Optical module

Abstract

An optical module (200) comprises a light emitting assembly (500), the light emitting assembly (500) comprises a TEC (511b) and a tube socket (510b), the TEC (511b) comprises a first substrate and a second substrate, and the first substrate and the second substrate are oppositely arranged in parallel; an inclined cushion block (900) is arranged on the surface of the TEC (511b), the section of the inclined cushion block (900) is triangular, the inclined cushion block (900) comprises an inclined plane, and a preset angle is formed between the inclined plane and the surface of the first substrate; a laser chip substrate (512b) is arranged on the surface of the inclined cushion block (900), a laser chip (513b) is arranged on the surface of the laser chip substrate (512b), and optical signals generated by the laser chip (513b) are obliquely emitted out along the inclined plane.

Description

optical modules

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This disclosure claims priority to patents filed with the China Patent Office on June 30, 2022, with application number 202210772299.7, and with application number 202221698289.5, filed with the China Patent Office on June 30, 2022, the entire contents of which are incorporated by reference into this disclosure. Technical Field

[0003] The present disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0004] Optical modules are tools for converting optical and electrical signals and are key components in optical communication equipment. They typically include an optical transmitter, receiver, and microprocessor. Some modules also combine separate transmitter and receiver components within a metal housing to create an optical transceiver assembly.

[0005] Summary of the Invention

[0006] In a first aspect, some embodiments of the present disclosure provide an optical module, comprising: a circuit board; an optical emission component electrically connected to the circuit board, comprising: a tube seat; a TEC, disposed on a surface of the tube seat, comprising a first substrate and a second substrate, the first substrate and the second substrate being arranged relatively parallel to each other; a tilted pad, disposed on the surface of the TEC, having a triangular cross-section and comprising an inclined surface, wherein the inclined surface forms a preset angle with the surface of the first substrate; a laser chip substrate, disposed on the surface of the tilted pad, and having a first signal transmission area and a second signal transmission area respectively provided on the surface; a signal adapter board, disposed on one side of the TEC, having a third signal transmission area provided on the surface, the third signal transmission area being electrically connected to the second signal transmission area; a laser chip, disposed on the surface of the laser chip substrate, comprising a light-emitting area and an electro-absorption modulation area, and configured to emit a light signal, wherein the light signal transmission optical path forms a preset angle with the first substrate; the light-emitting area is electrically connected to the first signal transmission area; the electro-absorption modulation area is electrically connected to the second signal transmission area; and a reflecting prism, disposed on the light output path of the laser chip, and configured to change the transmission direction of the light signal so that the light signal is transmitted to the outside of the optical emission component.

[0007] In a second aspect, some embodiments of the present disclosure provide an optical module, comprising: a circuit board; an optical emission component electrically connected to the circuit board, comprising: a tube seat; a TEC, arranged on the surface of the tube seat, comprising a first substrate and a second substrate, the second substrate being arranged on the surface of the tube seat, the first substrate and the second substrate being connected via a semiconductor tube column array; the first substrate being arranged obliquely relative to the second substrate, and the minimum vertical distance between the first substrate and the second substrate being not less than a preset distance; the semiconductor tube column array, comprising semiconductor tube columns, being configured to control the cooling or heating of the TEC according to the input current; a laser chip substrate, arranged on the surface of the first substrate, and having a first signal transmission area and a second signal transmission area; a signal adapter board is provided on one side of the TEC, and a third signal transmission area is provided on the surface of the TEC, and the third signal transmission area is electrically connected to the second signal transmission area; a laser chip is provided on the surface of the laser chip substrate, including a light-emitting area and an electro-absorption modulation area, and is configured to emit a light signal, and the light signal transmission optical path is at a preset inclination angle with the surface of the tube seat; the light-emitting area is electrically connected to the first signal transmission area; the electro-absorption modulation area is electrically connected to the second signal transmission area; a reflecting prism is provided on the light-emitting optical path of the laser chip, and is configured to change the transmission direction of the light signal so that the light signal is transmitted to the outside of the light emitting component. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in certain embodiments of the present disclosure.

[0009] FIG1 is a connection diagram of an optical communication system according to some embodiments;

[0010] FIG2 is a block diagram of an optical network terminal according to some embodiments;

[0011] FIG3 is a structural diagram of an optical module according to some embodiments;

[0012] FIG4 is an exploded view of an optical module according to some embodiments;

[0013] FIG5 is a structural diagram of an optical transceiver assembly of an optical module according to some embodiments;

[0014] FIG6 is a structural diagram of an optical transmission component of an optical module according to some embodiments;

[0015] FIG7 is an exploded structural diagram of an optical transmission component of an optical module according to some embodiments;

[0016] FIG8 is a structural diagram of a light emitting assembly of an optical module from one perspective after a cap is removed according to some embodiments;

[0017] FIG9 is a structural diagram of a light emitting assembly of an optical module from another perspective after a cap is removed according to some embodiments;

[0018] FIG10 is a structural diagram of a light emitting assembly of an optical module from another perspective after a cap is removed according to some embodiments;

[0019] FIG11 is a structural diagram of a light emitting assembly of an optical module from another perspective after a cap is removed according to some embodiments;

[0020] FIG12 is a schematic diagram of the internal exploded structure of a light emitting assembly of an optical module according to some embodiments;

[0021] FIG13 is a partial structural diagram of a light emitting assembly of an optical module according to some embodiments;

[0022] FIG14 is a diagram illustrating a socket structure of a light emitting assembly of an optical module from one perspective according to some embodiments;

[0023] FIG15 is a diagram illustrating a socket structure of a light emitting assembly of an optical module from another perspective according to some embodiments;

[0024] FIG16 is a diagram illustrating a socket structure of a light emitting assembly of an optical module from another perspective according to some embodiments;

[0025] FIG17 is a diagram illustrating a socket structure of a light emitting assembly of an optical module from another perspective according to some embodiments;

[0026] FIG18 is a structural diagram of a signal adapter board from a perspective of an optical transmission component of an optical module according to some embodiments;

[0027] FIG19 is a structural diagram of a signal adapter board of an optical transmission component of an optical module from another perspective according to some embodiments;

[0028] FIG20 is a TEC structure diagram of a light emitting component of an optical module from one perspective according to some embodiments;

[0029] FIG21 is a TEC structure diagram of a light emitting assembly of an optical module from another perspective according to some embodiments;

[0030] FIG22 is a structural diagram of a laser chip substrate of a light emitting assembly of an optical module according to some embodiments;

[0031] FIG23 is an exploded view of a laser chip substrate of a light emitting assembly of an optical module according to some embodiments;

[0032] FIG24 is a schematic diagram illustrating electrical connections of various structures of a light emitting assembly of an optical module according to some embodiments;

[0033] FIG25 is a schematic diagram of optical transmission of an optical transmission component of an optical module according to some embodiments;

[0034] FIG26 is a schematic structural diagram of another optical transmission component of an optical module according to some embodiments;

[0035] FIG27 is a schematic structural diagram of another optical emitting assembly of an optical module after a cap is removed according to some embodiments;

[0036] FIG28 is a schematic structural diagram of another optical emitting assembly of an optical module after a cap is removed according to some embodiments;

[0037] FIG29 is a schematic structural diagram of another optical emitting assembly of an optical module after a cap is removed according to some embodiments;

[0038] FIG30 is a schematic structural diagram of another optical emitting component of an optical module after the cap is removed according to some embodiments. DETAILED DESCRIPTION

[0039] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0040] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0041] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of certain embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0042] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0043] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0044] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0045] The use of "configured to" herein is intended to be open and inclusive language that does not exclude devices being configured to perform additional tasks or steps.

[0046] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0047] In optical communication technology, light is used to carry the information to be transmitted. This information is then transmitted through optical fiber or waveguide information transmission equipment to information processing equipment such as computers. Because optical signals have passive transmission characteristics when transmitted through optical fiber or waveguide, low-cost, low-loss information transmission is possible. Furthermore, the signals transmitted by optical fiber or waveguide information transmission equipment are optical signals, while the signals that can be recognized and processed by computers and other information processing equipment are electrical signals. Therefore, in order to establish an information connection between optical fiber or waveguide information transmission equipment and computers and other information processing equipment, it is necessary to convert electrical signals into optical signals.

[0048] In the field of fiber-optic communications, optical modules implement the aforementioned conversion between optical and electrical signals. They include an optical port and an electrical port. The optical module uses the optical port to achieve optical communication with information transmission equipment such as optical fibers or optical waveguides, while the electrical port enables electrical connection to an optical network terminal (e.g., an optical modem). The electrical connection is primarily configured to provide power, I2C signal transmission, data signal transmission, and grounding. The optical network terminal transmits the electrical signals to information processing equipment such as computers via network cables or wireless fidelity (Wi-Fi).

[0049] Figure 1 is a connection diagram of an optical communication system according to some embodiments. As shown in Figure 1, the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103;

[0050] One end of optical fiber 101 is connected to remote server 1000, and the other end is connected to optical network terminal 100 via optical module 200. Optical fiber itself can support long-distance signal transmission, for example, signal transmission over several kilometers (6 to 8 kilometers). Furthermore, if repeaters are used, ultra-long-distance transmission is theoretically possible. Therefore, in typical optical communication systems, the distance between remote server 1000 and optical network terminal 100 can typically reach several thousand meters, tens of kilometers, or even hundreds of kilometers.

[0051] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing device 2000 can be any one or more of the following devices: a router, a switch, a computer, a mobile phone, a tablet computer, a television, etc.

[0052] The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

[0053] Optical module 200 includes an optical port and an electrical port. The optical port is configured to connect to optical fiber 101, thereby establishing a bidirectional optical signal connection between optical module 200 and optical fiber 101. The electrical port is configured to connect to optical network terminal 100, thereby establishing a bidirectional electrical signal connection between optical module 200 and optical network terminal 100. Optical module 200 converts optical signals into electrical signals, thereby establishing a connection between optical fiber 101 and optical network terminal 100. For example, optical signals from optical fiber 101 are converted into electrical signals by optical module 200 and then input into optical network terminal 100. Similarly, electrical signals from optical network terminal 100 are converted into optical signals by optical module 200 and then input into optical fiber 101.

[0054] The optical network terminal 100 includes a roughly rectangular housing, and an optical module interface 102 and a network cable interface 104 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200, thereby establishing a bidirectional electrical signal connection between the optical network terminal 100 and the optical module 200. The network cable interface 104 is configured to connect to the network cable 103, thereby establishing a bidirectional electrical signal connection between the optical network terminal 100 and the network cable 103. The connection between the optical module 200 and the network cable 103 is established through the optical network terminal 100. For example, the optical network terminal 100 transmits electrical signals from the optical module 200 to the network cable 103, and transmits signals from the network cable 103 to the optical module 200. Therefore, the optical network terminal 100 serves as the host computer of the optical module 200 and can monitor the operation of the optical module 200. In addition to the optical network terminal 100, the host computer of the optical module 200 may also include an optical line terminal (OLT), etc.

[0055] The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101 , the optical module 200 , the optical network terminal 100 and the network cable 103 .

[0056] Figure 2 is a structural diagram of an optical network terminal according to some embodiments. To clearly illustrate the connection between optical module 200 and optical network terminal 100, Figure 2 only shows the structure of optical network terminal 100 related to optical module 200. As shown in Figure 2, optical network terminal 100 also includes a PCB circuit board 105 disposed within a housing, a cage 106 disposed on the surface of PCB circuit board 105, and an electrical connector disposed within cage 106. The electrical connector is configured to connect to the electrical port of optical module 200; the heat sink 107 has raised portions, such as fins, to increase the heat dissipation area.

[0057] The optical module 200 is inserted into the cage 106 of the optical network terminal 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects to the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the optical network terminal 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the optical fiber 101.

[0058] Figure 3 is a structural diagram of an optical module according to some embodiments, and Figure 4 is an exploded view of an optical module according to some embodiments. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, and an optical transceiver assembly 400;

[0059] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing with two openings. The outer contour of the housing is generally a square.

[0060] In some embodiments of the present disclosure, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0061] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0062] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or it can be inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200 (the right end in Figure 3), and opening 205 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, opening 204 is located at the end of the optical module 200, while opening 205 is located on the side of the optical module 200. Opening 204 is an electrical port, and the gold finger of the circuit board 300 extends from opening 204 and is inserted into the host computer (for example, the optical network terminal 100); opening 205 is an optical port, which is configured to connect to the external optical fiber 101, so that the external optical fiber 101 can connect to the optical transceiver assembly 400 inside the optical module 200.

[0063] The combined assembly of the upper housing 201 and the lower housing 202 facilitates installation of components such as the circuit board 300 and the optical transceiver assembly 400 within the housing, with the upper housing 201 and the lower housing 202 providing encapsulation and protection for these components. Furthermore, during assembly of the circuit board 300 and the optical transceiver assembly 400, the positioning, heat dissipation, and electromagnetic shielding components of these components are easily arranged, facilitating automated production.

[0064] In some embodiments, the upper shell 201 and the lower shell 202 are generally made of metal materials, which are conducive to electromagnetic shielding and heat dissipation.

[0065] In some embodiments, the optical module 200 further includes an unlocking component 203 located outside its housing. The unlocking component 203 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0066] For example, the unlocking component 203 is located on the outer walls of the two lower side panels 2022 of the lower housing 202 and has a snap-fitting component that mates with the host computer cage (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the host computer cage, the snap-fitting component of the unlocking component secures the optical module 200 in the host computer cage. When the unlocking component is pulled, the snap-fitting component of the unlocking component moves accordingly, thereby changing the connection between the snap-fitting component and the host computer, thereby releasing the snap-fitting relationship between the optical module 200 and the host computer, thereby allowing the optical module 200 to be removed from the host computer cage.

[0067] The circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips together according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips include, for example, microcontroller units (MCUs), laser driver chips, limiting amplifiers, clock and data recovery (CDR) chips, power management chips, and digital signal processing (DSP) chips.

[0068] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; when the optical transceiver component is located on the circuit board, the rigid circuit board can also provide stable load-bearing; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage.

[0069] The circuit board 300 also includes gold fingers formed on its end surfaces. The gold fingers are composed of multiple independent pins. The circuit board 300 is inserted into the cage 106, and the gold fingers are electrically connected to the electrical connector inside the cage 106. The gold fingers can be provided only on one side of the circuit board 300 (for example, the upper surface shown in FIG4 ), or they can be provided on both the upper and lower surfaces of the circuit board 300 to accommodate applications requiring a large number of pins. The gold fingers are configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0070] Of course, some optical modules also use flexible printed circuits. They are typically used in conjunction with rigid printed circuits to complement them. For example, a flexible printed circuit can be used to connect a rigid printed circuit to an optical transceiver assembly.

[0071] The optical transceiver assembly 400 includes an optical transmitting assembly and an optical receiving assembly. The optical transmitting assembly is configured to transmit an optical signal, and the optical receiving assembly is configured to receive an optical signal. For example, the optical transmitting assembly and the optical receiving assembly are combined to form an integrated optical transceiver assembly.

[0072] FIG5 is a schematic diagram of the internal structure of an optical module according to some embodiments. As shown in FIG5 , the optical transceiver assembly 400 in the aforementioned embodiment includes an optical transmitter assembly 500 and an optical receiver assembly 700. The optical module also includes a square tube body 600 and an optical fiber adapter 800. In some embodiments of the present disclosure, the optical transceiver assembly is connected to the optical fiber via the optical fiber adapter 800. That is, the optical fiber adapter 800 is embedded in the square tube body 600 and is configured to connect the optical fiber. In some embodiments of the present disclosure, the square tube body 600 is provided with a third tube opening 603 for inserting the optical fiber adapter 800. The optical fiber adapter 800 is embedded in the third tube opening 603. The optical transmitter assembly 500 and the optical receiver assembly 700 respectively establish optical connections with the optical fiber adapter 800. The light emitted and received by the optical transceiver assembly are both transmitted via the same optical fiber in the optical fiber adapter. That is, the same optical fiber in the optical fiber adapter serves as the transmission channel for light entering and exiting the optical transceiver assembly. The optical transceiver assembly implements a single-fiber bidirectional optical transmission mode.

[0073] The rectangular tube 600 is configured to carry the optical transmitter assembly 500 and the optical receiver assembly 700. In certain embodiments of the present disclosure, the rectangular tube 600 is made of metal to facilitate electromagnetic shielding and heat dissipation. The rectangular tube 600 is provided with a first nozzle 601 and a second nozzle 602, which are respectively located on adjacent side walls of the rectangular tube 600. In certain embodiments of the present disclosure, the first nozzle 601 is located on the longitudinal side wall of the rectangular tube 600, and the second nozzle 602 is located on the width side wall of the rectangular tube 600.

[0074] The optical transmitter assembly 500 is embedded in the first tube opening 601, through which the optical transmitter assembly 500 is in thermal contact with the rectangular tube body 600. The optical receiver assembly 700 is embedded in the second tube opening 602, through which the optical receiver assembly 700 is in thermal contact with the rectangular tube body 600. In certain embodiments of the present disclosure, the optical transmitter assembly 500 and the optical receiver assembly 700 are directly press-fitted into the rectangular tube body 600, with the rectangular tube body 600 in contact with the optical transmitter assembly 500 and the optical receiver assembly 700, respectively, either directly or through a heat-conducting medium. In this manner, the rectangular tube body can be configured to dissipate heat from the optical transmitter assembly 500 and the optical receiver assembly 700, ensuring effective heat dissipation for the optical transmitter assembly 500 and the optical receiver assembly 700.

[0075] In some embodiments of the present disclosure, the optical transmitter assembly 500 is connected to the circuit board 300 via a flexible circuit board and is configured to transmit optical signals. The optical receiver assembly 700 is connected to the circuit board 300 via a flexible circuit board and has an optical receiver chip therein and is configured to receive optical signals.

[0076] Figure 6 is a structural diagram of an optical transmitter assembly of an optical module according to some embodiments, and Figure 7 is an exploded structural diagram of an optical transmitter assembly of an optical module according to some embodiments. As shown in Figures 6 and 7, the optical transmitter assembly 500 includes a base 510a and a cap 520a. The cap 520a is mounted on the base 510a, and the base 510a and the cap 520a enclose a cavity. A laser chip is disposed within the cavity enclosed by the base 510a and the cap 520a. The laser chip includes a light-emitting region and an electro-absorption modulation region. The positive terminal of the light-emitting region is connected to the laser driver chip on the circuit board, and the negative terminal of the light-emitting region is grounded. The positive terminal of the electro-absorption modulation region is connected to the laser driver chip and power chip on the circuit board, and the negative terminal of the electro-absorption modulation region is grounded. The light-emitting region emits light that does not carry data in response to a drive signal, and the electro-absorption modulation region modulates the light that does not carry data into data light in response to a modulation signal and a bias signal. The cap 520a is provided with a through hole 40221, and a collimating lens is bonded to the through hole 40221. The data light emitted by the laser chip is collimated by the collimating lens on cap 520a and then enters the square tube. It is then converged by the optical components inside the tube and coupled into the fiber adapter. The drive signal, modulation signal, and bias signal are all high-frequency signals. The drive signal is provided by the laser driver chip, the modulation signal is also provided by the laser driver chip, and the bias signal is provided by the power chip.

[0077] Figure 8 is a structural diagram of an optical module's light emitting assembly from one perspective after removing the cap, according to some embodiments; Figure 9 is a structural diagram of an optical module's light emitting assembly from another perspective after removing the cap, according to some embodiments; Figure 10 is a structural diagram of an optical module's light emitting assembly from another perspective after removing the cap, according to some embodiments; and Figure 11 is a structural diagram of an optical module's light emitting assembly from another perspective after removing the cap, according to some embodiments. Figures 8, 9, 10, and 11 illustrate the internal structure of light emitting assembly 500 from different perspectives after removing cap 520a; Figure 12 is a schematic diagram of the exploded internal structure of an optical module's light emitting assembly, according to some embodiments; and Figure 13 is a partial structural diagram of an optical module's light emitting assembly, according to some embodiments. Figure 14 is a structural diagram of the socket of an optical module from one perspective; Figure 15 is a structural diagram of the socket of an optical module from another perspective; Figure 16 is a structural diagram of the socket of an optical module from another perspective; and Figure 17 is a structural diagram of the socket of an optical module from another perspective. Figures 14-17 are structural schematic diagrams of the tube seat 510a at different viewing angles; Figure 18 is a structural diagram of the signal adapter board at one viewing angle of the optical emission component of an optical module according to some embodiments; Figure 19 is a structural diagram of the signal adapter board at another viewing angle of the optical emission component of an optical module according to some embodiments; Figures 18 and 19 are structural schematic diagrams of the signal adapter board 514a at different viewing angles; Figure 20 is a structural diagram of the TEC at one viewing angle of the optical emission component of an optical module according to some embodiments; Figure 21 is a structural diagram of the TEC at another viewing angle of the optical emission component of an optical module according to some embodiments; Figures 20 and 21 are structural schematic diagrams of TEC511A at different viewing angles; Figure 22 is a structural diagram of the laser chip substrate of the optical emission component of an optical module according to some embodiments; Figure 23 is an exploded view of the laser chip substrate of the optical emission component of an optical module according to some embodiments; Figures 22 and 23 are surface structural schematic diagrams of the laser chip substrate 512a.

[0078] As shown in Figures 8 to 13, a TEC511A is provided on the surface of the tube holder 510a. The surface of the tube holder 510a is also provided with a fourth pin and a fifth pin. A laser chip substrate 512a is provided on the surface of the TEC511A. A laser chip 513a is provided on the surface of the laser chip substrate 512a. The laser chip 513a includes a light-emitting area and an electro-absorption modulation area, which are electrically connected to the fourth pin and the fifth pin respectively. A signal adapter board 514a is provided on the side of the TEC511A, and a reflective prism 516a is provided on the light-emitting optical path of the laser chip 513a. In some embodiments of the present disclosure: TEC511A is provided on the surface of the tube seat 510a, and includes a first substrate and a second substrate, and the first substrate and the second substrate are connected through a semiconductor tube column array; the first substrate is tilted relative to the second substrate, and the relatively lower end is closer to the fourth pin and the fifth pin, and the minimum vertical distance between the first substrate and the second substrate is not less than a preset distance; the semiconductor tube column array includes semiconductor tube columns, which are configured to control the cooling or heating of the TEC according to the input current; the laser chip substrate 512a is provided on the surface of the first substrate, and the surface is respectively provided with a first signal transmission area and a second signal transmission area; the first signal transmission area is electrically connected to the fourth pin; the signal adapter board 514a is provided on the surface of the TEC On one side, a third signal transmission region is provided on the surface; one end of the third signal transmission region is electrically connected to the fifth pin, and the other end is electrically connected to the second signal transmission region. A laser chip 513a is provided on the surface of the laser chip substrate and includes a light-emitting region and an electro-absorption modulation region. The light-emitting region is electrically connected to the first signal transmission region. Since the first signal transmission region is electrically connected to the fourth pin, the light-emitting region is electrically connected to the fourth pin. The electro-absorption modulation region is electrically connected to the second signal transmission region. Since the second signal transmission region is electrically connected to the third signal transmission region and the third signal transmission region is electrically connected to the fifth pin, the electro-absorption modulation region is electrically connected to the fifth pin. The laser chip 513a generates an optical signal, and the optical signal transmission path is inclined at a predetermined angle to the surface of the base. A reflective prism is provided on the optical path of the laser chip and is configured to change the transmission direction of the optical signal emitted by the laser chip so that the optical signal is transmitted outside the optical emitting assembly.

[0079] In certain embodiments of the present disclosure, since the surface of the first substrate is an inclined surface, the laser chip is also tilted relative to the second substrate. Therefore, the optical signal generated by the laser chip is emitted obliquely along the first substrate, and the emission angle of the optical signal is reduced, thereby increasing the coupling efficiency of the optical signal to the tube cap lens.

[0080] In some embodiments of the present disclosure, since the first substrate is tilted relative to the second substrate, the minimum vertical distance between the first substrate and the second substrate is not less than a preset distance, the distance between the first substrate and the second substrate increases, and the height of the first substrate increases, thereby increasing the setting height of the laser chip, and then increasing the setting height of the tube seat, thereby reducing the setting length of the flexible circuit board and improving the high-frequency signal performance.

[0081] In some embodiments of the present disclosure, the distance between the first substrate and the second substrate increases, thereby increasing the length of each semiconductor column between the first substrate and the second substrate. Compared with the related art, the length of the semiconductor column is increased, thereby increasing the temperature control performance of the TEC.

[0082] In some embodiments of the present disclosure, since a tungsten-copper heat sink is avoided, the heat conduction path between the laser and the TEC can be shortened.

[0083] A light emitting assembly according to some embodiments will be described in detail below with reference to FIG. 6 to FIG. 25 .

[0084] As shown in Figures 14 to 17, a pin 515a is provided on the surface of the tube socket 510a. In some embodiments of the present disclosure, a first pin 5151, a second pin 5152, a third pin 5153, a fourth pin 5154 and a fifth pin 5155 are provided on the surface of the tube socket 510a; the first pin 5151, the second pin 5152, the third pin 5153, the fourth pin 5154 and the fifth pin 5155 respectively protrude relative to the surface of the tube socket 510a, and the protrusion heights are different, among which the protrusion height of the fifth pin 5155 is higher than the first pin 5151, the second pin 5152, the third pin 5153 and the fourth pin 5154. The first pin 5151, second pin 5152, third pin 5153, fourth pin 5154, and fifth pin 5155 are each electrically connected to the circuit board via a flexible printed circuit board. Electrical signals are transmitted to the circuit board, then to the corresponding pins via the flexible printed circuit board, and then from the pins to the corresponding device. These electrical signals include high-frequency signals. The first pin 5151 and second pin 5152 are electrically connected to the first electrode 5113 and second electrode 5114 of the TEC 511A, respectively. The third pin 5153 is electrically connected to the thermistor. The fourth pin 5154 is electrically connected to the first signal transmission area 5124. The fifth pin 5155 is electrically connected to the third signal transmission area 5142.

[0085] As shown in Figures 20 and 21, the TEC511A includes a first substrate 5111, a second substrate 5112, a first electrode 5113, and a second electrode 5114. A semiconductor column array 5115 is provided between the first substrate 5111 and the second substrate 5112. The first electrode 5113 and the second electrode 5114 are electrically connected to a first pin 5151 and a second pin 5152, respectively. The first pin 5151 and the second pin 5152 are power supply pins. The power signal is transmitted to the circuit board via the power pins on the gold finger, and then to the flexible circuit board, and further to the first pin 5151 and the second pin 5152. The first pin 5151 and the second pin 5152 supply power to the first electrode 5113 and the second electrode 5114. The first electrode 5113 and the second electrode 5114 are configured to supply power to the semiconductor column array 5115, so that the semiconductor column array 5115 controls the cooling or heating of the TEC511A according to the input current, thereby controlling the operating temperature of the laser chip.

[0086] Regarding the semiconductor column array 5115, the present disclosure refers to all semiconductor columns between the first substrate 5111 and the second substrate 5112 as the semiconductor column array 5115. For the convenience of description, the direction in which the second substrate 5112 extends is defined as the horizontal direction, and the direction perpendicular to this direction is defined as the vertical direction. The semiconductor column array 5115 includes various semiconductor column groups. Semiconductor columns in the same column in the vertical direction constitute a semiconductor column group, so that the semiconductor columns in the same semiconductor column group have the same length, that is, semiconductor columns with the same length are divided into a semiconductor column group; the length of each semiconductor column group in the horizontal direction gradually changes, and each semiconductor column group constitutes the semiconductor column array 5115.

[0087] Therefore, the semiconductor column array 5115 includes a first semiconductor column group, a second semiconductor column group, a third semiconductor column group, ..., and an Nth semiconductor column group. The first semiconductor column group, the second semiconductor column group, the third semiconductor column group, ..., and the Nth semiconductor column group are distributed between the first substrate 5111 and the second substrate 5112 with equal spacing. The lengths of the first semiconductor column group, the second semiconductor column group, the third semiconductor column group, ..., and the Nth semiconductor column group increase in a direction. The first semiconductor column group includes semiconductor columns of the same length, the second semiconductor column group includes semiconductor columns of the same length, ..., and the Nth semiconductor column group includes semiconductor columns of the same length. The second substrate 5112 is disposed on a surface of the stem 510a, and in some embodiments of the present disclosure, is disposed on the top surface of the stem 510a. The second substrate 5112 is disposed parallel to the top surface of the stem 510a, and the first substrate 5111 is disposed at an angle relative to the second substrate 5112, i.e., the surface of the first substrate 5111 is an inclined surface. The first substrate 5111 is tilted relative to the second substrate 5112, so that the extension lines of the first substrate 5111 and the second substrate 5112 intersect at a certain point. At this time, there is a preset angle between the extension lines of the first substrate 5111 and the second substrate 5112. In some embodiments, the preset angle can be set to 30°.

[0088] The first substrate 5111 is tilted relative to the second substrate 5112, and the distance between the first substrate 5111 and the second substrate 5112 gradually changes. In some embodiments of the present disclosure, the vertical distance between the first substrate 5111 and the second substrate 5112 gradually increases from the first end to the second end; and the minimum vertical distance between the first substrate 5111 and the second substrate 5112 is not less than the preset distance, and the vertical distance between the first substrate 5111 and the second substrate 5112 is not less than the preset distance at the first end; in some embodiments, in the prior art, the first substrate 5111 in TEC511A is usually arranged parallel to the second substrate 5112. Assuming that the vertical distance between the two is H, the aforementioned preset distance can be set to H, and the minimum vertical distance between the first substrate 5111 and the second substrate 5112 is not less than H.

[0089] The first substrate 5111 and the second substrate 5112 are connected by a semiconductor column array 5115, that is, a semiconductor column array 5115 is provided between the first substrate 5111 and the second substrate 5112; the semiconductor column array 5115 includes semiconductor column groups of different lengths. Since the distance between the first substrate 5111 and the second substrate 5112 gradually increases from one end to the other end, the length of the semiconductor column group between the first substrate 5111 and the second substrate 5112 gradually increases from the first end to the second end, so that the length of each semiconductor column group between the first substrate and the second substrate increases gradually. Compared with the related technology, the length of the semiconductor column is increased, thereby improving the temperature control performance of the TEC.

[0090] The semiconductor tube column array 5115 includes semiconductor tube column groups of different lengths, and each semiconductor tube column group includes a semiconductor tube column. The top surface of any semiconductor tube column is in contact with the first substrate. In some embodiments, the top surface of each semiconductor tube column is set as an inclined surface, and the inclined direction is the same as the inclined direction of the first substrate 5111. In this way, the contact surface of each semiconductor tube column with the first substrate 5111 is an inclined surface, which increases the contact area and can further improve the temperature control performance of TEC.

[0091] In some embodiments of the present disclosure, the relatively lower end of the first substrate 5111 is closer to the fourth pin 5154 and the fifth pin 5155. Since the fourth pin 5154 and the fifth pin 5155 are electrically connected to the light-emitting area and the electro-absorption modulation area of ​​the laser chip 513a, respectively, when the relatively lower end of the first substrate 5111 is closer to the fourth pin 5154 and the fifth pin 5155, it is convenient to bond wires and the bonding length is shorter, which is beneficial to the transmission of high-frequency signals, thereby improving high-frequency performance.

[0092] The laser chip substrate 512a is arranged on the surface of the first substrate 5111 and is also tilted relative to the second substrate 5112. The tilt direction and tilt angle are the same as the tilt direction and tilt angle of the first substrate 5111. A laser chip 513a is provided on the surface of the laser chip substrate 512a. As shown in Figures 22 and 23, the laser chip substrate 512a is a metallized ceramic substrate, and a high-frequency signal line can be laid on the surface to form a circuit pattern. In some embodiments, the surface of the laser chip substrate 512a is provided with a first signal transmission area 5124 and a second signal transmission area 5122, and a first grounding area 5121 and a second grounding area 5123 are respectively provided on both sides of the second signal transmission area 5122. The first grounding area 5121, the second signal transmission area 5122, and the second grounding area 5123 constitute a GSG signal transmission method. The laser chip 513a includes a light-emitting area and an electro-absorption modulation area. The positive end of the light-emitting area is wired to the first signal transmission area 5124, and then the first signal transmission area 5124 is wired to the fourth pin 5154. Conversely, the fourth pin 5154 is wired to the first signal transmission area 5124, and the first signal transmission area 5124 is wired to the light-emitting area of ​​the laser chip 513a. The first high-frequency signal is then transmitted to the light-emitting area of ​​the laser chip 513a through the fourth pin. The light-emitting area of ​​the laser chip 513a generates light that does not carry data based on the received first high-frequency signal. The first high-frequency signal includes a high-frequency driving signal provided to the light-emitting area of ​​the laser chip 513a.

[0093] The signal transfer board 514a is disposed on one side of the TEC 511A and is also tilted relative to the second substrate 5112. The tilt direction and angle are the same as those of the first substrate 5111. The signal transfer board 514a shortens the bonding distance between the signal transmission area of ​​the laser chip substrate 512a and the pins, facilitating the transmission of high-frequency signals. The signal transfer board 514a is also a metallized ceramic substrate, and high-frequency signal lines can be laid on its surface to form a circuit pattern. In some embodiments, the signal transfer board 514a has a third signal transmission area 5142 on its surface, flanked by a third grounding area 5141 and a fourth grounding area 5143. These three areas, 5141, 5142, and 5143, form a GSG signal transmission scheme. The third grounding area 5141 is electrically connected to the first grounding area 5121, and the fourth grounding area 5143 is electrically connected to the second grounding area 5123.

[0094] One end of the third signal transmission region 5142 is wired to the fifth pin 5155, and the other end is wired to the second signal transmission region 5122. The second signal transmission region 5122 is wired to the electro-absorption modulation region of the laser chip 513a. Then, the second high-frequency signal is transmitted to the third signal transmission region 5142 through the fifth pin 5155, and then continues to be transmitted to the second signal transmission region 5122, and then is transmitted to the electro-absorption modulation region of the laser chip 513a. The electro-absorption modulation region of the laser chip 513a modulates the light that does not carry data generated by the light-emitting region into light that carries data according to the second high-frequency signal. In some embodiments of the present disclosure, data is modulated into the light beam generated by the light-emitting region, and then the light that does not carry data generated by the light-emitting region is modulated into light that carries data. The second high-frequency signal includes a high-frequency modulation signal and a high-frequency bias signal provided to the electro-absorption modulation region of the laser chip 513a.

[0095] The laser chip 513a is arranged parallel to the laser chip substrate 512a. Since the laser chip substrate 512a is arranged relatively tilted, the laser chip 513a is also arranged relatively tilted. The light-emitting area and the electro-absorption modulation area receive the first high-frequency signal and the second high-frequency signal respectively, and then emit a light beam carrying data according to the first high-frequency signal and the second high-frequency signal.

[0096] Since the surface of the first substrate is an inclined surface, the laser chip is also tilted relative to the second substrate. The optical signal generated by the laser chip is emitted along the first substrate at an angle, and the emission angle of the optical signal is reduced, thereby increasing the coupling efficiency of the optical signal to the tube cap lens.

[0097] Since the first substrate is tilted relative to the second substrate, the minimum vertical distance between the first substrate and the second substrate is not less than the preset distance, so the distance between the first substrate and the second substrate increases, and the height of the first substrate increases, thereby increasing the setting height of the laser chip, and then increasing the setting height of the tube seat, thereby reducing the setting length of the flexible circuit board and improving the high-frequency signal performance.

[0098] The reflective prism 516a is disposed on the light path of the laser chip 513a and is configured to change the propagation direction of the light beam emitted by the laser chip 513a so that the light beam emitted by the laser chip 513a is directed toward the collimating lens inside the tube cap 520a. In some embodiments of the present disclosure, the optical path diagram is shown in Figure 25.

[0099] The protruding height of the fifth pin 5155 relative to the surface of the tube seat 510a is slightly different from the height of the signal adapter board 514a, so the height difference between the fifth pin 5155 and the third signal transmission area 5142 on the surface of the signal adapter board 514a is slightly different. Therefore, the surface of the fifth pin 5155 does not need to be set at an angle, but the surface of the fifth pin 5155 can be set horizontally, then the fifth pin 5155 and the third signal transmission area 5142 are directly connected by wires to transmit the second high-frequency signal.

[0100] The protruding height of the fourth pin 5154 relative to the surface of the tube base 510a is relatively small, which is smaller than the height of the laser chip substrate 512a, and is in turn smaller than the height of the first signal transmission area 5124. In order to shorten the bonding length between the fourth pin 5154 and the first signal transmission area 5124 and ensure smooth bonding, the surface of the fourth pin 5154 is tilted, and the tilt direction and tilt angle are the same as those of the laser chip substrate 512a. This shortens the bonding length between the fourth pin 5154 and the first signal transmission area 5124 and ensures smooth bonding, which is beneficial to the transmission of the first high-frequency signal.

[0101] As shown in FIG22 , a terminal resistor 518 and a matching capacitor 517 are further provided on the surface of the laser chip substrate 512 a.

[0102] Matching capacitor 517 has its positive terminal connected to the negative terminal of terminal resistor 518, which is grounded, and is configured to reduce power consumption. The positive terminal of terminal resistor 518 is wire-bonded to laser chip 513a, and terminal resistor 518 is configured to reduce signal reflections caused by impedance discontinuities.

[0103] The terminal resistor 518 and the matching capacitor 517 are connected in series so that they are connected in parallel with the laser chip 513 a .

[0104] As shown in Figure 23, the surface of the laser chip substrate 512a is also provided with a first setting area 5125, a second setting area 5126 and a third setting area 5127. The first setting area 5125, the second setting area 5126 and the third setting area 5127 are installation areas. The first setting area 5125 is configured to install the terminal resistor 518; the second setting area 5126 and the third setting area 5127 are configured to install the matching capacitor 517.

[0105] FIG24 is a schematic diagram of electrical connections of various structures of a light emitting component of an optical module according to some embodiments. As shown in FIG24 , a thermistor 519 is further provided on the surface of the laser chip substrate 512 a .

[0106] Thermistor 519 has a positive terminal connected to the third pin 5153 and a negative terminal connected to ground. It is configured to collect the operating temperature of the laser chip 513a and thereby monitor the operating temperature of the laser chip 513a. In certain embodiments of the present disclosure, the temperature of the laser chip 513a is collected in real time by thermistor 519 and fed back to a semiconductor cooler driver circuit. The semiconductor cooler driver circuit determines the current to be input to the semiconductor column array 5115 based on the received temperature of the laser chip 513a, thereby heating or cooling the semiconductor column array 5115, thereby controlling the temperature of the laser chip 513a within a target temperature range.

[0107] The protruding height of the third pin 5153 relative to the surface of the tube base 510a is relatively small, and is smaller than the height of the thermistor 519. In order to shorten the wire bonding length between the third pin 5153 and the thermistor 519 and ensure smooth wire bonding, the surface of the third pin 5153 is tilted. The tilt direction and tilt angle are the same as those of the laser chip substrate 512a. This shortens the wire bonding length between the third pin 5153 and the thermistor 519 and ensures smooth wire bonding, which is beneficial to the transmission of high-frequency signals.

[0108] Therefore, the present disclosure can shorten the wire bonding length between components and ensure the smoothness of wire bonding by tilting the laser chip substrate 512a, the laser chip 513a, the signal transfer board 514a, the third pin 5153, and the fourth pin 5154, and the tilting direction is the same as the tilting direction of the first substrate 5111, thereby facilitating the transmission of high-frequency signals and improving the high-frequency performance of the optical module.

[0109] In certain embodiments of the present disclosure, because the surface of the first substrate is inclined, the laser chip is also tilted relative to the second substrate. Consequently, the optical signal generated by the laser chip is emitted obliquely along the first substrate, reducing the emission angle of the optical signal and thereby increasing the coupling efficiency of the optical signal to the cap lens. In certain embodiments of the present disclosure, because the first substrate is tilted relative to the second substrate, the minimum vertical distance between the first and second substrates is not less than a predetermined distance. This increases the distance between the first and second substrates, increasing the height of the first substrate. This increases the height of the laser chip and the height of the socket, thereby reducing the length of the flexible printed circuit board and improving high-frequency signal performance. In certain embodiments of the present disclosure, the increasing distance between the first and second substrates increases the length of each semiconductor pillar between the first and second substrates. Compared to the length of semiconductor pillars in related art, this increases the temperature control performance of the TEC. In certain embodiments of the present disclosure, by eliminating the need for a tungsten-copper heat sink, the heat conduction path between the laser and the TEC can be shortened.

[0110] In some embodiments of the present disclosure, some embodiments of the present disclosure also provide another optical emission component, Figure 25 is a schematic diagram of the optical path transmission of the optical emission component of an optical module according to some embodiments; Figure 26 is a structural schematic diagram of another optical emission component of an optical module according to some embodiments; Figure 27 is a structural schematic diagram of another optical emission component of an optical module after the tube cap is removed according to some embodiments; Figure 28 is a structural schematic diagram of another optical emission component of an optical module according to some embodiments after the tube cap is removed; Figure 29 is a structural schematic diagram of another optical emission component of an optical module according to some embodiments after the tube cap is removed; Figure 30 is a structural schematic diagram of another optical emission component of an optical module according to some embodiments after the tube cap is removed.

[0111] As shown in Figures 26 to 30, it includes a tube cap 520b and a tube base 510b. The surface of the tube base 510b has TEC511b, a laser chip substrate 512b, a laser chip 513b, a signal adapter board 514b, a pin 515b, a reflective prism 516b and an inclined pad 900.

[0112] As shown in Figures 26-30, the TEC 511b includes a first substrate and a second substrate. The first substrate and the second substrate are arranged relatively parallel to each other, and the first substrate is located above the second substrate.

[0113] TEC511b has an inclined pad 900 on its surface. The cross-section of the inclined pad 900 is triangular. The inclined pad 900 includes a horizontal surface, a vertical surface and an inclined surface. The horizontal surface is provided on the surface of the first substrate. The vertical surface is arranged perpendicular to the first substrate. A preset angle is formed between the inclined surface and the first substrate. In some embodiments of the present disclosure, the preset angle between the inclined surface and the first substrate is 30°.

[0114] A laser chip substrate 512b is provided on the inclined surface of the inclined pad 900, and a laser chip 513b is provided on the surface of the laser chip substrate 512b. The optical signal path transmission direction generated by the laser chip 513b is emitted along the inclined surface, that is, the optical signal path transmission direction forms a preset angle with the first substrate. As mentioned above, the preset angle can be 30°.

[0115] The laser chip substrate 512 b , like the laser chip substrate 512 a , has a first signal transmission region and a second signal transmission region respectively provided on its surface.

[0116] The laser chip 513b includes a light-emitting area and an electro-absorption modulation area, which are electrically connected to the first signal transmission area and the second signal transmission area, respectively. The generated light signal is emitted obliquely along the first substrate, and the emission angle of the light signal is reduced, thereby increasing the coupling efficiency of the light signal to the tube cap lens; and the inclined pad 900 can increase the setting height of the laser chip, thereby increasing the setting height of the tube seat, thereby reducing the setting length of the flexible circuit board and improving the high-frequency signal performance.

[0117] The surface of the signal adapter plate 514b is inclined, and the inclined direction and angle of the surface are the same as the inclined surface of the inclined pad 900, so the surface of the signal adapter plate 514b is parallel to the inclined surface of the inclined pad 900; a third signal transmission area is provided on the surface, and the third signal transmission area is electrically connected to the second signal transmission area.

[0118] Pin 515b, like pin 515a, includes a fourth pin and a fifth pin, and the fourth pin and the fifth pin are close to the relatively lower end of the inclined surface of the inclined pad 900, which is conducive to wire bonding and shortens the wire bonding length, which is conducive to high-frequency signal transmission.

[0119] The reflecting prism 516b functions similarly to the reflecting prism 516a and is configured to change the transmission direction of the optical signal generated by the laser chip 513b so that the optical signal generated by the laser chip 513b is coupled to the lens in the tube cap.

[0120] In the related existing solutions, when the laser chip is set through the tungsten copper heat sink, the heat conduction path between the laser chip set on the tungsten copper heat sink and the TEC needs to pass through the longer vertical surface of the tungsten copper heat sink, resulting in a longer heat conduction path between the laser chip and the TEC; while in the embodiment shown in Figures 26-30, the tungsten copper heat sink is avoided and an inclined pad 900 is used instead. The inclined pad 900 can shorten the vertical distance between the laser chip and the TEC, thereby shortening the heat conduction path between the laser chip and the TEC.

[0121] In the embodiment shown in Figures 26-30, the optical signal generated by the laser chip 513b is emitted obliquely along the first substrate, and the emission angle of the optical signal is reduced, thereby increasing the coupling efficiency of the optical signal to the tube cap lens; and the inclined pad 900 can increase the setting height of the laser chip, thereby increasing the setting height of the tube seat, thereby reducing the setting length of the flexible circuit board and improving the high-frequency signal performance.

[0122] In summary, in an optical module according to some embodiments, FIG. 6 to FIG. 25 provide a light emitting assembly, and FIG. 26 to FIG. 30 provide another light emitting assembly.

[0123] In the optical transmission assembly provided in Figures 6-25, because the surface of the first substrate is inclined, the laser chip is also tilted relative to the second substrate. Consequently, the optical signal generated by the laser chip is emitted obliquely along the first substrate, reducing the emission angle of the optical signal and thereby increasing the coupling efficiency of the optical signal to the cap lens. In certain embodiments of the present disclosure, because the first substrate is tilted relative to the second substrate, the minimum vertical distance between the first and second substrates is no less than a predetermined distance. This increases the distance between the first and second substrates, increasing the height of the first substrate. This increases the height of the laser chip and the height of the socket, thereby reducing the length of the flexible printed circuit board and improving high-frequency signal performance. In certain embodiments of the present disclosure, the increasing distance between the first and second substrates increases the length of each semiconductor pillar between the first and second substrates, compared to the length of the semiconductor pillars in related art, thereby improving the temperature control performance of the TEC. In certain embodiments of the present disclosure, by eliminating the need for a tungsten-copper heat sink, the thermal path between the laser and the TEC can be shortened.

[0124] In the embodiment shown in Figures 26-30, the optical signal generated by the laser chip 513b is emitted obliquely along the first substrate, and the emission angle of the optical signal is reduced, thereby increasing the coupling efficiency of the optical signal to the tube cap lens; and the inclined pad 900 can increase the setting height of the laser chip, thereby increasing the setting height of the tube seat, thereby reducing the setting length of the flexible circuit board and improving the high-frequency signal performance.

[0125] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. An optical module, comprising: circuit boards; The optical emission assembly is electrically connected to the circuit board and includes: tube socket; TEC, provided on the surface of the tube seat, comprising a first substrate and a second substrate, wherein the first substrate and the second substrate are arranged parallel to each other; an inclined spacer, provided on the surface of the TEC, having a triangular cross-section and including an inclined surface, wherein the inclined surface forms a preset angle with the surface of the first substrate; A laser chip substrate is provided on the surface of the inclined pad, and a first signal transmission area and a second signal transmission area are respectively provided on the surface; a signal adapter board, disposed on one side of the TEC, having a third signal transmission area on its surface, the third signal transmission area being electrically connected to the second signal transmission area; a laser chip disposed on a surface of the laser chip substrate, comprising a light-emitting region and an electro-absorption modulation region, configured to emit a light signal, wherein a light signal transmission path forms a preset angle with the first substrate; The light emitting area is electrically connected to the first signal transmission area; The electro-absorption modulation region is electrically connected to the second signal transmission region; The reflecting prism is arranged on the light-emitting path of the laser chip and is configured to change the transmission direction of the optical signal so that the optical signal is transmitted to the outside of the optical emitting component.

2. The optical module according to claim 1, wherein: The top surface of the signal adapter plate is set as an inclined surface; The top surface of the signal transfer board is parallel to the surface of the first substrate.

3. The optical module according to claim 1, wherein: The TEC includes a first electrode and a second electrode; The first substrate and the second substrate are connected via a semiconductor column array; The first electrode and the second electrode are configured to supply power to the semiconductor column array so that the semiconductor column array controls the TEC to cool or heat according to an input current.

4. The optical module according to claim 3, wherein: A thermistor is provided on the surface of the laser chip substrate; The surface of the tube seat is respectively provided with a first pin, a second pin, a third pin, a fourth pin, and a fifth pin; The first pin is electrically connected to the first electrode and is configured to supply power to the first electrode; The second pin is electrically connected to the second electrode and is configured to supply power to the second electrode; The third pin is electrically connected to the thermistor, and the top surface is set as an inclined surface, and the inclined direction is the same as the inclined direction of the first substrate; The fourth pin is located near a relatively lower end of the first substrate and is electrically connected to the first signal transmission area. The top surface of the fourth pin is configured as an inclined surface, and the inclination direction is the same as the inclination direction of the first substrate. The fourth pin is configured to transmit the first high-frequency signal to the first signal transmission area and then to the light-emitting area. The fifth pin, located near a relatively lower end of the first substrate, is electrically connected to the third signal transmission area and is configured to transmit the second high-frequency signal to the third signal transmission area, and then to the electro-absorption modulation area via the second signal transmission area.

5. The optical module according to claim 3, wherein: The semiconductor column array includes semiconductor columns; The contact surface of the semiconductor column with the first substrate is set as an inclined surface.

6. The optical module according to claim 4, wherein: The distance from the fifth pin to the third signal transmission area is shorter than the distance from the third pin to the thermistor and the distance from the fourth pin to the first signal transmission area; The height of the fifth pin protruding from the surface of the tube seat is higher than the height of the first pin protruding from the surface of the tube seat, the height of the second pin protruding from the surface of the tube seat, the height of the third pin protruding from the surface of the tube seat, and the height of the fourth pin protruding from the surface of the tube seat. The height of the fifth pin protruding relative to the surface of the base is the same as the height of the signal adapter board.

7. The optical module according to claim 1, wherein: An extended line of the first substrate and an extended line of the second substrate form a preset angle; The preset angle between the extension line of the first substrate and the extension line of the second substrate is 30°.

8. The optical module according to claim 1, wherein: The laser chip substrate is also provided with a terminal resistor and a matching capacitor; The terminal resistor has a positive terminal electrically connected to the second signal transmission region and a negative terminal connected to the positive terminal of the matching capacitor, and is configured to reduce impedance discontinuity; The negative terminal of the matching capacitor is grounded.

9. The optical module according to claim 8, wherein: The surface of the laser chip substrate is further provided with a first setting area, a second setting area and a third setting area; The first setting area is configured to set the terminal resistor; The second setting region and the third setting region are configured to set the matching capacitor.

10. The optical module according to claim 1, wherein: A first grounding area and a second grounding area are respectively provided on both sides of the second signal transmission area; A third grounding area and a fourth grounding area are respectively provided on both sides of the third signal transmission area; The first grounding region is electrically connected to the third grounding region; The second ground region is electrically connected to the fourth ground region.

11. An optical module, comprising: circuit boards; The optical emission assembly is electrically connected to the circuit board and includes: tube socket; TEC, provided on the surface of the tube base, comprising a first substrate and a second substrate, wherein the second substrate is provided on the surface of the tube base, and the first substrate and the second substrate are connected via a semiconductor column array; The first substrate is tilted relative to the second substrate, and the minimum vertical distance between the first substrate and the second substrate is not less than a preset distance; The semiconductor column array, including semiconductor columns, is configured to control the TEC to cool or heat according to an input current; A laser chip substrate is provided on the surface of the first substrate, and a first signal transmission area and a second signal transmission area are respectively provided on the surface; a signal adapter board, disposed on one side of the TEC, having a third signal transmission area on its surface, the third signal transmission area being electrically connected to the second signal transmission area; A laser chip is provided on the surface of the laser chip substrate, includes a light emitting region and an electro-absorption modulation region, and is configured to emit a light signal, wherein the light signal transmission optical path is inclined at a preset angle to the surface of the tube seat; The light emitting area is electrically connected to the first signal transmission area; The electro-absorption modulation region is electrically connected to the second signal transmission region; The reflecting prism is arranged on the light-emitting path of the laser chip and is configured to change the transmission direction of the optical signal so that the optical signal is transmitted to the outside of the optical emitting component.

12. The optical module according to claim 11, wherein: The top surface of the signal adapter plate is set as an inclined surface; The top surface of the signal transfer board is parallel to the surface of the first substrate.

13. The optical module according to claim 11, wherein: The TEC includes a first electrode and a second electrode; The first electrode and the second electrode are configured to supply power to the semiconductor column array so that the semiconductor column array controls the TEC to cool or heat according to an input current.

14. The optical module according to claim 13, wherein: A thermistor is provided on the surface of the laser chip substrate; The surface of the tube seat is respectively provided with a first pin, a second pin, a third pin, a fourth pin, and a fifth pin; The first pin is electrically connected to the first electrode and is configured to supply power to the first electrode; The second pin is electrically connected to the second electrode and is configured to supply power to the second electrode; The third pin is electrically connected to the thermistor, and the top surface is set as an inclined surface, and the inclined direction is the same as the inclined direction of the first substrate; The fourth pin is located near a relatively lower end of the first substrate and is electrically connected to the first signal transmission area. The top surface of the fourth pin is configured as an inclined surface, and the inclination direction is the same as the inclination direction of the first substrate. The fourth pin is configured to transmit the first high-frequency signal to the first signal transmission area and then to the light-emitting area. The fifth pin, located near a relatively lower end of the first substrate, is electrically connected to the third signal transmission area and is configured to transmit the second high-frequency signal to the third signal transmission area, and then to the electro-absorption modulation area via the second signal transmission area.

15. The optical module according to claim 11, wherein: The contact surface of the semiconductor column with the first substrate is set as an inclined surface.

16. The optical module according to claim 14, wherein: The distance from the fifth pin to the third signal transmission area is shorter than the distance from the third pin to the thermistor and the distance from the fourth pin to the first signal transmission area; The height of the fifth pin protruding from the surface of the tube seat is higher than the height of the first pin protruding from the surface of the tube seat, the height of the second pin protruding from the surface of the tube seat, the height of the third pin protruding from the surface of the tube seat, and the height of the fourth pin protruding from the surface of the tube seat. The height of the fifth pin protruding relative to the surface of the base is the same as the height of the signal adapter board.

17. The optical module according to claim 11, wherein: An extended line of the first substrate and an extended line of the second substrate form a preset angle; The preset angle between the extension line of the first substrate and the extension line of the second substrate is 30°.

18. The optical module according to claim 11, wherein: The laser chip substrate is also provided with a terminal resistor and a matching capacitor; The terminal resistor has a positive terminal electrically connected to the second signal transmission region and a negative terminal connected to the positive terminal of the matching capacitor, and is configured to reduce impedance discontinuity; The negative terminal of the matching capacitor is grounded.

19. The optical module according to claim 18, wherein: The surface of the laser chip substrate is further provided with a first setting area, a second setting area and a third setting area; The first setting area is configured to set the terminal resistor; The second setting region and the third setting region are configured to set the matching capacitor.

20. The optical module according to claim 11, wherein A first grounding area and a second grounding area are respectively provided on both sides of the second signal transmission area; A third grounding area and a fourth grounding area are respectively provided on both sides of the third signal transmission area; The first grounding region is electrically connected to the third grounding region; The second ground region is electrically connected to the fourth ground region.

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