.

[0098] The term "alkenoxyl group", "alkenoxygroup", "alkenyloxyl group" or "alkenyloxy group" used herein means an alkenyl group to which an oxygen radical is bonded, and unless otherwise specified, has 2 to 60 carbon atoms, but is not limited thereto.

[0099] Unless otherwise described, the terms "aryl group" and "arylene group" used in the present application have 6 to 60 carbons, respectively, but are not limited thereto. In the present application, aryl group or arylene group include monocyclic type, cyclopolymer, condensed polycyclic compounds, etc. For example, the aryl group may include a monovalent functional group of phenyl group, biphenyl, a monovalent functional group of naphthalene, a fluorenyl group, and a substituted fluorenyl group. Arylene group may include a fluorenyl group and a substituted fluorenyl group.

[0100] The term "ring assemblies" used in the present application is composed of two or more ring systems (monocyclic or fused ring systems) directly connected by a single bond or a double bond, indicating that the number of directly connected rings is less than the total number of ring systems contained in the compound by 1. The ring assemblies can be directly connected by the same or different ring systems through a single bond or a double bond.

[0101] In the present application, the aryl group includes a cyclopolymer, and thus, the aryl group includes biphenyl and terphenyl connected by a single bond to a benzene ring as a monocyclic aromatic. In addition, the aryl group also includes a compound in which an aromatic ring system fused to an aromatic monocyclic ring is connected by a single bond, and thus, for example, a compound in which an aromatic ring system fused to a benzene ring as an aromatic monocyclic ring, i.e., fluorene, is connected by a single bond.

[0102] The term "fused polycyclic ring system" used in this application refers to a fused ring that shares at least two atoms, including: a form in which two or more hydrocarbon ring systems are fused and a form in which at least one heterocyclic ring system is fused and the heterocyclic ring system contains at least one heteroatom. The fused polycyclic ring system can be an aromatic ring, an aromatic heterocyclic ring, an aliphatic ring, or a combination of such rings. For example, an aryl group can be a naphthyl group, a phenanthrenyl group, a fluorenyl group, etc., but it is not limited thereto.

[0103] The term "spiro compound" used in the present application has a 'spiro union', which means that two rings share only one atom to form a connection. In this case, the atom shared by the two rings is called a 'spiro atom', and according to the number of spiro atoms contained in one compound, it is called a 'monospiro-', 'dispiro-', 'trispiro-' compound, respectively.

[0104] Unless otherwise described, the terms "fluorenyl group", "fluorenylene group" and "fluorene-triyl group" used in this application respectively represent monovalent, divalent or trivalent functional groups in which R, R', R" and R'" are all hydrogen in the following structures, and "substituted fluorenyl group", "substituted fluorenyl group" or "substituted fluoren e-triyl group" means that at least one of the substituents R, R', R", R'" is a substituent other than hydrogen, including the case where R and R' are bonded to each other and form a spiro compound together with the carbon to which they are bonded. In this specification, the fluorenyl group, fluorenylene group and fluorene-triyl group may be named as fluorenyl group without considering the equivalent number of monovalent, divalent and trivalent.

[0105]

[0106] Furthermore, the R, R', R" and R'" may be independently: an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or a heterocyclyl group having 2 to 30 carbon atoms. For example, the aryl group may be phenyl, biphenyl, naphthalene, anthracene or phenanthrene, and the heterocyclyl group may be pyrrole, furan, thiophene, pyrazole, imidazole, triazole, pyridine, pyrimidone, pyridazine, pyrazine, triazine, indole, benzofuran, or the like. For example, the substituted fluorenyl group and the fluorenyl group may be monovalent or divalent functional groups of 9,9-dimethylfluorene, 9,9-diphenylfluorene, and 9,9'-spirobi [9H-fluorene], respectively.

[0107] The term "heterocyclyl group" used in the present application includes not only aromatic rings such as "heteroaryl group" or "heteroarylene group", but also non-aromatic rings, unless otherwise described, respectively, and includes one or more heteroatoms (hetero atom) and a ring having a carbon number of 2 to 60, but, not limited thereto. Unless otherwise described, the term "heteroatom (hetero atom)" used in the present application means N, O, S, P or Si, and heterocyclyl group (heterocyclyl group) means a monocyclic type, cyclopolymer, fused polycyclic system, spiro compound, etc. containing a heteroatom (hetero atom).

[0108] For example, a "heterocyclyl group" may also replace a cyclic carbon, including the following compounds, and compounds containing heteroatom terminal groups such as SO2 and P=O.

[0109]

[0110] The term "ring" used in the present application includes monocyclic and polycyclic rings, and of course, hydrocarbon rings include heterocyclic rings, the heterocyclic rings contain at least one heteroatom, and include aromatic and non-aromatic rings.

[0111] The term "polycyclic" as used in this application includes ring assemblies such as biphenyl and terphenyl and fused polycyclic systems and spiro compounds, including not only aromatic but also non-aromatic. Of course, hydrocarbon rings include heterocyclic rings that contain at least one heteroatom.

[0112] The term "aliphatic cyclo group" used in this application refers to cyclic hydrocarbons other than aromatic hydrocarbons, including monocyclic types, cyclopolymers, fused polycyclic systems, spiro compounds, etc.

[0113] Unless otherwise specified, it means a ring having 3 to 60 carbon atoms, but it is not limited thereto. For example, when an aromatic ring benzene and a non-aromatic cyclohexane are fused, they are also equivalent to an aliphatic ring.

[0114] Furthermore, when prefixes are used consecutively, it means that the substituents are arranged in the order of the description. For example, aryl alkoxy group means an alkoxy group substituted with an aryl group, alkoxy carbonyl group means a carbonyl group substituted with an alkoxy group, and aryl carbonyl alkenyl group means an alkenyl group substituted with an arylcarbonyl group, wherein an arylcarbonyl group is a carbonyl group substituted with an aryl group.

[0115] Furthermore, unless otherwise specified, in the term "substituted or unsubstituted" used in the present application, "substituted" means substituted with one or more substituents selected from the group consisting of deuterium, halogen, amino group, nitrile group, nitro group, C1-C 30 Alkyl group, C1~C 30 Alkoxy group, C1~C 30 Alkyl amine group, C1~C 30 alkyl thiophene group, C6~C 30 arylthiophene group, C2~C 30 Alkenyl group, C2~C 30 Alkinyl group, C3~C 30 Cycloalkyl group, C6~C 30 aryl group, C6~C 30 Aryl group, C8~C 30 aryl alkenyl group, silane group, boron group, germanium group and C2~C 30 The heterocyclic group, the C2~C 20 The heterocyclic group includes at least one heteroatom selected from the group consisting of O, N, S, Si and P. And, it is not limited by the substituents thereof.

[0116] In the present application, the 'functional group name' corresponding to the aryl group, arylene group, heterocyclyl group, etc. described in each label and its substituent examples can be recorded as 'functional group name reflecting valence' or as 'name of the parent compound'. For example, 'phenanthrene' as an aryl group' can be recorded as the name of the 'group' according to the valence, such as recording the monovalent 'group' as 'phenanthryl (group)' and recording the divalent 'group' as 'phenanthryl (group)', etc. However, it can also be recorded as the name of the parent compound 'phenanthrene' without considering the valence.

[0117] Similarly, pyrimidone can be recorded as 'pyrimidone' regardless of the valence, or recorded as pyrimidinyl (base) when it is monovalent, and can be recorded as the 'name of the base' of the corresponding valence when it is divalent, such as pyrimidinylene (base), etc. Therefore, in the present application, when the type of substituent is recorded as the name of the parent compound, it can represent: an n-valent 'base' formed by the desorption of hydrogen atoms bonded to carbon atoms and / or heteroatoms of the parent compound.

[0118] In addition, in this specification, when recording the name of the compound or the name of the substituent, the numerals or alphabets indicating the position can be omitted. For example, pyrido [4,3-d] pyrimidone can be recorded as pyrido pyrimidone, benzo furan [2,3-d] pyrimidone can be recorded as benzo furan pyrimidone, 9,9-dimethyl-9H-fluorene can be recorded as dimethylfluorene, etc. Therefore, benzo [g] quinoxaline or benzo [f] quinoxaline can be recorded as benzo quinoxaline.

[0119] Furthermore, unless otherwise expressly stated, the chemical formulae used in this application are also subject to the definitions of substituents according to the index definitions of the following chemical formulae.

[0120]

[0121] Wherein, when a is an integer of 0, it indicates that the substituent R 1 When a is 0, the carbon atoms forming the benzene ring are all bonded with hydrogen atoms. In this case, the symbol of the hydrogen atoms bonded with carbon atoms can be omitted and the chemical formula or compound can be recorded. 1 When a is an integer of 2 or 3, the bonding can be as follows. When a is an integer of 4 to 6, it can also be bonded to the carbon of the benzene ring by a similar method. When a is an integer of 2 or more, R 1 Can be the same or different.

[0122]

[0123] In the present application, unless otherwise described, forming a ring means that adjacent groups are bonded to each other to form a monocyclic ring or a fused polycyclic ring, and the monocyclic ring and the formed fused polycyclic ring include not only hydrocarbon rings but also heterocyclic rings, which contain at least one heteroatom and may include aromatic and non-aromatic rings.

[0124] In addition, in this specification, unless otherwise described, when a condensed ring is represented, in the term "number-condensed ring", the number represents the number of condensed rings. For example, a condensed form of three rings can be represented as a 3-condensed ring, such as anthracene, phenanthrene, benzo quinozoline, etc.

[0125] In addition, unless otherwise described, the term "bridged bicyclic compound" used in the present application refers to a compound in which two rings share three or more atoms to form a ring. In this case, the shared atoms may include carbon or heteroatoms.

[0126] In the present application, an organic electrical element refers to a component(s) between an anode and a cathode, or refers to an organic light emitting diode including anode and cathode and a component(s) therebetween.

[0127] Furthermore, depending on the circumstances, the display device of the present application refers to an organic electrical element, an organic light emitting diode and a panel including the same, or an electronic device including a panel and a circuit. For example, the electronic device includes all lighting devices, solar cells, portable or mobile terminals (for example, smart phones, tablet computers, PDAs, electronic dictionaries, PMPs, etc.), navigation terminals, game consoles, various TVs, various computer displays, etc., but is not limited thereto, and any form of device is acceptable as long as it includes the aforementioned (several) components.

[0128] Hereinafter, an implementation example of the present invention will be described in detail. However, this is for illustrative purposes only and the present invention is not limited thereto. The present invention is only defined by the scope of the following claims.

[0129] According to an implementation example of the present invention, a composition including a colorant may be used to prepare a red pattern, a green pattern, a blue pattern or a black matrix, and a pixel definition layer (PDL).

[0130] According to an implementation example of the present invention, the black pixel defining layer (PDL) may further include an additional colorant in addition to the colorant contained in the colorant, that is, an organic black pigment or a black dye. For example, the organic pigment can be used alone or mixed with the organic pigment and the coloring pigment. The advantage at this time is that, due to the mixed coloring pigment with insufficient light-shielding property, even if the amount of the colorant is relatively increased, the strength of the film (layer) or the adhesion of the substrate will not decrease. According to an implementation example of the present invention, the negative pixel defining layer (Negative PDL (Pixel define layer)) may include an additional colorant, that is, a black pigment or a black dye, to replace the colorant contained in the colorant.

[0131] Hereinafter, each component is described in detail.

[0132] 1. The preparation process of the negative pixel defining layer is as follows.

[0133] (1) Coating and coating steps

[0134] The photosensitive composition is a low-viscosity liquid reagent. In order to form a coating with a certain thickness after coating on a substrate, a spin coater or a slit coater is used. The advantage of a spin coater is that the higher the number of rotations, the thinner the thickness, but the flatness deviation in the area is reduced. In order to form a coating on a large-area substrate, a slit coater is preferably used compared to a spin coater, but its disadvantage is that after the coating is formed, the surface exhibits fluidity due to the residual solvent, resulting in a decrease in flatness. In order to overcome this drawback, VCD (vacuum chamber dry) is used to locally remove the solvent to reduce the fluidity of the surface.

[0135] (2) Pre-baking step

[0136] This process uses a hot plate or oven to heat the substrate of the coating at a certain temperature and time to partially remove the solvent contained in the coating film. If the surface or deep part of the coating film is not dry, it will cause photomask contamination when the next process is exposed. When irradiated with ultraviolet light, the exposed part is not well cured. If it is not cured, it will cause the development process to not form and remove the pattern.

[0137] (3) Exposure Step

[0138] When the pre-baking process is completed, the process uses a photomask with a pattern to irradiate actinic rays (ultraviolet rays) to cure the formed film. The types of lamps that generate actinic rays include LED lamps or metal (mercury) lamps, and the wavelengths include g-line (436nm), h-line (405nm), i-line (365nm), and Deep UV (<260nm), which can be used separately or in combination.

[0139] (4) Development step

[0140] When the exposure step irradiates actinic rays, the photomask is divided into an exposed part and a non-exposed part. In the case of a positive type, the exposed part is dissolved by a developer, while the non-exposed part resists the developer and leaves a pattern. In the case of a negative type, the exposed part is cured and resistant to the developer, while the non-exposed part is developed. The black pixel defining layer (Black PDL) prepared using a composition containing the colorant of the present invention is a negative type, which can be divided into an exposed part (cured) and a non-exposed part (developed) to form a pattern.

[0141] (5) Post-exposure step

[0142] After the development process is completed, the process step is to irradiate the patterned substrate with actinic rays (ultraviolet rays) again to further solidify the formed film. The types of lamps that generate actinic rays include LED lamps or metal (mercury) lamps, and the wavelengths include g-line (436nm), h-line (405nm), i-line (365nm), and Deep UV (<260nm), which can be used alone or in combination.

[0143] (6) Post-baking step

[0144] The process heats the developed substrate at a high temperature of 200°C to 300°C to remove residual solvent and fume. If the process does not completely remove the solvent and fume, degassing during the process after post-baking will affect the components, thereby affecting black spots or pixel shrinkage.

[0145] 2. The composition for forming the negative pixel defining layer including the colorant is as follows.

[0146] (1) Resins for photolithography

[0147] According to an embodiment of the present invention, the photolithography resin may include an acrylic binder resin, a cardo binder resin, or a combination thereof.

[0148] The acrylic binder resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin including one or more acrylic repeating units.

[0149] The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing one or more carboxyl groups, and specific examples thereof include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof. The content of the first ethylenically unsaturated monomer in the total amount of the acrylic binder resin may be 5 wt % to 50 wt %, for example, 10 wt % to 40 wt %.

[0150] The second ethylenically unsaturated monomer may be an aromatic vinyl compound such as styrene, α-methylstyrene, vinyltoluene, vinylbenzyl methyl ether, etc.; an unsaturated carboxylic acid ester compound such as methyl (meta)acrylate, ethyl (meta)acrylate, butyl (meta)acrylate, 2-hydroxyethyl (meta)acrylate, 2-hydroxybutyl (meta)acrylate, benzyl (meta)acrylate, cyclohexyl (meta)acrylate, benzene (meta)acrylate, etc.; an unsaturated carboxylic acid aminoalkyl ester compound such as 2-aminoethyl (meta)acrylate, 2-dimethylaminoethyl (meta)acrylate, etc.; a carboxylic acid vinyl ester compound such as vinyl acetate; an unsaturated carboxylic acid glycidyl ester compound such as glycidyl (meta)acrylate, a vinyl cyanide compound such as (meta)acrylonitrile, an unsaturated amide compound such as (meta)acrylamide, etc., and the like may be used alone or in combination of two or more.

[0151] Specific examples of the acrylic binder resin include: (meta) acrylic acid / benzyl methacrylate copolymer, (meta) acrylic acid / benzyl methacrylate / styrene copolymer, (meta) acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, (meta) acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, etc., but it is not limited to this. They can also be used alone or in combination of two or more. The weight average molecular weight of the acrylic binder resin can be 3,000 g / mol to 150,000 g / mol, for example, 5,000 g / mol to 50,000 g / mol, for example, 20,000 g / mol to 30,000 g / mol.

[0152] The cardo-based resin includes a repeating structure represented by the following Chemical Formula 1.

[0153] <Chemical Formula 1>

[0154]

[0155] In the chemical formula 1,

[0156] 1) R 1 and R 2 Independently of each other: hydrogen; deuterium; halogen; C6~C 30an aryl group; a C2-C 30 Heterocyclyl group; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group,

[0157] 2) R 1 and R 2 Rings can be formed between adjacent bases.

[0158] 3) m or n is independently an integer from 0 to 4,

[0159] 4) A1 and A2 are independently of each other represented by the following chemical formula 2 or chemical formula 3,

[0160] <Chemical Formula 2>

[0161]

[0162] <Chemical formula 3>

[0163]

[0164] In the chemical formula 2 and the chemical formula 3,

[0165] 4-1)* indicates the connected parts,

[0166] 4-2) R 3 ~R 6 Independently of each other: hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 Heterocyclyl group; C6~C30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group,

[0167] 4-3) R 3 ~R 6 Rings can be formed between adjacent groups.

[0168] 4-4)Y 1 and Y 2 Independently of each other, it is the following Chemical Formula 6 or Chemical Formula 7,

[0169] <Chemical Formula 6>

[0170]

[0171] <Chemical Formula 7>

[0172]

[0173] In the chemical formula 6 and the chemical formula 7,

[0174] 4-4-1)* indicates the bonding position,

[0175] 4-4-2)R 9 is hydrogen or methyl ester;

[0176] 4-4-3)R 10 ~R 13 Independently of each other: hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 heterocyclic group; C6~C 30 The fused ring group of the aliphatic ring and the aromatic ring (cycl o group); C1~C 20Alkyl group; C2~C 20 alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group,

[0177] 4-4-4)L 1 ~L 3 are independently: a single bond; a fluorenyl group; C2~C 30 Alkylene; C6~C 30 Arylene; C2~C 30 Heterocyclic ring; C1~C 30 Alkoxylene; C2~C 30 Alkyleneoxy; C6~C 30 aryloxy group; C2~C 30 The polyethyleneoxy group,

[0178] 4-4-5) q and r are independently integers from 0 to 3; however, q+r=3,

[0179] 5) The resin includes a repeating unit represented by Chemical Formula 1, wherein within the polymer chain, the ratio of A1 to A2 is 9:1 to 1:9,

[0180] 6)X 1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; the following chemical formula 4; or chemical formula 5,

[0181] 6-1) R' and R" are independently: hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 Heterocyclyl group; C6~C 30The fused ring group of aliphatic ring and aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group,

[0182] 6-2) R' and R" can form a ring between adjacent groups,

[0183] <Chemical Formula 4>

[0184]

[0185] <Chemical Formula 5>

[0186]

[0187] In the chemical formula 4 and the chemical formula 5,

[0188] 6-3)* indicates the bonding position,

[0189] 6-4) R 7 ~R 8 Independently of each other: hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 Heterocyclyl group; C6~C 30 The fused ring group of aliphatic ring and aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group,

[0190] 6-5) o and p are independently integers from 0 to 4,

[0191] 7)X 2 It is C6~C 30 an aryl group; a C2-C 30 heterocyclic group; C6~C 30 The fused ring group of aliphatic ring and aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group,

[0192] 8) R', R", X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 may be further substituted with one or more substituents selected from the group consisting of the following components: deuterium; halogen; substituted or unsubstituted C1-C 30 Alkyl group or C6~C 30aryl group, silane group, siloxane group, boron group, germanium group, cyano group, amino group, nitro group, C1~C 30 Alkylthio group; C1~C 30 Alkoxy group; C6~C 30 Aryl alkoxy group; C1~C 30 Alkyl group; C2~C 30 alkenyl group; C2~C 30 Alkinyl group; C6~C 30 aryl group; C6~C 30 aryl group; fluorenyl group; C2~C 30 A heterocyclic group comprising at least one heteroatom selected from the group consisting of O, N, S, Si and P; C3~C 30 Aliphatic ring group; C7~C 30 Aryl alkyl group; C8~C 30 and combinations thereof, and adjacent substituents may form a ring.

[0193] The R', R", X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 When it is an aryl group, preferably, it can be C6 to C 30 The aryl group may be C6 to C 18 The aryl group may be, for example, phenyl, biphenyl, naphthyl, terphenyl, or the like.

[0194] The R', R", X 2 , L 1 ~L3 , R 1 ~R 8 and R 10 ~R 13 When it is a heterocyclic group, preferably, it can be C2 to C 30 The heterocyclic group (heterocyclyl group), further preferably, can be C2~C 18 The heterocyclic group may be, for example, dibenzofuran, dibenzothiophene, naphthobenzothiophene, naphthobenzofuran, or the like.

[0195] The R', R", R 1 ~R 8 and R 10 ~R 13 When it is a fluorenyl group, preferably, it may be 9,9-dimethyl-9H-fluorene, 9,9-diphenyl-9H-fluorenyl, 9,9'-spirobifluorene, or the like.

[0196] The L 1 ~L 3 When it is an arylene group, it is preferably C6 to C 30 The arylene group may be C6 to C 18 The arylene group may be, for example, phenyl, biphenyl, naphthyl, terphenyl, or the like.

[0197] The R', R", X 2 , R 1 ~R 8 and R 10 ~R 13 When it is an alkyl group, preferably, it can be C1 to C 10 The alkyl group may be, for example, a methyl group, a t-butyl group, or the like.

[0198] The R', R", X 2 , R 1 ~R8 and R 10 ~R 13 When it is an alkoxy group, it is preferably C1 to C 20 The alkoxy group, more preferably, may be C1 to C 10 The alkoxy group may be, for example, methoxy, t-butoxy, or the like.

[0199] The R', R", X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 The ring formed by bonding adjacent groups can be C6 to C 60 Aromatic ring group; fluorenyl group; C2~C 60 or C3~C 60 For example, when adjacent groups are bonded to each other to form an aromatic ring, preferably, a C6-C 20 The aromatic ring may preferably form a C6 to C 14 The aromatic ring can form, for example, benzene, naphthalene, phenanthrene, etc.

[0200] For example, the cardo resin can be prepared by mixing two or more of the following components: fluorene-containing compounds such as 9,9-bis(4-oxiranemethoxyphenyl)fluorene; anhydride compounds such as benzenetetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride, benzophenonetetracarboxylic dianhydride, pyromellitic dianhydride, cyclobutanetetracarboxylic dianhydride, perylenetetracarboxylic dianhydride, tetrahydrofurantetracarboxylic dianhydride, and tetrahydrophthalic anhydride; glycol compounds such as ethylene glycol, propylene glycol, and polyethylene glycol; ethanol compounds such as methanol, ethanol, propanol, n-butanol, cyclohexanol, and benzyl alcohol; solvent compounds such as propylene glycol monomethyl ether acetate and N-methylpyrrolidone; phosphorus compounds such as triphenylphosphine; and ammonium or ammonium salt compounds such as tetramethylammonium chloride, tetraethylammonium bromide, benzyldiethylammonium, triethylammonium, tributylammonium, and benzyltriethylammonium chloride.

[0201] The weight average molecular weight of the cardo resin is 1,000 to 100,000 g / mol, preferably 1,000 to 50,000 g / mol, and more preferably 1,000 to 30,000 g / mol. If the weight average molecular weight of the resin is included in the range, no residue is generated when preparing the light-shielding layer, the pattern forming effect is good, and there is no loss in film thickness during development, and a good pattern can be obtained. In the total amount of the photosensitive resin composition, the content of the resin is 1 to 30% by weight, and more preferably, the content can be 3 to 20% by weight. When the content of the resin is included in the range, excellent sensitivity, developability and adhesion (tightness) can be obtained.

[0202] (2) Reactive unsaturated compounds

[0203] The reactive unsaturated compound is an essential component of the negative pattern and has an ethylene unsaturated double bond. Therefore, when the pattern forming process is exposed, it can initiate sufficient polymerization to form a pattern with excellent heat resistance, light resistance and chemical resistance.

[0204] Specific examples of the reactive unsaturated compound include ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxy acrylate, ethylene glycol monomethyl ether acrylate, trimethylolpropane triacrylate, tripentaerythritol octaacrylate, and the like.

[0205] Commercially available products of the reactive unsaturated compound are, for example, the following.

[0206] For example, the difunctional esters of (meth)acrylic acid include: aronyxM-210, M-240, M-6200, etc. from Toa Synthetic Chemical Industry Co., Ltd.; KAYARAD HDDA, HX-220, R-604, etc. from Nippon Chemical Co., Ltd.; V-260, V-312, V-335HP, etc. from Osaka Organic Chemical Industry Co., Ltd.

[0207] For example, the trifunctional esters of (meth)acrylic acid include: aronyx M-309, M-400, M-405, M-450, M-7100, M-8030, M-8060, etc. from Toa Synthetic Chemical Industry Co., Ltd.; KAYARAD TMPTA, DPCA-20, DPCA-60, DPCA-120, etc. from Nippon Chemical Co., Ltd.; V-295, V-300, V-360, etc. from Osaka Organic Chemical Industry Co., Ltd.

[0208] The above products can be used alone or in combination of two or more.

[0209] In order to have a better developability, the reactive unsaturated compound may be used after being treated with an acid anhydride. In the total amount of the photosensitive resin composition, the content of the reactive unsaturated compound may be 1 to 40% by weight, for example, 1 to 20% by weight. When the content of the reactive unsaturated compound is included in the range, sufficient curing is induced when the pattern forming process is exposed, so that the reliability is excellent, the heat resistance, light resistance and chemical resistance of the pattern are excellent, and the clarity and adhesion are also excellent.

[0210] (3) Photoinitiator

[0211] In order to present a negative pattern through a photolithography machine, a photoradical initiator is required. The molar absorption coefficient of the photoinitiator in the 330 to 380 nm region is 10,000 (L / mol·cm) or more, and the temperature at which the photoinitiator loses 5% by weight is below 200°C. The molar absorption coefficient can be calculated by the beer-Lambert Law. In addition, the weight loss was detected by TGA in a nitrogen atmosphere at a rate of 5°C per minute to 300°C.

[0212] The photopolymerization initiator is generally used in a photosensitive resin composition, and for example, acetophenone compounds, benzophenone compounds, thioxanthone compounds, benzoin compounds, triazine compounds, etc. may be used.

[0213] For example, the acetophenone compounds include: 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloroacetophenone, pt-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butane-1-one, etc.

[0214] For example, the benzophenone compounds include benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, and the like.

[0215] For example, the thioxanthone compounds include thioxanthone, 2-chlorothiazolone, 2-methylthioxanthone, isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2,4-diisopropyl thioxanthone, 2-chlorothioxanthone and the like.

[0216] For example, the benzoic acid ketone-based compounds include benzoic acid ketone, benzoic acid ketone methyl ether, benzoic acid ketone ethyl ether, benzoic acid ketone isopropyl ether, benzoic acid ketone isobutyl ether, benzyl dimethyl ketal, and the like.

[0217] For example, the triazine compounds include: 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, (Trichloromethyl)-s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-phenylvinyl-s-triazine, 2-(naphtho-1-ol)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-ol)-4,6-bis(trichloromethyl)-s-triazine, 2-4-trichloromethyl (piperonyl)-6-triazine, 2-4-trichloromethyl (4'-methoxyphenylvinyl)-6-triazine, etc.

[0218] In addition to compounds, the photoinitiator may also be a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, a non-imidazole compound, and the like.

[0219] The photoinitiator is a free radical polymerization initiator, and may be a peroxide compound, an azobis compound, or the like.

[0220] For example, the peroxide compounds include: ketone peroxides such as methyl ethyl ketone peroxide, methyl isobutyl ketone peroxide, cyclohexanone peroxide, methyl cyclohexanone peroxide, acetylacetone peroxide, etc.; diacyl peroxides such as isobutyryl peroxide, 2,4-dichlorobenzoyl peroxide, o-methylbenzoyl peroxide, di-3,5,5-trimethylhexanoyl peroxide, etc.; hydroperoxides such as 2,4,4,-trimethylpentyl-2-hydroperoxide, diisopropylbenzene hydroperoxide, isopropylbenzene hydroperoxide, t-butyl hydroperoxide, etc.; diisopropylbenzene peroxide, 2,5-dimethyl-2,5-di(t-butylperoxide) dialkyl peroxides such as butyl peroxy (butyl) hexane, 1,3-bis (t-butoxyisopropyl) benzene, t-butyl peroxy valerate, etc.; alkyl succinates such as 2,4,4-trimethylpentyl peroxy phenoxy acetate, α-peroxy neodecanoate cumyl, t-butyl peroxy benzoic acid, di-t-butyl peroxy trimethyl adipic acid, etc.; percarbonates such as di-3-methoxy butyl peroxy dicarbonate, di-2-ethylhexyl peroxy dicarbonate, bis-4-t-cyclohexyl peroxy dicarbonate, diisopropyl peroxy dicarbonate, acetyl peroxy cyclohexyl sulfonyl, t-butyl peroxy carbonate, etc.

[0221] For example, the azobis compounds include: 1,1'-azobiscyclohexane-1-carbonitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2,-azobis(methyl isobutyrate), 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), α,α'-azobis(isobutyronitrile) and 4,4'-azobis(4-cyanovaleric acid).

[0222] After the photoinitiator absorbs light and transitions to an excited state, it transfers its energy and is used together with a photosensitizer that undergoes a chemical reaction. For example, the photosensitizer includes: triethylene glycol bis-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, dipentaerythritol tetrakis-3-mercaptopropionate, and the like.

[0223] The content of the photoinitiator in the total amount of the photosensitive composition may be 0.01 to 10% by weight, for example, 0.1 to 5% by weight. When the content of the photoinitiator is within the above range, sufficient curing is induced when the pattern forming process is exposed, so that the reliability is excellent, the heat resistance, light resistance and chemical resistance of the pattern are excellent, and the clarity and adhesion are also excellent. In addition, the reduction of transmittance caused by the unreacted initiator can be prevented.

[0224] (4) Colorant

[0225] Both organic pigments and inorganic pigments and dyes can be used as the colorant.

[0226] The colorant may be a red pigment, a green pigment, a blue pigment, a yellow pigment, a black pigment, or the like.

[0227] For example, the red pigment includes: CI red pigment 254, CI red pigment 255, CI red pigment 264, CI red pigment 270, CI red pigment 272, CI red pigment 177, CI red pigment 89 and the like.

[0228] For example, the green pigment includes: halogen-substituted copper phthalocyanine pigments, such as CI green pigment 36, CI green pigment 7, and the like.

[0229] For example, the blue pigment includes copper phthalocyanine pigments such as CI blue pigment 15:6, CI blue pigment 15, CI blue pigment 15:1, CI blue pigment 15:2, CI blue pigment 15:3, CI blue pigment 15:4, CI blue pigment 15:5, and CI blue pigment 16.

[0230] For example, the yellow pigment includes isoindoline pigments such as CI yellow pigment 139, quinophthalone pigments such as CI yellow pigment 138, nickel composite pigments such as CI yellow pigment 150, and the like.

[0231] For example, the black pigment includes lactam black, aniline black, perylene black, titanium black, carbon black and the like.

[0232] Furthermore, according to an implementation example, the colorant in the photosensitive resin composition may include a pigment, a dye, or a combination thereof. For example, the dye may include a phthalocyanine compound.

[0233] The above components can be used alone or in combination of two or more as the pigment and dye, but are not limited thereto.

[0234] The black pigment in the above components can be used to effectively shield the light from the light shielding layer. When the black pigment is used, it can also be used together with a color-correcting agent such as anthraquinone pigments, perylene pigments, phthalocyanine pigments, and azo pigments.

[0235] In order to disperse the pigment on the photosensitive resin composition, a dispersant may be used together. Specifically, the pigment may be used after surface pretreatment with a dispersant, or, when preparing the photosensitive resin composition, a dispersant may be added together with the pigment before use.

[0236] The dispersant may be a nonionic dispersant, anionic dispersant, cationic dispersant, etc. Specific examples of the dispersant include polyalkylene glycol and its esters, polyoxyalkylene, oxyalkylene polyol ester additives, alcohol alkylene oxide additives, sulfonic acid esters, sulfonic acid salts, carboxylates, carboxylates, oxyalkylene alkylamide additives, alkyl amines, etc., which may be used alone or in combination of two or more.

[0237] The dispersant products on sale include, for example, DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001, etc. from BYK; EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450, etc. from EFKA Chemicals; Solsperse 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse 17000, Solsperse20000, Solsperse 24000GR, Solsperse 27000, Solsperse 28000, etc.; or PB711, PB821, etc. from Ajinomoto.

[0238] The content of the dispersant in the total amount of the photosensitive resin composition may be 0.1 wt % to 15 wt %. When the content of the dispersant is within the above range, the composition has excellent dispersibility, and accordingly, when preparing a light shielding layer, the stability, developability and patternability are excellent.

[0239] The pigment can also be pre-treated with a water-soluble inorganic salt and a wetting agent before use. When the pigment is used after the pre-treatment, the average particle size of the pigment can be refined.

[0240] The pretreatment is achieved by kneading the pigment together with a water-soluble inorganic salt and a wetting agent; and then filtering and washing the pigment obtained in the kneading step.

[0241] The kneading may be performed at a temperature of 40° C. to 100° C., and the filtering and washing may be performed by washing the inorganic salt with water or the like and filtering.

[0242] For example, the water-soluble inorganic salts include sodium chloride, potassium chloride, etc., but are not limited thereto.

[0243] The wetting agent uniformly mixes the pigment and the water-soluble inorganic salt, thereby playing the role of a medium that makes the pigment easy to crush. For example, the wetting agent includes: alkylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, and diethylene glycol monomethyl ether; alcohols such as ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, and glycerin polyethylene glycerol, etc., and the like can be used alone or in combination of two or more.

[0244] The pigment after the kneading step can have an average value of D10 to D90 of 60nm to 120nm, preferably, 70nm to 130nm, and more preferably, an average particle size of 80nm to 120nm. When the average particle size of the pigment is included in the range, not only the heat resistance and light resistance are excellent, but also fine patterns can be effectively formed. That is, when the particle size of the inorganic or organic pigment exceeds the range, after the development process is implemented, residue will occur, reducing visibility and brightness. In addition, when the particle size of the inorganic pigment is lower than the above range, it may become a cause of pixel shrinkage, resulting in reduced brightness and shortened life.

[0245] The content of the pigment in the total amount of the photosensitive resin composition may be 1% to 40% by weight, more specifically, 2% to 30% by weight. When the pigment is included within the above range, the color reproduction rate is excellent, and the curability and adhesion of the pattern are also excellent.

[0246] (5) Solvent

[0247] The solvent is compatible with the cardo-based resin, the reactive unsaturated compound, the pigment, the cardo-based compound, and the initiator, and a non-reactive substance may be used.

[0248] For example, the solvent includes: alcohols such as methanol and ethanol; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, anisole, tetrahydrofuran, etc.; glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; ethyl acetate glycol ethers such as methoxyethyl acetate, ethoxyethyl acetate, and diethoxyethyl acetate; carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and diethylene glycol diethyl ether; propylene glycol Propylene glycol alkyl ether acetates such as methyl ether acetate and propylene glycol propyl ether acetate; aromatic hydrocarbons such as toluene and xylene; ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-di-n-amyl ketone, 2-heptanone; saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, isobutyl acetate; lactic acid esters such as methyl lactate and ethyl lactate; oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate, methyl oxyacetate, butyl oxyacetate; methoxy Alkoxyacetic acid alkyl esters such as methyl acetate, methoxyethyl acetate, methoxybutyl acetate, ethoxymethyl acetate, ethoxyethyl acetate, etc.; 3-oxopropionic acid alkyl esters such as methyl 3-oxopropionate, ethyl 3-oxopropionate, etc.; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate, etc.; 2-oxopropionic acid alkyl esters such as methyl 2-oxopropionate, ethyl 2-oxopropionate, propyl 2-oxopropionate, etc.; methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, etc. 2-alkoxypropionic acid alkyl esters such as ethyl 2-ethoxypropionate, methyl 2-ethoxypropionate; 2-oxy-2-methylpropionic acid esters such as methyl 2-oxy-2-methylpropionate and ethyl 2-oxy-2-methylpropionate; monooxymonocarboxylic acid alkyl esters of 2-alkoxy-2-methylpropionic acid alkyl such as methyl 2-methoxy-2-methylpropionate and ethyl 2-ethoxy-2-methylpropionate; esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyacetate, methyl 2-hydroxy-3-methylbutanoate; keto acid esters such as ethyl pyruvate, etc.

[0249] In addition, high boiling point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, hexanoic acid, octanoic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and ethylene glycol phenyl acetate can be used.

[0250] Taking into account the compatibility and reactivity of the solvent, glycol ethers such as ethylene glycol monoethyl ether (ethylene glycolmonoethyl ether); ethylene glycol alkoxy ethers such as ethoxyethyl acetate; ethers such as ethyl 2-hydroxypropionate; carbitols such as diethylene glycol monomethyl ether; propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate can be used.

[0251] In the total amount of the photosensitive resin composition, the solvent may be included as a balance, specifically, the content may be 40 to 90% by weight. When the content of the solvent is included in the range, the photosensitive resin composition may have an appropriate viscosity, thereby achieving excellent processability when preparing a pattern layer.

[0252] (6) Other additives

[0253] In order to prevent the occurrence of marks or spots, improve the leveling performance and prevent the generation of residues due to undevelopment when applying the photosensitive composition, the photosensitive composition may further contain additives such as malonic acid; 3-amino-1,2-propanediol; a silane coupling agent containing a vinyl or (meth)acryloxy group; a leveling agent; a fluorine-based surfactant; and a free radical polymerization initiator.

[0254] For example, in order to improve adhesion to a substrate, the photosensitive resin composition may further include a silane coupling agent having a reactive substituent such as a vinyl group, a carboxyl group, a methacryloxy group, an isocyanate group, or an epoxy group.

[0255] For example, the silane coupling agent includes trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatepropyltrioxysilane, γ-glycidyloxypropyltrimethoxysilane, β-epoxycyclohexylethyltrimethoxysilane, etc., which can be used alone or in combination of two or more.

[0256] The weight part of the silane coupling agent may be 0.01 parts by weight to 10 parts by weight in 100 parts by weight of the photosensitive resin composition. When the weight part of the silane coupling agent is within the above range, the adhesion and storage properties are excellent.

[0257] Furthermore, the photosensitive resin composition may further include a surfactant, such as a fluorine-based surfactant, as required. The surfactant has the effects of improving coating properties and preventing defects.

[0258] The fluorine-based surfactant can be the following fluorine-based surfactants available on the market: etc.; Dainippon Ink & Chemicals Co., Ltd.'s Mecha Pack F Same model F Same model F Same model F etc.; Lard from Sumitomo 3M Co. Same style Same style Same style etc.; Saffron from Asahi Glass Co., Ltd. Same style Same style Same style Same style etc.; Toray Silicon Corporation Same Style- Same Style- wait.

[0259] In 100 parts by weight of the photosensitive resin composition, the weight of the surfactant can be 0.001 parts by weight to 5 parts by weight. When the weight of the surfactant is within the range, the coating uniformity can be ensured, no streaking occurs, and the wettability of the glass substrate is excellent. In addition, the photosensitive resin composition can be added with a certain amount of antioxidants, stabilizers and other additives within the range that does not damage the physical properties.

[0260] Another implementation example may be to use the photosensitive resin composition to perform photolithography on a pixel separation portion of an organic light emitting element electrode.

[0261] Hereinafter, the synthesis examples and examples of the present invention will be described in detail, but the synthesis examples and examples of the present invention are not limited thereto.

[0262] Synthesis Example 1: (Chemical formula 8 represents the preparation of 9,9-Bis[4-(glycidyloxy)phenyl]fluorene)

[0263] 20 g of 9,9'-bisphenolfluorene (Sigma Aldrich), 8.67 g of glycidyl chloride (Sigma Aldrich), 30 g of anhydrous potassium carbonate and 100 ml of dimethylformamide were poured into a 300 ml three-necked round-bottom flask equipped with a distillation tube, heated to 80°C, and reacted for 4 hours. Then, the temperature was lowered to 25°C, and the reaction liquid was filtered. Then, the filtrate was stirred and dropped into 1000 ml of water. The precipitated powder was filtered, washed with water, reduced pressure at 40°C and dried to obtain 25 g of 9,9-bis(4-(glycidyloxy)phenyl]fluorene represented by the following compound 8. The purity of the powder was obtained by HPLC analysis, and the purity was 98%.

[0264] <Chemical Formula 8>

[0265]

[0266] Synthesis Example 2: Preparation of Cardo-based binder resin

[0267] 25 g (54 mmol) of compound 1 obtained in Synthesis Example 1, 8 g of acrylic acid (Oi Kakin Co., Ltd.), 0.2 g of benzyl triethylammonium chloride (Oi Kakin Co., Ltd.), 0.2 g of hydroquinone (Oi Kakin Co., Ltd.) and 52 g of propylene glycol methyl ether acetate (Sigma Aldrich Co., Ltd.) were poured into a 300 ml 3-neck round bottom flask equipped with a distillation tube, and stirred at 110° C. for 6 hours. After the reaction was completed, 8 g of biphenyltetracarboxylic dianhydride (Mitsubishi Gas Co., Ltd.) and 1.8 g of tetrahydrophthalic acid (Sigma Aldrich Co., Ltd.) were further poured, and then stirred at 110° C. for 6 hours. After the reaction was completed, the reaction solution was recovered and analyzed, and as a result, a cardo-based binder resin having a molecular weight of 4,580 and a solid powder content of 45% was obtained.

[0268] Preparation Example 1: Preparation of black pigment dispersion

[0269] Using a paint shaker (Asada), 15 g of Irgaphor Black S100CF (black pigment / BASF), 8.5 g of Disperbyk 163 (BYK), 6.5 g of SR-3613 (SMS), 70 g of propylene glycol methyl ether acetate, and 100 g of zirconia beads with a diameter of 0.5 mm (Toray) were dispersed for 8 hours to obtain a dispersion. The average particle size (Mean) of the dispersion was analyzed by a particle size analyzer (SZ-100Z, HORIBA), and the confirmed result was 119.7 nm.

[0270] Preparation Example 2: Preparation of black pigment dispersion

[0271] Using a paint shaker (Asada), 15 g of Irgaphor Black S100CF (black pigment / BASF), 8.5 g of Disperbyk 163 (BYK), 6.5 g of SR-3613 (SMS), 70 g of propylene glycol methyl ether acetate, and 100 g of zirconium oxide beads with a diameter of 0.5 mm (Toray) were dispersed for 9 hours to obtain a dispersion. The average particle size (Mean) of the dispersion was analyzed by a particle size analyzer (SZ-100Z, HORIBA), and the confirmed result was 105.6 nm.

[0272] Preparation Example 3: Preparation of black pigment dispersion

[0273] Using a paint shaker (Asada), 15 g of Irgaphor Black S100CF (black pigment / BASF), 8.5 g of Disperbyk 163 (BYK), 6.5 g of SR-3613 (SMS), 70 g of propylene glycol methyl ether acetate, and 100 g of zirconium oxide beads with a diameter of 0.5 mm (Toray) were dispersed for 10 hours to obtain a dispersion. The average particle size (Mean) of the dispersion was analyzed by a particle size analyzer (SZ-100Z, HORIBA), and the confirmed result was 81.8 nm.

[0274] Preparation Example 4: Preparation of black pigment dispersion

[0275] Using a paint shaker (Asada), 15 g of Irgaphor Black S100CF (black pigment / BASF), 8.5 g of Disperbyk 163 (BYK), 6.5 g of SR-3613 (SMS), 70 g of propylene glycol methyl ether acetate, and 100 g of zirconia beads with a diameter of 0.5 mm (Toray) were dispersed for 7 hours to obtain a dispersion. The average particle size (Mean) of the dispersion was analyzed by a particle size analyzer (SZ-100Z, HORIBA), and the confirmed result was 136.8 nm.

[0276] Preparation Example 5: Preparation of black pigment dispersion

[0277] Using a paint shaker (Asada), 15 g of Irgaphor Black S100CF (black pigment / BASF), 8.5 g of Disperbyk 163 (BYK), 6.5 g of SR-3613 (SMS), 70 g of propylene glycol methyl ether acetate, and 100 g of zirconium oxide beads with a diameter of 0.5 mm (Toray) were dispersed for 11 hours to obtain a dispersion. The average particle size (Mean) of the dispersion was analyzed by a particle size analyzer (SZ-100Z, HORIBA), and the confirmed result was 75.3 nm.

[0278] The photosensitive composition solution was prepared using the components in Table 1 below.

[0279] Specifically, an initiator is dissolved in a solvent, and then stirred at room temperature, wherein a binder resin and a polymerizable compound are added, and stirred at room temperature. Then, a colorant and other additives are added to the obtained reactant, and stirred at room temperature. Then, the resultant is filtered three times to remove impurities, and a photosensitive resin composition is prepared.

[0280]

Table 1

[0281] Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Black pigment dispersion (Preparation Example 1) 23 Black pigment dispersion (Preparation Example 2) 23 Black pigment dispersion (Preparation Example 3) 23 Black pigment dispersion (Preparation Example 4) 23 Black pigment dispersion (Preparation Example 5) 23 Cardo binder (Synthesis Example 2) 15 15 15 15 15 Miramer M600 (Mihara Chemical Co., Ltd.) 12.5 12.5 12.5 12.5 12.5 PBG-304(Tronly) 0.5 0.5 0.5 0.5 0.5 Propylene glycol methyl ether acetate 49 49 49 49 49

[0282] The method for preparing a negative pixel definition layer (negative PDL) using the photosensitive composition is as follows.

[0283] (1) Coating and coating steps

[0284] On a cleaned and metal-evaporated 10cm*10cm substrate, a photosensitive composition is coated with a constant thickness using a spin coater, and then a portion of the solvent is removed using a vacuum chamber dry (VCD) to form a coating film. The thickness of the coating of the photosensitive composition after VCD is 3.3 microns to 3.5 microns.

[0285] (2) Pre-baking step

[0286] The obtained coating film is heated at 80° C. to 120° C. for 50 to 200 seconds on a hot plate to remove the solvent contained in the obtained coating film. This process removes a certain amount of solvent so as to reduce the mask contamination of the pixel morphology when implementing the next process (exposure) step and prepare a clean pattern.

[0287] (3) Exposure Step

[0288] A mask of a given shape is interspersed on the coating film obtained above to form a desired pattern and a certain thickness. Then, 190nm to 600nm actinic rays are irradiated by an exposure machine. Preferably, a metal or LED light source with ghi-line can be irradiated to form a pattern. The exposure amount for pattern formation is 20 to 150mJ / cm 2 The photoresist material of the negative type has a transmittance of three sections, namely, 0% (non-exposed part), 20 to 50% (half-tone), and 100% (full-tone), to form a pattern.

[0289] (4) Development step

[0290] After the exposure step, the image pattern is formed by dipping the surface of the substrate with a 2.38 wt% developer of TMAH (tetramethylhydroxyammonium) at 23±2°C for a certain time (minutes), the development time being 30 to 60 seconds, and then washing with deionized water (DI water) to dissolve and remove the unexposed portion, leaving only the exposed portion. The thickness of the coating is 1.30 to 1.95 μm when half-tone is used, and 3.20 to 3.40 μm when full-tone is used.

[0291] (5) Post-exposure step

[0292] Following the development step, in order to prevent the pattern from disintegrating after the post-baking process, the entire area is irradiated with 190nm to 600nm actinic rays by photoelectricity, preferably with a metal or LED light source with ghi-line, without using a photomask, to increase the strength of the coating. The exposure amount for increasing the intensity is 50 to 1,000mJ / cm 2 .

[0293] (6) Post-baking step

[0294] In order to obtain the image pattern obtained by the post-exposure treatment, post baking was carried out in an oven at 200 to 300° C. for 30 to 120 minutes to completely remove the solvent and solidify the pattern to form a film, which was then inspected using a scanning microscope.

[0295] (7) Pattern and taper angle analysis

[0296] After forming a pattern on a substrate using the photosensitive composition through the above steps (1) to (6), the thickness of the pattern cross section (half-tone) was compared using a scanning electron microscope (JEOL) according to the different average particle sizes of the inorganic pigment.

[0297] (8) Particle size detection

[0298] The pigment dispersions prepared in the above preparation examples 1 to 5 were introduced into the PGMEA solvent and diluted 3,000 times to prepare test samples, and the particle sizes were measured using the SZ-100Z of HORIBA. During the test, the D10, D50, and D90 values ​​were obtained, and the average pigment size was defined by the mean value of the total average.

[0299]

Table 2

[0300]

[0301]

[0302] *1)H / T:Half-tone,*2)F / T:Full tone

[0303] According to the different average particle sizes of the inorganic pigments, the thickness of the lower and upper pattern sections of the formed pattern was detected and compared. Referring to Comparative Example 1 in Table 2 above, it can be confirmed that due to the large particle size, the thickness of half-tone is 1.91 μm and the thickness of full-tone is 3.22 μm, which is somewhat high. When the thickness of half-tone exceeds 1.90 μm, the following disadvantages will occur: increased illumination, residue, and reduced visibility.

[0304] It can be confirmed by referring to Comparative Example 2 that it presents a trend opposite to that of Comparative Example 1. Due to the small particle size, the thickness of half-tone is 0.99 μm and the thickness of full-tone is 2.78 μm, which is high. When the thickness of half-tone PD L is less than 1.00 μm, in terms of light shielding, it cannot completely block the light reflected by the lower TFT electrode, so there are disadvantages of color interference or low brightness.

[0305] Therefore, the thickness of half-tone must be maintained at 1.00 μm to 1.90 μm. Referring to the above Examples 1 to 3, it can be seen that the average particle size of the inorganic pigment is 80 nm to 120 nm, the thickness of full-tone is 2.90 μm to 3.10 μm, and the thickness of half-tone is 1.20 μm to 1.80 μm. It can also be confirmed that there is no residue in the above Examples 1 to 3.

[0306] The above description is merely an example of the present invention, and a person skilled in the art in the art to which the present invention belongs can make various modifications without departing from the essential characteristics of the present invention.

[0307] Therefore, the embodiments disclosed in this specification are used to describe the present invention, rather than to limit the present invention, and the idea and scope of the present invention are not limited by such embodiments. The scope of the claims of the present invention should be interpreted according to the following claims, and should be interpreted as including all technologies within the scope equivalent thereto falling within the scope of the claims of the present invention.

Claims

1. A method for preparing a pixel defining layer, characterized in that: The invention comprises the following steps: coating and coating a photosensitive composition containing a colorant, wherein the average particle size of the colorant is 60 nm to 140 nm; pre-baking; exposure; development; post-exposure; and post-baking treatment; the post-baking treatment step is carried out in an oven at 200° C. to 300° C. for 30 minutes to 120 minutes. After the post-baking treatment step, the thickness of the full-tone is 2.80 μm to 3.20 μm, and the thickness of the half-tone is 1.00 μm to 1.90 μm, and there is no residue.

2. The method for preparing a pixel defining layer according to claim 1, wherein: The colorant includes one or more of an inorganic dye, an organic dye, an inorganic pigment and an organic pigment.

3. The method for preparing a pixel defining layer according to claim 1, wherein: The colorant is pretreated with a dispersant; or a water-soluble inorganic salt and a wetting agent.

4. The method for preparing a pixel defining layer according to claim 1, wherein: After the development step, the half-tone thickness of the pattern is 1.40 to 2.00 μm.

5. The method for preparing a pixel defining layer according to claim 1, wherein: After the development step, the full-tone thickness of the pattern was 3.20 to 3.42 μm.

6. The method for preparing a pixel defining layer according to claim 1, characterized in that: The hot plate temperature for the pre-bake step was 90 to 120°C.

7. The method for preparing a pixel defining layer according to claim 1, characterized in that: The pre-baking step is performed for 100 to 150 seconds.

8. The method for preparing a pixel defining layer according to claim 1, characterized in that: The developing step is performed for 35 to 55 seconds.

9. The method for preparing a pixel defining layer according to claim 1, characterized in that: The exposure step irradiates with an energy of 80 to 110 mJ / cm 2 .

10. The method for preparing a pixel defining layer according to claim 1, characterized in that: The post-exposure step does not use a photomask, but irradiates the entire area with 190nm to 600nm actinic rays equivalent to the exposure step, and the exposure energy irradiated is 100 to 900mJ / cm 2 .

11. The method for preparing a pixel defining layer according to claim 1, characterized in that: The photosensitive composition includes a photolithography resin, and the photolithography resin includes an acrylic binder resin, a cardo binder resin, or a combination thereof.

12. A pixel defining layer prepared according to claim 1. 13 . An organic light emitting display device comprising the pixel defining layer according to claim 13 .

14. An electronic device, characterized in that: The invention comprises the display device according to claim 13 and a control unit for driving the display device.

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